CN114672884A

CN114672884A - Warehouse-in and warehouse-out component and single cell library preparation system

Info

Publication number: CN114672884A
Application number: CN202210309431.0A
Authority: CN
Inventors: 索海军; 焦少灼; 李宗文
Original assignee: Beijing Xunyin Biological Technology Co ltd
Current assignee: Beijing Xunyin Biological Technology Co ltd
Priority date: 2022-03-28
Filing date: 2022-03-28
Publication date: 2022-06-28
Anticipated expiration: 2042-03-28
Also published as: CN114672884B

Abstract

The invention discloses a warehouse entry and exit component and a single cell library preparation system, wherein the warehouse entry and exit component comprises a warehouse entry and exit and a temperature control mechanism, and the warehouse entry and exit defines an installation area for installing a microfluidic chip; the temperature control mechanism is arranged in the in-out bin and at least acts on the microfluid chip at the mounting area so as to control the temperature of the microfluid chip to be maintained in a target temperature interval. In the invention, the inlet and outlet bin can be used for fixedly installing the microfluid chip and driving the microfluid chip to enter and exit the inner cavity of the shell of the single-cell preparation library; the temperature control mechanism is arranged in the in-out bin and at least can adjust the temperature of the microfluidic chip, so that no matter the in-out bin and/or the single cell library preparation system is applied to a scene with higher temperature or lower temperature, the microfluidic chip is always maintained in a target temperature range, a good preparation environment is ensured, and the applicability of the whole machine is improved.

Description

Warehouse-in and warehouse-out component and single cell library preparation system

Technical Field

The invention relates to the technical field of single cell library preparation, in particular to a warehouse-in and warehouse-out component and a single cell library preparation system.

Background

The existing single cell library preparation system is generally provided with an in-out warehouse structure to send the microfluid chip into the inner cavity of the shell, so as to complete the preparation process. However, the single cell library preparation process needs to be maintained in a suitable temperature range, which imposes restrictions on the use environment of the single cell library preparation system.

Disclosure of Invention

The invention mainly aims to provide a warehouse-in and warehouse-out component and a single-cell library preparation system, and aims to solve the problem that the traditional single-cell library preparation system cannot control the temperature.

In order to achieve the above object, the present invention provides an inlet and outlet assembly for being movably mounted on a housing of a single-cell library preparation system, the inlet and outlet assembly comprising:

an in-out bin defining an installation area for installing the microfluidic chip; and the number of the first and second groups,

and the temperature control mechanism is arranged in the inlet and outlet bin and at least acts on the microfluid chip at the mounting area so as to control the temperature of the microfluid chip to be maintained in a target temperature interval.

Optionally, the in-and-out bin comprises an object carrying plate, the object carrying plate is provided with a through hole in a penetrating manner along the vertical direction, and the through hole defines the installation area; the temperature control mechanism comprises:

the heat conduction part and the heat dissipation part are arranged at intervals from top to bottom;

the refrigerating pieces are provided with a first working end and a second working end which are oppositely arranged, the refrigerating pieces are arranged at the interval, the first working end is in heat exchange connection with the heat conducting part, and the second working end is in heat exchange connection with the heat radiating part; and the number of the first and second groups,

and the heat insulation ring extends along the circumferential direction of the interval to jointly separate the heat conduction part and the heat dissipation part with the refrigeration sheet.

Optionally, the carrying plate is made of a heat conducting material, and the heat dissipation portion is plate-shaped and extends along the peripheral side wall surface of the through hole to be in heat exchange connection with the carrying plate.

Optionally, the heat insulation ring includes a main ring section and an extension ring section formed by inward protruding from a lower portion of the main ring section, the main ring section is disposed in the through hole to separate the carrier plate from the heat conduction portion, and the extension ring section is limited between the heat conduction portion and the heat dissipation portion.

Optionally, the heat dissipation portion is provided with a fastening hole along the vertical direction, the extension ring section is provided with a fastener protruding downwards, and the fastener passes through the fastening hole and is fastened and fixed with the fastening hole;

the buckle with the heat conduction part corresponds the department and is equipped with the connecting hole respectively, temperature control mechanism still includes the connecting pin, the connecting pin connects gradually two the connecting hole.

Optionally, the heat conducting portion and/or the heat dissipating portion may be elastically and vertically movably disposed with respect to the refrigeration sheet, respectively, so that when the microfluidic chip is disposed on the heat conducting portion, the elastically and movably disposed heat conducting portion and/or the heat dissipating portion is driven to adhere to the refrigeration sheet;

the temperature control mechanism further comprises a connecting pin, the connecting pin sequentially penetrates through the heat dissipation part and the heat conduction part from bottom to top and extends upwards to form an extending section, a convex buckle is formed by laterally and convexly arranging the end part of the extending section, the convex buckle is supported on the upper end face of the heat conduction part, can upwards penetrate through a fixing hole of the microfluidic chip when the microfluidic chip is installed on the heat conduction part, and is supported on the upper end face of the microfluidic chip to limit the microfluidic chip from coming out of the inlet and outlet bin.

Optionally, the heat conducting portion includes a heat conducting film disposed corresponding to the first working end, and the heat conducting film is made of a material including at least one of metal, graphite, and graphene.

Optionally, the heat dissipation part is arranged in a plate shape, a plurality of heat dissipation ribs are arranged at intervals on one side of the heat dissipation part, which is opposite to the second working end, and a heat dissipation flow channel is defined between every two adjacent heat dissipation ribs;

the temperature control mechanism further comprises a heat dissipation fan, and the heat dissipation fan is arranged at the heat dissipation flow channel to drive airflow to pass through the heat dissipation flow channel and dissipate heat generated at the second working end.

Optionally, the heat dissipation flow channel includes an air inlet section, an air outlet section, and a heat dissipation cavity communicated between the air inlet section and the air outlet section, the heat dissipation cavity is disposed corresponding to the through hole and has a plurality of air inlets communicated with the air inlet section, and a peripheral side wall of the heat dissipation cavity extends in an arc shape;

the plurality of air inlets are arranged at intervals along the circumferential direction of the heat dissipation cavity, each air inlet supplies air towards the tangential direction at the position, and the plurality of air inlets supply air towards the same side of the heat dissipation cavity in the circumferential direction.

Further, to achieve the above object, the present invention provides a single cell library preparation system comprising:

the side wall of the shell is provided with an opening communicated to the inner cavity of the shell; and the number of the first and second groups,

business turn over storehouse subassembly, business turn over storehouse subassembly holds and establishes casing inner chamber, and can certainly the opening part activity is taken out, business turn over storehouse subassembly includes:

In the technical scheme provided by the invention, the inlet and outlet bin can be used for fixedly mounting the microfluidic chip and driving the microfluidic chip to enter and exit the inner cavity of the shell of the single cell preparation library; the temperature control mechanism is arranged in the in-out bin and at least can adjust the temperature of the microfluidic chip, so that no matter the in-out bin and/or the single cell library preparation system is applied to a scene with higher temperature or lower temperature, the microfluidic chip is always maintained in a target temperature range, a good preparation environment is ensured, and the applicability of the whole machine is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic perspective view of a single-cell library preparation system (after removing the housing) according to an embodiment of the present invention;

FIG. 2 is a schematic perspective view of the single-cell library preparation system of FIG. 1 (without the loading/unloading module installed);

FIG. 3 is a perspective view of a perspective of the access assembly of FIG. 1;

FIG. 4 is a perspective view of the access assembly of FIG. 1 from another perspective;

FIG. 5 is a schematic perspective view of the in-out bin assembly of FIG. 4 (with the slide rail assembly removed);

FIG. 6 is a perspective view of the access assembly of FIG. 5 (with the bottom cover removed);

FIG. 7 is a perspective view of the in-out bin assembly of FIG. 6 (with the heat sink fan and heat sink removed);

FIG. 8 is a schematic longitudinal sectional view of the access assembly of FIG. 1;

FIG. 9 is an enlarged schematic view of the first embodiment at A in FIG. 8;

FIG. 10 is an enlarged schematic view of the second embodiment at A in FIG. 8;

fig. 11 is a schematic structural diagram of another embodiment of the heat dissipation portion in fig. 1.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				1	Single cell library preparation system	223	Refrigerating plate
100	Casing (CN)	224	Heat insulation ring
				110	Opening of the container	224a	Main ring section
200	Warehouse in and out component	224b	Extension ring section
				210	In-out bin	224c	Buckle
211	Mounting area	225	Connecting hole
				212	Loading board	226	Connecting pin
213	Dodging groove	226a	Convex button
				220	Temperature control mechanism	230	Heat radiation fan
221	Heat conducting part	240	Bottom cover
				222	Heat dissipation part	250	Drag chain
222a	Buckle hole	241	Driver
				222b	Radiating convex rib	242	Sliding rail assembly
222c	Heat dissipation flow channel	243	Transmission assembly
				222d	Air inlet section	300	Manifold board
222e	Heat dissipation cavity	400	Electric control device
				222f	Air outlet section	500	Microfluidic chip

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

In view of the foregoing, the present invention provides a warehouse entry and exit assembly for use in a single cell library preparation system.

In addition, the invention provides a single cell library preparation system which comprises a machine shell and an inlet and outlet bin, wherein the side wall of the machine shell is provided with an opening communicated with the inner cavity of the machine shell, and the inlet and outlet bin assembly is accommodated in the inner cavity of the machine shell and can be movably extracted from the inner cavity of the machine shell from the opening. Referring to fig. 1 to 11, an embodiment of the present invention is shown in which the warehouse entry/exit component is applied to a single-cell library preparation system.

Since the present invention mainly improves the inlet/outlet assembly, the inlet/outlet assembly will be mainly described with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1 to 3, the present invention further provides a chamber access assembly 200, wherein the chamber access assembly 200 includes a chamber access 210 and a temperature control mechanism 220, the chamber access 210 defines a mounting region 211 for mounting a microfluidic chip 500; the temperature control mechanism 220 is disposed in the inlet/outlet chamber 210, and at least acts on the microfluidic chip 500 at the mounting region 211 to control the temperature of the microfluidic chip 500 to be maintained within a target temperature range.

In the technical scheme provided by the invention, the in-out bin 210 can be used for fixedly mounting the microfluidic chip 500 and driving the microfluidic chip 500 to enter and exit the inner cavity of the shell 100 of the single cell preparation library; the temperature control mechanism 220 is disposed in the in-out bin 210 and at least can adjust the temperature of the microfluidic chip 500, so that whether the in-out bin 210 and/or the single cell library preparation system 1 is applied in a scene with a high temperature or a low temperature, the microfluidic chip 500 is always maintained in a target temperature range, a good preparation environment is ensured, and the applicability of the whole machine is improved.

In the design, the inlet and outlet bin 210 is generally plate-shaped or relatively thin block-shaped; any surface of the inlet/outlet bin 210 defines a mounting area 211, it should be noted that the mounting area 211 can be disposed at, for example, the upper end, the lower end or any peripheral side of the inlet/outlet bin 210 according to actual needs, but for easy understanding, in the following embodiments, the surface of the inlet/outlet bin 210 defining the mounting area 211 is taken as an example of an upper surface.

The region of the in-out bin 210 other than the installation region 211 is a remaining region. The mounting region 211 may be protruded on the upper surface of the in-out chamber 210 by an arbitrary mark symbol, for example, by a pattern, a color, a character, a material, a shape, a degree of unevenness, etc. different from those of the remaining region. The mounting region 211 is adapted to the shape and size of the microfluidic chip 500 to ensure that the microfluidic chip 500 can be accurately and securely mounted on the in-out chamber 210. Since the microfluidic chip 500 may be mounted on the access chamber 210 individually or in multiple plates, the mounting region 211 may be a region for marking a single microfluidic chip 500, or may be a region for marking a plurality of microfluidic chips 500.

When the upper end of business turn over storehouse 210 is sunken, inject concave type setting installation area 211 is the time, the upper end of business turn over storehouse 210 generally still be equipped with the groove 213 of dodging of installation area 211 intercommunication, dodge groove 213 and form certain space of dodging, conveniently do benefit to user's dismouting microfluid chip 500.

The temperature control mechanism 220 can be disposed on the housing 100 and then be configured to act on at least the hand mounting area 211. However, since the in-out bin 210 moves inward and outward at any time according to the requirement of the casing 100, in order to ensure that the temperature control mechanism 220 continuously adjusts the temperature of the installation region 211 on the movement stroke of the in-out bin 210 and to reduce interference of the position of the temperature control mechanism 220 close to the in-out bin 210 on the inward and outward movement of the in-out bin 210, in this embodiment, the temperature control mechanism 220 is directly disposed on the in-out bin 210, so that the installation region 211 can be continuously adjusted in temperature, and the disassembly and replacement are easy.

The temperature control mechanism 220 is used to maintain the temperature of the microfluidic chip 500 on the mounting region 211 within a target temperature interval. The target temperature area can be specifically set according to actual needs:

in one embodiment, the single-cell library preparation system 1 further comprises an electronic control device 400, wherein a memory is integrated in the electronic control device 400, and the memory stores therein a database of the types of the microfluidic chips 500 and the optimal temperature ranges associated with the one-to-one mapping of the types of the microfluidic chips 500. When the type of the microfluidic chip 500 is determined, the database may be queried to obtain an optimal temperature interval associated with the type mapping of the current microfluidic chip 500 as the current target temperature interval of the temperature control mechanism 220.

In another embodiment, the single-cell library preparation system 1 further comprises an electronic control device 400 and an input device, wherein the input device can be a mechanical case such as a keyboard, a virtual case such as a touch screen, a voice input module, a gesture recognition module, and the like, and can accurately receive an input instruction triggered by a user. The electronic control device 400 is electrically connected to the input device, and when the type of the microfluidic chip 500 is determined, the electronic control device 400 may obtain and recognize an input command triggered by the input device, so as to obtain a temperature interval associated with the input command as a current target temperature interval of the temperature control mechanism 220.

Of course, in the above embodiment, the type of the microfluidic chip 500 may be determined by the user by querying the marks on the outer surface of the microfluidic chip 500, or may be automatically detected by the imaging device, the two-dimensional code/barcode recognition device, etc. integrated with the single-cell library preparation system 1.

The temperature control mechanism 220 may directly act on the microfluidic chip 500 to perform temperature rise adjustment and/or temperature drop adjustment. The specific temperature control mode is not limited, and all schemes for adjusting temperature rise and/or temperature drop can be realized within the protection scope of the design. For example, a relatively hot or cold air flow may be blown toward the microfluidic chip 500 at the mounting region 211 by, for example, sending a cold or hot air flow toward the microfluidic chip 500, or by disposing, for example, a heat emitting face or a cold face toward the microfluidic chip 500. Alternatively, the temperature adjustment of the microfluidic chip 500 may be finally achieved by temperature adjustment of the mounting region 211, and then by means of contact-type heat conduction between the mounting region 211 and the microfluidic chip 500.

Specifically, referring to fig. 6 to 9, in an embodiment, the in-out bin 210 includes an object carrying plate 212, and through holes are formed in the object carrying plate 212 along the vertical direction, and define the installation region 211; the temperature control mechanism 220 comprises a heat conduction part 221, a heat dissipation part 222, a refrigeration sheet 223 and a heat insulation ring 224, wherein the heat conduction part 221 and the heat dissipation part 222 are arranged at intervals from top to bottom; the refrigeration piece 223 is provided with a first working end and a second working end which are oppositely arranged, the refrigeration piece 223 is arranged at the interval, the first working end is in heat exchange connection with the heat conducting part 221, and the second working end is in heat exchange connection with the heat radiating part 222; the thermal insulating ring 224 extends in the circumferential direction of the space to separate the heat-conducting portion 221 and the heat-radiating portion 222 in cooperation with the cooling fins 223.

The working principle of the refrigerating plate 223, namely the semiconductor refrigerating plate, is based on the peltier principle, namely, energy required by electron current is provided by a direct current power supply, and after the power supply is switched on, an electron cathode starts to start to firstly pass through a P-type semiconductor and absorb heat by the P-type semiconductor, and then pass through an N-type semiconductor and emit the absorbed heat. Every time the refrigerant passes through one NP module, heat is sent from one end of the refrigerating piece 223 to the other end of the refrigerating piece to generate temperature difference, and cold and hot ends are formed. Therefore, by arranging the refrigeration piece 223 and then supplying power to the refrigeration piece 223 through the electric control device 400 or an additionally arranged power supply assembly, one end of the refrigeration piece 223 can be used for refrigerating and the other end can be used for heating. For ease of understanding, in the following embodiments, two opposite ends of the refrigeration sheet 223 are defined as a first working end and a second working end, one of which is a cold end and the other of which is a hot end; by switching the current direction of the refrigeration sheet 223, the cold and hot properties of the first working end and the second working end can be switched.

The in-out bin 210 is further provided with a wiring slot and/or a tow chain 250, and the wiring slot and/or the tow chain 250 is used for wiring of the electric control device 400 or an additionally arranged power supply assembly.

In view of the above, in the present embodiment, the heat conduction portion 221 and the heat dissipation portion 222 are provided, and both the heat conduction portion 221 and the heat dissipation portion 222 are made of a material with good heat conduction performance, for example, the heat conduction portion 221 may be made of a metal material such as an aluminum material, and the heat dissipation portion 222 may be made of a metal material such as a copper material. The first working end of the refrigeration sheet 223 is in heat exchange connection with the heat conduction part 221, and the second working end of the refrigeration sheet 223 is in heat exchange connection with the heat dissipation part 222, so that when the first working end is a cold end and the second working end is a hot end, cold energy generated by the cold end can be directly transmitted to the microfluidic chip 500 through the heat conduction part 221, and heat generated by the hot end can be timely dissipated through the heat dissipation part 222, so that the refrigeration sheet 223 has better heat exchange performance; on the contrary, when the second working end is a cold end and the first working end is a hot end, the heat generated by the hot end can be directly transferred to the microfluidic chip 500 by the heat conducting part 221, and the cold generated by the cold end can be timely dissipated by the heat dissipating part 222, so that the refrigerating sheet 223 has better heat exchange performance.

For the sake of understanding, in the following embodiments, the first working end is a cold end and the second working end is a hot end. The heat exchange connection means a connection capable of performing heat exchange, and may be a contact connection or a non-contact connection that performs heat exchange through a medium such as air. However, in the present embodiment, in order to achieve a better heat exchange effect, the first working end is held in contact with at least a part of the heat conductive portion 221, and the second working end is held in contact with at least a part of the heat dissipating portion 222.

Since the cooling sheet 223 is substantially plate-shaped (or sheet-shaped with a thinner thickness), in practical applications, in order to increase the contact area between the heat conducting portion 221 and the first working end and the contact area between the heat dissipating portion 222 and the second working end, in this embodiment, the heat conducting portion 221 and the heat dissipating portion 222 may be both plate-shaped, sheet-shaped, or even film-shaped.

The shape and size of the plate surface of the heat conduction portion 221 may be substantially the same as or slightly larger than the shape and size of the end surface of the first working end of the cooling fin 223. In order to increase the range of the heat dissipation area as much as possible, the plate area of the heat dissipation portion 222 may be selected to be larger than the end area of the second working end of the cooling plate 223. This allows the cooling plate 223 to separate the middle area of the heat-conducting portion 221 and the heat-radiating portion 222, and the heat-insulating ring 224 to separate at least the edge areas of the heat-conducting portion 221 and the heat-radiating portion 222, thereby ensuring that the heat-conducting portion 221 and the heat-radiating portion 222 cannot or are difficult to directly exchange heat.

The heat insulation ring 224 may be made of a material having relatively poor thermal conductivity, i.e., at least smaller than the materials of the heat conduction portion 221 and the heat dissipation portion 222, such as plastic and rubber.

It will be appreciated that the carrier plate 212 is made of a thermally conductive material. When the carrier plate 212 is also made of a heat conductive material, the carrier plate 212 has a heat conductive capability as a whole. When the loading plate 212 made of a heat conductive material is connected to the heat conductive portion 221 in a heat exchange manner, the area of the heat conductive portion 221 can be enlarged. In view of this, in one embodiment, the loading plate 212 may be detachably connected with the heat conducting portion 221 in a heat exchange manner, for example, a movable connecting structure is disposed between the loading plate 212 and the heat conducting portion 221, the connecting structure is made of a heat insulating material, and when the connecting structure is moved out to connect the loading plate 212 and the heat conducting portion 221, the heat exchange is achieved; when the connecting structure is movably moved in and is connected with the loading plate 212 and the heat conducting part 221, the loading plate 212 and the heat conducting part realize heat insulation. Of course, the object plate 212 and the heat conducting portion 221 may be movably disposed in a direction approaching to and departing from each other, so that the object plate 212 and the heat conducting portion 221 realize heat exchange when approaching to each other; when the carrier plate 212 and the heat conduction portion 221 are away from each other, thermal insulation is achieved. With the above arrangement, the range of the heat conducting area of the in-out chamber 210 can be adjusted, and when necessary, for example, when a large number of microfluidic chips 500 need to be mounted, the carrier plate 212 and the heat conducting portion 221 can be selected to conduct heat to each microfluidic chip 500 together.

Alternatively, the carrier plate 212, which is made of a thermally conductive material, may optionally be in heat exchange communication with the heat sink 222. Specifically, referring to fig. 3 to 5, in an embodiment, the heat dissipation portion 222 is plate-shaped and extends along the peripheral wall surface of the through hole to be connected to the object carrying plate 212 in a heat exchange manner. Therefore, the heat dissipation area of the refrigeration sheet 223 is enlarged in a limited space, so that the second working end of the refrigeration sheet 223 can dissipate heat more efficiently and quickly, and the improvement of the refrigeration effect of the first working end of the refrigeration sheet 223 is facilitated.

Of course, the above two embodiments may be combined, that is, the object carrying plate 212 may be selectively connected to the heat conducting portion 221 or the heat radiating portion 222 in a heat exchange manner, so as to adjust the connection state of the object carrying plate 212 according to actual needs, for example, according to the refrigeration sheet 223 for refrigerating or heating the microfluidic chip 500, which is not described herein.

In addition, referring to fig. 8 to 10, in an embodiment, the heat insulation ring 224 includes a main ring section 224a and an extension ring section 224b formed by protruding inward from a lower portion of the main ring section 224a, the main ring section 224a is disposed in the through hole to separate the object plate 212 from the heat conduction portion 221, and the extension ring section 224b is limited between the heat conduction portion 221 and the heat dissipation portion 222.

The main ring segment 224a and the extension ring segment 224b may be made of the same material or different materials. For example, the main ring segment 224a and the extension ring segment 224b may be made of an elastic material, so that the main ring segment 224a may seal, fix and relieve the impact on the connection between the carrier plate 212 and the heat conducting portion 221, and the extension ring segment 224b may seal, fix and relieve the impact on the connection between the heat conducting portion 221 and the heat dissipating portion 222 while achieving a heat insulation function. The elastic modulus of the extension ring segment 224b is optionally smaller than that of the main ring segment 224a, so that the heat conduction portion 221 can slightly float in the up-down direction, thereby realizing the floating installation of the microfluidic chip 500 on the in-out chamber 210.

The heat insulation ring 224 can be a solid structure, or a structure with a cavity; any surface of the heat insulation ring 224 may be a whole flat surface, and a concave-convex structure of any form (shape and size) may be provided on any surface of the heat insulation ring 224 according to actual needs, so as to achieve the purposes of reducing contact area, saving material consumption, and the like.

Next, in an embodiment, the heat dissipating portion 222 is provided with a fastening hole 222a extending along the vertical direction, the extending ring segment 224b is provided with a fastener 224c protruding downward, and the fastener 224c passes through the fastening hole 222a and is fastened and fixed with the fastening hole 222 a; the specific form of the clip 224c is not limited, and when the clip 224c is fixed to the clip hole 222a, the heat sink 222 and the heat insulating ring 224 can be firmly connected under a certain external force. The buckle 224c and the heat conducting portion 221 are respectively provided with a connecting hole 225 at a corresponding position, the temperature control mechanism 220 further includes a connecting pin 226, and the connecting pin 226 is sequentially connected to the two connecting holes 225. The connecting pin 226 sequentially passes through the connecting hole 225 of the buckle 224c and the connecting hole 225 of the heat conducting part 221 from bottom to top, so that the heat radiating part 222, the heat insulating ring 224 and the heat conducting part 221 are connected and fixed.

Further, the portion of the clip 224c may be made of an elastic material, or by structural modification, for example, in the form of a spring plate, the aperture of the connection hole 225 of the clip 224c may be adjusted and the outer diameter of the outer wall surface of the clip 224c may be adjusted. At this time, the connection pin 226 may be an expansion screw, and the side wall of the latch 224c is sufficiently close to the inner wall of the fastening hole 222a by the expansion at the connection hole 225 of the latch 224c, so that the tight connection between the heat insulating ring 224 and the heat dissipating part 222 is realized.

Further, in an embodiment, the heat conducting portion 221 and/or the heat dissipating portion 222 are elastically and vertically disposed with respect to the cooling sheet 223, respectively, so that when the microfluidic chip 500 is disposed on the heat conducting portion 221, the elastically and movably disposed heat conducting portion 221 and/or the heat dissipating portion 222 are attached to the cooling sheet 223. As such, when the in-out cartridge 210 is not installed with the microfluidic chip 500, the heat conducting portion 221, the cooling plate 223, and the heat radiating portion 222 remain in a natural state without being forced; when the inlet and outlet bin 210 is used for installing the microfluidic chip 500, the gravity of the microfluidic chip 500 or the acting force of a user for installing the microfluidic chip 500 drives the microfluidic chip 500, the heat conducting part 221, the refrigerating piece 223 and the heat radiating part 222 to be fully attached and close to each other, so that a good heat exchange effect is achieved.

With reference to fig. 10, in an embodiment, the temperature control mechanism 220 further includes a connecting pin 226, and the connecting pin 226 sequentially penetrates through the heat dissipation portion 222 and the heat conduction portion 221 from bottom to top and extends upward to form an extending section. Specifically, as described above, the heat dissipation portion 222 is provided with a fastening hole 222a extending in the vertical direction, the extension ring section 224b is provided with a fastener 224c protruding downward, and the fastener 224c passes through the fastening hole 222a and is fastened and fixed with the fastening hole 222 a; the buckle 224c and the heat conducting portion 221 are respectively provided with a connecting hole 225 at a corresponding position, the temperature control mechanism 220 further includes a connecting pin 226, and the connecting pin 226 is sequentially connected to the two connecting holes 225. The connection hole 225 of the heat conduction portion 221 is disposed to penetrate the upper end surface of the heat conduction portion 221 upward, so that the connection pin 226 can move upward to protrude from the upper surface of the heat conduction portion 221.

The portion of the connecting pin 226 protruding upward from the upper surface of the heat-conducting portion 221 is defined as a protruding section. The end of the protruding section protrudes laterally to form a protruding buckle 226a, the protruding buckle 226a is supported on the upper end surface of the heat conducting portion 221, and can penetrate out of the fixing hole of the microfluidic chip 500 when the microfluidic chip 500 is mounted on the heat conducting portion 221, and is supported on the upper end surface of the microfluidic chip 500 to limit the microfluidic chip 500 from coming out of the in-out bin 210.

It will be appreciated that the button 226a is formed with a downwardly facing stepped surface. The extended ring segment 224b of the insulating ring 224 is provided to be made of an elastic material; and/or, at least one of the four parts, i.e., the heat conducting part 221 and the extending ring section 224b, the heat conducting part 221 and the first working end, the heat dissipating part 222 and the extending ring section 224b, and the heat dissipating part 222 and the second working end, is provided with an elastic member, so that when the microfluidic chip 500 is not mounted, i.e., the heat conducting part 221 is not subjected to a downward acting force, at least the heat conducting part 221 is pushed up, so that the wall surface of the heat conducting part 221 on the periphery side of the connecting hole 225 thereof is abutted against the step surface of the convex buckle 226 a; when the microfluidic chip 500 is mounted on the heat conducting portion 221 under an external force, the heat conducting portion 221 moves downward under a downward force, so that the extending portion of the connecting pin 226 extends or stretches out, the fixing hole of the microfluidic chip 500 passes through the extending portion of the connecting pin 226 downward until the wall surface of the microfluidic chip 500 on the periphery of the fixing hole abuts against the step surface of the protruding buckle 226a, thereby realizing the stable mounting of the microfluidic chip 500 on the in-out bin 210, and simultaneously, the heat conducting portion 221 is sufficiently close to the first working end, the heat dissipating portion 222 is sufficiently close to the second working end, and at least the extending ring section 224b of the heat insulating ring 224 is more stably clamped and limited by the heat conducting portion 221 and the heat dissipating portion 222.

Further, according to any of the above embodiments, the heat conducting portion 221 includes a heat conducting film disposed corresponding to the first working end, and the heat conducting film is made of a material including at least one of metal, graphite, and graphene.

The thermal conductive film can reduce the thickness thereof and the surface roughness thereof, thereby improving the thermal conductive performance of the thermal conductive portion 221 to some extent. Meanwhile, the shape of the heat conducting film is adapted to the first working end or the lower end surface of the microfluidic chip 500, for example, when the refrigeration sheet 223 is formed to be concave, that is, has a bottom and a side portion bending upwards from the periphery of the bottom, heat exchange in the space of the microfluidic chip 500 in the groove can be realized. The heat-conducting film is attached to the whole inner groove wall of the groove.

The heat-conducting film made of metal, graphite or graphene has a better heat-conducting effect, the metal such as platinum is an existing material, the technology of the material serving as the heat-conducting film is mature, and the material can be selected alternatively or in a selective manner according to actual application requirements.

In addition, referring to fig. 5, fig. 6 and fig. 11, in an embodiment, the heat dissipation portion 222 is disposed in a plate shape, a plurality of heat dissipation ribs 222b are disposed at intervals on a side of the heat dissipation portion 222 opposite to the second working end, and a heat dissipation flow channel 222c is defined between every two adjacent heat dissipation ribs 222 b; the temperature control mechanism 220 further includes a heat dissipation fan 230, wherein the heat dissipation fan 230 is disposed at the heat dissipation flow channel 222c to drive the airflow to pass through the heat dissipation flow channel 222c and dissipate the heat generated at the second working end.

The heat dissipation ribs 222b can increase the heat dissipation surface area of the heat dissipation portion 222. Further, at least a portion of the surface of the heat dissipating ribs 222b may be provided with a concave-convex structure having any suitable shape to further increase the heat dissipating surface area of the heat dissipating portion 222. The size, cross-sectional shape, extension length, etc. of the heat dissipating ribs 222b are not limited.

The heat dissipation flow channel 222c defined by every two adjacent heat dissipation ribs 222b can realize circulation of heat dissipation airflow under the action of the heat dissipation fan 230, and the heat dissipation airflow in the casing 100 is timely discharged to the outside of the casing 100. The heat dissipation channel 222c may extend along a straight shape or may also extend in at least one bending manner.

The heat dissipation fan 230 may be disposed at any position of the heat dissipation flow channel 222c, that is, at any opening of the heat dissipation flow channel 222 c. When the heat dissipation flow channel 222c extends in a direction close to and away from the opening 110 of the casing 100, the heat dissipation fan 230 may be disposed at any port of the heat dissipation air duct.

Further, the casing 100 or the in-out bin 210 is provided with an air deflector at a position close to the opening 110 of the casing 100, and the air deflector is fixed or movably arranged and can guide out the heat dissipation airflow along a set direction. For example, the air guiding plate may form an air guiding surface gradually extending downward or gradually extending toward two opposite sides of the cabinet 100 in the horizontal direction. The movably arranged air deflector can realize the adjustment of the exhaust direction of the heat dissipation airflow in the moving process of the air deflector.

Further, the casing 100 or the in-out bin 210 is provided with a wind shield at a position close to the opening 110 of the casing 100, and the wind shield is fixedly or movably arranged, so that the heat dissipation airflow emitted from the inside of the casing 100 to the outside of the casing 100 can be blocked outside, and the heat dissipation airflow is prevented from flowing back into the casing 100. The movably arranged wind shield can realize the backflow prevention of the heat dissipation airflow at each position in the movable stroke of the wind shield.

Based on the above embodiment, please refer to fig. 11, since the cooling plate 223 is mainly disposed corresponding to the installation area 211. The heat dissipation flow channel 222c includes an air inlet section 222d, an air outlet section 222f, and a heat dissipation cavity 222e communicated between the air inlet section 222d and the air outlet section 222f, the heat dissipation cavity 222e is disposed corresponding to the through hole, and has a plurality of air inlets communicated with the air inlet section 222d, and the peripheral side wall of the heat dissipation cavity 222e extends in an arc shape. The heat dissipation cavity 222e is configured to accommodate a certain heat dissipation airflow blown by the heat dissipation fan 230, so that the heat dissipation airflow performs a certain circulation in the heat dissipation cavity 222e, and the heat dissipation at the through hole, that is, the mounting region 211, is enhanced.

Specifically, the plurality of air inlets are arranged at intervals along the circumferential direction of the heat dissipation chamber 222e, each air inlet supplies air in the tangential direction at the position, and the plurality of air inlets supply air in the same side in the circumferential direction of the heat dissipation chamber 222 e. In this way, the heat dissipation airflow entering the heat dissipation cavity 222e through the air inlet can circulate along the peripheral side wall of the heat dissipation cavity 222e to form a vortex airflow, and the vortex airflow is discharged to the air outlet section 222f after circulating to and fro to some extent in the heat dissipation cavity 222 e.

It should be noted that, the detailed structure of the in-and-out component 200 in the single cell library preparation system 1 provided by the present invention can refer to the above embodiment of the in-and-out component 200, and is not described herein again; because the above described warehouse entry and exit component 200 is used in the single cell library preparation system 1 of the present invention, the embodiment of the single cell library preparation system 1 of the present invention includes all technical solutions of all embodiments of the above described warehouse entry and exit component 200, and the achieved technical effects are also completely the same, and are not described herein again.

It is understood that the opening 110 may be formed at any position of the casing 100, for example, at the top or any side of the casing 100, and for the convenience of understanding, in the following embodiments, the casing 100 is defined to have a front-back direction and a left-right direction which are arranged to intersect in a horizontal direction, wherein the opening 110 is formed at the front side of the casing 100.

Further, in order to provide the smoothness and accuracy of the back-and-forth movement of the microfluidic chip 500, in an embodiment, the single-cell library preparation system 1 further comprises an access assembly 200, wherein the access assembly 200 is movably mounted on the housing 100 along the back-and-forth direction, so as to be accommodated in the mounting cavity and be capable of being horizontally moved from the opening 110 to the outside of the housing 100 along the back-and-forth direction. The microfluidic chip 500 is mounted on the in-out assembly 200 so as to be driven by the in-out assembly 200 to enter the mounting cavity or move out of the casing 100.

The inlet and outlet assembly 200 is formed with an installation region 211 for positioning and installing the microfluidic chip 500, the specific expression form of the installation region 211 is not limited, and the installation region may be an installation groove formed in the upper end surface of the inlet and outlet assembly 200 or a positioning structure arranged on the upper end surface of the inlet and outlet assembly 200, the positioning structure includes a positioning convex portion and a positioning concave portion, one of the positioning convex portion and the positioning concave portion is arranged in the inlet and outlet assembly 200, and the other is arranged in the microfluidic chip 500, so that when the positioning convex portion is in concave-convex fit with the positioning concave portion, the microfluidic chip 500 is accurately positioned on the installation region 211 of the inlet and outlet assembly 200.

The forward and backward movement of the in-out bin assembly 200 can be directly realized through manual operation of a user, on the basis, a sliding rail mechanism can be arranged between the in-out bin assembly 200 and the inner cavity wall of the mounting cavity at the position, and the in-out bin assembly 200 can be slidably mounted on the machine shell 100 along a set path through sliding matching of a sliding groove in the sliding rail mechanism and a sliding protrusion.

Of course, the back and forth movement of the in-out warehouse assembly 200 can also be realized by automatic control of a driving device, and there are various specific schemes of the driving device, such as a screw-nut mechanism, a directional rocker mechanism, etc. in an embodiment, the driving device includes a driver 241 and a transmission assembly 243, the driver 241 may be a motor, and the transmission assembly 243 includes a rack and a gear. The moving direction of the warehouse inlet and outlet assembly 200 is defined as forward and backward, the rack extends forward and backward and is fixedly installed on the inner cavity wall of the installation cavity, the gear is installed on the warehouse inlet and outlet assembly 200 in a manner of rotating forward and backward along the left-right axis and is meshed with the rack, and the driver 241 is in driving connection with the gear.

In addition, the specific representation form of the microfluidic chip 500 is not limited, and in an embodiment, each of the microfluidic chips 500 has a first side and a second side that are oppositely disposed along the thickness direction thereof, and in general, the thickness direction of the microfluidic chip 500 is generally upward and downward for better performing single cell preparation operation and for better facilitating the compact structure layout of the single cell library preparation system 1, wherein the first side may be, but is not limited to, the upper side of the microfluidic chip 500, and the second side corresponds to the lower side of the microfluidic chip 500.

It is understood that a plurality of flow channels are formed in each microfluidic chip 500, and the plurality of flow channels include a main flow channel and a plurality of branch flow channels, wherein the main flow channel may be one or more.

The flow channels are provided with inlet ends and outlet ends which are arranged oppositely, the inlet ends of the flow channels can be formed on a first side, the inlet ends of the branch flow channels are used for storing various raw materials, specifically, a plurality of groove bodies can be arranged on the first side, and the groove bodies are communicated with the inlet ends of the flow channels in a one-to-one correspondence manner; the forming mode of the groove body is not limited, and when the thickness of the microfluidic chip 500 is enough, the groove body can be directly formed on the first side; when the plate thickness of the microfluidic chip 500 is thin, a plurality of cylinders may be protruded on the first side of the microfluidic chip 500, and the plurality of cylinders and the microfluidic chip 500 may be integrally disposed or detachably disposed in a separated manner. The plurality of cylinders are in one-to-one correspondence to form a plurality of grooves. For the convenience of distinguishing, the plurality of tank bodies are provided with a material storage tank corresponding to the branch flow channel and a finished product tank corresponding to the main flow channel.

The flow channel may be formed inside the microfluidic chip 500, or may be formed on the second side of the microfluidic chip 500; when the flow channel is formed on the second side of the microfluidic chip 500, the microfluidic chip 500 further includes a cover film covering the second side of the microfluidic chip 500; the cover film may be made of a Cyclic Olefin Copolymer (COC) material or the like.

In the plurality of branch flow channels, the outlet ends of all the branch flow channels can be directly intersected, or at least two branch flow channels are arranged to be intersected firstly and then are intersected with the rest branch flow channels according to the single cell preparation requirement; or at least two branch runners are arranged to be intersected to form a group, and a plurality of groups are integrally intersected to one position after being sequentially intersected.

In the plurality of branch flow channels, an adjusting structure may be disposed at least one branch flow channel according to an actual preparation requirement, and the adjusting structure may be disposed at an outlet end of the branch flow channel to control a flow rate and a flow velocity of the branch flow channel, for example, when the branch flow channel circulates a particulate material, such as nuclei or magnetic beads, the adjusting structure may adjust the nuclei or the magnetic beads to be sequentially and sequentially discharged according to a set number.

The single cell library preparation system 1 further comprises a manifold plate 300. The manifold plate 300 is accommodated in the mounting cavity and positioned above the mounting region 211, and the manifold plate 300 is movably arranged in the up-and-down direction so as to be capable of moving down to the mounting region 211 and stacking with the microfluidic chip 500; the manifold plate 300 is provided with a plurality of air passages, which are disposed corresponding to the plurality of flow passages, so that when the manifold plate 300 moves downward to be close to the microfluidic chip 500, the plurality of air passages communicate with the plurality of flow passages in a one-to-one correspondence.

Like the microfluidic chip 500, the up-and-down movement of the manifold 300 can be directly realized by manual operation of a user, and based on this, a slide rail mechanism can also be arranged between the manifold 300 and the inner cavity wall of the mounting cavity at the position of the manifold 300, and through the sliding fit between the slide groove and the slide protrusion in the slide rail mechanism, the manifold 300 can be slidably mounted on the housing case 100 along a set path.

Of course, the up and down movement of the manifold board 300 can also be automatically controlled by a driving device, and there are various specific schemes of the driving device based on this, such as a screw nut mechanism, a directional rocker mechanism, etc.

The single cell library preparation system 1 further comprises an air purging device, wherein the air purging device supplies air to the manifold plate 300, for example, the air purging device comprises a pump body, and the pump body is used for acting on a plurality of air passages, so that air flow can flow in the air passages and corresponding flow passages according to a set direction; the pump bodies can be arranged in one or more than one; the pump body may be mounted to the housing by, for example, a mounting bracket.

In addition, the purging device further comprises a valve body assembly corresponding to each air passage, wherein the valve body assembly can be one or more of a switch valve, a flow valve and a pressure valve, so that the flow and the flow rate of the airflow flowing through the air passages and the corresponding flow passages can be adjusted.

For the convenience of understanding, the purging device can comprise a first purging component and a second purging component, wherein the first purging component correspondingly adjusts and drives the fluid activity of the branch flow channel; the second purging component correspondingly drives the fluid of the main runner to move.

It is understood that, in the above-described embodiment, the single-cell library preparation system 1 can be applied to the preparation of a variety of single cells. In one embodiment, the microfluidic chip 500 includes three reservoirs and a product tank, and the three reservoirs and the product tank are sequentially arranged at intervals along the length direction of the microfluidic chip 500; the three storage tanks are used for storing oil phase, cell nuclei and magnetic beads respectively in the direction close to the finished product tank, wherein the branch flow channels corresponding to the cell nuclei and the magnetic beads can be firstly intersected, so that after the cell nuclei are combined with the magnetic beads, the branch flow channels corresponding to the oil phase are intersected with the flow channels of the combined cell nuclei and the magnetic beads, the oil phase wraps the combination body of the cell nuclei and the magnetic beads, single cells or microfluid is finally formed, the single cells enter the finished product tank and are collected, the bar codes are added, the oil phase is removed, and a library for sequencing is obtained.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. An access assembly for removable mounting to a housing of a single cell library preparation system, the access assembly comprising:

2. The access assembly of claim 1, wherein said access includes a carrier plate having a through hole extending vertically therethrough, said through hole defining said mounting area; the temperature control mechanism comprises:

3. The access assembly of claim 2, wherein the carrier plate is made of a thermally conductive material, and the heat dissipating portion is plate-shaped and extends along a peripheral wall surface of the through hole to be in heat exchange connection with the carrier plate.

4. The access assembly of claim 3, wherein the thermal shield ring comprises a main ring section and an extension ring section protruding inward from a lower portion of the main ring section, the main ring section is disposed in the through hole to separate the carrier plate from the heat conducting portion, and the extension ring section is retained between the heat conducting portion and the heat dissipating portion.

5. The warehouse entry and exit assembly of claim 4, wherein the heat dissipating part is provided with a fastening hole extending vertically, the extending ring section is provided with a buckle protruding downwards, and the buckle passes through the fastening hole and is fastened and fixed with the fastening hole;

6. The warehouse entry and exit assembly of claim 2, wherein the heat conducting portion and/or the heat dissipating portion are elastically and vertically disposed with respect to the refrigeration sheet, respectively, so that when a microfluidic chip is disposed on the heat conducting portion, the elastically and movably disposed heat conducting portion and/or the heat dissipating portion are brought into contact with the refrigeration sheet;

the temperature control mechanism further comprises a connecting pin, the connecting pin sequentially penetrates through the heat dissipation portion and the heat conduction portion from bottom to top and extends upwards to form an extending section, a protruding buckle is formed by protruding the end portion of the extending section in the lateral direction, the protruding buckle is supported on the upper end face of the heat conduction portion, can upwards penetrate through a fixing hole of the microfluid chip when the microfluid chip is installed on the heat conduction portion, and is supported on the upper end face of the microfluid chip to limit the microfluid chip from coming out of the inlet and outlet bin.

7. The access assembly of claim 2, wherein the thermally conductive portion comprises a thermally conductive film disposed in correspondence with the first working end, the thermally conductive film being formed from a material comprising at least one of metal, graphite, and graphene.

8. The warehouse entry and exit assembly of claim 2, wherein the heat dissipation part is in a plate shape, a plurality of heat dissipation ribs are arranged at intervals on one side of the heat dissipation part opposite to the second working end, and a heat dissipation flow channel is defined between every two adjacent heat dissipation ribs;

9. The inlet and outlet assembly according to claim 8, wherein the heat dissipation flow channel comprises an air inlet section, an air outlet section and a heat dissipation cavity communicated between the air inlet section and the air outlet section, the heat dissipation cavity is disposed corresponding to the through hole and has a plurality of air inlets communicated with the air inlet section, and a peripheral side wall of the heat dissipation cavity extends in an arc shape;

10. A single cell library preparation system, comprising:

the access assembly of any of claims 1 to 9, wherein the access assembly is received in the interior cavity of the housing and is removably extractable from the opening.