CN114727518A - Four-layer circuit board manufacturing process with high circuit alignment precision - Google Patents
Four-layer circuit board manufacturing process with high circuit alignment precision Download PDFInfo
- Publication number
- CN114727518A CN114727518A CN202210431497.7A CN202210431497A CN114727518A CN 114727518 A CN114727518 A CN 114727518A CN 202210431497 A CN202210431497 A CN 202210431497A CN 114727518 A CN114727518 A CN 114727518A
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- circuit board
- double
- layer
- sided copper
- copper
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000010030 laminating Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 42
- 238000005520 cutting process Methods 0.000 claims description 38
- 239000011889 copper foil Substances 0.000 claims description 35
- 238000003825 pressing Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 230000003213 activating effect Effects 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 5
- 239000011229 interlayer Substances 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims 1
- 238000003754 machining Methods 0.000 abstract description 2
- 230000004913 activation Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a four-layer circuit board manufacturing process with high line alignment precision, which comprises the following steps of: firstly, manufacturing an original material of a PCB circuit; step two, plate surface connection; step three, manufacturing a circuit board; step four, laminating the multilayer circuit board; step five, manufacturing a multilayer circuit board; a plurality of positioning holes are formed in the surface of the double-sided copper-clad plate after the periphery of the double-sided copper-clad plate is polished, and the positioning holes in the double-sided copper-clad plate are positioned in the processes of machining and conveying in the subsequent process, so that the alignment precision between circuits is guaranteed when one layer of circuit board is manufactured at each time, and meanwhile, the required circuits can be prevented from being influenced in the subsequent processes such as exposure and development.
Description
Technical Field
The invention relates to the technical field of four-layer circuit board manufacturing processes, in particular to a four-layer circuit board manufacturing process with high circuit alignment precision.
Background
The circuit board is used as a key component in various electronic products, and has a great influence on the performance of the electronic products. With the development of electronic products in the direction of miniaturization and multi-functionalization, the requirements for circuit boards are increasing, multilayer circuit boards are used in various applications, and the number of layers in the multilayer circuit board is still increasing, from four layers, six layers to eight layers or even more.
Chinese patent discloses a method for manufacturing a multilayer circuit board with high line alignment accuracy (publication No. CN111356309B), which manufactures alignment references (alignment targets) when manufacturing lines; therefore, various adverse effects of the existing mechanical drilling hole shape on interlayer circuit alignment operation can be effectively avoided, the circuit alignment precision between connected layers is realized, but in the conveying process, the copper foil plate is likely to have positioning difference, so that the processing precision is affected.
Disclosure of Invention
The invention aims to provide a four-layer circuit board manufacturing process with high circuit alignment precision, wherein a plurality of positioning holes are formed in the surface of a double-sided copper-clad plate after the periphery of the double-sided copper-clad plate is polished, and the positioning holes in the double-sided copper-clad plate are used for positioning in the subsequent processing and conveying processes, so that the alignment precision among circuits is ensured when a layer of circuit board is manufactured each time, and meanwhile, the required circuit can be prevented from being influenced in the subsequent processes such as exposure, development and the like.
The purpose of the invention can be realized by the following technical scheme:
a four-layer circuit board manufacturing process with high circuit alignment precision comprises the following steps:
step one, manufacturing an original material of a PCB circuit: selecting a double-sided copper-clad plate with the thickness of the copper foils on two sides being 0.03-0.035mm, cutting the double-sided copper-clad plate through a cutting machine, polishing the periphery of the edge of the cut double-sided copper-clad plate, and punching positioning holes at two ends of the double-sided copper-clad plate after polishing is completed;
step two, plate surface connection: the copper clad laminate is positioned through the positioning hole, the drilling machine is utilized to drill a reserved hole, a half-through hole and a screw hole in the double-sided copper clad laminate, then the plate is soaked in the activating solution, the hole wall is activated, and then the two layers of copper foils are connected in a copper deposition mode.
Step three, manufacturing a circuit board: covering a circuit pattern on the surface of the double-sided copper-clad plate through the processes of film pressing, exposure and development, and then electroplating and etching to obtain a plurality of circuit boards;
step four, laminating the multilayer circuit board: covering two layers of PP films on the top of the circuit board, covering a layer of circuit board to form a multilayer board, covering a layer of copper foil on two sides of the multilayer board, and laminating layer by layer through a hot press to form a copper foil board;
step five, manufacturing a multilayer circuit board: and cutting redundant copper foils on the surface of the copper foil plate by using cutting equipment to form a circuit substrate, and then carrying out plate surface connection and circuit board manufacturing operation on the circuit substrate again to form the multilayer circuit board.
As a further scheme of the invention: and in the first step, the interlayer material of the double-sided copper-clad plate is epoxy resin and glass fiber cloth.
As a further scheme of the invention: the sizes of the plurality of double-sided copper-clad plates cut in the step one are the same.
As a further scheme of the invention: and the temperature of the activation solution in the second step is 20-40 ℃, and the activation time is 5-7 minutes.
As a further scheme of the invention: the hot pressing environment of the hot press in the fourth step is 200-300 ℃ under the vacuum condition.
As a further scheme of the invention: the multilayer board in the fourth step takes the positioning holes of the rows of the double-sided copper-clad board as a reference stroke.
As a further scheme of the invention: the positioning holes are circularly arranged and distributed on the periphery of the top of the double-sided copper-clad plate.
As a further scheme of the invention: and fifthly, determining the times of the circuit substrate surface connection and circuit board manufacturing operation according to the required circuit board layer number.
The invention has the beneficial effects that:
(1) according to the invention, the periphery of the double-sided copper-clad plate is polished and then the surface of the double-sided copper-clad plate is provided with a plurality of positioning holes, and the positioning holes on the double-sided copper-clad plate are used for positioning in the subsequent processing and conveying processes, so that the alignment precision between circuits is ensured when one layer of circuit board is manufactured each time, and meanwhile, the required circuit can be prevented from being influenced in the subsequent procedures of exposure, development and the like.
(2) According to the invention, the cutting equipment is arranged to cut redundant copper foil on the copper foil plate, and the copper foil plate can be accurately cut off at one time by matching with the lifting and rotating top plate and the adjustable cutting blade in the cutting equipment, so that the influence caused by subsequent secondary film pressing, exposure and positioning is avoided.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a schematic view showing an external structure of the cutting apparatus of the present invention;
FIG. 3 is a schematic view showing an outer structure of a top plate according to the present invention;
fig. 4 is a schematic view showing an external structure of the cutting plate according to the present invention.
In the figure: 1. a mounting frame; 2. a roller conveyor; 3. a support wheel; 4. a support frame; 5. pressing down the air cylinder; 6. a top plate; 7. a sliding groove; 8. a slider; 9. a limiting sleeve; 10. a connecting member; 11. a cutting blade; 12. a bidirectional threaded rod; 13. a drive motor; 14. a rotating plate; 15. an electric telescopic rod; 16. a support plate; 17. cutting a plate; 18. the groove is rotated.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention is a manufacturing process of a four-layer circuit board with high circuit alignment accuracy, comprising the following steps:
step one, manufacturing an original material of a PCB circuit: selecting a double-sided copper-clad plate with the thickness of the copper foils on two sides being 0.03-0.035mm, cutting the double-sided copper-clad plate through a cutting machine, polishing the periphery of the edge of the cut double-sided copper-clad plate, and punching positioning holes at two ends of the double-sided copper-clad plate after polishing is completed;
step two, plate surface connection: the copper clad laminate is positioned through the positioning hole, the drilling machine is utilized to drill a reserved hole, a half-through hole and a screw hole in the double-sided copper clad laminate, then the plate is soaked in the activating solution, the hole wall is activated, and then the two layers of copper foils are connected in a copper deposition mode.
Step three, manufacturing a circuit board: covering a circuit pattern on the surface of the double-sided copper-clad plate through the processes of film pressing, exposure and development, and then electroplating and etching to obtain a plurality of circuit boards;
step four, laminating the multilayer circuit board: covering two layers of PP films on the top of the circuit board, covering a layer of circuit board to form a multilayer board, covering a layer of copper foil on two sides of the multilayer board, and laminating layer by layer through a hot press to form a copper foil board;
step five, manufacturing a multilayer circuit board: and cutting redundant copper foils on the surface of the copper foil plate by using cutting equipment to form a circuit substrate, and then carrying out plate surface connection and circuit board manufacturing operation on the circuit substrate again to form the multilayer circuit board.
A plurality of positioning holes are formed in the surface of the double-sided copper-clad plate after the periphery of the double-sided copper-clad plate is polished, and the positioning holes in the double-sided copper-clad plate are positioned in the processes of machining and conveying in the subsequent process, so that the alignment precision between circuits is guaranteed when one layer of circuit board is manufactured at each time, and meanwhile, the required circuits can be prevented from being influenced in the subsequent processes such as exposure and development.
The positioning holes are circularly arranged and distributed on the periphery of the top of the double-sided copper-clad plate, and play a role in positioning in the subsequent process.
And in the first step, the interlayer material of the double-sided copper-clad plate is epoxy resin and glass fiber cloth.
The sizes of the plurality of double-sided copper-clad plates cut in the step one are the same.
And the temperature of the activation solution in the second step is 20-40 ℃, and the activation time is 5-7 minutes.
The hot pressing environment of the hot press in the fourth step is 200-300 ℃ under the vacuum condition.
The multilayer board in the fourth step takes the positioning holes of the rows of the double-sided copper-clad board as a reference stroke.
And fifthly, determining the times of the circuit substrate surface connection and circuit board manufacturing operation according to the required circuit board layer number.
The film pressing, exposing and developing processes in the third step are also positioned by the positioning holes.
The cutting equipment in the fifth step comprises an installation frame 1, a roller conveyor 2 is arranged inside the installation frame 1, the roller conveyor 2 comprises a support and a plurality of conveying rollers, a plurality of supporting wheels 3 are fixedly connected to the outer surface of each conveying roller, a supporting frame 4 is fixedly connected to the top of the installation frame 1, two sides of the top of the supporting frame 4 are fixedly connected with a pressing cylinder 5, the output ends of the two pressing cylinders 5 penetrate through the supporting frame 4 and extend to the outside of the supporting frame 4, a top plate 6 is fixedly connected between the output ends of the two pressing cylinders 5, sliding grooves 7 are formed in the front side and the rear side of the top plate 6, sliding blocks 8 are slidably connected to the inner surfaces of the two sliding grooves 7, a connecting piece 10 is fixedly connected between the bottoms of the front sliding blocks 8 and the rear sliding blocks 8, and a cutting blade 11 is fixedly connected to the bottom of the connecting piece 10, bottom fixedly connected with stop collar 9 of roof 6, the internal surface of stop collar 9 rotates and is connected with two-way threaded rod 12, threaded hole runs through in one side of connecting piece 10, the internal surface of screw hole and the surface threaded connection of two-way threaded rod 12 can adjust the distance between two cutting blade 11 through rotating two-way threaded rod 12, thereby can adjust the cutting width, and it is higher to adjust its precision with the pivoted mode, or control two-way threaded rod 12 through the motor, and utilize PLC controller pivoted angle, cut unnecessary copper foil on the copper foil board through setting up cutting equipment, can go up and down and pivoted roof 6 and cutting blade 11 that can adjust in the cooperation cutting equipment, can once only with the accurate downcut of copper foil board, in order to avoid the film pressing once more of subsequent order, Exposure and positioning are affected.
The inside fixedly connected with backup pad 16 of mounting bracket 1, the bottom fixedly connected with driving motor 13 of backup pad 16, driving motor 13's output runs through backup pad 16 and extends to the outside of backup pad 16, driving motor 13's output fixedly connected with rotor plate 14, the top fixedly connected with electric telescopic handle 15 of rotor plate 14, electric telescopic handle 15 are located between two adjacent conveying rollers, electric telescopic handle 15's output fixedly connected with cutting plate 17, a plurality of rotation groove 18 has been seted up at cutting plate 17's top, and the diameter in this rotation groove 18 is greater than the diameter of supporting wheel 3, guarantees that cutting plate 17 can fall down.
The working principle of the invention is as follows: firstly, the two-way threaded rod 12 is rotated, under the action of the threaded hole, the two connecting pieces 10 drive one side of the cutting blade 11 to move, the sliding block 8 slides on the inner surface of the sliding groove 7, so as to adjust the distance between the two cutting blades 11, at the moment, the copper foil plate is conveyed to the corresponding position of the roller conveyor 2 by utilizing the positioning hole on the copper foil plate, the supporting wheel 3 is started to rotate, so as to convey the copper foil plate, after the copper foil plate moves to the upper part of the cutting plate 17, the cutting plate 17 is extended by starting the electric telescopic rod 15 on the rotating plate 14, so as to enable the cutting plate 17 to move upwards, so as to jack up the copper foil plate on the supporting wheel 3, at the moment, the pushing cylinder 5 is started to extend, so as to drive the top plate 6 to move downwards, so as to enable the cutting blade 11 to cut redundant copper foil on the copper foil plate, after the cutting is finished, the cutting blade 11 is lifted by the pushing cylinder 5, then the driving motor 13 is controlled to rotate for 90 degrees, so that the copper foil plates on the cutting plate 17 are driven to rotate, and at the moment, the copper foils on the copper foil plates on the other two sides are cut again by extending the pressing cylinder 5.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation and a specific orientation configuration and operation, and thus, should not be construed as limiting the present invention. Furthermore, "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate member, or they may be connected through two or more elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (8)
1. A four-layer circuit board manufacturing process with high circuit alignment precision is characterized by comprising the following steps of:
step one, manufacturing an original material of a PCB circuit: selecting a double-sided copper-clad plate with the thickness of the copper foils on two sides being 0.03-0.035mm, cutting the double-sided copper-clad plate through a cutting machine, polishing the periphery of the edge of the cut double-sided copper-clad plate, and punching positioning holes at two ends of the double-sided copper-clad plate after polishing is completed;
step two, plate surface connection: positioning through the positioning hole, drilling a reserved hole, a half-through hole and a screw hole on the double-sided copper-clad plate by using a drilling machine, soaking the plate in an activating solution, activating the hole wall, and connecting the two layers of copper foils in a copper deposition mode;
step three, manufacturing a circuit board: covering a circuit pattern on the surface of the double-sided copper-clad plate through the processes of film pressing, exposure and development, and then electroplating and etching to obtain a plurality of circuit boards;
step four, laminating the multilayer circuit board: covering two layers of PP films on the top of the circuit board, covering a layer of circuit board to form a multilayer board, covering a layer of copper foil on two sides of the multilayer board, and laminating layer by layer through a hot press to form a copper foil board;
step five, manufacturing a multilayer circuit board: and cutting redundant copper foils on the surface of the copper foil plate by using cutting equipment to form a circuit substrate, and then carrying out plate surface connection and circuit board manufacturing operation on the circuit substrate again to form the multilayer circuit board.
2. The manufacturing process of the four-layer circuit board with high line alignment precision according to claim 1, wherein the interlayer material of the double-sided copper-clad plate in the first step is epoxy resin and glass fiber cloth.
3. The manufacturing process of the four-layer circuit board with high circuit alignment precision according to claim 1, wherein the plurality of double-sided copper-clad plates cut in the first step have the same size.
4. The process for manufacturing a four-layer circuit board with high alignment precision as claimed in claim 1, wherein the temperature of the activating solution in the second step is 20-40 ℃ and the activating time is 5-7 minutes.
5. The manufacturing process of the four-layer circuit board with high circuit alignment accuracy as claimed in claim 1, wherein the hot pressing environment of the hot press in the fourth step is 200-300 ℃ under vacuum.
6. The manufacturing process of the four-layer circuit board with high circuit alignment precision according to claim 1, wherein the multi-layer board in the fourth step takes the positioning holes of the row of the double-sided copper-clad plate as a reference stroke.
7. The manufacturing process of the four-layer circuit board with high alignment precision as claimed in claim 1, wherein the positioning holes are arranged in a circle and distributed around the top of the double-sided copper-clad plate.
8. The manufacturing process of a four-layer circuit board with high circuit alignment accuracy as claimed in claim 1, wherein the number of times of board surface connection and circuit board manufacturing operations of the circuit substrate in the fifth step is determined according to the number of required circuit board layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210431497.7A CN114727518B (en) | 2022-04-22 | 2022-04-22 | Manufacturing process of multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210431497.7A CN114727518B (en) | 2022-04-22 | 2022-04-22 | Manufacturing process of multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114727518A true CN114727518A (en) | 2022-07-08 |
| CN114727518B CN114727518B (en) | 2024-10-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210431497.7A Active CN114727518B (en) | 2022-04-22 | 2022-04-22 | Manufacturing process of multilayer circuit board |
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| CN110602887A (en) * | 2019-09-17 | 2019-12-20 | 四川深北电路科技有限公司 | Manufacturing method of high-frequency multilayer circuit board |
| CN111050477A (en) * | 2019-12-23 | 2020-04-21 | 深圳市泰科思特精密工业有限公司 | Circuit board cutting edge grinding groove milling machining method and production line |
| CN111385982A (en) * | 2019-01-01 | 2020-07-07 | 长沙牧泰莱电路技术有限公司 | Method for improving laminated structure of multilayer PCB |
| CN212795100U (en) * | 2020-06-01 | 2021-03-26 | 苏州台立龙电子科技有限公司 | Thermal-insulated panel cutting device |
| CN214238446U (en) * | 2020-11-19 | 2021-09-21 | 重庆石城塑料制品有限公司 | Cotton processing of EPE pearl is with fluting device |
-
2022
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Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020050055A1 (en) * | 2000-10-26 | 2002-05-02 | Nitto Denko Corporation | Boring method for circuit board |
| KR20180018216A (en) * | 2016-08-12 | 2018-02-21 | 안종이 | Automatic adhesive tape attachment device and assembly system having the same |
| CN106961802A (en) * | 2017-05-04 | 2017-07-18 | 深圳崇达多层线路板有限公司 | A kind of preparation method of printed board LDI exposure alignings |
| CN207658768U (en) * | 2017-12-05 | 2018-07-27 | 劲亚（上海）机械有限公司 | A kind of flat-press flat-die cutting machine feeding fixing device |
| CN109714907A (en) * | 2018-12-18 | 2019-05-03 | 安徽四创电子股份有限公司 | A kind of production method of the multi-layer PCB for 5G communication |
| CN111385982A (en) * | 2019-01-01 | 2020-07-07 | 长沙牧泰莱电路技术有限公司 | Method for improving laminated structure of multilayer PCB |
| CN110602887A (en) * | 2019-09-17 | 2019-12-20 | 四川深北电路科技有限公司 | Manufacturing method of high-frequency multilayer circuit board |
| CN111050477A (en) * | 2019-12-23 | 2020-04-21 | 深圳市泰科思特精密工业有限公司 | Circuit board cutting edge grinding groove milling machining method and production line |
| CN212795100U (en) * | 2020-06-01 | 2021-03-26 | 苏州台立龙电子科技有限公司 | Thermal-insulated panel cutting device |
| CN214238446U (en) * | 2020-11-19 | 2021-09-21 | 重庆石城塑料制品有限公司 | Cotton processing of EPE pearl is with fluting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114727518B (en) | 2024-10-11 |
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