CN103993295A - Micro accurate coating system - Google Patents
Micro accurate coating system Download PDFInfo
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- CN103993295A CN103993295A CN201410202912.7A CN201410202912A CN103993295A CN 103993295 A CN103993295 A CN 103993295A CN 201410202912 A CN201410202912 A CN 201410202912A CN 103993295 A CN103993295 A CN 103993295A
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- 238000000576 coating method Methods 0.000 title claims abstract description 41
- 239000011248 coating agent Substances 0.000 title claims abstract description 40
- 238000006243 chemical reaction Methods 0.000 claims abstract description 132
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- 238000000151 deposition Methods 0.000 claims description 23
- 230000008021 deposition Effects 0.000 claims description 19
- 230000000740 bleeding effect Effects 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 5
- 239000006227 byproduct Substances 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 10
- 238000013461 design Methods 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000012423 maintenance Methods 0.000 abstract description 2
- 238000000605 extraction Methods 0.000 abstract 2
- 239000010409 thin film Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 14
- 238000000231 atomic layer deposition Methods 0.000 description 6
- 238000011160 research Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010574 gas phase reaction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007783 nanoporous material Substances 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
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- Physical Or Chemical Processes And Apparatus (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The invention discloses a micro accurate coating system. The micro accurate coating system comprises a reaction chamber system, a reaction source system and an air extraction system; the reaction chamber system is arranged at the upper part, while the reaction source system is arranged at the lower part; the reaction chamber system is hermetically connected with the reaction source system; the air extraction system is hermetically connected with the reaction chamber system. The invention provides an integrated design of the micro accurate coating system for the first time, and the micro accurate coating system is specially suitable for instrumentalization utilization in the research-oriented fields; the micro accurate coating system has the advantages that no space is occupied due to small volume, and the external dimension of the system is only 350*350*400mm so that the system can be directly put on a desktop, the actual space of the reaction chamber is small, and a roasting heating method is adopted so that the thermal field is even and the dosage of the reaction source is reduced, the operation of the system is simple, and only the thickness of a to-be-deposited thin film needs to be input so that the system can automatically run by matching parameters, and compared with the present market sold coating systems, the use and maintenance costs of the micro accurate coating system are low.
Description
Technical field
The present invention relates to a kind of technique for atomic layer deposition.
Background technology
Benzene ald is by the pulse of gas-phase reaction source alternately being passed into reactor and Chemisorption form a kind of coating technique of deposited film in deposition substrate.The pulse of gas-phase reaction source alternately enters reactor, gas-phase reaction source and in substrate, occurs from limiting the key character that chemisorption is technique for atomic layer deposition.It is to realize the inhomogeneity assurance of large area film that two or more reaction sources alternately enter reactor, the key that realizes this technology be each reaction source enter cavity saturated and adsorb after, need to utilize rare gas element to remove unnecessary reaction source and by product, avoid with after the reaction source that enters there is CVD effect.Each reaction source enters after reactor, occurs from restrictive Chemisorption in substrate, constantly repeat from limited reactions just form thickness accurately, good uniformity there is the film of outstanding surface coverage.Technique for atomic layer deposition can be realized the deposition of multiple material, such as oxide compound, nitride, metal and classes of semiconductors material and superconducting material etc., at aspects such as semi-conductor and nanoelectronics, photoelectric material and device, MEMS MEMS (micro electro mechanical system), nano materials, have a wide range of applications.
The domestic and international development about accurate coating system and invented party are to there being three at present: the one, for research application, the type coating system novelty and handiness are higher, containing multiple reaction source system, are applicable to the multiple film substrate of deposition, increase the accessory of various functions, be applicable to the exploration in various fields; The 2nd, for industrial application, the type coating system is mainly considered sedimentation velocity and big area deposition; The 3rd, for a certain special application, the type coating system is mainly concentrated application in a certain respect, with strong points, be applied to especially nano material, porous material and powder deposition aspect, the development of following coating system has three kinds of trend, and the one, multifunction, better adapts to scientific research, solve a more science difficult problem, for fundamental research is carried out in industrialized propelling; The 2nd, maximize, be mainly used in industrialization growth, solution speed and Cost Problems.The 3rd, miniaturization, coating system has application in a lot of fields, in some research fields, just using coating system as a kind of instrument, and does not require its multifunction.So convenient flexible integrated coating system just becomes demand.
Summary of the invention
The technical problem to be solved in the present invention is to overcome existing defect, provides that a kind of volume is little, deposition film quality good, the miniature accurate coating system of simple to operate, integrated design;
Another object of the present invention is to provide the applied apparatus for atomic layer deposition of a kind of above-mentioned miniature accurate coating system;
Another object of the present invention is to provide a kind of method of utilizing above-mentioned miniature accurate coating system deposition of aluminium oxide film.
Object of the present invention is carried out specific implementation by the following technical programs:
A kind of miniature accurate coating system, described miniature accurate coating system comprises reaction chamber system, reaction source system and air-bleed system, top is divided into reaction chamber system, bottom is divided into reaction source system, reaction chamber system is connected with reaction source system sealing, air-bleed system is connected with reaction chamber system sealing, wherein
Described reaction chamber system comprises vacuum chamber, reaction source entrance, the outlet of bleeding, sample inlet and chamber heating unit, reaction source entrance, the outlet of bleeding, sample inlet are communicated with vacuum chamber sealing, reaction source enters vacuum chamber by reaction source entrance from reaction source system flows out, residual reaction source and by product are discharged reaction chamber system by the outlet of bleeding, and sample enters vacuum chamber by sample inlet;
Described reaction source system comprises reaction source container and reaction source outlet, between reaction source container and reaction source outlet, is provided with valve, controls the outflow of reaction source, and described reaction source outlet is connected with the reaction source entrance of reaction chamber system;
Described air-bleed system is connected with the outlet of bleeding of reaction chamber system.
Wherein, air-bleed system is the part that cavity is realized vacuum, is provided with pressure monitor part and stopping valve and vacuum pump, is filming equipment common technology.
Preferably, described vacuum chamber upper and lower surface is respectively provided with chamber heating unit, described chamber heating unit heating piece and heater wire outlet vacuum electrode form, heater wire outlet vacuum electrode is connected with power supply, wherein, the surface that is positioned at the heating piece below vacuum chamber is simultaneously as the sample deposition substrate of vacuum chamber.Sample is directly put on heating piece below, and heat transmission is direct, and thermal field is even.
Further preferred, described heating piece adopts cast aluminium material, through surface finish and anodic oxidation treatment, heating piece thickness above vacuum chamber is 10 mm, heating piece thickness above vacuum chamber is 15 mm, and the diameter of well heater is consistent with the diameter of vacuum chamber, between seamless.
Preferably, described vacuum chamber consists of oxygen free copper gasket seal with cavity base below cavity upper cover above, the cavity configuration of described vacuum chamber is located in cavity base, wherein, described upper and lower heating unit is embedded in respectively in cavity upper cover and cavity base, when cavity upper cover is covered on cavity base, the vacuum chamber of the sealing that formation can be heated up and down.
Between cavity base and cavity upper cover, can cross gasket and be tightly connected, but not directly welding, the installation of more convenient heating piece and replacing.
Preferably, the cavity configuration of described vacuum chamber is followed successively by vacuum chamber, stainless steel cavity ring wall, thermal insulation layer, water-cooled layer from inside to outside.
Further preferred, described sample inlet extends cavity from cavity ring wall the place ahead of plenum chamber, and compared with high 30 cm of vacuum chamber, the sample inlet place degree of depth is 8 mm, and width is 60 mm, and this sample inlet maximum can be placed 2 inches diameter, the sample of height 5 mm.Like this, being more conducive to gas in cavity better circulates.Sample enters the setting of product, by sample inlet, puts into and take out sample, can effectively alleviate the number of times of opening of cavity upper cover, thereby has avoided the detrimentally affect to the sealing property of vacuum chamber that in actual use, frequent operation brings.
Further preferred, described reaction source entrance and the outlet of bleeding are symmetrically distributed in the cavity ring wall both sides of vacuum chamber, between upper and lower two well heaters.
Further preferred, described reaction source system comprises two reaction source container, and described two reaction source container are connected with reaction source outlet by seal valve, control valve respectively.The volume of described reaction source container is preferably 25mL.
Further preferred, also comprise central control system, described reaction cavity system and reaction source system are all electrically connected to central control system, described central control system is usingd PLC and is controlled as core, on the basis of PLC controller, increase temperature control module, analog module, between PLC and temperature control module, analog module, in RS485 mode, communicate by letter.
A deposition method for aluminum oxide film, utilizes aforesaid device, and its operation steps is as follows:
1) sample pretreatment, puts into vacuum chamber by the sample of processing;
2) start Controlling System;
3) after bringing into operation, the thickness that makes deposition of aluminium oxide is 20 nm, and the temperature up and down of vacuum chamber is 150 ℃, and number of deposition cycles is 167 times, and depositing time is 28 min;
4) deposition finishes, and cavity auto-admission takes out sample.
The principle of the invention:
The present invention adopts small volume cavity, adopts small volume reaction source container, and reaction source loss is few.The upper end of reaction source container is provided with sealed valve, and sealed valve plays sealing function after packing reaction source into.The present invention adopts integrated design accurately to control deposit film thickness.
In technological process, open sealed valve, then pass through the control valve of the upper end setting of seal valve, control the amount of the reaction source that enters vacuum reaction chamber.Reaction source gas is the reaction source entrance with reaction chamber system by the reaction source outlet through reaction source system, enters vacuum reaction chamber, and reaction source gas is carried out electroless plating on sample.
Beneficial effect of the present invention:
1) heating piece in apparatus for atomic layer deposition of the present invention adopts cast aluminum heaters to be directly embedded in the mode in cavity, and this mode heat transmission is direct, and without the temperature difference, whole cavity inner wall is without the temperature difference.This well heater adopts the form of cast aluminium, and the polishing of forming aluminium section rear surface and anodic oxidation treatment, and reaction cavity base and upper cover are all inlayed cast aluminum heaters, and heating is without dead angle.
2) the present invention proposes a kind of integrated design of miniature accurate coating system first, is specially adapted for research field tool and uses, and to be that volume is little do not take up space the advantage of this device, and apparent size only has 350*350*400 mm, can directly be put on desktop; Reaction cavity real space is little, and adopts baking type type of heating, and reaction source consumption evenly, is saved in temperature field; Simple to operate, only need input deposit film thickness, system can Auto-matching parameter be moved; With respect to market coating system on sale, equipment use and maintenance cost are low.
3) present device is by integrated design, Controlling System is that man-machine interface adopts touch screen interface to control, in operation interface, need only input deposit film thickness, Controlling System can be calculated the correlation parameters such as required deposition cycle number, this film thickness required time voluntarily, and move correlation parameter, after end, automatically stop experiment, each step proceeds to next step can prompting, and whole process record and all parameters of preservation.The present invention accurately controls thin film deposition thickness by the film thickness of accurate each circulation of control, has realized the accurate control of coating process.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, and forms a part for specification sheets, for explaining the present invention, is not construed as limiting the invention together with embodiments of the present invention.In the accompanying drawings:
Fig. 1 is the miniature accurate coating system schematic top plan view of the present invention;
Fig. 2 is the miniature accurate coating system elevational schematic view of the present invention;
Fig. 3 is that schematic diagram is looked on the miniature accurate coating system of a present invention left side;
Fig. 4 is the miniature accurate coating system reaction chamber system architecture schematic diagram of the present invention;
Fig. 5 is control flow chart of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described, should be appreciated that preferred embodiment described herein, only for description and interpretation the present invention, is not intended to limit the present invention.
As shown in Figures 1 to 4, a kind of miniature accurate coating system, adopts integrated design, comprises reaction chamber system 100, reaction source inlet system 200, air-bleed system 300 and Controlling System 400.
Reaction chamber system 100 comprises vacuum chamber 101, reaction source entrance 109, bleed outlet 110, sample inlet 111 and chamber heating unit, reaction source entrance 109, the outlet 110 of bleeding, sample inlet 111 are communicated with vacuum chamber 101 sealings, reaction source enters vacuum chamber 101 by reaction source entrance 109 from reaction source system 200 flows out, residual reaction source and by product are discharged reaction chamber system by the outlet 110 of bleeding, and sample enters vacuum chamber 101 by sample inlet 111.
Described reaction source system 200 comprises that reaction source container 202(volume is 25mL) and reaction source outlet 201, between reaction source container 202 and reaction source outlet 201, be provided with valve, control the outflow of reaction source, described reaction source outlet 201 is connected with the reaction source entrance 109 of reaction chamber system.
Described air-bleed system 300 is connected with the outlet 110 of bleeding of reaction chamber system.
Described Controlling System 400 is electrically connected to respectively with between reaction chamber system 100, reaction source system 200, air-bleed system 300.
As shown in Figure 4, in reaction chamber system, described vacuum chamber 101 upper and lower surfaces are respectively provided with heating unit.Described vacuum chamber 101 is 20 mm by cavity upper cover 107(thickness above) the cavity base 108(thickness be below 50 mm) by oxygen free copper gasket seal, form, the cavity configuration of vacuum chamber 101 is located in cavity base 108.Wherein, upper and lower heating unit is embedded in respectively in cavity upper cover 107 and cavity base 108, when cavity upper cover 107 is covered on cavity base 108, and the vacuum chamber 101 of the sealing that formation can be heated up and down.Described heating unit is comprised of heating piece 102 and heater wire outlet vacuum electrode 103, and heater wire outlet vacuum electrode 103 is connected with power supply, wherein, is positioned at the surface while of the heating piece below vacuum chamber as the sample deposition substrate of apparatus for atomic layer deposition.Sample is directly put on heating piece below, and heat transmission is direct, and thermal field is even.
Described heating piece adopts cast aluminium material, and through surface finish and anodic oxidation treatment, the heating piece thickness above vacuum chamber is 10 mm, heating piece thickness above vacuum chamber is 15 mm, the diameter of well heater is consistent with the diameter of vacuum chamber, is 80 mm, between seamless.Between cavity base and cavity upper cover, can cross gasket and be tightly connected, but not directly welding, the installation of more convenient heating piece and replacing.
The cavity configuration of described vacuum chamber is followed successively by vacuum chamber 101,316L stainless steel cavity ring wall 104, fiber insulation layer 105, water-cooled layer 106 from inside to outside.The rear side of cavity is water-cooled pipeline 112, and front side is sample inlet 111, and sample inlet is compared with the height of vacuum chamber 30 cm, and the degree of depth is 8 mm, and width is 60 mm, and this entrance maximum can be placed 2 inches diameter, the sample of height 5 mm.Reaction source inlet size is 12 mm, and the outlet size of bleeding is 12 mm, the flange of external KF16.
In the present invention, selected rack enclosure is of a size of 350 * 350*400 mm, and material is stainless steel, and reaction chamber system is placed in enclosure top, and left side is reaction source inlet system, and right side is air-bleed system and control panel (as shown in Figures 2 and 3).
In the present invention, sample is 2 inches of sizes, by sample inlet 111, send into chamber vacuum chamber 101, device in the present invention is hot auxiliary type, adopt upper and lower two heating pieces by the middle of sample baking, whole chamber vacuum room temperature is even, the temperature range of heating piece is room temperature-300 ℃, and accuracy of temperature control is less than positive and negative 1 ℃.
Reaction source of the present invention can be solid-state, liquid state or gaseous state.If being the above two, reaction source need to produce a certain amount of steam by the mode of heating, reaction source steam is by the unlatching of manual valve 204, enter control valve 203, valve is accurately controlled thus, the reaction source of flowing through outlet 201, the vacuum chamber 101 that finally enters reaction cavity by reaction source entrance 109 reacts, and residual reaction source and by product are external by outlet 110 discharge sides of bleeding.All reaction source transportation pipeline and bleed lines are also provided with detachable heating and heat-insulating device, and temperature range is room temperature to 200 ℃.
As shown in Figure 5, for control flow chart of the present invention, first using the thickness that need to input required deposit film, system calculates the thickness of required deposition automatically according to film thickness, now click operation, the temperature parameter of this formula of automated system operation, the parameter settings such as burst length setting and flow, now start timing, equal time is to rear prompting user, whether start deposition, if clicked, start, system brings into operation, and calculating required time, after having deposited, prompting technique completes, auto-admission, and sample is taken out in prompting, in whole technological process, all parameters all have record and preserve.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, although the present invention is had been described in detail with reference to previous embodiment, for a person skilled in the art, its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. a miniature accurate coating system, it is characterized in that: described miniature accurate coating system comprises reaction chamber system, reaction source system and air-bleed system, top is divided into reaction chamber system, bottom is divided into reaction source system, reaction chamber system is connected with reaction source system sealing, air-bleed system is connected with reaction chamber system sealing, wherein
Described reaction chamber system comprises vacuum chamber, reaction source entrance, the outlet of bleeding, sample inlet and chamber heating unit, reaction source entrance, the outlet of bleeding, sample inlet are communicated with vacuum chamber sealing, reaction source enters vacuum chamber by reaction source entrance from reaction source system flows out, residual reaction source and by product are discharged reaction chamber system by the outlet of bleeding, and sample enters vacuum chamber by sample inlet;
Described reaction source system comprises reaction source container and reaction source outlet, between reaction source container and reaction source outlet, is provided with valve, controls the outflow of reaction source, and described reaction source outlet is connected with the reaction source entrance of reaction chamber system;
Described air-bleed system is connected with the outlet of bleeding of reaction chamber system.
2. miniature accurate coating system according to claim 1, it is characterized in that: described vacuum chamber upper and lower surface is respectively provided with chamber heating unit, described chamber heating unit heating piece and heater wire outlet vacuum electrode form, heater wire outlet vacuum electrode is connected with power supply, wherein, the surface that is positioned at the heating piece below vacuum chamber is simultaneously as the sample deposition substrate of vacuum chamber.
3. miniature accurate coating system according to claim 2, it is characterized in that: described heating piece adopts cast aluminium material, through surface finish and anodic oxidation treatment, heating piece thickness above vacuum chamber is 10 mm, heating piece thickness above vacuum chamber is 15 mm, the diameter of well heater is consistent with the diameter of vacuum chamber, between seamless.
4. miniature accurate coating system according to claim 1, it is characterized in that: described vacuum chamber consists of oxygen free copper gasket seal with cavity base below cavity upper cover above, the cavity configuration of described vacuum chamber is located in cavity base, wherein, described upper and lower heating unit is embedded in respectively in cavity upper cover and cavity base, when cavity upper cover is covered on cavity base, the vacuum chamber of the sealing that formation can be heated up and down.
5. miniature accurate coating system according to claim 1, is characterized in that: the cavity configuration of described vacuum chamber is followed successively by vacuum chamber, stainless steel cavity ring wall, thermal insulation layer, water-cooled layer from inside to outside.
6. miniature accurate coating system according to claim 1, it is characterized in that: described sample inlet extends cavity from cavity ring wall the place ahead of plenum chamber, compared with high 30 cm of vacuum chamber, the sample inlet place degree of depth is 8 mm, width is 60 mm, this sample inlet maximum can be placed 2 inches diameter, the sample of height 5 mm.
7. according to the miniature accurate coating system described in claim 1 to 6 any one, it is characterized in that: described reaction source entrance and the outlet of bleeding are symmetrically distributed in the cavity ring wall both sides of vacuum chamber, between upper and lower two well heaters.
8. according to the miniature accurate coating system described in claim 1 to 6 any one, it is characterized in that: described reaction source system comprises two reaction source container, described two reaction source container are connected with reaction source outlet by seal valve, control valve respectively.
9. according to the miniature accurate coating system described in claim 1 to 6 any one, it is characterized in that: also comprise central control system, described reaction cavity system, reaction source system and air-bleed system are all electrically connected to central control system, described central control system is usingd PLC and is controlled as core, on the basis of PLC controller, increase temperature control module, analog module, between PLC and temperature control module, analog module, in RS485 mode, communicate by letter.
10. a deposition method for aluminum oxide film, is characterized in that: utilize equipment described in claim 1 to 9 any one, its operation steps is as follows:
1) sample pretreatment, puts into vacuum chamber by the sample of processing;
2) start Controlling System;
3) after bringing into operation, the thickness that makes deposition of aluminium oxide is 20 nm, and the temperature up and down of vacuum chamber is 150 ℃, and number of deposition cycles is 167 times, and depositing time is 28 min;
4) deposition finishes, and cavity auto-admission takes out sample.
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| CN201410202912.7A CN103993295B (en) | 2014-05-15 | 2014-05-15 | A kind of miniature accurate coating system |
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| CN201410202912.7A CN103993295B (en) | 2014-05-15 | 2014-05-15 | A kind of miniature accurate coating system |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2371993A1 (en) * | 2010-03-26 | 2011-10-05 | National Tsing Hua University | Method of surface treatment and surface treated article provided by the same |
| JP2011195900A (en) * | 2010-03-19 | 2011-10-06 | Mitsui Eng & Shipbuild Co Ltd | Atomic-layer deposition method and atomic-layer deposition apparatus |
| CN102418084A (en) * | 2011-12-14 | 2012-04-18 | 无锡迈纳德微纳技术有限公司 | Source gas isolated solid source atomic layer deposition device and method |
| CN202193841U (en) * | 2011-07-28 | 2012-04-18 | 英作纳米科技（北京）有限公司 | Novel atomic layer depositing equipment |
-
2014
- 2014-05-15 CN CN201410202912.7A patent/CN103993295B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011195900A (en) * | 2010-03-19 | 2011-10-06 | Mitsui Eng & Shipbuild Co Ltd | Atomic-layer deposition method and atomic-layer deposition apparatus |
| EP2371993A1 (en) * | 2010-03-26 | 2011-10-05 | National Tsing Hua University | Method of surface treatment and surface treated article provided by the same |
| CN202193841U (en) * | 2011-07-28 | 2012-04-18 | 英作纳米科技（北京）有限公司 | Novel atomic layer depositing equipment |
| CN102418084A (en) * | 2011-12-14 | 2012-04-18 | 无锡迈纳德微纳技术有限公司 | Source gas isolated solid source atomic layer deposition device and method |
Non-Patent Citations (1)
| Title |
|---|
| 王莹 等: ""原子层沉积氧化铝薄膜摩擦学性能研究"", 《摩擦学学报》 * |
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Effective date of registration: 20171218 Address after: 214100 Jiangsu province Wuxi City Linghu New District Road No. 228 Wu Tian wisdom city 3-104 Patentee after: JIANGSU MNT MICRO AND NANOTECH CO.,LTD. Address before: 214028 room B, room B, No. 35, Airport Industrial Park, No. 35, Changjiang South Road, new area of Jiangsu Patentee before: Wuxi MNT Micro and Nanotech Co.,Ltd. |
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Denomination of invention: Micro accurate coating system Effective date of registration: 20190701 Granted publication date: 20160817 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi science and Technology Branch Pledgor: JIANGSU MNT MICRO AND NANOTECH CO.,LTD. Registration number: 2019990000646 |
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Date of cancellation: 20220920 Granted publication date: 20160817 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi science and Technology Branch Pledgor: JIANGSU MNT MICRO AND NANOTECH CO.,LTD. Registration number: 2019990000646 |
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Denomination of invention: A Micro Precision Coating System Effective date of registration: 20220921 Granted publication date: 20160817 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi science and Technology Branch Pledgor: JIANGSU MNT MICRO AND NANOTECH CO.,LTD. Registration number: Y2022320010531 |