CN114430652B - Electronic device heat abstractor based on thermal imaging technology - Google Patents
Electronic device heat abstractor based on thermal imaging technology Download PDFInfo
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- CN114430652B CN114430652B CN202210130966.1A CN202210130966A CN114430652B CN 114430652 B CN114430652 B CN 114430652B CN 202210130966 A CN202210130966 A CN 202210130966A CN 114430652 B CN114430652 B CN 114430652B
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- 238000005516 engineering process Methods 0.000 title abstract description 20
- 238000001931 thermography Methods 0.000 title abstract description 20
- 230000005540 biological transmission Effects 0.000 claims abstract description 90
- 230000017525 heat dissipation Effects 0.000 claims abstract description 72
- 230000005855 radiation Effects 0.000 claims abstract description 63
- 230000006698 induction Effects 0.000 claims abstract description 35
- 230000008859 change Effects 0.000 claims abstract description 17
- 238000009434 installation Methods 0.000 claims description 51
- 230000001681 protective effect Effects 0.000 claims description 19
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 230000009471 action Effects 0.000 claims description 4
- 230000005389 magnetism Effects 0.000 abstract description 10
- 230000020169 heat generation Effects 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20181—Filters; Louvers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Studio Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an electronic device heat dissipation device based on a thermal imaging technology, which comprises a mounting cabinet body and a heat dissipation base, wherein the heat dissipation base is fixedly arranged at the bottom of the mounting cabinet body, the inner edge of a lower air flow transmission port is fixedly provided with a connecting side plate, one side of each of the two connecting side plates, which is opposite to the other side, is fixedly provided with a magnetic guide rail, the surface of each of the magnetic guide rails is provided with a magnetic section, the interior of each of the magnetic sections is fixedly provided with a magnetic induction coil, the surface of a heat conduction frame uniformly contacts with air flow to dissipate heat, so that the internal infrared radiation energy of a storage cavity is balanced, the change of the infrared radiation energy in the storage cavity causes the resistance change of an infrared photo resistor, the magnetism of each magnetic section on the magnetic guide rail is changed due to the connection of the infrared photo resistor with the magnetic induction coils in the magnetic section under the infrared photo resistor, and a slide plate slides on the magnetic guide rail under the driving of magnetic force so as to focus on the position with more heat generation, and the heat dissipation speed is increased.
Description
Technical Field
The invention relates to the field of electronic devices, in particular to an electronic device heat dissipation device based on a thermal imaging technology.
Background
The existing high-power electronic devices (such as a data processing terminal) can generate a large amount of heat in the working process, most of the electronic devices need to be installed in the cabinet body for working, and the cabinet body in the prior art mostly adopts a combination of a fixedly installed heat dissipation fan and a heat dissipation opening formed in the side face for heat dissipation, so that some problems exist in using the mode for heat dissipation: firstly, a data processing terminal is composed of a plurality of modules, the heat generated by the modules has larger difference, and if a combination of a fixedly installed heat radiation fan and a heat radiation opening arranged on the side face is adopted for heat radiation, the defects that important heat radiation can not be carried out on the position with high heat generation and the heat radiation effect is poor can exist; in order to solve the above problems, we have combined thermal imaging technology with heat dissipation equipment to provide an electronic device heat dissipation device based on thermal imaging technology.
Disclosure of Invention
The invention mainly aims to provide the electronic device heat dissipation device based on the thermal imaging technology, which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: the utility model provides an electron device heat abstractor based on thermal imaging technique, includes the installation cabinet body and heat dissipation base, heat dissipation base fixed mounting is in the bottom of the installation cabinet body, down the air current transmission mouth has been seted up to the side of heat dissipation base, down the interior edge fixed mounting of air current transmission mouth has the connection curb plate, two the side fixed mounting that connects the curb plate in opposite directions has the magnetic guide rail, the magnetism section has been seted up on the surface of magnetic guide rail, the inside fixed mounting of magnetism section has the magnetic induction coil, the inside fixed mounting of the installation cabinet body has coupling assembling, coupling assembling's side fixed mounting has the conducting strip, the upper end rotation of conducting strip is connected with the heat conduction frame, the position of heat conduction frame corresponds with the position of magnetism section, the circular telegram electric current of magnetic induction coil increases along with the heat conduction frame surface temperature that is located directly over it.
The invention is further improved in that an upper air flow transmission port is formed in the side face of the upper end of the installation cabinet body, a heat conducting pipe fitting is installed at one end, far away from the heat conducting fin, of the heat conducting pipe fitting, one end, far away from the heat conducting frame, of the heat conducting pipe fitting extends to the outer side of the installation cabinet body, a heat radiating fin is fixedly installed on the upper surface of the end part of the heat conducting pipe fitting, and the heat radiating fin is located right below the output end of the upper air flow transmission port.
The structure can be realized by the following steps: under the effect of the heat radiation fan, the lower airflow transmission port and the upper airflow transmission port form a heat radiation channel from bottom to top, the electronic device is arranged on the surface of the connecting component, the connecting component exchanges heat with the heat conduction frame inside the protective outer frame through the heat conduction sheet, the heat conduction frame exchanges heat with the heat radiation fins through the heat conduction pipe fitting, and the heat radiation airflow and the heat radiation fins cooperate to rapidly conduct out the heat generated by the electronic device.
The invention is further improved in that a protective outer frame is fixedly arranged on one side of the heat conducting fin, which is far away from the connecting component, the protective outer frame is sleeved on the extension of the heat conducting frame, and an airflow transmission groove is formed in the surface of the protective outer frame.
The structure can be realized by the following steps: the cross section of the airflow transmission groove is arranged to be trapezoid, and the energy of the airflow is increased to provide rotation accelerating force for the heat conduction frame.
The invention is further improved in that a connecting sleeve is fixedly arranged at the bottom of the protective outer frame, a pneumatic assembly is rotationally connected below the connecting sleeve, a first bevel gear is connected above the pneumatic assembly through a transmission shaft, a second bevel gear and a heat dissipation strip are fixedly arranged on the outer surface of the heat conducting frame, and the first bevel gear and the second bevel gear are meshed for transmission.
The structure can be realized by the following steps: the heat dissipation air current drives the pneumatic assembly to rotate in the process of internal transmission of the installation cabinet body, the pneumatic assembly is in transmission connection with the first bevel gear, the first bevel gear is in transmission engagement with the second bevel gear on the surface of the heat conduction frame, and the heat conduction frame is driven to rotate in the heat dissipation air current, so that the heat dissipation speed is increased rapidly, meanwhile, the heat dissipation fins are arranged at the output end of the upper air current transmission port, and the heat dissipation fins also rotate in the heat dissipation air current.
The invention is further improved in that a storage inner cavity is formed in the heat conducting frame, an infrared photo resistor is fixedly arranged in the storage inner cavity, and the output end of the infrared photo resistor is connected with the magnetic induction coil.
The structure can be realized by the following steps: the heat conducting frame is arranged to rotate in this way, and the surface of the heat conducting frame is uniformly contacted with the air flow to uniformly dissipate heat, so that the internal infrared radiation energy of the storage inner cavity is balanced.
The invention is further improved in that the surface of the magnetic guide rail is connected with a sliding plate in a sliding way, an iron sliding sleeve is fixedly arranged in the middle of the sliding plate, the iron sliding sleeve is magnetically connected with the electrified magnetic induction coil, and a heat radiation fan is fixedly arranged on the upper surface of the sliding plate.
The structure can be realized by the following steps: the change of the infrared radiation energy in the storage inner cavity causes the resistance change of the infrared photoresistor, and the infrared photoresistor is connected with the magnetic induction coil in the magnetic section right below the infrared photoresistor, so that the magnetism of each magnetic section on the magnetic guide rail is changed, and the sliding plate slides on the magnetic guide rail under the driving of magnetic force, so that the position with more heat is subjected to important heat dissipation.
The invention is further improved in that the side surface of the installation cabinet body is fixedly provided with a power supply module, the power supply module supplies power for the magnetic induction coil and the heat radiation fan, and the power supply module keeps stable voltage output of the magnetic induction coil.
The structure can be realized by the following steps: the power supply module is arranged to keep stable voltage output of the magnetic induction coil, so that the change of infrared radiation energy in the storage cavity can cause the current change of the magnetic induction coil after the resistance change of the infrared photoresistor, and the magnetism of each magnetic section can be changed.
The invention is further improved in that a dustproof net is fixedly arranged between the installation cabinet body and the heat dissipation base, the installation cabinet body is provided with the side with the upper air flow transmission port, and the heat dissipation base is not provided with the lower air flow transmission port.
The structure can be realized by the following steps: the dust screen is arranged to prevent the air flow from bringing external dust into the installation cabinet body, and the installation cabinet body is provided with the side of the upper air flow transmission port, and the lower air flow transmission port is not provided to prevent the heated air flow from reentering the installation cabinet body.
The invention further improves the application method of the electronic device heat dissipation device based on the thermal imaging technology, which comprises the following application steps:
a: the heat dissipation base is arranged on the ground, a cabinet door of the installation cabinet body is opened, the electronic device is integrally fixed on one side of the connecting component far away from the heat conducting fin, the power module is connected with external power supply equipment, and the operation of the magnetic induction coil and the heat dissipation fan is controlled through the power module;
B: after the step A is completed, under the action of a heat radiation fan, a lower airflow transmission port and an upper airflow transmission port form a heat radiation channel from bottom to top, an electronic device is arranged on the surface of a connecting component, the connecting component exchanges heat with a heat conduction frame in the protective outer frame through a heat conduction sheet, the heat conduction frame exchanges heat with the heat radiation fins through heat conduction pipe fittings, and the heat radiation airflow is matched with the heat radiation fins to rapidly lead out the heat generated by the electronic device;
C, after the step B is completed, the radiating airflow drives the pneumatic assembly to rotate in the process of transmission in the installation cabinet body, the pneumatic assembly is in transmission connection with a first bevel gear, the first bevel gear is in transmission engagement with a second bevel gear on the surface of the heat conducting frame, and the heat conducting frame is driven to rotate in the radiating airflow, so that the radiating speed is quickly increased, meanwhile, the radiating fins are arranged at the output end of the upper airflow transmission port and also rotate in the radiating airflow, and then the electronic device in the installation cabinet body is efficiently radiated;
D: and C, uniformly contacting the surface of the heat conducting frame with the air flow to uniformly dissipate heat, so that the internal infrared radiation energy of the storage inner cavity is balanced, and the resistance of the infrared light resistor is changed due to the change of the infrared radiation energy in the storage inner cavity.
Compared with the prior art, the invention has the following beneficial effects:
1. through the heat dissipation base and the installation cabinet body cooperation use that set up, under the effect of radiator fan, lower air current transmission mouth constitutes the heat dissipation passageway from bottom to top with last air current transmission mouth, electronic device installs on coupling assembling's surface, coupling assembling carries out heat exchange through conducting strip and the inside heat conduction frame of protection frame, and the heat conduction frame carries out heat exchange through heat conduction pipe fitting and heat radiation fin, the heat dissipation air current is with the heat radiation fin cooperation is derived fast with the heat that electronic device produced, the air current drives the pneumatic subassembly at the inside in-process of the transmission of installation cabinet body simultaneously and rotates, and pneumatic subassembly is connected with first bevel gear transmission, first bevel gear again with the transmission of the second bevel gear meshing on heat conduction frame surface, and then drive the heat conduction frame and rotate in the air current, thereby rapidly increased radiating rate, heat radiation fin sets up at last air current transmission mouth output simultaneously, heat radiation fin also rotates in the air current, and then carry out high efficiency to the electronic device of the installation cabinet body inside.
2. The radiating airflow drives the pneumatic assembly to rotate in the process of internal transmission of the installation cabinet, the pneumatic assembly is in transmission connection with a first bevel gear, the first bevel gear is in transmission engagement with a second bevel gear on the surface of the heat conducting frame, and the heat conducting frame is driven to rotate in the radiating airflow, so that the surface of the heat conducting frame is uniformly contacted with the airflow to uniformly radiate heat, the internal infrared radiation energy of the storage cavity is balanced, the change of the infrared radiation energy in the storage cavity leads to the resistance change of the infrared photoelectric resistor, and the magnetism of each magnetic section on the magnetic guide rail is changed due to the connection of the infrared photoelectric resistor with a magnetic induction coil in the magnetic section right below the infrared photoelectric resistor, and the sliding plate slides on the magnetic guide rail under the driving of magnetic force, so that the heat is radiated in a focus at a position with more generated heat, and meanwhile, the radiating speed is increased.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a heat dissipating device for an electronic device based on thermal imaging technology according to the present invention.
Fig. 2 is an internal schematic view of an installation cabinet of the electronic device heat dissipating device based on the thermal imaging technology of the present invention.
Fig. 3 is a schematic diagram of the overall structure of a connection assembly of a heat dissipating device for electronic devices based on thermal imaging technology according to the present invention.
Fig. 4 is a schematic diagram showing connection between a heat conducting fin and a heat conducting frame of a heat dissipating device for electronic devices based on thermal imaging technology according to the present invention.
Fig. 5 is an internal schematic view of a heat conducting frame of an electronic device heat dissipating device based on thermal imaging technology according to the present invention.
Fig. 6 is a schematic cross-sectional view of a heat dissipation base of an electronic device heat dissipation device based on thermal imaging technology according to the present invention.
Fig. 7 is a schematic diagram showing connection between a slide plate and a heat dissipation fan of the heat dissipation device of an electronic device based on thermal imaging technology.
Fig. 8 is a schematic cross-sectional view of a magnetic rail of an electronic device heat sink based on thermal imaging technology according to the present invention.
In the figure: 1. installing a cabinet body; 2. a heat dissipation base; 3. a power module; 4. an upper airflow transmission port; 5. a heat conducting pipe fitting; 6. a heat radiation fin; 7. a dust screen; 8. a connection assembly; 9. a heat conductive sheet; 10. a protective outer frame; 11. a pneumatic assembly; 12. an air flow transmission groove; 13. a heat conduction frame; 14. a first bevel gear; 15. a two-size bevel gear; 16. a heat dissipation strip; 17. a storage lumen; 18. an infrared photoresistor; 19. connecting sleeves; 201. a lower airflow transmission port; 202. connecting side plates; 203. a magnetic guide rail; 204. a slide plate; 205. a magnetic section; 206. a heat radiation fan; 207. an iron sliding sleeve; 208. a magnetic induction coil.
Detailed Description
In order that the technical means, the creation characteristics, the achievement of the objects and the effects of the present invention may be easily understood, it should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Example 1
As shown in fig. 1-8, an electronic device heat dissipation device based on thermal imaging technology comprises a mounting cabinet body (1) and a heat dissipation base (2), wherein the heat dissipation base (2) is fixedly arranged at the bottom of the mounting cabinet body (1), a lower airflow transmission port (201) is formed in the side surface of the heat dissipation base (2), a connecting side plate (202) is fixedly arranged at the inner edge of the lower airflow transmission port (201), a magnetic guide rail (203) is fixedly arranged at one side of the two connecting side plates (202) which are opposite, a magnetic section (205) is formed on the surface of the magnetic guide rail (203), a magnetic induction coil (208) is fixedly arranged in the magnetic section (205), A connecting component (8) is fixedly arranged in the installation cabinet body (1), a heat conducting fin (9) is fixedly arranged on the side surface of the connecting component (8), a heat conducting frame (13) is rotationally connected to the upper end of the heat conducting fin (9), the position of the heat conducting frame (13) corresponds to the position of the magnetic section (205), and the electrifying current of the magnetic induction coil (208) increases along with the surface temperature rise of the heat conducting frame (13) right above the magnetic induction coil; An upper airflow transmission port (4) is formed in the side face of the upper end of the installation cabinet body (1), a heat conduction pipe fitting (5) is installed at one end, far away from the heat conduction sheet (9), of the heat conduction frame (13), one end, far away from the heat conduction frame (13), of the heat conduction pipe fitting (5) extends to the outer side of the installation cabinet body (1), a heat radiation fin (6) is fixedly installed on the upper surface of the end part of the heat conduction pipe fitting (5), the heat radiation fin (6) is located under the output end of the upper airflow transmission port (4), a lower airflow transmission port (201) and the upper airflow transmission port (4) form a heat radiation channel from bottom to top under the action of a heat radiation fan (206), and an electronic device is installed on the surface of the connecting component (8), The connecting component (8) exchanges heat with the heat conducting frame (13) inside the protective outer frame (10) through the heat conducting fin (9), the heat conducting frame (13) exchanges heat with the heat radiating fins (6) through the heat conducting pipe fitting (5), and the heat generated by the electronic device is rapidly conducted out through the heat radiating airflow and the heat radiating fins (6) in a matching way; One side of the heat conducting fin (9) far away from the connecting component (8) is fixedly provided with a protective outer frame (10), the protective outer frame (10) is sleeved on the extension of the heat conducting frame (13), the surface of the protective outer frame (10) is provided with an air flow transmission groove (12), the cross section of the air flow transmission groove (12) is arranged into a trapezoid, and the energy of air flow is increased to provide rotation accelerating force for the heat conducting frame (13); The bottom of the protective outer frame (10) is fixedly provided with a connecting sleeve (19), the lower part of the connecting sleeve (19) is rotationally connected with a pneumatic component (11), the upper part of the pneumatic component (11) is connected with a first bevel gear (14) through a transmission shaft, the outer surface of the heat conducting frame (13) is fixedly provided with a second bevel gear (15) and a heat radiating strip (16), the first bevel gear (14) is meshed with the second bevel gear (15) for transmission, the heat radiating airflow drives the pneumatic component (11) to rotate in the process of internal transmission of the installation cabinet body (1), the pneumatic component (11) is in transmission connection with the first bevel gear (14), the first bevel gear (14) is meshed with the second bevel gear (15) on the surface of the heat conducting frame (13), The heat conducting frame (13) is driven to rotate in the heat radiation air flow, so that the heat radiation speed is increased rapidly, meanwhile, the heat radiation fins (6) are arranged at the output end of the upper air flow transmission port (4), and the heat radiation fins (6) also rotate in the heat radiation air flow; A dust screen (7) is fixedly installed between the installation cabinet body (1) and the heat dissipation base (2), the installation cabinet body (1) is provided with the side of the upper air flow transmission port (4), the heat dissipation base (2) is not provided with the lower air flow transmission port (201), the dust screen (7) is used for preventing air flow from bringing external dust into the installation cabinet body (1), the installation cabinet body (1) is provided with the side of the upper air flow transmission port (4), and the lower air flow transmission port (201) is not provided with the side of the lower air flow transmission port (201) so as to prevent heated air flow from entering the installation cabinet body (1) again.
The implementation of the embodiment can be realized: through the cooperation of the heat dissipation base (2) that sets up and the installation cabinet body (1) use, under the effect of cooling fan (206), down air current transmission mouth (201) constitutes the heat dissipation passageway from bottom to top with last air current transmission mouth (4), the surface at coupling assembling (8) is installed to electronic component, coupling assembling (8) carry out heat exchange through conducting strip (9) and the inside heat conduction frame (13) of protection frame (10), and heat conduction frame (13) carry out heat exchange through heat conduction pipe fitting (5) and heat dissipation fin (6), the heat dissipation air current is exported fast with the heat dissipation fin (6) that electronic component produced, simultaneously the heat dissipation air current drives pneumatic component (11) rotation at the in-process of the inside transmission of installation cabinet body (1), and pneumatic component (11) are connected with a number bevel gear (14) transmission, a bevel gear (14) meshes the transmission with the second bevel gear (15) on heat conduction frame (13) surface again, and then drive heat conduction frame (13) and rotate in the heat dissipation air current, thereby rapid increase speed, simultaneously fin (6) set up at last air current transmission mouth (4) and heat dissipation fin (6) carry out heat dissipation device high-efficient rotation in the inside the heat dissipation cabinet (1).
Example 2
As shown in fig. 1-8, an electronic device heat dissipation device based on thermal imaging technology comprises a mounting cabinet body (1) and a heat dissipation base (2), wherein the heat dissipation base (2) is fixedly arranged at the bottom of the mounting cabinet body (1), a lower airflow transmission port (201) is formed in the side surface of the heat dissipation base (2), a connecting side plate (202) is fixedly arranged at the inner edge of the lower airflow transmission port (201), a magnetic guide rail (203) is fixedly arranged at one side of the two connecting side plates (202) which are opposite, a magnetic section (205) is formed on the surface of the magnetic guide rail (203), a magnetic induction coil (208) is fixedly arranged in the magnetic section (205), A connecting component (8) is fixedly arranged in the installation cabinet body (1), a heat conducting fin (9) is fixedly arranged on the side surface of the connecting component (8), a heat conducting frame (13) is rotationally connected to the upper end of the heat conducting fin (9), the position of the heat conducting frame (13) corresponds to the position of the magnetic section (205), and the electrifying current of the magnetic induction coil (208) increases along with the surface temperature rise of the heat conducting frame (13) right above the magnetic induction coil; An upper airflow transmission port (4) is formed in the side surface of the upper end of the installation cabinet body (1), a heat conduction pipe fitting (5) is installed at one end, far away from the heat conduction sheet (9), of the heat conduction frame (13), one end, far away from the heat conduction frame (13), of the heat conduction pipe fitting (5) extends to the outer side of the installation cabinet body (1), a heat radiation fin (6) is fixedly installed on the upper surface of the end part of the heat conduction pipe fitting (5), and the heat radiation fin (6) is located under the output end of the upper airflow transmission port (4); a protective outer frame (10) is fixedly arranged on one side of the heat conducting fin (9) far away from the connecting component (8), the protective outer frame (10) is sleeved on the extension of the heat conducting frame (13), and an airflow transmission groove (12) is formed in the surface of the protective outer frame (10); The bottom of the protection outer frame (10) is fixedly provided with a connecting sleeve (19), the lower part of the connecting sleeve (19) is rotationally connected with a pneumatic assembly (11), the upper part of the pneumatic assembly (11) is connected with a first bevel gear (14) through a transmission shaft, the outer surface of the heat conducting frame (13) is fixedly provided with a second bevel gear (15) and a heat radiating strip (16), and the first bevel gear (14) is meshed with the second bevel gear (15); a storage inner cavity (17) is formed in the heat conducting frame (13), an infrared photo resistor (18) is fixedly arranged in the storage inner cavity (17), the output end of the infrared photo resistor (18) is connected with the magnetic induction coil (208), the heat conducting frame (13) rotates, the surface of the heat conducting frame (13) is uniformly contacted with air flow to uniformly dissipate heat, and the internal infrared radiation energy of the storage inner cavity (17) is balanced; The surface of the magnetic guide rail (203) is connected with a sliding plate (204) in a sliding way, the middle part of the sliding plate (204) is fixedly provided with an iron sliding sleeve (207), the iron sliding sleeve (207) is magnetically connected with a magnetic induction coil (208) after being electrified, the upper surface of the sliding plate (204) is fixedly provided with a heat radiation fan (206), the change of infrared radiation energy in the storage cavity (17) causes the resistance change of the infrared light thermistor (18), as the infrared light thermistor (18) is connected with the magnetic induction coil (208) in the magnetic section (205) right below the infrared light thermistor, the magnetism of each magnetic section (205) on the magnetic guide rail (203) is changed, the sliding plate (204) slides on the magnetic guide rail (203) under the drive of magnetic force, so that the heat is mainly dissipated at the position where the heat is generated; The side surface of the installation cabinet body (1) is fixedly provided with a power supply module (3), the power supply module (3) supplies power for the magnetic induction coil (208) and the heat radiation fan (206), and the power supply module (3) keeps stable voltage output of the magnetic induction coil (208); a dustproof net (7) is fixedly installed between the installation cabinet body (1) and the heat dissipation base (2), the installation cabinet body (1) is provided with the side of the upper air flow transmission port (4), and the heat dissipation base (2) is not provided with the lower air flow transmission port (201).
The implementation of the embodiment can be realized: the radiating airflow drives the pneumatic assembly (11) to rotate in the process of internal transmission of the installation cabinet body (1), the pneumatic assembly (11) is connected with the first bevel gear (14) in a transmission manner, the first bevel gear (14) is in meshed transmission with the second bevel gear (15) on the surface of the heat conducting frame (13), and the heat conducting frame (13) is driven to rotate in the radiating airflow, so that the surface of the heat conducting frame (13) uniformly contacts with the airflow to uniformly radiate heat, the internal infrared radiation energy of the storage cavity (17) is balanced, the resistance of the infrared radiation resistor (18) is changed due to the change of the infrared radiation energy in the storage cavity (17), and the magnetic induction coils (208) in the magnetic sections (205) right below the infrared radiation resistor (18) are connected, so that the magnetism of each magnetic section (205) on the magnetic guide rail (203) is changed, and the sliding plate (204) slides on the magnetic guide rail (203) under the driving of magnetic force, so that the positions with more generated heat are emphasized, and the radiating speed is increased.
It should be noted that, when the electronic device heat dissipation device based on the thermal imaging technology is used, firstly, the heat dissipation base (2) is installed on the ground, the cabinet door of the installation cabinet body (1) is opened, the electronic device is integrally fixed on one side of the connection assembly (8) far away from the heat conducting fin (9), the power module (3) is connected with external power supply equipment, the magnetic induction coil (208) and the heat dissipation fan (206) are controlled to operate through the power module (3), secondly, under the action of the heat dissipation fan (206), the lower airflow transmission port (201) and the upper airflow transmission port (4) form a heat dissipation channel from bottom to top, the electronic device is installed on the surface of the connection assembly (8), the connection assembly (8) exchanges heat with the heat conducting frame (13) inside the protection outer frame (10) through the heat conducting fin (9), the heat conducting frame (13) exchanges heat through the heat conducting pipe fitting (5) and the heat radiating fin (6), the heat generated by the electronic device is rapidly conducted through the heat conducting airflow and the air-driven fin (6), then, the airflow drives the air-driven bevel gear (14) to rotate in the installation cabinet body (1) to drive the bevel gear (14) to rotate, and the bevel gear (14) is meshed with the bevel gear (14), and then drive heat conduction frame (13) and rotate in the radiating air current to increase the radiating rate fast, radiating fin (6) set up at the output of last air current transmission mouth (4) simultaneously, radiating fin (6) also rotate in the radiating air current, and then carry out high-efficient heat dissipation to the inside electronic device of installation cabinet body (1), finally, the surface and the even heat dissipation of air current uniform contact of heat conduction frame (13), make the inside infrared radiation energy of storage inner chamber (17) balanced, the change of the inside infrared radiation energy of storage inner chamber (17) leads to the resistance change of infrared photo resistor (18) like this, owing to infrared photo resistor (18) is connected with magnetic induction coil (208) in magnetic section (205) under with, thereby make the magnetism of each magnetic section (205) on magnetic guide rail (203) change, and slide board (204) slide on magnetic guide rail (203) under the drive of magnetic force, so carry out the focus to the position that produces the heat more, the radiating rate has been increased simultaneously.
The foregoing has shown and described the basic principles and main features of the present invention and the advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (2)
1. An electronic device heat dissipation device, characterized in that: the heat radiation base is fixedly arranged at the bottom of the installation cabinet body, a lower airflow transmission port is formed in the side face of the heat radiation base, a connecting side plate is fixedly arranged at the inner edge of the lower airflow transmission port, a magnetic guide rail is fixedly arranged on one side of each of the two connecting side plates, a magnetic section is arranged on the surface of each magnetic guide rail, a magnetic induction coil is fixedly arranged in each magnetic section, a connecting assembly is fixedly arranged in the installation cabinet body, a heat conducting fin is fixedly arranged on the side face of each connecting assembly, a heat conducting frame is rotatably connected to the upper end of each heat conducting fin, the positions of the heat conducting frames correspond to the positions of the magnetic sections, and the electrifying current of each magnetic induction coil increases along with the rise of the surface temperature of the heat conducting frame right above the heat conducting frame; an upper airflow transmission port is formed in the side face of the upper end of the installation cabinet body, a heat conducting pipe fitting is installed at one end, far away from the heat conducting fin, of the heat conducting pipe fitting, one end, far away from the heat conducting rack, of the heat conducting pipe fitting extends to the outer side of the installation cabinet body, a heat radiating fin is fixedly installed on the upper surface of the end part of the end of the heat conducting pipe fitting, and the heat radiating fin is located right below the output end of the upper airflow transmission port;
A protective outer frame is fixedly arranged on one side of the heat conducting fin, which is far away from the connecting component, the protective outer frame is sleeved on the extension of the heat conducting frame, and an airflow transmission groove is formed in the surface of the protective outer frame; the bottom of the protection outer frame is fixedly provided with a connecting sleeve, the lower part of the connecting sleeve is rotationally connected with a pneumatic assembly, the upper part of the pneumatic assembly is connected with a first bevel gear through a transmission shaft, the outer surface of the heat conduction frame is fixedly provided with a second bevel gear and a heat dissipation strip, and the first bevel gear is meshed with the second bevel gear for transmission; a storage inner cavity is formed in the heat conducting frame, an infrared photo resistor is fixedly arranged in the storage inner cavity, and the output end of the infrared photo resistor is connected with the magnetic induction coil; the surface of the magnetic guide rail is connected with a sliding plate in a sliding way, an iron sliding sleeve is fixedly arranged in the middle of the sliding plate and is magnetically connected with the electrified magnetic induction coil, and a heat radiation fan is fixedly arranged on the upper surface of the sliding plate; the side surface of the installation cabinet body is fixedly provided with a power supply module, the power supply module supplies power to the magnetic induction coil and the heat radiation fan, and the power supply module keeps stable voltage output of the magnetic induction coil; a dustproof net is fixedly installed between the installation cabinet body and the heat dissipation base, the installation cabinet body is provided with the side of the upper air flow transmission port, and the heat dissipation base is not provided with the lower air flow transmission port.
2. The electronic device heat sink as claimed in claim 1, wherein: the using steps are as follows:
a: the heat dissipation base is arranged on the ground, a cabinet door of the installation cabinet body is opened, the electronic device is integrally fixed on one side of the connecting component far away from the heat conducting fin, the power module is connected with external power supply equipment, and the operation of the magnetic induction coil and the heat dissipation fan is controlled through the power module;
B: after the step A is completed, under the action of a heat radiation fan, a lower airflow transmission port and an upper airflow transmission port form a heat radiation channel from bottom to top, an electronic device is arranged on the surface of a connecting component, the connecting component exchanges heat with a heat conduction frame in the protective outer frame through a heat conduction sheet, the heat conduction frame exchanges heat with the heat radiation fins through heat conduction pipe fittings, and the heat radiation airflow is matched with the heat radiation fins to rapidly lead out the heat generated by the electronic device;
C, after the step B is completed, the radiating airflow drives the pneumatic assembly to rotate in the process of transmission in the installation cabinet body, the pneumatic assembly is in transmission connection with a first bevel gear, the first bevel gear is in transmission engagement with a second bevel gear on the surface of the heat conducting frame, and the heat conducting frame is driven to rotate in the radiating airflow, so that the radiating speed is quickly increased, meanwhile, the radiating fins are arranged at the output end of the upper airflow transmission port and also rotate in the radiating airflow, and then the electronic device in the installation cabinet body is efficiently radiated;
D: and C, uniformly contacting the surface of the heat conducting frame with the air flow to uniformly dissipate heat, so that the internal infrared radiation energy of the storage inner cavity is balanced, and the resistance of the infrared light resistor is changed due to the change of the infrared radiation energy in the storage inner cavity.
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| CN111816630B (en) * | 2020-06-30 | 2022-07-05 | 科华恒盛股份有限公司 | Heat radiation structure and power module |
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| CN113359960B (en) * | 2021-08-02 | 2022-07-29 | 广东培正学院 | Computer for electronic information |
| CN215500238U (en) * | 2021-08-02 | 2022-01-11 | 柳州城市职业学院 | Energy-saving refrigeration air conditioner device |
| CN113949171B (en) * | 2021-11-17 | 2023-06-30 | 重庆前卫无线电能传输研究院有限公司 | Rail type wireless charging pickup and forming method thereof |
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| CN111587050A (en) * | 2020-06-05 | 2020-08-25 | 杭州成昌网络科技有限公司 | Memory installation cabinet heat abstractor based on bimetallic strip principle |
| CN112600110A (en) * | 2020-12-30 | 2021-04-02 | 记忆(广州)数码科技有限公司 | High-low pressure sealing power distribution cabinet |
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