CN103941948A - Capacitance type touch panel and manufacturing method thereof - Google Patents
Capacitance type touch panel and manufacturing method thereof Download PDFInfo
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- CN103941948A CN103941948A CN201410171948.3A CN201410171948A CN103941948A CN 103941948 A CN103941948 A CN 103941948A CN 201410171948 A CN201410171948 A CN 201410171948A CN 103941948 A CN103941948 A CN 103941948A
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Abstract
The invention discloses a capacitance type touch panel, and a manufacturing method of the capacitance type touch panel. An etching blocking layer is arranged between an insulating layer and a second transparent electric conduction layer, and therefore a functional layer below the etching blocking layer is protected, and the functional layer below the etching blocking layer is protected against influences caused when the second transparent electric conduction layer needs to be removed due to the fact that the second transparent electric conduction layer has defects or when the second transparent electric conduction layer is formed. In addition, compared with the prior art, by appropriately decreasing the thickness of the insulating layer, the dielectric constant of a matched capacitor can meet the use requirement of a capacitance screen.
Description
Technical field
The present invention relates to a kind of capacitance type touch-control panel and manufacture method thereof.
Background technology
Current is touch panel structure provided, as Chinese patent literature CN12736760A discloses a kind of touch panel structure provided and preparation method thereof, it is touch panel structure provided referring to accompanying drawing 1 and accompanying drawing 2, and it comprises substrate 1 and shielding layer 2, first transparency conducting layer 3, insulation course 4 and second transparency conducting layer 5 of storehouse on substrate 1 from bottom to top sequentially.The wherein substrate 1 configurable display device (not shown) in below, nationality is to show image.
Refer to Fig. 2, the first transparency conducting layer 3 has multiple the first patterns, be separated from each other and be configured to be parallel to first direction X, and the second transparency conducting layer 5 has multiple the second patterns, is separated from each other and is configured to be parallel to second direction Y.The mechanism that electric capacity forms is so to have an angle between first direction X and second direction Y, as shown in Figure 2, in figure, be expressed as right angle, in figure, dotted line represents the part of crested, omits other structures except the first transparency conducting layer 3, the second transparency conducting layer 5 and insulation course 4.As can be seen from the figure, insulation course 4 covers whole the first transparency conducting layer 3.In Fig. 2, the first connecting portion 302 and the second connecting portion 502, form electric capacity in conjunction with insulation course, and nationality is to provide capacitance type touch-control panel.
In said structure, insulation course 4 covers the first transparency conducting layer 3, and nationality to be to form insulating medium between the pole plate of electric capacity, and avoids short circuit between conductive layer.
The processing procedure of capacitance type touch-control panel adopts as sputtering process moulding one nesa coating taking tin indium oxide (ITO) as target conventionally on substrate 1, then this nesa coating is carried out to the stitching printing as mated the first pattern, and etching forms the first transparency conducting layer 3; And then on the first transparency conducting layer stacked insulation course 4, then on insulation course 4, carry out the making of the second transparency conducting layer, need to be etched with equally and obtain the second transparency conducting layer 5.
Etching comprises physical technology, chemical technology or the technique that both combine, by time can obtain desired stitching, and etch depth is had to good control, to reduce the impact of the functional layer on moulding.In addition, if can not link up as the second transparency conducting layer test, need positive second transparency conducting layer of removing, other functional layers that yet need protection are not destroyed.As Chinese patent literature CN12736760A is short of the protection to moulding functional layer, easily cause the damage of molded functional layer and follow-up making again, when producing repetitive operation, affect product efficiency and product yield.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of capacitance type touch-control panel, by increasing etch stop layer, the rete so as to protection below etch stop layer, the present invention also provides a kind of manufacture method of capacitance type touch-control panel.
According to one aspect of the present invention, a kind of capacitance type touch-control panel, is characterized in that, comprising:
Transparency carrier, has first surface and second;
Shielding layer, is made up of lighttight material, is overlying on described first surface, in order to cover the light of second institute's dress display device transmitting; And this shielding layer has the pattern of covering, in order to expose coupling, this covers the part substrate of pattern;
The first transparency conducting layer, be formed on shielding layer and the part substrate that exposes on;
Insulation course, is covered on described the first transparency conducting layer;
Etch stop layer, is stacked on insulation course; And
The second transparency conducting layer, is formed on etch stop layer.
According to another aspect of the present invention, a kind of capacitance type touch-control panel manufacture method, is characterized in that, comprises the following steps:
On given substrate, form a shielding layer, wherein shielding layer is made up of lighttight material, and in order to cover the light of being launched by the display device of this substrate below, and shielding layer etching has to expose the pattern that covers of part substrate;
On described shielding layer and the substrate that exposes, form one first transparency conducting layer;
Stacked insulation course on described the first transparency conducting layer;
And then on insulation course coating one deck etch stop layer, the common matching capacitance specific inductive capacity of this etch stop layer and insulation course;
Then on etch stop layer, form the second transparency conducting layer.
According to the present invention; between insulation course and the second transparency conducting layer, etch stop layer is set; so as to the functional layer under etch stop layer is protected; need to remove because of defectiveness at the second transparency conducting layer; or when the second electrically conducting transparent formable layer, the functional layer of protection below etch stop layer is unaffected.In addition, than prior art, by suitably reducing the thickness of insulation course, the specific inductive capacity of matching capacitance, meets the request for utilization of capacitance plate.
Brief description of the drawings
Fig. 1 is that known contact panel master cuts open structural representation.
Fig. 2 is the perspective view of a capacitor cell of known contact panel.
Fig. 3 is the structural representation according to a kind of capacitance type touch-control panel of the present invention.
Fig. 4 is the making process flow diagram according to a kind of capacitance type touch-control panel of the present invention.
Fig. 5 is the capacitance type touch-control panel structural representation that forms the original layers of the second transparency conducting layer in an embodiment.
Fig. 6 makes the first transparency conducting layer before the second transparency conducting layer and the configuration structure schematic diagram of insulation course in an embodiment.。
Fig. 7 is the capacitance type touch-control panel structural representation of the original layers of the second transparency conducting layer in another embodiment.
Fig. 8 is the capacitance type touch-control panel structural representation after middle etching the second transparency conducting layer original layers in another embodiment.
Fig. 9 removes etch stop layer and insulation course redundance and beats the capacitance type touch-control panel structural representation after silver-colored line.
Embodiment
For making the effectiveness of the clearer understanding of those skilled in the art inventive principle of the present invention and concrete means.Technological means, creation characteristic that the present invention realizes, reach object and effect is easy to understand, below in conjunction with concrete accompanying drawing, further set forth the present invention.
The present invention is taking Chinese patent literature CN12736760A as reference, and relational language explanation is quoted so far, and agent structure is referring to accompanying drawing 1-2.
Contact panel master as shown in Figure 1 cuts open structure, and illustrated structure is stacked structure, and in figure, to be expressed as the second residing position of transparency conducting layer 5 be upper to upper-lower position, comparatively speaking, and under the residing position of substrate 1 is.
In contact panel technical field, substrate 1 is generally transparent material, and as glass-based substrate, therefore, substrate 1 is also referred to as transparency carrier in the text.
Substrate 1 has two faces, i.e. previously described first surface and second, and first surface is face, for stacking gradually of touch panel structure provided upper functional layer.Second is called again air surface conventionally, is the face towards user.
Therefore; in the first embodiment; as shown in accompanying drawing 3,5-7; according to single-face structure of touch control panel of the present invention; with residing of the display device of Matching installation for below; so relative face be substrate 1 above; the basis that substrate 1 depends on for other parts; be configured to key horizon; shielding layer 2 is set on substrate 1, is then the first transparency conducting layer 3, insulation course 4, etch stop layer 6 and the second transparency conducting layer 5; wherein as shown in Figure 7, etch stop layer 6 is protected the rete below it in the time of the second transparency conducting layer 5 etching.
About substrate 1, based on the selection of contact panel, as use glass to form transparent substrate sheet material, form glass baseplate, in other application, according to concrete applied environment and technical configuration, those skilled in the art can specifically select such as adopting N-type substrate or P type substrate, and other are as the transparency carrier of the insulation material of glass-based.In other application, can also adopt transparent soft substrate, as disclosed transparent soft thin film substrate in Chinese patent literature CN100431184C.
As shown in Figure 1, based on stacked structure, on substrate 1, stack gradually shielding layer 2, the first transparency conducting layer 3, insulation course 4, and second transparency conducting layer 5, this second transparency conducting layer 5 and the first transparency conducting layer 3, and be superimposed upon insulation course formation electric capacity between the two, form according to this touch-control structure.
First see insulation course 4, final structure as shown in Figure 9, omits all the other structures except rete and substrate in figure.Insulation course 4 between the first transparency conducting layer 3 and the second transparency conducting layer 5 forms insulating medium, form again capacitor dielectric, it exists on the one hand for the electric insulation between the first transparency conducting layer 3 and the second transparency conducting layer 5, form on the other hand medium between the pole plate of electric capacity, thereby affect the specific inductive capacity of electric capacity, the existence of etch stop layer 6 also can affect specific inductive capacity, and both need to plan as a whole both impacts on overall dielectric constant at combination, and consider both selection and thickness.
In addition, it is also conceivable that following problem: in processing procedure, can produce various waste gas, as Acidity of Aikalinity waste gas, volatile organic waste gas and general waste gas, the existence of these waste gas can reduce the yield of product.
First about the introducing of etch stop layer 6, inventor finds, in the time that the second transparency conducting layer is made, as adopted chemical etching, may affect the performance of insulation course 4 and the first transparency conducting layer 3, and then affect product yield.In addition, in some implementations, insulation course 4 no longer adopts the insulation course of whole, but adopts the insulation course of coupling as the second pattern, and remainder is all got rid of, and has and relates to hereinafter, does not repeat them here.
This just inevitably exists when as etching the second transparency conducting layer, can affect the problem of the first transparency conducting layer 3 of moulding.
In addition, if the second transparency conducting layer 5 is but tested, or have other defect and need to remove time, insulation course 4 and the first transparency conducting layer 3 may all can be affected, and the piece that must not differ is removed, and then again made, produce unnecessary man-hour.
Under such technical background, between insulation course 4 and the second transparency conducting layer 5, increase by an etch stop layer 6, the whole face of this etch stop layer 6 is covered on insulation course 4, about etch stop layer 6, it should adopt has chemically inert material to make to etching, as silicon dioxide, silicon nitride and titania, and with these three kinds of materials that material physicochemical property is approaching.
Be to be understood that simultaneously, " etching stops " do not represent that applicable restraining barrier 6 is inevitable by having chemically inert material to form to the etching solution that mates the second transparency conducting layer 5, can also adopt the scheme on sacrificial etch restraining barrier 6, as shown in Figure 8, in Fig. 8, mate the part of the second pattern for transparent conductive layer, insulation course 4 and etch stop layer 6 are all removed, therefore, etch stop layer 6 also can adopt to be made the not high material of the second transparency conducting layer 5 etching solution activity used, in addition, tackle the second transparency conducting layer 5 and there is no negative effect carrying out the technique of etch stop layer 6 while removing.
The formation way of etch stop layer, as silicon dioxide, adopt vacuum sputtering, taking silicon as target, taking oxygen as reaction gas, the oxygen rates passing into by controls, control silicon dioxide the speed of growth.
Silicon dioxide has higher chemical stability, and transparency conducting layer, as tin indium oxide, can be for as the etching of acidic materials institute, and the acidic materials that use on silicon dioxide without any impact, thereby can protect the membranous layer stability under it.
If silicon dioxide is also a kind of common capacitor dielectric material, can be used for adjusting the specific inductive capacity of electric capacity, whole matching insulation course 4, adjust overall specific inductive capacity, be to be understood that, the insulation course is here thinner than usual insulation course, and the insulation course of removal is replaced by silicon dioxide, is mated specific inductive capacity.
According to said structure, as shown in Figure 6, may there is such situation in insulation course 4, namely need to mate the second pattern on the second transparency conducting layer, stitching in other words, thereby can expose the first transparency conducting layer 3 of part, removes or when etching at the second transparency conducting layer 5, if do not add protection, therefore the first transparency conducting layer 3 exposing may be destroyed.Therefore, etch protection layer 6 provides the protection to molded rete, manufacture craft while reducing heavy industry.
In addition, can also, as adjusting the etching functional layer that remove refraction effect, make overall picture more even using etch stop layer 6, as cover the second pattern and make it not in sight.
About the use of insulation strip, specifically use insulation strip group to replace the insulation course of whole, region relative narrower on Width that insulation strip covers, is conducive to the discharge of waste gas, thereby has improved the yield of product.
In the time using insulation strip, in the time making the second transparency conducting layer 5, as shown in Figure 3, the first transparency conducting layer 3 will come out, and therefore, in figure, etch stop layer 6 covers insulation course 4, the first transparency conducting layer 3 under it completely, express for clear, in figure, shielding layer, substrate are all not shown.
As shown in Figure 7 and Figure 8, in the Another application of coupling the second transparency conducting layer 5, etch stop layer has further comprised the part between insulation strip.
About the concrete configuration of insulation strip, referring to Figure of description 3, the part that in figure, dotted line is crested, the concrete configuration of insulation strip is subject to the impact of the first transparency conducting layer 3 and the second transparency conducting layer 5, therefore, first the first transparency conducting layer 3 and second concrete structure of transparency conducting layer 5 and the presentation mode of capacitance structure are described.
The first transparency conducting layer 3, be configured in shielding layer 2 and the transparency carrier that exposes on, and there are a plurality of the first patterns, between the first pattern, be separated from each other and be configured to be parallel to first direction X.
The second transparency conducting layer 5, there are a plurality of the second patterns, between the second pattern, be separated from each other and be configured to be parallel to second direction Y, between this second direction and described first direction, be an angle, thereby the interleaved bits that the first pattern and the second pattern form forms electric capacity position, position shown in A portion is a capacitor cell as shown in Figure 2, and the position wherein intersecting forms the capacitance structure of stack.
In the time that user touches, the mutual capacitance meeting of the infall sensing unit of surperficial row or column changes, according to above-mentioned variation touch-control IC(integrated circuit, integrated circuit) finally detect the particular location of touch point.
The number of insulation strip depends on the number of row or the row of the array intersecting to form so, and as having x row to classify benchmark as, to suppose, the number of insulation strip just can be configured to x bar so, and correspondingly, if there are y row, the number of insulation strip also can be configured to y bar so.
Particularly, insulation course 4 is constructed by following mode, be arranged between the first transparency conducting layer and the second transparency conducting layer and form according to second direction by a plurality of insulation strip, in the corresponding covering of each insulation strip second direction one row electric capacity position, the number of insulation strip is limited with the technology contents described in leading portion.
The projection of insulation strip in Fig. 3 in insulation course 4 in second day transparency conducting layer 5 plane is just the same, represents the insulation strip shape of average, the strip that insulation strip is certain width in Fig. 4.
Because formed electric capacity position individual relative is very little, so corresponding insulation strip just can be very narrow, the especially structure of the insulation course 4 shown in Fig. 3, and therefore exhaust is no longer subject to the restriction of whole insulation course, thereby ensure the smoothness of exhaust, and then ensured that product has higher yield.
Described the first pattern is connected to form by the first connecting portion 302 in turn by multiple first bodies 301, and correspondingly, the second pattern is connected to form by the second connecting portion 502 in turn by multiple the second bodies 501, forming array structure.
And then described in each insulation strip in the time covering the row of one in second direction electric capacity position, its width is more than or equal to the width of electric capacity position in this second direction and is less than or equal to the length of the second connecting portion in second direction, under insulation strip bottom line condition, form insulating matter medium between capacitor plate, ensure that capacitance is in relatively high state, and processing procedure is relatively easy.
Under the condition of insulation strip maximum, can play better supporting role, avoid the short circuit of relevant body.
Structure shown in Fig. 3, insulation strip has and the identical pattern form of the second pattern, thereby has reliable support, can not produce short circuit.Taking the structure shown in Fig. 3 as preferred structure.
In the structure shown in Fig. 3, the angle of having expressed the first pattern and the second pattern is 90 degree, does not have overlapping bit so between first body 301 and the second body 501, and narrower insulation strip also can ensure the generation of circuit defect.
About the angle of first direction X and second direction Y, be preferably 90 degree, but be not limited to 90 degree, between the first direction described in figure document CN12736760A and second direction, there is an angle, can be acute angle, right angle or obtuse angle.
In the time carrying out angle Selection, also should be with reference to above information, and as the concrete structure of first body 301, structurally should avoid being as far as possible created between first body 301 and the second body 501 overlapping in substrate 1 projection.
So correspondingly, described in each, insulation strip is in the time covering the row of one in second direction electric capacity position, and its width is more than or equal to the width of electric capacity position in this second direction and is less than or equal to the length of the second connecting portion in second direction.
In certain embodiments, the first pattern is identical with described the second pattern, refer to that the first connecting portion 302 is identical with the second connecting portion 502, first body 301 is also identical with the second body 501, the electric capacity position that formed is so square, isotropy, make touch control operation each to having more consistance.
Further, first body 301 is diamond structure, and this diamond structure pair of horns line parallel is in first direction or second direction, and its two cornerwise Length Ratio intervals are [1,2];
The first connecting portion 302 is rectangular structure, and its length is in a first direction [1.5,2.5] with the Length Ratio interval in second direction.
In like manner, if adopt both identical configurations, the second body 501 is diamond structure so, and this diamond structure pair of horns line parallel is in first direction or second direction, and its two cornerwise Length Ratio intervals are [1,2];
The second connecting portion 502 is rectangular structure, and its length is in a first direction [1.5,2.5] with the Length Ratio interval in second direction.
By above structure, can make electric capacity in rational distribution, and the shape of electric capacity is relatively reasonable, ensure as much as possible isotropy.
In further structure, further comprise an aerial lug layer, be formed on described the second transparency conducting layer, for routing to connect external module.
About the shape of body, can also select, as square (a kind of special rhombus), rectangle etc., also has at document CN12736760A to relate to, and those skilled in the art can be with reference to it.
Meanwhile, as described in above, this case dependency structure also needs to consider the relativity problem of angle, shape in when design, reduces or avoids the circuit defect between body.
About shielding layer 2, formed by lighttight material, such as black material, in order to cover the light of being launched by the display device of substrate 1 below.
About shielding layer 2, its further functional part is the pattern that covers forming in the above, and for exposing the substrate 1 of part, the first transparency conducting layer 3 just can be connected with substrate 1 by pattern so so.
The first transparency conducting layer 3 and the second transparency conducting layer 5 preferential oxidation indium tin conducting films (ITO), insulation course 4 can have silicon dioxide to form.
The second embodiment, only addresses its basic structure, other partial references the first embodiment.
A kind of single-face structure of touch control panel, comprising:
One transparency carrier;
One shielding layer 2, is stacked in transparency carrier one side by lighttight material layers and forms, in order to cover the light emitted line of display device that is positioned at transparency carrier another side; And this shielding layer 2 has the pattern of covering, in order to expose the transparency carrier that covers pattern corresponding to this;
One cushion, cover shielding layer and the transparency carrier that exposes on;
One first transparency conducting layer 3, is configured on described cushion, and has a plurality of the first patterns, is separated from each other and is configured to be parallel to first direction between the first pattern;
One second transparency conducting layer 5, there are a plurality of the second patterns, between the second pattern, be separated from each other and be configured to be parallel to second direction, between this second direction and described first direction, be an angle, thereby the interleaved bits that the first pattern and the second pattern form forms electric capacity position;
Insulation course 4, by and the second pattern one to one insulation strip be arranged between the first transparency conducting layer and the second transparency conducting layer and form according to second direction, thereby, form electric capacity position in the first transparency conducting layer and the second transparency conducting layer staggered place; And
Etch stop layer 6, is arranged between insulation course 4 and the second transparency conducting layer 5.
About the method for making of the single-face structure of touch control panel described in the first embodiment and the second embodiment, its key step can, referring to the 0027th section, document CN12736760A instructions to 0031 section, not repeat them here.Here lay particular emphasis on the making of insulation course.
Complete because the making about each layer all can adopt prior art, comprise the making of etch stop layer, only emphasize here increases by an etch stop layer 6 between insulation course 4 and the second transparency conducting layer 5, thereby such touch panel structure provided method for making is summarized as follows:
Step S10 makes successively shielding layer on a substrate;
Step S20 makes the first transparency conducting layer on shielding layer and the substrate that exposes;
Step S30, makes insulation course after the first transparency conducting layer, and wherein the first transparency conducting layer has a plurality of the first patterns, is separated from each other and is configured to be parallel to first direction between the first pattern;
Wherein, the insulation course 4 forming has a plurality of insulation strip that are separated from each other and are parallel to second direction;
Step S40, so on insulation course 4 coating one deck etch stop layer 6, this etch stop layer 6 and the common matching capacitance specific inductive capacity of insulation course 4;
Step S50, and then form and there is the second transparency conducting layer 5 of a plurality of the second patterns on insulation course 4, and the second pattern is separated from each other and is parallel to second direction, thus make insulation strip and the second pattern stacking one by one.
With, the making step of Fig. 5-Fig. 9, Figure 5 shows that insulation course 4, etch stop layer 6 and second transparency conducting layer 5 of whole making, Fig. 6 relates to and covers the processing after the making of pattern as insulation course 4, can expose the first transparency conducting layer 3 of part.
Fig. 7 shows the second transparency conducting layer 5 and removes the trace that forms coupling the second pattern, and etch stop layer 6 forms the protection to insulation course 4 and the first transparency conducting layer 3.
Fig. 8, removes the second transparency conducting layer 5, and etch stop layer 6 forms the protection to the first transparency conducting layer.
Fig. 9 is final product structure, and etch stop layer 6 is also partly removed, and retains the part under the second transparency conducting layer 5, and the first transparency conducting layer 3 exposing, for playing lead-in wire, produces silver-colored line 7 as shown in Figure 7.Also be that etch stop layer cleans before silver-colored line plated film, by silver-colored line with as partially-etched in the etch stop layer at ITO contact place fall.
Those skilled in the art, by consulting the content of above-mentioned announcement, is readily understood that alternate embodiment comprises within the scope of the invention, can have rectangle to substitute the same such as the body shape of diamond structure.
The present invention can implement and not its spirit of the underneath side of a quilt or essential characteristic with other particular forms.The embodiment describing is considered to have exemplary in every respect, does not limit the protection domain of invention.
Claims (12)
1. a capacitance type touch-control panel, is characterized in that, comprising:
Transparency carrier, has first surface and second;
Shielding layer, is made up of lighttight material, is overlying on described first surface, in order to cover the light of second institute's dress display device transmitting; And this shielding layer has the pattern of covering, in order to expose coupling, this covers the part substrate of pattern;
The first transparency conducting layer, be formed on shielding layer and the part substrate that exposes on;
Insulation course, is covered on described the first transparency conducting layer;
Etch stop layer, is stacked on insulation course; And
The second transparency conducting layer, is formed on etch stop layer.
2. capacitance type touch-control panel according to claim 1, is characterized in that, described the second transparency conducting layer is the rete being formed by indium tin oxide etc.
3. capacitance type touch-control panel according to claim 1, is characterized in that, described etch stop layer serve as reasons the second transparency conducting layer etching solution is had to the material of chemical inertness forms rete.
4. capacitance type touch-control panel according to claim 3, is characterized in that, described etch stop layer is the rete being formed by silicon dioxide, titania or silicon nitride.
5. according to the arbitrary described capacitance type touch-control panel of claim 1 to 4, it is characterized in that, described the first transparency conducting layer has a plurality of the first patterns, is separated from each other and is configured to be parallel to first direction;
Described the second transparency conducting layer has a plurality of the second patterns, is separated from each other and is configured to be parallel to second direction, and this second direction is crossing with first direction, thereby the first pattern forms electric capacity with the second pattern in crossing position.
6. capacitance type touch-control panel according to claim 5, is characterized in that, described the first pattern is formed by connecting by the first connecting portion in turn by first body;
Described the second pattern has the second body to be formed by connecting in turn by the second connecting portion, and the first pattern is crossing at the first connecting portion and the second connecting portion place coupling with the second pattern.
7. capacitance type touch-control panel according to claim 6, it is characterized in that, being shaped as of described first body and described the second body is square, rectangle, rhombus, circle, ellipse or regular polygon, and the first connecting portion and the second connecting portion are the strip with homogeneous width.
8. capacitance type touch-control panel according to claim 5, is characterized in that, first direction and second direction intersect vertically.
9. capacitance type touch-control panel according to claim 1, is characterized in that, described transparency carrier is glass-based transparency carrier or transparent soft substrate; Described insulation course is made up of epoxy resin or photosensitive type organic insulator.
10. according to the capacitance type touch-control panel described in claim 1 or 9, it is characterized in that, described insulation course has and the second pattern corresponding insulation strip one by one, be separated from each other and be parallel to second direction, and be positioned at corresponding the second pattern under.
11. 1 kinds of capacitance type touch-control panel manufacture methods, is characterized in that, comprise the following steps:
On given substrate, form a shielding layer, wherein shielding layer is made up of lighttight material, and in order to cover the light of being launched by the display device of this substrate below, and shielding layer etching has to expose the pattern that covers of part substrate;
On described shielding layer and the substrate that exposes, form one first transparency conducting layer;
Stacked insulation course on described the first transparency conducting layer;
And then on insulation course coating one deck etch stop layer, the common matching capacitance specific inductive capacity of this etch stop layer and insulation course;
Then on etch stop layer, form the second transparency conducting layer.
12. capacitance type touch-control panel manufacture methods according to claim 11, it is characterized in that, the making step of insulation course is: on the first transparency conducting layer, form an insulation material layers, then in this insulation material layers, produce the second pattern that is parallel to each other and separates.
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| CN201410171948.3A CN103941948A (en) | 2014-04-28 | 2014-04-28 | Capacitance type touch panel and manufacturing method thereof |
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| CN201410171948.3A CN103941948A (en) | 2014-04-28 | 2014-04-28 | Capacitance type touch panel and manufacturing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030127308A1 (en) * | 2001-12-18 | 2003-07-10 | Eturbotouch Technology Inc. | Polarizing device integrated with touch sensor |
| CN102736760A (en) * | 2011-04-11 | 2012-10-17 | 富创得科技股份有限公司 | Single face structure of touch panel and manufacture method thereof |
| CN203117929U (en) * | 2012-12-18 | 2013-08-07 | 宸鸿光电科技股份有限公司 | Touch electrode structure |
| CN103235659A (en) * | 2013-04-12 | 2013-08-07 | 京东方科技集团股份有限公司 | Touch panel and manufacturing method and display device thereof |
| CN203849718U (en) * | 2014-04-28 | 2014-09-24 | 山东华芯富创电子科技有限公司 | Capacitive touch panel |
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2014
- 2014-04-28 CN CN201410171948.3A patent/CN103941948A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030127308A1 (en) * | 2001-12-18 | 2003-07-10 | Eturbotouch Technology Inc. | Polarizing device integrated with touch sensor |
| CN102736760A (en) * | 2011-04-11 | 2012-10-17 | 富创得科技股份有限公司 | Single face structure of touch panel and manufacture method thereof |
| CN203117929U (en) * | 2012-12-18 | 2013-08-07 | 宸鸿光电科技股份有限公司 | Touch electrode structure |
| CN103235659A (en) * | 2013-04-12 | 2013-08-07 | 京东方科技集团股份有限公司 | Touch panel and manufacturing method and display device thereof |
| CN203849718U (en) * | 2014-04-28 | 2014-09-24 | 山东华芯富创电子科技有限公司 | Capacitive touch panel |
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Application publication date: 20140723 |