CN114752924A - Preparation method of aluminum foil ion reaction multilayer structure film - Google Patents
Preparation method of aluminum foil ion reaction multilayer structure film Download PDFInfo
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- CN114752924A CN114752924A CN202210478531.6A CN202210478531A CN114752924A CN 114752924 A CN114752924 A CN 114752924A CN 202210478531 A CN202210478531 A CN 202210478531A CN 114752924 A CN114752924 A CN 114752924A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1813—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/028—Including graded layers in composition or in physical properties, e.g. density, porosity, grain size
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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Abstract
The invention relates to the field of conductive metal structure layers, in particular to a preparation method of an aluminum foil ion reaction multilayer structure film, which comprises the following steps: s1, putting the aluminum foil into the electrolytic degreasing solution to purify impurities on the surface of the aluminum foil to obtain an aluminum foil A; s2, carrying out plasma treatment on the aluminum foil A to generate a micro-nano concave-convex point structure on the surface of the aluminum foil A to obtain an aluminum foil B; s3, generating a nickel film layer on the surface of the aluminum foil B by adopting an alkaline low-temperature chemical nickel plating mode for the nickel catalytic active material to obtain an aluminum foil C; and S4, generating a copper film layer on the surface of the aluminum foil C by adopting an electroplating mode through the electroplating solution, and obtaining the composite aluminum copper foil. The invention can realize the continuous production requirement of the aluminum copper foil, can meet the requirement of the laminated flexible connection of the lithium battery and the solar photovoltaic battery module of the new energy automobile, and is worthy of popularization.
Description
Technical Field
The invention relates to the field of conductive metal structure layers, in particular to a preparation method of an aluminum foil ion reaction multilayer structure film.
Background
The copper foil and the aluminum foil are required for the lamination flexible connection of the lithium battery and the solar photovoltaic battery module of the new energy automobile; copper foil and aluminum foil are used as efficient and reliable electrical connecting parts, and flexible connection of the copper foil and the aluminum foil is widely applied to various lithium batteries of electric automobiles nowadays.
However, in the laminated flexible connection, the aluminum-aluminum expansion joint is used when the soft-copper expansion joint is arranged between buses, the copper-copper expansion joint is used when the copper bus is arranged, the aluminum and the copper are not suitable for direct overlapping, and revolutionary changes are brought to the industry along with the breakthrough of the required continuous mileage of the electric automobile; along with the popularization of new energy automobiles and electric automobiles, corresponding copper foil and aluminum foil flexible connection products are customized for integrated higher batteries in order to respond to the growing demands of the electric automobiles on energy storage systems such as batteries and super capacitors, and can be directly lapped in demand. A small component plays an important role in the power battery system, namely, the aluminum-copper foil composite flexible connection provides good conductive connection for the power battery of the electric automobile, and the power battery is light, safe and good in heat dissipation; but the aluminum copper foil composite flexible connection is difficult to prepare and cannot meet the use requirement.
Disclosure of Invention
The invention aims to provide a preparation method of an aluminum foil ion reaction multilayer structure film aiming at the problems in the background technology.
The technical scheme of the invention is as follows: a preparation method of an aluminum foil ion reaction multilayer structure film comprises the following specific steps:
s1, putting the aluminum foil into the electrolytic degreasing solution to purify impurities on the surface of the aluminum foil to obtain an aluminum foil A;
S2, carrying out plasma treatment on the aluminum foil A to generate a micro-nano concave-convex point structure on the surface of the aluminum foil A, and obtaining an aluminum foil B;
s3, generating a nickel film layer on the surface of the aluminum foil B by adopting an alkaline low-temperature chemical nickel plating way for the nickel catalytic active material to obtain an aluminum foil C;
and S4, forming a copper film layer on the surface of the aluminum foil C by adopting an electroplating mode through the electroplating solution, and obtaining the composite aluminum-copper foil.
Preferably, the impurities on the surface of the aluminum foil comprise an oxide layer and grease.
Preferably, when the aluminum foil a is plasma-treated in S2, a voltage of 500 to 1000V is applied to the surface of the aluminum foil a to generate a low-energy glow discharge.
Preferably, the nickel catalytically active material comprises the following components: 150-200 g/L NiSO4·7H2O, 20-30 g/L NiCl2·6H2O, 5-8 g/L NaH2PO2·H2O, 5-8 g/L NH4Cl, and K of 150-200 g/L4P2O715-20 g/L ammonium citrate, 1-4 g/L brightener and 5-10 g/L complexing agent.
Preferably, the electroplating bath comprises the following components: copper oxide powder, copper sulfate solution and sulfuric acid solution; wherein, the copper content in the copper oxide powder is not lower than 99.96 percent; the content of copper sulfate in the copper sulfate solution is not lower than 96.00 percent; the content of sulfuric acid in the sulfuric acid solution is not lower than 98.00 percent; the content of copper ions in the electrolyte is 20-26 g/L, the temperature of the electrolyte is 18-25 ℃, the content of copper sulfate in the electrolyte is 66-80 g/L, and the content of sulfuric acid in the electrolyte is 50-60 g/L.
Preferably, the thickness of the nickel film layer in the aluminum foil C is 0.2-0.5 um.
Preferably, the thickness of the copper film layer in the finished product aluminum foil ion reaction multilayer structure film is 0.7-6.0 um.
Compared with the prior art, the technical scheme of the invention has the following beneficial technical effects:
the preparation method of the aluminum foil ion reaction multilayer structure film provided by the invention is simple to operate, the nickel film layer and the copper film layer are combined on the aluminum foil under the treatment modes of electrically removing an oil layer and a plasma treatment layer on the aluminum foil, chemically plating nickel and a copper plating layer and the like, so that the composite aluminum copper foil can be produced continuously, the use requirements of laminated flexible connection of a new energy automobile lithium battery and a solar photovoltaic battery module can be met, and the preparation method is worthy of popularization.
Drawings
Fig. 1 is a flowchart of an embodiment of the present invention.
Detailed Description
Example one
As shown in fig. 1, the method for preparing a multilayer structure film by using an aluminum foil ion reaction provided by the invention comprises the following specific steps:
s1, putting the aluminum foil into the electrolytic degreasing solution to purify impurities on the surface of the aluminum foil to obtain an aluminum foil A; forming an electric release oil layer on the surface of the aluminum foil A;
Further, the electrolytic oil removal powder solution comprises electric removal oil powder and water, wherein the solubility of the electric removal oil powder is 200-500 g/L; uniformly mixing electrolytic oil removal powder and water, preparing to obtain an electrolytic oil removal powder solution, putting an aluminum foil into the electrolytic oil removal powder solution, connecting a circuit to electrolyze the aluminum foil, and cleaning impurities on the surface of the aluminum foil by using an input current of 10-15A; impurities on the surface of the aluminum foil comprise an oxide layer and grease;
s2, carrying out plasma treatment on the aluminum foil A to generate a micro-nano concave-convex point structure on the surface of the aluminum foil A, and obtaining an aluminum foil B; forming a plasma treatment layer on the surface of the aluminum foil B;
when the aluminum foil A is subjected to plasma treatment, 500-1000V voltage is applied to the surface of the aluminum foil A to generate low-energy glow discharge so as to treat the surface of the aluminum foil A;
s3, generating a nickel film layer on the surface of the aluminum foil B by adopting an alkaline low-temperature chemical nickel plating mode for the nickel catalytic active material to obtain an aluminum foil C; the thickness of the nickel film layer in the aluminum foil C is 0.2-0.5 um;
s4, generating a copper film layer on the surface of the aluminum foil C by electroplating the electroplating solution to obtain a composite aluminum-copper foil; the thickness of a copper film layer in the finished product aluminum foil ion reaction multilayer structure film is 0.7-6.0 um;
the thicknesses of the electric stripping oil layer, the plasma treatment layer nickel film layer and the copper film layer on the outer side of the aluminum foil ion reaction multilayer structure film are 1.0-7.0 um.
Example two
Compared with the first embodiment, the preparation method of the aluminum foil ion reaction multilayer structure film provided by the invention has the advantages that the nickel catalytic active material in the first embodiment comprises the following components: NiSO with solubility of 150-200 g/L4·7H2O (nickel sulfate), solubilityNiCl of 20-30 g/L2·6H2O (nickel chloride) and NaH with solubility of 5-8 g/L2PO2·H2O (sodium hypophosphite) and NH with the solubility of 5-8 g/L4Cl (ammonium chloride) and K with the solubility of 150-200 g/L4P2O7(potassium pyrophosphate), ammonium citrate with the solubility of 15-20 g/L ((NH4)3C6H5O7), brightener with the solubility of 1-4 g/L and complexing agent with the solubility of 5-10 g/L.
EXAMPLE III
Compared with the first embodiment, the electroplating solution in the embodiment of the invention comprises the following components: copper oxide powder, copper sulfate solution and sulfuric acid solution;
wherein, the copper content in the copper oxide powder is not lower than 99.96 percent; the content of copper sulfate in the copper sulfate solution is not lower than 96.00 percent; the content of sulfuric acid in the sulfuric acid solution is not lower than 98.00 percent;
in an electrolytic state, under the condition of circulating cooling, the sulfuric acid solution reacts with the copper oxide powder to generate copper ions, and the copper ions are supplemented into the electrolyte, so that the content of the copper ions in the electrolyte is 20-26 g/L, the temperature of the electrolyte is 18-25 ℃, the content of copper sulfate in the electrolyte is 66-80 g/L, and the content of sulfuric acid in the electrolyte is 50-60 g/L.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (7)
1. The preparation method of the aluminum foil ion reaction multilayer structure film is characterized by comprising the following specific steps of:
s1, putting the aluminum foil into the electrolytic degreasing solution to purify impurities on the surface of the aluminum foil to obtain an aluminum foil A;
s2, carrying out plasma treatment on the aluminum foil A to generate a micro-nano concave-convex point structure on the surface of the aluminum foil A to obtain an aluminum foil B;
s3, generating a nickel film layer on the surface of the aluminum foil B by adopting an alkaline low-temperature chemical nickel plating mode for the nickel catalytic active material to obtain an aluminum foil C;
and S4, generating a copper film layer on the surface of the aluminum foil C by adopting an electroplating mode through the electroplating solution, and obtaining the composite aluminum copper foil.
2. The method as claimed in claim 1, wherein the impurities on the surface of the aluminum foil include oxide layer and grease.
3. The method for preparing the aluminum foil ion reaction multilayer structure film as claimed in claim 1, wherein when the aluminum foil A is subjected to plasma treatment in S2, a voltage of 500-1000V is applied to the surface of the aluminum foil A to generate low-energy glow discharge.
4. The method for preparing the ionic reaction multilayer structure film of the aluminum foil as claimed in claim 1, wherein the nickel catalytic active material comprises the following components: 150-200 g/L NiSO4·7H2O, 20-30 g/L NiCl2·6H2O, 5-8 g/L NaH2PO2·H2O, 5-8 g/L NH4Cl and K of 150-200 g/L4P2O715-20 g/L ammonium citrate, 1-4 g/L brightener and 5-10 g/L complexing agent.
5. The method for preparing an aluminum foil ion-reactive multilayer structure film as claimed in claim 1, wherein the plating solution comprises the following components: copper oxide powder, copper sulfate solution and sulfuric acid solution; wherein, the copper content in the copper oxide powder is not lower than 99.96 percent; the content of copper sulfate in the copper sulfate solution is not lower than 96.00 percent; the content of sulfuric acid in the sulfuric acid solution is not lower than 98.00 percent; the content of copper ions in the electrolyte is 20-26 g/L, the temperature of the electrolyte is 18-25 ℃, the content of copper sulfate in the electrolyte is 66-80 g/L, and the content of sulfuric acid in the electrolyte is 50-60 g/L.
6. The method for preparing the aluminum foil ion reaction multilayer structure film as claimed in claim 1, wherein the thickness of the nickel film layer in the aluminum foil C is 0.2-0.5 um.
7. The method for preparing the aluminum foil ion reaction multilayer structure film according to claim 1, wherein the thickness of the copper film layer in the finished aluminum foil ion reaction multilayer structure film is 0.7-6.0 um.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210478531.6A CN114752924A (en) | 2022-05-05 | 2022-05-05 | Preparation method of aluminum foil ion reaction multilayer structure film |
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| CN202210478531.6A CN114752924A (en) | 2022-05-05 | 2022-05-05 | Preparation method of aluminum foil ion reaction multilayer structure film |
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| CN114752924A true CN114752924A (en) | 2022-07-15 |
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| CN202210478531.6A Pending CN114752924A (en) | 2022-05-05 | 2022-05-05 | Preparation method of aluminum foil ion reaction multilayer structure film |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5448021A (en) * | 1993-08-12 | 1995-09-05 | Fujitsu Limited | Copper plating process and wiring board |
| CN102623192A (en) * | 2011-02-01 | 2012-08-01 | 林钲絖 | Negative electrode aluminum and carbon foil structure of solid aluminum electrolytic capacitor and forming method thereof |
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2022
- 2022-05-05 CN CN202210478531.6A patent/CN114752924A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5448021A (en) * | 1993-08-12 | 1995-09-05 | Fujitsu Limited | Copper plating process and wiring board |
| CN102623192A (en) * | 2011-02-01 | 2012-08-01 | 林钲絖 | Negative electrode aluminum and carbon foil structure of solid aluminum electrolytic capacitor and forming method thereof |
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