CN103167719B - The wiring method of printed circuit board (PCB), printed circuit board (PCB) and electronic equipment - Google Patents
The wiring method of printed circuit board (PCB), printed circuit board (PCB) and electronic equipment Download PDFInfo
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Abstract
Provide the wiring method of printed circuit board (PCB), printed circuit board (PCB) and electronic equipment.This printed circuit board (PCB) is laminated construction, this laminated construction at least includes multiple signals layer and multiple with reference to stratum, and at least can form the overall laminated construction with reference to stratum/signals layer/reference stratum or the overall laminated construction with reference to stratum/signals layer/signals layer/reference stratum, the wiring method of this printed circuit board (PCB) comprises determining that part is the plurality of with reference to the interval region existed in stratum；Either above or below at described interval region introduces new reference stratum, to form local layer stack structure.By the wiring method of printed circuit board (PCB) according to embodiments of the present invention, printed circuit board (PCB) and electronic equipment, local layer stack structure can be adopted in the printed circuit boards to configure with reference to stratum and signals layer neatly, thus reducing the thickness of printed circuit board (PCB) and size to promote the miniaturization of electronic equipment.
Description
Technical field
The present invention relates to the wiring method of printed circuit board (PCB), printed circuit board (PCB) and electronic equipment.
Background technology
In recent electronic equipment, due to the needs of structural design and outward appearance, host computer system part is likely to be designed to frivolous strip.Fig. 1 is the schematic diagram of a kind of appearance design example of electronic equipment.As it is shown in figure 1, this design greatly have compressed PCB in host computer system (printed circuit board (PCB)) mainboard size planar, in some cases, its width almost only with one name cards width is similar.
And, for this long and narrow type design, significantly limit the flexibility ratio of cabling in signals layer, major part signal possibly even only has the outlet of unique feasible, winding schemes, and in routing procedure, also will inevitably there is the HW High Way problem across different reference plane.
In the folded structure technology of existing PCB, in order to solve the problems referred to above, generally increase the number of plies of PCB main board to increase the signals layer with complete reference plane, and the HW High Way of original mutual conductance is moved to the signals layer with complete reference plane.Or, increasing PCB main board size longitudinally, place power plane segmentation, reference plane split is away from the routing region of HW High Way.But, these methods are by increasing the size of the thickness of PCB main board or length direction, thus increasing manufacturing cost and the manufacturing cycle of PCB main board.
And, in current and future, consumption electronic product all continues to develop towards more frivolous, less direction, and the thickness of PCB main board, area, laminated construction mode will become main restriction.It is therefore desirable to be able to the further thickness reducing printed circuit board (PCB) and size are to promote the miniaturization of electronic equipment.
Summary of the invention
Therefore, the present invention is made for above-mentioned problems of the prior art and demand.
The purpose of the wiring method of the printed circuit board (PCB) of the embodiment of the present invention, printed circuit board (PCB) and electronic equipment is to reduce the thickness of printed circuit board (PCB) and size to promote the miniaturization of electronic equipment.
An aspect according to embodiments of the present invention, provide the wiring method of a kind of printed circuit board (PCB), it is applied in an electronic equipment, described printed circuit board (PCB) is laminated construction, described laminated construction at least includes multiple signals layer and multiple with reference to stratum, described laminated construction at least can form the overall laminated construction with reference to stratum/signals layer/reference stratum or the overall laminated construction with reference to stratum/signals layer/signals layer/reference stratum, it is characterized in that, described method comprises determining that part is the plurality of with reference to the interval region existed in stratum；Either above or below at described interval region introduces new reference stratum, to form local layer stack structure.
In the wiring method of above-mentioned printed circuit board (PCB), the step on the reference stratum that described introducing is new specifically includes: utilize semiconductor fabrication process to form a metal level, is electrically connected with the reference stratum closed on by described metal level.
In the wiring method of above-mentioned printed circuit board (PCB), the described step by described metal level with the reference stratum electric connection closed on specifically includes: the metallic conductor being utilized through multiple through hole is connected described metal level and the described reference stratum closed on.
In the wiring method of above-mentioned printed circuit board (PCB), the step on the reference stratum that described introducing is new specifically includes: need in the interval region of high impedance in described local layer stack structure, introduces new reference stratum in farther away from the reference plane of signals layer.
In the wiring method of above-mentioned printed circuit board (PCB), the described step introducing new reference stratum in farther away from the reference plane of signals layer specifically includes: according to the impedance control requirement of described interval region, it is determined that described in distance between reference plane and its former reference plane at place, reference stratum that are newly introduced.
In the wiring method of above-mentioned printed circuit board (PCB), farther include after the step on the reference stratum that described introducing is new: in the reference stratum being newly introduced with the reference plane of the reference plane opposite side that there is interval region, signals layer is set.
In the wiring method of above-mentioned printed circuit board (PCB), according to different local layer stack structures, the width of described holding wire is set to difference, wherein, when two of holding wire both sides with reference to the distance between stratum more big, the width of holding wire is set to more wide.
Another aspect according to embodiments of the present invention, provide a kind of printed circuit board (PCB), it is applied in an electronic equipment, described printed circuit board (PCB) has laminated construction, described laminated construction at least includes multiple signals layer and multiple with reference to stratum, described laminated construction at least can form the overall laminated construction with reference to stratum/signals layer/reference stratum or the overall laminated construction with reference to stratum/signals layer/signals layer/reference stratum, it is characterized in that, described printed circuit board (PCB) includes: local layer stack structure, it is arranged in the plurality of interval region existed with reference to stratum of part, and include the new reference stratum introduced in the either above or below of described interval region.
In above-mentioned printed circuit board (PCB), described local layer stack structure includes: metal level, utilizes semiconductor fabrication process to be formed, and wherein said metal level is electrically connected with the reference stratum closed on.
In above-mentioned printed circuit board (PCB), described local layer stack structure includes: metallic conductor, multiple through holes of its described metal level of traverse；Wherein, described metal level is electrically connected with the described reference stratum closed on by described metallic conductor.
In above-mentioned printed circuit board (PCB), needing in the interval region of high impedance in described local layer stack structure, described new reference stratum is located further away from the reference plane of signals layer.
In above-mentioned printed circuit board (PCB), according to the impedance control requirement of described interval region, it is determined that described in distance between reference plane and its former reference plane at place, reference stratum that are newly introduced.
In above-mentioned printed circuit board (PCB), described local layer stack structure comprises newly-installed signals layer in the reference stratum being newly introduced with the reference plane of the reference plane opposite side that there is interval region.
In above-mentioned printed circuit board (PCB), according to different local layer stack structures, the width of described holding wire is different, and wherein, two of holding wire both sides are more big with reference to the distance between stratum, and the width of holding wire is more wide.
Another aspect according to embodiments of the present invention, it is provided that a kind of electronic equipment, it comprises printed circuit board (PCB) as above.
By the wiring method of printed circuit board (PCB) according to embodiments of the present invention, printed circuit board (PCB) and electronic equipment, local layer stack structure can be adopted in the printed circuit boards to configure with reference to stratum and signals layer neatly, thus reducing the thickness of printed circuit board (PCB) and size to promote the miniaturization of electronic equipment.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic diagram of a kind of appearance design example of electronic equipment；
Fig. 2 is the indicative flowchart of the wiring method illustrating printed circuit board (PCB) according to embodiments of the present invention；
Fig. 3 is the schematic diagram of the existing overall laminated construction that there is interval region；
Fig. 4 is the schematic diagram of the laminated construction design illustrating and eliminating mutual conductance impact in local layer stack structure according to embodiments of the present invention；
Fig. 5 is the schematic diagram of multiple local layer stack structures according to embodiments of the present invention；
Fig. 6 is the schematic diagram of the live width line-spacing for explaining multiple local layer stack structure high speed holding wires according to embodiments of the present invention.
Detailed description of the invention
Below, will be described in detail with reference to accompanying drawings the wiring method of printed circuit board (PCB) according to embodiments of the present invention, printed circuit board (PCB) and electronic equipment.
As mentioned above, in existing solution, if by the number of plies of increase PCB main board to obtain more internal layer routing layer, then the increase of the number of plies of this PCB main board will increase cost, and cause that the production cycle lengthens, additionally, the thickness causing PCB main board is also dramatically increased by the increase of the number of plies of this PCB main board.
In addition, there is also the laminated construction of dual strip line (Dual-StripLine), in this laminated construction, the laminated construction of G/S/S/G is adopted to replace the laminated construction of common G/S/G, can the number of signals layer of pds signal line so that increase.But, under the laminated construction of the identical number of plies, although the laminated construction of many G/S/S/G can increase the number of signal internal layer, but owing to two signals layers are adjacent, it will cause more serious crosstalk (CrossTalk).Therefore, actual walk in line process, it is necessary to make holding wire make corresponding skew, make each signals layer cabling be more limited on the contrary, and the increased number of advantage of signals layer cannot be embodied.Further, due to the crosstalk between above-mentioned two adjacent signals layers so that under G/S/S/G structure, the prepreg (PrePreg) between S/S needs thicker, so that the thickness of PCB main board correspondingly increases in many G/S/S/G laminated construction.Above with in the description of the following embodiment of the present invention, G represents the reference stratum in laminated construction, and S represents the signals layer in laminated construction.
Therefore, The embodiment provides the wiring method of a kind of printed circuit board (PCB), it is applied in an electronic equipment, described printed circuit board (PCB) is laminated construction, described laminated construction at least includes multiple signals layer and multiple with reference to stratum, described laminated construction at least can form the overall laminated construction with reference to stratum/signals layer/reference stratum or the overall laminated construction with reference to stratum/signals layer/signals layer/reference stratum, it is characterized in that, described method comprises determining that part is the plurality of with reference to the interval region existed in stratum；Either above or below at described interval region introduces new reference stratum, to form local layer stack structure.
Fig. 2 is the indicative flowchart of the wiring method illustrating printed circuit board (PCB) according to embodiments of the present invention.As shown in Figure 2, the wiring method of printed circuit board (PCB) according to embodiments of the present invention is applied in an electronic equipment, this printed circuit board (PCB) is laminated construction, and at least include multiple signals layer and multiple with reference to stratum, further, in this laminated construction, the overall laminated construction of G/S/G or the overall laminated construction of G/S/S/G can at least be formed, the method includes: S1, it is determined that part is the plurality of with reference to the interval region existed in stratum；And S2, the either above or below at described interval region introduces new reference stratum, to form local layer stack structure.
Wiring method by printed circuit board (PCB) according to embodiments of the present invention, breach the restriction of overall laminated construction in prior art, thus adopting local layer stack structure to arrange with reference to stratum and signals layer neatly, its area successfully solving PCB main board reduces the contradiction between number of plies increase and thickness increase, and solve the problem routeing mutual conductance in the layout of small size PCB main board, effectively increase the flexibility ratio of signal line topology, thus promoting the reduction of PCB main board area further.
In the wiring method of above-mentioned printed circuit board (PCB) according to embodiments of the present invention, eliminate the concept of overall laminated construction in existing printed circuit board (PCB), thus a certain plane not integrally being defined to reference to formation plane or signals layer plane, and be based on and be originally likely to be not belonging to the reference plane with reference to stratum with reference to the interval region existed in stratum, such as, introduce new reference stratum in the reference plane of original signal layer, so, just can the location arrangements holding wire of holding wire originally can not be arranged, thus increasing the utilization rate of internal layer signal lead.
In the wiring method of printed circuit board (PCB) according to embodiments of the present invention, unfixing reference stratum and the definition of signals layer, namely, each layer for the PCB main board of such as prior art, as required, local in the reference plane on stratum can be examined in Radix Scrophulariae and holding wire internal layer is set, and new reference stratum can also be locally set in the reference plane at original signal layer place, thus at any particular location of PCB main board, can design and produce the local layer stack structure of similar G/S/G or G/S/S/G, and the overall laminated construction being not limited in existing PCB main board G/S/G or G/S/S/G.
So, when there is interval region in reference stratum, in there is mutual conductance in G/S/G or G/S/S/G laminated construction or needing the interval region of high impedance, new reference stratum can be introduced, thus solving the problem that cannot be carried out HW High Way cabling in region corresponding with this interval region brought by above-mentioned interval region in the either above or below of this interval region.
In the wiring method of printed circuit board (PCB) according to embodiments of the present invention, the step on the reference stratum that described introducing is new specifically includes: utilize semiconductor fabrication process to form a metal level, is electrically connected with the reference stratum closed on by described metal level.
In the wiring method of printed circuit board (PCB) according to embodiments of the present invention, the described step by described metal level with the reference stratum electric connection closed on specifically includes: the metallic conductor being utilized through multiple through hole is connected described metal level and the described reference stratum closed on.
Fig. 3 is the schematic diagram of the existing overall laminated construction that there is interval region.As shown in Figure 3, when certain in overall laminated construction is with reference to stratum, such as, when G7 layer as shown in Figure 3 exists interval region (here, this interval region is likely due to mutual conductance problem and produces), in region corresponding with interval region with in the laminated construction of the 6th layer of S6 for the 5th layer of S5 as shown in Figure 3, owing to there is interval region, strictly forbid the holding wire walking high-speed differential signal line and high speed sensitive signal (such as DDR signal) so that the signals layer of HW High Way cannot be arranged.Or, independent low speed signal can only be walked in the above-mentioned region corresponding with interval region, this is lost its meaning as signal internal layer.Further, although it will be understood by those skilled in the art that and being shown without in figure 3, due to the existence of interval region, in region corresponding with interval region in the laminated construction of the 8th layer of S8, the signals layer of HW High Way cannot be arranged equally.
And implement in the middle of process in local layer stack structure according to embodiments of the present invention, new reference stratum can be used as with metal level, and on the reference stratum that there is interval region and the reference stratum being newly introduced, through hole is set, and by the metallic conductor the plurality of through hole of traverse, it is electrically connected with the reference adjacent thereto stratum, reference stratum that will be newly introduced, thus making the reference stratum that there is the vicinity of interval region be revealed as a complete reference stratum together with the reference stratum being newly introduced in electrical characteristics, keep the concordance of reference and the integrity of return flow path.As shown in Figure 4.Fig. 4 is the schematic diagram of the laminated construction design illustrating and eliminating mutual conductance impact in local layer stack structure according to embodiments of the present invention.
Here, it will be appreciated by those skilled in the art that, although in the foregoing description, it is described for metal level and metallic conductor, here the reference stratum being newly introduced can also be other conductive material, and be electrically connected by the reference stratum of the mode of other conductor with the vicinity that there is interval region, as long as the reference stratum that the reference stratum being newly introduced adjacent thereto can exist interval region is revealed as a complete reference stratum in electrical characteristics, thus keeping the concordance of reference and the integrity of return flow path, embodiments of the invention are not intended to this is carried out any restriction.
In the wiring method of printed circuit board (PCB) according to embodiments of the present invention, the step on the reference stratum that described introducing is new specifically includes: need in the interval region of high impedance in described local layer stack structure, introduces new reference stratum in farther away from the reference plane of signals layer.
In the wiring method of printed circuit board (PCB) according to embodiments of the present invention, the described step introducing new reference stratum in farther away from the reference plane of signals layer specifically includes: according to the impedance control requirement of described interval region, it is determined that described in distance between reference plane and its former reference plane at place, reference stratum that are newly introduced.
Fig. 5 is the schematic diagram of multiple local layer stack structures according to embodiments of the present invention.As shown in the left-hand component of Fig. 5, in the laminated construction of PCB main board, it is understood that there may be need the interval region of high impedance, and in order to realize high impedance, then need to increase adjacent in this region two with reference to the distance between stratum.Therefore, in order to realize high impedance in local layer stack structure, it is necessary to increase two of signals layer both sides of corresponding HW High Way with reference to the distance between stratum.Specifically, this can pass through to introduce in farther away from the reference plane of signals layer new reference stratum, and examine stratum by the such as mode of metallic conductor as above with Radix Scrophulariae and be connected, and realizes high impedance control locally.
Here, owing to the impedance in local layer stack structure is directly proportional with reference to the distance between stratum with adjacent two, therefore, it can, according to impedance control requirement concrete in this local layer stack structure, determine the distance between reference plane and its former reference plane at the place, reference stratum being newly introduced.Such as, in Figure 5, illustrate in the former reference plane S8 adjacent with former reference plane G7, introduce new reference stratum, here, it will be appreciated by those skilled in the art that, if the impedance needed is higher than impedance when as shown in Figure 5, it is also possible in the reference plane farther away from reference plane G7, for instance reference plane G9 or introduce new reference stratum in S10.Or, due in the wiring method at printed circuit board (PCB) according to embodiments of the present invention, can configuration signal layer and with reference to the position on stratum neatly, the position on the reference stratum of signals layer opposite side can also be changed simultaneously, such as, the reference stratum above signals layer as shown in Figure 5 is moved on to the reference plane farther away from signals layer from G reference plane, for instance, in S3, G2 or S1, thus meeting its impedance control requirement.Here, although being shown without in Figure 5, but it will be appreciated by those skilled in the art that, the integrity of concordance and return flow path in order to keep reference in the local layer stack structure of this high impedance, remain a need for the reference stratum being newly introduced and contiguous reference stratum, that is, the reference stratum of the reference stratum in the S8 shown in Fig. 5 and G7 is electrically connected, so that it is revealed as a complete reference stratum in electrical characteristics.Further, this electric connection can be realized by the such as corresponding mode with reference to the through hole on stratum with through the metallic conductor of through hole.
Certainly, here it will be appreciated by those skilled in the art that, need in low-impedance situation in local layer stack structure, the reference stratum being newly introduced can also be moved on to and examine stratum than Radix Scrophulariae and be more nearly the reference plane of signals layer, and the requirement based on impedance control determines which reference plane the reference stratum being newly introduced specifically moves on to, its process is similar with in above-mentioned high impedance situation, just repeats no more here.
In the wiring method of printed circuit board (PCB) according to embodiments of the present invention, farther include after the step on the reference stratum that described introducing is new: in the reference stratum being newly introduced with the reference plane of the reference plane opposite side that there is interval region, signals layer is set.
As shown in Figure 4 and Figure 5, after introducing new reference stratum in the local layer stack structure of printed circuit board (PCB) according to embodiments of the present invention, just can arrange signals layer in the region of the signals layer that originally can not arrange HW High Way as shown in Figure 3, thus adding the region that can walk HW High Way in pcb board, add the motility of signal route.Here, as shown in Figure 4 and Figure 5, when by the cabling scenario of printed circuit board (PCB) according to embodiments of the present invention, after introducing new reference stratum corresponding to the interval region that exists in former reference plane, holding wire is arranged between reference stratum and the reference plane of opposite side being newly introduced.Such as, as shown in Figure 4, after introducing new reference stratum at reference plane S6, signals layer is arranged between reference plane S6 and reference plane G, namely in reference plane S5.And as shown in the mid portion of Fig. 5, after introducing new reference stratum at reference plane S5, signals layer is arranged between reference plane S5 and reference plane S2, namely, can signals layer be arranged in reference plane S3 or in reference plane G, form G/S/G laminated construction, or signals layer being arranged within both reference plane S3 and G to form G/S/S/G laminated construction.
Have been mentioned above, although in figure 3, the region to reference plane G above interval region only is shown as arranging the region of signals layer, but it practice, below this interval region, should also be as the region being to arrange signals layer to the region of reference plane G9.Therefore, after introducing new reference stratum above or below interval region, the integrity of concordance and return flow path owing to achieving reference in reference stratum in this local layer stack structure, it is also possible to arrange signals layer in the reference plane S8 below interval region as shown in Figure 4.Namely, after the reference stratum that to be formed in electrical characteristics complete, the reference stratum that there is the reference stratum of interval region and the new of introducing, just can arranging HW High Way in two that the reference stratum of this new composition is adjacent with reference to the reference plane between stratum, embodiments of the invention are not intended to this is carried out any restriction.
Additionally, in the wiring method of the printed circuit board (PCB) of the embodiment of the present invention, new reference stratum can be introduced according to the position of interval region in reference stratum and shape, so that the position on the reference stratum being newly introduced is corresponding with the position of interval region and shape with shape, thus covering this interval region, the integrity of concordance and return flow path to ensure reference.Such as, if in local layer stack structure as described in Figure 4, this interval region be shaped as a rectangle, the shape on the reference stratum that then this is newly introduced can also be rectangle, and it is more bigger than the area of the rectangular shape of this interval region, make after being connected with the reference stratum that there is interval region by through hole and metallic conductor, it is possible to the interval region being completely covered in this reference stratum to exist.Such benefit is that reference stratum owing to being newly introduced is complete covers the interval region that Radix Scrophulariae is examined in stratum, thus constituting the complete reference stratum in new electrical characteristics with this reference stratum that there is interval region in the scope of whole reference plane, this allows for two the reference stratum can being adjacent on the reference stratum of this new composition, such as, the reference plane between G and G9 in Fig. 4, specifically arbitrarily arrange holding wire in S5 and S8 reference plane, this significantly increases the area in the region that can walk HW High Way in signal internal layer, thus improve the utilization rate to signal internal layer, and extend the motility of the route of PCB main board high speed holding wire.
In addition, the position on reference stratum and the shape that replace making to be newly introduced are completely corresponding with the position of interval region and shape, can also according to the requirement of the cabling of HW High Way, only introduce new reference stratum in the position needing HW High Way, so that the reference stratum being newly introduced is only capable of covering a part for interval region.Such as, when the reference plane S5 above interval region as shown in Figure 4 only needs wall scroll HW High Way, just need not introduce the new reference stratum that can cover whole interval region, and only need to introduce the reference stratum of the bar shaped corresponding with this single signal line.So, by the two ends on the reference stratum of this bar shaped being newly introduced and the reference stratum that there is interval region are electrically connected, can ensure that the integrity for the concordance of reference this single signal line and return flow path, without the greater area of reference stratum being newly introduced.Therefore, if according to the needs of signal lead specifically arrange position and the shape on the reference stratum being newly introduced, then the motility of the wiring method of printed circuit board (PCB) according to embodiments of the present invention can be increased further.
In sum, in order to solve the PCB main board of electronic equipment under the planar dimension of the limit, overall laminated construction due to existing PCB main board, the such as mutual conductance that the HW High Way that thickness of slab restriction causes runs into when signal internal layer cabling is (across reference layer, power plane split) problem, the wiring method of printed circuit board (PCB) according to embodiments of the present invention forms complete reference current loop by introducing new reference stratum above and below interval region, thus the problem solving to arrange the signals layer of HW High Way in the region above and below interval region and between adjacent reference stratum.
The local layer stack structure of this PCB main board can solve the mutual conductance problem existed in G/S/G and G/S/S/G laminated construction well, the problem of implementation of high impedance under ultra-thin PCB main board thickness can also be solved well, but, when adopting this local layer stack structure, as it is shown in figure 5, multiple local layer stack structure may be there is, therefore, some HW High Ways are likely to the local layer stack structure that meeting is different through many places on whole wiring path
Such as, as shown in Figure 6, when same HW High Way (or a pair differential signal line) path upward wiring from left to right in figure 6, multiple local layer stack structure can be crossed over, thus causing the change of signal impedance, this can cause that the transient impedance on signal lead path is inconsistent and discontinuous, thus causing multiple reflections and the superposition of signal, causes the deterioration of signal quality.Therefore, when adopting local layer stack Conception of Structure Design for HW High Way, it is preferable that the problem also needing to solve the cabling impedance discontinuity that multiple local layer stack structure causes.Here, Fig. 6 is the schematic diagram of the live width line-spacing for explaining multiple local layer stack structure high speed holding wires according to embodiments of the present invention.And, it will be appreciated by those skilled in the art that, although in figure 6 by HW High Way live width line-spacing in three regions (namely, W1/S1/S2, W2/S2/W2 and W3/S3/W3) it is shown as equal, but this is intended merely to the purpose of signal, it practice, should have different live width line-spacings at multiple local layer stack structure high speed holding wires according to embodiments of the present invention.
For the impedance control of printed circuit board (PCB), it is actually the control of wire live width and line-spacing.When laminated construction is certain, the live width of single-ended HW High Way is well-determined, additionally, for Difference signal pair, although and not exclusive determine, but the restriction of the manufacturing process due to PCB main board, have live width and the line-spacing of prioritizing selection.Therefore, under the overall laminated construction of existing PCB main board, the live width of same impedance line and line-spacing with layer are all well-determined.
But, in the wiring method of the printed circuit board (PCB) of the embodiment of the present invention, owing to have employed local layer stack structure, so also correspondingly proposing same impedance line different local layer stack structural sections within the same layer there is the configuration of different live widths, thus meeting the concordance of impedance.
In the wiring method of above-mentioned printed circuit board (PCB) according to embodiments of the present invention, according to different local layer stack structures, the width of described holding wire is set to difference, wherein, when two of holding wire both sides with reference to the distance between stratum more big, the width of holding wire is set to more wide.
Wiring method by this default live width Yu the PCB main board of default local layer stack structure interactive application, it is possible to meet production technology demand, impedance control and local optimum cabling demand.
Below, reference Fig. 6 is specifically described the live width line-spacing that same HW High Way should have in different local layer stack structures.As shown in Figure 6, in reference plane S5, the high speed signal of example is when multiple local layer stack structure cabling, and they also should different (W is live width, S be line-spacing in Difference signal pair) at the live width line-spacing of different local layer stack structural sections.
Based on described above, when two of holding wire both sides with reference to the distance between stratum more big when, the width of holding wire should be configured to more wide, in the example depicted in fig. 6, left area due to the holding wire process in reference plane S5, in zone line and rear edge regions, distance between the reference stratum of its both sides meets the relation of right area > left area > zone line, therefore, the live width of this holding wire also should meet the relation of right area > left area > zone line.
Specifically, line segment is walked for the high speed signal in left area, can according to the making technology requirement of resistance requirements and pcb board factory, calculate and select the live width line-spacing of this local layer stack structure according to G/S/S/G laminated construction, such as, if for 85-ohm differential signal line, then calculating W1/S1/W1 is 3.8/7/3.8mil；High speed signal for zone line walks line segment, according to resistance requirements, calculates the live width line-spacing of this part according to G/S/G laminated construction, and equally for 85-ohm differential signal line, it is 3/6.3/3mil that calculating obtains W2/S2/W2；High speed signal for right area walks line segment, according to resistance requirements, according to G/S/G laminated construction (although similar G/S/G structure herein, but the distance between G/S changes, impedance need to be recalculated) calculate the live width line-spacing of this part, still for above-mentioned 85-ohm differential signal line, it is 5.1/4.6/5.1mil that calculating obtains W3/S3/W3.Based on above-mentioned result of calculation, after the live width line-spacing completing above-mentioned three sections calculates, then line can be covered according to corresponding live width line-spacing at signal lead path place.Further, in the examples described above, in the critical part of each segmentation, owing to the live width line-spacing of signal lead is different, it is possible to carry out processing (that is, the critical part of the critical part of left area and zone line and zone line and right area) by 135 ° of lead angles.
Here, although it will be understood by those skilled in the art that in the examples described above, it is be described for high-speed differential signal line, but for single-ended HW High Way, is equally applicable, impedance control only for single-ended HW High Way, it is only necessary to consider this parameter of live width.Therefore, for single-ended HW High Way, it is also possible to according to the mode that above-mentioned differential signal line is similar, calculate in the different live width of each local layer stack structure end.Here, its live width meets two of holding wire both sides with reference to the more wide condition of the width of the more big then holding wire of distance between stratum.
Based on described above, wiring method for printed circuit board (PCB) according to embodiments of the present invention, for local layer stack structure, abolish the same HW High Way of same layer and only have the restriction of unique live width line-spacing, such that it is able to determine local layer stack structure according to resistance requirements, determine live width and the line-spacing of HW High Way (single-ended or differential pair signal) in local layer stack structure subsequently again.So, solve HW High Way in the impedance concordance of multiple local layer stack structural sections cablings, successional problem, the cabling making HW High Way has bigger flexibility ratio, make local impedance control method can meet production technology process requirement, impedance control requirement etc., thus realizing the design of high impedance signal line under superthin PCB mainboard thickness simultaneously.
As mentioned above, PCB main board for electronic equipment trends towards thin and undersized trend, and existing solution is all that HW High Way shifts to the G/S/G endothecium structure without mutual conductance, causes the signals layer of G/S/S/G structure to waste, and cause the crowded of endothecium structure holding wire, even cannot leave.Therefore, do less and less at current PCB main board, cabling space compressed under more and more limited trend, the overall laminated construction design of existing PCB main board cannot meet needs, it is impossible to take into account the requirement such as cabling space of signal quality, compression simultaneously.
And adopt the wiring method of printed circuit board (PCB) according to embodiments of the present invention, it is possible to effectively for the laminated construction of G/S/S/G dual strip line, solve the mutual conductance that internal layer signals layer produces due to reference plane power supply segmentation etc. and the problem that cannot connect up.By adopting local layer stack structure to replace overall laminated construction, in PCB main board, main devices can at will be put, and reference plane can at will be cut, and cabling can at will be walked, thus significantly reducing the planar dimension of PCB main board.Further, carry out HW High Way cabling owing to existing PCB main board can be maximally utilised, it is not necessary to newly-increased signals layer and with reference to stratum, it is possible to be substantially reduced the thickness of multi-layer PCB mainboard, and reduce the requirement to PCB main board processing procedure of the impedance control of high impedance line.In addition, owing to effectively increasing the utilization rate of internal layer signal lead in laminated construction, can effectively reduce the area of PCB main board, and can suitably by cabling even density, that is, by the original existing overall highly dense region of laminated construction downward cabling, it is optimized by local layer stack structure, segment signal line is moved to the sparse place of cabling, thus improving effective cabling space and the cabling uniformity of whole PCB main board.Further, since in the wiring method of printed circuit board (PCB) according to embodiments of the present invention, signals layer, with reference to stratum will without fixed area every, therefore can replace each other according to local demand, thus meeting the flexible requirements of impedance control and cabling.
Here, the wiring method of printed circuit board (PCB) according to embodiments of the present invention can apply to the layout cabling stage of pcb board, thus solving HW High Way across reference layer the problem that keeps impedance continuity.Additionally, the scheme of the wiring method of printed circuit board (PCB) according to embodiments of the present invention can also be applied to before the layout cabling stage of PCB main board, thus as the important references determining the laminated construction of PCB main board, the number of plies, impedance line structure etc..
Embodiments of the invention additionally provide a kind of printed circuit board (PCB), it is applied in an electronic equipment, described printed circuit board (PCB) has laminated construction, described laminated construction at least includes multiple signals layer and multiple with reference to stratum, described laminated construction at least can form the overall laminated construction with reference to stratum/signals layer/reference stratum or the overall laminated construction with reference to stratum/signals layer/signals layer/reference stratum, it is characterized in that, described printed circuit board (PCB) includes: local layer stack structure, it is arranged in the plurality of interval region existed with reference to stratum of part, and include the new reference stratum introduced in the either above or below of described interval region.
In above-mentioned printed circuit board (PCB), described local layer stack structure includes: metal level, utilizes semiconductor fabrication process to be formed, and wherein said metal level is electrically connected with the reference stratum closed on.
In above-mentioned printed circuit board (PCB), described local layer stack structure includes: metallic conductor, multiple through holes of its described metal level of traverse；Wherein, described metal level is electrically connected with the described reference stratum closed on by described metallic conductor.
In above-mentioned printed circuit board (PCB), needing in the interval region of high impedance in described local layer stack structure, described new reference stratum is located further away from the reference plane of signals layer.
In above-mentioned printed circuit board (PCB), according to the impedance control requirement of described interval region, it is determined that described in distance between reference plane and its former reference plane at place, reference stratum that are newly introduced.
In above-mentioned printed circuit board (PCB), described local layer stack structure comprises newly-installed signals layer in the reference stratum being newly introduced with the reference plane of the reference plane opposite side that there is interval region.
In above-mentioned printed circuit board (PCB), according to different local layer stack structures, the width of described holding wire is different, and wherein, two of holding wire both sides are more big with reference to the distance between stratum, and the width of holding wire is more wide.
In order to realize local layer stack structure in above-mentioned printed circuit board (PCB), first, need to find the interval region with reference in stratum, such as, G/S/S/G structure mutual conductance place, subsequently, there is signal mutual conductance or needing the surface of reference plane on reference stratum of high impedance or underface to introduce new reference stratum, and the reference stratum newly increased and Radix Scrophulariae are examined stratum be electrically connected, such as connected by through hole, thus keeping the concordance of reference and the integrity of return flow path, such as by HW High Way in new reference plane (finally, mutual conductance shielding place) interior cabling covers.
Here, it will be understood by those skilled in the art that and can also be equally applied in this description about printed circuit board (PCB) above with regard to other details described in the wiring method of printed circuit board (PCB) according to embodiments of the present invention, in order to succinctly will not be described in great detail.
In above-mentioned printed circuit board (PCB), breakthrough by laminated construction mode, success solves its area and reduces the contradiction between number of plies increase, thickness increase, solve the printed circuit board (PCB) of dimension limit increases wiring topology effectively by the problem of flexibility ratio, thus promote further in turn printed circuit board (PCB) the area of plane reduce the reduction with thickness.
Additionally, embodiments of the invention additionally provide a kind of electronic equipment, it comprises printed circuit board (PCB) as above.
This electronic equipment all can be equally applied to, therefore herein for succinctly will not be described in great detail above in connection with other details described in the wiring method of printed circuit board (PCB) according to embodiments of the present invention and printed circuit board (PCB).
By the wiring method of printed circuit board (PCB) according to embodiments of the present invention, printed circuit board (PCB) and electronic equipment, local layer stack structure can be adopted in the printed circuit boards to configure with reference to stratum and signals layer neatly, thus reducing the thickness of printed circuit board (PCB) and size to promote the miniaturization of electronic equipment.
The present invention has been described in detail by reference to specific embodiment.It may be evident, however, that when without departing substantially from the spirit of the present invention, embodiment can be performed change and replace by those skilled in the art.In other words, the form that the present invention illustrates is open, rather than explains with being limited.Judge idea of the invention, it is contemplated that appended claim.
Claims (15)
1. the wiring method of a printed circuit board (PCB), it is applied in an electronic equipment, described printed circuit board (PCB) is laminated construction, described laminated construction at least includes multiple signals layer and multiple with reference to stratum, described laminated construction at least can form the overall laminated construction with reference to stratum/signals layer/reference stratum or the overall laminated construction with reference to stratum/signals layer/signals layer/reference stratum, it is characterized in that, described method includes:
Determine that part is the plurality of with reference to the interval region existed in stratum；
Either above or below at described interval region introduces new reference stratum, to form local layer stack structure.
2. the method for claim 1, wherein the step on the reference stratum that described introducing is new specifically includes:
Utilize semiconductor fabrication process to form a metal level, described metal level is electrically connected with the reference stratum closed on.
3. method as claimed in claim 2, wherein, described specifically includes described metal level and the step of reference stratum electric connection closed on:
The metallic conductor being utilized through multiple through hole connects described metal level and the described reference stratum closed on.
4. method any one of in Claim 1-3, wherein, the step on the reference stratum that described introducing is new specifically includes:
Need in the interval region of high impedance in described local layer stack structure, in farther away from the reference plane of signals layer, introduce new reference stratum.
5. method as claimed in claim 4, wherein, the described step introducing new reference stratum in farther away from the reference plane of signals layer specifically includes:
Impedance control requirement according to described interval region, it is determined that the distance between reference plane and its former reference plane at the place, reference stratum being newly introduced.
6. method any one of in Claim 1-3, wherein, farther includes after the step on the reference stratum that described introducing is new:
In the reference stratum being newly introduced with the reference plane of the reference plane opposite side that there is interval region, signals layer is set.
7. method any one of in Claim 1-3, wherein
According to different local layer stack structures, the width of described holding wire is set to difference, wherein, when two of holding wire both sides with reference to the distance between stratum more big, the width of holding wire is set to more wide.
8. a printed circuit board (PCB), it is applied in an electronic equipment, described printed circuit board (PCB) has laminated construction, described laminated construction at least includes multiple signals layer and multiple with reference to stratum, described laminated construction at least can form the overall laminated construction with reference to stratum/signals layer/reference stratum or the overall laminated construction with reference to stratum/signals layer/signals layer/reference stratum, it is characterized in that, described printed circuit board (PCB) includes:
Local layer stack structure, it is arranged in the plurality of interval region existed with reference to stratum of part, and includes the new reference stratum introduced in the either above or below of described interval region.
9. printed circuit board (PCB) as claimed in claim 8, wherein, described local layer stack structure includes:
Metal level, utilizes semiconductor fabrication process to be formed, and wherein said metal level is electrically connected with the reference stratum closed on.
10. printed circuit board (PCB) as claimed in claim 9, wherein, described local layer stack structure includes:
Metallic conductor, multiple through holes of its described metal level of traverse；
Wherein, described metal level is electrically connected with the described reference stratum closed on by described metallic conductor.
11. such as printed circuit board (PCB) any one of in claim 8 to 10, wherein, need in the interval region of high impedance in described local layer stack structure, described new reference stratum is located further away from the reference plane of signals layer.
12. printed circuit board (PCB) as claimed in claim 11, wherein, according to the impedance control requirement of described interval region, it is determined that the distance between reference plane and its former reference plane at the place, reference stratum being newly introduced.
13. such as printed circuit board (PCB) any one of in claim 8 to 10, wherein, described local layer stack structure comprises newly-installed signals layer in the reference stratum being newly introduced with the reference plane of the reference plane opposite side that there is interval region.
14. such as printed circuit board (PCB) any one of in claim 8 to 10, wherein
According to different local layer stack structures, the width of described holding wire is different, and wherein, two of holding wire both sides are more big with reference to the distance between stratum, and the width of holding wire is more wide.
15. an electronic equipment, it comprises such as printed circuit board (PCB) any one of in claim 8 to 14.
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| CN201110427499.0A CN103167719B (en) | 2011-12-19 | 2011-12-19 | The wiring method of printed circuit board (PCB), printed circuit board (PCB) and electronic equipment |
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| CN105205260A (en) * | 2015-09-24 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | Low-cost and anti-interference dual mode stack design method |
| CN106815429B (en) * | 2017-01-16 | 2020-02-07 | 苏州浪潮智能科技有限公司 | Circuit board lamination deployment method and device |
| CN108668433B (en) * | 2017-03-29 | 2019-09-06 | 苏州旭创科技有限公司 | Ultrahigh speed substrate encapsulation structure and optical module |
| CN108196182B (en) * | 2017-12-30 | 2020-04-21 | 大族激光科技产业集团股份有限公司 | Reference network selection method and device for flying probe test |
| CN108566724B (en) * | 2018-06-13 | 2020-12-04 | 晶晨半导体（深圳）有限公司 | Wiring board for DDR memory, printed circuit board, and electronic device |
| CN112867229A (en) * | 2020-12-25 | 2021-05-28 | 广州朗国电子科技有限公司 | Signal routing structure across division gaps and signal impedance optimization method |
| CN114063697B (en) * | 2021-11-15 | 2024-11-01 | 维沃移动通信有限公司 | Temperature drift compensation structure and electronic equipment |
| CN117677029A (en) * | 2022-08-31 | 2024-03-08 | 华为技术有限公司 | Signal transmission structure and manufacturing method |
| CN118475062A (en) * | 2023-11-15 | 2024-08-09 | 荣耀终端有限公司 | Electronic equipment |
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| CN1437436A (en) * | 2002-02-04 | 2003-08-20 | 华为技术有限公司 | Circuit board design method |
| US6937480B2 (en) * | 2001-05-14 | 2005-08-30 | Fuji Xerox Co., Ltd. | Printed wiring board |
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| CN1284835A (en) * | 1999-08-13 | 2001-02-21 | 日本电气株式会社 | Multi-layer printed circuit board |
| US6937480B2 (en) * | 2001-05-14 | 2005-08-30 | Fuji Xerox Co., Ltd. | Printed wiring board |
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