CN114110838A - Semiconductor heat exchanger device with multiple air outlets - Google Patents
Semiconductor heat exchanger device with multiple air outlets Download PDFInfo
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- CN114110838A CN114110838A CN202111313660.1A CN202111313660A CN114110838A CN 114110838 A CN114110838 A CN 114110838A CN 202111313660 A CN202111313660 A CN 202111313660A CN 114110838 A CN114110838 A CN 114110838A
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- air outlet
- heat exchange
- air
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- heater
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/50—Control or safety arrangements characterised by user interfaces or communication
- F24F11/54—Control or safety arrangements characterised by user interfaces or communication using one central controller connected to several sub-controllers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/50—Control or safety arrangements characterised by user interfaces or communication
- F24F11/56—Remote control
- F24F11/58—Remote control using Internet communication
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/70—Control systems characterised by their outputs; Constructional details thereof
- F24F11/72—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure
- F24F11/79—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure for controlling the direction of the supplied air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/70—Control systems characterised by their outputs; Constructional details thereof
- F24F11/80—Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air
- F24F11/83—Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air by controlling the supply of heat-exchange fluids to heat-exchangers
- F24F11/84—Control systems characterised by their outputs; Constructional details thereof for controlling the temperature of the supplied air by controlling the supply of heat-exchange fluids to heat-exchangers using valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/08—Air-flow control members, e.g. louvres, grilles, flaps or guide plates
- F24F13/10—Air-flow control members, e.g. louvres, grilles, flaps or guide plates movable, e.g. dampers
- F24F13/14—Air-flow control members, e.g. louvres, grilles, flaps or guide plates movable, e.g. dampers built up of tilting members, e.g. louvre
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to a semiconductor heat exchanger device with multiple air outlets. The problem that a semiconductor air conditioner in the prior art is poor in use flexibility is solved. The semiconductor heat exchange unit comprises a semiconductor heat exchange unit, a heater assembly used for transmitting heat of the semiconductor heat exchange unit is arranged on one side of the semiconductor heat exchange unit, a refrigerator assembly used for transmitting cold of the semiconductor heat exchanger is arranged on the other side of the semiconductor heat exchange unit, a plurality of refrigerator air guide structures are circumferentially arranged on the refrigerator assembly, a plurality of heater air guide structures are circumferentially arranged on the heater assembly, and a heat dissipation assembly is arranged on one side, away from the semiconductor heat exchange unit, of the heater assembly. The invention has the advantages that: simple structure, reasonable in design have avoided cold wind and hot-blast sharing same exit position, use in a flexible way.
Description
Technical Field
The invention relates to the technical field of air conditioning equipment, in particular to a semiconductor heat exchanger device with multiple air outlets.
Background
The semiconductor air conditioner utilizes the Peltier effect to refrigerate or heat, and has the characteristics of low cost, high refrigerating or heating speed, no rotating part, no refrigerant and environmental friendliness. However, because of the low coefficient of performance, a large amount of heat or cold is generated while refrigerating or heating, if the heat or cold is dissipated indoors, the temperature of the room cannot be lowered or raised, and the temperature of the room can be raised or lowered, which seriously limits the wide application of the semiconductor air conditioner; moreover, in the conventional semiconductor air conditioning system, since the contact area of the air with the cooling surface or the heating surface is limited, the air is greatly restricted from being rapidly cooled or heated; meanwhile, most of the existing semiconductor air conditioning equipment adopts a current switching mode to realize the function switching of refrigeration and heating, but when a plurality of air outlets and cold air and hot air outlet positions are different, the traditional heat exchange mode easily leads to the cold air and the hot air to use the same outlet position, and the use flexibility is poor.
In order to solve the defects of the prior art, people have long searched for and put forward various solutions. For example, the chinese patent document discloses a heat/cold storage type two-flow semiconductor air conditioning apparatus [ cn201811485265.x ], which includes a semiconductor refrigeration unit, a heat exchange unit, an exhaust fan, and a power supply controller. The heating/refrigerating machine core is divided into an upper layer and a lower layer which have the same structure, an air inlet is formed among the heat exchange sheets of the first heat exchange unit at the lower layer, an air outlet is formed among the heat exchange sheets of the first heat exchange unit at the upper layer, an exhaust fan is arranged at the air outlet, and air enters from the air inlet and passes through the reflux groove and is exhausted from the air outlet by the exhaust fan. The air conditioning device absorbs the cold or heat of the semiconductor refrigerating unit through the heat exchange unit and the heat storage material, when the environment needs refrigerating, the heat released by the semiconductor refrigerating unit is absorbed by the heat storage material, and when the environment needs heating, the cold released by the semiconductor refrigerating unit is absorbed by the heat storage material. The semiconductor refrigerating unit realizes the switching of refrigeration and heating by converting the positive pole and the negative pole of the direct current power supply. The reflux groove effectively increases the heat exchange area and the heat exchange time, and improves the refrigeration or heating efficiency.
The scheme solves the problem that the cold or heat of the semiconductor air-conditioning equipment is easy to dissipate indoors and influence the indoor temperature in the prior art to a certain extent, but the scheme still has a plurality of defects, such as: most of the existing semiconductor air conditioning equipment adopts a current switching mode to realize the function switching of refrigeration and heating, but when a plurality of air outlets and cold air and hot air outlet positions are different, the traditional heat exchange mode easily leads to the cold air and the hot air to use the same outlet position, and the use flexibility is poor.
Disclosure of Invention
The invention aims to solve the problems and provides a semiconductor heat exchanger device with multiple air outlets, which is reasonable in design and flexible to use.
In order to achieve the purpose, the invention adopts the following technical scheme: this semiconductor heat exchanger device with many air outlets, including semiconductor heat transfer unit, semiconductor heat transfer unit one side is equipped with the heater subassembly that is used for transmitting the semiconductor heat transfer unit heat, and the opposite side is equipped with the refrigerator subassembly with the cold volume of transmission semiconductor heat exchanger, and refrigerator subassembly circumference is equipped with a plurality of refrigerator wind-guiding structures, and heater subassembly circumference is equipped with a plurality of heater wind-guiding structures, and one side that the semiconductor heat transfer unit was kept away from to the heater subassembly is equipped with radiator unit. Through setting up the refrigerator wind-guiding structure of a plurality of different wind-guiding directions at refrigerator subassembly circumference to set up a plurality of heat producer wind-guiding structures that are different from refrigerator wind-guiding structure wind-guiding direction on the heat producer subassembly, make the air outlet of heat producer subassembly and refrigerator subassembly be located different positions respectively, avoid sharing the problem of air outlet, can freely adjust the air-out direction according to actual conditions moreover, use in a flexible way.
In the semiconductor heat exchanger device with multiple air outlets, one side of the semiconductor heat exchange unit is provided with the heat conducting substrate which is in contact with the heater assembly, and the other side of the semiconductor heat exchange unit is provided with the cold conducting substrate which is in contact with the refrigerator assembly.
In the semiconductor heat exchanger device with multiple air outlets, the refrigerator component comprises a cold air cover with openings on two sides, a refrigerator is arranged in the cold air cover, the refrigerator is tightly attached to the cold guide substrate, a first air guide cover is arranged at the lower end of one side of the cold air cover, a second air guide cover is arranged at the upper end of the other side of the cold air cover, and a third air guide cover is arranged at the upper end of the cold air cover; one side of the cold wind hood facing the cold guide substrate is open and is flush with the cold guide substrate. The arrangement can effectively save the installation space.
In the semiconductor heat exchanger device with multiple air outlets, the refrigerator air guide structure comprises a first heat exchange fan arranged on one side of the first air guide cover, which is far away from the refrigerator, a first heat exchange air outlet is arranged on the first heat exchange fan, and a first switch valve capable of opening or closing the first heat exchange air outlet is arranged on the first heat exchange air outlet; a second heat exchange fan is arranged on the two sides, away from the refrigerator, of the second air guide cover, a second heat exchange air outlet is formed in the second heat exchange fan, and a second switch valve capable of opening or closing the second heat exchange air outlet is arranged on the second heat exchange air outlet; and a third heat exchange fan is arranged on one side, away from the refrigerator, of the third wind scooper, a third heat exchange air outlet is formed in the third heat exchange fan, and a third switch valve capable of opening or closing the third heat exchange air outlet is arranged on the third heat exchange air outlet. The cold air outlet direction of the refrigerator can be freely adjusted by arranging the refrigerator air guide structure, and the using effect is good.
In the semiconductor heat exchanger device with the multiple air outlets, the outer wall of the cold air hood is provided with the ECU controller connected with the semiconductor heat exchange unit, the ECU controller is respectively connected with the first switch valve, the second switch valve and the third switch valve, and the ECU controller is in data connection with the external mobile terminal through a wireless network or a data network. The ECU controller replaces the traditional current switching control cold and hot mode, and the condition that cold air and hot air use the same outlet position is avoided.
In the semiconductor heat exchanger device with multiple air outlets, the first heat exchange air outlet, the second heat exchange air outlet and the third heat exchange air outlet are respectively provided with a heat exchange air outlet dust screen, and the heat exchange air outlet dust screens are detachably arranged. The dust screen of the heat exchange air port can prevent dust or sundries from entering the interior, the protection effect is good, and the dust screen is convenient to disassemble and clean.
In the above semiconductor heat exchanger device with multiple air outlets, the heater assembly includes a heater mounting cover, a heater is arranged in the heater mounting cover, one side of the heater is tightly attached to the heat conducting substrate, one side of the heater mounting cover, which is far away from the heat conducting substrate, is provided with an air outlet opening, and the other side of the heater mounting cover is provided with a heat conducting opening.
In the above semiconductor heat exchanger device with multiple air outlets, the heat dissipation assembly comprises a fan mounting seat mounted on the air outlet opening, a heat dissipation fan is arranged in the fan mounting seat, one side of the fan mounting seat is circumferentially fixed on the heater mounting cover, and the inner side of the fan mounting seat in the circumferential direction is communicated with the air outlet opening. The arrangement is such as to keep the exhaust air open.
In the semiconductor heat exchanger device with multiple air outlets, the heat generator air guiding structure includes a first heat generator air outlet arranged on one side of the heat generator mounting cover, and a second heat generator air outlet horizontally extending towards the refrigerator assembly is arranged on one side of the bottom of the heat generator mounting cover. The air outlets of the first heater and the second heater in different air outlet directions are arranged, so that the requirements of air outlet directions in different positions are met.
In the above semiconductor heat exchanger device with multiple air outlets, the air outlets of the first and second heaters are provided with air outlet dust covers, and the air outlet of the first heater is provided with a first air outlet valve, and the air outlet of the second heater is provided with a second air outlet valve. The first air outlet valve and the second air outlet valve are arranged to be freely opened and closed according to actual conditions, and the use is flexible.
Compared with the prior art, the invention has the advantages that: reasonable in design, moreover, the steam generator is simple in structure, refrigerator wind-guiding structure through setting up a plurality of different wind-guiding directions at refrigerator subassembly circumference, and set up the heater wind-guiding structure of a plurality of different wind-guiding directions on the heater subassembly, the air outlet that makes heater subassembly and refrigerator subassembly is located different positions respectively, satisfy different air-out demands, and can nimble switching as required, and use is nimble, and simultaneously, the mode of replacing traditional current switching is put to the cold and hot mode of putting through ECU controller control semiconductor heat transfer unit realizes refrigerating and heating, the condition of cold wind and hot-blast sharing air outlet has been avoided, excellent in use effect.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an exploded view of a portion of the structure of the present invention;
FIG. 3 is a front view of the present invention;
FIG. 4 is a schematic view of a cooling hood according to the present invention;
FIG. 5 is a schematic view of the heater installation cover according to the present invention.
In the figure, a semiconductor heat exchange unit 1, a heat conducting substrate 11, a cold conducting substrate 12, a semiconductor refrigerating unit 13, a semiconductor heating unit 14, a heater assembly 2, a heater installation cover 21, a heater 22, an air outlet opening 23, a heat conducting opening 24, a refrigerator assembly 3, a cold wind cover 31, a refrigerator 32, a first wind guide cover 33, a second wind guide cover 34, a third wind guide cover 35, a refrigerator wind guide structure 4, a first heat exchange fan 41, a first heat exchange air outlet 42, a first switch valve 43, a second heat exchange fan 44, a second heat exchange air outlet 45, a second switch valve 46, a third heat exchange fan 47, a third heat exchange air outlet 48, a third switch valve 49, a heater wind guide structure 5, a first heater air outlet 51, a second heater air outlet 52, an air outlet dust cover 53, a first air outlet valve 54, a second air outlet valve 55, a heat dissipation assembly 6, a fan installation seat 61, Cooling fan 62, ECU controller 7, heat transfer wind gap dust screen 8.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1-5, the semiconductor heat exchanger device with multiple air outlets includes a semiconductor heat exchange unit 1, a heater assembly 2 for transferring heat of the semiconductor heat exchange unit 1 is disposed on one side of the semiconductor heat exchange unit 1, a refrigerator assembly 3 for transferring cold of the semiconductor heat exchanger is disposed on the other side of the semiconductor heat exchange unit, a plurality of refrigerator air guide structures 4 are circumferentially disposed on the refrigerator assembly 3, a plurality of heater air guide structures 5 are circumferentially disposed on the heater assembly 2, and a heat dissipation assembly 6 is disposed on one side of the heater assembly 2 away from the semiconductor heat exchange unit 1. Through setting up semiconductor heat exchange unit 1 between refrigerator subassembly 3 and heater subassembly 2 to utilize refrigerator wind guide structure 4 that circumference set up on refrigerator subassembly 3 to carry out the not equidirectional airing exhaust, and set up the heater wind guide structure 5 of different direction on heater subassembly 2, satisfy the cold wind of not equidirectional or hot-blast emission, use in a flexible way.
The semiconductor heat exchange unit 1 is of a split structure, one of the semiconductor heat exchange units is a semiconductor refrigerating unit 13, the other semiconductor heat exchange unit is a semiconductor heating unit 14, the semiconductor refrigerating unit 13 is in mutual contact with the cold guide substrate 12, and the semiconductor heating unit 14 is in mutual contact with the heat guide substrate 11.
Visibly, the refrigerator assembly 3 includes a cold wind hood 31 with openings on two sides, a refrigerator 32 is arranged in the cold wind hood 31, the refrigerator 32 is closely attached to the cold guide substrate 12, a first wind scooper 33 is arranged at the lower end of one side of the cold wind hood 31, a second wind scooper 34 is arranged at the upper end of the other side of the cold wind hood 31, a third wind scooper 35 is arranged at the upper end of the cold wind hood 31, and one side of the cold wind hood 31 facing the cold guide substrate 12 is open and is flush with the cold guide substrate 12. The cooler 32 here uses pin fins to ventilate and dissipate heat in the circumferential direction.
Obviously, the refrigerator air guiding structure 4 includes a first heat exchange fan 41 disposed on one side of the first air guiding cover 33 away from the refrigerator 32, a first heat exchange air outlet 42 is disposed on the first heat exchange fan 41, and a first switch valve 43 capable of opening or closing the first heat exchange air outlet 42 is disposed on the first heat exchange air outlet 42; a second heat exchange fan 44 is installed on two sides of the second air guiding cover 34 away from the refrigerator 32, a second heat exchange air outlet 45 is arranged on the second heat exchange fan 44, and a second switch valve 46 capable of opening or closing the second heat exchange air outlet 45 is arranged on the second heat exchange air outlet 45; a third heat exchange fan 47 is installed on one side of the third wind scooper 35 away from the refrigerator 32, a third heat exchange air outlet 48 is arranged on the third heat exchange fan 47, and a third switch valve 49 capable of opening or closing the third heat exchange air outlet 48 is arranged on the third heat exchange air outlet 48. The refrigerator air guide structure 4 is used for enabling cold air to meet the requirements of emission in different directions.
Furthermore, an ECU controller 7 connected with the semiconductor heat exchange unit 1 is arranged on the outer wall of the cold air hood 31, the ECU controller 7 is respectively connected with the first switch valve 43, the second switch valve 46 and the third switch valve 49, and the ECU controller 7 is in data connection with an external mobile terminal through a wireless network or a data network. The ECU controller 7 can control cold and hot switching of the semiconductor heat exchange unit 1, remote control can be achieved by the aid of the movable end, and the use is convenient and fast.
Specifically, the first heat exchange air outlet 42, the second heat exchange air outlet 45, and the third heat exchange air outlet 48 are all provided with a heat exchange air port dust screen 8, and the heat exchange air port dust screen 8 is detachable. The heat exchange air port dustproof net 8 is used for preventing dust and dirt from entering and can be detached and cleaned at any time.
Furthermore, the heater assembly 2 includes a heater mounting cover 21, a heater 22 is disposed in the heater mounting cover 21, one side of the heater 22 is tightly attached to the heat conducting substrate 11, an air outlet opening 23 is disposed on one side of the heater mounting cover 21 away from the heat conducting substrate 11, and a heat conducting opening 24 is disposed on the other side of the heater mounting cover. The arrangement is convenient for smooth air exhaust.
More specifically, radiator unit 6 is equipped with radiator fan 62 including installing in the fan mount pad 61 of the uncovered 23 of air-out in fan mount pad 61, and fan mount pad 61 one side circumference is fixed on heater installing cover 21, and fan mount pad 61 circumference inboard communicates each other with between the uncovered 23 of air-out.
In detail, the heater air guiding structure 5 includes a first heater air outlet 51 disposed at one side of the heater mounting cover 21, and a second heater air outlet 52 horizontally extending toward the refrigerator assembly 3 is disposed at one side of the bottom of the heater mounting cover 21. The bottom of the cool air hood 31 is abutted against the upper end face of the second heater air outlet 52.
Preferably, the first heater air outlet 51 and the second heater air outlet 52 are both provided with air outlet dust covers 53, and the first heater air outlet 51 is provided with a first air outlet valve 54, and the second heater air outlet 52 is provided with a second air outlet valve 55.
In summary, the principle of the present embodiment is: under the working condition of refrigeration, the first heat exchange fan 41 and the second heat exchange fan 44 work normally, the first heat exchange air outlet 42 and the second heat exchange air outlet 45 are in an open state, the system discharges cold air, the third heat exchange fan 47 does not work, the third heat exchange air outlet 48 is in a closed state, the heat dissipation fan 62 works, the second heater air outlet 52 is in a closed state, and the first heater air outlet 51 discharges waste air to the waste air outlet; in the heating condition, the first heat exchange fan 41 and the second heat exchange fan 44 stop working, the first heat exchange air outlet 42 and the second heat exchange air outlet 45 are in the closed state, the third heat exchange fan 47 normally works, the third heat exchange air outlet 48 is in the open state and discharges waste air to the waste air outlet, the heat dissipation fan 62 works, the first heater air outlet 51 is in the closed state, and the second heat exchange air outlet 45 is in the open state, so that hot air is provided for a user.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Although the terms of the semiconductor heat exchange unit 1, the heat conductive substrate 11, the cold conductive substrate 12, the heater module 2, the heater installation cover 21, the heater 22, the air outlet opening 23, the refrigerator module 3, the cold wind cover 31, the refrigerator 32, the first air guide cover 33, the second air guide cover 34, the third air guide cover 35, the refrigerator air guide structure 4, the first heat exchange fan 41, the first heat exchange air outlet 42, the first switch valve 43, the second heat exchange fan 44, the second heat exchange air outlet 45, the second switch valve 46, the third heat exchange fan 47, the third heat exchange air outlet 48, the third switch valve 49, the heater air guide structure 5, the first heater air outlet 51, the second heater air outlet 52, the air outlet dust cover 53, the first air outlet valve 54, the second air outlet valve 55, the heat dissipation module 6, the fan installation base 61, the heat dissipation fan 62, the ECU controller 7, the heat exchange air outlet dust cover 8, etc. are used more, but does not exclude the possibility of using other terms. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
Claims (10)
1. The utility model provides a semiconductor heat exchanger device with many air outlets, includes semiconductor heat transfer unit (1), its characterized in that, semiconductor heat transfer unit (1) one side be equipped with and be used for transmitting the thermal heating ware subassembly (2) of semiconductor heat transfer unit (1), the opposite side is equipped with refrigerator subassembly (3) with transmission semiconductor heat transfer unit (1) cold volume, refrigerator subassembly (3) circumference be equipped with a plurality of refrigerator wind-guiding structures (4), heating ware subassembly (2) circumference be equipped with a plurality of heating ware wind-guiding structures (5), just heating ware subassembly (2) keep away from one side of semiconductor heat transfer unit (1) and be equipped with and be used for carrying out radiating radiator unit (6) to heating ware subassembly (2).
2. The semiconductor heat exchanger device with multiple air outlets according to claim 1, wherein a heat conducting substrate (11) in contact with the heater assembly (2) is disposed on one side of the semiconductor heat exchanging unit (1), a cold conducting substrate (12) in contact with the refrigerator assembly (3) is disposed on the other side of the semiconductor heat exchanging unit, the semiconductor heat exchanging unit (1) is of a split structure, one of the semiconductor heat exchanging unit is a semiconductor refrigerating unit (13), the other semiconductor heat exchanging unit is a semiconductor heating unit (14), the semiconductor refrigerating unit (13) and the cold conducting substrate (12) are in contact, and the semiconductor heating unit (14) and the heat conducting substrate (11) are in contact.
3. The semiconductor heat exchanger device with multiple air outlets according to claim 2, wherein the refrigerator assembly (3) comprises a cold air cover (31) with openings on two sides, a refrigerator (32) is arranged in the cold air cover (31), the refrigerator (32) is tightly attached to the cold guide substrate (12), a first air guide cover (33) is arranged at the lower end of one side of the cold air cover (31), a second air guide cover (34) is arranged at the upper end of the other side of the cold air cover (31), and a third air guide cover (35) is arranged at the upper end of the cold air cover (31); the cold air hood (31) is open towards one side of the cold guide substrate (12) and is flush with the cold guide substrate (12).
4. The semiconductor heat exchanger device with multiple air outlets according to claim 2, wherein the refrigerator air guiding structure (4) comprises a first heat exchange fan (41) disposed on a side of the first air guiding cover (33) away from the refrigerator (32), the first heat exchange fan (41) is provided with a first heat exchange air outlet (42), and the first heat exchange air outlet (42) is provided with a first switch valve (43) capable of opening or closing the first heat exchange air outlet (42); a second heat exchange fan (44) is arranged on two sides, away from the refrigerator (32), of the second air guiding cover (34), a second heat exchange air outlet (45) is formed in the second heat exchange fan (44), and a second switch valve (46) capable of opening or closing the second heat exchange air outlet (45) is arranged on the second heat exchange air outlet (45); and a third heat exchange fan (47) is installed on one side, away from the refrigerator (32), of the third air guiding cover (35), a third heat exchange air outlet (48) is formed in the third heat exchange fan (47), and a third switch valve (49) capable of opening or closing the third heat exchange air outlet (48) is arranged on the third heat exchange air outlet (48).
5. The semiconductor heat exchanger device with multiple air outlets according to claim 4, characterized in that an ECU controller (7) connected with the semiconductor heat exchange unit (1) is arranged on the outer wall of the cold air hood (31), the ECU controller (7) is respectively connected with the first switch valve (43), the second switch valve (46) and the third switch valve (49), and the ECU controller (7) is in data connection with an external mobile terminal through a wireless network or a data network.
6. The semiconductor heat exchanger device with multiple air outlets according to claim 5, wherein the first heat exchange air outlet (42), the second heat exchange air outlet (45), and the third heat exchange air outlet (48) are all provided with a heat exchange air outlet dust screen (8), and the heat exchange air outlet dust screen (8) is detachable.
7. The semiconductor heat exchanger device with multiple air outlets according to claim 2, wherein the heater assembly (2) comprises a heater mounting cover (21), a heater (22) is arranged in the heater mounting cover (21), one side of the heater (22) is tightly attached to the heat conducting substrate (11), one side of the heater mounting cover (21) far away from the heat conducting substrate (11) is provided with an air outlet opening (23), and the other side of the heater mounting cover is provided with a heat conducting opening (24).
8. The semiconductor heat exchanger device with multiple air outlets according to claim 7, wherein the heat dissipation assembly (6) comprises a fan mounting seat (61) installed at the air outlet opening (23), a heat dissipation fan (62) is arranged in the fan mounting seat (61), one side of the fan mounting seat (61) is circumferentially fixed on the heater mounting cover (21), and the circumferential inner side of the fan mounting seat (61) is communicated with the air outlet opening (23).
9. The semiconductor heat exchanger device with multiple air outlets according to claim 8, wherein the heater air guiding structure (5) comprises a first heater air outlet (51) disposed at one side of the heater mounting cover (21), and a second heater air outlet (52) horizontally extending toward the refrigerator assembly (3) is disposed at one side of the bottom of the heater mounting cover (21).
10. The semiconductor heat exchanger device with multiple air outlets according to claim 9, wherein the first heater air outlet (51) and the second heater air outlet (52) are both provided with air outlet dust covers (53), and the first heater air outlet (51) is provided with a first air outlet valve (54), and the second heater air outlet (52) is provided with a second air outlet valve (55).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111313660.1A CN114110838B (en) | 2021-11-08 | 2021-11-08 | Semiconductor heat exchanger device with multiple air outlets |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111313660.1A CN114110838B (en) | 2021-11-08 | 2021-11-08 | Semiconductor heat exchanger device with multiple air outlets |
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| CN114110838A true CN114110838A (en) | 2022-03-01 |
| CN114110838B CN114110838B (en) | 2023-04-21 |
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| CN202111313660.1A Active CN114110838B (en) | 2021-11-08 | 2021-11-08 | Semiconductor heat exchanger device with multiple air outlets |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114704891A (en) * | 2022-03-28 | 2022-07-05 | 北京理工大学 | Portable air conditioner |
| CN115489410A (en) * | 2022-09-27 | 2022-12-20 | 浙江汉恒热电科技有限公司 | Double-cup double-control vehicle-mounted cold and hot cup stand with lifting function |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2442138Y (en) * | 2000-09-06 | 2001-08-08 | 徐光荣 | Electronic temperature difference air conditioner |
| US20030145605A1 (en) * | 2002-02-07 | 2003-08-07 | Moon Dong Soo | Air conditioner having thermoelectric module |
| CN104214989A (en) * | 2014-09-24 | 2014-12-17 | 皓庭(唐山）环境科技有限公司 | Electronic refrigerating and auxiliary heating device and draught fan system |
| CN204739719U (en) * | 2015-07-04 | 2015-11-04 | 陈爱珍 | Cold and hot feeding mechanism of semiconductor based on solar energy |
| CN204757233U (en) * | 2015-07-04 | 2015-11-11 | 陈群 | Controllable cultivation room of temperature |
-
2021
- 2021-11-08 CN CN202111313660.1A patent/CN114110838B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2442138Y (en) * | 2000-09-06 | 2001-08-08 | 徐光荣 | Electronic temperature difference air conditioner |
| US20030145605A1 (en) * | 2002-02-07 | 2003-08-07 | Moon Dong Soo | Air conditioner having thermoelectric module |
| CN104214989A (en) * | 2014-09-24 | 2014-12-17 | 皓庭(唐山）环境科技有限公司 | Electronic refrigerating and auxiliary heating device and draught fan system |
| CN204739719U (en) * | 2015-07-04 | 2015-11-04 | 陈爱珍 | Cold and hot feeding mechanism of semiconductor based on solar energy |
| CN204757233U (en) * | 2015-07-04 | 2015-11-11 | 陈群 | Controllable cultivation room of temperature |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114704891A (en) * | 2022-03-28 | 2022-07-05 | 北京理工大学 | Portable air conditioner |
| CN115489410A (en) * | 2022-09-27 | 2022-12-20 | 浙江汉恒热电科技有限公司 | Double-cup double-control vehicle-mounted cold and hot cup stand with lifting function |
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| Publication number | Publication date |
|---|---|
| CN114110838B (en) | 2023-04-21 |
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