CN103197449B - Frame and liquid crystal module before the mixed type of a kind of plastic cement and metal - Google Patents
Frame and liquid crystal module before the mixed type of a kind of plastic cement and metal Download PDFInfo
- Publication number
- CN103197449B CN103197449B CN201310113617.XA CN201310113617A CN103197449B CN 103197449 B CN103197449 B CN 103197449B CN 201310113617 A CN201310113617 A CN 201310113617A CN 103197449 B CN103197449 B CN 103197449B
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- Prior art keywords
- frame
- liquid crystal
- mixed type
- metalwork
- metal
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 65
- 239000002184 metal Substances 0.000 title claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 28
- 239000004568 cement Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000007769 metal material Substances 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000834 fixative Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 11
- 238000009825 accumulation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
Abstract
It is an object of the invention to provide a kind of low cost, lightweight and there is frame and liquid crystal module before the plastic cement of electrostatic-proof function and the mixed type of metal, before described mixed type, frame is made up of the metalwork of at least one metal material manufacture and the plastic parts connection of at least one plastic material manufacture, front frame at least one chip on film corresponding position uses metalwork, then by conductive component, the backboard of metalwork and conductive material is electrically connected, effectively realize liquid crystal panel Electro-static Driven Comb.The front frame at other positions then uses plastic parts, it is effectively reduced the weight of front frame, thus play the purpose reducing whole LCD product weight, realize LCD product lightweight, before making this mixed type, the usage amount of the metal material of frame also can greatly reduce simultaneously, significantly reduce the cost of manufacture of front frame, solve the technical problem that available liquid crystal module cost of manufacture is higher, weight is bigger.
Description
Technical field
The invention belongs to field of liquid crystal display, particularly relate to frame and liquid crystal before the mixed type of a kind of plastic cement and metal
Module.
Background technology
Liquid crystal module includes backlight module and liquid crystal panel, real by front frame between backlight module and liquid crystal panel
Now fix.Chip on film (Chip On Film is called for short COF) method is for pacifying drive integrated circult (IC)
Being contained on flexible PCB, be packaged with IC chip in COF, IC chip connects with the pin of COF.Such as Fig. 1 institute
Show, to comprise four source electrode COF (Soucre COF) and the liquid crystal of two gate pole COF (Gate COF)
As a example by module, source electrode COF and gate pole COF often lays respectively at upper side edge and the left side of liquid crystal panel 30.
In prior art designs, in order to discharge the electrostatic on liquid crystal panel 30, it is typically all the metal material system of employing
Frame 20 before the integrated metal become, by metal front frame 20 as electrostatic leakage path release electrostatic.Use gold
Before belonging to, frame 20 has the advantages such as size is accurate, intensity preferable, conducts electricity very well；But also result in liquid crystal mould simultaneously
The heavier-weight of group 10, especially in large scale liquid crystal product, the weight of metal front frame 20 is not sneezed at especially,
And the price of metal costly, processing procedure complicated, higher thus cause production cost to compare in material cost
High.In existing LCD product designer trends, product design ultra lightweighting and cost degradation attract most attention.
Use plastic material can be prevented effectively from the defect of metal material, but use pure plastic material to be applied to front frame
Time, owing to the insulation of plastic cement can cause the electrostatic of liquid crystal panel 30 to discharge, along with the accumulation of electrostatic charge,
The IC that electrostatic probably reaches on COF along the COF pin being arranged on liquid crystal panel edge, causes COF
And IC is by damage by static electricity, thus cause module disabler.
Weak point based on frame front in above-mentioned available liquid crystal product, the present invention proposes a kind of plastic cement and metal
Mixed type before frame and liquid crystal module.
Summary of the invention
It is an object of the invention to provide frame and liquid crystal module before the mixed type of a kind of plastic cement and metal, it is intended to subtract
The weight of the liquid crystal module of light existing employing metal front frame, it is achieved the light-weight design of LCD product weight, fall
The cost of low production also solves the problem that plastic rubber front frame causes liquid crystal panel electrostatic to discharge.
To achieve these goals, the present invention provides a kind of low cost, lightweight and have electrostatic-proof function
Frame before the mixed type of plastic cement and metal, for being fixed on liquid crystal module by liquid crystal panel, along liquid crystal panel
Side interval is disposed with the chip on film being electrically connected to each other, and before described mixed type, frame is by least one metal material system
The plastic parts that the metalwork made and at least one plastic material manufacture connects composition, and described metalwork is arranged at layout
There is the position of at least one chip on film.
Preferably, described first component and second component are independent structural member, and before described mixed type, frame is for dividing
Frame before body formula.
Preferably, described first component is formed in one with second component and is connected, and before described mixed type, frame is one
Frame before body formula.
The present invention also provides for a kind of liquid crystal module, including backboard, liquid crystal panel, side along liquid crystal panel
Interval is disposed with the chip on film being electrically connected to each other and the front frame for fixative crystal panel, and described front frame is served as reasons
Metalwork and the plastic parts of at least one plastic material manufacture that at least one metal material manufactures connect the plastic cement formed
And frame before the mixed type of metal, described metalwork is arranged at the position being disposed with at least one chip on film, institute
Stating backboard and use conductive material, connecting between described metalwork and backboard has conductive component, and described metalwork leads to
Cross described conductive component to electrically connect with backboard.
Preferably, described conductive component is metal screws.
Preferably, offering connecting hole before described mixed type on the metalwork of frame, metalwork passes through screw and company
Connect hole to coordinate with backboard reliably electrically connects.
Preferably, described liquid crystal module also includes the glue frame being arranged between described front frame and backboard, corresponding institute
Stating connecting hole glue frame and be provided with through hole, screw is electrically connected with backboard with front frame respectively by through hole.
Preferably, it is further opened with on frame before described mixed type positioning hole.
Beneficial effect: frame and liquid crystal module before the plastic cement of present invention offer and the mixed type of metal, according to reality
Application, the parts being arranged in diverse location use metal or plastic material to make before being combined into described mixed type
Frame, is then electrically connected the backboard of metalwork and conductive material by conductive component, accumulation on liquid crystal panel
Electrostatic can be discharged on backboard by metalwork, has both achieved the Electro-static Driven Comb to liquid crystal panel, can make again
Relatively low with cost and lighter weight plastic cement material makes front frame, is effectively reduced the weight of front frame, thus rises
To the purpose reducing whole LCD product weight, it is achieved the lightweight of LCD product, and reduce further life
Produce cost.
Accompanying drawing explanation
Fig. 1 is the Liquid crystal module front frame structural representation of prior art.
Fig. 2 is liquid crystal module first structural representation of the present invention.
Fig. 3 is liquid crystal module second structural representation of the present invention.
Fig. 4 is the partial sectional view of a-quadrant in Fig. 3.
Fig. 5 is the front mount structure schematic diagram of the embodiment of the present invention 1.
Fig. 6 is the front mount structure schematic diagram of the embodiment of the present invention 2.
Specific embodiment
In order to preferably illustrate technical characterstic and the structure of the present invention, below in conjunction with embodiments of the invention and
Accompanying drawing is described in detail, and wherein, identical label represents identical parts all the time.
Embodiment 1
As shown in Figure 4, the liquid crystal module 10 described in the present embodiment, include the most successively cooperating
Frame 100, glue frame 200 before fixing mixed type, it is held on before described mixed type between frame 100 and glue frame 200
Liquid crystal panel 300 and backboard 400, wherein, backboard 400 uses the conductive materials such as metal.
As shown in Figures 2 to 5, before described mixed type, frame 100 is connected by metalwork 110 and plastic parts 120
Composition, wherein before mixed type, frame 100 only uses at least one metal at the position being disposed with chip on film 310
Part 110, other front frames 100 are the plastic parts 120 using plastic cement material accordingly.Chip on film 310 is along liquid
The upper side edge of crystal panel 300 or left side are arranged, concrete, four source electrode COF (Soucre COF) and
Two gate pole COF (Gate COF) lay respectively at upper side edge and the left side of liquid crystal panel 30.Such as Fig. 2 institute
Showing, because chip on film 310 is electrically connected to each other, before mixed type, frame 100 is only in the upside of liquid crystal panel 300
Limit correspondence is disposed with the position of Source COF and uses a metalwork.Correspondingly, the front frame 100 at other positions
Then without using metalwork 110, use plastic parts 120 to replace metalwork 110 can save substantial amounts of metal and use
Material, the production cost of frame before reducing.Can certainly be as it is shown on figure 3, correspondence be disposed with Source COF's
It is respectively provided with on the left side of the upper side edge of liquid crystal panel 300 and the liquid crystal panel 300 that is disposed with Gate COF
There is a metalwork 110.
Before assembling mixed type, frame 100 is when liquid crystal module 10, offers hole 130, location before mixed type on frame 100,
It is also preferred that the left hole 130, location is positioned on plastic parts 120.To being provided with the liquid crystal module 10 of glue frame 200, glue frame
200 are placed in before mixed type between frame 100 and backboard 400, the most also can arrange in the relevant position of glue frame 200
Location structure (not shown), but should be as limit.Location structure coordinates hole 130, location to frame before mixed type
100 position in liquid crystal module 10, and so that frame before mixed type 100 to be connected to glue frame 200, clamping is solid
Surely liquid crystal panel 300 is lived.Make the later stage more easily frame before mixed type 100 are fixed on liquid crystal module simultaneously
In 10, simplify late stage process, improve production efficiency.Further, conductive component uses metal screws 410,
One end of screw 410 connects frame 100 before mixed type, and the other end connects backboard 400.As shown in Figure 4, assemble
Time mixed type before frame 100 metalwork 110 on offer connecting hole, glue frame 200 is towards frame 100 before mixed type
One side be also provided with corresponding through hole, use screw 410, by connecting hole and the glue frame 200 of metalwork 110
Through hole, be spirally connected with backboard 400.The metalwork 110 of frame 100 and backboard 400 before described mixed type
Between realize reliably electrically connecting by metal screws 410, screw 410 also has frame before mixed type 100 simultaneously
Lock the function in outside at backboard 400, further reinforcement structure intensity together with glue frame 200, be conducive to
Simplify design and the assembling of liquid crystal module 10.
Therefore, before mixed type, frame 100 is connected with each other with liquid crystal panel 300, the metal of frame 100 before mixed type
Part 110 is connected with backboard 400 mutual conduction, and on liquid crystal panel 400, the electrostatic of accumulation will cover by being arranged at
Metalwork 110 at brilliant thin film 310 is discharged into backboard 400, and backboard 400 is again by adapter and external circuit
Connect, effectively liquid crystal panel 300 electrostatic can be realized release, it is to avoid on liquid crystal panel 400, accumulation is quiet
Fax is directed at the pin of chip on film 310, and electrostatic is reached IC and the electronics unit being attached thereto by pin again
Device, it is therefore prevented that under the liquid crystal display device display quality caused owing to the electrostatic of liquid crystal panel cannot discharge
Fall.
It is noted that especially in the present embodiment, as it is shown in figure 5, frame 100 is split before described mixed type
Frame before formula, is designed as independent structural member, the most respectively by gold during production by metalwork 110 and plastic parts 120
Belong to part 110 and plastic parts 120 produces, be the most each assemblied in liquid crystal module 10 connection fixed Combination and become institute
State split type front frame.
Embodiment 2
As shown in Figure 6, it is with the difference of embodiment 1: before mixed type in embodiment 1
Frame is split type front frame, and described in the present embodiment, before mixed type, frame 100 is frame before integral type.By metalwork 110
It is positioned over after producing in plastic mold, uses injecting glue integral forming process, make metalwork 110 and plastic cement
Part 120 forms frame before integral type, the simple in construction of frame 100 before so mixed type, easy for installation, simplifies
Later stage assembling flow path, improves production efficiency.
In sum, apply according to reality, use frame design before mixed type, be arranged in the parts of diverse location
Metal or plastic material is used to make and be combined into frame before described mixed type, i.e. at least one chip on film pair
The front frame answering position uses metalwork, is then electrically connected by the backboard of metalwork and conductive material by conductive component
Connect, effectively realize liquid crystal panel Electro-static Driven Comb.The front frame being positioned at other positions then uses plastic parts, effectively
Alleviate the weight of front frame, thus play the purpose reducing whole LCD product weight, it is achieved LCD product is light
Quantifying, before making this mixed type, the usage amount of the metal material of frame also can greatly reduce simultaneously, significantly reduces
The cost of manufacture of front frame, solves the technical problem that available liquid crystal module cost of manufacture is higher, weight is bigger.
Above content is to combine concrete preferred implementation further description made for the present invention, no
Can assert the present invention be embodied as be confined to these explanations.Common for the technical field of the invention
For technical staff, without departing from the inventive concept of the premise, it is also possible to make some simple deductions or replace
Change, all should be considered as belonging to protection scope of the present invention.
Claims (5)
1. a frame before the mixed type of plastic cement and metal, for liquid crystal panel is fixed on liquid crystal module, along
The side interval of liquid crystal panel is disposed with the chip on film being electrically connected to each other, it is characterised in that described mixed type
Metalwork that front frame is manufactured by least one metal material and the plastic parts connection group that at least one plastic material manufactures
Becoming, described metalwork is arranged at the position being disposed with at least one chip on film；Offer on frame before mixed type
The hole, location positioned frame before mixed type in liquid crystal module, hole, described location is positioned on described plastic parts；
Connect between described metalwork and backboard and have conductive component, described metalwork offers connecting hole, on glue frame
Being provided with corresponding through hole, described conductive component electrically connects through described connecting hole and described through hole with described backboard.
Frame before mixed type the most according to claim 1, it is characterised in that described metalwork and described mould
Glue part is independent structural member, and before described mixed type, frame is split type front frame.
Frame before mixed type the most according to claim 1, it is characterised in that described metalwork is moulded with described
Glue part is formed in one connection, frame before frame is integral type before described mixed type.
4. a liquid crystal module, including backboard, liquid crystal panel, along liquid crystal panel side be spaced be disposed with
The chip on film that is electrically connected to each other and the front frame for fixative crystal panel, it is characterised in that also include arranging
Glue frame between described front frame and backboard, described front frame be by least one metal material manufacture metalwork and
The plastic parts that at least one plastic material manufactures connects frame before the plastic cement of composition and the mixed type of metal, described metal
Part is arranged at the position being disposed with at least one chip on film, and described backboard uses conductive material, described metal
Connect between part and backboard and have conductive component, described metalwork offers connecting hole, corresponding described connecting hole
Glue frame is provided with through hole, in described conductive component is arranged in described connecting hole and described through hole and is electrically connected with backboard
Connect；The hole, location that frame before mixed type is positioned in liquid crystal module is offered on frame before mixed type, described
Hole, location is positioned on described plastic parts.
Liquid crystal module the most according to claim 4, it is characterised in that described conductive component is metal spiral shell
Silk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310113617.XA CN103197449B (en) | 2013-04-02 | 2013-04-02 | Frame and liquid crystal module before the mixed type of a kind of plastic cement and metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310113617.XA CN103197449B (en) | 2013-04-02 | 2013-04-02 | Frame and liquid crystal module before the mixed type of a kind of plastic cement and metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103197449A CN103197449A (en) | 2013-07-10 |
| CN103197449B true CN103197449B (en) | 2016-08-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310113617.XA Expired - Fee Related CN103197449B (en) | 2013-04-02 | 2013-04-02 | Frame and liquid crystal module before the mixed type of a kind of plastic cement and metal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103197449B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105979186A (en) * | 2016-07-01 | 2016-09-28 | 南京熊猫电子股份有限公司 | Source board fixing device and method |
| CN108594526A (en) * | 2018-04-26 | 2018-09-28 | 京东方科技集团股份有限公司 | a kind of backlight source module and display device |
| CN111308758B (en) * | 2020-02-28 | 2023-05-09 | 北京京东方茶谷电子有限公司 | Display device and frame structure thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200993707Y (en) * | 2006-12-27 | 2007-12-19 | 上海广电光电子有限公司 | Liquid crystal module |
| CN101373287A (en) * | 2007-08-24 | 2009-02-25 | 奇美电子股份有限公司 | LCD device |
| JP2009205080A (en) * | 2008-02-29 | 2009-09-10 | Seiko Instruments Inc | Liquid crystal display device |
| CN101739907A (en) * | 2010-01-15 | 2010-06-16 | 友达光电股份有限公司 | Display module and display device using same |
| CN102566106A (en) * | 2012-03-15 | 2012-07-11 | 深圳市华星光电技术有限公司 | Liquid crystal display device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101319592B1 (en) * | 2006-07-31 | 2013-10-16 | 삼성디스플레이 주식회사 | Multi-layer flexible film package and liquid crystal display device having the same |
-
2013
- 2013-04-02 CN CN201310113617.XA patent/CN103197449B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200993707Y (en) * | 2006-12-27 | 2007-12-19 | 上海广电光电子有限公司 | Liquid crystal module |
| CN101373287A (en) * | 2007-08-24 | 2009-02-25 | 奇美电子股份有限公司 | LCD device |
| JP2009205080A (en) * | 2008-02-29 | 2009-09-10 | Seiko Instruments Inc | Liquid crystal display device |
| CN101739907A (en) * | 2010-01-15 | 2010-06-16 | 友达光电股份有限公司 | Display module and display device using same |
| CN102566106A (en) * | 2012-03-15 | 2012-07-11 | 深圳市华星光电技术有限公司 | Liquid crystal display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103197449A (en) | 2013-07-10 |
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