CN114426433A - Electroplated diamond wire saw, diamond wire abrasive particles and preparation method of diamond wire abrasive particles - Google Patents
Electroplated diamond wire saw, diamond wire abrasive particles and preparation method of diamond wire abrasive particles Download PDFInfo
- Publication number
- CN114426433A CN114426433A CN202210225209.2A CN202210225209A CN114426433A CN 114426433 A CN114426433 A CN 114426433A CN 202210225209 A CN202210225209 A CN 202210225209A CN 114426433 A CN114426433 A CN 114426433A
- Authority
- CN
- China
- Prior art keywords
- powder
- diamond
- diamond wire
- abrasive particles
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 191
- 239000010432 diamond Substances 0.000 title claims abstract description 191
- 239000002245 particle Substances 0.000 title claims abstract description 78
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000000843 powder Substances 0.000 claims abstract description 204
- 229910052574 oxide ceramic Inorganic materials 0.000 claims abstract description 61
- 239000011224 oxide ceramic Substances 0.000 claims abstract description 61
- 238000006243 chemical reaction Methods 0.000 claims abstract description 36
- 239000006061 abrasive grain Substances 0.000 claims abstract description 24
- 238000005245 sintering Methods 0.000 claims abstract description 21
- 230000007847 structural defect Effects 0.000 claims abstract description 21
- 239000011812 mixed powder Substances 0.000 claims abstract description 16
- 238000002156 mixing Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 18
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 18
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 16
- 238000004321 preservation Methods 0.000 claims description 14
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052810 boron oxide Inorganic materials 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 10
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 238000005406 washing Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 238000007873 sieving Methods 0.000 claims description 4
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 3
- 229910001948 sodium oxide Inorganic materials 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 13
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 9
- 239000012535 impurity Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000007596 consolidation process Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000036314 physical performance Effects 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- MOWNZPNSYMGTMD-UHFFFAOYSA-N oxidoboron Chemical compound O=[B] MOWNZPNSYMGTMD-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3244—Zirconium oxides, zirconates, hafnium oxides, hafnates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3409—Boron oxide, borates, boric acids, or oxide forming salts thereof, e.g. borax
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses an electroplated diamond wire saw, diamond wire abrasive particles and a preparation method of the diamond wire abrasive particles, wherein the preparation method of the diamond wire abrasive particles comprises the following steps: carrying out thermal reaction treatment on the diamond micro powder to obtain the diamond micro powder with roughened surface and formed structural defects; uniformly mixing the diamond micro powder with the roughened surface and formed with the structural defects with oxide ceramic powder to obtain mixed powder; and sintering the mixed powder in a vacuum environment to obtain the diamond wire abrasive particles. According to the method, the diamond micro powder is subjected to thermal reaction treatment, physical mixing treatment with oxide ceramic powder and sintering treatment in sequence to obtain diamond wire abrasive particles, so that the self-sharpening property of the diamond abrasive particles is improved, the holding strength of a coating on the diamond abrasive particles is increased, the cutting efficiency and the processing effect of the electroplated diamond wire saw are further improved, and the service life of the electroplated diamond wire saw is further prolonged. The invention also provides an electroplated diamond wire saw comprising a base wire, an electroplated layer and diamond wire abrasive grains embedded in the electroplated layer.
Description
Technical Field
The invention relates to the technical field of abrasive tools, in particular to an electroplated diamond wire saw, diamond wire abrasive particles and a preparation method of the diamond wire abrasive particles.
Background
An electroplated diamond wire saw is a cutting tool for consolidating diamond micro powder on a metal wire by utilizing an electroplating process, and has the advantages of high cutting efficiency and more environment-friendly cutting process, so that the electroplated diamond wire saw is widely applied to the field of processing hard and brittle materials such as ceramics, stones, magnetic materials, semiconductor materials and the like. The electroplated diamond wire saw consists of diamond wire abrasive grains, a coating and a base line. Among them, the strength and self-sharpening of diamond wire abrasive grains and the holding strength of diamond wire abrasive grains by a plating layer affect the service life, cutting efficiency and machining effect of the electroplated diamond wire saw.
In the prior art, the holding strength of the diamond wire abrasive particles is increased by increasing the thickness of a coating, but the excessive coating can reduce the cutting height of the diamond wire abrasive particles, so that a series of problems of difficult chip removal, poor processing quality and the like are easily caused; in addition, poor self-sharpening of diamond abrasive particles can result in blunting of the cutting surface and reduced cutting efficiency.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides an electroplated diamond wire saw, diamond wire abrasive particles and a preparation method of the diamond wire abrasive particles.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a method for preparing diamond wire abrasive grains, comprising the steps of:
carrying out thermal reaction treatment on the diamond micro powder to obtain the diamond micro powder with roughened surface and formed structural defects; uniformly mixing the diamond micro powder with the roughened surface and the formed structural defects with oxide ceramic powder to obtain mixed powder; and sintering the mixed powder in a vacuum environment to obtain the diamond wire abrasive particles.
Further, the oxide ceramic powder includes a mixed powder of two or more of a silicon oxide powder, an aluminum oxide powder, a sodium oxide powder, a zirconium oxide powder, and a boron oxide powder.
Further, the mass ratio of the diamond micro powder with the roughened surface and the formed structural defects to the oxide ceramic powder is 100:1-100: 10.
Further, the sintering process includes: the sintering temperature is 750-810 ℃, and the heat preservation time is 30-60 min.
Further, the particle size of the oxide ceramic powder is 5-10 microns.
Further, the thermal reaction process comprises: and placing the diamond micro powder in a muffle furnace, wherein the thermal reaction treatment temperature is 680-800 ℃, and the heat preservation time is 60-300 seconds.
Further, the granularity of the diamond micro powder is 5-10 microns; the thermal reaction treatment temperature is 780 ℃, and the heat preservation time is 300 seconds; the mass ratio of the diamond micro powder with the roughened surface and the formed structural defects to the oxide ceramic powder is 100: 8; the oxide ceramic powder comprises the silicon oxide powder, the aluminum oxide powder and the zirconium oxide powder, and the mass ratio of the silicon oxide powder to the aluminum oxide powder to the zirconium oxide powder is 23:5: 1; the sintering temperature is 780 ℃, and the heat preservation time is 60 min; the particle size D50 of the oxide ceramic powder was 7.5 microns.
Further, the granularity of the diamond micro powder is 6.5-10 microns; the thermal reaction treatment temperature is 800 ℃, and the heat preservation time is 300 seconds; the preset mass ratio of the diamond micro powder with the roughened surface and the formed structural defects to the oxide ceramic powder is 100: 1; the oxide ceramic powder includes the silicon oxide powder, the boron oxide powder, the aluminum oxide powder, and the zirconium oxide powder; the mass ratio of the silicon oxide powder to the boron oxide powder to the aluminum oxide powder to the zirconium oxide powder is 23:12:5: 1; the sintering temperature is 800 ℃, and the heat preservation time is 60 minutes; the particle size D50 of the oxide ceramic powder was 7.5 microns.
Further, the preparation method further comprises the following steps:
the diamond micro powder with the roughened surface and the structural defects formed is elutriated at least once by ultrasonic water washing; and drying and sieving the washed diamond micro powder.
In a second aspect, the present invention provides diamond wire abrasive grains produced by any one of the above methods for producing diamond wire abrasive grains.
In a third aspect, the present invention provides an electroplated diamond wire saw comprising a base wire, an electroplated layer and diamond wire abrasive grains of any one of the above, wherein the diamond wire abrasive grains are embedded in the electroplated layer.
According to the preparation method of the diamond wire abrasive particles, provided by the invention, the diamond micro powder is subjected to thermal reaction treatment, physical mixing treatment with oxide ceramic powder and sintering treatment in sequence, so that the diamond wire abrasive particles are obtained; the diamond wire abrasive particles provided by the invention are prepared by the preparation method; the electroplated diamond wire saw provided by the invention comprises diamond wire abrasive particles embedded in an electroplating layer.
Firstly, the diamond wire abrasive particles are subjected to thermal reaction treatment, so that the surface of diamond micro powder is roughened, structural defects are formed, the surface strength of the diamond micro powder is reduced, and the self-sharpening performance of the diamond wire abrasive particles is improved; meanwhile, the diamond micro powder and the oxide ceramic powder are purely physically mixed, no chemical reaction occurs, the physical properties of the diamond micro powder and the oxide ceramic powder are similar, and the roughening of the surface of the diamond micro powder is beneficial to uniform and firm consolidation of the diamond micro powder and the oxide ceramic powder.
On the other hand, after the diamond micro powder and the oxide ceramic powder are mixed and sintered to form the diamond wire abrasive particles, the surface area of the diamond wire abrasive particles is increased, the physical performance of the oxide ceramic powder is between the diamond micro powder and the electroplated layer, and the holding strength of the electroplated layer on the diamond wire abrasive particles is improved under the condition that the thickness of the electroplated layer is not increased, so that the cutting height of the diamond wire abrasive particles is improved, and the service life of the electroplated diamond wire saw is prolonged.
On the other hand, in the cutting process of the electroplated diamond wire saw, the oxide ceramic powder sintered on the surface of the diamond micro powder has the functions of auxiliary grinding and material gradient transition, the damage depth of the electroplated diamond wire saw to the surface of the cut workpiece can be reduced, and the stress strain is reduced to improve the surface state of the cut workpiece, so that the processing quality of the cut workpiece is improved.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing diamond wire abrasive grains according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified. Additionally, the use of "based on" or "according to" means open and inclusive, as a process, step, calculation, or other action that is "based on" or "according to" one or more stated conditions or values may in practice be based on additional conditions or exceeding the stated values.
Referring to fig. 1, fig. 1 is a schematic flow chart of a method for manufacturing diamond wire abrasive grains according to an embodiment of the present invention.
Referring to fig. 1, the invention provides an electroplated diamond wire saw, diamond wire abrasive particles and a preparation method of the diamond wire abrasive particles, and the preparation method of the diamond wire abrasive particles comprises the steps of carrying out thermal reaction treatment on diamond micro powder, physical mixing treatment with oxide ceramic powder and sintering treatment in sequence to obtain the diamond abrasive particles, so that the self-sharpening property of the diamond abrasive particles is improved, the holding strength of a coating on the diamond abrasive particles is increased, the cutting efficiency and the processing effect of the electroplated diamond wire saw are further improved, and the service life of the electroplated diamond wire saw is further prolonged.
Fig. 1 is a schematic flow chart of a method for manufacturing diamond wire abrasive grains according to an embodiment of the present invention; the preparation method of the diamond wire abrasive particles provided in the embodiment specifically includes the following steps:
in this embodiment, first, the diamond fine powder is subjected to a thermal reaction treatment to obtain a diamond fine powder having a roughened surface and having structural defects, which can reduce the hardness of the particles of the diamond fine powder and increase the surface area of the particles of the diamond fine powder.
In this embodiment, preferably, the thermal reaction treatment of the diamond micro powder may specifically include: placing the diamond micro powder in a muffle furnace for thermal reaction treatment, and naturally exhausting air, wherein the temperature of the thermal reaction treatment can be 680-800 ℃, and the heat preservation time can be 60-300 seconds.
In this embodiment, it is understood that the larger the particle size of the diamond fine powder is, the higher the temperature of the thermal reaction treatment may be, or the longer the heat retention time of the thermal reaction treatment may be.
For example, when the particle size of the diamond fine powder is 5 micrometers to 10 micrometers, that is, the average bit diameter (median diameter) of the diamond fine powder is 5 micrometers to 10 micrometers, the temperature of the thermal reaction treatment is 780 ℃, and the holding time is 300 seconds; when the granularity of the diamond micro powder is 6.5-10 microns, the temperature of the thermal reaction treatment is 800 ℃, and the heat preservation time is 300 seconds.
In this embodiment, it is preferable to elutriate the diamond fine powder having a roughened surface and having structural defects formed thereon, which is obtained after the thermal reaction treatment.
It can be understood that after the diamond fine powder is subjected to the thermal reaction treatment, graphitized materials and other impurities adhere to the particle surfaces of the diamond fine powder, and therefore, the graphitized materials and other impurities on the particle surfaces can be removed by elutriating the diamond fine powder after the thermal reaction treatment.
In this embodiment, preferably, the diamond fine powder after the thermal reaction treatment may be elutriated at least once by using ultrasonic water washing, and the elutriated diamond fine powder is dried and sieved to obtain diamond fine powder particles with a suitable particle size.
And then, uniformly mixing the diamond micro powder with the roughened surface and the structural defects with the oxide ceramic powder to obtain mixed powder, preferably uniformly mixing the elutriated diamond micro powder with the oxide ceramic powder to obtain mixed powder, wherein the uniform mixing refers to pure physical mixing between the diamond micro powder and the oxide ceramic powder without chemical reaction.
In this embodiment, preferably, the oxide ceramic powder includes two or more mixed powders of silica powder, alumina powder, sodium oxide powder, zirconia powder and boria powder, and the physical properties of the oxide ceramic powder are between those of the electroplated layer and the diamond micro powder and are similar to those of the diamond micro powder, which is beneficial for the firm mixing and consolidation of the two.
In this embodiment, preferably, the particle size D50 of the oxide ceramic powder may be 5 to 10 microns, that is, the particle size of the oxide ceramic powder is similar to that of the diamond micro powder, so as to improve the uniformity of mixing and facilitate the sintering; the diamond micro powder and the oxide ceramic powder can be uniformly mixed according to the mass ratio of 100:1-100:10, so that the auxiliary effect of the oxide ceramic powder on the diamond micro powder is ensured on the premise of saving materials.
Optionally, the oxide ceramic powder may include silica powder, alumina powder and zirconia powder, the mass ratio of the silica powder to the alumina powder to the zirconia powder is 23:5:1, wherein the silica powder accounts for the maximum ratio, and at this time, the diamond micro powder and the oxide ceramic powder are uniformly mixed in the mass ratio of 100: 8.
Alternatively, the oxide ceramic powder comprises silicon oxide powder, boron oxide powder, aluminum oxide powder and zirconium oxide powder, the mass ratio of the silicon oxide powder to the boron oxide powder to the aluminum oxide powder to the zirconium oxide powder is 23:12:5:1, wherein the silicon oxide powder still accounts for the largest proportion, and the boron oxide powder is added, so that the diamond micro powder and the oxide ceramic powder can be uniformly mixed in the mass ratio of 100: 1.
And finally, sintering the mixed powder in a vacuum environment to obtain the diamond wire abrasive particles.
In the embodiment, the mixed powder is placed in a vacuum furnace, the temperature is kept constant at 750-810 ℃ for 30-60 min, and then the mixed powder is naturally cooled to obtain the processed diamond abrasive particles.
According to the preparation method of the diamond wire abrasive particles, the diamond micro powder is subjected to thermal reaction treatment, physical mixing treatment with oxide ceramic powder and sintering treatment in sequence, so that the diamond wire abrasive particles are obtained; further, the base wire, the electroplated layer and the diamond wire abrasive particles embedded in the electroplated layer form the electroplated diamond wire saw.
In the embodiment, firstly, the diamond wire abrasive particles are subjected to thermal reaction treatment, so that the surfaces of the diamond micro powder can be roughened to form structural defects, the surface strength of the diamond micro powder is reduced, and the self-sharpening performance of the diamond wire abrasive particles is improved; meanwhile, the diamond micro powder and the oxide ceramic powder are purely physically mixed, no chemical reaction occurs, the physical properties of the diamond micro powder and the oxide ceramic powder are similar, and the roughening of the surface of the diamond micro powder is beneficial to uniform and firm consolidation of the diamond micro powder and the oxide ceramic powder.
On the other hand, after the diamond micro powder and the oxide ceramic powder are mixed and sintered to form the diamond wire abrasive particles, the surface area of the diamond wire abrasive particles is increased, the physical performance of the oxide ceramic powder is between the diamond micro powder and the electroplated layer, and the holding strength of the electroplated layer on the diamond wire abrasive particles is improved under the condition that the thickness of the electroplated layer is not increased, so that the cutting height of the diamond wire abrasive particles is improved, and the service life of the electroplated diamond wire saw is prolonged.
On the other hand, in the cutting process of the electroplated diamond wire saw, the oxide ceramic powder sintered on the surface of the diamond micro powder has the functions of auxiliary grinding and material gradient transition, the damage depth of the electroplated diamond wire saw to the surface of the cut workpiece can be reduced, and the stress strain is reduced to improve the surface state of the cut workpiece, so that the processing quality of the cut workpiece is improved.
To explain the preparation method of the diamond wire abrasive grain more clearly, the specific preparation steps are as follows:
step 1, placing diamond micro powder with the granularity of 5-10 microns in a muffle furnace, naturally exhausting air, keeping the temperature of thermal reaction at 780 ℃ for 300s, and roughening the surface of the diamond micro powder to form structural defects;
step 2, ultrasonically washing the diamond micro powder subjected to the thermal reaction treatment for 2 times by using pure water, removing graphitized materials and other impurities on the particle surface, drying and sieving;
step 3, uniformly mixing the diamond micro powder obtained in the step 2 with oxide ceramic powder according to the mass ratio of 100:8, wherein the oxide ceramic powder comprises a mixture of silicon oxide, aluminum oxide and zirconium oxide, and the mass ratio is mSilicon oxide/mAlumina oxide/mZirconium oxideThe particle size D50 of the oxide ceramic powder was 7.5 μm, 23:5: 1.
And 4, placing the mixed powder obtained in the step 3 in a vacuum furnace for vacuum sintering, wherein the sintering temperature is 780 ℃, keeping the temperature for 60min, and then naturally cooling to obtain the final diamond abrasive particles.
In this embodiment, the specific preparation steps of the preparation method of diamond wire abrasive grains are as follows:
step 1, placing diamond micro powder with the granularity of 6.5-10 microns in a muffle furnace, naturally exhausting air, keeping the temperature of thermal reaction at 800 ℃ for 300s, and roughening the surface of the diamond micro powder to form structural defects;
step 2, ultrasonically washing the diamond micro powder subjected to the thermal reaction treatment for 2 times by using pure water, removing graphitized materials and other impurities on the particle surface, drying and sieving;
step 3, uniformly mixing the diamond micro powder obtained in the step 2 with oxide ceramic powder according to the mass ratio of 100:1, wherein the oxide ceramic powder comprises silicon oxide, boron oxide, aluminum oxide and oxygenMixture of zirconium oxide and zirconium oxide, and the mass ratio of the zirconium oxide to the zirconium oxide is mSilicon oxide/mBoron oxide/mAlumina oxide/mZirconium oxideThe particle size D50 of the oxide ceramic powder was 7.5 μm, 23:12:5: 1.
And 4, placing the mixed powder obtained in the step 3 in a vacuum furnace for vacuum sintering at 800 ℃, keeping the temperature for 60min, and then naturally cooling to obtain the final diamond abrasive particles.
The embodiment also provides the diamond abrasive grain prepared by the preparation method, and the oxide ceramic powder and the diamond micro powder are mixed and then sintered to form an oxide ceramic layer after vacuum sintering treatment, and the oxide ceramic layer is coated on the surface of the diamond micro powder particles in a rugged manner, wherein the oxide ceramic layer generally has the characteristics of high strength, high toughness, corrosion resistance, wear resistance, high melting point and the like.
The embodiment also provides an electroplated diamond wire saw, which comprises a base line, an electroplated layer and diamond wire abrasive particles as described above, wherein the diamond wire abrasive particles are embedded in the electroplated layer, and the stability of the diamond wire abrasive particles embedded in the electroplated layer is improved due to the fact that the physical properties of the oxide ceramic powder are between the diamond micro powder and the electroplated layer.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions within the technical scope of the present invention are intended to be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (11)
1. A preparation method of diamond wire abrasive grains is characterized by comprising the following steps:
carrying out thermal reaction treatment on the diamond micro powder to obtain the diamond micro powder with roughened surface and formed structural defects;
uniformly mixing the diamond micro powder with the roughened surface and the formed structural defects with oxide ceramic powder to obtain mixed powder;
and sintering the mixed powder in a vacuum environment to obtain the diamond wire abrasive particles.
2. The method of manufacturing diamond wire abrasive grains according to claim 1, wherein the oxide ceramic powder includes a mixed powder of two or more of silica powder, alumina powder, sodium oxide powder, zirconia powder, and boria powder.
3. The method for preparing diamond wire abrasive grains according to claim 2, wherein the mass ratio of the diamond micro powder with the roughened surface and the formed structural defects to the oxide ceramic powder is 100:1-100: 10.
4. The method of manufacturing diamond wire abrasive grains according to claim 3, wherein the sintering process includes: the sintering temperature is 750-810 ℃, and the heat preservation time is 30-60 min.
5. The method of making diamond wire abrasive particles according to claim 4, wherein the oxide ceramic powder has a particle size of 5 to 10 microns.
6. The method of manufacturing diamond wire abrasive grains according to claim 5, wherein the thermal reaction treatment includes: and placing the diamond micro powder in a muffle furnace, wherein the thermal reaction treatment temperature is 680-800 ℃, and the heat preservation time is 60-300 seconds.
7. The method for producing diamond wire abrasive grains according to claim 6, wherein the diamond fine powder has a particle size of 5 to 10 μm; the thermal reaction treatment temperature is 780 ℃, and the heat preservation time is 300 seconds; the mass ratio of the diamond micro powder with the roughened surface and the formed structural defects to the oxide ceramic powder is 100: 8; the oxide ceramic powder comprises the silicon oxide powder, the aluminum oxide powder and the zirconium oxide powder, and the mass ratio of the silicon oxide powder to the aluminum oxide powder to the zirconium oxide powder is 23:5: 1; the sintering temperature is 780 ℃, and the heat preservation time is 60 min; the particle size D50 of the oxide ceramic powder was 7.5 microns.
8. The method for producing diamond wire abrasive grains according to claim 6, wherein the diamond fine powder has a particle size of 6.5 to 10 μm; the thermal reaction treatment temperature is 800 ℃, and the heat preservation time is 300 seconds; the preset mass ratio of the diamond micro powder with the roughened surface and the formed structural defects to the oxide ceramic powder is 100: 1; the oxide ceramic powder includes the silicon oxide powder, the boron oxide powder, the aluminum oxide powder, and the zirconium oxide powder; the mass ratio of the silicon oxide powder to the boron oxide powder to the aluminum oxide powder to the zirconium oxide powder is 23:12:5: 1; the sintering temperature is 800 ℃, and the heat preservation time is 60 minutes; the particle size D50 of the oxide ceramic powder was 7.5 microns.
9. The method of manufacturing diamond wire abrasive grains according to any one of claims 1 to 8, further comprising:
the diamond micro powder with the roughened surface and the structural defects formed is elutriated at least once by ultrasonic water washing;
and drying and sieving the washed diamond micro powder.
10. Diamond wire abrasive grain produced by the method according to any one of claims 1 to 9.
11. An electroplated diamond wire saw comprising a base wire, an electroplated layer and diamond wire abrasive particles according to claim 10 embedded within the electroplated layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210225209.2A CN114426433A (en) | 2022-03-07 | 2022-03-07 | Electroplated diamond wire saw, diamond wire abrasive particles and preparation method of diamond wire abrasive particles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210225209.2A CN114426433A (en) | 2022-03-07 | 2022-03-07 | Electroplated diamond wire saw, diamond wire abrasive particles and preparation method of diamond wire abrasive particles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114426433A true CN114426433A (en) | 2022-05-03 |
Family
ID=81312907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210225209.2A Pending CN114426433A (en) | 2022-03-07 | 2022-03-07 | Electroplated diamond wire saw, diamond wire abrasive particles and preparation method of diamond wire abrasive particles |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114426433A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115584540A (en) * | 2022-11-29 | 2023-01-10 | 江苏三超金刚石工具有限公司 | Diamond wire saw with composite coating and preparation process thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5969266A (en) * | 1982-09-14 | 1984-04-19 | Nippon Gureen Kenkyusho:Kk | Production method of vitrified bond diamond grindstone |
| CN102634319A (en) * | 2012-03-30 | 2012-08-15 | 天津大学 | Novel microcrystalline abrasive for super-hard abrasive tools and production method thereof |
-
2022
- 2022-03-07 CN CN202210225209.2A patent/CN114426433A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5969266A (en) * | 1982-09-14 | 1984-04-19 | Nippon Gureen Kenkyusho:Kk | Production method of vitrified bond diamond grindstone |
| CN102634319A (en) * | 2012-03-30 | 2012-08-15 | 天津大学 | Novel microcrystalline abrasive for super-hard abrasive tools and production method thereof |
Non-Patent Citations (1)
| Title |
|---|
| （苏）布加耶夫等: "人造金刚石在地质勘探钻进中的应用", 中国原子能出版社, pages: 51 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115584540A (en) * | 2022-11-29 | 2023-01-10 | 江苏三超金刚石工具有限公司 | Diamond wire saw with composite coating and preparation process thereof |
| CN115584540B (en) * | 2022-11-29 | 2024-01-12 | 江苏三超金刚石工具有限公司 | Diamond wire saw with composite coating and preparation process thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2210488C2 (en) | Sintered diamond blank and method for making it | |
| JPH11165261A (en) | Porous abrasive grain grinding wheel and its manufacture | |
| CN107140960B (en) | Method for sintering alumina-based eutectic ceramic composite material by discharge plasma | |
| CN103361530B (en) | Diamond cutting blade and preparation method thereof | |
| CN110064974B (en) | Method for inhibiting crack damage of hard and brittle material grinding processing by adopting surface layer toughening | |
| CN113997213B (en) | Ceramic diamond grinding wheel for thinning SiC wafer and manufacturing method thereof | |
| CN109676541B (en) | Repair-free composite binding agent superhard grinding wheel for grinding silicon ingot and preparation method and application thereof | |
| CN104944956B (en) | Gel reaction-based polycrystalline nanometer diamond grinding tool preparation method | |
| CN105437091A (en) | Large-pore resin binder superhard material grinding wheel for stainless steel end face grinding and manufacturing method thereof | |
| CN110981497A (en) | High-thermal-conductivity and high-wear-resistance silicon nitride ceramic and preparation method and application thereof | |
| CN114426433A (en) | Electroplated diamond wire saw, diamond wire abrasive particles and preparation method of diamond wire abrasive particles | |
| CN105014553B (en) | A kind of ceramic microcrystalline emery wheel and its manufacture method with high-strength grinding performance | |
| CN108818329B (en) | Diamond grinding wheel and preparation method thereof | |
| CN114670128B (en) | Nanoscale high-temperature sintered ceramic abrasive and preparation method thereof | |
| CN109773673B (en) | Preparation method of ceramic bond diamond grinding wheel | |
| CN114380610B (en) | Method for manufacturing pressureless liquid phase sintered silicon carbide ceramic grinding disc | |
| CN114193339A (en) | Metal bond diamond grinding tool and preparation method thereof | |
| JP3486666B2 (en) | Processing method of ceramics | |
| JPH0215977A (en) | Diamond grindstone and manufacture thereof | |
| CN108818331B (en) | Bronze-based CBN grinding wheel and preparation method thereof | |
| CN107900921A (en) | A kind of porous cubic boron nitride abrasive wheel working lining and its manufacture method based on abrasive particle cluster and graphene | |
| CN102699565A (en) | Thermal-damage-free active soldering method for cubic boron nitride (CBN) abrasive particles and soldering material used therein | |
| CN110551483B (en) | Method for preparing cubic boron nitride titanium carbide composite abrasive | |
| KR101402214B1 (en) | Polycrystalline diamond grinding edge tools with multi-layer deposition | |
| CN108942705B (en) | Preparation method of stable ceramic binder material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 519000 unit B25, 2nd floor, building 4, No. 153, Rongao Road, Hengqin New District, Zhuhai City, Guangdong Province Applicant after: Gaojing Solar Co.,Ltd. Address before: 519000 unit B25, 2nd floor, building 4, No. 153, Rongao Road, Hengqin New District, Zhuhai City, Guangdong Province Applicant before: Guangdong Gaojing Solar Energy Technology Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220503 |
|
| RJ01 | Rejection of invention patent application after publication |