CN103785951B - The product of laser welding glass heat pipe Surface L ED and manufacture method and equipment - Google Patents
The product of laser welding glass heat pipe Surface L ED and manufacture method and equipment Download PDFInfo
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- CN103785951B CN103785951B CN201410042469.1A CN201410042469A CN103785951B CN 103785951 B CN103785951 B CN 103785951B CN 201410042469 A CN201410042469 A CN 201410042469A CN 103785951 B CN103785951 B CN 103785951B
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- glass heat
- laser welding
- circuit board
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- 238000003466 welding Methods 0.000 title claims abstract description 105
- 239000011521 glass Substances 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 43
- 239000010959 steel Substances 0.000 claims abstract description 43
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 3
- 230000006698 induction Effects 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 8
- 230000013011 mating Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000035939 shock Effects 0.000 abstract description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 235000013569 fruit product Nutrition 0.000 description 1
- 239000002737 fuel gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/244—Overlap seam welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/211—Bonding by welding with interposition of special material to facilitate connection of the parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Laser Beam Processing (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The method of laser welding glass heat pipe Surface L ED: LED circuit board is mounted on glass heat pipe；Described LED is held with a secondary suction pawl connected with negative pressure source, at LED lower surface gluing, be placed in LED in circuit board LED aperture to paste with glass heat pipe and realize low thermal resistance and be connected and make the stitch welding plain film at LED two ends be laminated on the wiring board at LED aperture edge on stainless sheet steel, with laser welding device transmitting terminal by described stitch welding plain film together with stainless sheet steel stitch welding on wiring board.Laser welding LED, LED circuit board, LED laser welding equipment and the glass heat pipe LED lamp manufactured according to the method.The method of laser welding glass heat pipe Surface L ED of the present invention provides the LED laser stitch welding welding method of industrialized production glass heat pipe LED lamp, and the laser welding time is short, firm, can realize at normal temperatures, welding process is little to glass heat pipe tube wall thermal shock.
Description
Technical field
The present invention relates to the product of laser welding glass heat pipe Surface L ED and manufacture method and equipment.LED is that the English of lasing fluorescence diode is called for short, and can be regarded as the technical term that the art is generally acknowledged.
Background technology
Existing electronic circuit board many employings wave-soldering, passes hot linked LED, because LED surface can be impacted by liquid tin, inapplicable wave-soldering for posting with glass heat pipe surface requirements.In order to reduce thermal resistance, LED is generally required row welding again after glass heat pipe surface point glue.The most such as use soldering, then in order to prevent the LED displacement during stannum crystallisation by cooling, need complicated working position apparatus；And described soldering process is the most long.
Summary of the invention
The invention aims to provide the product of laser welding glass heat pipe Surface L ED and manufacture method and equipment.
The method of laser welding glass heat pipe Surface L ED of the present invention: manufacture laser welding LED, including LED chip and with extraneous linkage interface；The two ends of described LED respectively make the stainless sheet steel stitch welding plain film of more than one piece band corrugated changeover portion；Manufacture one piece of LED circuit board, make LED circuit board contain some LED aperture, stainless sheet steel is set at the edge of described LED aperture on two blocks of Above Transmission Lines plates as the electrical connection interface with LED；Manufacture a LED laser welding equipment, including LED picking manipulator, laser generator, laser welding device transmitting terminal, high-frequency induction transmitting coil and control system；Described high-frequency induction transmitting coil is with stainless sheet steel on wiring board and LED stainless sheet steel stitch welding plain film as load；The state of described high-frequency induction transmitting coil and laser welding device transmitting terminal changes according to the state of control system and changes；Described LED circuit board is mounted on glass heat pipe；Stainless sheet steel on wiring board is launched frequency electromagnetic waves and is heated by the high-frequency induction transmitting coil making LED laser welding equipment；By hand instrument clamping LED or with one secondary two groups often organize more than one suction pawl connected with negative pressure source and hold described LED, at described LED lower surface gluing, being allowed to realize with glass heat pipe adhesion laminating to be connected with the low thermal resistance of glass heat pipe and make the stitch welding plain film at LED two ends to be laminated on the wiring board at LED aperture edge on stainless sheet steel in LED is correctly arranged in described LED aperture, described stitch welding plain film is launched frequency electromagnetic waves and is heated by the high-frequency induction transmitting coil making LED laser welding equipment, with laser welding device transmitting terminal by described stitch welding plain film together with stainless sheet steel stitch welding on wiring board.
The present invention is according to one of said method technical scheme realizing its purpose: manufacture laser welding LED, including LED chip and with extraneous linkage interface.The two ends of described LED respectively make the stainless sheet steel stitch welding plain film of more than one piece band corrugated changeover portion；Seamlessly transit between described band corrugated changeover portion each several part.
The present invention realizes the two of the technical scheme of its purpose according to said method: manufacture a LED laser welding equipment, including LED picking manipulator, laser generator, laser welding device transmitting terminal, high-frequency induction transmitting coil and control system；Described high-frequency induction transmitting coil is with stainless sheet steel on wiring board and LED stainless sheet steel stitch welding plain film as load.The state of described high-frequency induction transmitting coil and laser welding device transmitting terminal changes according to the state of control system and changes.
The present invention realizes the three of the technical scheme of its purpose according to said method: manufacture one piece of LED circuit board, the conducting wire including insulated substrate and being made on insulated substrate and LED linkage interface, and circuit board enhancement Layer and mesh；LED linkage interface includes soldering interface；Enhancement Layer includes being embedded in the stephanoporate steel plate within insulated substrate or elastic web plate.LED circuit board contains some LED aperture；The edge of LED aperture contains the linkage interface more than at two with LED；Described LED aperture is contained within LED；Described LED and the LED linkage interface electrical connection at LED aperture edge in described LED circuit board.
Can also make described LED linkage interface is to be arranged at stainless sheet steel on the wiring board on wiring board.
The present invention realizes the four of the technical scheme of its purpose according to said method: manufacture one piece of LED circuit board, the conducting wire including insulated substrate and being made on insulated substrate, LED linkage interface, circuit board enhancement Layer and mesh；LED linkage interface includes soldering interface；Circuit board enhancement Layer includes being embedded in the stephanoporate steel plate within insulated substrate or elastic web plate.LED circuit board contains some LED aperture；The edge of LED aperture contains the linkage interface more than at two with LED；Described LED aperture is contained within LED；Described LED is electrically connected with described linkage interface；Described LED circuit board is flexible PCB, and the shape of described flexible PCB changes according to the surface configuration of the glass heat pipe fitted with it and changes.
Can also make described LED linkage interface is to be arranged at stainless sheet steel on the wiring board on wiring board.
The present invention realizes the five of the technical scheme of its purpose according to said method: manufacture a glass heat pipe LED lamp, including the electrical connection interface in glass heat pipe, LED, driving power supply and the external world, even mating plate and control system.Glass heat pipe includes glass shell, exhaustor and working medium；Control system includes man machine interface；Man machine interface is wired with the catch cropping of control system governor circuit or wireless signal is connected.LED is connected with the hot junction heat transfer of glass heat pipe and the stitch welding plain film of LED contains laser stitch welding connecting portion with stainless sheet steel on wiring board.
Beneficial effects of the present invention: the method for laser welding glass heat pipe Surface L ED of the present invention provides the LED laser stitch welding welding method of the glass heat pipe LED lamp of a kind of applicable industrialized production, overcomes soldering time length, the possible inadequate defect of weld strength；Laser welding is firm, can realize welding at normal temperatures, and welding process is little to the thermal shock of glass heat pipe tube wall.The present invention can adapt to, according to the LED of the method, the reality that glass heat pipe machining accuracy error may be bigger.LED laser welding equipment of the present invention uses high-frequency induction preheating can provide higher laser stitch welding intensity and welding quality.LED aperture structure is opened in the LED circuit board employing of the present invention, is suitable for LED and is directly connected with glass heat pipe heat transfer, provides condition for realizing the connection glass heat pipe realization heat radiation maximization of LED direct heat transfer.Actual effect is: glass heat pipe LED lamp is under at heat-pipe radiator, even radiator cost averagely reduces by 50 to 70% premises, and the service life of light decay 20% extends to more than 7 years in average 2 to 3 years from existing heat-pipe radiator or cast aluminium radiator product.The non-ferrous metal that cast aluminium radiator relates to is cast into major source of pollutant；And the processing of glass heat pipe can pertain only to fuel gas fire head, its carrying capacity of environment is insignificant.And owing in the service life length 3 times of glass heat pipe LED lamp, glass heat pipe radiator production process, carbon emission is few, environmental benefit is obvious.It is good that glass properties stablizes weather resistance air-tightness, and service life significantly improves compared with metal heat pipe.
Accompanying drawing explanation
The present invention is further described with embodiment below in conjunction with the accompanying drawings.
Fig. 1 is a glass heat pipe LED lamp structure schematic diagram using single glass heat pipe.
Fig. 2 is the LED circuit board structural representation of a glass heat pipe LED lamp, is that the front to Fig. 1 LED circuit board describes.
Fig. 3 is a glass heat pipe structural representation with round table-like cold end, is the special description to Fig. 1 glass heat pipe.
Fig. 4 be glass heat pipe LED lamp use laser stitch welding LED stitch welding plain film face structural representation.
Fig. 5 is the upper TV structure schematic diagram that a glass heat pipe LED lamp uses laser stitch welding LED stitch welding plain film.
Fig. 6 be a LED face structural representation.
Fig. 7 is the LED laser welding equipment operation principle that carries out welding and faces structural representation.
Fig. 8 is total line frame graph of a LED laser welding equipment control system.
1. glass heat pipe in figure；2.LED；3. drive power supply；5. with extraneous electrical connection interface；The evenest mating plate；7. exhaustor；11.LED circuit board；12. conducting wires；13. control systems；15.LED linkage interface；19.LED hole；21. magnetic couplings；22. conducting adhesive material；23. corrugated changeover portions；24. stitch welding plain films；25. man machine interfaces；Stainless sheet steel on 26. wiring boards；27.LED picking manipulator；28. laser welding device transmitting terminals；29. high-frequency induction transmitting coils；30. inhale pawl；61. governor circuits；62. memorizeies；63. user-machine interface circuit；64.LED picking manipulator interface circuit；65. laser welding device transmitting terminal interface circuits；66. high-frequency induction transmitting coil interface circuits；67. buses.
Detailed description of the invention
Fig. 1 to 3 provides first embodiment of the invention jointly.
In Fig. 1 to 3, glass heat pipe LED lamp includes the electrical connection interface 5 in glass heat pipe 1, LED2, driving power supply 3 and the external world, even mating plate 6 and control system 13.Glass heat pipe 1 includes glass shell, exhaustor 7 and working medium；Control system 13 includes man machine interface 25；Wired or wireless signal can be made between man machine interface 25 with control system governor circuit be connected.
Wick net can also be set as required inside glass heat pipe 1.Working medium includes water and ethanol.If may freezing in fruit product use occasion and storage and transport process, optional ethanol is as working medium.Bulb screw mouth and the electric wire that can use screw lamp holder is used with extraneous electrical connection interface 5.LED2 is connected with the heat transfer of glass heat pipe 1 hot junction.In Fig. 1 to 3, arrow the most inwards represents heat pipe hot junction, and heat pipe hot junction absorbs heat energy；The most outside arrow represents heat pipe cold end, heat pipe cold end release heat energy.
Containing LED circuit board 11 outside glass heat pipe 1 hot junction.LED circuit board 11 includes insulated substrate and the conducting wire 12 being made on insulated substrate, LED linkage interface 15 and enhancement Layer.Enhancement Layer uses stephanoporate steel plate to be embedded in inside insulated substrate.Stephanoporate steel plate enhancement Layer is lightweight, intensity is guaranteed, its hollow sectors does not affect conductor and passes through LED circuit board 11.At least two above conducting wire, places 12 are the most directly electrically connected.The inner surface of LED circuit board 11 matches with the outer surface in glass heat pipe 1 hot junction.
LED circuit board 11, containing some LED aperture 19, places LED2 in LED aperture 19.The edge of each LED aperture 19 contains LED linkage interface 15 at two.Design on thermal insulation is used between LED linkage interface 15 and glass heat pipe 1.It is connected with the heat transfer of glass heat pipe 1 hot junction in LED2 is arranged in LED aperture 19 and by elastic conducting hotting mask or conducting adhesive material.
Even mating plate 6 realizes the connection with glass heat pipe 1 by the permanent magnetism magnetic coupling 21 being arranged on even mating plate 6 with the mutual magnetic of permanent magnetism magnetic coupling 21 being arranged on glass heat pipe 1.Described setting includes the pre-buried of moulding and bonding.
In embodiment 1, the relevant content of LED linkage interface 15 can also be with reference to the embodiment 2 of Fig. 4 and Fig. 5.The content of embodiment 1 also contributes to the understanding to embodiment 2.
Fig. 4 and Fig. 5 provides second embodiment of the invention jointly.
In Fig. 4 and Fig. 5, post one piece of LED circuit board 11 in glass heat pipe 1 hot junction.Conducting wire 12 and LED aperture 19 it is provided with for disposing LED2 in LED circuit board 11.The LED linkage interface 15 being made in LED circuit board 11 uses stainless sheet steel 26 on the wiring board of thickness 0.4 millimeter.Use Design on thermal insulation to alleviate the thermal shock to glass heat pipe 1 and heat transfer between LED linkage interface 15 and glass heat pipe 1.LED2 is shaped with conducting adhesive material 22 on the contact surface of glass heat pipe 1.LED2 two ends are stacked with stainless sheet steel about 26 on LED linkage interface 15 wiring board by the stitch welding plain film 24 of band corrugated changeover portion 23 respectively.The corrosion resistant plate that is stacked of two pieces of thickness 0.4 millimeter uses laser to carry out stitch welding.On stitch welding plain film 24 and linkage interface 15 wiring board, the gauge of stainless sheet steel 26 can regulate.Stainless sheet steel 26 laser welding to be experienced on LED linkage interface 15 wiring board, the embedding enhancement Layer of LED circuit board 11 the most below should retain steel plate.
Use 3 stitch welding on the stitch welding plain film 24 described in multiple spot stitch welding such as Fig. 5 can increase the reliability being welded to connect.The stitch welding plain film using band corrugated changeover portion 23 can slow down the negative effect of harmful stress that may be present generation between LED2 and LED circuit board 11, can slow down unfavorable mechanicals efforts, thermal shock and heat transfer to glass heat pipe 1.
Fig. 6 provides third embodiment of the invention.
In Fig. 6, manufacture laser welding LED2, including LED chip and the LED linkage interface that is connected with the external world.The two ends of LED2 respectively make the stainless sheet steel stitch welding plain film 24 of more than one piece band corrugated changeover portion 23.
Fig. 7 provides four embodiment of the invention.
In Fig. 7, manufacture a LED laser welding equipment, including LED picking manipulator 27, laser generator, laser welding device transmitting terminal 28, high-frequency induction transmitting coil 29 and control system.LED picking manipulator 27 be one secondary two groups often organize more than one suction pawl 30 connected with negative pressure source, it can hold and discharge LED2.High-frequency induction transmitting coil 29 can constitute electromagnetic circuit by the magnetic line of force as shown in Fig. 7 two long annular broken side by side and stainless sheet steel 26 on charge circuit plate or stitch welding plain film 24, and stainless sheet steel 26 or stitch welding plain film 24 are to produce eddy current in the circuit board.Laser welding apparatus in Fig. 7 can move up and down.In LED2 can being held when it moves down position shown in dashed pattern and putting it into the LED aperture 19 of LED circuit board 11.The state of high-frequency induction transmitting coil 29 and laser welding device transmitting terminal 28 changes according to the state of control system and changes.LED circuit board 11 is being mounted on glass heat pipe 1；Stainless sheet steel on wiring board 26 is launched frequency electromagnetic waves and is heated by the high-frequency induction transmitting coil making LED laser welding equipment；Described LED2 is held with the suction pawl 30 connected with negative pressure source, conducting adhesive material 22 is coated at LED2 lower surface, being allowed to realize with glass heat pipe 1 adhesion laminating to be connected with the low thermal resistance of glass heat pipe 1 and make the stitch welding plain film 24 at LED2 two ends to be laminated on the wiring board at LED aperture 19 edge on stainless sheet steel 26 in LED2 is arranged in LED aperture 19, described stitch welding plain film 24 is launched frequency electromagnetic waves and is heated by the high-frequency induction transmitting coil 29 making LED laser welding equipment, with laser welding device transmitting terminal 28 by stitch welding plain film 24 together with stainless sheet steel on wiring board 26 stitch welding.
Fig. 8 provides fifth embodiment of the invention.
In Fig. 8, LED laser welding equipment control system includes that governor circuit 61, memorizer 62, man machine interface and interface circuit 63 thereof, LED picking manipulator and interface circuit 64 thereof, laser welding device transmitting terminal and interface circuit 65 thereof, high-frequency induction transmitting coil and interface circuit 66 thereof and software include application program.Described governor circuit 61, memorizer 62, user-machine interface circuit 63, LED picking manipulator interface circuit 64, laser welding device transmitting terminal interface circuit 65, high-frequency induction transmitting coil interface circuit 66 are connected by bus 67 signal.
The control system block diagram of LED lamp can be obtained according to Fig. 8 embodiment, omit here.
Claims (8)
1. the method for laser welding glass heat pipe Surface L ED: manufacture laser welding LED, including LED chip and with extraneous linkage interface；The two ends of described LED respectively make the stainless sheet steel stitch welding plain film of more than one piece band corrugated changeover portion；Manufacture one piece of LED circuit board, make LED circuit board contain some LED aperture, stainless sheet steel is set at the edge of described LED aperture on two blocks of Above Transmission Lines plates as the electrical connection interface with LED；Manufacture a LED laser welding equipment, including LED picking manipulator, laser generator, laser welding device transmitting terminal, high-frequency induction transmitting coil and control system；Described high-frequency induction transmitting coil is with stainless sheet steel on wiring board and LED stainless sheet steel stitch welding plain film as load；The state of described high-frequency induction transmitting coil and laser welding device transmitting terminal changes according to the state of control system and changes；Described LED circuit board is mounted on glass heat pipe；Stainless sheet steel on wiring board is launched frequency electromagnetic waves and is heated by the high-frequency induction transmitting coil making LED laser welding equipment, it is characterized in that by hand instrument clamping LED or with one secondary two groups often organize more than one suction pawl connected with negative pressure source and hold described LED, at described LED lower surface gluing, being allowed to realize with glass heat pipe adhesion laminating to be connected with the low thermal resistance of glass heat pipe and make the stitch welding plain film at LED two ends to be laminated on the wiring board at LED aperture edge on stainless sheet steel in LED is correctly arranged in described LED aperture, described stitch welding plain film is launched frequency electromagnetic waves and is heated by the high-frequency induction transmitting coil making LED laser welding equipment, with laser welding device transmitting terminal by described stitch welding plain film together with stainless sheet steel stitch welding on wiring board.
Laser welding LED that the most according to claim 1, method manufactures, including LED chip and with extraneous linkage interface, it is characterized in that the two ends of described LED respectively make the stainless sheet steel stitch welding plain film of more than one piece band corrugated changeover portion；Seamlessly transit between described band corrugated changeover portion each several part.
The LED laser welding equipment that the most according to claim 1, method manufactures, including LED picking manipulator, laser generator, laser welding device transmitting terminal, high-frequency induction transmitting coil and control system, it is characterized in that the state of described high-frequency induction transmitting coil and laser welding device transmitting terminal changes according to the state of control system and changes.
The LED circuit board that the most according to claim 1, method manufactures, the conducting wire including insulated substrate and being made on insulated substrate and LED linkage interface, it is characterized in that LED circuit board contains some LED aperture；The edge of LED aperture contains the linkage interface more than at two with LED；Described LED aperture is contained within LED；Described LED and the LED linkage interface electrical connection at LED aperture edge in described LED circuit board.
LED circuit board the most according to claim 4, is characterized in that described LED linkage interface is to be arranged at stainless sheet steel on the wiring board on wiring board.
The LED circuit board that the most according to claim 1, method manufactures, the conducting wire including insulated substrate and being made on insulated substrate, LED linkage interface, circuit board enhancement Layer and mesh；LED linkage interface includes soldering interface；Circuit board enhancement Layer includes being embedded in the stephanoporate steel plate within insulated substrate or elastic web plate, it is characterized in that LED circuit board contains some LED aperture；The edge of LED aperture contains the linkage interface more than at two with LED；Described LED aperture is contained within LED；Described LED is electrically connected with described linkage interface；Described LED circuit board is flexible PCB, and the shape of described flexible PCB changes according to the surface configuration of the glass heat pipe fitted with it and changes.
LED circuit board the most according to claim 6, is characterized in that described LED linkage interface is to be arranged at stainless sheet steel on the wiring board on wiring board.
The glass heat pipe LED lamp that the most according to claim 1, method manufactures, including the electrical connection interface in glass heat pipe, LED, driving power supply and the external world, even mating plate and control system；Glass heat pipe includes glass shell, exhaustor and working medium；Control system includes man machine interface；Man machine interface is wired with the catch cropping of control system governor circuit or wireless signal is connected, and it is characterized in that LED is connected with the hot junction heat transfer of glass heat pipe and the stitch welding plain film of LED contains laser stitch welding connecting portion with stainless sheet steel on wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410042469.1A CN103785951B (en) | 2014-01-28 | 2014-01-28 | The product of laser welding glass heat pipe Surface L ED and manufacture method and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410042469.1A CN103785951B (en) | 2014-01-28 | 2014-01-28 | The product of laser welding glass heat pipe Surface L ED and manufacture method and equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103785951A CN103785951A (en) | 2014-05-14 |
| CN103785951B true CN103785951B (en) | 2016-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410042469.1A Active CN103785951B (en) | 2014-01-28 | 2014-01-28 | The product of laser welding glass heat pipe Surface L ED and manufacture method and equipment |
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