CN103369851A - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
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- CN103369851A CN103369851A CN2012101015147A CN201210101514A CN103369851A CN 103369851 A CN103369851 A CN 103369851A CN 2012101015147 A CN2012101015147 A CN 2012101015147A CN 201210101514 A CN201210101514 A CN 201210101514A CN 103369851 A CN103369851 A CN 103369851A
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Abstract
The invention relates to a manufacturing method for a printed circuit board. Problems that corrosives are used so that serious pollution on environment is caused and that copper materials are wasted exist in a traditional manufacturing process of the printed circuit board. Moreover, a problem that security cannot be ensured also exists. The manufacturing method for the printed circuit board provided by the invention includes: preparing a substrate; positioning a silk screen on the substrate through a silk-screen or steel-screen printing process; spreading metal slurry uniformly on the silk screen through adoption of a slurry spreading process so that the metal slurry is printed on the substrate through hollow out points or hollow out lines; carrying out a pre-drying process on the substrate which undergoes the slurry spreading process; and firing the substrate which undergoes the pre-drying process so that the metal slurry is reverted to a metal pattern layer.
Description
Technical field
The present invention relates to printed substrate, relate in particular to the manufacturing process of printed circuit board (PCB), also relate to the printed circuit board (PCB) that uses this manufacturing process to obtain.
Background technology
Printed substrate is the most frequently used electronic product substrate in the electronics product manufacturing industry, and the electronic devices and components that consist of electronic product are fixed on the printed substrate of this effect substrate.Realize electrical connection between each components and parts by the conductive pattern on the printed substrate.
Printed substrate is generally take insulation board as substrate, and substrate commonly used mostly is the epoxies insulated substrate at present.Then be laminated with one deck copper foil layer at substrate, press product requirement, the mode of conductive pattern by sensitization or printing copied on the copper foil layer, then use corrosive agent to corrode, unwanted Copper Foil is etched away, the Copper Foil that stays forms the conductive pattern that needs.Can also print solder mask and character as required, form final printed wire panel products.
The problem that the manufacturing process of this existing printed substrate exists is to need to use corrosive agent that Copper Foil is carried out etching, and a large amount of corrosive agent that use can cause severe contamination to environment on the one hand, and etched Copper Foil also causes the waste to copper product on the other hand.
In the prior art, also have a kind ofly take copper coin or aluminium sheet as base material, form substrate at copper coin or the sticking one deck insulating material of pressing of surface of aluminum plate, Copper Foil is laminated with on the insulating material of substrate.Then adopt above-mentioned similar technique to form printed substrate.This printed substrate need to be applied in the electronic product of heat conduction and heat radiation usually, for example the LED product.Because this printed substrate is required that good heat conductivility is arranged, therefore, usually do insulation material layer thinly as far as possible, to improve the heat conductivility of printed substrate.Yet insulating barrier becomes book will bring proof voltage breakdown performance variation, so that the overall security of product can't be guaranteed.
Summary of the invention
According to the problem that prior art exists, main purpose of the present invention is to provide a kind of brand-new manufacture method of printed substrate, and it can solve and use macro-corrosion agent generation to the problem of environment.
According to the problem that prior art exists, another object of the present invention is to provide a kind of brand-new manufacture method of printed substrate, and it can solve the safety issues such as withstand voltage.
According to the problem that prior art exists, a further object of the present invention is to provide a kind of printed substrate, and this printed substrate has solved when making and used macro-corrosion agent generation to the problem of environment.
According to the problem that prior art exists, another purpose of the present invention is to provide a kind of printed substrate, and it can solve the safety problems such as withstand voltage.
According to above-mentioned purpose, the manufacture method of printed substrate provided by the invention comprises the steps:
A, preparation one substrate;
B, use silk-screen printing technique, with conductive pattern sensitization or be printed on the silk screen, form one deck conductive pattern film, the hollow out point of wherein said conductive pattern film or hollow out line are the wire icon of conductive pattern needs;
C, described silk screen is placed on the described substrate;
Sizing process is drawn together in D, employing, and the metal slurry was drawn together described silk screen equably, makes the metal slurry see through described hollow out point or hollow out line, is printed on the described substrate;
E, process carrying out prebake through the described substrate of drawing together sizing process;
G, the described substrate that prebake is processed to process are fired, and make the metal slurry be reduced into metal pattern layer.
In the manufacture method of above-mentioned printed substrate, described substrate is ceramic substrate.
In the manufacture method of above-mentioned printed substrate, the described sizing process of drawing together adopts flexibility to draw together cutter to finish.
In the manufacture method of above-mentioned printed substrate, described metal slurry is silver slurry or copper slurry.
In the manufacture method of above-mentioned printed substrate, described firing is to carry out in 600 ℃ to 900 ℃ high temperature furnace.
In the manufacture method of above-mentioned printed substrate, also be included on the described metal pattern layer and print solder mask.
According to above-mentioned purpose, the present invention also provides a kind of manufacture method of printed substrate to comprise following steps:
A, preparation one substrate;
B, with conductive pattern sensitization or be replicated on the sheet metal, and the wire icon that needs in etching on the described sheet metal or the wire icon that on described sheet metal, needs with laser scoring;
C, described sheet metal is placed on the described substrate;
Sizing process is drawn together in D, employing, and the metal slurry was drawn together described sheet metal equably, makes the metal slurry through the wire icon on the described sheet metal, is printed on the described substrate;
E, process carrying out prebake through the described substrate of drawing together sizing process; And
G, the described substrate that prebake is processed to process are fired, and make the metal slurry be reduced into metal pattern layer.
In the manufacture method of above-mentioned printed substrate, described sheet metal is steel plate.
In the manufacture method of above-mentioned printed substrate, described substrate is ceramic substrate.
In the manufacture method of above-mentioned printed substrate, the described sizing process of drawing together adopts flexibility to draw together cutter to finish.
In the manufacture method of above-mentioned printed substrate, described metal slurry is silver slurry or copper slurry.
In the manufacture method of above-mentioned printed substrate, described firing is to carry out in 600 ℃ to 900 ℃ high temperature furnace.
In the manufacture method of above-mentioned printed substrate, also be included on the described metal pattern layer and print solder mask.
According to above-mentioned purpose, the present invention also provides a kind of printed substrate that adopts said method to make, and comprising:
Substrate adopts ceramic material;
Metal pattern layer, described metal pattern layer are fired by the metal slurry and are formed on the described substrate.
In above-mentioned printed substrate, described metal slurry is silver slurry or copper slurry.
In above-mentioned printed substrate, described firing is to carry out in 600 ℃ to 900 ℃ high temperature furnace.
In the manufacturing process of printed substrate of the present invention, abandoned the step that needs Copper Foil is carried out chemical corrosion in the traditional handicraft, reduced the impact on environment, saved simultaneously the waste of metal material.On the other hand, among embodiment, substrate has adopted ceramic material therein, and the application scenario for heat radiation or heat conduction requirement are arranged can directly be arranged at ceramic substrate on the radiator, ceramic substrate is done thin as far as possible simultaneously, to guarantee heat conductivility.Because ceramic material has good insulation property, therefore, compares with the traditional printing wiring board, under equal conditions, the heat conductivility of printed circuit board (PCB) of the present invention and insulation safety will improve a lot.
Description of drawings
Fig. 1 shows the structural representation of realizing manufacture method instrument of the present invention;
Fig. 2 is the structural representation that utilizes the printed substrate that the manufacture method of printed substrate of the present invention obtains.
Embodiment
The below will describe the embodiment of the manufacture method of printed substrate of the present invention.
At first, prepare a substrate, the size of substrate and thickness can determine as required that the used material of substrate can be used traditional insulation board, for example the epoxies insulated substrate.But preferably, in the present embodiment, can adopt ceramic sheet as substrate.
Then, adopt silk-screen printing technique, the mode by sensitization or printing on a silk screen forms the conductive pattern film, wherein, has hollow out point or hollow out line in the conductive pattern film, as the wire icon of conductive pattern needs; Print or sensitization technique can adopt known technology at silk screen, therefore be not described in detail at this, those of ordinary skills can realize on the basis of known technology.
Although in above-mentioned description, on order, described first prepared substrate, then silk-screen printing technique has been described, be appreciated that these two steps when realizing, there is no strict order minute, before whom after whom all can, also can carry out simultaneously.Therefore, above-mentioned description should not be considered as the restriction to the inventive method.
Then, on the basis of above-mentioned steps, silk screen is placed on the substrate.
Then, adopt and draw together sizing process, the metal slurry was drawn together silk screen equably, make the metal slurry see through hollow out point or hollow out line, be printed on the substrate; When drawing together slurry, can adopt flexibility to draw together cutter.
Finish draw together sizing process after, substrate is carried out prebake processes;
At last, the substrate of processing through prebake is fired, made the metal slurry be reduced into metal pattern layer.The temperature of firing can be determined according to different metal slurries.In the present embodiment, the metal slurry is selected silver slurry or copper slurry.Its firing temperature is controlled at and carries out in 600 ℃ to 900 ℃ the high temperature furnace.
In another embodiment of the present invention, after finishing, burning process can as traditional technology, increase by one in the step of metal pattern layer printing solder mask.
Described in above-mentioned embodiment, in the manufacturing process of printed substrate of the present invention, abandoned the step that needs Copper Foil is carried out chemical corrosion in the traditional handicraft, reduced the impact on environment, saved simultaneously the waste of metal material.On the other hand, among embodiment, substrate has adopted ceramic material therein, and the application scenario for heat radiation or heat conduction requirement are arranged can directly be arranged at ceramic substrate on the radiator, ceramic substrate is done thin as far as possible simultaneously, to guarantee heat conductivility.Because ceramic material has good insulation property, therefore, compares with the traditional printing wiring board, under equal conditions, the heat conductivility of printed circuit board (PCB) of the present invention and insulation safety will improve a lot.
See also Fig. 1, Fig. 1 shows the instrument of realizing above-mentioned manufacture method.As shown in Figure 1, this instrument comprises silk screen 1, has formed the conductive pattern film by sensitization or mode of printing on this silk screen 1.Below silk screen 1, place a substrate 2, then silk screen is placed on the substrate 2, then adopt and draw together sizing process, draw together cutter 3 with flexibility the metal slurry was drawn together silk screen 2 equably, make the metal slurry see through hollow out point or hollow out line, be printed on the substrate 2.At last substrate 2 is taken out and carry out the prebake processing and fire processing.
Another embodiment of the manufacture method of printed substrate of the present invention is described below.
In this another embodiment, at first, prepare a substrate, the size of substrate and thickness can determine as required that the used material of substrate can be used traditional insulation board, for example the epoxies insulated substrate.But preferably, in the present embodiment, can adopt ceramic sheet as substrate.
Then with conductive pattern sensitization or be replicated on the sheet metal, and the wire icon that etching needs on sheet metal; Perhaps directly on sheet metal, engrave technique with laser, scribe the wire icon that needs.Carry out etch process or laser at sheet metal and engrave technique and can adopt known technology, therefore be not described in detail at this, those of ordinary skills can realize on the basis of known technology.Equally, sheet metal can be selected steel plate, also can adopt other sheet metal.
Although in above-mentioned description, on order, described first prepared substrate, then silk-screen printing technique has been described, be appreciated that these two steps when realizing, there is no strict order minute, before whom after whom all can, also can carry out simultaneously.Therefore, above-mentioned description should not be considered as the restriction to the inventive method.
Then, adopt and draw together sizing process, the metal slurry was drawn together sheet metal equably, make the metal slurry see through the wire icon, be printed on the substrate; When drawing together slurry, can adopt flexibility to draw together cutter.
Finish draw together sizing process after, substrate is carried out prebake processes;
Then, the substrate of processing through prebake is fired, made the metal slurry be reduced into metal pattern layer.The temperature of firing can be determined according to different metal slurries.In the present embodiment, the metal slurry is selected silver slurry or copper slurry.Its firing temperature is controlled at and carries out in 600 ℃ to 900 ℃ the high temperature furnace.
In this another embodiment, can as traditional technology, increase by one in the step of metal pattern layer printing solder mask.
Fig. 2 shows the schematic diagram that adopts the printed substrate that the above-mentioned manufacture method of the present invention obtains.This printed substrate comprises a substrate 2 and the metal pattern layer 4 that is positioned on the substrate 2.Substrate 2 has adopted ceramic material, and metal pattern layer 4 has adopted above-mentioned technique, fires by the metal slurry to be formed on the substrate 2.
Claims (16)
1. the manufacture method of a printed substrate comprises the steps:
A, preparation one substrate;
B, use silk-screen printing technique, with conductive pattern sensitization or be printed on the silk screen, form one deck conductive pattern film, the hollow out point of wherein said conductive pattern film or hollow out line are the wire icon of conductive pattern needs;
C, described silk screen is placed on the described substrate;
Sizing process is drawn together in D, employing, and the metal slurry was drawn together described silk screen equably, makes the metal slurry see through described hollow out point or hollow out line, is printed on the described substrate;
E, process carrying out prebake through the described substrate of drawing together sizing process;
G, the described substrate that prebake is processed to process are fired, and make the metal slurry be reduced into metal pattern layer.
2. the manufacture method of printed substrate as claimed in claim 1 is characterized in that, described substrate is ceramic substrate.
3. the manufacture method of printed substrate as claimed in claim 1 or 2 is characterized in that, the described sizing process of drawing together adopts flexibility to draw together cutter to finish.
4. the manufacture method of printed substrate as claimed in claim 1 or 2 is characterized in that, described metal slurry is silver slurry or copper slurry.
5. the manufacture method of printed substrate as claimed in claim 1 or 2 is characterized in that, described firing is to carry out in 600 ℃ to 900 ℃ high temperature furnace.
6. the manufacture method of printed substrate as claimed in claim 1 or 2 is characterized in that, also is included on the described metal pattern layer to print solder mask.
7. the manufacture method of a printed substrate comprises the steps:
A, preparation one substrate;
B, with conductive pattern sensitization or be replicated on the sheet metal, and the wire icon that needs in etching on the described sheet metal or the wire icon that on described sheet metal, needs with laser scoring;
C, described sheet metal is placed on the described substrate;
Sizing process is drawn together in D, employing, and the metal slurry was drawn together described sheet metal equably, makes the metal slurry through the wire icon on the described sheet metal, is printed on the described substrate;
E, process carrying out prebake through the described substrate of drawing together sizing process; And
G, the described substrate that prebake is processed to process are fired, and make the metal slurry be reduced into metal pattern layer.
8. the manufacture method of printed substrate as claimed in claim 7 is characterized in that, described sheet metal is steel plate.
9. the manufacture method of printed substrate as claimed in claim 8 is characterized in that, described substrate is ceramic substrate.
10. such as the manufacture method of claim 7 or 9 described printed substrates, it is characterized in that the described sizing process of drawing together adopts flexibility to draw together cutter to finish.
11. the manufacture method such as claim 7 or 9 described printed substrates is characterized in that, described metal slurry is silver slurry or copper slurry.
12. the manufacture method such as claim 7 or 9 described printed substrates is characterized in that, described firing is to carry out in 600 ℃ to 900 ℃ high temperature furnace.
13. the manufacture method such as claim 7 or 9 described printed substrates is characterized in that, also is included on the described metal pattern layer and prints solder mask.
14. the printed substrate that an employing is made such as method as described in one of claim 1 to 13 comprises:
Substrate adopts ceramic material;
Metal pattern layer, described metal pattern layer are fired by the metal slurry and are formed on the described substrate.
15. printed substrate as claimed in claim 14 is characterized in that, described metal slurry is silver slurry or copper slurry.
16., it is characterized in that described firing is to carry out such as the described printed substrate of claims 14 or 15 in 600 ℃ to 900 ℃ high temperature furnace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101015147A CN103369851A (en) | 2012-04-09 | 2012-04-09 | Printed circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101015147A CN103369851A (en) | 2012-04-09 | 2012-04-09 | Printed circuit board and manufacturing method thereof |
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| CN103369851A true CN103369851A (en) | 2013-10-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012101015147A Pending CN103369851A (en) | 2012-04-09 | 2012-04-09 | Printed circuit board and manufacturing method thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104640344A (en) * | 2015-02-16 | 2015-05-20 | 上海贺鸿电子有限公司 | Copper-plated ceramic circuit board and manufacturing method for same |
| CN104866154A (en) * | 2015-06-10 | 2015-08-26 | 罗延廷 | Silk-screen printing technology for making projection-type capacitance touch screen |
| CN110278653A (en) * | 2018-03-16 | 2019-09-24 | 惠州市超频三全周光智能照明科技有限公司 | Printed circuit board and preparation method thereof |
| WO2020211401A1 (en) * | 2019-04-16 | 2020-10-22 | 珠海中京电子电路有限公司 | Process method for improving color difference of led display screen |
| CN111901980A (en) * | 2020-07-13 | 2020-11-06 | 珠海杰赛科技有限公司 | Method for manufacturing flexible circuit board |
| CN111970845A (en) * | 2019-05-20 | 2020-11-20 | 宁波言成电子科技有限公司 | Preparation method of printed circuit board |
| CN112062607A (en) * | 2020-05-29 | 2020-12-11 | 南京凯泰化学科技有限公司 | Preparation method of copper paste printed circuit board |
| CN112584628A (en) * | 2019-09-27 | 2021-03-30 | 宁波言成电子科技有限公司 | Preparation method of riveted bonding pad printed circuit board |
| CN113427921A (en) * | 2021-06-01 | 2021-09-24 | Tcl华星光电技术有限公司 | Silver paste transfer printing method, Micro-LED transfer printing method and Micro-LED |
| CN114016025A (en) * | 2021-10-29 | 2022-02-08 | 株洲中车时代半导体有限公司 | Metal film transfer method |
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| US20020061388A1 (en) * | 2000-11-20 | 2002-05-23 | Alps Electric Co., Ltd. | Printed circuit board having a pattern of traces formed by screen-printing |
| US20060157085A1 (en) * | 2005-01-18 | 2006-07-20 | International Business Machines Corporation | Screening nest, method of screening wiring layers in a multi-layer ceramic and cleaning the screening mask and mask cleaning station |
| TW201121111A (en) * | 2011-01-21 | 2011-06-16 | Atek Technology Corp | Lighting device and method for forming the same |
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2012
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20020061388A1 (en) * | 2000-11-20 | 2002-05-23 | Alps Electric Co., Ltd. | Printed circuit board having a pattern of traces formed by screen-printing |
| US20060157085A1 (en) * | 2005-01-18 | 2006-07-20 | International Business Machines Corporation | Screening nest, method of screening wiring layers in a multi-layer ceramic and cleaning the screening mask and mask cleaning station |
| TW201121111A (en) * | 2011-01-21 | 2011-06-16 | Atek Technology Corp | Lighting device and method for forming the same |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104640344A (en) * | 2015-02-16 | 2015-05-20 | 上海贺鸿电子有限公司 | Copper-plated ceramic circuit board and manufacturing method for same |
| CN104866154A (en) * | 2015-06-10 | 2015-08-26 | 罗延廷 | Silk-screen printing technology for making projection-type capacitance touch screen |
| CN104866154B (en) * | 2015-06-10 | 2018-06-26 | 罗延廷 | A kind of method for printing screen for making projecting type capacitor touch screen |
| CN110278653A (en) * | 2018-03-16 | 2019-09-24 | 惠州市超频三全周光智能照明科技有限公司 | Printed circuit board and preparation method thereof |
| WO2020211401A1 (en) * | 2019-04-16 | 2020-10-22 | 珠海中京电子电路有限公司 | Process method for improving color difference of led display screen |
| JP2022529267A (en) * | 2019-04-16 | 2022-06-20 | 珠海中京▲電▼子▲電▼路有限公司 | Process method to improve the color difference of LED display |
| CN111970845A (en) * | 2019-05-20 | 2020-11-20 | 宁波言成电子科技有限公司 | Preparation method of printed circuit board |
| CN112584628A (en) * | 2019-09-27 | 2021-03-30 | 宁波言成电子科技有限公司 | Preparation method of riveted bonding pad printed circuit board |
| CN112062607A (en) * | 2020-05-29 | 2020-12-11 | 南京凯泰化学科技有限公司 | Preparation method of copper paste printed circuit board |
| CN111901980A (en) * | 2020-07-13 | 2020-11-06 | 珠海杰赛科技有限公司 | Method for manufacturing flexible circuit board |
| CN113427921A (en) * | 2021-06-01 | 2021-09-24 | Tcl华星光电技术有限公司 | Silver paste transfer printing method, Micro-LED transfer printing method and Micro-LED |
| CN114016025A (en) * | 2021-10-29 | 2022-02-08 | 株洲中车时代半导体有限公司 | Metal film transfer method |
| CN114016025B (en) * | 2021-10-29 | 2024-04-19 | 株洲中车时代半导体有限公司 | Metal film transfer method |
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Application publication date: 20131023 |