CN114345742B - Method, device, equipment and medium for detecting chip mounting position - Google Patents
Method, device, equipment and medium for detecting chip mounting position Download PDFInfo
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Abstract
The invention discloses a method, a device, equipment and a medium for detecting a chip mounting position, wherein the method comprises the following steps: acquiring feedback pressure values received by a chip, wherein the feedback pressure values are resultant forces of stress of the chip in different directions; if the feedback pressure value is greater than or equal to a preset pressure value, acquiring displacement information of the chip under the action of the feedback pressure value; and judging whether the chip mounting position is abnormal or not according to the displacement information. The invention improves the accuracy of detecting the abnormality of the mounting arrival position of the chip.
Description
Technical Field
The present invention relates to the field of computer technologies, and in particular, to a method, an apparatus, a device, and a medium for detecting a chip mounting position.
Background
With the rapid development of the semiconductor industry, the chip size tends to be thinner and weaker, so that the critical requirements on collision protection of devices such as a chip sorter and the like required by chip sealing and testing are met. In order to ensure good contact between the chip pins and the chip pads, the chip sorter and other devices need to exert pressure on the chip surface. Due to the existence of the stacked material and the askew material, the chip is damaged or hidden. The stacking means that the suction nozzle sucks two chips at the same time, and when the suction nozzle falls down, the servo motor moves according to a set position instruction and can collide with the base strongly. The skew material means that when a chip is absorbed by the suction nozzle, the chip deviates at a certain angle on the horizontal plane, and when the chip is carried by the suction nozzle to move downwards, a larger collision force is caused between the chip and the guide groove of the base, so that the chip is damaged or hidden injury is caused.
In the existing scheme, whether the chip is overlapped and askew is judged usually through modes such as motor torque or current feedback. However, the two conditions of stacking and skewing are light collision, so that misjudgment or missed judgment is easy, and quality accidents can be caused after chips circulate to downstream products.
Disclosure of Invention
The invention mainly aims to provide a method, a device, equipment and a medium for detecting a chip mounting position, which aim to solve the problem of how to improve the accuracy of detecting the abnormality of the chip mounting position.
In order to achieve the above object, the present invention provides a method for detecting a chip mounting position, the method for detecting a chip mounting position comprising the steps of:
Acquiring feedback pressure values received by a chip, wherein the feedback pressure values are resultant forces of stress of the chip in different directions;
If the feedback pressure value is greater than or equal to a preset pressure value, acquiring displacement information of the chip under the action of the feedback pressure value;
and judging whether the chip mounting position is abnormal or not according to the displacement information.
In an embodiment, the step of determining whether the chip is abnormal according to the displacement information includes:
Determining the displacement length of the chip according to the displacement information;
if the displacement length is smaller than the preset length, judging that the chip mounting position is abnormal;
And if the displacement length is greater than or equal to the preset length, judging that the chip mounting position is normal.
In an embodiment, after the step of determining that the chip mounting position is abnormal, the method further includes:
And outputting abnormal prompt information, and controlling a cam to reduce the pressure on the chip so that a spring on a chip base lifts the chip away from the chip base.
In an embodiment, before the step of determining that the chip mounting position is abnormal if the displacement length is smaller than a preset length, the method further includes:
acquiring reference displacement information corresponding to the lower surface of the chip under a feedback pressure value;
Determining a reference displacement length according to the reference displacement information;
and taking the difference value obtained by subtracting the thickness tolerance of the chip from the reference displacement length as the preset length.
In one embodiment, the step of obtaining the feedback pressure value received by the chip includes:
acquiring the pressure of a cam on the chip, the spring pressure of a spring on a chip base and a preset friction force;
determining a sum of the spring pressure and the friction force;
and determining the feedback pressure value according to the difference between the pressure of the cam on the chip and the sum value.
In an embodiment, after the step of obtaining the feedback pressure value to which the chip is subjected, the method further includes:
and if the feedback pressure value is smaller than a preset threshold value, the pressure of the control cam on the chip is increased by the preset pressure value until the feedback pressure value is larger than or equal to the preset threshold value.
In an embodiment, the step of obtaining displacement information of the chip under the action of the feedback pressure value includes:
acquiring a rotation angle of a motor or a cam;
And determining the displacement information of the chip according to the rotation angle.
In order to achieve the above object, the present invention also provides a device for detecting a chip mounting position, the device for detecting a chip mounting position including:
the acquisition module is used for acquiring feedback pressure values received by the chip, wherein the feedback pressure values are resultant forces of the stress of the chip in different directions;
The determining module is used for acquiring displacement information of the chip under the action of the feedback pressure value if the feedback pressure value is larger than or equal to a preset pressure value;
And the detection module is used for judging whether the chip mounting position is abnormal or not according to the displacement information.
In order to achieve the above object, the present invention also provides a chip-mounting-position detecting apparatus including a memory, a processor, and a chip-mounting-position detecting program stored in the memory and executable on the processor, the chip-mounting-position detecting program realizing the respective steps of the chip-mounting-position detecting method as described above when executed by the processor.
In order to achieve the above object, the present invention also provides a computer-readable storage medium storing a detection program of a chip mounting position, which when executed by a processor, implements the respective steps of the method of detecting a chip mounting position as described above.
The invention provides a method, a device, equipment and a medium for detecting a chip mounting position, which are used for acquiring feedback pressure values received by a chip, wherein the feedback pressure values are resultant forces of stress of the chip in different directions; if the feedback pressure value is greater than or equal to the preset pressure value, acquiring displacement information of the chip under the action of the feedback pressure value; and judging whether the mounting position of the chip is abnormal or not according to the displacement information. Whether the mounting position of the chip is abnormal or not is judged through the displacement information of the chip under the action of the feedback pressure value, the accuracy of detecting the abnormality of the mounting position of the chip is improved, and the chip is prevented from being damaged or hidden injury.
Drawings
Fig. 1 is a schematic hardware configuration diagram of a chip mounting position detection apparatus according to an embodiment of the present invention;
FIG. 2 is a flowchart of a first embodiment of a method for detecting a chip mounting position according to the present invention;
FIG. 3 is a diagram showing the position information of a chip in the method for detecting the mounting position of the chip according to the present invention;
FIG. 4 is a detailed flowchart of step S30 of the method for detecting the mounting position of the chip according to the second embodiment of the present invention;
fig. 5 is a schematic diagram of a logic structure of a device for detecting a chip mounting position according to the present invention.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The main solutions of the embodiments of the present invention are: acquiring feedback pressure values received by the chip, wherein the feedback pressure values are resultant forces of the stress of the chip in different directions; if the feedback pressure value is greater than or equal to the preset pressure value, acquiring displacement information of the chip under the action of the feedback pressure value; and judging whether the mounting position of the chip is abnormal or not according to the displacement information.
Whether the mounting position of the chip is abnormal or not is judged through the displacement information of the chip under the action of the feedback pressure value, the accuracy of detecting the abnormality of the mounting position of the chip is improved, and the chip is prevented from being damaged or hidden injury.
As an implementation, the device for detecting the chip mounting position may be as shown in fig. 1.
The embodiment of the invention relates to a device for detecting a chip mounting position, which comprises: a processor 101, such as a CPU, a memory 102, and a communication bus 103. Wherein the communication bus 103 is used to enable connected communication among the components.
The memory 102 may be a high-speed RAM memory or a stable memory (non-volatilememory), such as a disk memory. As shown in fig. 1, a detection program of a chip mounting position may be included in a memory 102 as a computer-readable storage medium; and the processor 101 may be configured to call a detection program of the chip mounting position stored in the memory 102 and perform the following operations:
Acquiring feedback pressure values received by a chip, wherein the feedback pressure values are resultant forces of stress of the chip in different directions;
If the feedback pressure value is greater than or equal to a preset pressure value, acquiring displacement information of the chip under the action of the feedback pressure value;
and judging whether the chip mounting position is abnormal or not according to the displacement information.
In one embodiment, the processor 101 may be configured to invoke a detection program of a chip mounting location stored in the memory 102 and perform the following operations:
Determining the displacement length of the chip according to the displacement information;
if the displacement length is smaller than the preset length, judging that the chip mounting position is abnormal;
And if the displacement length is greater than or equal to the preset length, judging that the chip mounting position is normal.
In one embodiment, the processor 101 may be configured to invoke a detection program of a chip mounting location stored in the memory 102 and perform the following operations:
And outputting abnormal prompt information, and controlling a cam to reduce the pressure on the chip so that a spring on a chip base lifts the chip away from the chip base.
In one embodiment, the processor 101 may be configured to invoke a detection program of a chip mounting location stored in the memory 102 and perform the following operations:
acquiring reference displacement information corresponding to the lower surface of the chip under a feedback pressure value;
Determining a reference displacement length according to the reference displacement information;
and taking the difference value obtained by subtracting the thickness tolerance of the chip from the reference displacement length as the preset length.
In one embodiment, the processor 101 may be configured to invoke a detection program of a chip mounting location stored in the memory 102 and perform the following operations:
acquiring the pressure of a cam on the chip, the spring pressure of a spring on a chip base and a preset friction force;
determining a sum of the spring pressure and the friction force;
and determining the feedback pressure value according to the difference between the pressure of the cam on the chip and the sum value.
In one embodiment, the processor 101 may be configured to invoke a detection program of a chip mounting location stored in the memory 102 and perform the following operations:
and if the feedback pressure value is smaller than a preset threshold value, the pressure of the control cam on the chip is increased by the preset pressure value until the feedback pressure value is larger than or equal to the preset threshold value.
In one embodiment, the processor 101 may be configured to invoke a detection program of a chip mounting location stored in the memory 102 and perform the following operations:
acquiring a rotation angle of a motor or a cam;
And determining the displacement information of the chip according to the rotation angle.
Based on the hardware architecture of the device for detecting the chip mounting position, the embodiment of the method for detecting the chip mounting position is provided.
Referring to fig. 2, fig. 2 is a first embodiment of a method for detecting a chip mounting position according to the present invention, the method for detecting a chip mounting position includes the steps of:
step S10, obtaining feedback pressure values received by the chip, wherein the feedback pressure values are resultant forces of the stress of the chip in different directions.
Specifically, the chip handler and other devices need to apply pressure to the chip surface to ensure good contact between the chip pins on the test station and the chip pads. The mechanical structure of the chip sorting machine and other equipment is that a rotary servo motor is directly connected with a cam, the cam adsorbs chips through a suction nozzle, and a guide groove is formed between the chips and a chip base of a testing station so as to facilitate the contact between chip pins and probes of the base. The rotary servo motor controls the cam to move downward to press the chip until the chip is pressed onto the test station base. While during pressing of the chip onto the base of the test station, springs are present to prevent the movable assembly from moving downwards.
The stress of the chip can be downward pressure of the cam on the chip, and the stress of the chip is spring pressure of a spring on the base of the test station, wherein the spring pressure can be obtained by multiplying the elastic coefficient by the deformation quantity. The stress of the chip has friction force, wherein the friction force can be obtained through experiments. If the friction is made small by good machining precision and lubrication measures, it is negligible. The stress of the chip can also be the adsorption force of the suction nozzle and the gravity of the chip, wherein the adsorption force is equal to the gravity of the chip and the directions are opposite. And obtaining a feedback pressure value received by the chip, wherein the feedback pressure value is the resultant force of the stress of the chip in different directions. Acquiring the pressure of a cam on a chip, the spring pressure of a spring on a chip base and a preset friction force; determining a sum of the spring pressure and the friction force; and determining a feedback pressure value according to the difference value of the sum value of the pressure of the cam to the chip. Illustratively, the feedback pressure value is as follows:
Feedback pressure value = pressure of cam against chip-spring pressure-friction;
If the feedback pressure value is smaller than the preset threshold value, the pressure of the control cam on the chip is increased by the preset pressure value until the feedback pressure value is larger than or equal to the preset threshold value, wherein the preset pressure value can be determined by a PWM (Pulse Width Modulation ) mode.
Step S20, if the feedback pressure value is greater than or equal to a preset pressure value, obtaining displacement information of the chip under the action of the feedback pressure value.
Specifically, if the feedback pressure value is greater than or equal to the preset pressure value, the displacement information of the chip under the action of the feedback pressure value is obtained, where the displacement information may include the direction of movement of the chip and the position information of the chip. As shown in fig. 3, C is a chip, D is a suction nozzle, B is positional information that the chip arrives under the effect of a feedback pressure value at a chip mounting position under normal conditions, and a is a contact position of the chip and a chip base. The displacement information may also include a direction of movement of the chip and a distance of movement, wherein the distance of movement may be derived from the positional information of the chip.
The displacement information of the chip under the action of the feedback pressure value is obtained, the displacement information of the chip under the action of the feedback pressure value can be indirectly measured, for example, the rotation angle of a motor or a cam is obtained, and the displacement information of the chip is determined according to the rotation angle; the displacement information of the chip under the action of the feedback pressure value can be directly measured, for example, the position information of the chip is directly measured, and the displacement information is determined according to the position information of the chip.
And step S30, judging whether the chip mounting position is abnormal or not according to the displacement information.
Specifically, the reasons for the abnormality of the chip mounting position are mainly stacking and tilting of the chips, wherein the stacking is that the suction nozzle sucks two chips at the same time, and when the chips fall, if the rotary servo motor moves according to a given position instruction, the chips and the chip base can be caused to collide violently. When the chip is absorbed by the suction nozzle, the chip can deviate at a certain angle on the horizontal plane, so that when the chip is carried by the suction nozzle to move downwards, if the chip moves according to the position instruction at the moment, a larger collision force is generated between the chip and the guide groove of the base, and the chip is damaged or hidden.
Judging whether the mounting position of the chip is abnormal or not according to the displacement information, determining the position information of the chip according to the displacement information, judging whether the chip reaches a preset position or not according to the position information, and judging that the mounting position of the chip is normal when the chip reaches the preset position; when the chip does not reach the preset position, the situation that the chip is overlapped or distorted is indicated, so that the chip cannot reach the preset position, and the abnormal mounting position of the chip is judged.
In the technical scheme of the embodiment, a feedback pressure value of the chip is obtained, wherein the feedback pressure value is the resultant force of the stress of the chip in different directions; if the feedback pressure value is greater than or equal to the preset pressure value, acquiring displacement information of the chip under the action of the feedback pressure value; and judging whether the mounting position of the chip is abnormal or not according to the displacement information. Whether the mounting position of the chip is abnormal or not is judged through the displacement information of the chip under the action of the feedback pressure value, the accuracy of detecting the abnormality of the mounting position of the chip is improved, and the chip is prevented from being damaged or hidden injury.
Referring to fig. 4, fig. 4 is a second embodiment of a method for detecting a chip mounting position according to the present invention, based on the first embodiment, the step S30 includes:
step S31, determining the displacement length of the chip according to the displacement information;
step S32, if the displacement length is smaller than the preset length, judging that the chip mounting position is abnormal;
and step S33, if the displacement length is greater than or equal to the preset length, judging that the chip mounting position is normal.
Specifically, the displacement length of the chip is determined according to the displacement information, and if the displacement information includes the movement direction of the chip and the position information of the chip, the displacement length of the chip is determined according to the position information of the chip and the position information of a preset origin; if the displacement information comprises the movement direction of the chip and the movement distance of the chip, determining the displacement length of the chip according to the position distance of the chip.
Before step S32, acquiring reference displacement information corresponding to the lower surface of the chip under the feedback pressure value; determining a reference displacement length according to the reference displacement information; the difference of the reference displacement length minus the thickness tolerance of the chip is taken as the preset length. For example, as shown in fig. 3, the reference displacement length is shown as a length a, the thickness tolerance of the chip is shown as a length b, and the preset length is the difference between the length b and the length c.
And when the displacement length is smaller than the preset length, the situation that the chip does not reach the preset position and the chip is overlapped or distorted is indicated, and the abnormal mounting position of the chip is judged. And when the displacement length is greater than or equal to the preset length, indicating that the chip reaches the preset position, and judging that the chip mounting position is normal.
After the abnormal mounting position of the chip is judged, outputting abnormal prompt information, and controlling the cam to reduce the pressure on the chip so that the spring on the chip base lifts the chip away from the chip base; or switching off the PWM mode of the rotary servo motor. Thereby protecting the chip in time and avoiding damage or hidden injury.
In the technical scheme of the embodiment, the displacement length of the chip is determined according to the displacement information; if the displacement length is smaller than the preset length, judging that the mounting position of the chip is abnormal; if the displacement length is greater than or equal to the preset length, judging that the chip mounting position is normal. Whether the mounting position of the chip is abnormal or not is judged through the displacement length, the accuracy of detecting the abnormality of the mounting position of the chip is improved, and the chip is prevented from being damaged or hidden injury.
Referring to fig. 5, the present invention provides a chip mounting position detecting apparatus including:
the acquiring module 100 is configured to acquire a feedback pressure value received by a chip, where the feedback pressure value is a resultant force of forces applied to the chip in different directions;
The determining module 200 is configured to obtain displacement information of the chip under the action of the feedback pressure value if the feedback pressure value is greater than or equal to a preset pressure value;
And the detection module 300 is used for judging whether the chip mounting position is abnormal according to the displacement information.
In one embodiment, in determining whether the chip is abnormal according to the displacement information, the detection module 300 is specifically configured to:
Determining the displacement length of the chip according to the displacement information;
if the displacement length is smaller than the preset length, judging that the chip mounting position is abnormal;
And if the displacement length is greater than or equal to the preset length, judging that the chip mounting position is normal.
In one embodiment, after determining that the chip mounting position is abnormal, the detection module 300 is specifically configured to:
And outputting abnormal prompt information, and controlling a cam to reduce the pressure on the chip so that a spring on a chip base lifts the chip away from the chip base.
In one embodiment, before determining that the chip mounting position is abnormal if the displacement length is smaller than a preset length, the detection module 300 is specifically configured to:
acquiring reference displacement information corresponding to the lower surface of the chip under a feedback pressure value;
Determining a reference displacement length according to the reference displacement information;
and taking the difference value obtained by subtracting the thickness tolerance of the chip from the reference displacement length as the preset length.
In one embodiment, in terms of acquiring the feedback pressure value to which the chip is subjected, the acquiring module 100 is specifically configured to:
acquiring the pressure of a cam on the chip, the spring pressure of a spring on a chip base and a preset friction force;
determining a sum of the spring pressure and the friction force;
and determining the feedback pressure value according to the difference between the pressure of the cam on the chip and the sum value.
In one embodiment, after acquiring the feedback pressure value to which the chip is subjected, the acquiring module 100 is specifically configured to:
and if the feedback pressure value is smaller than a preset threshold value, the pressure of the control cam on the chip is increased by the preset pressure value until the feedback pressure value is larger than or equal to the preset threshold value.
In one embodiment, in acquiring displacement information of the chip under the feedback pressure value, the determining module 100 is specifically configured to:
acquiring a rotation angle of a motor or a cam;
And determining the displacement information of the chip according to the rotation angle.
The present invention also provides a chip-mounting-position detecting apparatus including a memory, a processor, and a chip-mounting-position detecting program stored in the memory and executable on the processor, the chip-mounting-position detecting program realizing the steps of the chip-mounting-position detecting method described in the above embodiments when executed by the processor.
The present invention also provides a computer-readable storage medium storing a detection program of a chip mounting position, which when executed by a processor, implements the steps of the method for detecting a chip mounting position according to the above embodiment.
The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, system, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, system, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, system, article, or apparatus that comprises the element.
From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment system may be implemented by means of software plus necessary general purpose hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a computer readable storage medium (e.g. ROM/RAM, magnetic disk, optical disk) as described above, comprising several instructions for causing a terminal device to be tested (which may be a mobile phone, a computer, a parking management device to be tested, an air conditioner, or a network device to be tested, etc.) to execute the system according to the embodiments of the present invention.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (8)
1. The method for detecting the chip mounting position is characterized by comprising the following steps of:
Acquiring feedback pressure values received by a chip, wherein the feedback pressure values are resultant forces of stress of the chip in different directions;
if the feedback pressure value is greater than or equal to a preset pressure value, acquiring displacement information of the chip under the action of the feedback pressure value, wherein the displacement information comprises the movement direction of the chip and the position information of the chip;
judging whether the chip mounting position is abnormal according to the displacement information, including: determining the displacement length of the chip according to the displacement information; acquiring reference displacement information corresponding to the lower surface of the chip under a feedback pressure value; determining a reference displacement length according to the reference displacement information; taking the difference value of the reference displacement length minus the thickness tolerance of the chip as a preset length; if the displacement length is smaller than the preset length, judging that the chip mounting position is abnormal due to the overlapping and the askew of the chips; and if the displacement length is greater than or equal to the preset length, judging that the chip mounting position is normal.
2. The method for detecting a chip mounting position according to claim 1, wherein after the step of determining that the chip mounting position is abnormal, further comprising:
And outputting abnormal prompt information, and controlling a cam to reduce the pressure on the chip so that a spring on a chip base lifts the chip away from the chip base.
3. The method of detecting a chip mounting position according to claim 1, wherein the step of acquiring a feedback pressure value to which the chip is subjected comprises:
acquiring the pressure of a cam on the chip, the spring pressure of a spring on a chip base and a preset friction force;
determining a sum of the spring pressure and the friction force;
and determining the feedback pressure value according to the difference between the pressure of the cam on the chip and the sum value.
4. The method for detecting a mounting position of a chip according to claim 1, wherein after the step of acquiring the feedback pressure value to which the chip is subjected, further comprising:
and if the feedback pressure value is smaller than a preset threshold value, the pressure of the control cam on the chip is increased by the preset pressure value until the feedback pressure value is larger than or equal to the preset threshold value.
5. The method of detecting a chip mounting position according to claim 1, wherein the step of acquiring displacement information of the chip under the action of the feedback pressure value includes:
acquiring a rotation angle of a motor or a cam;
And determining the displacement information of the chip according to the rotation angle.
6. A device for detecting a chip mounting position, characterized in that the device for detecting a chip mounting position comprises:
the acquisition module is used for acquiring feedback pressure values received by the chip, wherein the feedback pressure values are resultant forces of the stress of the chip in different directions;
The determining module is used for acquiring displacement information of the chip under the action of the feedback pressure value if the feedback pressure value is larger than or equal to a preset pressure value, wherein the displacement information comprises the movement direction of the chip and the position information of the chip;
The detection module is used for judging whether the chip mounting position is abnormal according to the displacement information, and comprises the following steps: determining the displacement length of the chip according to the displacement information; acquiring reference displacement information corresponding to the lower surface of the chip under a feedback pressure value; determining a reference displacement length according to the reference displacement information; taking the difference value of the reference displacement length minus the thickness tolerance of the chip as a preset length; if the displacement length is smaller than the preset length, judging that the chip mounting position is abnormal due to the overlapping and the askew of the chips; and if the displacement length is greater than or equal to the preset length, judging that the chip mounting position is normal.
7. A chip-mounting-position detecting apparatus, characterized in that the chip-mounting-position detecting apparatus includes a memory, a processor, and a chip-mounting-position detecting program stored in the memory and executable on the processor, the chip-mounting-position detecting program realizing the respective steps of the chip-mounting-position detecting method according to any one of claims 1 to 5 when executed by the processor.
8. A computer-readable storage medium storing a program for detecting a chip mounting position, which when executed by a processor, implements the respective steps of the method for detecting a chip mounting position according to any one of claims 1 to 5.
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| CN116007686A (en) * | 2023-03-28 | 2023-04-25 | 四川华鲲振宇智能科技有限责任公司 | AI processing chip quality monitoring method, equipment and system |
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| JP2001196794A (en) * | 2000-01-11 | 2001-07-19 | Matsushita Electric Ind Co Ltd | Method and device for mounting component |
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| JPH06224598A (en) * | 1993-01-22 | 1994-08-12 | Juki Corp | Method for detecting height of mounting position in chip device mounting apparatus |
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