CN114783680A - Preparation method of superconducting wire for quantum computer - Google Patents
Preparation method of superconducting wire for quantum computer Download PDFInfo
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- CN114783680A CN114783680A CN202210686193.5A CN202210686193A CN114783680A CN 114783680 A CN114783680 A CN 114783680A CN 202210686193 A CN202210686193 A CN 202210686193A CN 114783680 A CN114783680 A CN 114783680A
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
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- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
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- H—ELECTRICITY
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
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Abstract
The invention discloses a preparation method of a superconducting wire for a quantum computer, which comprises the following steps: 1) coating a Cu shell on the surface of an NbTi rod serving as a raw material, tightly combining the Cu shell and one end of the NbTi rod in a rotary swaging way, and drawing the NbTi rod into an NbTi/Cu single-core wire by passing the NbTi rod through a drawing die; 2) removing the Cu skin by a skinning method to obtain an NbTi wire; 3) preparing a Polytetrafluoroethylene (PTFE) insulating layer on the NbTi wire; 4) preparing an NbTi capillary tube by using NbTi powder with the same components as those in the step one; 5) assembling the insulated NbTi wire and the NbTi capillary tube by a tube penetrating method, and cold-drawing and forming; 6) and welding joints at two ends of the wire rod to finally obtain the superconducting wire rod for the quantum computer. The superconducting wire prepared by the invention has extremely low-temperature resistance and strong heat conductivity, and completely meets the use requirement of a quantum computer.
Description
Technical Field
The invention belongs to the field of superconducting composite wire processing, and particularly relates to a preparation method of a superconducting wire for a quantum computer.
Background
The quantum computer is a machine capable of realizing quantum computation, and is a system capable of realizing mathematical and logical operations, processing and storing information through quantum mechanical laws. The quantum state is used as a memory unit and an information storage form, quantum dynamics evolution is used as quantum communication and quantum computation based on information transmission and processing, and the sizes of various elements of hardware in a quantum computer reach the magnitude of atoms or molecules. The method has the characteristics of high running speed, high information processing capability, wide application range and the like. Compared with the traditional computer, the quantum computer has the advantages that the information processing amount is larger, the quantum computer is beneficial to implementing operation, and the accuracy of the operation can be ensured.
Based on the above description, quantum computers can solve the problems that the traditional computer can not solve, and in some specific problems, the potential of the operational capability and the operational speed of the quantum computer is far higher than the sum of all the classical computers in the world. However, the core quantum state of a quantum computer is "fragile", the working environment of a quantum chip needs to be below 30mK to have excellent performance, and if the temperature is too high, the evolution of the quantum state is very difficult to control. Therefore, the signal transmission wire used in the quantum computer should have the characteristics of extremely low resistance and extremely high heat conductivity in a low-temperature environment, so that the low-temperature use environment of the superconducting chip is prevented from being influenced. The superconducting wire is applied to the development of signal transmission wires in quantum computers due to the characteristic of zero resistance at low temperature.
At present, wires used in quantum computers are monopolized abroad, so that scientific research institutes and enterprises in the field of domestic quantum computers are always necked by the technology. In view of the above, the present inventors propose a method for preparing a superconducting wire for a quantum computer, so as to fill up the domestic technical gap.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a preparation method of a superconducting wire for a quantum computer, the preparation method takes NbTi as a raw material, and the preparation process comprises the steps of coating Cu on the surface of the NbTi for drawing → peeling treatment → painting insulating tetrafluoroethylene → 3D printing for manufacturing NbTi capillary tubes → pipe penetrating assembly → welding joints, and the finally obtained superconducting wire is actually verified to have the heat leakage rate lower than 0.3 muW/K at the temperature of 4-20K, so that the requirements of the quantum computer on extremely low-temperature resistance and extremely strong heat conduction capability are completely met.
The purpose of the invention is solved by the following technical scheme:
a preparation method of a superconducting wire for a quantum computer comprises the following specific steps:
firstly, taking an NbTi bar as a raw material, coating a Cu shell on the surface of the NbTi bar, then tightly combining the Cu shell and one end of the NbTi bar in a rotary swaging way, enabling the Cu shell to penetrate through a drawing die, and drawing the NbTi/Cu single-core wire;
step two, peeling the NbTi/Cu single-core wire obtained in the step one by a peeling die to remove all Cu peels on the surface of the NbTi/Cu single-core wire and obtain an NbTi wire;
step three, putting the NbTi wire obtained in the step two into an extruder, adopting polytetrafluoroethylene as an insulating material, and baking while extruding the polytetrafluoroethylene to finish the polytetrafluoroethylene insulation of the NbTi wire;
step four, adopting NbTi powder with the same components as those in the step one as a raw material, and obtaining an NbTi capillary tube by using a selective laser melting 3D printing technology;
step five, assembling the NbTi wire insulated in the step three and the NbTi capillary tube obtained in the step four in a tube penetrating mode, wherein the insulated NbTi wire is positioned in the middle of the NbTi capillary tube, and forming in a cold drawing mode;
and step six, welding joints at two ends of the wire rod obtained in the step five to finally obtain the superconducting wire rod for the quantum computer.
Further, the content of Nb in the NbTi rod used in the first step is 50 to 60wt.%, and the diameter of the NbTi rod is 30 to 60 mm.
Further, the thickness of the Cu shell adopted in the first step is 2-5 mm, and the machining rate between drawing lines is 10-30% when the Cu shell passes through a drawing die for drawing.
Further, the peeling mold in the second step is made of tungsten carbide, the cutting edge angle of the peeling mold is 10-35 degrees, the cutting edge length is 1-4 mm, the peeling amount is 0.01-0.1 mm, and the peeling frequency is 1 time, so that all Cu peels are removed to obtain the NbTi wire.
Further, the polytetrafluoroethylene used in the third step has a particle diameter of 200-500 μm, a baking temperature of 300-500 ℃, and an insulation layer thickness of 0.1-2 mm.
Further, the particle size of the NbTi powder in the fourth step is 10-50 μm, and the selective laser melting 3D printing parameters are set as follows: the layer thickness is 0.01-0.05 mm, the power is 200-900W, the scanning speed is 800-1500 mm/s, and the track pitch is 0.1-0.2 mm.
Furthermore, the inter-pass processing rate of cold drawing in the fifth step is 2-10%, and the inter-pass processing rate is used for tightly combining the NbTi capillary tube and the insulated NbTi wire.
Further, the joint model used in the sixth step is SMA, APC or GPPO.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a preparation method of a superconducting wire for a quantum computer, which takes an NbTi rod as a raw material, a Cu shell is coated on the surface of the NbTi rod, the NbTi rod is drawn into an NbTi/Cu single-core wire, an NbTi wire is obtained through peeling treatment, a Polytetrafluoroethylene (PTFE) insulating layer is prepared on the NbTi wire, NbTi capillary tubes are obtained through selective laser melting 3D printing technology by adopting NbTi powder with the same components as the NbTi rod, the NbTi wire and the NbTi capillary tubes which are obtained after insulation are assembled and formed through cold drawing in a perforation mode, and joints are welded at two ends of the wire to finally obtain the superconducting wire for the quantum computer, wherein the superconducting wire actually verifies that the heat leakage rate is lower than 0.3 muW/K at the temperature of 4-20K, and completely meets the requirements of the quantum computer on extremely low-temperature resistance and extremely strong heat conductivity.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a flow chart of a method for manufacturing a superconducting wire for a quantum computer according to the present invention;
FIG. 2 is a schematic view showing a cross-sectional structure of a superconducting wire produced by the method of the present invention.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus consistent with certain aspects of the invention, as detailed in the appended claims.
In order to make those skilled in the art better understand the technical solution of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings and examples.
Referring to fig. 1, the present invention provides a method for preparing a superconducting wire for a quantum computer, comprising the following steps:
firstly, coating a Cu shell on the surface of an NbTi rod serving as a raw material, then tightly combining the Cu shell and one end of the NbTi rod in a rotary swaging mode, enabling the Cu shell to penetrate through a drawing die, and drawing the NbTi/Cu single-core wire;
specifically, the content of Nb in the NbTi rod adopted in the first step is 50-60 wt%, the outer diameter of the NbTi rod is phi 30-60 mm, in order to solve the problem of drawing and die sticking of the NbTi wire, a Cu shell is coated outside the NbTi rod to play a role in drawing lubrication, the thickness of the Cu shell is 2-5 mm, the purpose of rotary swaging is to enable the NbTi rod and the Cu shell to be tightly combined, meanwhile, the NbTi rod can pass through a die to be drawn, and the processing rate between drawing passes is 10-30%.
Step two, peeling the NbTi/Cu single-core wire obtained in the step one by a peeling die to remove all Cu peels on the surface of the NbTi/Cu single-core wire and obtain an NbTi wire;
specifically, the material of the skinning die in the second step is tungsten carbide, the angle of the cutting edge of the skinning die is 10-35 degrees, the length of the cutting edge is 1-4 mm, the skinning amount is 0.01-0.1 mm, and the skinning times are 1 time, so that all Cu skins are removed to obtain the NbTi wire.
Step three, putting the NbTi wire obtained in the step two into an extruder, adopting polytetrafluoroethylene as an insulating material, and baking while extruding the polytetrafluoroethylene to finish the polytetrafluoroethylene insulation of the NbTi wire;
specifically, because Polytetrafluoroethylene (PTFE) cannot be used for injection molding, an NbTi wire is insulated by adopting an extrusion method, the particle diameter of the adopted Polytetrafluoroethylene (PTFE) is 200-500 mu m, the baking temperature is 300-500 ℃, and the thickness of an insulating layer is 0.1-2 mm. The purpose of using Polytetrafluoroethylene (PTFE) as the insulation is because the operating temperature of the wire is 4K, at which temperature Polytetrafluoroethylene (PTFE) can still maintain good performance.
Step four, adopting NbTi powder with the same components as those in the step one as a raw material, and obtaining an NbTi capillary tube by using a selective laser melting 3D printing technology;
specifically, in the fourth step, the particle size of the NbTi powder is 10-50 μm, and the selective laser melting 3D printing parameters are set as follows: the layer thickness is 0.01-0.05 mm, the power is 200-900W, the scanning speed is 800-1500 mm/s, and the track pitch is 0.1-0.2 mm.
Step five, assembling the NbTi wire insulated in the step three and the NbTi capillary tube obtained in the step four in a tube penetrating mode, wherein the insulated NbTi wire is positioned in the middle of the NbTi capillary tube, and forming in a cold drawing mode;
preferably, the inter-pass machining rate of cold drawing in the fifth step is 2-10%, and the method is used for enabling the NbTi capillary tube and the insulated NbTi to be tightly combined.
Welding joints at two ends of the wire rod obtained in the step five to finally obtain the superconducting wire rod for the quantum computer;
preferably, the linker type used is SMA, APC or GPPO.
In order to further verify the efficacy of the preparation method of the present invention, the inventors carried out the following specific examples:
example 1
1) Firstly, an NbTi rod with the Nb content of 50wt.% is used as a raw material, the outer diameter of the NbTi rod is phi 60mm, a Cu shell is coated on the surface of the NbTi rod to play a role in lubrication, the thickness of the Cu shell is 5mm, then one end of the NbTi rod coated with the Cu shell is swaged, the NbTi rod and the Cu shell are tightly combined and can pass through a drawing die, then the NbTi/Cu single-core wire with the phi 0.56mm is drawn, and the inter-pass processing rate in the drawing process is 10%.
2) And removing all Cu peels on the surfaces of the NbTi/Cu single-core wires by adopting a peeling die, wherein the peeling die is made of tungsten carbide, the angle of a cutting edge of the tungsten carbide die is controlled to be 10 degrees, the length of the cutting edge is controlled to be 1mm, the peeling amount is 0.06mm, and the peeling frequency is 1 time, so that the superfine NbTi wire with the diameter of 0.5mm is obtained.
3) The particle diameter of Polytetrafluoroethylene (PTFE) is 200 μm, the baking temperature is 300 ℃, and the diameter after insulation is 1.9 mm.
4) NbTi powder with the Nb content of 50wt.% is used as a raw material, and a selective laser melting technology (SLM) is adopted to obtain the NbTi capillary tube with the outer diameter of phi 3.0mm through 3D printing, wherein the particle size of the NbTi powder is 10 mu m, the layer thickness is 0.01mm, the power is 200W, the scanning speed is 800mm/s, and the track spacing is 0.1 mm.
5) Then, the ultra-fine NbTi wire insulated in the step 3) passes through the NbTi capillary tube in the step 4) in a tube penetrating mode, and then is formed into a wire rod with phi 2.20mm in a cold drawing mode (the machining rate between drawing passes is 2%);
6) SMA joints are welded at two ends of the wire to finally obtain the superconducting wire for the quantum computer, the structure of the superconducting wire is shown in figure 2, and the heat leakage rate of the superconducting wire is lower than 0.3 muW/K at the temperature of 4-20K through practical verification.
Example 2
1) Firstly, an NbTi rod with 53wt.% of Nb content is used as a raw material, the outer diameter of the NbTi rod is phi 50mm, a Cu shell is coated on the surface of the NbTi rod to play a role in lubrication, the thickness of the Cu shell is 4mm, then one end of the NbTi rod coated with the Cu shell is swaged, the NbTi rod and the Cu shell are tightly combined and can pass through a drawing die, then the NbTi/Cu single-core wire with phi 0.37mm is drawn, and the processing rate between passes in the drawing process is 15%.
2) And removing all Cu peels on the surface of the NbTi/Cu single-core wire by adopting a peeling die, wherein the peeling die is made of tungsten carbide, the angle of a cutting edge of the tungsten carbide die is controlled to be 20 degrees, the length of the cutting edge is controlled to be 2mm, the peeling amount is 0.07mm, and the peeling frequency is 1 time, so that the superfine NbTi wire with the diameter of 0.3mm is obtained.
3) The particle diameter of Polytetrafluoroethylene (PTFE) is 300 μm, the baking temperature is 350 ℃, and the diameter after insulation is 1.1 mm.
4) NbTi powder with 53wt.% of Nb content is used as a raw material, and a selective laser melting technology (SLM) is adopted to obtain the NbTi capillary tube with the outer diameter of phi 2.0mm through 3D printing, wherein the particle size of the NbTi powder is 20 mu m, the layer thickness is 0.05mm, the power is 500W, the scanning speed is 1000mm/s, and the track spacing is 0.15 mm.
5) Then, the superfine NbTi wire insulated in the step 3) passes through the NbTi capillary in the step 4) in a tube penetrating mode, and then is formed into a wire rod with phi of 1.19mm in a cold drawing mode (the machining rate between drawing passes is 5%);
6) SMA joints are welded at two ends of the wire to finally obtain the superconducting wire for the quantum computer, and the heat leakage rate of the superconducting wire is lower than 0.09 mu W/K at the temperature of 4-20K through practical verification.
Example 3
1) Firstly, an NbTi rod with 55wt.% of Nb content is used as a raw material, the outer diameter of the NbTi rod is phi 40mm, a Cu shell is coated on the surface of the NbTi rod to play a role of lubrication, the thickness of the Cu shell is 3mm, then one end of the NbTi rod coated with the Cu shell is swaged, the NbTi rod and the Cu shell are tightly combined and can pass through a drawing die, then the NbTi/Cu single-core wire with phi 0.3mm is drawn, and the processing rate between passes in the drawing process is 20%.
2) And removing all Cu peels on the surface of the NbTi/Cu single-core wire by adopting a peeling die, wherein the peeling die is made of tungsten carbide, the angle of a cutting edge of the tungsten carbide die is controlled to be 28 degrees, the length of the cutting edge is controlled to be 3mm, the peeling amount is 0.05mm, and the peeling frequency is 1 time, so that the superfine NbTi wire with the diameter of 0.25mm is obtained.
3) The particle diameter of Polytetrafluoroethylene (PTFE) is 400 μm, the baking temperature is 400 ℃, and the diameter after insulation is 0.8 mm.
4) NbTi powder with the Nb content of 55wt.% is used as a raw material, and a selective laser melting technology (SLM) is adopted to obtain an NbTi capillary tube with the outer diameter of phi 1.5mm through 3D printing, wherein the particle size of the NbTi powder is 35 mu m, the layer thickness is 0.04mm, the power is 800W, the scanning speed is 1300mm/s, and the track spacing is 0.15 mm.
5) Then, the superfine NbTi wire insulated in the step 3) passes through the NbTi capillary in the step 4) in a tube penetrating mode, and then is formed into a wire rod with phi of 1.0mm in a cold drawing mode (the processing rate between drawing passes is 10 percent);
6) and (3) welding APC joints at two ends of the wire to finally obtain the superconducting wire for the quantum computer, wherein the heat leakage rate of the superconducting wire is lower than 0.0.7 muW/K at the temperature of 4-20K through practical verification.
Example 4
1) Firstly, an NbTi rod with the Nb content of 60wt.% is used as a raw material, the outer diameter of the NbTi rod is phi 30mm, a Cu shell is coated on the surface of the NbTi rod to play a role in lubrication, the thickness of the Cu shell is 2mm, then one end of the NbTi rod coated with the Cu shell is swaged, the NbTi rod and the Cu shell are tightly combined and can pass through a drawing die, then an NbTi/Cu single-core wire with the phi 0.22mm is drawn, and the inter-pass processing rate in the drawing process is 30%.
2) And removing all Cu peels on the surface of the NbTi/Cu single-core wire by adopting a peeling die, wherein the peeling die is made of tungsten carbide, the angle of a cutting edge of the tungsten carbide die is controlled to be 30 degrees, the length of the cutting edge is controlled to be 4mm, the peeling amount is 0.02mm, and the peeling frequency is 1 time, so that the superfine NbTi wire with the diameter of 0.20mm is obtained.
3) The particle diameter of Polytetrafluoroethylene (PTFE) is 500 μm, the baking temperature is 500 ℃, and the diameter after insulation is 0.6 mm.
4) NbTi powder with the Nb content of 60wt.% is used as a raw material, and a selective laser melting technology (SLM) is adopted to obtain the NbTi capillary tube with the outer diameter of phi 1.1mm through 3D printing, wherein the particle size of the NbTi powder is 50 mu m, the layer thickness is 0.05mm, the power is 900W, the scanning speed is 1500mm/s, and the track spacing is 0.2 mm.
5) Then, the superfine NbTi wire insulated in the step 3) passes through the NbTi capillary in the step 4) in a tube penetrating mode, and then is formed into a wire rod with phi of 0.86mm in a cold drawing mode (the processing rate between drawing passes is 8%);
6) and welding GPPO joints at two ends of the wire to finally obtain the superconducting wire for the quantum computer, wherein the structure of the superconducting wire is shown in figure 2, and the heat leakage rate of the superconducting wire is lower than 0.0.6 mu W/K at the temperature of 4-20K through practical verification.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention.
It is to be understood that the present invention is not limited to what has been described above, and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (8)
1. A preparation method of a superconducting wire for a quantum computer is characterized by comprising the following specific steps:
firstly, coating a Cu shell on the surface of an NbTi rod serving as a raw material, then tightly combining the Cu shell and one end of the NbTi rod in a rotary swaging mode, enabling the Cu shell to penetrate through a drawing die, and drawing the NbTi/Cu single-core wire;
step two, peeling the NbTi/Cu single-core wire obtained in the step one by a peeling die to remove all Cu peels on the surface of the NbTi/Cu single-core wire and obtain an NbTi wire;
step three, putting the NbTi wire obtained in the step two into an extruder, adopting polytetrafluoroethylene as an insulating material, and baking while extruding the polytetrafluoroethylene to finish the polytetrafluoroethylene insulation of the NbTi wire;
step four, adopting NbTi powder with the same components as those in the step one as a raw material, and obtaining an NbTi capillary tube by using a selective laser melting 3D printing technology;
step five, assembling the NbTi wire insulated in the step three and the NbTi capillary tube obtained in the step four in a tube penetrating mode, wherein the insulated NbTi wire is positioned in the middle of the NbTi capillary tube, and forming in a cold drawing mode;
and step six, welding joints at two ends of the wire rod obtained in the step five to finally obtain the superconducting wire rod for the quantum computer.
2. The method according to claim 1, wherein the NbTi rod used in the first step has a Nb content of 50 to 60wt.%, and the NbTi rod has a diameter of 30 to 60 mm.
3. The method according to claim 1 or 2, wherein the thickness of the Cu shell used in the first step is 2 to 5mm, and the processing rate between drawing lines is 10 to 30% when drawing through the drawing die.
4. The method according to claim 1, wherein the skinning die in the second step is made of tungsten carbide, the angle of the cutting edge of the skinning die is 10 to 35 °, the length of the cutting edge is 1 to 4mm, the skinning amount is 0.01 to 0.1mm, and the number of skinning is 1, and the method is used for removing all Cu skin to obtain NbTi filaments.
5. The method according to claim 1, wherein the polytetrafluoroethylene used in step three has a particle diameter of 200 to 500 μm, a baking temperature of 300 to 500 ℃, and an insulating layer thickness of 0.1 to 2 mm.
6. The method of claim 1, wherein the NbTi powder in the fourth step has a particle size of 10 to 50 μm, and the selective laser melting 3D printing parameters are set as follows: the layer thickness is 0.01-0.05 mm, the power is 200-900W, the scanning speed is 800-1500 mm/s, and the track pitch is 0.1-0.2 mm.
7. The method according to claim 1, wherein the cold drawing in the fifth step has a pass-to-pass processing ratio of 2 to 10% for tightly bonding the NbTi capillary tube to the insulated NbTi wire.
8. The method for preparing a superconducting wire for a quantum computer according to any one of claims 1 to 7, wherein the joint type used in the sixth step is SMA, APC or GPPO.
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| CN116580894A (en) * | 2023-07-13 | 2023-08-11 | 西安聚能超导线材科技有限公司 | Preparation method of superfine NbTi filaments |
| CN117936185A (en) * | 2024-03-21 | 2024-04-26 | 西安聚能超导线材科技有限公司 | Preparation method of superconductive cable for multichannel clustered quantum computer |
| CN117936186A (en) * | 2024-03-22 | 2024-04-26 | 西安聚能超导线材科技有限公司 | Preparation method of superconducting coaxial cable for quantum computer |
| CN117954163A (en) * | 2024-03-26 | 2024-04-30 | 西安聚能超导线材科技有限公司 | Preparation method of superconducting coaxial cable for quantum computer |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1381059A1 (en) * | 2002-07-12 | 2004-01-14 | High Energy Accelerator Research Organization | Superconducting magnet, superconducting coil structure, and superconducting spectrometer |
| CN101728029A (en) * | 2009-12-22 | 2010-06-09 | 西北有色金属研究院 | Preparation method for NbTi/Cu multi-core composite superconducting wire with rectangular section |
| CN102522153A (en) * | 2011-10-25 | 2012-06-27 | 西北有色金属研究院 | Preparation method of multi-core MgB2 superconducting wire |
| JP2012240091A (en) * | 2011-05-20 | 2012-12-10 | Hitachi Cable Ltd | Method for temporary fixing vacuum weld zone of superconductive billet and temporary fixing structure |
| CN103325517A (en) * | 2013-05-20 | 2013-09-25 | 西部超导材料科技股份有限公司 | Manufacturing method for NbTi/Cu superconducting joint |
| CN103606423A (en) * | 2013-12-11 | 2014-02-26 | 西北有色金属研究院 | Preparation method of MgB2-NbTi composite superconducting wire |
| CN104091651A (en) * | 2014-07-28 | 2014-10-08 | 西北有色金属研究院 | Method for manufacturing multi-core MgB2 superconductive wires through extrusion technology |
| CN104201278A (en) * | 2014-08-26 | 2014-12-10 | 西安艾菲尔德复合材料科技有限公司 | NbTi/Cu superconducting composite pipe and preparation method thereof |
| CN104538543A (en) * | 2014-12-11 | 2015-04-22 | 西部超导材料科技股份有限公司 | Preparing method of NbTi rod for low-temperature superconducting wire rod |
| CN106328306A (en) * | 2016-08-30 | 2017-01-11 | 西部超导材料科技股份有限公司 | Method for preparing high-copper-ratio NbTi/Cu superconductive wire rod through inset welding method |
| CN110556215A (en) * | 2018-06-04 | 2019-12-10 | 西部超导材料科技股份有限公司 | Method for assembling NbTi multi-core superconducting ingot blank |
| CN111659749A (en) * | 2020-05-20 | 2020-09-15 | 西部超导材料科技股份有限公司 | Preparation method of NbTi/CuNi/Cu superconducting composite wire |
| CN112267079A (en) * | 2020-10-26 | 2021-01-26 | 西安工程大学 | Method for manufacturing amorphous composite material by performing laser material increase on zirconium-based alloy powder |
-
2022
- 2022-06-17 CN CN202210686193.5A patent/CN114783680B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1381059A1 (en) * | 2002-07-12 | 2004-01-14 | High Energy Accelerator Research Organization | Superconducting magnet, superconducting coil structure, and superconducting spectrometer |
| CN101728029A (en) * | 2009-12-22 | 2010-06-09 | 西北有色金属研究院 | Preparation method for NbTi/Cu multi-core composite superconducting wire with rectangular section |
| JP2012240091A (en) * | 2011-05-20 | 2012-12-10 | Hitachi Cable Ltd | Method for temporary fixing vacuum weld zone of superconductive billet and temporary fixing structure |
| CN102522153A (en) * | 2011-10-25 | 2012-06-27 | 西北有色金属研究院 | Preparation method of multi-core MgB2 superconducting wire |
| CN103325517A (en) * | 2013-05-20 | 2013-09-25 | 西部超导材料科技股份有限公司 | Manufacturing method for NbTi/Cu superconducting joint |
| CN103606423A (en) * | 2013-12-11 | 2014-02-26 | 西北有色金属研究院 | Preparation method of MgB2-NbTi composite superconducting wire |
| CN104091651A (en) * | 2014-07-28 | 2014-10-08 | 西北有色金属研究院 | Method for manufacturing multi-core MgB2 superconductive wires through extrusion technology |
| CN104201278A (en) * | 2014-08-26 | 2014-12-10 | 西安艾菲尔德复合材料科技有限公司 | NbTi/Cu superconducting composite pipe and preparation method thereof |
| CN104538543A (en) * | 2014-12-11 | 2015-04-22 | 西部超导材料科技股份有限公司 | Preparing method of NbTi rod for low-temperature superconducting wire rod |
| CN106328306A (en) * | 2016-08-30 | 2017-01-11 | 西部超导材料科技股份有限公司 | Method for preparing high-copper-ratio NbTi/Cu superconductive wire rod through inset welding method |
| CN110556215A (en) * | 2018-06-04 | 2019-12-10 | 西部超导材料科技股份有限公司 | Method for assembling NbTi multi-core superconducting ingot blank |
| CN111659749A (en) * | 2020-05-20 | 2020-09-15 | 西部超导材料科技股份有限公司 | Preparation method of NbTi/CuNi/Cu superconducting composite wire |
| CN112267079A (en) * | 2020-10-26 | 2021-01-26 | 西安工程大学 | Method for manufacturing amorphous composite material by performing laser material increase on zirconium-based alloy powder |
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|---|---|---|---|---|
| CN116580894A (en) * | 2023-07-13 | 2023-08-11 | 西安聚能超导线材科技有限公司 | Preparation method of superfine NbTi filaments |
| CN116580894B (en) * | 2023-07-13 | 2023-10-13 | 西安聚能超导线材科技有限公司 | Preparation method of superfine NbTi filaments |
| CN117936185A (en) * | 2024-03-21 | 2024-04-26 | 西安聚能超导线材科技有限公司 | Preparation method of superconductive cable for multichannel clustered quantum computer |
| CN117936185B (en) * | 2024-03-21 | 2024-06-07 | 西安聚能超导线材科技有限公司 | Preparation method of superconductive cable for multichannel clustered quantum computer |
| CN117936186A (en) * | 2024-03-22 | 2024-04-26 | 西安聚能超导线材科技有限公司 | Preparation method of superconducting coaxial cable for quantum computer |
| CN117936186B (en) * | 2024-03-22 | 2024-06-18 | 西安聚能超导线材科技有限公司 | Preparation method of superconducting coaxial cable for quantum computer |
| CN117954163A (en) * | 2024-03-26 | 2024-04-30 | 西安聚能超导线材科技有限公司 | Preparation method of superconducting coaxial cable for quantum computer |
| CN117954163B (en) * | 2024-03-26 | 2024-06-18 | 西安聚能超导线材科技有限公司 | Preparation method of superconducting coaxial cable for quantum computer |
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