CN114783911A - Transfer device of LED chip, chip assembly process and display screen - Google Patents

Abstract

The application provides a transfer device of an LED chip, an assembly process of the chip and a display screen, wherein the transfer device of the LED chip is provided with a transfer head, the transfer head is provided with an installation side, and the transfer head is configured to fix the chip on the installation side and move the chip; the first magnetic part is arranged on the transfer head and can apply magnetic adsorption force to the magnetic material on the mounting side and/or apply magnetic adsorption force to the magnetic material on the mounted side; the second magnetic part and the first magnetic part are arranged on the transfer head at intervals, and the second magnetic part can apply magnetic adsorption force to the magnetic material on the mounting side and/or apply magnetic adsorption to the magnetic material on the mounted side. The transfer device of LED chip that this application provided is favorable to improving the yield of product.

Description

LED chip transfer device, chip assembly process and display screen

technical field

The present application belongs to the field of display technology, and in particular relates to a transfer device for an LED chip, a chip assembly process and a display screen.

Background technique

With the development of technology, people use MicroLED (micron light-emitting diode) more and more widely. During its assembly, the LED chips need to be transferred to the circuit substrate. In the process of transfer and installation, solder paste needs to be placed on the P and N poles of the LED chip, and the LED chip is mounted on the circuit substrate after the solder paste is melted. Since the distance between the P and N poles is very close, it is easy to connect the melted solder paste together, resulting in a short circuit between the P and N poles. As a result, the product yield cannot be guaranteed, which is not conducive to the use of MicroLED.

SUMMARY OF THE INVENTION

Embodiments of the present application provide a transfer device for an LED chip, an assembly process for the chip, and a display screen, so as to solve the problem that the existing solder pastes on the P pole and the N pole are easy to connect.

In a first aspect, an embodiment of the present application provides a device for transferring an LED chip, including:

a transfer head, the transfer head having a mounting side, the transfer head being configured to fix the chip on the mounting side and move the chip;

a first magnetic piece, the first magnetic piece is disposed on the transfer head, and can apply a magnetic adsorption force to the magnetic material on the installation side, and/or apply a magnetic adsorption force to the magnetic material on the installed side;

A second magnetic member, the second magnetic member is disposed on the transfer head spaced from the first magnetic member, the second magnetic member can exert a magnetic adsorption force on the magnetic material on the installation side, and/or the installed side The magnetic material exerts magnetic adsorption.

Optionally, one end of the first magnetic member is connected to the transfer head, and the other end extends downward and protrudes from the bottom of the transfer head; and/or,

One end of the second magnetic piece is connected with the transfer head, and the other end extends downward and protrudes from the bottom of the transfer head.

Optionally, the magnetic properties of the protruding portion of the first magnetic member are the same as the magnetic properties of the protruding portion of the second magnetic member.

Optionally, solder paste is provided on the P electrode and N electrode of the LED chip, and the solder paste contains magnetic particles;

The mounting side has a chip mounting position, the chip mounting position is configured to mount an LED chip, the first magnetic member is disposed adjacent to the P electrode, and the second magnetic member is disposed adjacent to the N electrode.

Optionally, the first magnetic member is arranged in a sheet shape, and the side of the first magnetic member faces the P electrode; the second magnetic member is arranged in a sheet shape, and the side of the second magnetic member faces the N electrode.

Optionally, the first magnetic member includes any one or more of an electromagnet, a permanent magnet, and a magnet; the second magnetic member includes any one or more of an electromagnet, a permanent magnet, and a magnet;

The magnetic particles are made of any one or more of ferrous oxide, ferrous cobalt tetroxide, ferrous nickel tetroxide, ferrous manganese tetroxide, ferric oxide, metallic iron, cobalt, and nickel. .

Optionally, the magnetic particles are made of any one or more of ferrous oxide, cobalt ferrous tetroxide, nickel ferrous tetroxide, manganese ferrous tetroxide, and ferric tetroxide;

The first magnetic member and the second magnetic member include electromagnets, permanent magnets, magnets, and any one or more of metal iron, cobalt, and nickel.

In a second aspect, an embodiment of the present application further provides a chip assembly process, where the chip assembly process uses the LED chip transfer device described in any one of the above;

The chip assembly process includes:

The transfer head grabs the LED chip, so that the P electrode of the chip is disposed adjacent to the first magnetic member of the transfer device, and the N electrode of the chip is disposed adjacent to the second magnetic member of the transfer device;

solder paste is arranged on the P electrode and the N electrode, or solder paste is arranged on the circuit substrate at the position corresponding to the P electrode and the N electrode, and the solder paste contains magnetic particles;

The solder paste is melted and the chip is attached to the circuit board.

Optionally, the first magnetic member and/or the second magnetic member are electromagnetic sheets, and the step of melting the solder paste and attaching the chip to the circuit substrate includes:

energizing the first magnetic member and the second magnetic member, so that the first magnetic member has a magnetic adsorption force on the solder paste on the P electrode, and the second magnetic member has a magnetic adsorption force on the solder paste on the N electrode;

Melt the solder paste and solder the chip to the circuit board.

In a third aspect, an embodiment of the present application further provides a display screen, the display screen includes an LED chip, and the transfer of the LED chip is completed by the LED chip transfer device in the above embodiment; and/or,

The installation of the LED chip is completed according to the chip assembly process in the above embodiment.

In the transfer device for the LED chip provided by the embodiment of the present application, during the transfer process of the LED chip, the P electrode and the N electrode of the LED chip are provided with solder paste, and the solder paste contains magnetic particles, and the solder paste is fluid when heated and melted. Enhancement, the solder paste (magnetic particles) on the first magnetic part and the P electrode prevents the solder paste on the P electrode from moving in the direction of the N electrode under the action of the magnetic adsorption force (the magnetic particles on the P electrode and the first magnetic part are magnetically magnetic. Adsorption increases the ability of the magnetic particles to resist directional flow); the solder paste (magnetic particles) on the second magnetic part and the N electrode prevents the solder paste on the N electrode from moving in the direction of the P electrode under the action of the magnetic adsorption force (N The magnetic particles on the electrodes are magnetically adsorbed to the second magnetic member, which increases the ability of the magnetic particles to resist directional flow); in this way, the solder paste in the molten state on the P electrode and the N electrode is prevented from flowing in opposite directions and connected, thereby avoiding the short circuit phenomenon. Appears, which is conducive to greatly improving the yield of products.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative effort.

For a more complete understanding of the present application and its beneficial effects, the following description will be made with reference to the accompanying drawings. Here, the same reference numerals denote the same parts in the following description.

FIG. 1 is a schematic flowchart of an assembling process of a chip according to an embodiment of the present application.

FIG. 2 is a schematic structural diagram of an embodiment of a device for transferring LED chips according to an embodiment of the present application.

FIG. 3 is a schematic structural diagram of the LED chip transfer device shown in FIG. 2 from another perspective.

FIG. 4 is a schematic structural diagram of the LED chip transfer device shown in FIG. 2 from another perspective.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

The embodiments of the present application provide a transfer device for the LED chip 300, an assembly process for the chip, and a display screen, so as to solve the problem that the P pole and the N pole are easily turned on when the LED chip 300 is transferred by the existing transfer device of the LED chip 300 . LEDs take MicroLED (Micron Light Emitting Diode) as an example, which can be widely used in display fields, especially in display screens. The following description will be made with reference to the accompanying drawings.

The transfer device for the LED chip 300 provided by the embodiment of the present application can be applied to the chip assembly process. For example, please refer to FIG. 1 , which is a schematic flowchart of the chip assembly process provided by the embodiment of the present application. The assembly process of the chip can be applied to the production of display screens such as mobile phone display screens, computer display screens, TV display screens, etc.

In order to explain the structure of the transfer device of the LED chip 300 more clearly, the transfer device of the LED chip 300 will be introduced below with reference to the accompanying drawings.

For example, please refer to FIG. 2 to FIG. 4 . FIG. 2 is a schematic structural diagram of an embodiment of a transfer apparatus for an LED chip 300 provided by an embodiment of the present application. FIG. 3 is a schematic structural diagram of the transfer device of the LED chip 300 shown in FIG. 2 from another perspective. FIG. 4 is a schematic structural diagram of the transfer device of the LED chip 300 shown in FIG. 2 from another perspective. The transfer device of the LED chip 300 includes: a transfer head 100 having a mounting side 110, and the transfer head 100 is configured to fix the chip on the mounting side 110 and move the chip; a first magnetic member 210, the first The magnetic element 210 is disposed on the transfer head 100, and can apply a magnetic adsorption force to the magnetic material on the mounting side 110, and/or apply a magnetic adsorption force to the magnetic material on the mounted side 110; the second magnetic element 220, the said The second magnetic member 220 is disposed on the transfer head 100 at intervals from the first magnetic member 210 , and the second magnetic member 220 can apply a magnetic adsorption force to the magnetic material on the mounting side 110 , and/or the magnetic material on the mounted side 110 Magnetic materials apply magnetic adsorption.

Specifically, in this embodiment, the transfer head 100 may have many forms, such as adsorption by negative pressure, clamping by a clamp, and the like. The transfer head 100 may have various shapes such as cylindrical shape and square column shape, and one side of the transfer head 100 is connected with the transfer drive, so that the transfer head 100 can move to a preset station and run according to a preset trajectory. For example, it can be any one of rotation, up, down, left and right movement, left and right swing, and back and forth swing or a combination of multiple modes. The mounting side 110 of the transfer head 100 is used for mounting the LED chip 300 (taking a micron light-emitting diode as an example). In some embodiments, in order to better position the LED chip 300, a chip mounting position may be set on the mounting side 110, so that the LED chip The position of 300 on the mounting side 110 is fixed, so the positions of the P electrode 320 and the N electrode 330 of the LED chip 300 are also fixed. The LED chip 300 further includes a chip body 310 on which the P electrode 320 and the N electrode 330 are mounted. In this way, it is beneficial to better arrangement of the magnetic elements. For example, the first magnetic element 210 is disposed adjacent to the P electrode 320, and the second magnetic element 220 is disposed adjacent to the N electrode 330, so that the magnetic element can better align the P electrode 320 and the N electrode. The solder paste 500 on the electrode 330 exerts a force.

There are many ways to connect the first magnetic member 210 and the transfer head 100 , such as connection through a buckle, a clamping slot, connection through a fastener such as a screw, or an adhesive connection. Similarly, there are many ways to connect the second magnetic member 220 to the transfer head 100 , such as connecting through a buckle, a slot, connecting through a fastener such as a screw, or connecting by gluing.

Regarding the materials of the first magnetic member 210 and the second magnetic member 220 , any magnetic adsorption force may be applied or applied. The specific material can be set according to the specific working conditions. In some working conditions, the specific material of the first magnetic member 210 and the second magnetic member 220 is related to the material of the magnetic particles contained in the solder paste 500 . Examples are given below.

When the first magnetic member 210 and the second magnetic member 220 are made of materials with magnetic adsorption force (which can generate a magnetic field), the magnetic particles contained in the solder paste 500 may have magnetic adsorption force, or only need to have magnetic adsorption force. characteristics (cannot generate a magnetic field, but can be magnetically attracted). For example, the first magnetic member 210 includes any one or more of electromagnets, permanent magnets, and magnets; the second magnetic member 220 includes any one or more of electromagnets, permanent magnets, and magnets. The magnetic particles can be made of any one or more of iron oxide, cobalt iron oxide, nickel iron oxide, manganese iron oxide, iron iron oxide, metal iron, cobalt, and nickel. . Among them, the magnetic particles can be in many forms, such as magnetic material powder, or nano-magnetic material.

When the magnetic particles are made of materials with magnetic adsorption (which can generate a magnetic field), the first magnetic member 210 and the second magnetic member 220 may have magnetic adsorption, or only need to have the characteristics of being magnetically adsorbed (can not generate a magnetic field). , but can be magnetically adsorbed). For example, the magnetic particles are made of any one or more of ferrous oxide, cobalt ferrous tetroxide, nickel ferrous oxide, manganese ferrous tetroxide, and ferric tetroxide; the first magnetic member 210 and The second magnetic member 220 includes an electromagnet, a permanent magnet, a magnet, and any one or more of metallic iron, cobalt, and nickel.

In this embodiment, during the transfer process of the LED chip 300, the P electrode 320 and the N electrode 330 of the LED chip 300 are provided with solder paste 500. The solder paste 500 contains magnetic particles, and the solder paste 500 is fluid when heated and melted. Enhancement, the solder paste 500 (magnetic particles) on the first magnetic member 210 and the P electrode 320 prevents the solder paste 500 on the P electrode 320 from moving in the direction of the N electrode 330 under the action of the magnetic adsorption force (the magnetic particles on the P electrode 320 The particles are magnetically adsorbed to the first magnetic member 210, which increases the ability of the magnetic particles to resist directional flow). The solder paste 500 on the upper electrode moves to the direction of the P electrode 320 (the magnetic particles on the N electrode 330 are magnetically adsorbed with the second magnetic member, which increases the ability of the magnetic particles to resist the flow in the direction); The solder pastes 500 in the molten state flow in opposite directions and are connected, thereby avoiding the occurrence of a short circuit phenomenon, which is beneficial to greatly improve the yield of the product.

In some embodiments, in order to further improve the effect of the first magnetic member 210 and the second magnetic member 220 on the solder paste 500 . One end of the first magnetic member 210 is connected to the transfer head 100, and the other end extends downward and protrudes from the bottom of the transfer head 100; and/or, one end of the second magnetic member 220 is connected to the transfer head 100, and the other end is connected to the transfer head 100. One end extends downward and protrudes from the bottom of the transfer head 100 . In this embodiment, the first magnetic member 210 is in the shape of an elongated strip as an example. The first magnetic member 210 protrudes from the bottom portion of the transfer head 100 , and the magnetic field generated by the first magnetic member 210 can directly act on the solder paste 500 on the P electrode 320 . The distance between the first magnetic member 210 and the solder paste 500 on the P electrode 320 is shortened, which is beneficial for the first magnetic member 210 to better play an adsorption function. Similarly, the second magnetic member 220 is in the shape of an elongated strip as an example. The second magnetic member 220 protrudes from the bottom portion of the transfer head 100, and the magnetic field generated by the second magnetic member 220 can directly act on the solder paste 500 on the N electrode 330, shortening the The distance between the second magnetic member 220 and the solder paste 500 on the N electrode 330 is beneficial for the second magnetic member 220 to better play an adsorption function.

In some embodiments, in order to further improve the effect of magnetic adsorption, the magnetic properties of the protruding portion of the first magnetic member 210 are the same as the magnetic properties of the protruding portion of the second magnetic member 220 . In this embodiment, the magnetic properties of the protruding parts of the first magnetic member 210 and the second magnetic member 220 are taken as an example of the north pole (N pole). At the same time, the north pole of the first magnetic member 210 produces an adsorption force on the solder paste 500 on the P electrode 320 , and the second magnetic member 220 also produces an adsorption force on the solder paste 500 on the N electrode 330 through the north pole.

In some embodiments, in order to further improve the effect of magnetic adsorption, the first magnetic member 210 is provided in a sheet shape, and one side of the first magnetic member 210 faces the P electrode 320 ; the second magnetic member 220 is a sheet The second magnetic member 220 is arranged in such a way that one side of the second magnetic member 220 faces the N electrode 330 . In this embodiment, by setting the first magnetic member 210 and the second magnetic member 220 in a sheet shape, the magnetic field of the first magnetic member 210 covers the area where the solder paste 500 on the P electrode 320 is located, and the magnetic field of the second magnetic member 220 The area where the solder paste 500 is located on the N electrode 330 is covered. In this way, it is beneficial to control the flow of the solder paste 500 more reliably.

In order to better explain and solve the problem of setting the solder paste 500 connection on the P electrode 320 and the N electrode 330, the present application discloses a chip assembly process, and the chip assembly process uses the transfer device of the LED chip 300 in the above embodiment. , the chip assembly process includes:

S100, the transfer head 100 grabs the LED chip 300, so that the P electrode 320 of the chip is disposed adjacent to the first magnetic member 210 of the transfer device, and the N electrode 330 of the chip is disposed adjacent to the second magnetic member 220 of the transfer device;

S200, disposing solder paste 500 on the P electrode 320 and the N electrode 330, or disposing the solder paste 500 on the circuit substrate corresponding to the P electrode 320 and the N electrode 330, wherein the solder paste 500 contains magnetic particles; S300, disposing the tin The paste 500 melts and attaches the chip to the circuit substrate.

Specifically, in this embodiment, the transfer head 100 can grab the LED chip 300 by means of negative pressure adsorption, so that the LED chip 300 is located on the chip mounting position. In this way, the P electrode 320 of the chip is disposed adjacent to the first magnetic member 210 of the transfer device, and the N electrode 330 of the chip is disposed adjacent to the second magnetic member 220 of the transfer device. The solder paste 500 is provided on the electrodes, or the solder paste 500 is provided on the circuit substrate on which the LED chip 300 is to be mounted. It should be noted that, in some embodiments, the step of disposing the solder paste 500 may be performed before grabbing the LED chip 300 . The solder paste 500 may be melted first and then the chip is attached, or the chip may be placed at a preset position, and the attachment and the melting of the solder paste 500 are performed simultaneously.

When the first magnetic member 210 and the second magnetic member 220 are electromagnets, in order to better control the attaching process of the LED chip 300, the first magnetic member 210 and/or the second magnetic member 220 are electromagnetic sheets, so the The steps of melting the solder paste 500 and attaching the chip to the circuit substrate include: energizing the first magnetic member 210 and the second magnetic member 220, so that the first magnetic member 210 has a good effect on the solder paste 500 on the P electrode 320. Magnetic adsorption force, the second magnetic member 220 has a magnetic adsorption force to the solder paste 500 on the N electrode 330 ; the solder paste 500 is melted and the chip is soldered to the circuit substrate. In this way, when the solder paste 500 needs to be adsorbed, the first magnetic member 210 and the second magnetic member 220 are energized to generate magnetic adsorption force, and when the solder paste 500 does not need to be magnetically adsorbed, the first magnetic member is powered off 210 and the second magnetic member 220 to avoid affecting other components.

The present application further provides a display screen, the display screen includes an LED chip 300, and the transfer of the LED chip 300 is completed by the transfer device of the LED chip 300 in the above embodiment. The installation of the LED chip 300 is completed according to the chip assembly process proposed in the above embodiment.

In the above-mentioned embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

In the description of this application, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more features. The transfer device for the LED chip 300 provided by the embodiments of the present application has been described in detail above. The principles and implementations of the present application are described with specific examples. The descriptions of the above embodiments are only used to help understand the present application. method and its core idea; at the same time, for those skilled in the art, according to the idea of the application, there will be changes in the specific implementation and application scope. In conclusion, the content of this specification should not be construed as a limitation to the application .

Claims (10)

1. A transfer device of LED chips is characterized by comprising:

a transfer head having a mounting side, the transfer head configured to secure the chip to the mounting side and move the chip;

the first magnetic part is arranged on the transfer head and can apply magnetic adsorption force to the magnetic material on the mounting side and/or the magnetic material on the mounted side;

the second magnetic part and the first magnetic part are arranged on the transfer head at intervals, and the second magnetic part can apply magnetic adsorption force to the magnetic material on the installation side and/or apply magnetic adsorption to the magnetic material on the installed side.

2. The transfer device of the LED chip according to claim 1, wherein one end of the first magnetic member is connected to the transfer head, and the other end of the first magnetic member extends downward and protrudes from the bottom of the adapter; and/or the presence of a gas in the atmosphere,

one end of the second magnetic part is connected with the transfer head, and the other end of the second magnetic part extends downwards and protrudes out of the bottom of the adapter.

3. The transfer device of LED chips of claim 2, wherein the magnetic properties of the first magnetic member protruding portion are the same as those of the second magnetic member protruding portion.

4. The LED chip transfer device of claim 1, wherein solder paste is disposed on the P electrode and the N electrode of the LED chip, and the solder paste contains magnetic particles;

the mounting side is provided with a chip mounting position, the chip mounting position is configured to mount an LED chip, the first magnetic piece is arranged close to the P electrode, and the second magnetic piece is arranged close to the N electrode.

5. The LED chip transfer device according to claim 4, wherein the first magnetic member is disposed in a sheet shape, and a sheet surface of the first magnetic member faces the P electrode; the second magnetic part is arranged in a sheet shape, and the sheet surface of the second magnetic part faces the N electrode.

6. The LED chip transfer device according to claim 4, wherein the first magnetic member comprises any one or more of an electromagnet, a permanent magnet, and a magnet; the second magnetic part comprises any one or more of an electromagnet, a permanent magnet and a magnet;

the magnetic particles are made of any one or more of iron sesquioxide, cobalt iron tetroxide, nickel iron tetroxide, manganese iron tetroxide, ferroferric oxide, metallic iron, cobalt and nickel.

7. The LED chip transfer device of claim 4, wherein the magnetic particles are made of any one or more of iron sesquioxide, cobalt iron tetroxide, nickel iron tetroxide, manganese iron tetroxide, and ferroferric oxide;

the first magnetic part and the second magnetic part comprise an electromagnet, a permanent magnet, a magnet and any one or more of metal iron, cobalt and nickel.

8. A chip assembly process using the transfer apparatus for LED chips according to any one of claims 1 to 7, the chip assembly process comprising:

the transfer head grabs the LED chip, so that a P electrode of the chip is arranged close to the first magnetic part of the transfer device, and an N electrode of the chip is arranged close to the second magnetic part of the transfer device;

arranging solder paste on the P electrode and the N electrode, or arranging solder paste on the circuit substrate at positions corresponding to the P electrode and the N electrode, wherein the solder paste contains magnetic particles;

the solder paste is melted and the chip is attached to the circuit substrate.

9. The process of assembling a chip according to claim 8, wherein the first and/or second magnetic members are electromagnetic plates, and the step of melting solder paste and attaching the chip to the circuit substrate includes:

electrifying the first magnetic part and the second magnetic part so that the first magnetic part has magnetic adsorption force on the solder paste on the P electrode and the second magnetic part has magnetic adsorption force on the solder paste on the N electrode;

the solder paste is melted and the chip is soldered to the circuit substrate.

10. A display screen, characterized in that the display screen comprises LED chips, and the transfer of the LED chips is performed by the transfer device of the LED chips in any one of claims 1 to 7; and/or the presence of a gas in the gas,

the mounting of the LED chip is done according to the assembly process of the chip of claim 8 or 9.

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