CN114401586B - SMT template preparation method - Google Patents
SMT template preparation method Download PDFInfo
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- CN114401586B CN114401586B CN202210119244.6A CN202210119244A CN114401586B CN 114401586 B CN114401586 B CN 114401586B CN 202210119244 A CN202210119244 A CN 202210119244A CN 114401586 B CN114401586 B CN 114401586B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 142
- 238000004140 cleaning Methods 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000005530 etching Methods 0.000 claims abstract description 28
- 238000005520 cutting process Methods 0.000 claims abstract description 20
- 238000005260 corrosion Methods 0.000 claims abstract description 16
- 238000010147 laser engraving Methods 0.000 claims abstract description 15
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 30
- 238000005498 polishing Methods 0.000 claims description 22
- 238000003698 laser cutting Methods 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000012459 cleaning agent Substances 0.000 claims description 12
- 229910001294 Reinforcing steel Inorganic materials 0.000 claims description 10
- 239000010935 stainless steel Substances 0.000 claims description 10
- 229910001220 stainless steel Inorganic materials 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 7
- 229910001369 Brass Inorganic materials 0.000 claims description 6
- 239000010951 brass Substances 0.000 claims description 6
- 238000009432 framing Methods 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 230000002787 reinforcement Effects 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 239000002313 adhesive film Substances 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 description 11
- 239000010959 steel Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000000227 grinding Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 4
- 238000011010 flushing procedure Methods 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Printing Plates And Materials Therefor (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a preparation method of an SMT template, which relates to the technical field of SMT templates and comprises the following steps: s1: selecting a metal plate with proper thickness, cutting the metal plate by using a cutting machine to form a metal sheet with proper size and shape, and obtaining a substrate for standby; s2: and placing the substrate in an ultrasonic cleaner, and performing ultrasonic cleaning to obtain a pretreated substrate. According to the invention, the substrate is cut to form a proper size and shape, then ultrasonic cleaning is carried out, after cleaning, an anti-corrosion film is stuck on the surface of the substrate, then the film is burnt and removed by a laser engraving machine according to a preset shape, so that the film is hollowed out into a proper shape, then the substrate can be etched by an etching machine, so that the surface of the substrate forms a concave step and a convex step.
Description
Technical Field
The invention relates to the technical field of SMT templates, in particular to a preparation method of an SMT template.
Background
The main function of the SMT template is to assist in depositing solder paste, the accurate amount of material can be transferred to the accurate position on the PCB board through the opening on the template, so that subsequent processing is facilitated, the concave or convex steps on the template can increase or reduce the amount of solder paste deposited on the PCB board, therefore, most of template surfaces can be provided with concave or convex steps at preset positions, but the template often forms a photographic plate on the surface of a steel substrate in the processing process of carrying out surface steps, patterns are transferred to two sides of a steel plate, the two sides of the steel plate are transferred and accurately positioned by process pins, resist film patterns are formed through pattern exposure and development, then the steel plate with the two sides having the resist film patterns is put into chemical liquid for corrosion forming, the process operation is complicated, long time is required to be spent, and good processing and using effects are difficult to achieve.
Chinese patent No. CN104760404a discloses a process for producing SMT printing templates, which includes chemical etching, laser cutting, electroforming, mixing and template forming, the chemical etching process is to transfer patterns to two sides of a steel plate by photo-plate making, the two sides of the steel plate are transferred and precisely positioned by process pins, the patterns are exposed and developed, more importantly, the thermal expansion coefficient is very matched with that of stainless steel sheet and aluminum alloy frame, and the process is especially suitable for the high temperature/high pressure and ultrasonic impact of increasingly popular template automatic cleaning machine in the cleaning process, but the pattern exposure and development are adopted, the mode of forming resist film patterns is complex in operation and needs improvement.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a preparation method of an SMT template.
In order to achieve the above purpose, the present invention adopts the following technical scheme: a method for preparing an SMT template comprising the steps of:
s1: selecting a metal plate with proper thickness, cutting the metal plate by using a cutting machine to form a metal sheet with proper size and shape, and obtaining a substrate for standby;
s2: placing the substrate in an ultrasonic cleaner, and performing ultrasonic cleaning to obtain a pretreated substrate;
s3: sticking an anti-corrosion film on the surface of a substrate, placing the substrate with the film under a laser engraving machine, and performing laser burning removal on the film according to a step concave area reserved on a circuit board through the laser engraving machine, so that the film is hollowed out into a proper shape without damaging the substrate;
s4: then placing the substrate in an etching machine for etching treatment, and etching the hollowed-out part of the surface film of the substrate to form a concave and convex step corresponding to the circuit board on the surface of the substrate, wherein the thickness of the concave and convex step is 0.03-0.08mm;
s5: tearing off the anti-corrosion film on the surface of the substrate, tightening the substrate, placing the tightened substrate on a laser cutting base, and cutting the part of the surface of the substrate, which needs to be opened, by a laser cutting machine to obtain an opening substrate;
s6: welding reinforcing steel bars on the surfaces of the substrates at proper positions outside the openings and outside the etching steps, performing reinforcement treatment, polishing the opening substrates through a polishing machine, and obtaining polished substrates after the treatment is completed;
s7: and (3) cleaning the polished substrate by using an ultrasonic cleaner, and after the cleaning, framing the substrate by using an aluminum alloy frame according to the proper direction to obtain the finished SMT template.
In order to provide the substrate with good strength, the improvement of the present invention is that the metal plate in the step S1 is made of one of nickel, brass and stainless steel, and preferably made of stainless steel.
In order to facilitate the processing of the substrate, the improvement of the invention is that the thickness of the metal plate in the step S1 is 0.2-0.3mm.
In order to make the opening easy to release solder paste, the improvement of the invention is that the opening in the step S5 is one of rectangular, square and circular.
In order to enable the solder paste to easily move out of the opening, the improvement of the invention is that the type of the opening wall in the step S5 is one of a vertical opening or a horn opening.
In order to achieve a better polishing effect on the opening, the improvement of the invention is that the polishing machine used in the step S6 is a grinding fluid polishing machine.
In order to achieve a better cleaning effect, the invention is improved in that a cleaning agent is added for cleaning in the ultrasonic cleaning process of the steps S2 and S7, and the cleaning agent is required to be washed 3-5 times after the cleaning is finished.
In order to achieve better reinforcing effect, the improvement of the invention is that the thickness of the reinforced steel bar welded in the step S6 is 0.3-0.4mm.
Compared with the prior art, the invention has the advantages and positive effects that,
according to the invention, the substrate is cut to form a proper size and shape, then ultrasonic cleaning is carried out, after cleaning, an anti-corrosion film is stuck on the surface of the substrate, then the film is burnt and removed by a laser engraving machine according to a preset shape, so that the film is hollowed out into a proper shape, then the substrate can be etched by an etching machine, so that the surface of the substrate forms a concave step and a convex step, the process is simple in operation, the time required by operation is saved, the whole template is easy to produce and manufacture, the film can be torn off, an opening is cut by a laser cutting machine, then a reinforced steel bar is welded, the substrate is prevented from being deformed easily in the subsequent use process, and the substrate is polished, so that solder paste can be released from the opening more easily, and a better use effect is achieved.
Drawings
FIG. 1 is a flow chart showing a method for preparing an SMT template according to the present invention.
Detailed Description
In order that the above objects, features and advantages of the invention will be more clearly understood, a further description of the invention will be rendered by reference to the appended drawings and examples. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.
In the description of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, in the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Referring to fig. 1, the present invention provides a method for preparing an SMT template, comprising the following steps:
s1: selecting a metal plate with proper thickness, cutting the metal plate by using a cutting machine to form a metal sheet with proper size and shape, and obtaining a substrate for standby;
s2: placing the substrate in an ultrasonic cleaner, and performing ultrasonic cleaning to obtain a pretreated substrate;
s3: sticking an anti-corrosion film on the surface of a substrate, placing the substrate with the film under a laser engraving machine, and performing laser burning removal on the film according to a step concave area reserved on a circuit board through the laser engraving machine, so that the film is hollowed out into a proper shape without damaging the substrate;
s4: then placing the substrate in an etching machine for etching treatment, and etching the hollowed-out part of the surface film of the substrate to form a concave and convex step corresponding to the circuit board on the surface of the substrate, wherein the thickness of the concave and convex step is 0.03-0.08mm;
s5: tearing off the anti-corrosion film on the surface of the substrate, tightening the substrate, placing the tightened substrate on a laser cutting base, and cutting the part of the surface of the substrate, which needs to be opened, by a laser cutting machine to obtain an opening substrate;
s6: welding reinforcing steel bars on the surfaces of the substrates at proper positions outside the openings and outside the etching steps, performing reinforcement treatment, polishing the opening substrates through a polishing machine, and obtaining polished substrates after the treatment is completed;
s7: and (3) cleaning the polished substrate by using an ultrasonic cleaner, and after the cleaning, framing the substrate by using an aluminum alloy frame according to the proper direction to obtain the finished SMT template.
The metal plate in the step S1 is made of one of nickel, brass and stainless steel, preferably made of stainless steel, the nickel, the brass and the stainless steel have good strength, but the stainless steel template is superior to a brass template in terms of hardness, stress bearing, etching quality, printing effect, service life and the like, and the nickel electroforming die is highest in price, so that the stainless steel template is preferably used, the thickness of the metal plate in the step S1 is 0.2-0.3mm, the opening in the step S5 is one of rectangle, square and round, the rectangular opening has better demolding efficiency than the square and round opening, the solder paste is released smoothly when the opening is vertical or the horn mouth is downward so as to achieve better use effect, the polishing machine used in the step S6 is a grinding fluid polishing machine, and the grinding fluid polishing machine can have good polishing effect on the opening so that the release is smooth so as to achieve better use effect of the solder paste.
In the ultrasonic cleaning process of the steps S2 and S7, cleaning agents are required to be added for cleaning, after the cleaning is finished, cleaning water is required to be used for washing for 3-5 times, the cleaning agents can remove oil on the surface of the substrate so as to facilitate subsequent processing of the substrate, the thickness of the reinforced steel bar welded in the step S6 is 0.3-0.4mm, the strength of the substrate can be improved by the reinforced steel bar, the substrate is prevented from being easily deformed, and the substrate can have longer service life.
Example 1
A method for preparing an SMT template comprising the steps of:
s1: selecting a metal plate with proper thickness, wherein the metal plate is made of nickel, the thickness of the metal plate is 0.25mm, and cutting the metal plate by using a cutting machine to form a metal sheet with proper size and shape, so that a substrate can be obtained for standby;
s2: placing the substrate in an ultrasonic cleaner for ultrasonic cleaning, adding a cleaning agent in the cleaning process, and washing the substrate with clear water for 4 times after the cleaning is finished to obtain a pretreated substrate;
s3: sticking an anti-corrosion film on the surface of a substrate, placing the substrate with the film under a laser engraving machine, and performing laser burning removal on the film according to a step concave area reserved on a circuit board through the laser engraving machine, so that the film is hollowed out into a proper shape without damaging the substrate;
s4: then placing the substrate in an etching machine, performing etching treatment, and etching the hollowed-out part of the surface film of the substrate to form a concave and convex step corresponding to the circuit board on the surface of the substrate, wherein the thickness of the concave and convex step is 0.05mm;
s5: tearing off the anti-corrosion adhesive film on the surface of the substrate, tightening the substrate, placing the tightened substrate on a laser cutting base, and cutting the part of the surface of the substrate, which needs to be opened, by a laser cutting machine, wherein the opening is rectangular in shape and the opening wall is vertical in type, so that an opening substrate is obtained;
s6: welding reinforcing steel bars on the surfaces of the substrates at proper positions outside the openings and outside the etching steps, performing reinforcement treatment, wherein the thickness of the reinforcing steel bars is 0.35mm, and then polishing the opening substrates through a grinding fluid polishing machine to obtain polished substrates after the treatment is completed;
s7: and (3) cleaning the polished substrate by using an ultrasonic cleaner, adding a cleaning agent in the cleaning process, flushing 3 times by using clear water after the cleaning is finished, and framing the substrate by using an aluminum alloy frame in a proper direction after the treatment is finished, so that the finished SMT template can be obtained.
Example two
A method for preparing an SMT template comprising the steps of:
s1: selecting a metal plate with proper thickness, wherein the metal plate is made of brass, the thickness of the metal plate is 0.22mm, and cutting the metal plate by using a cutting machine to form a metal sheet with proper size and shape, so that a substrate can be obtained for standby;
s2: placing the substrate in an ultrasonic cleaner for ultrasonic cleaning, adding a cleaning agent in the cleaning process, and washing 3 times by using clear water after the cleaning is finished, so as to obtain a pretreated substrate after the cleaning;
s3: sticking an anti-corrosion film on the surface of a substrate, placing the substrate with the film under a laser engraving machine, and performing laser burning removal on the film according to a step concave area reserved on a circuit board through the laser engraving machine, so that the film is hollowed out into a proper shape without damaging the substrate;
s4: then placing the substrate in an etching machine, performing etching treatment, and etching the hollowed-out part of the surface film of the substrate to form a concave and convex step corresponding to the circuit board on the surface of the substrate, wherein the thickness of the concave and convex step is 0.04mm;
s5: tearing off the anti-corrosion adhesive film on the surface of the substrate, tightening the substrate, placing the tightened substrate on a laser cutting base, cutting the part of the surface of the substrate, which needs to be opened, by a laser cutting machine, wherein the opening is square in shape, and the opening wall is vertical in type, so that an opening substrate is obtained;
s6: welding reinforcing steel bars on the surfaces of the substrates at proper positions outside the openings and outside the etching steps, performing reinforcement treatment, wherein the thickness of the reinforcing steel bars is 0.36mm, and then polishing the opening substrates through a grinding fluid polishing machine to obtain polished substrates after the treatment is completed;
s7: and (3) cleaning the polished substrate by using an ultrasonic cleaner, adding a cleaning agent in the cleaning process, flushing for 4 times by using clear water after the cleaning is finished, and framing the substrate by using an aluminum alloy frame in a proper direction after the treatment is finished, so that the finished SMT template can be obtained.
Example III
A method for preparing an SMT template comprising the steps of:
s1: selecting a metal plate with proper thickness, wherein the metal plate is made of stainless steel, the thickness of the metal plate is 0.3mm, and cutting the metal plate by using a cutting machine to form a metal sheet with proper size and shape, so that a substrate can be obtained for standby;
s2: placing the substrate in an ultrasonic cleaner for ultrasonic cleaning, adding a cleaning agent in the cleaning process, and washing with clear water for 5 times after the cleaning is completed to obtain a pretreated substrate;
s3: sticking an anti-corrosion film on the surface of a substrate, placing the substrate with the film under a laser engraving machine, and performing laser burning removal on the film according to a step concave area reserved on a circuit board through the laser engraving machine, so that the film is hollowed out into a proper shape without damaging the substrate;
s4: then placing the substrate in an etching machine, performing etching treatment, and etching the hollowed-out part of the surface film of the substrate to form a concave and convex step corresponding to the circuit board on the surface of the substrate, wherein the thickness of the concave and convex step is 0.06mm;
s5: tearing off the anti-corrosion adhesive film on the surface of the substrate, tightening the substrate, placing the tightened substrate on a laser cutting base, and cutting the part of the surface of the substrate, which needs to be opened, by a laser cutting machine, wherein the opening shape is circular, and the opening wall is vertical, so that an opening substrate is obtained;
s6: welding reinforcing steel bars on the surfaces of the substrates at proper positions outside the openings and outside the etching steps, performing reinforcement treatment, wherein the thickness of the reinforcing steel bars is 0.3mm, and then polishing the opening substrates through a grinding fluid polishing machine to obtain polished substrates after the treatment is completed;
s7: and (3) cleaning the polished substrate by using an ultrasonic cleaner, adding a cleaning agent in the cleaning process, flushing for 4 times by using clear water after the cleaning is finished, and framing the substrate by using an aluminum alloy frame in a proper direction after the treatment is finished, so that the finished SMT template can be obtained.
According to the invention, the substrate is cut to form a proper size and shape, then ultrasonic cleaning is carried out, an anti-corrosion film is stuck on the surface of the substrate after cleaning, then the film is burnt and removed by a laser engraving machine according to a preset shape, so that the film is hollowed out into a proper shape, then the substrate can be etched by an etching machine, so that the surface of the substrate forms a concave step and a convex step, the process is simple in operation, meanwhile, the time required by operation is saved, the whole template is easy to produce and manufacture, the film can be torn off, an opening is cut by a laser cutting machine, then a reinforced steel bar is welded, the substrate is prevented from being deformed easily in the subsequent use process, and the substrate is polished, so that solder paste can be released from the opening more easily, and a better use effect is achieved.
The present invention is not limited to the above embodiments, and any equivalent embodiments which can be changed or modified by the technical disclosure described above can be applied to other fields, but any simple modification, equivalent changes and modification to the above embodiments according to the technical matter of the present invention will still fall within the protection scope of the technical disclosure.
Claims (4)
1. A preparation method of an SMT template is characterized in that: the method comprises the following steps:
s1: selecting a metal plate with a proper thickness, wherein the thickness of the metal plate is 0.2-0.3mm, and cutting the metal plate by using a cutting machine to form a metal sheet with a proper size and shape, so that a substrate can be obtained for standby;
s2: placing the substrate in an ultrasonic cleaner, and performing ultrasonic cleaning to obtain a pretreated substrate;
s3: sticking an anti-corrosion film on the surface of a substrate, placing the substrate with the film under a laser engraving machine, and performing laser burning removal on the film according to a step concave area reserved on a circuit board through the laser engraving machine, so that the film is hollowed out into a proper shape without damaging the substrate;
s4: then placing the substrate in an etching machine for etching treatment, and etching the hollowed-out part of the surface film of the substrate to form a concave and convex step corresponding to the circuit board on the surface of the substrate, wherein the thickness of the concave and convex step is 0.03-0.08mm;
s5: tearing off the anti-corrosion adhesive film on the surface of the substrate, tightening the substrate, placing the tightened substrate on a laser cutting base, and cutting the part of the surface of the substrate, which needs to be opened, by a laser cutting machine, wherein the type of the opening wall is one of a vertical opening or a horn opening, and the opening shape is one of a rectangle, a square and a circle, so that an opening substrate is obtained;
s6: welding reinforcing steel bars on the surfaces of the substrates at proper positions outside the openings and outside the etching steps, wherein the thickness of the welded reinforcing steel bars is 0.3-0.4mm, performing reinforcement treatment, polishing the opening substrates through a polishing machine, and obtaining polished substrates after the treatment is completed;
s7: and (3) cleaning the polished substrate by using an ultrasonic cleaner, and after the cleaning, framing the substrate by using an aluminum alloy frame according to the proper direction to obtain the finished SMT template.
2. The method for preparing an SMT template according to claim 1, wherein: the metal plate in the step S1 is made of one of nickel, brass and stainless steel.
3. The method for preparing an SMT template according to claim 1, wherein: the polishing machine used in the step S6 is a polishing fluid polishing machine.
4. The method for preparing an SMT template according to claim 1, wherein: in the ultrasonic cleaning process of the steps S2 and S7, cleaning agents are required to be added for cleaning, and after the cleaning is finished, the cleaning agents are required to be washed 3-5 times by using clean water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210119244.6A CN114401586B (en) | 2022-02-08 | 2022-02-08 | SMT template preparation method |
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|---|---|---|---|
| CN202210119244.6A CN114401586B (en) | 2022-02-08 | 2022-02-08 | SMT template preparation method |
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| Publication Number | Publication Date |
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| CN114401586A CN114401586A (en) | 2022-04-26 |
| CN114401586B true CN114401586B (en) | 2024-01-30 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102963146A (en) * | 2012-09-29 | 2013-03-13 | 深圳光韵达光电科技股份有限公司 | SMT (surface mounted technology) laser stencil and manufacture method thereof |
| CN103203965A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A hybrid production process for a printing stencil used in surface-mounting technology (SMT) |
| CN103203981A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | SMT (surface mounting technology) template with locating points and manufacturing method thereof |
| CN104837303A (en) * | 2015-04-25 | 2015-08-12 | 桐城运城制版有限公司 | Production technology of printing template |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4147723B2 (en) * | 2000-06-05 | 2008-09-10 | 松下電器産業株式会社 | Printed wiring board |
-
2022
- 2022-02-08 CN CN202210119244.6A patent/CN114401586B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103203965A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A hybrid production process for a printing stencil used in surface-mounting technology (SMT) |
| CN103203981A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | SMT (surface mounting technology) template with locating points and manufacturing method thereof |
| CN102963146A (en) * | 2012-09-29 | 2013-03-13 | 深圳光韵达光电科技股份有限公司 | SMT (surface mounted technology) laser stencil and manufacture method thereof |
| CN104837303A (en) * | 2015-04-25 | 2015-08-12 | 桐城运城制版有限公司 | Production technology of printing template |
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| CN114401586A (en) | 2022-04-26 |
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