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CN103367325A - 具触觉效果的电子元件 - Google Patents

具触觉效果的电子元件 Download PDF

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Publication number
CN103367325A
CN103367325A CN2012100957254A CN201210095725A CN103367325A CN 103367325 A CN103367325 A CN 103367325A CN 2012100957254 A CN2012100957254 A CN 2012100957254A CN 201210095725 A CN201210095725 A CN 201210095725A CN 103367325 A CN103367325 A CN 103367325A
Authority
CN
China
Prior art keywords
electronic component
touch
sense
electronic element
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012100957254A
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English (en)
Inventor
唐兴华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2012100957254A priority Critical patent/CN103367325A/zh
Priority to TW101112687A priority patent/TW201343024A/zh
Priority to US13/629,487 priority patent/US20130258561A1/en
Publication of CN103367325A publication Critical patent/CN103367325A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • User Interface Of Digital Computer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Connecting Device With Holders (AREA)
  • Instructional Devices (AREA)

Abstract

一种电子元件，包括一本体以及至少一触觉可感部件，该至少一触觉可感部件位于本体的侧面，用于在用户手持该电子元件时，供用户触摸而确认电子元件的相对于插槽的方向是否正确。本发明的电子元件，可供用户快速识别出电子元件的摆放方向，节省时间。

Description

具触觉效果的电子元件
技术领域
本发明涉及一种电子元件。
背景技术
目前，电子装置的组装过程中，电路板上不少芯片的插接需要操作员手动插接。通常芯片的引脚与电路板上的插槽只能在一个方向上进行匹配，当芯片反置时，则芯片无法插接入插槽，如果强行插接则会将芯片引脚损坏。因此，操作员在进行芯片插接时，通常需要仔细辨认芯片是否与插槽方向匹配，现有情况下，操作员只能将芯片试探性的插入插槽才能知道芯片是否插反，大大增加了操作员的操作时间。
发明内容
本发明提供一种电子元件，可供用户快速识别出电子元件的摆放方向。
一种电子元件，包括一本体以及至少一触觉可感部件，该至少一触觉可感部件位于本体的侧面。
本发明的电子元件，可供用户快速识别出电子元件的摆放方向，节省时间。
附图说明
图1为本发明第一实施方式中电子元件的外观示意图。
主要元件符号说明
电子元件 1
本体 10
触摸可感部件 20
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，一电子元件1，如一芯片，包括一本体10以及位于该本体10外表面的触觉可感部件20。在本实施方式中，该触觉可感部件20为一个，位于本体10的一个侧面上，用于在用户手持该电子元件1时，供用户触摸而确认电子元件1的相对于插槽的方向是否正确。
具体的，该触觉可感部件20为一凹凸图案，用户通过手指触摸很容易感应到。
该凹凸图案可为凸起形式的电子元件1的商标（Logo），也可为一个凸点，也可以为凸起形式的该电子元件1的的型号、凸起形式的该电子元件1的功能简介文字等。
该触觉可感部件20可位于该本体10的四个侧面的任意一个，从而用户可根据触摸该触觉可感部件20获得电子元件1的摆放方向，从而确认电子元件1相对于插槽的方向是否正确。
在另一实施例中，该触觉可感部件20的个数为两个，位于电子元件1的本体10的相邻的两个侧面，用户在握持该电子元件1时，通过感觉该触觉感应部件20所在的两个侧面确定电子元件1的摆放方向，从而确认电子元件1的相对于插槽的方向是否正确。

Claims (5)

1.一种电子元件，包括一本体，其特征在于，该电子元件还包括至少一触觉可感部件，该至少一触觉可感部件位于本体的侧面。
2.如权利要求1所述的电子元件，其特征在于，该触觉可感部件为凹凸图案。
3.如权利要求1所述的电子元件，其特征在于，该凹凸图案为凸起形式的电子元件的商标、凸点、凸起形式的该电子元件的型号、凸起形式的该电子元件的功能简介文字中的一种。
4.如权利要求1所述的电子元件，其特征在于，该触觉可感部件的个数为一个，位于该本体四个侧面中的任意一个。
5.如权利要求1所述的电子元件，其特征在于，该触觉可感部件的个数为二个，位于本体的相邻的两个侧面。
CN2012100957254A 2012-04-03 2012-04-03 具触觉效果的电子元件 Pending CN103367325A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2012100957254A CN103367325A (zh) 2012-04-03 2012-04-03 具触觉效果的电子元件
TW101112687A TW201343024A (zh) 2012-04-03 2012-04-10 具觸覺效果的電子元件
US13/629,487 US20130258561A1 (en) 2012-04-03 2012-09-27 Electronic component with guiding element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012100957254A CN103367325A (zh) 2012-04-03 2012-04-03 具触觉效果的电子元件

Publications (1)

Publication Number Publication Date
CN103367325A true CN103367325A (zh) 2013-10-23

Family

ID=49234729

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012100957254A Pending CN103367325A (zh) 2012-04-03 2012-04-03 具触觉效果的电子元件

Country Status (3)

Country Link
US (1) US20130258561A1 (zh)
CN (1) CN103367325A (zh)
TW (1) TW201343024A (zh)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5909122A (en) * 1996-12-17 1999-06-01 Chung; Robbie M. K. Integrated circuit package pin marking system
US6121067A (en) * 1998-02-02 2000-09-19 Micron Electronics, Inc. Method for additive de-marking of packaged integrated circuits and resulting packages
US6337122B1 (en) * 2000-01-11 2002-01-08 Micron Technology, Inc. Stereolithographically marked semiconductors devices and methods
KR20070006747A (ko) * 2004-01-21 2007-01-11 엔쏜 인코포레이티드 전자부품의 주석 표면에서 납땜성의 보존과 휘스커 증식의억제 방법
TW200534754A (en) * 2004-04-02 2005-10-16 Benq Corp Printed circuit board and electronic apparatus using the same
US20080061408A1 (en) * 2006-09-08 2008-03-13 National Semiconductor Corporation Integrated circuit package
US20090315159A1 (en) * 2008-06-20 2009-12-24 Donald Charles Abbott Leadframes having both enhanced-adhesion and smooth surfaces and methods to form the same
US20110156033A1 (en) * 2009-12-31 2011-06-30 Stmicroelectronics Asia Pacific Pte. Ltd. Method and system for tracing die at unit level
JP4985810B2 (ja) * 2010-03-23 2012-07-25 サンケン電気株式会社 半導体装置
JP5596456B2 (ja) * 2010-07-23 2014-09-24 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー レーザー加工方法及びその加工方法を用いた半導体装置

Also Published As

Publication number Publication date
US20130258561A1 (en) 2013-10-03
TW201343024A (zh) 2013-10-16

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Application publication date: 20131023