Nothing Special   »   [go: up one dir, main page]

CN114199193B - Inclination detection device and method and mechanical arm system - Google Patents

Inclination detection device and method and mechanical arm system Download PDF

Info

Publication number
CN114199193B
CN114199193B CN202010987012.3A CN202010987012A CN114199193B CN 114199193 B CN114199193 B CN 114199193B CN 202010987012 A CN202010987012 A CN 202010987012A CN 114199193 B CN114199193 B CN 114199193B
Authority
CN
China
Prior art keywords
fiber sensor
mechanical arm
laser fiber
laser
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010987012.3A
Other languages
Chinese (zh)
Other versions
CN114199193A (en
Inventor
金建澔
周娜
王佳
李俊杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Microelectronics of CAS
Zhenxin Beijing Semiconductor Co Ltd
Original Assignee
Institute of Microelectronics of CAS
Zhenxin Beijing Semiconductor Co Ltd
Filing date
Publication date
Application filed by Institute of Microelectronics of CAS, Zhenxin Beijing Semiconductor Co Ltd filed Critical Institute of Microelectronics of CAS
Priority to CN202010987012.3A priority Critical patent/CN114199193B/en
Publication of CN114199193A publication Critical patent/CN114199193A/en
Application granted granted Critical
Publication of CN114199193B publication Critical patent/CN114199193B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention relates to an inclination detection device, an inclination detection method and a mechanical arm system, belongs to the technical field of measurement, and solves the problems that when a wafer is continuously moved, the moment points for finding out the problem of a bearing structure are usually after the wafer is damaged and scratched or poor process (low edge yield) occurs. The inclination detection device includes: the object to be measured is placed on the mechanical arm bearing structure; the laser fiber sensor comprises a first laser fiber sensor and a second laser fiber sensor, wherein the first laser fiber sensor and the second laser fiber sensor are respectively arranged at two ends of a blocking piece between the mechanical arm bearing structure and the mechanical arm part in a central symmetry mode, and the laser fiber sensor is used for respectively emitting laser beams towards an object to be detected in a parallel mode and correspondingly receiving reflected light reflected from the object to be detected in the moving process of the object to be detected so as to judge whether the object to be detected is inclined or not according to the reflected light. The inclination can be detected, so that wafer scratch and damage caused by the inclination are avoided, and the yield is improved.

Description

Inclination detection device and method and mechanical arm system
Technical Field
The present invention relates to the field of measurement technologies, and in particular, to an inclination detection device, an inclination detection method, and a mechanical arm system.
Background
Currently, semiconductor processing requires transfer of wafers, which are moved into the process chamber by various means (e.g., robot, alignment, front opening unified pod FOUP (Front Opening Unified Pod), and center finding), but the wafer is damaged and the processing is defective due to in-process tilting, particularly the robot carrying structure for moving the wafers is tilted.
At present, the mechanical arm searching and the mechanical arm calibrating are implemented, the function of whether the bearing structure of the semiconductor mechanical arm is inclined is not sensed, the problem point can be mastered after the wafer is scratched and damaged due to the inclination, and the main functions of the mechanical arm at present are moving wafer, wafer scanning and wafer positioning.
Since the robot arm module has no function of sensing the tilting left and right, when the wafer is continuously moved, the problem of the carrying structure is usually found after the wafer is damaged and scratched or poor process (low yield of edge) occurs.
Disclosure of Invention
In view of the above analysis, the present invention aims to provide a tilt detection device, a tilt detection method and a robot system, which are used for solving the problem that when the conventional robot module does not sense the motion of the wafer continuously caused by the tilting left and right, the timing point of the problem of the carrying structure is usually found after the wafer is damaged, scratched or poor in process (edge low yield).
In one aspect, an embodiment of the present invention provides an inclination detection apparatus, including: the object to be measured is placed on the mechanical arm bearing structure; the laser fiber sensor comprises a first laser fiber sensor and a second laser fiber sensor which are respectively arranged at two ends of a blocking piece between the mechanical arm bearing structure and the mechanical arm part in a central symmetry mode, wherein the laser fiber sensor is used for respectively emitting laser beams towards the object to be detected in a parallel mode and correspondingly receiving reflected light reflected from the object to be detected in the moving process of the object to be detected so as to judge whether the object to be detected is inclined or not according to the reflected light.
The beneficial effects of the technical scheme are as follows: the first laser fiber sensor and the second laser fiber sensor can respectively emit laser beams towards the object to be detected and correspondingly receive reflected light reflected from the object to be detected, and then whether the object to be detected is inclined or not is sensed in advance according to the reflected light. By sensing the slight inclination of the mechanical arm bearing structure in advance, the wafer can be prevented from being scratched and damaged.
Based on the further improvement of the device, the blocking piece is a cylinder, wherein the laser emission points of the laser fiber sensor are positioned at the center of the circle at two ends of the cylinder, and the reflection points are positioned on the side wall of the object to be detected, which is opposite to the blocking piece.
Based on a further improvement of the above apparatus, determining whether the object to be measured is inclined based on the reflected light includes: determining a distance between the laser emission point and the reflection point of the object to be measured according to the reflected light, wherein the distance comprises the sum of the distance between the edge of the blocking piece and the reflection point on the object to be measured and the radius of the blocking piece; judging whether the object to be detected inclines relative to the mechanical arm bearing structure or not according to the distance, wherein when the distance is between 10 and 30mm, the reading of the laser fiber sensor is 1, and the object to be detected is in a range allowed by an inclination error; and when the distance is between 0 and 10mm or between 30 and infinity, the reading of the laser fiber sensor is 0, and the object to be measured is inclined relative to the mechanical arm bearing structure.
Based on a further improvement of the above device, the laser beam comprises a first laser beam and a second laser beam; the reflected light includes a first reflected light and a second reflected light; the distance comprises a first distance between a first laser emission point and a first reflection point of the first laser fiber sensor and a second distance between a second laser emission point and a second reflection point of the second laser fiber sensor, wherein when readings of the first laser fiber sensor and the second laser fiber sensor are 1, the object to be measured is not inclined relative to the mechanical arm bearing structure; when any one of two readings of the first laser fiber sensor and the second laser fiber sensor is 0, the object to be measured is slightly inclined relative to the mechanical arm bearing structure, and a mechanical arm calibration device is triggered; and when two readings of the first laser fiber sensor and the second laser fiber sensor are 0, the object to be detected is seriously inclined relative to the mechanical arm bearing structure, and the interlocking device of the inclination detection device and the mechanical arm linkage is triggered.
Based on the further improvement of the device, the inclination detection device further comprises a level sensor, wherein the level sensor comprises a first level sensor and a second level sensor, and the first level sensor and the second level sensor are respectively installed on the first laser fiber sensor and the second laser fiber sensor and are used for sensing the self inclination of the mechanical arm bearing structure of the mechanical arm.
Based on the further improvement of the device, the object to be measured is a wafer.
In another aspect, an embodiment of the present invention provides a mechanical arm system, including the tilt detection device described above.
In still another aspect, an embodiment of the present invention provides a tilt detection method, including: placing an object to be tested on a mechanical arm bearing structure; in the moving process of the object to be detected, two laser beams are emitted simultaneously according to preset time in a parallel mode through a laser fiber sensor, and reflected light reflected from the object to be detected is correspondingly received, wherein the laser fiber sensor comprises a first laser fiber sensor and a second laser fiber sensor which are respectively arranged at two ends of a barrier of the mechanical arm bearing structure and the mechanical arm in a central symmetry mode; and judging whether the object to be detected is inclined or not according to the reflected light.
Based on a further improvement of the method, the blocking piece is arranged as a cylinder, wherein the laser emission points of the laser fiber sensor are located at the center of the circle at the two ends of the cylinder and the reflection points are located on the side wall of the object to be detected opposite to the blocking piece.
Based on a further improvement of the above method, determining whether the object to be measured is inclined based on the reflected light includes: determining a distance between the laser emission point and the reflection point of the object to be measured according to the reflected light, wherein the distance comprises the sum of the distance between the edge of the blocking piece and the reflection point on the object to be measured and the radius of the blocking piece; judging whether the object to be detected inclines relative to the mechanical arm bearing structure or not according to the distance, wherein when the distance is between 10 and 30mm, the distance reading of the laser fiber sensor is 1, and the object to be detected is within the range allowed by the inclination error; and when the distance is between 0 and 10mm or between 30 and infinity, the distance reading of the laser fiber sensor is 0, and the object to be measured is inclined relative to the mechanical arm bearing structure.
Based on a further improvement of the above method, the laser beam comprises a first laser beam and a second laser beam; the reflected light includes a first reflected light and a second reflected light; the distance comprises a first distance between a first laser emission point and a first reflection point of the first laser fiber sensor and a second distance between a second laser emission point and a second reflection point of the second laser fiber sensor, wherein when readings of the first laser fiber sensor and the second laser fiber sensor are 1, the object to be measured is not inclined relative to the mechanical arm bearing structure; when any one of two readings of the first laser fiber sensor and the second laser fiber sensor is 0, the object to be measured is slightly inclined relative to the mechanical arm bearing structure, and a reminding instruction is given to calibrate the mechanical arm; and when the two readings of the first laser fiber sensor and the second laser fiber sensor are 0, the object to be detected is severely inclined relative to the mechanical arm bearing structure, and a stopping mechanical arm and an alarm indication are given so that the inclination detection device and the mechanical arm are interlocked and interlocked.
Based on a further improvement of the above method, the tilt detection method further comprises: the self-inclination of the mechanical arm bearing structure of the mechanical arm is sensed through a horizontal sensor, wherein the horizontal sensor comprises a first horizontal sensor and a second horizontal sensor, and the first horizontal sensor and the second horizontal sensor are respectively installed on the first laser fiber sensor and the second laser fiber sensor.
Compared with the prior art, the invention has at least one of the following beneficial effects:
1. The first laser fiber sensor and the second laser fiber sensor can respectively emit laser beams towards the object to be detected and correspondingly receive reflected light reflected from the object to be detected, and then whether the object to be detected is inclined or not is sensed in advance according to the reflected light. Therefore, the mechanical arm bearing structure is sensed to be slightly inclined in advance, and the mechanical arm is calibrated according to the reminding indication, so that the wafer is prevented from being scratched and damaged.
2. The serious inclination of the mechanical arm bearing structure is sensed in advance, and the inclination detection device and the mechanical arm are interlocked according to the stopping mechanical arm and the alarm indication, so that the wafer is prevented from being scratched and damaged.
3. The horizontal sensor is used for sensing the self-inclination of the mechanical arm bearing structure, so that the integral inclination of the mechanical arm is sensed.
In the invention, the technical schemes can be mutually combined to realize more preferable combination schemes. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, like reference numerals being used to refer to like parts throughout the several views.
Fig. 1 is a schematic view of a tilt detection device according to an embodiment of the present invention.
Fig. 2 is a schematic view of a laser beam in a tilting detection apparatus according to an embodiment of the present invention.
Fig. 3 is a flowchart of a tilt detection method according to an embodiment of the present invention.
Reference numerals:
102-an object to be measured; 104-a mechanical arm bearing structure; 106-a first laser fiber sensor; 108-a second laser fiber sensor; 110-a first level sensor; 112-a second level sensor; 114-a barrier; 116-a first line segment; 118-a second line segment; 120-a third line segment; 122-fourth line segment
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is only exemplary and is not intended to limit the scope of the present disclosure. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the concepts of the present disclosure.
Various structural schematic diagrams according to embodiments of the present disclosure are shown in the drawings. The figures are not drawn to scale, wherein certain details are exaggerated for clarity of presentation and may have been omitted. The shapes of the various regions, layers and relative sizes, positional relationships between them shown in the drawings are merely exemplary, may in practice deviate due to manufacturing tolerances or technical limitations, and one skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present therebetween. In addition, if one layer/element is located "on" another layer/element in one orientation, that layer/element may be located "under" the other layer/element when the orientation is turned.
Referring to fig. 1, an inclination detection apparatus is disclosed for detecting whether an object 102 to be detected placed on a robot arm carrying structure 104 is inclined or not. In one embodiment, the object to be measured 102 may be a wafer, for example, a wafer having a thickness of 0.775mm. The object to be measured may be moved to a desired location in space by a robot carrying structure, such as a wafer table of a process chamber, a front opening wafer transfer box, a wafer table of a next process chamber, and the like. The inclination detection device can be applied to a control device of a mechanical arm for moving an object to be detected to a desired position.
With continued reference to fig. 1, the tilt detection device includes a laser fiber sensor including a first laser fiber sensor 106 and a second laser fiber sensor 108 disposed at both ends of a block 114 between the arm carrying structure 104 and the arm, respectively, in a centrosymmetric manner. During the movement of the object 104 to be measured, the first laser fiber sensor 106 and the second laser fiber sensor 108 respectively emit laser beams toward the object 104 to be measured in a parallel manner and correspondingly receive reflected light reflected from the object 104 to be measured, so as to determine whether the object to be measured is inclined according to the reflected light. The blocking member 114 may be a cylinder in which the laser emission points of two laser fiber sensors are located at the center of the cylinder at both ends and the corresponding two reflection points are located on the side wall of the object 104 to be measured opposite to the blocking member 114. The laser beam emitted by the first laser fiber sensor is a first laser beam, and the laser beam emitted by the second laser fiber sensor is a second laser beam. In this embodiment, each laser beam does not pass through the wafer but reflects the laser beam when it reaches the edge of the wafer. Thus, the laser fiber sensor may be used to detect the distance, i.e., half the measured distance is the distance between the laser fiber sensor and the wafer edge. The first and second laser beams emitted by the first and second laser fiber sensors 106 and 108 may be used to detect the distance between the two laser fiber sensors and the two reflection points.
Accordingly, the reflected light also includes the first reflected light and the second reflected light. The distance between the two laser emission points and the two reflection points of the object 104 to be measured is determined from the first reflected light and the second reflected light, where the distance includes a sum of a distance between an edge of the barrier 114 to the reflection point on the object 104 to be measured and a radius of the barrier 114, where the radius of the barrier 114 is a fixed constant. In an alternative embodiment, the radius of the stop 114 may be ignored when the radius is sufficiently small. The distance between the first laser emission point and the first reflection point of the first laser fiber sensor 106 is referred to as a first distance, and the distance between the first laser emission point and the second reflection point of the second laser fiber sensor 108 is referred to as a second distance.
In one possible embodiment, whether the object to be measured is inclined with respect to the mechanical arm bearing structure is determined according to any one of the first distance and the second distance. Specifically, referring to fig. 2, when the distance is between 10 and 30mm, the reading of the laser fiber sensor is 1, and the object to be measured is within the range allowed by the tilt error. For example, the distance indicated by the arrowed first and second line segments 116, 118 is a normal distance. When the distance is between 0 and 10mm or between 30mm and infinity (e.g. 200 mm), the reading of the laser fiber sensor is 0 and there is an inclination of the object to be measured relative to the mechanical arm carrying structure. For example, the distance indicated by the third and fourth arrowed line segments 120 and 122 is an abnormal distance.
In one possible embodiment, it is determined whether the object to be measured is tilted with respect to the mechanical arm carrying structure according to the first distance and the second distance. The following three conditions exist in the position relation between the object to be measured and the mechanical arm bearing structure: when the readings of the first laser fiber sensor and the second laser fiber sensor are 1, that is, the first distance and the second distance are between 10 and 30mm, the object to be measured is judged to be in the range allowed by the inclination error relative to the mechanical arm bearing structure, preferably, when the first distance and the second distance are 20mm, the object to be measured is judged to be aligned exactly or not inclined relative to the mechanical arm bearing structure. When one of the two readings of the first and second laser fiber sensors is 0 and the other is 1, i.e. the wafer size is 200mm, when either of the first and second distances is between 0 and 10mm or between 30mm and infinity, there is a slight tilt of the object to be measured relative to the robot arm carrying structure, i.e. the ratio of the tilt size to the wafer size is less than 10%, triggering the robot arm calibration device. When the two readings of the first laser fiber sensor and the second laser fiber sensor are both 0, namely, when the first distance and the second distance are both between 0 and 10mm or between 30mm and infinity, the object to be measured is severely inclined relative to the mechanical arm bearing structure, namely, the ratio of the inclination size to the wafer size is more than 10%, and the interlocking device of the inclination detection device and the mechanical arm linkage is triggered.
The tilt detection device may further include a first level sensor 110 and a second level sensor 112 mounted on the first laser fiber sensor 106 and the second laser fiber sensor 108, respectively, for sensing an autologous tilt of the robotic arm carrying structure 104 of the robotic arm. The influence of the inclination detection result of the object to be detected (such as a wafer) due to the self-inclination is eliminated.
In another embodiment of the present invention, a robotic arm system is disclosed. The robot arm system is a robot arm for moving an object to be measured. The mechanical arm system comprises the inclination detection device.
In yet another embodiment of the present invention, a tilt detection method is disclosed. Hereinafter, the inclination detection method will be described in detail with reference to fig. 1 and 3.
Referring to fig. 1, the self-tilting of the arm carrying structure of the arm is sensed by a level sensor to be able to sense the overall tilting of the arm. The level sensor includes a first level sensor and a second level sensor. The first level sensor and the second level sensor are respectively arranged on the first laser fiber sensor and the second laser fiber sensor. The first laser fiber sensor and the second laser fiber sensor are respectively arranged at two ends of the mechanical arm bearing structure and the blocking piece of the mechanical arm in a central symmetry mode. And arranging a blocking piece into a cylinder, wherein the blocking piece is used for preventing a wafer sliding sheet, and the laser emission points of the laser fiber sensor are positioned at the circle centers at two ends of the cylinder. When the mechanical arm bearing structure is inclined, the mechanical arm bearing structure is adjusted so that the mechanical arm bearing structure is kept horizontal.
After the robot arm carrying structure is kept horizontal, the object to be measured is placed on the robot arm carrying structure, refer to step S302 in fig. 3. In one embodiment, the object to be measured 102 is a wafer, for example, the wafer has a thickness of 0.775mm.
After the object to be measured is placed, the object to be measured is moved by the mechanical arm carrying structure, and during the movement of the object to be measured, two laser beams (a first laser beam and a second laser beam) are simultaneously emitted in a parallel manner for a predetermined time by the first and second laser fiber sensors, and reflected light (a first reflected light and a second reflected light) reflected from the object to be measured is correspondingly received, referring to step S304 in fig. 3. The reflection point is positioned on the side wall of the object to be measured opposite to the blocking piece.
After receiving the first reflected light and the second reflected light, referring to step S306 in fig. 3, first, a first distance and a second distance between the laser emission point and the reflection point of the object to be measured are determined according to each of the first reflected light and the second reflected light. The first distance is the distance between a first laser emission point and a first reflection point of the first laser fiber sensor, and the second distance is the distance between a second laser emission point and a second reflection point of the second laser fiber sensor. Either of the first distance and the second distance includes a sum of a distance between an edge of the barrier and a reflection point on the object to be measured and a radius of the barrier. And secondly, judging whether the object to be measured is inclined relative to the mechanical arm bearing structure according to the obtained distance, wherein when the distance is between 10 and 30mm, the distance reading of the laser fiber sensor is 1, and the object to be measured is normal. When the distance is between 0 and 10mm or between 30 and infinity, the distance reading of the laser fiber sensor is 0, and the object to be measured is inclined relative to the mechanical arm bearing structure.
Specifically, when the readings of the first laser fiber sensor and the second laser fiber sensor are both 1, that is, when the first distance and the second distance are both between 10 and 30mm, the object to be measured is not tilted with respect to the mechanical arm bearing structure. When either of the two readings of the first and second laser fiber sensors is 0, i.e., when either of the first and second distances is between 0 and 10mm or between 30mm and infinity, the object to be measured is slightly tilted with respect to the mechanical arm carrying structure, giving a warning indication for mechanical arm calibration. When the two readings of the first laser fiber sensor and the second laser fiber sensor are 0, namely, when the first distance and the second distance are between 0 and 10mm or between 30mm and infinity, the object to be measured is severely inclined relative to the mechanical arm bearing structure, and a stopping mechanical arm and an alarm indication are given to enable the inclination detection device to be interlocked with the mechanical arm.
Compared with the prior art, the invention has at least one of the following beneficial effects:
1. The first laser fiber sensor and the second laser fiber sensor can respectively emit laser beams towards the object to be detected and correspondingly receive reflected light reflected from the object to be detected, and then whether the object to be detected is inclined or not is sensed in advance according to the reflected light. Therefore, the mechanical arm bearing structure is sensed to be slightly inclined in advance, and the mechanical arm is calibrated according to the reminding indication, so that the wafer is prevented from being scratched and damaged.
2. The serious inclination of the mechanical arm bearing structure is sensed in advance, and the inclination detection device and the mechanical arm are interlocked according to the stopping mechanical arm and the alarm indication, so that the wafer is prevented from being scratched and damaged.
3. The horizontal sensor is used for sensing the self-inclination of the mechanical arm bearing structure, so that the integral inclination of the mechanical arm is sensed.
In the above description, technical details of patterning, etching, and the like of each layer are not described in detail. Those skilled in the art will appreciate that layers, regions, etc. of the desired shape may be formed by a variety of techniques. In addition, to form the same structure, those skilled in the art can also devise methods that are not exactly the same as those described above. In addition, although the embodiments are described above separately, this does not mean that the measures in the embodiments cannot be used advantageously in combination.
The embodiments of the present disclosure are described above. These examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be made by those skilled in the art without departing from the scope of the disclosure, and such alternatives and modifications are intended to fall within the scope of the disclosure.

Claims (6)

1. A tilt detection device, comprising:
the object to be measured is placed on the mechanical arm bearing structure;
The laser fiber sensor comprises a first laser fiber sensor and a second laser fiber sensor which are respectively arranged at two ends of a blocking piece between the mechanical arm bearing structure and the mechanical arm part in a central symmetry mode, wherein the blocking piece is a cylinder, and a laser emission point of the laser fiber sensor is positioned at the center of the circle at two ends of the cylinder and a reflection point is positioned on the side wall of the object to be detected opposite to the blocking piece; the method is used for respectively transmitting laser beams towards the object to be measured in a parallel mode and correspondingly receiving reflected light reflected from the object to be measured in the moving process of the object to be measured so as to judge whether the object to be measured is inclined according to the reflected light, wherein judging whether the object to be measured is inclined according to the reflected light comprises the following steps: determining a distance between a laser emission point and a reflection point of the object to be measured according to the reflected light, wherein the distance comprises a sum of a distance between an edge of the blocking piece and the reflection point on the object to be measured and a radius of the blocking piece; judging whether the object to be detected inclines relative to the mechanical arm bearing structure according to the distance, wherein,
When the distance is between 10 and 30mm, the reading of the laser fiber sensor is 1, and the object to be detected is in a range allowed by the inclination error; and
When the distance is between 0 and 10mm or between 30 and infinity, the reading of the laser fiber sensor is 0, and the object to be measured is inclined relative to the mechanical arm bearing structure;
The horizontal sensor comprises a first horizontal sensor and a second horizontal sensor which are respectively arranged on the first laser fiber sensor and the second laser fiber sensor and used for sensing the self-inclination of the mechanical arm bearing structure of the mechanical arm; the method comprises the steps that through sensing the slight inclination of a mechanical arm bearing structure in advance, the mechanical arm calibration is carried out according to a reminding instruction, and further, the wafer is prevented from being scratched and damaged;
the distance comprises a first distance between a first laser emission point and a first reflection point of the first laser fiber sensor and a second distance between a second laser emission point and a second reflection point of the second laser fiber sensor, wherein,
When the readings of the first laser fiber sensor and the second laser fiber sensor are 1, the object to be measured is not inclined relative to the mechanical arm bearing structure;
when any one of two readings of the first laser fiber sensor and the second laser fiber sensor is 0, the object to be measured is slightly inclined relative to the mechanical arm bearing structure, and a mechanical arm calibration device is triggered; and
When the two readings of the first laser fiber sensor and the second laser fiber sensor are 0, the object to be detected is seriously inclined relative to the mechanical arm bearing structure, and the interlocking device of the inclination detection device and the mechanical arm linkage is triggered, so that wafer scratch and damage are avoided.
2. The tilt sensing apparatus of claim 1, wherein,
The laser beams include a first laser beam and a second laser beam;
the reflected light includes a first reflected light and a second reflected light.
3. The tilt sensing apparatus of claim 1, wherein the object to be measured is a wafer.
4. A robotic arm system comprising a tilt detection device according to any one of claims 1 to 3.
5. A tilt detection method employing the tilt detection device according to any one of claims 1 to 3, comprising:
Placing an object to be tested on a mechanical arm bearing structure;
In the moving process of the object to be detected, two laser beams are emitted simultaneously according to preset time in a parallel mode through a laser fiber sensor, and reflected light reflected from the object to be detected is correspondingly received, wherein the laser fiber sensor comprises a first laser fiber sensor and a second laser fiber sensor which are respectively arranged at two ends of a barrier of the mechanical arm bearing structure and the mechanical arm in a central symmetry mode; the blocking piece is a cylinder, wherein laser emission points of the laser fiber sensor are positioned at the circle centers at two ends of the cylinder, and reflection points are positioned on the side wall of the object to be detected, which is opposite to the blocking piece;
Sensing the self-inclination of the mechanical arm bearing structure of the mechanical arm through a horizontal sensor, wherein the horizontal sensor comprises a first horizontal sensor and a second horizontal sensor which are respectively arranged on the first laser fiber sensor and the second laser fiber sensor; wherein, through sensing the slight slope of arm bearing structure in advance, instruct with carrying out the arm calibration according to warning, and then avoid wafer scratch and damage, and
Judging whether the object to be detected is inclined or not according to the reflected light, wherein judging whether the object to be detected is inclined or not according to the reflected light comprises: determining a distance between the laser emission point and the reflection point of the object to be measured according to the reflected light, wherein the distance comprises the sum of the distance between the edge of the blocking piece and the reflection point on the object to be measured and the radius of the blocking piece; judging whether the object to be detected inclines relative to the mechanical arm bearing structure or not according to the distance, wherein when the distance is between 10 and 30mm, the distance reading of the laser fiber sensor is 1, and the object to be detected is within the range allowed by the inclination error; and when the distance is between 0 and 10mm or between 30 and infinity, the distance reading of the laser fiber sensor is 0, and the object to be measured is inclined relative to the mechanical arm bearing structure;
the distance comprises a first distance between a first laser emission point and a first reflection point of the first laser fiber sensor and a second distance between a second laser emission point and a second reflection point of the second laser fiber sensor, wherein,
When the readings of the first laser fiber sensor and the second laser fiber sensor are 1, the object to be measured is not inclined relative to the mechanical arm bearing structure;
When any one of two readings of the first laser fiber sensor and the second laser fiber sensor is 0, the object to be measured is slightly inclined relative to the mechanical arm bearing structure, and a reminding instruction is given to calibrate the mechanical arm; and
When the two readings of the first laser fiber sensor and the second laser fiber sensor are 0, the object to be detected is seriously inclined relative to the mechanical arm bearing structure, and a stopping mechanical arm and an alarm indication are given so that the inclination detection device and the mechanical arm are interlocked.
6. The tilt detection method of claim 5, wherein the laser beam comprises a first laser beam and a second laser beam; the reflected light includes a first reflected light and a second reflected light.
CN202010987012.3A 2020-09-18 Inclination detection device and method and mechanical arm system Active CN114199193B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010987012.3A CN114199193B (en) 2020-09-18 Inclination detection device and method and mechanical arm system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010987012.3A CN114199193B (en) 2020-09-18 Inclination detection device and method and mechanical arm system

Publications (2)

Publication Number Publication Date
CN114199193A CN114199193A (en) 2022-03-18
CN114199193B true CN114199193B (en) 2024-11-08

Family

ID=

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000071190A (en) * 1998-08-27 2000-03-07 Komatsu Ltd Workpiece carrying system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000071190A (en) * 1998-08-27 2000-03-07 Komatsu Ltd Workpiece carrying system

Similar Documents

Publication Publication Date Title
US6522942B2 (en) Transfer apparatus for semiconductor process
US7387484B2 (en) Wafer positioning systems and methods thereof
US6900877B2 (en) Semiconductor wafer position shift measurement and correction
US7596456B2 (en) Method and apparatus for cassette integrity testing using a wafer sorter
EP1062687B1 (en) On the fly center-finding during substrate handling in a processing system
KR101817395B1 (en) Method and apparatus for detecting position of substrate transfer device, and storage medium
US20160133502A1 (en) Wafer transfer robot, method of controlling the same, and method of manufacturing a semiconductor device using the same
TWI313751B (en)
US6795202B2 (en) Wafer processing apparatus having wafer mapping function
US6504615B1 (en) Optical instrument for measuring shape of wafer
US7049577B2 (en) Semiconductor handler interface auto alignment
US9097515B2 (en) Measuring device and measuring method
JPH07280512A (en) Position detector of piled material body
CN107799430B (en) Wafer position detection method
CN110364461B (en) Wafer state detection equipment and method and wafer loading and unloading chamber
EP0996963A1 (en) Multiple point position scanning system
CN114199193B (en) Inclination detection device and method and mechanical arm system
US8347813B2 (en) Thin film deposition apparatus and method thereof
KR100863690B1 (en) Wafer dectecting system
CN114199193A (en) Inclination detection device and method and mechanical arm system
CN110752168A (en) Wafer detection device, wafer transmission system and wafer detection method
KR20050019445A (en) Mapping apparatus and control method thereof
JPH0864654A (en) Method and apparatus for transferring substrate
US7142314B2 (en) Wafer stage position calibration method and system
KR101173686B1 (en) Apparatus For Sensing Existence Or Chop of Substrates For Flat Panel Display In a Cassette

Legal Events

Date Code Title Description
PB01 Publication
SE01 Entry into force of request for substantive examination
GR01 Patent grant