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CN114424330A - Conveyor inspection system, substrate rotator, and test system having the conveyor inspection system and substrate rotator - Google Patents

Conveyor inspection system, substrate rotator, and test system having the conveyor inspection system and substrate rotator Download PDF

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Publication number
CN114424330A
CN114424330A CN202080066651.4A CN202080066651A CN114424330A CN 114424330 A CN114424330 A CN 114424330A CN 202080066651 A CN202080066651 A CN 202080066651A CN 114424330 A CN114424330 A CN 114424330A
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CN
China
Prior art keywords
conveyor
substrate
inspection system
fast
moveable
Prior art date
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Pending
Application number
CN202080066651.4A
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Chinese (zh)
Inventor
施勒岑杰·阿萨夫
马库斯·J·施托佩尔
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Applied Materials Inc
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Applied Materials Inc
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Filing date
Publication date
Priority claimed from US16/712,969 external-priority patent/US10937683B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN114424330A publication Critical patent/CN114424330A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

Embodiments disclosed herein relate generally to a conveyor inspection system and a method of sorting substrates. The conveyor inspection system includes a mobile conveyor and a fast conveyor. The movable conveyor is configured to transfer an undesired substrate to the fast conveyor. The method comprises the following steps: determining that the substrate is not expected to enter a modular inspection unit; transferring the substrate to a fast conveyor in response to determining that the substrate is not expected to enter the modular inspection unit; and transporting the substrate on the fast conveyor. The conveyor inspection system and the method remove substrates from a test system upon first entering the test system, which reduces the time wasted analyzing undesired substrates that will be discarded.

Description

Conveyor inspection system, substrate rotator, and test system having the conveyor inspection system and substrate rotator
Technical Field
Embodiments of the present disclosure generally relate to an apparatus and a method, and more particularly, to a conveyor inspection system, a substrate rotator, and a substrate testing system having the conveyor inspection system and the substrate rotator.
Background
Substrates (such as semiconductor substrates, solar substrates, etc.) are routinely inspected during processing at individual inspection stations to ensure compliance with predetermined quality control standards. The different inspection techniques provide comprehensive data about the product and process. However, due to the number of inspection stations required and the transfer time involved in moving the substrate between the inspection stations, comprehensive inspection can be time consuming, thereby reducing throughput. Thus, device manufacturers are often faced with the decision to choose whether to use excessive inspection/transfer time for the full inspection or to choose some of the aforementioned inspection processes.
A typical substrate testing system can process about 3,600 substrates per hour in a linear arrangement. However, as inspection processes continue to reduce the amount of time to complete inspection steps, there is a need for substrate handling equipment within a test system that can keep up with faster inspection times and/or additional inspection routines.
One drawback in the art is that damaged substrates may be inadvertently introduced into the substrate testing system. In particular, most conventional systems are unable to detect substrates having a damaged side. In these cases, time and effort are wasted on damaged or otherwise undesirable wafers that are immediately rejected for analysis. In addition, the undesired wafer may interfere with components of the test system, requiring the test system to be stopped to remove the damaged substrate. This increases the cost of ownership of the test system by the user.
Accordingly, there is a need in the art for an apparatus and method to improve substrate handling in a substrate testing system.
Disclosure of Invention
Embodiments herein generally relate to a conveyor inspection system and a method of sorting substrates within an inspection system. The conveyor inspection system and method remove substrates from a test system prior to entering a modular inspection unit of the test system, which reduces the time wasted analyzing undesired substrates that would be discarded regardless of inspection results.
In one embodiment, a conveyor inspection system is provided. The conveyor inspection system includes: an inlet conveyor; a moveable conveyor positioned to receive substrates from the entrance conveyor; a fast conveyor disposed below the moveable conveyor; an image capture device positioned to obtain an image of the substrate disposed on the entrance conveyor; and an illumination source. The illumination source is configured to emit illumination light onto the entrance conveyor in a field of view of the image capture device.
In another embodiment, a conveyor inspection system is provided. The conveyor inspection system includes: an inlet conveyor; a moveable conveyor positioned to receive substrates from the entrance conveyor; and a fast conveyor disposed below the movable conveyor. The moveable conveyor is configured to operate at a first speed. The fast conveyor is configured to operate at a second speed. The second speed is greater than the first speed.
In yet another embodiment, a method of sorting substrates is provided. The method comprises the following steps: transporting the substrate on an entrance conveyor at a first speed; determining that the substrate not expected to be transported on the entrance conveyor enters a modular inspection unit; transferring the substrate to a fast conveyor in response to determining that the substrate is not expected to enter the modular inspection unit; and transporting the substrate on the fast conveyor at a second speed greater than the first speed.
Drawings
So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only exemplary embodiments of this disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.
FIG. 1 illustrates a top plan view of an inspection (e.g., testing) system, according to one embodiment.
Figure 2 illustrates a top plan view of a high speed rotary sorter according to one embodiment.
FIG. 3A illustrates a top plan view of a conveyor inspection system according to one embodiment.
Fig. 3B illustrates a side plan view of the conveyor inspection system in a first orientation, in accordance with one embodiment.
Fig. 3C illustrates a side plan view of the conveyor inspection system in a second orientation, in accordance with one embodiment.
Fig. 4 is a flow chart of the method operations for sorting substrates according to one embodiment.
Fig. 5A illustrates a side plan view of a substrate rotator in a first orientation, in accordance with one embodiment.
Fig. 5B illustrates a top plan view of the substrate rotator in a first orientation, in accordance with one embodiment.
Fig. 5C illustrates a side plan view of the substrate rotator in a second orientation, in accordance with one embodiment.
Fig. 5D illustrates a top plan view of the substrate rotator in a second configuration, in accordance with one embodiment.
Fig. 5E illustrates a side plan view of the substrate rotator in a third configuration, in accordance with one embodiment.
Fig. 5F illustrates a top plan view of the substrate rotator in a third configuration, according to one embodiment.
FIG. 6 is a flowchart of the method operations for performing metrology on a substrate, in accordance with one embodiment.
Fig. 7A illustrates a schematic view of a body rotating in a first direction, according to one embodiment.
Fig. 7B illustrates a schematic view of a body rotating in a second direction, according to one embodiment.
Fig. 7C illustrates a schematic view of a body rotating in a first direction, according to one embodiment.
Fig. 7D illustrates a schematic view of a body rotating in a second direction, according to an embodiment.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of the embodiments may be beneficially incorporated in other embodiments without further recitation.
Detailed Description
Embodiments disclosed herein relate generally to a conveyor inspection system and a method of sorting substrates. The conveyor inspection system includes a mobile conveyor and a fast conveyor. The movable conveyor is configured to transfer the undesired substrates to the fast conveyor, thus removing the undesired substrates from the conveyor inspection system prior to entering the modular inspection unit. The method comprises the following steps: determining that an undesired substrate enters the modular inspection unit; transferring the substrate to a fast conveyor in response to determining that the substrate is not expected to enter the modular inspection unit; and transporting the substrate on the fast conveyor. The conveyor inspection system and method removes substrates from the test system upon first entering the test system, which reduces the time wasted analyzing undesired substrates in the modular inspection units that would be discarded regardless of inspection results from the modular inspection units. In addition, removing the undesired substrate reduces interference with the test system, thereby reducing the cost of ownership of the test system.
As used herein, the term "about" refers to a +/-10% variation from a nominal value. It is to be understood that such variations may be included in any of the values provided herein.
FIG. 1 illustrates a top plan view of an inspection (e.g., testing) system 100, according to one embodiment. The inspection system 100 is configured to inspect and sort a plurality of substrates 110. As shown, inspection system 100 includes a front end 102, a conveyor system 114, modular inspection units 104, sorting units 106, and a controller 190. The front end 102 may be a loading unit. The conveyor system 114 is configured to transport the substrates 110 from a loading unit (e.g., the front end 102) to the modular inspection unit 104. The modular inspection unit 104 may be a metrology unit. The sorting unit 106 may be a sorting module that utilizes grippers to transfer substrates into bins according to information obtained from instructions of the substrates in the modular inspection unit 104. The front end 102, modular inspection units 104, and sorting units 106 may be arranged linearly with respect to one another, e.g., with the conveyor system 114 extending through the front end 102, modular inspection units 104, and sorting units 106 of the inspection system 100 in a linear or substantially linear orientation. Alternatively, the front end 102, modular inspection units 104, and sorting units 106 may be arranged in another orientation, such as an "L-shape.
The front end 102 is configured to transport the substrate 110 to the rest of the inspection system 100 via the conveyor system 114. As shown, the conveyor system 114 includes a first conveyor apparatus 115, an intermediate conveyor apparatus 117, and a second conveyor apparatus 119. The conveyor system 114, and thus the first conveyor apparatus 115, the intermediate conveyor apparatus 117, and the second conveyor apparatus 119, may comprise any device configured to carry substrates through the inspection system 100. For example, the conveyor system 114 may include one or more of belts, rollers, rolls, or other devices/mechanisms suitable for transporting substrates through the inspection system 100. The conveyor system 114 may further include a carrier or tray for holding the substrate while moving along the conveyor system 114, wherein the carrier or tray is moved by the drive mechanism. Each of the first conveyor apparatus 115, the intermediate conveyor apparatus 117, and the second conveyor apparatus 119 may be driven individually.
The intermediate conveyor apparatus 117 is part of a conveyor inspection system 170. The conveyor inspection system 170 is configured to sort and remove undesired substrates 111 from the conveyor system 114 before the substrates may enter the modular inspection units 104 of the inspection system 100. The conveyor inspection system 170 is also configured to transfer substrates 110 suitable for further testing and/or inspection to the second conveyor apparatus 119 for transport to the modular inspection unit 104. More details regarding the conveyor inspection system 170 are given in the description of fig. 3 below.
The conveyor system 114 may be a motor-driven conveyor system and may include one or more conveyors, such as conveyor belts or tracks driven by actuators through rollers and/or drive gears. The conveyor system 114 may be provided in a linear arrangement to convey substrates through the modular inspection unit 104. Accordingly, the conveyor system 114 is disposed within the modular inspection unit 104 and facilitates the conveyance of the substrates 110 through the modular inspection unit 104. Additional modular inspection units may be positioned between the front end 102 and the modular inspection unit 104, and/or between the modular inspection unit 104 and the sorting unit 106, and/or after the sorting unit 106 to facilitate expansion of the inspection system 100.
As shown, the front end 102 includes a transfer robot 108. The transfer robot 118 is configured to transfer substrates 110 from one or more cassettes 112 positioned within the front end 102 to a first conveyor apparatus 115. The substrate loaded on the first conveyor apparatus 115 is transferred to the intermediate conveyor apparatus 117 and the second conveyor apparatus 119 to be further transported to the modular inspection unit 104. The transfer robot 108 includes a support element 108E such as a suction element, an end effector, and a gripper chuck for gripping and transferring the substrate 110.
The front end 102 receives one or more cassettes 112. Each cassette 112 contains substrates 110 in a stacked configuration. The substrates 110 may be stacked horizontally or vertically. For example, each cassette 112 includes a plurality of slots therein, and each slot is configured to hold a substrate 110. The cassettes 112 may be positioned such that the substrates 110 are positioned above one another. The substrate 110 is transferred from the cassette 112 to the conveyor system 114 via the transfer robot 108 for transfer through the inspection system 100 via the conveyor system. The front end 102 includes a controller 190. The controller 190 can include a graphical user interface adapted to present information related to operations occurring in the front end 102, including process metrics, lot numbers, and the like. In one example, the controller 190 includes a touch screen interface.
The modular inspection unit 104 is configured to take one or more measurements of the substrate 110 passing therethrough. As shown, the modular inspection unit 104 includes one or more metrology stations 116, a substrate edge metrology system 181, and a substrate rotator 180. In the embodiment of fig. 1, the modular inspection unit 104 includes five metrology stations 116A-116E, two of which are part of the substrate edge metrology system 181. In the embodiment shown in fig. 1, the metrology stations 116D and 116E separated by the substrate rotator 180 are part of a substrate edge metrology system 181. It is contemplated that if space permits, inspection system 100 may be modified by adding or subtracting metrology stations to modular inspection units 104, rather than adding a second modular inspection unit, thereby increasing throughput and/or the number of metrology processes performed.
The metering station 116 may include any of the following: a microcrack detection unit, a thickness measurement unit, a resistivity measurement unit, a photoluminescence unit, a geometry detection unit, a saw cut mark detection unit, a strain detection unit, a chip detection unit and/or a crystallization fraction detection unit. The microcrack inspecting unit may be configured to inspect the substrate for cracks and determine a crystallization fraction of the substrate. The geometry inspection unit may be configured to analyze surface properties of the substrate. The sawing mark detection unit may be configured to identify sawing marks on the substrate, including trenches, steps, and dual step marks. The metering station 116 may include other examples in addition to those listed above. As described in detail below, each of the metering stations 116 is used to deliver one or more metering values to the sorting units 106.
The metrology station 116B may be a thickness measurement unit adapted to measure the thickness of the substrate. The metrology station 116B may also or alternatively measure the resistivity of the substrate 110. The metrology station 116B receives the substrate 110 conveyed along the conveyor system 114 after inspection in the metrology station 116A, which is any type of metrology station. The metering station 116B is disposed downstream of the metering station 116A along the in-line path of the substrate 110 defined by the conveyor system 114. The metrology station 116B performs one or more inspection processes on the substrate 110. The inspection process occurring at the metrology station 116B may be performed while the substrate is in motion. It is contemplated that the motion of the substrate 110 may be stopped at the metrology station 1168 to facilitate improved accuracy of the inspection.
The metrology station 116C may be a photoluminescence unit configured to detect defects and/or perform impurity measurements. Additionally, another metrology station (not shown) may be a geometry inspection unit configured to analyze the geometry and surface properties of the substrate 110.
The metrology station 116C receives the substrate 110 conveyed along the conveyor system 114 after inspection thereof in the metrology station 116B. The metrology station 116D receives the substrate 110 conveyed along the conveyor system 114 after inspection thereof in the metrology station 116C. The metrology station 116E receives the substrate 110 conveyed along the conveyor system 114 after inspection thereof in the metrology station 116D, and so on if additional metrology units are used in the linear path as shown. Additionally, in some embodiments, non-linear path checking is utilized. Thus, the substrate 110 may be transferred between the metrology stations 116A-116E in a non-linear manner, such as in a circular manner or in an arcuate manner. The substrate rotator 180 picks up the substrate exiting the metrology station 116D on the conveyor system 114, rotates the substrate, and then returns the rotated substrate to the conveyor system 114 for transport to the metrology station 116E.
The substrate edge metrology system 181 is configured to measure defects on the edge of the substrate 110. As shown, the substrate edge metrology system includes metrology stations 116D, 116E and a substrate rotator 180. According to one embodiment, the metrology stations 116D, 116E are both Chip Side Inspection (CSI) tools. The CSI tool includes an image capture device, such as a camera, Charge Coupled Device (CCD), or the like, adapted to capture an image of one side of each substrate 110 as the substrate passes through the metrology stations 116D, 116E to check whether there is debris, cracking, or other defects on one side of the substrate. The CSI tool is configured to image one side of the substrate 110 parallel to the direction in which the substrate moves down the conveyor system 114. In the example shown in fig. 1, each metrology station 116D, 116E has a CSI tool positioned to obtain images of two opposing sides of a substrate, typically the sides of the substrate having an orientation parallel to the direction of travel of the substrate along a portion of the conveyor system 114 disposed within the modular inspection unit 104. In one example, the CSI tool is positioned to obtain images of two opposing sides of the substrate while the substrate remains on the conveyor system 114 within the metrology stations 116D, 116E.
The substrate rotator 180 is disposed between the metrology stations 116D, 116E. In the first metering station 116D, each side of the substrate (e.g., not the leading or trailing edge of the substrate on the conveyor system 114) is inspected for debris, cracks, or other defects. After the substrate 110 passes through the first metrology station 116D, the substrate rotator 180 rotates the substrate 110 about 90 degrees or about 270 degrees about the central axis of the substrate while translating the substrate 180 degrees. By translating the substrate 180 degrees, the substrate may be picked and placed on the conveyor system 114 in substantially the same position relative to other substrates on the conveyor system 114 as the substrate travels along the conveyor system 114 at a high rate of speed. In other words, the substrate rotator 180 has a substrate pick-up position above the first position above the conveyor system 114 and a substrate drop-off position above the second position above the conveyor system 114, wherein the substrate rotator 180 translates (e.g., rotates) 180 degrees between the first position and the second position above the conveyor system 114. Additionally, depending on the direction of the 180 degree rotation of the substrate rotator, the substrate is rotated about 90 ° or about 270 ° about its central axis such that the same edge (leading or trailing) of the substrate is placed on the conveyor system 114 in the same orientation, regardless of the direction of the rotational translation. In other words, when the substrate rotator 180 rotates 180 degrees between the first position and the second position, the substrate rotates 90 degrees. This exposes the sides of the substrate 110 that have not been measured (e.g., the leading and trailing edges prior to rotation by the substrate rotator 180) to the metrology station 116E, where inspection is performed to detect debris, cracks, or other defects. Thus, each side of the substrate 110 is inspected by the CSI tool. More details of the substrate rotator appear in the discussion of fig. 4 below.
A conveyor system 114 conveys the inspected substrates 110 from the modular inspection units 104 into the sorting units 106. The sorting unit 106 is configured to sort the substrates 110 into different categories according to the metrology value of each substrate found from the metrology station 116 in the modular inspection unit 104. As shown, sorting unit 106 includes a rotary sorting system 120. The conveyor system 114 delivers the inspected substrates 110 to a location in the sorting unit 106 accessible to the rotary sorting system 120. Additionally, the conveyor system 114 may continue through the sorting unit 106 to the connector 150. Thus, if the sorting unit 106 does not sort the substrates 110, the inspected substrates 110 bypass the rotary sorting system 120 of the sorting unit 106. Additionally, if the inspected substrate 110 is not picked up by the rotary sortation system 120, the substrate continues along the conveyor system 114 toward the connector 150.
In some embodiments, substrates that are not picked by the rotary sortation system 120 continue along the conveyor system 114, which leads to unsorted substrate bins. In some embodiments, sorting unit 106 is also connected with additional units (such as additional inspection systems, additional sorting units, and/or additional metrology units) via connectors 150. The connector 150 may also allow the conveyor system 114 to align with the conveyor system of additional units, such as additional inspection systems, additional sorting units, and/or additional metering units.
The controller 190 is configured to control and automate the inspection system 100. The controller 190 may be coupled to or in communication with one or more of the conveyor system 114, the front end 102, the modular units 104, the sorting units 106, the transfer robots 108, the conveyor inspection system 170, the substrate rotator 180, and/or the metrology stations 116A-116E. The inspection system 100 may provide information to the controller 190 regarding substrate movement, substrate transfer, substrate sorting, and/or metrology performed.
The controller 190 includes a Central Processing Unit (CPU) (not shown), a memory (not shown), and support circuits (or I/O) (not shown). The CPU is one of any form of computer processor used in an industrial environment to control various processes and hardware (e.g., pattern generators, motors, and other hardware) and to monitor processes (e.g., processing time and substrate position or location). A memory (not shown) is connected to the CPU and is one or more of readily available memory such as Random Access Memory (RAM), Read Only Memory (ROM), floppy disk, hard disk, or any other form of digital storage, local or remote. Software instructions and data may be encoded and stored in memory to instruct the CPU. Support circuits (not shown) are also connected to the CPU for supporting the processor in a conventional manner. The support circuits include conventional cache, power supplies, clock circuits, input/output circuits, subsystems, and the like. A program (or computer instructions) readable by the controller 190 determines tasks that can be performed on the substrate. The program may be software readable by the controller 190 and may include code to monitor and control, for example, the processing time and the positioning or position of the substrate within the inspection system 100.
Fig. 2 illustrates a top plan view of rotary sortation system 120, in accordance with one embodiment. The rotary sortation system 120 is configured to place the substrates 110 in various bins according to the metric value of each substrate. As shown, rotary sortation system 120 includes a rotatable support 122. The rotatable support 122 is configured to rotate the base plate 110 about a rotation axis R. The rotatable support 122 may be a rotating disk, a circular support, or any other shape for efficiently sorting the substrate 110.
As shown, the rotatable support 122 includes a plurality of arms 124. Each arm 124 is configured to rotate a given substrate 110 about the sorting unit 106. Each arm 124 has a first end 126 and a second end 128. A first end 126 of each arm 124 is connected to the rotatable support 122 via a suitable connection, such as a welded connection, pinned connection, fastened connection, or the like. The second end 128 of each arm 124 extends radially outward relative to the axis of rotation R. In one embodiment, the rotatable support 122 includes twelve arms 124. It is contemplated that any number of arms 124 may be included, such as ten or more arms 124, such as fourteen or sixteen arms.
At least one gripper 130 is coupled to the second end 128 of each arm 124. Each gripper 130 may be disposed on a bottom side or end of each of the arms 124 such that each gripper 130 may grasp a substrate 110 as the inspected substrate 110 reaches the sorting unit 106. Each gripper 130 may be a suction gripper, a gripper, a magnetic gripper, a picker, or other suitable gripper. In one embodiment, each gripper 130 is a bernoulli picker.
One or more sort bins 140 are disposed radially outward of the axis of rotation R. In one embodiment, ten sort bins 140 are utilized. It is contemplated that any number of sort bins 140 may be utilized, such as six, eight, or twelve sort bins 140. While the plurality of arms 124 are rotated by the rotatable support 122, the sort bin 140 may be positioned directly below the path taken by the grippers 130. According to one embodiment, the rotary sortation system 120 rotates about the axis of rotation R in a stepwise manner such that the rotary sortation system 120 stops gripping (e.g., picking up) substrates 110 from the conveyor system 114 as each substrate 110 enters the sort unit 106. Sort bin 140 is positioned to receive substrate 110 from rotary sortation system 120. The substrates 110 are sorted into the sort bins 140 in response to one or more substrate characteristics determined during one or more of the inspection processes performed in the metrology stations 116A-116E. The rotary sortation system 120 positions a substrate 110 above a sort bin 140 assigned to receive substrates having at least one predetermined substrate characteristic. The substrates 110 are then released from the respective grippers 130 into the appropriate sort bins 140. The sorting bin 140 stores the sorted substrate 110 when the gripper 130 releases the substrate.
Sorting bins 140 are each individually removable from sorting unit 106. Each sorting bin 140 may be removably connected with sorting unit 106, such as by individually removable drawers or containers, slide out of containers, or pull out of drawers or containers. Each sorting bin 140 is accessible from outside the sorting unit 106 such that each sorting bin 140 is removed from the sorting unit 106 without entering the sorting unit 106. The full sort bin 140 may be removed from the sorting unit 106 by pulling the sort bin 140 out of the sorting unit 106. Each sort bin 140 is removable from the sorting unit 106 when the sorting unit 106 sorts the substrates 110. Accordingly, the sorting of the substrates 110 may continue even if a particular sorting bin 140 is full or has been removed. Thus, each sort bin 140 may be emptied or replaced as sorting proceeds.
In addition, the controller 190 may count the number of substrates 110 within each sort bin 140 via the use of a counter (not shown). Thus, when a particular sort bin 140 is full or out of position, the sorting unit 106 skips the full or removed sort bin 140 until the full or removed sort bin 140 is emptied or replaced. Once an empty sort bin 140 is replaced within the sort unit 106, the counter is reset for that particular sort bin 140. The counter may be automatically reset each time a sorting bin 140 is replaced or emptied. The operator may empty or replace the full sort bin 140. Accordingly, the sorting unit 106 may continue to rotate the substrate 110 until the assigned sorting bin 140 is available. If no sort bins 140 are available, the sorting unit 106 may alert the operator and continue to rotate the substrate 110 until a suitable sort bin 140 becomes available. Once controller 190 determines that a particular sort bin 140 is near or has been at capacity, controller 190 may alert an operator by issuing an alarm and/or displaying an alarm.
Although not shown, it is contemplated that additional sort bins 140 may be positioned within the sort unit 106 to receive substrates 110 inadvertently missing a sort, thereby preventing damage to such substrates. Although ten sort bins 140 are illustrated, it is contemplated that more or less than ten sort bins 140 may be included within the sorting unit 106, such as six, eight, eighteen, or twenty-four sort bins 140. Additionally, a reject bin 144 may be positioned within the sorting unit 106 to capture substrates 110 that have been rejected by one or more of the metrology stations 116A-116E of the modular inspection unit 104. Accordingly, the rotary sortation system 120 may transfer the undesired substrates to the reject bin 144.
The rotary sortation system 120 may also include a yield analysis server 146 accessible by one or more access panels. The yield analysis server 146 is coupled to one or more of the front end 102 and the metrology stations 116A-116E and is adapted to receive, collect, analyze, store and/or report data received from the front end 102 and the one or more metrology stations 116A-116E regarding each substrate 110 passing therethrough.
The rotatable support 122 is coupled with a rotatable actuator (not shown), such as a pneumatic cylinder or a stepper motor. The rotary actuator rotates the rotatable support 122, such as in an indexed manner. At each indexing step of the rotatable support 122, a new substrate 110 is received from the modular inspection unit 104 via the conveyor system 114 onto the rotary sortation system 120 via each gripper 130. Additionally, as discussed further below, the rotatable support 122 may index each of the plurality of arms 124 over a respective sort bin 140 and/or over a discard bin 144 such that the substrate 110 is released into the sort bin 140 or the discard bin 144. By moving or indexing the steps continuously, the substrates 110 may be continuously removed from the conveyor system 114, thereby immediately freeing space on the conveyor system 114 for the next substrate 110. Thus, the rotational movement allows each gripper 130 to engage with each sort bin 140 such that a substrate held by a gripper 130 will be released into one of the sort bins 140 before the gripper 130 rotates back to a position to receive another substrate 110. The rotary sortation system 120 will continue to move until all substrates 110 have been sorted.
In some implementations, the rotary sortation system 120 picks up substrates 110 delivered from the modular inspection units 104 via the conveyor system 114 every 2/3 seconds. In such embodiments, the rotary sortation system 120 sorts at least 5,400 substrates per hour, which is a significant improvement over conventional sortation systems.
FIG. 3A is a partial top plan view of the inspection system 100 illustrating a conveyor inspection system 170, according to one embodiment. Fig. 3B is a side plan view of the inspection system 100 illustrating the conveyor inspection system 170 in a first orientation, according to one embodiment. The conveyor inspection system 170 is configured to transport the substrate 110 to a destination, where the destination is dependent on the quality of the substrate. As shown, the conveyor inspection system 170 includes an intermediate conveyor apparatus 117, a moveable conveyor actuator 209, an exit conveyor 203, an image capture device 250, one or more illumination sources 260, a flash conveyor 210, and a waste bin 240. The moveable conveyor actuator 209, as well as any other actuator described herein, may be a motor, hydraulic actuator, pneumatic actuator, or other motion control mechanism.
As shown, the intermediate conveyor apparatus 117 includes an entrance conveyor 201, a moveable conveyor 202, and a moveable conveyor actuator 209. The intermediate conveyor apparatus 117, and thus the entrance conveyor 201, the movable conveyor 202, and the exit conveyor 203, may comprise any device configured to carry substrates along the intermediate conveyor apparatus 117. For example, the intermediate conveyor apparatus 117 may include one or more of belts, rollers, webs, or other devices/mechanisms suitable for transporting substrates through the intermediate conveyor apparatus 117. The intermediate conveyor apparatus 117 may further include a carrier or tray that carries the substrate, wherein the carrier or tray is moved by a drive mechanism. Each of the entrance conveyor 201, the movable conveyor 202, and the movable conveyor actuator 209 may be driven individually.
The image capture device 250 may be a camera, a charge-coupled device (CCD), or other device suitable for determining that further transport of the substrate to the modular inspection unit 104 is not desired. The substrate 110 may be transported from the front end 102, across the entrance conveyor 201, the moveable conveyor 202, the exit conveyor 203, and into the modular inspection unit 204, and thus, the entrance conveyor 201, the moveable conveyor 202, the exit conveyor 203 may be considered components of the intermediate conveyor apparatus 117.
As shown in fig. 3A, the translation devices 270, 272, 274 (e.g., conveyor belts or equivalents) of the entrance conveyor 201, the conveyor system 114, and the exit conveyor 203 are generally, but not necessarily, aligned in a linear direction. The translation devices 272 of the conveyor system 114 are generally closer together than the translation devices 276 of the fast conveyor 210. The translation device 276 of the fast conveyor 210 is generally narrower than the width of the substrate so that the substrate is lifted off the conveyor system 114 and placed on the fast conveyor 210 as the conveyor system 114 moves between the translation devices 276 of the fast conveyor 210, as described further below.
Fig. 3B illustrates a path of an exemplary substrate 110 through the conveyor inspection system 170 in a first orientation. The substrates are set on an entrance conveyor 201 from a cassette (or other source) by a transfer robot 108. During transport of the substrate 110 across the entrance conveyor 201, the portion of the entrance conveyor 201 through which the substrate travels is illuminated by one or more illumination sources 260 (illumination is shown by beam 261). The portion of the entrance conveyor 201 illuminated by the one or more illumination sources 260 is also within the field of view of the image capture device 250. While illuminating the substrate 110, the image capture device 250 obtains an image of at least the edge of the substrate. Generally, the entrance conveyor 201 obtains an image of the substrate 110 as the substrate moves across the entrance conveyor 201.
The controller 190 obtains an image or image data from the image capture device 250. The controller 190 analyzes the image to determine whether the substrate 110 is undesirable or suitable for further transfer to the modular inspection unit 104. Examples of undesirable substrates include substrates having visible damage (such as cracked, chipped or broken corners and/or edges). In another example, the undesired substrate would include two substrates stacked on top of each other, e.g., a double substrate. The image may be analyzed using a standard picture analysis algorithm or other suitable algorithm to determine whether the substrate 110 is undesirable or suitable for further inspection. In one example, the profile of the substrate 110 is measured and the area of the substrate is calculated from the profile. If the area of the substrate 110 is less than a certain area limit, the substrate is considered broken and is therefore undesirable. If the area of the substrate 110 is greater than a certain area limit, the substrate is considered to be a double substrate and is therefore undesirable.
The controller 190 causes the conveyor inspection system 170 to direct the substrate from the moveable conveyor 202 to the exit conveyor 203 in response to the controller 190 determining that the substrate is desired, or to direct the substrate to the fast conveyor 210 in response to the controller 190 determining that the substrate is undesired. Referring back to the example of fig. 3B, when a substrate 110 is determined to be suitable, the suitable substrate 110 is then transported across the moveable conveyor 202 and the exit conveyor 203 to the modular inspection unit 104.
The movable conveyor 202 is configured to convey the substrate 110 from the entrance conveyor 201 to the exit conveyor 203. The moveable conveyor 202 is configured to convey the substrate 110 at the same speed as the inlet conveyor 201 system and the outlet conveyor 203. Although the moveable conveyor 202 is illustrated as being coplanar with the entrance conveyor 201 and the exit conveyor 203, any suitable arrangement of entrance conveyor, moveable conveyor, and exit conveyor is contemplated in the first orientation of the conveyor inspection system 170. For example, the entrance conveyor 201 and/or the exit conveyor 203 may be disposed at an angle to the moveable conveyor 202, so long as the moveable conveyor 202 is configured to move substrates from the entrance conveyor to the exit conveyor when the conveyor inspection system 170 is in the first orientation.
Fig. 3C illustrates a side plan view of the conveyor inspection system 170 in a second orientation, in accordance with one embodiment. A path of the undesired substrate 111 (e.g., a fragmented substrate determined with the image capture device 250) through the conveyor inspection system 170 in a second orientation is illustrated. In response to the undesired substrate 111 being determined to be undesired, the movable conveyor actuator 209 rotates the movable conveyor 202 in a direction away from the exit conveyor 203. In other words, moveable conveyor actuator 209 rotates moveable conveyor 202 from a position coplanar with exit conveyor 203 to a position below and forming an acute angle with exit conveyor 203.
The fast conveyor 210 is disposed at an acute angle to and below the mobile conveyor 202 (when in the first orientation) and at an acute angle to the exit conveyor 203. The fast conveyor 210 may include any suitable device configured to carry substrates across the fast conveyor 210. For example, the fast conveyor 210 may include one or more of belts, rollers, webs, or other devices/mechanisms suitable for transporting substrates through the fast conveyor 210. The fast conveyor 210 may also include a carrier or tray that carries the substrate, where the carrier or tray is moved by a drive mechanism. The fast conveyor 210 may be driven individually.
The fast conveyor 210 includes a plurality of transition devices 211 (e.g., a belt of the fast conveyor or equivalent). A fast conveyor 210 is also provided below the exit conveyor 203. According to one embodiment, transition device 211 includes a plurality of lower belts, and two of the lower belts are on opposite sides of moveable conveyor 202. As shown in fig. 3A, transition device 211 is outside of mobile conveyor 202. However, the transition device 211 may be located anywhere as long as the transition device 211 is positioned to remove the substrate when the conveyor inspection system 170 is oriented in the second orientation. According to one embodiment, transition device 211 is located inside of moveable conveyor 202, and moveable conveyor includes an aperture (not shown) that allows transition device 211 to pass through the aperture when moveable conveyor 202 is moved to the second orientation. Transition device 211 is movable into position from above moveable conveyor 202 such that transition device 211 is positioned to move the substrate in the second orientation.
The movable conveyor 202 rotates so that the undesired substrate 111 disposed in the movable conveyor 202 comes into contact with the translation device (176, shown in fig. 3A) of the fast conveyor 210, thereby transferring the undesired substrate 111 from the movable conveyor 202 to the fast conveyor 210. The fast conveyor 210 then transfers the undesired substrates 111 into a waste bin 240 disposed below the entrance conveyor. Thus, the undesired substrates 111 are removed from the inspection system 100 before the appropriate substrates can be moved to the modular inspection unit 104. Removing the undesired substrate 111 from the inspection system 100 reduces interference with the modular inspection unit 104, thereby reducing cost of ownership.
According to one embodiment, the moveable conveyor 202 is configured to operate at a first speed, the fast conveyor 210 is configured to operate at a second speed, and the second speed is greater than the first speed. The relative first and second speeds are determined at least in part by the size of the substrate 110, the rate of movement of the substrate across the conveyor inspection system 170, and the inter-substrate distance during operation of the conveyor inspection system 170. Generally, the first and second opposing speeds are selected to allow a substrate to be transferred from the mobile conveyor 202 to the fast conveyor 210 and then to the mobile conveyor 202 to return to the first orientation to accept the next substrate 170 traveling across the conveyor inspection system without interrupting the rate at which the substrate travels through the inspection system 100.
The moveable conveyor 202 is generally moveable between a first orientation (e.g., a first position) configured to transfer substrates from the entrance conveyor 201 to the exit conveyor 203 and a second orientation (e.g., a second position) configured to transfer substrates from the entrance conveyor 201 to the fast conveyor 210. As shown in fig. 3B and 3C, the moveable conveyor 202 is pivotable at a first end 230 disposed closer to the entrance conveyor 201. For example, first end 230 is attached to a shaft (not shown) that allows mobile conveyor 202 to pivot about the shaft's axis, thereby allowing the angular orientation of mobile conveyor 202 to be controllably selected. However, in other embodiments, moveable conveyor 202 may pivot about an axis offset from moveable conveyor 202 such that first end 230 moves with the rotation of moveable conveyor 202. In any case, the moveable conveyor 202 rotates and/or moves away from the exit conveyor 203 to allow substrates to be transferred from the moveable conveyor 202 to the fast conveyor 210.
Controller 190 may include or have access to a non-transitory computer-readable medium storing instructions. The non-transitory computer-readable medium storing the instructions may be executed by a processor (e.g., a CPU of controller 190). The instructions are executable by the processor to determine whether the substrate 110 is defective based on the image, in response to the substrate being defective, cause the movable conveyor 202 to move (e.g., rotate) from a first orientation (e.g., the orientation shown in fig. 3B) to a second orientation (e.g., the orientation shown in fig. 3C) when the defective substrate is detected on the movable conveyor 202, which results in the defective substrate being transferred to and carried by the shuttle conveyor 210 into the waste bin 240, and return the movable conveyor 202 to the first orientation before the next substrate arrives on the movable conveyor.
Although the moveable conveyor 202 in the second position is illustrated as being substantially coplanar with the fast conveyor 210, any arrangement of moveable and fast conveyors is contemplated in the second position of the conveyor inspection system 170. For example, the fast conveyor 210 may be disposed at an angle to the moveable conveyor 202, so long as the moveable conveyor 202 is configured to move the substrate from the entrance conveyor to the fast conveyor when the conveyor inspection system 170 is in the second position.
Fig. 4 is a flow diagram of a method 400 for sorting substrates 110 according to one embodiment. Although the method operations are described in conjunction with fig. 3B, 3C, and 4, one skilled in the art will appreciate that the method 400 may be performed using other devices. The method 400 may be stored or accessed by the controller 190 as a computer readable medium containing instructions that, when executed by a processor of the controller 190, cause the inspection system 100 to perform the method 400.
The method 400 begins at operation 410, where a substrate 110 is transported by an entry conveyor, such as the entry conveyor 201 of the conveyor inspection system 170.
At operation 420, an image of the substrate 110 is taken by an image capture device 250, such as a camera. In one example, the entrance conveyor continues to move the substrate 110 while operation 420 is performed.
At operation 430, the image is analyzed to determine whether the substrate 110 is undesirable or suitable for further inspection. A controller, such as controller 190, determines whether the substrate 110 is undesirable or suitable according to predefined criteria, such as by comparing the captured image to a reference image obtained from an image library or derived from an algorithm. Operation 430 includes determining a measured area of the substrate 110 from the image of the substrate and comparing the measured area to a predefined range of acceptable values to determine whether the substrate 110 is not desired or suitable for further inspection.
At operation 440, the substrate 110 is transported to a destination in response to determining whether the substrate is suitable or undesirable. If at operation 430 it is determined that the substrate 110 is suitable for further inspection, the substrate is transported across the moveable conveyor 202, in the first position, across the exit conveyor 203 to the modular inspection unit 104, as shown in FIG. 3B. If it is determined at operation 430 that the substrate is undesirable, the moveable conveyor actuator 209 moves the moveable conveyor 202 having the undesirable substrate disposed thereon in a direction away from the exit conveyor 203 to a second position at which the substrate is transferred from the moveable conveyor 202 to the fast conveyor 210. In one example, the moveable conveyor 202 rotates in a direction away from the exit conveyor 203 and between the fast conveyors 210. The fast conveyor 210 is disposed at an angle to and below the mobile conveyor 202. The movable conveyor 202 rotates so that the undesired substrate 111 comes into contact with the fast conveyor 210, thereby lifting and placing the substrate from the movable conveyor onto the fast conveyor 210. The fast conveyor 210 moves the substrate at a speed greater than the speed at which the substrate moves on the movable conveyor and then transfers the undesired substrate 111 into a waste bin 240 disposed below the entrance conveyor. Once the substrate moving on the fast conveyor 210 is disengaged from the moveable conveyor 202, the moveable conveyor 202 returns to the first orientation in which the moveable conveyor 202 can receive the next substrate from the entrance conveyor 201.
As described above, a conveyor inspection system and a method of sorting substrates are provided. The conveyor inspection system includes a mobile conveyor and a fast conveyor. The movable conveyor is configured to transfer the undesired substrate to the fast conveyor. The method comprises the following steps: determining that an undesired substrate enters the modular inspection unit; transferring the substrate to a fast conveyor in response to determining that the substrate is not expected to enter the modular inspection unit; and transporting the substrate on the fast conveyor.
The conveyor inspection system and method removes substrates from the test system when the substrates first enter the test system, which reduces the time wasted analyzing undesired substrates that will be discarded. In addition, removing undesired substrates may reduce interference with the test system, thereby reducing cost of ownership.
Fig. 5A illustrates a side plan view of the substrate rotator 180 in a first orientation, in accordance with one embodiment. Fig. 5B illustrates a top plan view of the substrate rotator 180 in a first orientation, in accordance with one embodiment. As shown, the substrate rotator 180 includes a rotation device 554 and a support device 550. The support device 550 supports the rotation device 554 as the rotation device rotates.
The substrate rotator 180 includes a body 501 having a first gripper 510 and a second gripper 512 coupled to the body in a manner that allows the grippers 510, 512 to rotate in response to rotation of the body 501. The synchronized relative movement of the grippers 510, 512 and the body 501 may be achieved by using one or more motors, actuators, linkages, belts, gears, combinations thereof or other suitable means. In the examples described below, the synchronous rotation of grippers 510, 512 in response to simultaneous rotation of body 501 may be achieved with a single actuator.
The support device 550 is configured to support the swivel device 554. As shown, support apparatus 550 includes a machine base 587, a stanchion 586, a support bar 585, an overhead support 583, a main actuator 502, a main belt 582, a shaft 557, a vacuum supply tube 581, a vacuum supply 556, and a rotary joint 555. Overhead support 583 is coupled to strut 586 by support rod 585. The stanchion 586 is supported by the machine base 587.
Shaft 557 is coupled to primary actuator 502 by primary band 593. The shaft 557 is retained by one or more bearings 575 that allow the shaft to rotate on a central axis of the shaft 557. The main actuator 502 rotates the shaft 557 via the main band 593. The shaft 557 is disposed in a tunnel (not shown) in the overhead support 583, and the shaft 557 rotates in the tunnel without the overhead support 583 rotating. The shaft 557 extends through the overhead support 583 and into the underlying body 501. The shaft 557 is surrounded by a tube 584. The tube 584 is separated from the shaft 557 by one or more bearings 575.
A vacuum supply 556 is coupled to the first gripper 510 and the second gripper 512 via a vacuum supply tube 581. The vacuum provided by the vacuum source 556 allows the first gripper 510 and the second gripper 512 to pick up the substrate, as described in further detail below. Vacuum supply tube 581 passes through shaft 557 and into body 501 and into first gripper 510 and second gripper 512. In embodiments where the first gripper 510 and the second gripper 512 do not require vacuum to function, the vacuum supply 556 and the vacuum supply tube 581 can be eliminated.
The rotation device 554 is configured to rotate one or more substrates. In the example shown in fig. 5A, the rotational device 554 includes a body 501, a first gear 511, a main gear 590, a first gripper 510, a second gear 513, a second gripper 512, a band 534, a first pinion 531, and a second pinion 532. The primary actuator 502 is configured to rotate the shaft 557, and thus the body 501, about an axis 592. The axis 592 is generally perpendicular to the plane of the conveyor system 114 and substrates moving thereon. The axis 592 is positioned through the center of the body 501.
The body actuator 502 may rotate the body 501 in clockwise and counterclockwise directions. The body actuator 502 is configured to rotate the body 501 about 180 degrees between the first position and the second position. The body actuator 502 is configured to rotate the body 501 clockwise and counterclockwise in an alternating sequence such that the grippers 510, 512 attached to the body 501 are located above the conveyor system 114 and linearly aligned with the conveyor system 114 when the body 501 is in the first position or the second position.
The body 501 is elongated and the body 501 has a first end 551 and a second end 552. The first gripper 510 is coupled to the first end 551 such that the first gripper 510 is rotatable about a first gripper axis 594. Similarly, second gripper 512 is coupled to second end 552 such that second gripper 512 is rotatable about second gripper axis 596. Axes 594, 596 are generally parallel to axis 592, such that as body 501 is rotated by body actuator 502, grippers 510, 512 and their axes 594, 596 rotate laterally about axis 592. First and second pinions 531, 532 are disposed on opposite sides of body actuator 502 and shaft 592. The main gear 590 is rotatably coupled to the main body 501, and the intermediate gear surrounds the shaft 557. The main gear 590 interfaces with a belt 534 with a first and second pinion 531, 532. When the body 501 is rotated by the body actuator 502, the main gear 590 remains stationary relative to the body 501 while the grippers 510, 512 and the pinions 531, 532 are free to rotate laterally with the body 501 about the shaft 557 on the axis 592. As the main body actuator 502 rotates the main body 501, the relative lateral rotation of the gears 531, 532 about the main gear 590 causes the belt 534 to be driven (e.g., advanced) by the main gear 590.
The first gear 511 is disposed at a first end 551 of the body 501. First pinion 531 is connected to first gear 511 by a belt 534. The first gear 511 is coupled to the first holder 510 such that when the first gear 511 rotates in a first direction about the axis 594, the first holder 510 also rotates in the first direction about the axis 594. The second gear 513 is disposed at a second end 552 of the body 501. The second pinion 532 is connected to the second gear 513 by a belt 534. Second gear 513 is coupled to second gripper 512 such that when second gear rotates in a first rotation about axis 596, second gripper 512 also rotates in the first direction about axis 596. Since the band 534 is coupled to the two gears 531, 532, the two grippers 510, 512 rotate simultaneously at a predetermined ratio in response to the grippers 510, 512 simultaneously being rotated laterally about the axis 592 by the body 501.
In one example, the band 534 is laid such that when the body 501 is rotated in one direction, the two grippers 510, 512 are rotated in the opposite direction. In another embodiment, the band 534 is laid out such that when the body 501 is rotated in one direction, the two grippers 510, 512 rotate in the same direction, for example by kinking the band 534 between one of the gears 531, 532 and the main gear 590. Alternatively, the relative direction of simultaneous rotation of the grippers 510, 512 may be selected by using multiple belts, gears, or other mechanisms. In embodiments where grippers 510, 512 rotate in opposite directions simultaneously, substrate rotator 180 is configured such that one gripper rotates 180 degrees more than the other gripper, e.g., 90 degrees more than 270 degrees in response to 180 degrees of rotation of body 501. In embodiments where grippers 510, 512 rotate in the same direction at the same time, substrate rotator 180 is configured such that one gripper rotates the same amount as the other, e.g., both grippers 510, 512 rotate 90 degrees in response to 180 degrees rotation of body 501.
In one example, the body 501 rotates in a first direction to rotate a substrate held in the first gripper 510 to a position closer to the next station 116, while the second gripper 512 without a substrate moves into position to receive the next substrate advancing down the conveyor system 114. As the first gripper rotates in the first direction, the substrate rotates such that one of the trailing edge or the leading edge of the substrate (as oriented in the previous station 116). Thereafter, the second gripper 512 picks up the next substrate advancing down the conveyor system 114, and as the body 501 rotates the second gripper 512 and substrate in the second direction closer to the next station 116, the substrate rotates into the same orientation as the previous substrate was placed back onto the conveyor system 114 by the first gripper 510. Kinking of electrical and fluid conduits within the substrate rotator 180 is substantially eliminated when the body 501 is rotated in first and second opposite directions.
The first and second clampers 510 and 512 are configured to clamp the first and second substrates, respectively. Each gripper 510, 512 may be a suction gripper, an electrostatic chuck (ESC), a gripper, a magnetic gripper, a picker, or other suitable gripper. In one embodiment, each gripper 510, 512 is a bernoulli pickup.
In the example shown in fig. 5B, the gear ratio between the first gear 511 and the main gear 590 is 2:1, such that the first gripper 510 rotates at half the first angle of rotation of the body actuator. For example, if the body actuator 502 rotates the body 501 by about 180 degrees, the first gripper 510 rotates by about 90 degrees. The gear ratio between the main gear 590 and the second gear 513 is 1:1.5 such that the second gripper 512 rotates two-thirds of the first angle of rotation of the body 501. For example, if the body actuator 502 rotates the body 501 by about 180 degrees, the second gripper 512 rotates by about 270 degrees.
Although fig. 5A to 5F show the first gripper 510 and the second gripper 512 coupled to the body actuator 502 by the belt 534 and the gears 511, 513, 531, 532, 590, other coupling means may be used. For example, the gears 511, 513 are directly coupled to the main gear 590. In other examples, a linkage may couple the body actuator 502 to the first gripper 510 and the second gripper 512. In another example, a separate actuator (not shown) is coupled to the first gripper 510 and the second gripper 512 and rotates independently of the body actuator 502.
FIG. 6 is a flow diagram of a method 600 for performing metrology on a substrate, according to one embodiment. Although the method operations are described in conjunction with fig. 5A-5F and 6, persons of ordinary skill in the art will understand that any system configured to perform the method operations in any order is within the scope of the embodiments described herein. The method 600 may be stored or accessed by the controller 190 as a computer readable medium containing instructions that, when executed by a processor of the controller 190, cause the inspection system 100 to perform the method 600.
The method 600 begins at operation 610, where metrology is performed on a first set of sides of a substrate, such as a first set of sides 520FS of a first substrate 520. Metering may be performed at metering station 116D. The metrology station 116D includes CSI, and as the substrate passes through the metrology station 116D, the CSI images the first set of sides 520FS of the first substrate 520 to inspect the first set of sides of the substrate for chips, cracks, or other defects. According to one embodiment, the first set of sides 520FS of the first substrate 520 is parallel to the direction of downward movement of the substrate along the conveyor system 114.
In operation 615, metrology is performed on the first set of sides 521S of the second substrate 521. Metering may be performed at metering station 116D. The metrology station 116D includes CSI, and as the second substrate passes through the metrology station 116D, the CSI images the first set of sides 521FS of the second substrate 521 to inspect the first set of sides of the substrate for chips, cracks, or other defects. According to one embodiment, the first set of sides 521FS of the second substrate 521 is parallel to the direction of downward movement of the substrate along the conveyor system 114.
At operation 620, the first substrate 520 is rotated by a first angle such that the second set of sides 520SS of the first substrate is in the same orientation as the first set of sides 520FS prior to rotating the first substrate. The substrate 520 may be picked from a location upstream of the conveyor system 114. According to one embodiment, the first substrate 520 is square and the first angle is about 90 degrees. According to one embodiment, the conveyor system 114 may stop and the first substrate 520 may rotate while stationary. The conveyor system 114 may move as the first substrate 520 rotates, but this requires the first substrate 520 to be placed further down the conveyor system 114 when the rotation is complete. If the first substrate 520 is not placed further below the conveyor system 114, the substrate 520 may be undesirably placed on another substrate.
In some embodiments, operation 620 is performed by the substrate rotator 180. Fig. 5A and 5B illustrate the substrate rotator 180 in a first orientation, wherein the substrate rotator grasps the first substrate 520 with the first gripper 510. According to one embodiment, the first substrate 520 is rotated about 90 degrees around the centerline of the first substrate while the first substrate is rotated 180 degrees laterally in the first direction. According to one embodiment, the first substrate 520 is rotated about 270 degrees around the centerline of the first substrate while the first substrate is rotated 180 degrees laterally in the first direction. In either case, the first substrate 520 is rotated such that the second group side 520SS is disposed in the same facing direction as the first group side 520 FS. In embodiments where the first gripper 510 and the second gripper 512 are bernoulli pickers, the first substrate 520 is picked by the first gripper 510 without the first gripper moving in the z-direction (e.g., away from the surface of the conveyor system 114 and/or away from the top surface of the first substrate 520). The bernoulli pickup uses vacuum to attract and grasp the first substrate 520, and thus movement of the first gripper 510 in the z direction is not necessary. According to one embodiment, the second substrate 521 continues to move down the conveyor system 114 and, thus, the picked-up first substrate 520 partially overlaps the second substrate 521 prior to rotation of the substrate rotator 180.
Fig. 5C illustrates a side plan view of the substrate rotator 180 in a second orientation, in accordance with one embodiment. Fig. 5D illustrates a top plan view of the substrate rotator 180 in a second orientation, in accordance with one embodiment. In this embodiment, the second orientation illustrates the substrate rotator 180 rotated approximately 180 ° relative to the first orientation. If the gear ratio between the first gear 511 and the gear of the body actuator 502 is 2:1, the first clamper 510 also rotates by about 90 degrees. The substrate 520 is rotated a total of 180 +90 degrees to 270 degrees relative to the original orientation of the substrate. Thus, the first set of sides 520FS is perpendicular to the direction of the downward movement of the substrate 520 down the conveyor system 114. Additionally, the second set of sides 520SS is parallel to the direction in which the second substrate 521 moves down the conveyor system 114. Finally, the length of the body 501 and the rotational speed of the body actuator 502 may be selected so that the substrate 520 is placed at the correct distance below the conveyor system 114 to maintain adequate substrate spacing. The substrate 520 continues to move down the conveyor system 114 to the metering station 116E.
Additionally, fig. 5C and 5D illustrate the second gripper 512 grasping the second substrate 521, wherein the first set of sides 521FS of the second substrate is parallel to the direction of the downward movement of the substrate along the conveyor system 114. The second substrate 521 may be picked up from a location upstream of the conveyor system 114. The second gripper 512 also allows the second substrate 521 to rotate, as described further below. Grasping the second substrate 521 increases the efficiency of the method by doubling the number of substrates reoriented within the same time frame. According to one embodiment, the second substrate 521 is rotated about-270 degrees about a centerline of the second substrate while laterally rotating the second substrate 180 degrees in a direction opposite to the first direction. According to one embodiment, the second substrate 521 is rotated about-90 degrees about a centerline of the second substrate while the second substrate is laterally rotated 180 degrees in a direction opposite to the first direction. In either case, the second substrate 521 is rotated such that the second set of sides 521SS is disposed in the same facing direction as the first set of sides 521 FS. In embodiments where the first gripper 510 and the second gripper 512 are bernoulli pickers, the second substrate 521 is picked by the second gripper 512 without movement of the second gripper in the z-direction (e.g., away from the surface of the conveyor system 114). The bernoulli pickup uses vacuum to attract and grasp the second substrate 521, and thus movement of the second gripper 512 in the z direction is not necessary. In addition, when the vacuum in the bernoulli pickup decreases, the first substrate 520 falls onto the conveyor system 114 without the bernoulli pickup moving in the z-direction.
At operation 625, the second substrate 521 is rotated a second angle such that the second set of sides 521SS of the second substrate is in the same orientation as the first set of sides 521FS prior to rotating the second substrate. According to one embodiment, the second substrate 521 is square and the second angle is about 270 °. According to one embodiment, the conveyor system 114 may stop and the second substrate 521 may rotate while stationary. The conveyor system 114 may move as the second substrate 521 rotates, but this requires the second substrate 521 to be placed further below the conveyor system 114 when the rotation is complete. If the second substrate 521 is not placed further below the conveyor system 114, the second substrate 521 may be undesirably placed on another substrate.
Fig. 5E illustrates a side plan view of the substrate rotator 180 in a third orientation, in accordance with one embodiment. Fig. 5F illustrates a top plan view of the substrate rotator 180 in a third orientation, in accordance with one embodiment. In this embodiment, the third orientation illustrates the substrate rotator 180 rotated approximately-180 degrees relative to the second orientation. Thus, the third orientation of the substrate rotator 180 is similar to the first orientation.
If the gear ratio between second gear 513 and the gear of body actuator 502 is 3:2, second gripper 512 also rotates about-270 degrees. The second substrate 521 is co-rotated 180-270-90-270 degrees with respect to the original orientation of the second substrate. Thus, the second set of sides 521FS is perpendicular to the direction of downward movement of the second substrate 521 along the conveyor system 114. Additionally, the second set of sides 521SS is parallel to the direction in which the second substrate 521 moves down the conveyor system 114. Finally, the first and second substrates 520 and 521 are oriented the same, e.g., rotated 270 degrees relative to the original orientation of the first and second substrates 520 and 521.
At operation 630, metrology is performed on a second set of sides of the substrate (such as the second set of sides 520SS of the first substrate 520). Metering may be performed at metering station 116E. The metrology station 116E includes CSI, and as the substrate passes through the metrology station 116E, the CSI images the second set of sides 520SS of the first substrate 520 to inspect the first set of sides of the substrate for chips, cracks, or other defects. According to one embodiment, the second set of sides 520SS of the first substrate 520 is parallel to the direction of downward movement of the substrate along the conveyor system 114. Thus, the method 600 results in the metering of multiple sets of sides 520FS, 520SS of the first substrate 520.
At operation 635, metrology is performed on the second set of sides 521SS of the second substrate 521. Metering may be performed at metering station 116E. The metrology station 116E includes CSI, and as the substrate passes through the metrology station 116E, the CSI images the second set of sides 521SS of the second substrate 521 to inspect for chips, cracks, or other defects on the first set of sides of the substrate. According to one embodiment, the second set of sides 521SS of the second substrate 521 is parallel to the direction of downward movement of the substrate along the conveyor system 114. Thus, the method 600 results in metrology of multiple sets of sides 521FS, 521SS of the second substrate 521.
In one example, the body 501 is rotated in a first direction in one step and the body is rotated in the opposite direction in a second step. Fig. 7A illustrates a schematic view of a body 501 rotating in a first direction according to one embodiment. Fig. 7A illustrates the same motion that exists between fig. 5B and 5D. The body 501 rotates in a first direction (indicated by arrow 701). The first gripper rotates in the same direction (indicated by arrow 702) as the first direction of the body 501. The second gripper rotates in a direction (indicated by arrow 703) opposite to the first direction of the body 501. For example, the body 501 is rotated 180 degrees in the first direction, the first gripper is rotated 90 degrees in the first direction, and the second gripper is rotated-270 degrees in the first direction.
Fig. 7B illustrates a schematic view of the body 501 rotated in a second direction according to an embodiment. Fig. 7B illustrates the same motion that exists between fig. 5D and 5F. The body 501 rotates in a second direction (indicated by arrow 701). The second direction is opposite to the first direction. The first gripper rotates in the same direction (indicated by arrow 702) as the second direction of the body 501. The second gripper rotates in a direction (indicated by arrow 703) opposite to the second direction of the body 501. For example, the body 501 is rotated 180 degrees in the second direction, the first gripper is rotated 90 degrees in the second direction, and the second gripper is rotated-270 degrees in the second direction. Thus, the body 501 and the first and second grippers end in the same direction as they started. The movement of the body 501 shown in fig. 7A, 7B may use an actuator (e.g., the primary actuator 502) that rotates only 180 degrees, rather than having to rotate the entire 360 degrees.
In another example, the body 501 is rotated in a first direction in one step and the body is rotated in the same direction in a second step. Fig. 7C illustrates a schematic view of the body 501 rotated in a first direction according to an embodiment. The body 501 rotates in a first direction (indicated by arrow 701).
The first gripper rotates in the same direction (indicated by arrow 702) as the first direction of the body 501.
The second gripper rotates in the same direction as the first direction of the body 501 (indicated by arrow 703). For example, the body 501 is rotated 180 degrees in the first direction, the first gripper is rotated 90 degrees in the first direction, and the second gripper is rotated 270 degrees in the first direction.
Fig. 7D illustrates a schematic view of the body 501 rotated in a second direction according to an embodiment. The body 501 rotates in a second direction (indicated by arrow 701). The first gripper rotates in the same direction (indicated by arrow 702) as the first direction of the body 501. The second gripper rotates in the same direction as the first direction of the body 501 (indicated by arrow 703). For example, the body 501 is rotated 180 degrees in the second direction, the first gripper is rotated 90 degrees in the second direction, and the second gripper is rotated 270 degrees in the second direction. Thus, the body 501 and the first and second grippers end in the same direction as they started. The movement of the body 501 shown in fig. 7C, 7D may use an actuator (e.g., the main actuator 502) that rotates in one direction, and does not have to rotate backwards.
Those skilled in the art will appreciate that the foregoing examples are illustrative and not limiting. It is intended that all substitutions, additions, equivalents and improvements thereto that will become apparent to those skilled in the art upon a reading of the specification and a study of the drawings are included within the true spirit and scope of the disclosure. It is therefore intended that the following appended claims include all such modifications, permutations and equivalents as fall within the true spirit and scope of these teachings.

Claims (20)

1. A conveyor inspection system comprising:
an inlet conveyor;
a moveable conveyor positioned to receive substrates from the entrance conveyor;
a fast conveyor disposed below the moveable conveyor;
an image capture device positioned to obtain an image of the substrate disposed on the entrance conveyor; and
an illumination source, wherein the illumination source is configured to emit illumination light onto the entrance conveyor in a field of view of the image capture device.
2. The conveyor inspection system of claim 1, further comprising an exit conveyor positioned to receive the substrate from the movable conveyor.
3. The conveyor inspection system of claim 2, further comprising a fast conveyor actuator configured to rotate the moveable conveyor a first angle relative to the exit conveyor.
4. The conveyor inspection system of claim 3, wherein the first angle is an acute angle.
5. The conveyor inspection system of claim 3, further comprising a waste bin.
6. A conveyor inspection system according to claim 5, wherein the fast conveyor is positioned to move the substrate to the waste bin.
7. The conveyor inspection system of claim 6, further comprising a controller configured to control the fast conveyor actuator.
8. The conveyor inspection system of claim 7, wherein the controller is configured to analyze the image and rotate the moveable conveyor in response to the image.
9. The conveyor inspection system of claim 8, wherein the controller is configured to analyze the image based on a measured area of the substrate in the image.
10. A conveyor inspection system comprising:
an inlet conveyor;
a moveable conveyor positioned to receive substrates from the entrance conveyor; and
a fast conveyor disposed below the movable conveyor, wherein
The moveable conveyor is configured to run at a first speed,
the fast conveyor is configured to run at a second speed, and
the second speed is greater than the first speed.
11. A conveyor inspection system as in claim 10 wherein the fast conveyor includes a plurality of translation devices configured to operate at the second speed.
12. The conveyor inspection system of claim 11, wherein
A first translation device of the plurality of translation devices is disposed on a first side of the moveable conveyor,
a second translation device of the plurality of translation devices is disposed on a second side of the moveable conveyor, and
the first side is opposite the second side.
13. The conveyor inspection system of claim 10, further comprising:
a controller; and
a movable conveyor actuator configured to rotate the movable conveyor, the movable conveyor actuator being controlled by the controller.
14. The conveyor inspection system of claim 13, wherein the moveable conveyor actuator is disposed at a first end of the moveable conveyor, and the first end is disposed proximate the entrance conveyor.
15. A method of sorting a substrate, comprising:
transporting the substrate on an entrance conveyor at a first speed;
determining that the substrate not expected to be transported on the entrance conveyor enters a modular inspection unit;
transferring the substrate to a fast conveyor in response to determining that the substrate is not expected to enter the modular inspection unit; and
transporting the substrate on the fast conveyor at a second speed greater than the first speed.
16. The method of claim 15, wherein determining the substrate that is not expected to be transported on the entrance conveyor comprises analyzing an image of the substrate taken by an image capture device.
17. The method of claim 16, wherein the analyzing the image of the substrate comprises:
determining a measured area of the substrate in the image of the substrate; and
the measured area is compared to a range of acceptable values.
18. The method of claim 15, wherein the transporting the substrate on the entrance conveyor comprises transferring the substrate to a movable conveyor, and the transferring the substrate to the fast conveyor comprises transporting the substrate from the movable conveyor.
19. The method of claim 18, wherein transferring the substrate to the fast conveyor further comprises rotating the moveable conveyor.
20. The method of claim 15, further comprising:
transporting the substrate to a waste bin.
CN202080066651.4A 2019-09-30 2020-09-01 Conveyor inspection system, substrate rotator, and test system having the conveyor inspection system and substrate rotator Pending CN114424330A (en)

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US201962908259P 2019-09-30 2019-09-30
US62/908,259 2019-09-30
US16/712,969 US10937683B1 (en) 2019-09-30 2019-12-12 Conveyor inspection system, substrate rotator, and test system having the same
US16/712,969 2019-12-12
PCT/US2020/048928 WO2021066984A1 (en) 2019-09-30 2020-09-01 Conveyor inspection system, substrate rotator, and test system having the same

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