CN114308577A - Novel semiconductor dispensing processing method - Google Patents
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- CN114308577A CN114308577A CN202111651013.1A CN202111651013A CN114308577A CN 114308577 A CN114308577 A CN 114308577A CN 202111651013 A CN202111651013 A CN 202111651013A CN 114308577 A CN114308577 A CN 114308577A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000003672 processing method Methods 0.000 title claims description 18
- 238000012360 testing method Methods 0.000 claims abstract description 42
- 239000003292 glue Substances 0.000 claims abstract description 23
- 238000004140 cleaning Methods 0.000 claims abstract description 21
- 238000004381 surface treatment Methods 0.000 claims abstract description 11
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 9
- 238000002360 preparation method Methods 0.000 claims abstract description 8
- 238000001514 detection method Methods 0.000 claims abstract description 7
- 238000005070 sampling Methods 0.000 claims abstract description 7
- 238000007493 shaping process Methods 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 27
- 238000005516 engineering process Methods 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 description 7
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
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Abstract
The invention relates to the technical field of dispensing processing technology, in particular to a novel semiconductor dispensing processing technology method, which comprises the following steps of S1: a preparation stage, filling glue into a charging barrel of a dispenser, preparing a plurality of groups of dispensing test samples, and cleaning the surfaces of the dispensing test samples; s2: dispensing a sample, and correcting parameters of a dispenser; 3: dispensing the product, namely conveying the product to a dispensing position of a dispenser for dispensing to obtain a finished product; s4: and (5) detecting and warehousing, performing sectional sampling detection on the finished product obtained after the point gluing is finished, and warehousing and storing after the quality is qualified. According to the invention, in the traditional semiconductor dispensing processing technology, the processes of testing sample dispensing and product surface treatment are added, so that the staff can be helped to realize more accurate adjustment on the whole dispensing technological parameter, and meanwhile, the surface treatment is carried out on the product by the plasma cleaning machine before dispensing, so that the dirt on the surface of the product can be cleaned to a great extent, and the dispensing quality is greatly improved.
Description
Technical Field
The invention relates to the technical field of dispensing processing technologies, in particular to a novel semiconductor dispensing processing technology method.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has application in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, and the glue dispensing is an important step in the production and preparation process of the semiconductor, which is directly related to the use effect of the whole semiconductor.
Chinese patent No. CN110833977A discloses a dispensing method, which mainly solves the problems that the amount of glue of the current dispensing machine is not enough, and the theoretical glue output amount of the common dispensing machine is deviated from the actual glue output amount, so that the dispensing machine is not enough in the dispensing process of the fingerprint module, or the glue output amount is not enough, which cannot satisfy the requirement of the connection strength, or the glue output amount is too much, which affects the thickness and the simplicity of the bonding part of the fingerprint module, and the product is not dispensed with the glue before being processed, which needs to be improved.
Chinese patent No. CN109513574A discloses a dispensing method of a dispenser, which mainly solves the problems that the dispensing points on the dispensed devices are often different due to processing reasons and placement accuracy, and at this time, if dispensing is performed at the same distance according to the dispensing procedure, bubbles are often generated or the shapes of the dispensed points are inconsistent, and the quality of image dispensing is not consistent, and the recording and sorting are not realized for abnormal situations, which is not beneficial to the follow-up of the quality in the later period, and needs to be improved.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a novel semiconductor dispensing processing method.
In order to achieve the purpose, the invention adopts the following technical scheme: a novel semiconductor dispensing processing method comprises the following steps:
s1: a preparation stage, filling glue into a charging barrel of a dispenser, preparing a plurality of groups of dispensing test samples, and cleaning the surfaces of the dispensing test samples;
s2: sample dispensing, namely conveying the prepared dispensing test sample to a dispensing position of a dispenser, performing dispensing test, and correcting parameters of the dispenser by combining a dispensing test result;
s3: dispensing the product, after the parameter setting of the dispenser is finished, conveying the product to a dispensing position of the dispenser, and dispensing to obtain a finished product;
s4: and (5) detecting and warehousing, performing sectional sampling detection on the finished product obtained after the point gluing is finished, and warehousing and storing after the quality is qualified.
In order to improve the using effect of the dispenser, the dispenser of the invention is improved in that the dispenser of S1 includes a dispensing module, a control module, a conveying module and a lens module, and the output end of the control module is electrically connected to the input ends of the dispensing module and the conveying module respectively.
In order to improve the dispensing quality of products, the invention improves that the dispensing module comprises a dispensing needle head, a height control unit and a shaping unit, wherein the shaping unit is arranged around a dispensing opening of the dispensing needle head, and a pressure sensor is arranged inside the shaping unit.
In order to improve the height control effect of the dispensing needle head, the invention has the improvement that the height control unit comprises a signal transmitter and an infrared distance meter, and the output end of the signal transmitter is electrically connected with the input end of the control module.
In order to ensure the subsequent dispensing quality, the invention improves that the conveying module comprises a feeding unit and a surface treatment unit, wherein the surface treatment unit consists of a plasma cleaning machine, and the model of the plasma cleaning machine is PT-2 SM.
In order to facilitate the control of the dispensing process by the staff, the invention has the improvement that the control module comprises a display screen, a key area, a signal lamp and an abnormity recording unit, and the output end of the signal lamp is electrically connected with the input end of the abnormity recording unit.
In order to improve the recording of the dispensing condition, the invention has the improvement that the lens module comprises a camera, an image storage unit, a sorting and recording unit and a timing clearing unit, and the output end of the lens module is electrically connected with the input end of the control module.
In order to ensure the precision of parameter correction, the invention improves that the number of the multiple groups of dispensing test samples is at least five.
In order to ensure the dispensing effect, the invention has the improvement that the dispensing time of the dispenser is set to be 2 s-5 s, and the input air pressure is 2.5-7 Kg/cm2The output air pressure is 0.01 to 5.5Kg/cm2The temperature of the charging barrel is controlled to be 25-30 ℃.
In order to improve the dispensing quality, the invention improves that the inner diameter of the dispensing needle head is 1/2 of the diameter of the dispensing point.
Compared with the prior art, the invention has the advantages and positive effects that:
1. in the invention, in the traditional semiconductor dispensing processing technology, the processes of testing sample dispensing and product surface treatment are added, so that the staff can be helped to realize more accurate adjustment on the whole dispensing technological parameters, and meanwhile, the surface treatment is carried out on the product by the plasma cleaning machine before dispensing, so that the dirt on the surface of the product can be cleaned to a great extent, and the dispensing quality is greatly improved.
2. According to the invention, through the cooperation of the abnormal recording units in the lens module and the control module, the abnormal conditions occurring in the dispensing process can be recorded, so that the quality follow-up of workers in the later period is facilitated, and meanwhile, reference can be provided for the improvement of the dispensing process.
Drawings
FIG. 1 is a schematic view of a novel semiconductor dispensing process according to the present invention;
fig. 2 is a test result diagram of each embodiment of a novel semiconductor dispensing processing method according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Example one
Referring to fig. 1-2, the present invention provides a technical solution: a novel semiconductor dispensing processing method comprises the following steps:
s1: a preparation stage, filling glue into a charging barrel of a dispenser, preparing a plurality of groups of dispensing test samples, and cleaning the surfaces of the dispensing test samples;
s2: sample dispensing, namely conveying the prepared dispensing test sample to a dispensing position of a dispenser, performing dispensing test, and correcting parameters of the dispenser by combining a dispensing test result;
s3: dispensing the product, after the parameter setting of the dispenser is finished, conveying the product to a dispensing position of the dispenser, and dispensing to obtain a finished product;
s4: and (5) detecting and warehousing, performing sectional sampling detection on the finished product obtained after the point gluing is finished, and warehousing and storing after the quality is qualified.
S1 the dispensing machine includes a dispensing module, a control module, a conveying module and a lens module, the output of the control module is connected with the input of the dispensing module and the conveying module, the control module can control and record the dispensing process of the dispensing machine, to ensure the smooth proceeding of the dispensing process, the dispensing module includes a dispensing needle, a height control unit and a shaping unit, the shaping unit is arranged around the dispensing opening of the dispensing needle, the shaping unit can control and limit the specific range of the dispensing, the shaping unit is provided with a pressure sensor inside, the pressure sensor can further improve the pressure control of the whole dispensing process, to improve the dispensing quality, the height control unit includes a signal transmitter and an infrared distance meter, the output of the signal transmitter is connected with the input of the control module, the conveying module includes a feeding unit and a surface processing unit, the surface treatment unit is composed of a plasma cleaning machine, the model of the plasma cleaning machine is PT-2SM, the plasma cleaning machine is used for treating the surface of a product, the efficiency is high, the dirt removing effect is strong, and the glue dispensing quality is further improved.
Control module has the display screen, press the key zone, signal lamp and unusual record unit are constituteed, the output of signal lamp and unusual record unit's input electric connection, the camera lens module includes the camera, the image storage unit, arrangement record unit and regularly clear away the unit and constitute, the output of camera lens module and control module's input electric connection, the inside unusual record unit of camera lens module and control module cooperates, can record the unusual condition that the in-process appears of gluing, make things convenient for the staff later stage to carry out the quality to follow up, also can provide the reference for the improvement of point glue technology simultaneously, the quantity of test sample is glued to the multiunit point is five groups at least, adopt five groups at least to glue test sample, can further improve the precision in the parameter adjustment process.
The dispensing time of the dispenser is set to 2s, and the input air pressure is 2.5Kg/cm2The output air pressure is 2Kg/cm2, the temperature of the charging barrel is controlled at 25 ℃, and the inner diameter of the dispensing needle head is 1/2 of the diameter of the dispensing point.
Example two
A novel semiconductor dispensing processing method comprises the following steps:
s1: a preparation stage, filling glue into a charging barrel of a dispenser, preparing a plurality of groups of dispensing test samples, and cleaning the surfaces of the dispensing test samples;
s2: sample dispensing, namely conveying the prepared dispensing test sample to a dispensing position of a dispenser, performing dispensing test, and correcting parameters of the dispenser by combining a dispensing test result;
s3: dispensing the product, after the parameter setting of the dispenser is finished, conveying the product to a dispensing position of the dispenser, and dispensing to obtain a finished product;
s4: and (5) detecting and warehousing, performing sectional sampling detection on the finished product obtained after the point gluing is finished, and warehousing and storing after the quality is qualified.
S1 the dispensing machine includes a dispensing module, a control module, a conveying module and a lens module, the output of the control module is connected with the input of the dispensing module and the conveying module, the control module can control and record the dispensing process of the dispensing machine, to ensure the smooth proceeding of the dispensing process, the dispensing module includes a dispensing needle, a height control unit and a shaping unit, the shaping unit is arranged around the dispensing opening of the dispensing needle, the shaping unit can control and limit the specific range of the dispensing, the shaping unit is provided with a pressure sensor inside, the pressure sensor can further improve the pressure control of the whole dispensing process, to improve the dispensing quality, the height control unit includes a signal transmitter and an infrared distance meter, the output of the signal transmitter is connected with the input of the control module, the conveying module includes a feeding unit and a surface processing unit, the surface treatment unit is composed of a plasma cleaning machine, the model of the plasma cleaning machine is PT-2SM, the plasma cleaning machine is used for treating the surface of a product, the efficiency is high, the dirt removing effect is strong, and the glue dispensing quality is further improved.
Control module has the display screen, press the key zone, signal lamp and unusual record unit are constituteed, the output of signal lamp and unusual record unit's input electric connection, the camera lens module includes the camera, the image storage unit, arrangement record unit and regularly clear away the unit and constitute, the output of camera lens module and control module's input electric connection, the inside unusual record unit of camera lens module and control module cooperates, can record the unusual condition that the in-process appears of gluing, make things convenient for the staff later stage to carry out the quality to follow up, also can provide the reference for the improvement of point glue technology simultaneously, the quantity of test sample is glued to the multiunit point is five groups at least, adopt five groups at least to glue test sample, can further improve the precision in the parameter adjustment process.
The dispensing time of the dispenser is set to 2.5s, and the input air pressure is 3Kg/cm2The output pressure was 3Kg/cm2 and the barrel temperature was controlled at 28 ℃.
EXAMPLE III
A novel semiconductor dispensing processing method comprises the following steps:
s1: a preparation stage, filling glue into a charging barrel of a dispenser, preparing a plurality of groups of dispensing test samples, and cleaning the surfaces of the dispensing test samples;
s2: sample dispensing, namely conveying the prepared dispensing test sample to a dispensing position of a dispenser, performing dispensing test, and correcting parameters of the dispenser by combining a dispensing test result;
s3: dispensing the product, after the parameter setting of the dispenser is finished, conveying the product to a dispensing position of the dispenser, and dispensing to obtain a finished product;
s4: and (5) detecting and warehousing, performing sectional sampling detection on the finished product obtained after the point gluing is finished, and warehousing and storing after the quality is qualified.
S1 the dispensing machine includes a dispensing module, a control module, a conveying module and a lens module, the output of the control module is connected with the input of the dispensing module and the conveying module, the control module can control and record the dispensing process of the dispensing machine, to ensure the smooth proceeding of the dispensing process, the dispensing module includes a dispensing needle, a height control unit and a shaping unit, the shaping unit is arranged around the dispensing opening of the dispensing needle, the shaping unit can control and limit the specific range of the dispensing, the shaping unit is provided with a pressure sensor inside, the pressure sensor can further improve the pressure control of the whole dispensing process, to improve the dispensing quality, the height control unit includes a signal transmitter and an infrared distance meter, the output of the signal transmitter is connected with the input of the control module, the conveying module includes a feeding unit and a surface processing unit, the surface treatment unit is composed of a plasma cleaning machine, the model of the plasma cleaning machine is PT-2SM, the plasma cleaning machine is used for treating the surface of a product, the efficiency is high, the dirt removing effect is strong, and the glue dispensing quality is further improved.
Control module has the display screen, press the key zone, signal lamp and unusual record unit are constituteed, the output of signal lamp and unusual record unit's input electric connection, the camera lens module includes the camera, the image storage unit, arrangement record unit and regularly clear away the unit and constitute, the output of camera lens module and control module's input electric connection, the inside unusual record unit of camera lens module and control module cooperates, can record the unusual condition that the in-process appears of gluing, make things convenient for the staff later stage to carry out the quality to follow up, also can provide the reference for the improvement of point glue technology simultaneously, the quantity of test sample is glued to the multiunit point is five groups at least, adopt five groups at least to glue test sample, can further improve the precision in the parameter adjustment process.
The dispensing time of the dispenser is set to 4s, and the input air pressure is 7Kg/cm2The output pressure was 5.5Kg/cm2, and the cylinder temperature was controlled at 30 ℃.
The working principle is as follows: when dispensing is carried out on a semiconductor by a worker, firstly, dispensing preparation is made, glue is filled into a charging barrel of a dispenser, a plurality of groups of dispensing test samples are prepared, the surfaces of the dispensing test samples are cleaned, then, sample dispensing is carried out, the prepared dispensing test samples are conveyed to a dispensing position of the dispenser, test dispensing is carried out, then, the parameters of the dispenser are corrected by combining a dispensing result, product dispensing is carried out, after the parameter setting of the dispenser is completed, the product is conveyed to the dispensing position of the dispenser, dispensing is carried out, a finished product is obtained, finally, the product is detected, the finished product obtained after dispensing is subjected to sectional sampling detection, and the finished product can be stored in a warehouse after the quality is qualified.
Although the present invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (10)
1. A novel semiconductor dispensing processing method is characterized by comprising the following steps:
s1: a preparation stage, filling glue into a charging barrel of a dispenser, preparing a plurality of groups of dispensing test samples, and cleaning the surfaces of the dispensing test samples;
s2: sample dispensing, namely conveying the prepared dispensing test sample to a dispensing position of a dispenser, performing dispensing test, and correcting parameters of the dispenser by combining a dispensing test result;
s3: dispensing the product, after the parameter setting of the dispenser is finished, conveying the product to a dispensing position of the dispenser, and dispensing to obtain a finished product;
s4: and (5) detecting and warehousing, performing sectional sampling detection on the finished product obtained after the point gluing is finished, and warehousing and storing after the quality is qualified.
2. The novel semiconductor dispensing processing method according to claim 1, characterized in that: the dispenser in the S1 comprises a dispensing module, a control module, a conveying module and a lens module, wherein the output end of the control module is electrically connected with the input ends of the dispensing module and the conveying module respectively.
3. The novel semiconductor dispensing processing method according to claim 2, characterized in that: the dispensing module comprises a dispensing needle head, a height control unit and a shaping unit, the shaping unit is arranged around a dispensing opening of the dispensing needle head, and a pressure sensor is arranged inside the shaping unit.
4. The novel semiconductor dispensing processing method according to claim 3, wherein: the height control unit comprises a signal transmitter and an infrared distance meter, and the output end of the signal transmitter is electrically connected with the input end of the control module.
5. The novel semiconductor dispensing processing method according to claim 2, characterized in that: the conveying module comprises a feeding unit and a surface treatment unit, wherein the surface treatment unit consists of a plasma cleaning machine, and the model of the plasma cleaning machine is PT-2 SM.
6. The novel semiconductor dispensing processing method according to claim 2, characterized in that: the control module comprises a display screen, a key area, a signal lamp and an abnormity recording unit, wherein the output end of the signal lamp is electrically connected with the input end of the abnormity recording unit.
7. The novel semiconductor dispensing processing method according to claim 2, characterized in that: the lens module comprises a camera, an image storage unit, a sorting recording unit and a timing clearing unit, and the output end of the lens module is electrically connected with the input end of the control module.
8. The novel semiconductor dispensing processing method according to claim 1, characterized in that: the number of the multiple groups of dispensing test samples is at least five.
9. The novel semiconductor dispensing processing method according to claim 1, characterized in that: the dispensing time of the dispenser is set to 2-5 s, and the input air pressure is 2.5-7 Kg/cm2The output air pressure is 0.01 to 5.5Kg/cm2The temperature of the charging barrel is controlled to be 25-30 ℃.
10. The novel semiconductor dispensing processing method according to claim 3, wherein: the inner diameter of the dispensing needle head is 1/2 of the diameter of the dispensing needle head.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871072A (en) * | 2022-06-15 | 2022-08-09 | 左洪琼 | Novel semiconductor dispensing processing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103071606A (en) * | 2013-01-15 | 2013-05-01 | 深圳市阿莱恩斯科技有限公司 | Pilot dispensing device, dispensing machine and dispensing method of dispensing machine |
| CN205507514U (en) * | 2016-02-18 | 2016-08-24 | 陈江友 | Novel incence burner production device |
| CN108672218A (en) * | 2018-07-27 | 2018-10-19 | 珠海市运泰利自动化设备有限公司 | A kind of intelligent dispenser system and its dispensing method of integration testing |
| CN212189889U (en) * | 2020-03-30 | 2020-12-22 | 大陆汽车电子（连云港）有限公司 | Dispensing and curing device |
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- 2021-12-30 CN CN202111651013.1A patent/CN114308577A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103071606A (en) * | 2013-01-15 | 2013-05-01 | 深圳市阿莱恩斯科技有限公司 | Pilot dispensing device, dispensing machine and dispensing method of dispensing machine |
| CN205507514U (en) * | 2016-02-18 | 2016-08-24 | 陈江友 | Novel incence burner production device |
| CN108672218A (en) * | 2018-07-27 | 2018-10-19 | 珠海市运泰利自动化设备有限公司 | A kind of intelligent dispenser system and its dispensing method of integration testing |
| CN212189889U (en) * | 2020-03-30 | 2020-12-22 | 大陆汽车电子（连云港）有限公司 | Dispensing and curing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114871072A (en) * | 2022-06-15 | 2022-08-09 | 左洪琼 | Novel semiconductor dispensing processing method |
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