CN103491760B - Element fixing apparatus and component mounting method - Google Patents

Abstract

The present invention relates to element fixing apparatus and component mounting method, described element fixing apparatus includes: operation head, lead elements and production method thereof is transported to the installation position being fixed on the substrate of job position, performs to be inserted into the lead-in wire of lead elements and production method thereof from a main surface side of substrate the element installation process inserting hole of described installation position；Bending utensil, the described wire contacts prominent with being inserted into another first type surface inserting Kong Bingcong substrate in described element installation process and by described lead-in wire bending；Support member, in the way of changing by the enough described installation positions based on described lead elements and production method thereof of setting unit potential energy of described bending utensil, detachably supports described bending utensil；Control portion, makes to be arranged at described bending utensil the described bending utensil that arrange position corresponding with described installation position before described element installation process starts and arranges process and performed.Thus, the moving range of substrate that need not be broad just can change the installation position of lead elements and production method thereof and the position relationship of substrate.

Description

Component mounting apparatus and component mounting method

Technical Field

The present invention relates to a component mounting technique for bending a lead of a lead component inserted into an insertion hole formed in a substrate to mount the lead component on the substrate.

Background

Japanese patent laying-open No. h 06-112692 discloses a bending (clamp) mechanism that inserts a lead of a lead element into a mounting hole (insertion hole) formed in a substrate and bends a distal end of the lead protruding from the substrate to mount the lead element on the substrate. The bending mechanism includes a head unit disposed above the substrate and a bending unit disposed below the substrate. When the head unit inserts the lead of the lead element into the mounting hole from above the substrate, the bending unit comes into contact with the distal end of the lead protruding below the substrate. The bending unit is formed with a beveled inclined surface, and the distal end of the lead wire contacting the bending unit is bent along the inclined surface. The distal end of the lead bent in this way engages with the mounting hole, and the lead element is mounted on the substrate.

However, the positional relationship between the mounting portion of the lead element and the substrate is not always the same. For example, when the type of a substrate to be produced is changed, it is necessary to change the positional relationship between the mounting portion of the lead element and the substrate according to the type of the substrate. In such a case, by appropriately moving the substrate by the bending mechanism as described above to change the positional relationship between the substrate and the bending unit, the positional relationship between the mounting portion of the lead element and the substrate can be changed.

However, the device does not always ensure a wide substrate movement range necessary for changing the positional relationship between the mounting portion of the lead element and the substrate. For example, when the device is miniaturized, the moving range of the substrate is naturally limited. Therefore, in the case of a configuration in which the positional relationship between the substrate and the bending unit is changed only by the movement of the substrate, the range in which the positional relationship between the mounting portion of the lead element and the substrate can be changed is limited.

Disclosure of Invention

The invention provides a technique capable of changing the positional relationship between the mounting position of a lead element and a substrate without requiring a wide movement range of the substrate.

A component mounting apparatus according to an aspect of the present invention to achieve the above object is a component mounting apparatus for mounting a lead component on a substrate in which insertion holes into which leads of the lead component are inserted are formed corresponding to positions on X and Y coordinates in XYZ orthogonal coordinate axes in which a Z-axis direction is a vertical direction of a mounting portion of the lead component, the insertion holes penetrating from one main surface to the other main surface of the substrate, the component mounting apparatus including: a substrate fixing unit for fixing the substrate at an operation position; a component supply unit that supplies the lead components; a work head that carries the lead component supplied from the component supply unit to the mounting site on the substrate fixed at the work position, and performs a component mounting process of inserting the lead of the lead component from the one main surface side of the substrate into the insertion hole of the mounting site; a bending jig which is brought into contact with the lead wire inserted into the insertion hole and protruding from the other main surface of the substrate in the component mounting process and bends the lead wire; a support member that detachably supports the bending tool so that positions on an X coordinate and a Y coordinate in the XYZ orthogonal coordinate axis of an installation site of the bending tool can be changed based on the positions on the X coordinate and the Y coordinate of the mounting site of the lead element; and a control unit that executes a bending tool setting process for setting the bending tool at the setting position corresponding to the mounting position before the component mounting process is started.

A component mounting method according to another aspect of the present invention is a component mounting method for mounting a lead component on a substrate in which insertion holes into which leads of the lead component are inserted are formed in correspondence with positions on X and Y coordinates in XYZ orthogonal coordinate axes in which a Z-axis direction is a vertical direction of a mounting portion of the lead component, the insertion holes penetrating from one main surface to the other main surface of the substrate, the component mounting method including the steps of: a substrate fixing step of fixing the substrate at an operation position; a component mounting step of conveying the lead component supplied to a component supply position to the mounting site on the substrate fixed to the working position and inserting the lead of the lead component from the one main surface side of the substrate into the insertion hole of the mounting site so that the lead protruding from the other main surface of the substrate comes into contact with a bending tool to bend the lead; wherein a bending tool setting step of setting the bending tool at a setting portion corresponding to the mounting portion is performed before the component mounting step is started, and positions on an X coordinate and a Y coordinate in the XYZ orthogonal coordinate axis of the setting portion of the bending tool can be changed based on the positions on the X coordinate and the Y coordinate of the mounting portion of the lead component.

According to the present invention, the positional relationship between the mounting portion of the lead element and the substrate can be changed without widening the moving range of the substrate.

Drawings

Fig. 1 is a plan view showing a schematic configuration of a component mounting apparatus according to an embodiment of the present invention.

Fig. 2 is a partial front view of the component mounting apparatus.

Fig. 3 is a block diagram showing a main electrical configuration of the component mounting apparatus.

Fig. 4 is a flowchart showing an example of the operation performed by the component mounting apparatus.

Fig. 5 is a diagram showing an example of a display mode of substrate data on a display.

Fig. 6 is a plan view schematically showing an example of an arrangement form of the bending pin on the support plate.

Fig. 7 is a perspective view schematically showing an example of the bending pin.

Fig. 8 is a sectional view schematically showing a partial section of the bending pin.

Fig. 9 is a perspective view schematically showing a structure according to a modification of the bending pin.

Fig. 10 is a partial sectional view schematically showing the structure and operation of a bending pin according to a modification.

Fig. 11 is a partial sectional view schematically showing the structure and operation of a bending pin according to a modification.

Detailed Description

Fig. 1 is a plan view showing a schematic configuration of a component mounting apparatus 1 according to an embodiment of the present invention, fig. 2 is a partial front view of the component mounting apparatus 1, and fig. 3 is a block diagram showing a main electrical configuration of the component mounting apparatus 1. The component mounting device 1 shown in these figures has a structure capable of mounting both a surface mount component and a lead component Pl on a substrate S. In fig. 1, 2 and the following drawings, XYZ orthogonal coordinate axes in which the Z-axis direction is the vertical direction are appropriately shown in order to clarify the directional relationship of the drawings.

The component mounting apparatus 1 includes a base 11 and a substrate conveyance mechanism 2 provided on the base 11, and is capable of conveying a substrate S in a predetermined conveyance direction X. More specifically, the substrate conveyance mechanism 2 includes a pair of conveyance belts 21 that convey the substrate S from the right side to the left side in fig. 1 on the base 11. The conveyor belt 21 conveys the substrate S in accordance with an instruction from the drive controller 210 of the control unit 200. Specifically, the conveyor belt 21 stops the substrate S carried in from the outside of the apparatus at a predetermined working position L (the position of the substrate S shown in fig. 1 and 2), and fixes and holds the substrate S by a fixing means (not shown). When the head unit 6 described later completes mounting of the electronic component P (surface mount component, lead component Pl) on the substrate S fixed at the working position L, the carrier tape 21 carries out the substrate S to the outside of the apparatus.

The base 11 is provided with a support portion 3 for supporting the substrate S fixed to the working position L from below. The support portion 3 includes a flat plate-shaped support plate 31 (push-up plate) and a plurality of bending pins 100 detachably provided on the upper surface of the support plate 31, and supports the substrate S by causing the bending pins 100 to abut against the substrate S from below. The reason why such bending pin 100 is used is as follows.

In the component mounting device 1, the surface mount component and the lead component Pl are mounted on the substrate S. The substrate S includes an insertion hole h (see fig. 8) penetrating from the front surface (one main surface) to the back surface (the other main surface). The lead element Pl is mounted by inserting the lead of the lead element Pl into the insertion hole h of the substrate S while applying a predetermined load to the lead element Pl. Therefore, if the substrate S is held by only the conveyor belt 21, the substrate S may be bent by a load accompanying the mounting of the lead elements Pl. Therefore, the bending of the substrate S due to the mounting of the lead element Pl is suppressed by providing the bending pin 100 at the installation site corresponding to the mounting site of the lead element Pl and supporting the mounting site with the bending pin 100. In order to mount the lead element Pl on the substrate S, the lead l of the lead element Pl must be bent. Therefore, the bending pin 100 has a function of bending the lead l of the lead element Pl mounted on the substrate S in addition to a function of suppressing the bending of the substrate S. In addition, if the kinds of substrates S produced are different, the mounting positions of the lead elements Pl are also different. Therefore, the installation position of the bending pin 100 can be changed according to the installation position of the lead element Pl.

The support 3 includes an elevating mechanism 35 for elevating and lowering the support plate 31 in response to a command from the drive control unit 210. Specifically, when the substrate S is fixed to the working position L by the conveyor belt 21, the elevating mechanism 35 positions the upper surface of the support plate 31 at the initial height z0, and supports the substrate S from below by the upper ends of the bending pins 100. On the other hand, when the substrate S is conveyed by the conveyor belt 21, the elevating mechanism 35 lowers the upper surface of the support plate 31 from the initial height z0 to prevent the substrate S from interfering with the bending pins 100 during conveyance.

The component supply units 4 are provided on the front side (+ Y axis direction side) and the rear side (-Y axis direction side) of the conveyor belt 21. The component supply section 4 is composed of a surface mount component supply section 4s and a lead component supply section 4 l. The surface mount component supply section 4s has a structure in which a plurality of feeders 41s for supplying surface mount components, which are electronic components P, are arranged in the X-axis direction. Each feeder 41s is a tape feeder provided with a reel (not shown) on which a tape for storing and holding surface mount components is wound, and is capable of supplying the surface mount components to the head unit 6. Specifically, on the tape, chip electronic components in a small chip form such as Integrated Circuits (ICs), transistors, and capacitors are housed and held at predetermined intervals. The feeder 41s intermittently feeds the tape from the reel to the head unit 6 side, thereby intermittently feeding the surface mount components in the tape to the component suction position. As a result, the surface mount component can be picked up by the suction nozzle 62 mounted on the mounting head 61 of the head unit 6.

The lead element supply unit 4l has a structure in which a plurality of feeders 41l for supplying lead elements Pl as electronic components P are arranged in the X-axis direction. Each feeder 41l is provided with a carrier tape (not shown) for holding a plurality of lead elements Pl at predetermined intervals, for example, as in the feeder disclosed in japanese patent laid-open publication No. 2007-180280, and the lead elements Pl are intermittently sent to the element suction position by sending the carrier tape to the head unit 6 side. As a result, the lead element Pl can be picked up by the suction nozzle 62 mounted on the mounting head 61 of the head unit 6.

The head unit 6 transports the electronic component P sucked and held by the suction nozzle 62 of the mounting head 61 to the substrate S, and transfers the electronic component P to a mounting site instructed by a user. Specifically, the head unit 6 includes six mounting heads 61F arranged in a row in the X axis direction on the front side and a total of 12 mounting heads 61 that are six mounting heads 61R arranged in a row in the X axis direction on the rear side. That is, as shown in fig. 1 and 2, in the head unit 6, 6 mounting heads 61F extending in the vertical direction Z are provided in a row (front row) at equal intervals in the X-axis direction. Further, a rear row configured in the same manner as the front row is provided on the rear side (the (-Y axis direction side) of the mounting head 61F. That is, 6 mounting heads 61R extending in the vertical direction Z are provided in a row at equal intervals in the X-axis direction. The mounting head 61F and the mounting head 61R are provided with a half pitch offset in the X-axis direction, and are provided in a zigzag shape in plan view as shown in fig. 1. Therefore, when viewed from the Y-axis direction, as shown in fig. 2, the 12 mounting heads 61 are aligned in a line in the X-axis direction without overlapping each other.

The distal end portion of each mounting head 61 of the mounting nozzle 62 can communicate with any one of the negative pressure generating device, the positive pressure generating device, and the atmosphere via the pressure switching mechanism 7 (fig. 3). The grip control portion 220 of the control unit 200 controls the pressure switching mechanism 7 so that the pressure given to the distal end portion of the mounting head 61 can be switched. Therefore, when a negative pressure suction force from the negative pressure generating device is given to the distal end portion of the mounting head 61 by pressure switching, the suction nozzle 62 mounted on the distal end portion sucks and holds the electronic component P. Conversely, when the positive pressure from the positive pressure generating device is applied to the distal end portion of the mounting head 61, the suction holding of the electronic component P by the suction nozzle 62 is released, and the electronic component P is mounted on the substrate S. After the electronic component P is mounted, the suction nozzle 62 is opened to the atmosphere. In this way, in the head unit 6, the electronic component P can be attached and detached by controlling the negative pressure suction force and the positive pressure supply by the grip control unit 220.

Each mounting head 61 can be moved up and down (moved in the Z-axis direction) with respect to the head unit 6 by a nozzle up-and-down driving mechanism (not shown), and can be rotated around the nozzle center axis (rotation in the R-direction in fig. 2) by a nozzle rotation driving mechanism (not shown). Among these driving mechanisms, the nozzle elevation driving mechanism elevates the mounting head 61 between a lowered position (lowered end) when the electronic component P is sucked or mounted and a raised position (raised end) when the electronic component P is transported. The nozzle rotation driving mechanism is a mechanism for rotating the suction nozzle 62 as necessary, and can position the electronic component P in a predetermined R direction at the time of mounting by rotation driving. These drive mechanisms are constituted by a Z-axis servomotor Mz, an R-axis servomotor Mr, and a predetermined power transmission mechanism. The drive control unit 210 controls the Z-axis servomotor Mz and the R-axis servomotor Mr to move the mounting heads 61 in the Z-axis direction and the R-axis direction.

The head unit 6 holding the mounting heads 61 is movable in the X-axis direction and the Y-axis direction (directions orthogonal to the X-axis direction and the Z-axis direction) over a predetermined range of the base 11. That is, the head unit 6 is supported movably along the X axis with respect to the mounting head support member 63 extending in the X axis direction. The mounting head support member 63 is supported at both ends thereof by fixed rails 64 in the Y-axis direction, and is movable in the Y-axis direction along the fixed rails 64. The head unit 6 is driven in the X-axis direction by an X-axis servomotor Mx via a ball screw 66, and the head supporting member 63 is driven in the Y-axis direction by a Y-axis servomotor My via a ball screw 68. Therefore, the drive control unit 210 controls the drive of the X-axis servo motor Mx and the Y-axis servo motor My, thereby moving the head unit 6 to a predetermined position in the XY plane. As a result, the head unit 6 can be appropriately moved to carry the electronic component P sucked by the mounting head 61 from the component supply unit 4 to the mounting site.

The component mounting apparatus 1 is provided with two types of cameras (a component recognition camera C1 and a component inspection camera C2) for picking up an image of the electronic component P. The component recognition camera C1 is configured by an illumination unit, a CCD (Charge Coupled Device) camera, and the like, is provided on the base 11, and is mainly used for confirming the suction state of the suction nozzle 62 of each mounting head 61 with respect to the electronic component P. Specifically, the drive control unit 210 moves the head unit 6 appropriately, thereby moving the electronic component P sucked by the suction nozzle 62 above the component recognition camera C1. In this state, the image of the electronic component P captured by the component recognition camera C1 is transmitted to (the image processing section 230 of) the control unit 200. The control unit 200 controls the R-axis servo motor Mr through the drive control section 210 based on the image, thereby appropriately rotating the mounting head 61 in the R direction to appropriately adjust the angle of the electronic component P mounted on the substrate S.

The component inspection camera C2 is composed of an illumination unit, a CCD camera, and the like, is mounted on the head unit 6, and is mainly used for inspecting the mounting state of the electronic component P mounted on the board S. Specifically, the drive control section 210 moves the head unit 6 appropriately, and moves the component inspection camera C2 above the mounting position of the electronic component P. In this state, the image of the electronic component P captured by the component inspection camera C2 is transmitted to the image processing section 230. The image processing unit 230 determines whether the mounted state of the electronic component P is good or bad based on the transferred image of the electronic component P.

As will be described in detail later, in the present embodiment, the bending pin 100 is provided at a predetermined installation position on the support plate 31 by the mounting head 61 of the head unit 6. That is, in the automatic nozzle replacement device 81 provided on the rear side (the side in the Y axis direction) of the support portion 3, the nozzles 62P for the electronic component P and the nozzles 62c for the bending pins 100 are prepared as the nozzles 62 which can be attached to the distal end portion of the mounting head 61, and the nozzles 62 attached to the mounting head 61 can be replaced therebetween. Further, a pin magazine 82 that accommodates a plurality of bending pins 100 is provided on the front side (+ Y axis direction side) of the support portion 3. Then, by using the mounting head 61 to which the suction nozzle 62c for the bending pin 100 is attached, the bending pin 100 is sucked from the pin stocker 82 and conveyed to the support plate 31, and the bending pin 100 can be set at a predetermined setting position of the support plate 31. The movement of the mounting head 61 at this time is controlled by the drive control unit 210 in the same manner as the above-described conveyance of the electronic component P.

As shown in fig. 3, the component mounting apparatus 1 includes a display 91 and an input device 92 that function as an interface with a user. The display 91 has a function of an input terminal configured by a touch panel to receive an input from a user, in addition to a function of displaying an operation state of the component mounting apparatus 1. The input device 92 is constituted by a mouse or a keyboard, and functions to receive input from a user. The input/output control of the display 91 and the input device 92 is performed by the input/output control unit 240 of the control unit 200.

The overall operation of the component mounting apparatus 1 configured as described above is controlled collectively by the main control section 250. The main control unit 250 exchanges signals with each unit of the control unit 200 via the bus 270 based on the program or data stored in the storage unit 260 to control the entire apparatus 1. Specifically, the storage unit 260 stores a pin setting program 261 and an installation program 262 (production program). The pin setting program 261 is a program for controlling the mounting head 61 and the like to set the bending pin 100 to the setting portion of the support plate 31. The mounting program 262 is a program for controlling the mounting head 61 and the like to mount the electronic components P on the mounting portions of the substrate S, and includes information such as the mounting order in addition to the positions and angles at which the electronic components P are mounted on the substrate S. Next, an example of an operation performed under the control of the main control unit 250 will be described.

Fig. 4 is a flowchart showing an example of the operation performed by the component mounting apparatus 1. In this figure, a flowchart when the production substrate type is switched is shown. That is, when switching of the substrate varieties is instructed by the user via 91, 92 of the user interface, the flowchart of the figure is executed. In step S101, substrate data indicating the position and angle at which the electronic component P is mounted on the substrate S is read from the mounting program 262 stored in the storage unit 260. The list of the substrate data is displayed on the display 91 (fig. 5).

Fig. 5 is a diagram showing an example of a display mode of the substrate data on the display 91. On the display 91, the positions (X coordinate and Y coordinate) where the electronic components are mounted and the angles (R angle) where the electronic components are mounted are displayed for the electronic components P1 and P2 … …, respectively. Further, on the display 91, a lead element check box for specifying whether each of the electronic elements P1 and P2 … … is the lead element Pl is displayed. The user uses the touch panel function or the input device 92 of the display 91 to hook in the lead element Pl, that is, the lead element check box of the electronic component P (step S102). Incidentally, in the example of fig. 5, the lead wire check boxes of the electronic components P2 and P6 are hooked.

In step S103, the mounting information of the lead element Pl is extracted based on the input result of the user in step S102. Specifically, in this step, the positions (X-coordinate, Y-coordinate) of the mounting sites of the electronic components P2, P6 designated as the lead elements Pl by the user are extracted. Then, the position of the installation position of the bending pin 100 is determined from the positions of the mounting positions of the lead elements P2 and P6. The lead element Pl is attached at a position different from the position of the bending pin 100 in the Z-axis direction. Therefore, the positions (X-coordinate and Y-coordinate) of the mounting portions of the lead elements P2 and P6 are obtained as the positions (X-coordinate and Y-coordinate) of the mounting portions of the bending pin 100.

In step S103, the mounting angle (R direction) of the electronic components P2 and P6 designated as the lead element Pl by the user is extracted and found as the installation angle of the bending pin 100. That is, as shown in fig. 7 and the like described in detail below, the bending pin 100 receives the lead l of the lead element Pl in the lead receiving groove 123 to bend the lead l. Therefore, if the lead wire receiving groove 123 is inclined with respect to the lead wire l, the lead wire l cannot be appropriately received by the lead wire receiving groove 123, and there is a risk that the lead wire l cannot be reliably bent. Therefore, in order to make the installation angle of the bending pin 100 correspond to the installation angle of the lead element Pl so that the lead l is reliably received in the lead receiving groove 123, the installation angle (R direction) of the lead element Pl is obtained as the installation angle (R direction) of the bending pin 100 in step S103.

Next, when the suction nozzle 62 of the mounting head 61 is replaced with the suction nozzle 62c for the bending pin in step S104, the bending pin setting process (bending tool setting process) of step S105 is executed. In this bending pin installation process, the bending pin 100 is installed on the support plate 31 based on the installation position and angle determined in step S103. Specifically, the main control unit 250 images the bending pin 100 as the installation target stored in the pin magazine 82 by the component inspection camera C2, and grasps the angle of the bending pin 100. Specifically, the angle of bending pin 100 is grasped based on the recognition result of the lead receiving groove 123 (fig. 7) of bending pin 100 or the mark attached to bending pin 100. Then, the bending pin 100 is set on the support plate 31 based on the set position and angle obtained in step S103 and the angle of the bending pin 100 recognized by the component inspection camera C2 (fig. 6). Here, fig. 6 is a plan view schematically showing an example of an installation form of the bending pin 100 on the support plate 31. As shown in fig. 6, bending pin 100 is provided on support plate 31 in accordance with the position and angle of lead element Pl (lead element P2 is x2, y2, r2, lead element P6 is x6, y6, r6) designated by the installation user.

In the bending pin setting process, the height of the upper surface of the support plate 31 is changed in accordance with the initial height z 0. The reason for this is as follows. When mounting the electronic component P on the substrate S fixed at the working position L, the mounting head 61 performs a work on the surface Sf of the substrate S at the component mounting height zf. In contrast, when the bending pin 100 is provided, the mounting head 61 performs work on the upper surface of the support plate 31. Therefore, the mounting head 61 needs to have a movement range capable of accessing both the surface Sf of the substrate S at the component mounting height zf and the upper surface of the support plate 31. Therefore, when the height of the upper surface of the support plate 31 at the time of the bending pin setting process is greatly different from the component mounting height zf, it is necessary to secure a wide movement range of the mounting head 61, but it is not necessarily simple to secure the movement range.

To cope with this, when the bending pin setting process is performed, the height of the upper surface of the support plate 31 is raised to a position higher than the initial height z0 by the component mounting height zf. That is, the position of the upper surface of support plate 31 at the time of performing the bending pin setting process is preferably moved to a position (position closer to mounting head 61) closer to the position (zf) of the surface Sf of substrate S at the time of performing the lead component mounting process than the position (z0) of the upper surface of support plate 31 at the time of performing the lead component mounting process, and preferably to the same height position as zf. In such a configuration, the range in which the mounting head 61 mounts the electronic component P on the substrate S can be made close to the range in which the mounting head 61 moves to provide the bending pins 100. Therefore, it is not necessary to secure a wide movement range of the mounting head 61, and the structure of the apparatus 1 can be simplified.

In step S105, all the bending pins 100 necessary for mounting the lead elements Pl are set, and when the bending pin setting process is completed, the suction nozzle 62 of the mounting head 61 is replaced with the suction nozzle 62p for the electronic component (step S106), and the substrate S is carried in and fixed to the working position L (step S107). Thus, the preparation for starting the mounting of the electronic component P is completed.

In the surface mount component mounting process of step S108, mounting of the surface mount component on the substrate S is performed. Specifically, the mounting head 61 sucks and holds the surface mount component supplied from the surface mount component supply unit 4S by the suction nozzle 62p, and conveys the component to the mounting site on the surface Sf of the substrate S. Then, a positive pressure is applied to the suction nozzle 62p, and the surface mount component is mounted on the mounting portion of the substrate S from the suction nozzle 62 p. When the mounting action is performed for all the surface mount components, step S109 is performed.

In the lead element mounting process of step S109, mounting of the lead element Pl on the substrate S is performed. Specifically, the mounting head 61 sucks and holds the lead component Pl supplied from the lead component supply unit 4l by the suction nozzle 62p, and conveys the lead component Pl to the mounting position on the surface Sf of the substrate S. Then, the lead element Pl is applied with a predetermined load from the Z-axis direction downward by the mounting head 61, and the lead of the lead element Pl is inserted into the insertion hole of the substrate S provided at the mounting site. At this time, the load applied to the lead element Pl is adjusted by controlling the drive current of the Z-axis servomotor Mz. Since the bending pin 100 is provided below the mounting position of the lead element Pl, the lead of the lead element Pl protruding from the rear surface Sb of the substrate S is bent by the bending pin 100. Thus, the lead element Pl is mounted on the substrate S. When the mounting operation is performed for all the lead elements Pl, step S110 is performed.

In step S110, the substrate S is carried out from the working position L, and in the next step S111, it is determined whether or not production of all the substrates S is completed. When the production is not completed (no in step S111), the process returns to step S107 to continue the production of the substrate S. On the other hand, when the production has been completed (when yes in step S111), the production of the substrate is ended.

The above is a detailed description of the structure and operation of the component mounting apparatus 1. Next, the structure and operation of the bending pin 100 used in the component mounting apparatus 1 will be described in detail. Fig. 7 is a perspective view schematically showing an example of the bending pin. Fig. 8 is a sectional view schematically showing a partial section of the bending pin of fig. 7. Bending pins 100 are provided on the support plate 31 to mount lead elements Pl such as resistors or capacitors to the substrate S. In fig. 7 and 8, a lead element Pl as an operation target of the bending pin 100, the substrate S, and the support plate 31 are also indicated. In fig. 7, the structure covered by the substrate S is also shown through the substrate S.

A predetermined number of (two in the drawing) wire-like leads l extend from the lead element Pl. The lead l functions to connect the lead element Pl to the substrate S and to electrically connect the lead element Pl to the pattern of the substrate S. On the other hand, the substrate S is provided with insertion holes h for inserting the leads l of the lead elements Pl with respect to the mounting portions Wa of the elements P. The insertion hole h penetrates from the surface Sf (one main surface) of the substrate S to the back surface Sb (the other main surface). The lead l of the lead element P1 is inserted into the insertion hole h from the element mounting direction D (direction parallel to the Z-axis direction) from the front surface Sf to the back surface Sb of the substrate S, and the lead l protruding below the substrate S due to the insertion is bent, whereby the lead element Pl is mounted on the substrate S.

As shown in fig. 7 and 8, the bending pin 100 has a cylindrical shape extending in the Z-axis direction. More specifically, the bending pin 100 has a schematic configuration including a cylindrical base member 110 extending in the Z-axis direction and a lead receiving member 120 attached to an upper end of the base member 110. A fitting hole 111 having a shape rotationally symmetrical with respect to the Z axis and opening upward is formed at the upper end of the base member 110. On the other hand, the lead wire receiving member 120 includes a disk-shaped head portion 121 and a rod-shaped (columnar) fitting protrusion 122 protruding downward from the head portion 121, and has a shape rotationally symmetrical with respect to the Z axis. The lead wire receiving member 120 is supported by the base member 110 in a state where the fitting projection 122 of the lead wire receiving member 120 is fitted into the fitting hole 111 of the base member 110 from above.

The diameter of the fitting protrusion 122 is smaller than that of the fitting hole 111. Therefore, the fitting protrusion 122 is fitted to the fitting hole 111 with a gap. Therefore, the lead receiving member 120 can be displaced with respect to the base member 110 in a plane (XY plane) orthogonal to the component mounting direction D. Further, a ball bearing 130 including a plurality of balls arranged so as to surround the fitting projection 122 is provided between the lower surface of the head portion 121 of the lead wire receiving member 120 and the upper surface of the base member 110. Therefore, the lead receiving member 120 can be smoothly displaced with respect to the base member 110 by the function of the ball bearing 130.

Specifically, the lead receiving member 120 can move in parallel in a plane orthogonal to the component mounting direction D or can move rotationally about an axis extending in the component mounting direction D. Incidentally, the parallel movement of the lead wire receiving member 120 is restricted within the range of the clearance between the fitting protrusion 122 and the fitting hole 111. Also, the rotational movement of the lead receiving member 120 is restricted by the rotation restricting member 190.

The rotation restricting member 190 has a hollow cylindrical shape, is fitted over the lead receiving member 120 in the device mounting direction D, and is fixed to the base member 110 by a rod-shaped fixing member 195. A slit 191 is formed in the head portion of the rotation restricting member 190, and a projection 121a formed in the head portion 121 of the lead wire receiving member 120 projects upward from the slit 191. The width of the protrusion 121a is narrower than the width of the slit 191, and a gap is provided between the slit 191 and the protrusion 121 a. As a result, the lead wire receiving member 120 can rotate within the range of the gap between the slit 191 and the protrusion 121 a. That is, the rotation (displacement) of the lead receiving member 120 is restricted by the protrusion 121a abutting against the wall surface of the slit 191.

A predetermined number of (two in the drawing) lead receiving grooves 123, which are cut in the radial direction of the lead receiving member 120 and open upward and laterally, are formed on the head portion 121 of the lead receiving member 120 on the upper surface side of the projecting portion 121 a. These lead receiving grooves 123 are provided corresponding to the leads l of the lead elements Pl, and are formed rotationally symmetrically (180 degrees symmetry in the drawing) with respect to the center line (rotational symmetry axis) of the lead receiving member 120. The lead wire receiving groove 123 is formed from a slightly outer side of the center line of the lead wire receiving member 120 to the peripheral surface, and has an inclined surface shape that is downward toward the peripheral surface of the lead wire receiving member 120. More specifically, the lead wire receiving groove 123 has a shape in which an upper steep slope and a lower gentle slope having a smaller inclination angle than the steep slope are smoothly connected by a circular arc, and is formed so as to transition from the steep slope to the gentle slope from the center line of the lead wire receiving member 120 toward the circumferential surface.

When the lead element Pl is bent to the substrate S, the bending pin 100 is provided at a lower installation location Wb of the substrate S so that the lead receiving groove 123 of the bending pin 100 is positioned below the insertion hole h of the substrate S (on the other main surface side of the substrate). Then, the lead element Pl is press-fitted downward from the state where the lead l of the lead element Pl is inserted into the insertion hole h. Thus, the lead wires l protruding below the substrate S are further pushed in after contacting the lead wire receiving groove 123, and are bent along the shape of the lead wire receiving groove 123. Thus, the lead l is bent, and the lead element Pl is mounted on the substrate S. At this time, as shown in fig. 8, the end of the lead wire l protrudes outside from the circumferential surface of the lead wire receiving member 120.

Further, a support protrusion 124 is formed on the upper surface of the head portion 121 of the lead receiving member 120. The bending pin 100 is in contact with the back surface Sb of the substrate S through the supporting protrusion 124 to support the substrate S. Thus, the substrate S is supported by the bending pins 100 against the load acting in association with the mounting of the lead elements Pl, and the bending of the substrate S is suppressed. A magnet 135 is screwed to the lower end of the base member 110, and the bending pin 100 is attached to the support plate 31 by magnetic force. This makes it possible to reliably erect the bending pin 100 on the support plate 31 against the force from the substrate S.

As described above, in the component mounting device 1 according to the present embodiment, the substrate S having the insertion hole h formed therein for inserting the lead L of the lead component Pl with respect to the mounting portion Wa of the lead component Pl is fixed to the working position L. Next, the lead element Pl is carried to the mounting site Wa of the substrate S, and a "lead element mounting process" of inserting the lead l of the lead element Pl from the surface Sf side of the substrate S into the insertion hole h of the mounting site Wa is performed. The bending pin 100 is in contact with the lead l inserted into the insertion hole h and protruding from the back surface Sb of the substrate S in the lead element mounting process, and bends the lead l. The lead l thus bent is engaged with the insertion hole h, and the lead element Pl is mounted on the substrate.

In particular, in the present embodiment, the installation location Wb of the bending pin 100 can be changed according to the installation location Wa of the lead element Pl. That is, the bending pin 100 is detachably supported by the support plate 31 so that the installation position Wb can be changed according to the attachment position Wa. Further, before the lead element mounting process is started, a bending pin setting process of setting the bending pin 100 at the setting location Wb corresponding to the mounting location Wa is performed. In such a configuration, when it is necessary to change the positional relationship between the mounting portion Wa of the lead element Pl and the substrate S, the installation portion Wb of the bending pin 100 is changed in accordance with the change, and the bending pin 100 is installed at the installation portion Wb after the change, so that it is possible to cope with the change in the positional relationship between the mounting portion Wa of the lead element Pl and the substrate S without particularly moving (the working position L of) the substrate S. Therefore, the positional relationship between the mounting portion Wa of the lead element Pl and the substrate S can be changed without widening the movement range of the substrate S.

The number of mounting sites Wa of the lead element Pl is not limited to one, and as described above, a plurality of mounting sites Wa may be provided on the substrate S. In such a case, according to the bending mechanism disclosed in japanese patent laid-open publication No. h 06-112692, the lead elements Pl can be mounted on each of the plurality of mounting locations Wa by repeating the operation of moving the substrate S so that the mounting location Wa is positioned above the bending unit and mounting the lead elements Pl on the mounting location Wa. However, the apparatus does not always ensure a wide movement range of the substrate S necessary to move the substrate S until the mounting portion Wa is positioned above the bending unit. Therefore, the conventional technique involving movement of the substrate S is not necessarily appropriate.

In contrast, according to the present embodiment, by executing the bending pin setting process, the bending pins 100 are respectively provided at the plurality of installation locations Wb corresponding to the plurality of mounting locations Wa. Therefore, in the lead element mounting process, it is preferable to mount the lead elements Pl to the plurality of mounting locations Wa in a state of being fixed to the working position L without particularly moving the substrate S.

In the present embodiment, surface mount devices are mounted on the substrate S fixed to the working position L in addition to the lead elements Pl. In such a configuration, both the lead element Pl and the surface mount element can be mounted on the substrate S, and the versatility of the element mounting device 1 can be improved.

In the configuration in which both the lead element Pl and the surface mount element can be mounted, it may not be possible to know which of the plurality of electronic components P mounted on the substrate S is the lead element Pl. In this case, it is also conceivable to provide bending pins 100 for all electronic components P regardless of the type of electronic component P. However, it cannot be said that the bending pin 100 is provided even in a surface-mounted component which does not require the bending pin 100 in mounting, because it is an unnecessary operation.

In contrast, in the present embodiment, the user can specify the lead elements Pl from among the plurality of electronic components P mounted on the substrate S by the input device 92 or the like functioning as a user interface. In the bending pin setting process, the bending pin 100 is set at the setting position Wb corresponding to the mounting position Wa of the lead element Pl set by the user. In such a configuration, since the lead element Pl is specified by the user, it is possible to grasp which of the plurality of electronic components P mounted on the substrate S is the lead element Pl. In the bending pin installation process, the bending pin 100 can be appropriately installed at the installation site Wb corresponding to the installation site Wa of the lead element Pl thus grasped. As a result, the occurrence of unnecessary operation of providing the bending pin 100 to the surface mount component can be suppressed.

In the present embodiment, the position of the installation site Wb of the bending pin 100 is determined from data indicating the position of the installation site Wa of the lead element Pl. Based on the result, the position where the bending pin 100 is provided in the bending pin providing process is controlled. Therefore, the position of the installation site Wb of the bending pin 100 can be appropriately controlled according to the position of the installation site Wa of the lead element Pl. Therefore, the lead l inserted into the insertion hole h provided in the mounting portion Wa can be reliably bent in contact with the bending pin 100 provided in the installation portion Wb, and the lead element Pl can be reliably mounted in the mounting portion Wa.

Further, the angle at which the bending pin 100 is provided is determined from the data indicating the angle at which the lead element Pl is mounted, and the angle at which the bending pin 100 is provided in the bending pin providing process is controlled based on the result. Therefore, the angle at which the bending pin 100 is provided can be appropriately controlled according to the angle at which the lead element Pl is mounted. Therefore, the lead l inserted into the insertion hole h provided in the mounting portion Wa can be reliably bent in contact with the bending pin 100 provided in the installation portion Wb, and the lead element Pl can be reliably mounted in the mounting portion Wa.

Further, the mounting head 61 carries the bending pins 100 from the pin stocker 82 to the setting portion Wb to perform the bending pin setting process. In such a configuration, the lead element Pl and the bending pin 100 can be both conveyed by the common mounting head 61. Therefore, it is not necessary to provide a structure for transporting the lead element Pl and the bending pin 100, respectively, and the device 1 can be downsized and reduced in cost.

In the present embodiment, the bending pin setting process is performed before the substrate S is conveyed to the working position L by the conveyor belt 21. In such a configuration, since the substrate S is not present at the working position L when the bending pin setting process is performed, the access to the support plate 31 becomes easy. As a result, the arrangement of the bending pin 100 on the support plate 31 can be easily performed.

As described above, in the above-described embodiment, the component mounting device 1 corresponds to an example of the "component mounting device" of the present invention, the pair of conveyor belts 21 corresponds to an example of the "substrate fixing unit" and the "substrate conveying unit" of the present invention, the lead component supply portion 4l corresponds to an example of the "component supply unit" of the present invention, the mounting head 61 corresponds to an example of the "work head" of the present invention, the support plate 31 corresponds to an example of the "support member" of the present invention, the bending pin 100 corresponds to an example of the "bending tool" of the present invention, the step S109 corresponds to an example of the "component mounting process" of the present invention, the bending pin setting process S105 corresponds to an example of the "bending tool setting process" of the present invention, the display 91 or the input device 92 corresponds to an example of the "user interface" of the present invention, and the pin reservoir 82 corresponds to an example of the "storage member" of the present invention, the main control unit 250 corresponds to a "control unit" of the present invention. Step S107 corresponds to an example of the "substrate fixing step" of the present invention, step S109 corresponds to an example of the "element mounting step" of the present invention, and step S105 corresponds to an example of the "bending tool setting step" of the present invention.

The present invention is not limited to the above-described embodiments, and various modifications can be made to the above-described embodiments without departing from the gist thereof. For example, the specific configuration of the bending pin 100 is not limited to the above configuration, and may be any configuration as long as the installation position Wb on the support plate 31 can be appropriately changed. Therefore, the bending pin 100 may be configured, for example, in the following manner.

Fig. 9 is a perspective view schematically showing the structure of a bending pin 100A according to a modification. Fig. 10 and 11 are partial sectional views schematically showing the structure and operation of the bending pin 100A. The structure of the bending pin 100A shown in fig. 9 to 11 is partially shared with the bending pin 100 shown in fig. 7 and 8. Therefore, hereinafter, different configurations will be mainly described, and the common portions will be denoted by the same reference numerals and will not be described as appropriate.

The bending pin 100A has a schematic configuration including a cylindrical base member 110 extending in the Z-axis direction and a lead receiving member 120 fixed to an upper end of the base member 110. A predetermined number of (two in the drawing) lead wire receiving grooves 123 are formed in the upper surface of the lead wire receiving member 120, and the lead wire receiving grooves 123 are cut in the radial direction of the lead wire receiving member 120 having a rotationally symmetrical shape and are opened upward and laterally. As described with reference to fig. 7 and 8, the bending pin 100A bends the lead l of the lead element Pl.

The bending pin 100A includes an additional processing mechanism 140 for performing additional processing on the lead l bent and protruding from the circumferential surface of the lead receiving member 120. As the additional processing, the present modification exemplifies cutting processing of the bent lead wire l. The additional processing means 140 includes a hollow outer cylinder 141 having a cylindrical shape extending in the Z-axis direction, a bridge 142 bridging the inner wall of the outer cylinder 141 so as to cross the hollow portion of the outer cylinder 141, and a shaft 143 extending downward from the bridge 142 and having an outward flange 143a at a lower end. The additional processing means 140 is attached to the base member 110 in the following manner.

As shown in fig. 10 and 11, an internal space 150 extending in the Z-axis direction is formed inside the base member 110. The upper end of the inner space 150 is blocked by the lead receiving member 120, and the lower end is blocked by the cover member 160. The cover member 160 has a protrusion 161 that faces upward and protrudes into the internal space 150. An inward flange 110a is provided on the inner wall of the base member 110 surrounding the internal space 150, and the internal space 150 is roughly divided into a lower space 150a below the inward flange 110a and an upper space 150b above the inward flange 110 a.

The shaft 143 of the additional processing mechanism 140 is provided in the internal space 150 of the base member 110 and is movable in the Z-axis direction. Specifically, the upper end of the shaft 143 is inserted into a hole surrounded by the inward flange 110a from below. A flange 143a at the lower end of the shaft 143 is positioned in the lower space 150a, and the upper end of the shaft 143 protrudes from the flange 143a to the upper space 150 b. As a result, the shaft 143 can move in the Z-axis direction between a position (position in fig. 10) below the projection 161 of the lid member 160 at which the flange 143a abuts and a position (position in fig. 11) above the flange 110a at which the flange 143a abuts.

The bridge portion 142 of the additional processing mechanism 140 is provided in a lateral hole 151 provided in the base member 110. The horizontal hole 151 penetrates the base member 110 in the horizontal direction and communicates with the upper space 150b, and the horizontal hole 151 is provided with a predetermined width in the Z-axis direction so as to secure a movable region of the bridge portion 142. The bridge 142 moves in the horizontal hole 151 and can move in the Z-axis direction along with the shaft 143 without interfering with the base member 110.

The outer cylinder 141 of the additional processing mechanism 140 is fitted to the outside of the base member 110 and the lead receiving member 120, and is supported by both ends of the bridge portion 142 protruding from the transverse hole 151. Thus, the outer cylinder 141 is connected to the shaft 143 via the bridge 142 and can move in the Z-axis direction along with the shaft 143.

Thus, the additional processing mechanism 140 including the outer cylinder 141, the bridge 142, and the shaft 143 is movable in the Z-axis direction. The additional processing mechanism 140 is moved by a press-fitting hole 171 and a compression spring 172 provided in the bending pin 100. That is, the press-fitting hole 171 penetrating the base member 110 communicates with the lower space 150a, and the air press-fitted into the lower space 150a from the press-fitting hole 171 pushes up the shaft 143 from the lower surface. On the other hand, the compression spring 172 is provided between the lead wire receiving member 120 and the bridge portion 142 in the upper space 150b, and pushes down the shaft 143 via the bridge portion 142. With such a configuration, the outer cylinder 141 can be raised along with the shaft 143 by pushing air in through the pressure-inlet hole 171, while the outer cylinder 141 can be lowered along with the shaft 143 by opening the pressure-inlet hole 171 to the atmospheric pressure. Specifically, the press-fitting hole 171 is connected to a pressure adjustment mechanism (not shown) via a hose, and the press-fitting of air into the press-fitting hole 171 and the opening of the press-fitting hole 171 to the atmospheric pressure are performed by the pressure adjustment mechanism.

The additional processing means 140 further includes an annular substrate protection member 144 fitted outside the lead receiving member 120 above the outer cylinder 141. The substrate protective member 144 is located slightly above the lower end of the inclined surface of the lead receiving groove 123. Therefore, in the state of fig. 10, the lead wires l bent along the lead wire receiving groove 123 protrude to the outside from between the inclined surface of the lead wire receiving groove 123 and the substrate protective member 144. Therefore, by raising the outer cylinder 141 to the position of fig. 11, the lead l can be cut by sandwiching the lead l between the blade 141a formed at the upper end of the outer cylinder 141 and the substrate protection member 144. Thus, the bending pin 100A according to the modification can cut the bent lead l. The above is a description of the structure and operation of bending pin 100A according to the modification.

In this way, the bending pin 100A additionally performs cutting processing of the lead l. However, the processing that can be additionally performed on the lead l is not limited to the cutting processing. Specifically, when the lead wire l is insufficiently bent only along the lead receiving groove 123, it is preferable that the process of further bending the lead wire l be additionally performed. Therefore, the bending pin 100A according to the modification can be modified as follows, for example.

Specifically, the blade and the substrate protection member 144 at the upper end of the outer cylinder 141 can be omitted. In such a configuration, the lead wire l bent along the lead wire receiving groove 123 can be additionally subjected to bending processing instead of cutting the lead wire l by the outer cylinder 141. Specifically, the outer tube 141 is raised, and the lead wire l protruding outward from the lead wire receiving groove 123 is pushed and bent by the outer tube 141, whereby additional bending processing can be performed.

In addition to the deformation of the bent pin 100, various modifications can be made. For example, in the above embodiment, the gripping of the bending pin 100 is performed by suction. However, the gripping form of the bending pin 100 is not limited to suction. Specifically, the chuck that can open and close the jaws by air pressure may be used to grip the jaws. The surface mount device and the lead element Pl may be similarly modified in the grip form.

In the above-described embodiment, a case where the present invention is applied to the component mounting device 1 capable of mounting both the surface mount component and the lead component Pl on the substrate S has been described. However, for example, the present invention may be applied to the component mounting apparatus 1 in which surface mounting of components to the substrate S is not performed.

In the above embodiment, the electronic component P is mounted from the upper side to the lower side in the vertical direction, in other words, the component mounting direction D is directed vertically downward. However, the element mounting direction D is not limited to this, and may be, for example, a direction that is vertically upward.

In the above embodiment, the mounting of the electronic component P and the setting of the bending pin 100 are performed by the common mounting head 61. However, the mechanism for providing the bending pins 100 may be provided separately from the mounting head 61 for mounting the electronic component P.

The above embodiments mainly include the inventions having the following configurations.

A component mounting apparatus according to an aspect of the present invention is a component mounting apparatus for mounting a lead component on a substrate in which an insertion hole into which a lead of the lead component is inserted is formed corresponding to a mounting portion of the lead component, the insertion hole penetrating from one main surface to another main surface of the substrate, the component mounting apparatus including: a substrate fixing unit for fixing the substrate at an operation position; a component supply unit that supplies the lead components; a work head that carries the lead component supplied from the component supply unit to the mounting site on the substrate fixed at the work position, and performs a component mounting process of inserting the lead of the lead component from the one main surface side of the substrate into the insertion hole of the mounting site; a bending jig which is brought into contact with the lead wire inserted into the insertion hole and protruding from the other main surface of the substrate in the component mounting process and bends the lead wire; a support member that detachably supports the bending tool so that an installation position of the bending tool can be changed based on the attachment position of the lead element; and a control unit that executes a bending tool setting process for setting the bending tool at the setting position corresponding to the mounting position before the component mounting process is started.

A component mounting method according to another aspect of the present invention is a component mounting method for mounting a lead component on a substrate in which an insertion hole into which a lead of the lead component is inserted is formed corresponding to a mounting portion of the lead component, the insertion hole penetrating from one main surface to another main surface of the substrate, the component mounting method including the steps of: a substrate fixing step of fixing the substrate at an operation position; a component mounting step of conveying the lead component supplied to a component supply position to the mounting site on the substrate fixed to the working position and inserting the lead of the lead component from the one main surface side of the substrate into the insertion hole of the mounting site so that the lead protruding from the other main surface of the substrate comes into contact with a bending tool to bend the lead; wherein a bending jig setting step of setting the bending jig at the setting position corresponding to the mounting position is performed before the component mounting step is started, and the setting position of the bending jig can be changed based on the mounting position of the lead component.

According to the above-described invention (component mounting apparatus, component mounting method) configured as described above, the substrate, in which the insertion holes into which the leads of the lead components are inserted are formed corresponding to the mounting positions of the lead components, is fixed at the working position. Next, the lead component is carried to a mounting site of the substrate, and the lead of the lead component is inserted into an insertion hole of the mounting site from one main surface side of the substrate (component mounting process, component mounting step). Then, the bending jig is brought into contact with the lead wire inserted into the insertion hole and protruding from the other main surface of the substrate in the component mounting process (step), thereby bending the lead wire. The lead wire thus bent is engaged with the insertion hole, and the lead element is mounted on the substrate.

In particular, in the present invention, the installation location provided with the bending tool can be changed based on the mounting location of the lead element. Then, before the component mounting process (step) is started, a bending tool setting process (step) of setting a bending tool to a setting portion corresponding to the mounting portion is performed. Thus, when the positional relationship between the mounting portion of the lead element and the substrate needs to be changed, the setting portion of the bending tool is changed accordingly, and the bending tool is set to the changed setting portion, so that the change in the positional relationship between the mounting portion of the lead element and the substrate can be coped with without specially moving the substrate. Therefore, the positional relationship between the mounting portion of the lead element and the substrate can be changed without widening the moving range of the substrate.

However, the number of mounting portions for the lead element is not limited to one, and a plurality of mounting portions may be provided on the substrate. In such a case, according to the bending mechanism of the related art, the operation of moving the substrate so that the mounting portion is positioned above the bending unit and mounting the lead element to the mounting portion is repeatedly performed for each mounting portion, whereby the lead element can be mounted to each of the plurality of mounting portions. However, the apparatus does not always ensure a wide substrate movement range required to move the substrate to a position where the mounting portion is located above the bending unit. Therefore, the conventional technique involving the movement of the substrate is not necessarily appropriate.

Therefore, in the above component mounting apparatus, the following structure may be further adopted: the substrate is provided with a plurality of the mounting portions, and in the bending tool setting process, the bending tool is provided at each of a plurality of the setting portions corresponding to the plurality of mounting portions. According to this configuration, the bending tool is provided to each of the plurality of installation locations corresponding to the plurality of attachment locations. Therefore, the lead element can be mounted to each of the plurality of mounting sites without intentionally moving the substrate.

In addition, the component mounting apparatus may further include: the work head further mounts a surface mount component to the substrate fixed at the work position. According to this configuration, both the lead element and the surface mount element can be mounted on the substrate, and the versatility of the element mounting apparatus can be improved.

In a configuration in which both a lead element and a surface-mounted element can be mounted, it may not be possible to know which element of a plurality of electronic elements mounted on a substrate is the lead element. In this case, it is also conceivable to provide bending tools for all the elements, regardless of the type of the elements. However, it is not appropriate to provide a bending tool even for a surface-mounted component that does not require a bending tool in mounting.

Therefore, the following structure may be further adopted in the component mounting apparatus, further comprising: a user interface for enabling a user to specify the lead element from a plurality of elements mounted to the substrate; wherein, in the bending jig setting process, the bending jig is set at the setting portion corresponding to the mounting portion of the lead element set by the user through the user interface. According to this configuration, since the lead element is specified by the user, which element among the plurality of elements mounted on the substrate is the lead element can be grasped. In the bending jig setting process, the bending jig can be appropriately set to the setting position corresponding to the mounting position of the lead element grasped in this manner. As a result, it is possible to suppress the occurrence of unnecessary operation of providing the surface mount component with the bending tool.

In addition, the component mounting apparatus may further include: the control unit obtains a position of the installation portion where the bending tool is installed from data indicating a position of the installation portion where the lead element is installed, and controls a position where the bending tool is installed in the bending tool installation process based on the obtained result. Thus, the position of the installation position of the bending tool can be appropriately controlled according to the position of the installation position of the lead element. Therefore, the lead wire inserted into the insertion hole provided in the mounting portion can be reliably bent while being in contact with the bending jig provided in the mounting portion, and the lead wire element can be reliably mounted on the mounting portion.

In this case, the component mounting apparatus may further adopt the following configuration: the control unit obtains an angle at which the bending tool is set at the setting position from data indicating an angle at which the lead element is mounted at the mounting position, and controls the angle at which the bending tool is set in the bending tool setting process based on the obtained result. Thus, the angle at which the bending tool is provided can be appropriately controlled according to the angle at which the lead element is attached. Therefore, the lead wire inserted into the insertion hole provided in the mounting portion can be reliably bent while being in contact with the bending jig provided in the mounting portion, and the lead wire element can be reliably mounted on the mounting portion.

In addition, the component mounting apparatus may further include: a housing member that houses the bending tool; wherein the work head carries the bending tool from the housing member to the setting portion to execute the bending tool setting process. Thus, both the lead element and the bending tool can be carried by the common work head. Therefore, it is not necessary to provide a separate structure for conveying the lead element and the bending tool, and the size and cost of the device can be reduced.

In this case, the component mounting apparatus may further include: the position of the support member when the bending tool setting process is performed is located at a position closer to the position of the one main surface of the substrate when the component mounting process is performed than the position of the support member when the component mounting process is performed. According to this configuration, the range in which the work head moves for the component mounting process can be made close to the range in which the work head moves for the bending tool setting process. Therefore, it is not necessary to secure a wide movement range of the working head, and the device structure can be simplified.

In addition, the component mounting apparatus may further include: a substrate carrying unit for carrying the substrate to the operation position; wherein the substrate fixing unit fixes the substrate transported to the operation position by the substrate transporting unit, and the controller performs the bending tool setting process before the substrate transporting unit transports the substrate to the operation position. Thus, when the bending tool setting process is performed, the substrate is not present at the working position, and therefore, the mounting component can be easily accessed. As a result, the bending tool setting process for setting the bending tool to the mounting member can be easily performed.

As described above, according to the present invention, the positional relationship between the mounting portion of the lead element and the substrate can be changed without requiring a wide movement range of the substrate.

Claims (10)

1. A component mounting apparatus for mounting a lead component on a substrate, the substrate having an insertion hole into which a lead of the lead component is inserted, the insertion hole penetrating from one main surface to the other main surface of the substrate, the insertion hole corresponding to positions on an X coordinate and a Y coordinate of XYZ orthogonal coordinate axes in which a Z-axis direction is a vertical direction of a mounting portion of the lead component, the component mounting apparatus comprising:

a substrate fixing unit for fixing the substrate at an operation position;

a component supply unit that supplies the lead components;

a work head that carries the lead component supplied from the component supply unit to the mounting site on the substrate fixed at the work position, and performs a component mounting process of inserting the lead of the lead component from the one main surface side of the substrate into the insertion hole of the mounting site;

a bending jig which is brought into contact with the lead wire inserted into the insertion hole and protruding from the other main surface of the substrate in the component mounting process and bends the lead wire;

a support member that detachably supports the bending tool so that positions on an X coordinate and a Y coordinate in the XYZ orthogonal coordinate axis of an installation site of the bending tool can be changed based on the positions on the X coordinate and the Y coordinate of the mounting site of the lead element;

and a control unit that executes a bending tool setting process for setting the bending tool at the setting position corresponding to the mounting position before the component mounting process is started.

2. A component mounting apparatus in accordance with claim 1, wherein:

the substrate is provided with a plurality of mounting parts,

in the bending tool setting process, the bending tool is set at each of the plurality of setting positions corresponding to the plurality of mounting positions.

3. A component mounting apparatus in accordance with claim 1, wherein:

the work head further mounts a surface mount component to the substrate fixed at the work position.

4. The component mounting apparatus according to claim 3, characterized by further comprising:

a user interface for enabling a user to specify the lead element from a plurality of elements mounted to the substrate; wherein,

in the bending jig setting process, the bending jig is set to the setting portion corresponding to the mounting portion of the lead element set by the user through the user interface.

5. A component mounting apparatus in accordance with claim 1, wherein:

the control unit obtains a position of the installation portion where the bending tool is installed from data indicating a position of the installation portion where the lead element is installed, and controls a position where the bending tool is installed in the bending tool installation process based on the obtained result.

6. The component mounting apparatus according to claim 5, wherein:

the control unit obtains an angle at which the bending tool is set at the setting position from data indicating an angle at which the lead element is mounted at the mounting position, and controls the angle at which the bending tool is set in the bending tool setting process based on the obtained result.

7. The component mounting apparatus according to claim 1, characterized by further comprising:

a housing member that houses the bending tool; wherein,

the work head carries the bending tool from the housing member to the setting portion to execute the bending tool setting process.

8. The component mounting apparatus according to claim 7, wherein:

the position of the support member when the bending tool setting process is performed is located at a position closer to the position of the one main surface of the substrate when the component mounting process is performed than the position of the support member when the component mounting process is performed.

9. The component mounting apparatus according to any one of claims 1 to 8, characterized by further comprising:

a substrate carrying unit for carrying the substrate to the operation position; wherein,

the substrate fixing unit fixes the substrate carried to the operation position by the substrate carrying unit,

the controller causes the bending tool setting process to be executed before the substrate conveying unit conveys the substrate to the operation position.

10. A component mounting method characterized by mounting a lead component on a substrate, the substrate having an insertion hole into which a lead of the lead component is inserted, the insertion hole penetrating from one main surface to the other main surface of the substrate, the insertion hole corresponding to positions on an X coordinate and a Y coordinate of XYZ orthogonal coordinate axes in which a Z-axis direction is a vertical direction of a mounting portion of the lead component, the component mounting method comprising:

a substrate fixing step of fixing the substrate at an operation position;

a component mounting step of conveying the lead component supplied to a component supply position to the mounting site on the substrate fixed to the working position and inserting the lead of the lead component from the one main surface side of the substrate into the insertion hole of the mounting site so that the lead protruding from the other main surface of the substrate comes into contact with a bending tool to bend the lead; wherein,

a bending tool setting step of setting the bending tool at a setting portion corresponding to the mounting portion is performed before the component mounting step is started, and positions on an X coordinate and a Y coordinate in the XYZ orthogonal coordinate axes of the setting portion of the bending tool can be changed based on the positions on the X coordinate and the Y coordinate of the mounting portion of the lead component.