CN114167553A

CN114167553A - Optical module

Info

Publication number: CN114167553A
Application number: CN202010953872.5A
Authority: CN
Inventors: 刘维伟; 邵乾; 杨柳
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-09-11
Filing date: 2020-09-11
Publication date: 2022-03-11
Anticipated expiration: 2040-09-11
Also published as: CN114167553B

Abstract

The application discloses an optical module, which comprises a circuit board and a tunable light emitting assembly connected with the circuit board through a flexible board, wherein the tunable light emitting assembly comprises a shell, and an SOA chip, a silicon optical chip and a switching ceramic board which are arranged in the shell; a bonding pad is arranged in the switching ceramic block; the SOA chip is used for emitting light with various wavelengths, the SOA chip is connected with the transit ceramic plate through a gold wire bonding wire, and the transit ceramic plate is connected with the bonding pad through the gold wire bonding wire; the silicon optical chip is connected with the bonding pad through a gold wire bonding wire and used for selecting wavelengths of various wavelengths, and the selected light is modulated to obtain signal light with corresponding wavelengths. According to the optical module, the silicon optical chip and the SOA chip are integrally packaged, and the wavelength can be tuned based on the silicon optical chip and the SOA chip, so that the optical module has a multi-wavelength tunable function.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

In optical fiber communication, a wavelength tunable optical module has been a subject of extensive study. The wavelength tunable optical module can not only make full use of the broadband resource of the optical fiber of a DWDM (Dense wavelength Division Multiplexing) system, greatly improve the communication capacity of a network system, but also be more flexible and changeable in links such as networking, material preparation and the like compared with the DWDM optical module with fixed wavelength, and can also be used as a backup light source of a traditional DWDM system, thereby being a key factor of an intelligent optical network.

At the initial stage of 5G network construction, a wavelength tunable optical module is a core unit, and existing wavelength tuning methods mainly focus on the design of optical devices, for example, a tunable method of a DFB (Distributed Feedback Laser), a DBR (Distributed Bragg reflector), a Distributed Bragg reflector (Distributed Bragg reflector) + an electro-absorption modulator, a Littman-metallurgical external cavity structure method, and the like, all of which are complex processes and designs on the structure, waveguide, and epitaxial growth of the optical device, thereby achieving multi-wavelength tuning.

Although there are many methods for realizing tunable wavelength, very complicated optical design and manufacturing process, ultra-high precision control, etc. are usually required, and the problems of high realization difficulty, high manufacturing cost, narrow tuning range, high power consumption, etc. are present, which are not favorable for the application of the wavelength tunable optical module.

Disclosure of Invention

The application provides an optical module to realize the development of low cost, wide tuning range, low power consumption and the like of a wavelength tunable optical module.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

the embodiment of the application discloses an optical module, includes:

a circuit board;

the tunable light emitting component is electrically connected with the circuit board through a flexible board and used for emitting signal light;

wherein the tunable optical transmission component comprises:

the shell is provided with a notch, a switching ceramic block is arranged at the notch, and the switching ceramic block is hermetically connected with the notch; pins are arranged on the outer wall of the switching ceramic block, and the flexible board is electrically connected with the pins; a bonding pad is arranged in the switching ceramic block;

the SOA chip is arranged in the shell and used for emitting light with various wavelengths;

the adapter ceramic plate is arranged in the shell, the SOA chip is connected with the adapter ceramic plate through a gold wire bonding wire, and the adapter ceramic plate is connected with the bonding pad through a gold wire bonding wire;

the silicon optical chip is arranged in the shell and is connected with the bonding pad through a gold wire bonding wire; and the wavelength selection module is used for selecting the wavelengths of the light with the multiple wavelengths, and modulating the selected light to obtain signal light with corresponding wavelengths.

The optical module that this application provided includes circuit board and tunable optical transmission subassembly, and tunable optical transmission subassembly passes through the flexible sheet and is connected with the circuit board electricity for the transmission signal light. The tunable light emitting component comprises a shell, and an SOA chip, a silicon optical chip and a switching ceramic plate which are arranged in the shell, wherein a notch is formed in the shell, a switching ceramic block is arranged at the notch, and the switching ceramic block is hermetically connected with the notch; pins are arranged on the outer wall of the switching ceramic block, and the flexible plate is electrically connected with the pins; a bonding pad is arranged inside the switching ceramic block, the silicon optical chip and the switching ceramic plate are respectively connected with the bonding pad through gold wire bonding wires, and the SOA chip is connected with the switching ceramic plate through the gold wire bonding wires, so that the tunable light emitting assembly is connected with the flexible plate and the circuit board, and the circuit board supplies power to the tunable light emitting assembly through the flexible plate and emits high-frequency signals; the silicon optical chip and the SOA chip form a resonant cavity, light with various wavelengths emitted by the SOA chip is amplified in the resonant cavity, and after the light is amplified to meet the standard, the amplified light is subjected to wavelength selection and modulation in the silicon optical chip to obtain signal light with corresponding wavelengths. The silicon optical chip has the advantages of low optical loss, high integration density and CMOS compatibility, and has huge application potential in the aspect of developing low-cost and high-speed photoelectric devices.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

fig. 2 is a schematic structural diagram of an optical network terminal;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 4 is an exploded schematic view of an optical module according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a tunable optical transmission element in an optical module according to an embodiment of the present disclosure;

fig. 6 is an exploded schematic view of a tunable optical transmission element in an optical module according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a first housing in an optical module according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of an adapting ceramic block in an optical module according to an embodiment of the present disclosure;

fig. 9 is a schematic partial structural diagram of a tunable optical transmission assembly in an optical module according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a silicon optical chip in an optical module according to an embodiment of the present disclosure;

fig. 11 is a top view of a silicon optical chip in an optical module according to an embodiment of the present disclosure;

fig. 12 is a top view of a tunable optical transmission assembly in an optical module according to an embodiment of the present disclosure;

fig. 13 is a schematic optical path diagram of a light emitting device in an optical module according to an embodiment of the present disclosure.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 via the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a first boss portion such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application, and fig. 4 is an exploded schematic diagram of the optical module according to the embodiment of the present application. As shown in fig. 3 and 4, the optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, a tunable optical transmission assembly 400, and an optical fiber adapter 700.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity generally presents a square body. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper shell 201 on the lower shell 202.

The two openings can be two end openings (204, 205) located at the same end of the optical module, or two openings located at different ends of the optical module; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect the tunable optical transmission assembly 400 inside the optical module; optoelectronic devices such as circuit board 300, tunable optical transmission assembly 400, fiber optic adapter 700 are located in the package cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the tunable light emitting assembly 400, the optical fiber adapter 700 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the packaging protection shell at the outermost layer of the module; the upper shell and the lower shell are made of metal materials generally, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component generally, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking member 203 is pulled to make the unlocking member 203 relatively move on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; by pulling the unlocking member 203, the engaging member of the unlocking member 203 moves along with the unlocking member, and further, the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 is used to provide signal circuits for signal electrical connection, which can provide signals. The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.

Fig. 5 is a schematic structural diagram of the tunable optical transmission assembly 400 in the optical module provided in the embodiment of the present application, and fig. 6 is an exploded schematic diagram of the tunable optical transmission assembly 400 in the optical module provided in the embodiment of the present application. As shown in fig. 5 and 6, one end of the tunable optical transmission assembly 400 is connected to the circuit board 300 through the flexible board 500, and the circuit board 300 powers up and provides a high frequency signal to the optical device of the tunable optical transmission assembly 400 through the flexible board 500; the other end of the tunable optical transmission assembly 400 is connected to the optical fiber adapter 700, and the signal light emitted by the tunable optical transmission assembly 400 is transmitted to an external optical fiber through the optical fiber adapter 700, so as to realize emission of the signal light.

Tunable optical transmission assembly 400 includes a housing 600 and an optical transmission device 800 disposed in housing 600, where housing 600 is provided with a notch, and a through-connection ceramic block 602 is disposed at the notch, and through-connection ceramic block 602 is hermetically connected to the notch. Pins are arranged on the outer wall of the switching ceramic block 602, and the flexible board 500 is connected with the pins to realize the connection between the flexible board 500 and the tunable light emitting assembly 400; the interior of the relay ceramic block 602 is provided with a pad, and the light emitting device 800 is connected to the pad by a gold wire bonding wire to transmit an electrical signal, a high frequency signal, etc. transmitted from the circuit board 300 to the tunable light emitting assembly 400 to the light emitting device 800, so that the light emitting device 800 emits a signal light.

Fig. 7 is a schematic structural diagram of a first housing 601 in an optical module provided in the embodiment of the present application, and fig. 8 is a schematic structural diagram of a through-connection ceramic block 602 in the optical module provided in the embodiment of the present application. As shown in fig. 7 and 8, the housing 600 includes a first housing 601, a bottom plate 603, and an upper cover plate 604, wherein the first housing 601, the adapting ceramic block 602, the bottom plate 603, and the upper cover plate 604 form a sealed cavity, and the light emitting device 800 is disposed in the sealed cavity.

The first housing 601 includes a first side plate 6011, a second side plate 6012, a third side plate 6013, and a fourth side plate 6014, the first side plate 6011, the second side plate 6012, the third side plate 6013, and the fourth side plate 6014 are sequentially connected to enclose a rectangular housing with an upper end and a lower end open, the upper cover plate 604 is connected to the upper end opening of the first housing 601 in a sealing manner, and the bottom plate 603 is connected to the lower end opening of the first housing 601 in a sealing manner. The notch 6016 is disposed on the second side plate 6012 along the length direction of the first side plate 6011, and the transferring ceramic block 602 is hermetically connected to the first housing 601 through the notch. The notch 6016 on the first housing 601 is located at the lower end of the second side plate 6012, the top surface of the notch on the second side plate 6012 abuts against the top surface of the adapting ceramic block 602, and the side surface of the notch 6016 abuts against the side surface of the adapting ceramic block 602. In this example, the first housing 601 is a metal housing formed integrally.

The adapting ceramic block 602 comprises a fifth side plate 6021, a sixth side plate 6022 and a seventh side plate 6023, wherein two ends of the sixth side plate 6022 are respectively connected with the fifth side plate 6021 and the seventh side plate 6023, and the fifth side plate 6021, the seventh side plate 6023 and the sixth side plate 6022 are arranged at a certain angle. That is, the fifth side plate 6021 and the sixth side plate 6022 are coupled to the seventh side plate 6023 to form a C-shaped block, the top surface of the C-shaped block is coupled to the top surface of the notch 6016 in a sealing manner, the side surface of the opening of the C-shaped block is coupled to the side surface of the notch 6016 in a sealing manner, and the bottom surface of the C-shaped block is coupled to the upper side surface of the bottom plate 603 in a sealing manner.

The sixth side plate 6022 is provided with a boss 6024, a pin 6025 is provided on the side surface of the boss 6024, and the flexible board 500 is connected with the pin 6025 to transmit the signal on the circuit board 300 to the relay ceramic block 602 through the flexible board 500. A groove 6026 is formed on the inner wall of the interposer ceramic block 602, a pad 6027 is formed on the bottom surface of the groove 6026, and the light emitting device 800 may be connected to the pad 6027 by a gold wire bonding wire to transmit a signal transmitted from the interposer ceramic block 602 to the light emitting device 800.

Specifically, the inner side of the C-shaped block formed by the fifth side plate 6021, the sixth side plate 6022 and the seventh side plate 6023 is provided with a groove 6026, the groove 6026 is a C-shaped groove 6026, a pad 6027 is provided on the bottom surface of the C-shaped groove 6026, and a light emitting device 800 is enclosed in an inner wall connected to the bottom surface of the C-shaped groove 6026 to facilitate connection of the pad 6027 with the light emitting device 800 by a gold wire bonding wire.

The housing 600 provided by the present application adopts a structure form of sealing connection among the first housing 601, the adapting ceramic block 602, the bottom plate 603 and the upper cover plate 604, which can facilitate the connection of the light emitting device 800 and the flexible board 500. During assembly, the light emitting device 800 is firstly fixed on the bottom plate 603, and then the first housing 601 is covered on the bottom plate 603, so that the bottom surface of the first housing 601 is in braze welding and sealing connection with the upper side surface of the bottom plate 603; then, the adapting ceramic block 602 is installed at the notch 6016 of the first housing 601, the bottom surface of the adapting ceramic block 602 is in brazing sealing connection with the upper side surface of the bottom plate 603, and the top surface and the side surface of the adapting ceramic block 602 are in brazing sealing connection with the side surface of the notch 6016 respectively; the upper cover 604 is then fitted over the first housing 601, and the top surface of the first housing 601 is sealingly coupled to the lower side of the upper cover 604, thereby completing the hermetic assembly of the housing 600 and enclosing the light emitting device 800 within the housing 600.

The light emitting device 800 is electrically connected to the circuit board 300 through the interposer ceramic block 602 and the flexible board 500, and the distance between the pin 6025 connected to the flexible board 500 on the interposer ceramic block 602 and the pad 6027 is short, so that the signal transmission distance is short, and thus the signal transmitted by the circuit board 300 through the flexible board 500 is less.

A through hole 6015 is disposed on the fourth side plate 6014 of the first housing 601, and the fiber adapter 700 is connected to the housing 600 through the through hole 6015, so that the fiber adapter 700 is assembled with the housing 600.

Fig. 9 is a schematic structural diagram of a light emitting device 800 in a light module according to an embodiment of the present application. As shown in fig. 9, the light emitting device 800 includes a semiconductor cooler 801, and a silicon optical chip 802, an SOA chip 805 and a transit ceramic board 804 which are disposed on the semiconductor cooler 801, wherein the semiconductor cooler 801 is disposed on the bottom board 603 for controlling the temperature inside the housing 600, and the silicon optical chip 802 and the SOA chip 805 are both disposed on the surface of the semiconductor cooler 801 and in direct contact with each other, thereby ensuring better heat dissipation of the silicon optical chip 802 and the SOA chip.

The silicon optical chip 802 is arranged in the light emitting direction of the SOA chip 805, the SOA chip 805 and the silicon optical chip 802 form a resonant cavity, light which does not carry signals and is emitted by the SOA chip 805 enters the silicon optical chip 802, the light interferes in the silicon optical chip 802, part of the light returns to the SOA chip 805 again to be subjected to resonant amplification, the operation is repeated until the intensity of the light meets the standard requirement, the amplified light is modulated by the silicon optical chip 802 to obtain signal light, and the signal light is emitted by the silicon optical chip 802 and then is coupled to the optical fiber adapter 700 through a lens, so that the emission of the signal light is realized.

An SOA lens 807 is further arranged between the SOA chip 805 and the silicon optical chip 802, and the SOA lens 807 is a converging lens and is used for converging light emitted by the SOA chip 805 to the silicon optical chip 802 so as to improve the optical path coupling efficiency.

A heat sink 803 is further arranged between the SOA chip 805 and the semiconductor refrigerator 801, the heat sink 803 is pasted on the upper surface of the semiconductor refrigerator 801, the SOA chip 805 is pasted on the upper surface of the heat sink 803, and therefore heat generated by the SOA chip 805 is conducted to the semiconductor refrigerator 801 through the heat sink 803, and heat dissipation efficiency of the SOA chip 805 can be improved.

The SOA chip 805 can emit light with various wavelengths, the light with various wavelengths emitted by the SOA chip 805 is amplified in a resonant cavity formed between the SOA chip 805 and the silicon optical chip 802, the amplified light is subjected to wavelength selection, signal modulation and the like in the silicon optical chip 802, the silicon optical chip 802 can be subjected to wavelength selection through temperature control, and thus the temperature of the silicon optical chip 802 can be controlled through the semiconductor refrigerator 801, so that the function of wavelength selection is achieved.

A thermistor 806 can also be disposed on the heat sink 803, and the thermistor 806 can control the temperature inside the casing 600 together with the semiconductor cooler 801, so as to better control the temperature of the silicon optical chip 802, thereby improving the wavelength selection performance.

Fig. 10 is a schematic structural diagram of a silicon optical chip 802 in an optical module according to an embodiment of the present application, and fig. 11 is a schematic structural diagram of another angle of the silicon optical chip 802 in the optical module according to the embodiment of the present application. As shown in fig. 10 and 11, the silicon optical chip 802 includes an input optical port 8021 and an output optical port 8022, the input optical port 8021 is disposed in the light exit direction of the SOA chip 805, so that light emitted from the SOA chip 805 is converged into the input optical port 8021 of the silicon optical chip 802 through the SOA lens 807, and the light is conveniently amplified in a resonant cavity formed by the silicon optical chip 802 and the SOA chip 805.

In order to avoid crosstalk and return loss, the input port 8021 of the silicon optical chip 802 and the end surface of the silicon optical chip 802 form a certain angle, that is, the input port 8021 and the horizontal plane form a certain angle, so the exit end surface of the SOA chip 805 and the horizontal plane also form a certain angle, and similarly, the converging light path of the SOA lens 807 and the horizontal plane also form a certain angle. By the arrangement, the light emitted by the SOA chip 805 can be prevented from being reflected at the end face of the input port 8021 and returning to the SOA chip 805, and the light emitted by the SOA chip 805 can be prevented from being reflected at the end face of the input port 8021 and the reflected light enters the silicon optical chip 802 to influence the signal modulation of the light in the silicon optical chip 802.

In the embodiment of the present application, an angle between the exit end surface of the SOA chip 805 and the horizontal plane, an angle between the input port 8021 of the silicon optical chip 802 and the horizontal plane, and an angle between the converged light path of the SOA lens 807 and the horizontal plane are all 19.5 °, so that the maximum coupling efficiency of the light path can be ensured.

The output light port 8022 and the input light port 8021 of the silicon optical chip 802 have a preset angle, and are configured to output the modulated signal light with the corresponding wavelength, and the signal light is converged and coupled into the optical fiber adapter 700, so that the output light port 8022 of the silicon optical chip 802 is located in the light incidence direction of the optical fiber adapter 700. In order to couple the signal light output by the output light port 8022 to the optical fiber adapter 700, a collimating lens 808 and a converging lens 8010 are sequentially disposed between the output light port 8022 and the optical fiber adapter 700, the collimating lens 808 and the converging lens 8010 are both adhered to the upper surface of the semiconductor refrigerator 801, and the output light port 8022, the collimating lens 808, the converging lens 8010 and the optical fiber adapter 700 are located on the same light path. After the signal light output by the output light port 8022 enters the collimating lens 808, the collimating lens 808 converts the signal light into a collimated light beam, the collimated light beam enters the converging lens 8010, the converging lens 8010 converts the collimated light beam into a converging light beam, and the converging light beam is coupled to the optical fiber adapter 700.

The converged light beam is coupled into the optical fiber adapter 700, and is easily reflected on the end surface of the optical fiber ferrule of the optical fiber adapter 700, and the reflected light beam is easily emitted into the output light port 8022 of the silicon optical chip 802 through the converging lens 8010 and the collimating lens 808, so as to affect the signal modulation of the silicon optical chip 802. Thus, an isolator 809 can be arranged between the collimating lens 808 and the converging lens 8010, after the signal light is output from the output port 8022 of the silicon optical chip 802 and enters the collimating lens 808, the collimating lens 808 converts the signal light into a collimated light beam, the collimated light beam enters the converging lens 8010 after passing through the isolator 809, the converging lens 8010 converts the collimated light beam into a converging light beam, and the converging light beam is coupled to the optical fiber adapter 700; the light beam reflected by the converged light beam on the end face of the optical fiber ferrule of the optical fiber adapter 700 penetrates through the converging lens 8010 and then enters the isolator 809, and the isolator 809 filters the reflected light beam, so that the reflected light beam cannot enter the silicon optical chip 802, and the return loss of light is avoided.

In the embodiment of the present application, the interposer ceramic board 804 may be arranged on the upper surface of the semiconductor cooler 801 in parallel with the silicon optical chip 802, and the silicon optical chip 802 is directly connected to the pad 6027 on the interposer ceramic block 602 by a gold wire bonding wire to receive the power-on signal and the high-frequency signal transmitted by the circuit board 300 through the interposer ceramic block 602; the SOA chip 805, the thermistor 806 and other devices are respectively connected with the transit ceramic board 804 through gold wire bonding wires, and the transit ceramic board 804 is connected with the pad 6027 on the inner wall of the transit ceramic block 602 through gold wire bonding wires so as to receive the power-on signal transmitted by the circuit board 300 through the transit ceramic block 602; semiconductor cooler 801 is electrically connected to relay ceramic block 602 through base plate 603 to receive a power-on signal transmitted from circuit board 300 through relay ceramic block 602, base plate 603. Thus, the SOA chip 805 emits light of various wavelengths under the signal effect; the semiconductor cooler 801 adjusts the temperature in the housing 600 under the signal action, so that the silicon optical chip 802 performs wavelength selection under temperature control; the silicon optical chip 802 modulates the light with the selected wavelength under the action of the signal to obtain signal light, and the signal light is coupled into the optical fiber adapter 700.

A glass optical window 8011 may be further disposed between the converging lens 8010 and the fourth side plate 6014 of the first casing 601, the glass optical window 8011 may be adhered to an inner side surface of the fourth side plate 6014, and a central axis of the glass optical window 8011 coincides with a central axis of the through hole 6015 of the fourth side plate 6014, so as to ensure transmission of the converging light beams from the inside to the outside of the casing 600.

Fig. 12 is a partial top view of the tunable optical transceiver module 400 in the optical module according to the embodiment of the present disclosure, and fig. 13 is a schematic optical path diagram of the optical transceiver device 800 in the optical module according to the embodiment of the present disclosure. As shown in fig. 12 and 13, the tunable optical transmission assembly 400 encapsulates the silicon optical chip 802 of the multi-wavelength tunable device and the SOA chip 805 together in a housing, and includes two paths of transmitting end optical paths, one path of optical path is that light emitted by the SOA chip 805 is converged to an input optical port 8021 of the silicon optical chip 802 through the SOA lens 807, and the light is resonance-amplified through a resonant cavity formed by the silicon optical chip 802 and the SOA chip 802; the other optical path is that the light after resonance amplification is subjected to wavelength selection in the silicon optical chip 802, the light after wavelength selection is subjected to signal modulation in the silicon optical chip 802, the modulated signal light is emitted from an output light port 8022 of the silicon optical chip 802 after phase interference, the emitted signal light is converted into a collimated light beam through a collimating lens 808, the collimated light beam is emitted into a converging lens 8010 through an isolator 809, the signal light is coupled to the optical fiber adapter 700 through the converging lens 8010, and the signal light is transmitted to an external optical fiber through the optical fiber adapter 700, so that light emission is realized.

The tunable optical transmission assembly 400 provided by the embodiment of the present application includes the following specific steps: first, the SOA chip 805 is soldered to the heat sink 803; then the thermistor 806 is adhered to the corresponding position of the heat sink 803 by silver glue; then, the semiconductor refrigerator 801 is adhered to the bottom plate 603 of the shell 600 by silver glue for curing; then the silicon optical chip 802, the heat sink 803 and the adapter ceramic plate 804 are bonded at corresponding positions of the semiconductor refrigerator 801 by silver adhesive; then, the silicon optical chip 802 and a bonding pad 6027 on the transit ceramic block 602, the SOA chip 805 and a transit ceramic plate 804, the thermistor 806 and the transit ceramic plate 804, and the transit ceramic plate 804 and the bonding pad 6027 on the transit ceramic block 602 are connected through a gold wire bonding wire, so that electrical connection is realized; then, the SOA lens 807 is pasted at the corresponding position of the semiconductor refrigerator 801 according to the light emergent direction of the SOA chip 805; then, the collimating lens 808 is aligned and coupled according to the light emitting direction of the silicon optical chip 802, the light spot is inspected through a beam scanner, and then the collimating lens 808 is pasted on the semiconductor refrigerator 801 according to the inspection condition; then passively mounting an isolator 809 and a converging lens 8010 on the chip mounter, and pasting the isolator 809 and the converging lens 8010 on the semiconductor refrigerator 801; then, a parallel sealing machine shell is adopted, namely the first shell 601, the switching ceramic block 602, the bottom plate 603 and the upper cover plate 604 are sealed by the parallel sealing machine, so that the light emitting device 800 is sealed in the shell 600; and finally, coupling the optical fiber adapter 700 to the maximum optical power, and fixing the optical fiber adapter 700 to the shell 600 by using a laser welding machine.

Because the silicon optical chip has the advantages of low optical loss, high integration density and compatibility with CMOS, the silicon optical chip has huge application potential in the aspect of developing low-cost and high-speed photoelectric devices, and the silicon optical chip is packaged into a 25G wireless adjustable wavelength optical device, so that the application development of a silicon optical technology in an optical module is promoted. According to the method, the silicon optical chip and the SOA chip are packaged together, and the wavelength can be tuned based on the silicon optical chip and the SOA chip, so that the optical module has a multi-wavelength tunable function, has good advantages in the aspects of low cost, wide tuning range, low power consumption and the like, and is an optimal solution for solving 25G colorless optical modules.

It should be noted that, in the present specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims

1. A light module, comprising:

a circuit board;

wherein the tunable optical transmission component comprises:

2. The optical module according to claim 1, wherein the housing includes a first housing, and an upper cover plate and a bottom plate covering the first housing, the first housing includes a first side plate, a second side plate, a third side plate and a fourth side plate, and the first side plate, the second side plate, the third side plate and the fourth side plate are sequentially connected to form a cavity housing;

the notch is arranged on the second side plate along the length direction of the first side plate, and the switching ceramic block is connected with the first shell in a sealing mode through the notch.

3. The optical module according to claim 2, wherein the adapting ceramic block comprises a fifth side plate, a sixth side plate and a seventh side plate, two ends of the sixth side plate are respectively connected with the fifth side plate and the seventh side plate, and the fifth side plate, the seventh side plate and the sixth side plate are arranged at an angle; the side surfaces of the fifth side plate, the sixth side plate and the seventh side plate are respectively in sealing connection with the side surface of the notch;

and a boss is arranged on the sixth side plate, and the pin is arranged on the boss.

4. The optical module as claimed in claim 3, wherein the inner wall of the adapting ceramic block is provided with a groove, and the bonding pad is disposed on a bottom surface of the groove.

5. The optical module of claim 1, wherein the silicon optical chip comprises an input optical port and an output optical port, the input optical port is disposed in a light exiting direction of the SOA chip, and a preset angle is formed between the output optical port and the input optical port.

6. The optical module of claim 5, wherein the input optical port of the silicon optical chip is disposed at an angle to an end surface of the silicon optical chip.

7. The optical module of claim 1, wherein the tunable optical transmission assembly further comprises a semiconductor cooler disposed within the housing, and wherein the SOA chip, the silicon optical chip, and the transition ceramic board are disposed on the semiconductor cooler.

8. The optical module of claim 7, wherein an SOA heat sink is disposed between the SOA chip and the semiconductor refrigerator, and the SOA chip is disposed on the SOA heat sink; and the SOA heat sink is also provided with a thermistor.

9. The optical module of claim 7, wherein a lens is disposed on the semiconductor cooler for optically coupling the signal light of the corresponding wavelength emitted from the silicon optical chip to a fiber adapter.