CN103108269B - Speaker module and apply the electronic installation of this speaker module - Google Patents
Speaker module and apply the electronic installation of this speaker module Download PDFInfo
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- CN103108269B CN103108269B CN201310048600.0A CN201310048600A CN103108269B CN 103108269 B CN103108269 B CN 103108269B CN 201310048600 A CN201310048600 A CN 201310048600A CN 103108269 B CN103108269 B CN 103108269B
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- loudspeaker monomer
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Abstract
The invention discloses a kind of speaker module, including peripheral frame and loudspeaker monomer, described peripheral frame is additionally provided with outlet sound mouth, the peripherally located frame facet of outlet sound mouth；Peripheral frame is communicated with speaker module internal and extraneous opening, opening seals with the board within electronic installation and combines, it is spaced structure that peripheral frame, board and described loudspeaker monomer form the front operatic tunes and the rear operatic tunes, the front operatic tunes and the rear operatic tunes.Also disclosing a kind of electronic installation, the inside of electronic installation is provided with and seals, with opening, the board combined.This structure can ensure that the slimming of speaker module is it is also ensured that its acoustical behavior and output, and make use of the space within electronic installation fully, is conducive to the realization of electronic installation slimming.
Description
Technical field
The present invention relates to electroacoustic field, be specifically related to a kind of speaker module and apply the electronic installation of this speaker module.
Background technology
Now, consumer's requirement day by day slimming to portable electron device, the electronic component within electronic installation is slimming increasingly also.Wherein, loudspeaker monomer is as important acoustic element also slimming increasingly, and speaker includes the vibrating diaphragm for radiating sound, and owing to differing 180 degree with the acoustical phase of rear side radiation on front side of vibrating diaphragm, therefore, the front operatic tunes and the rear operatic tunes should be spaced structure.The such as front operatic tunes being directly mounted in electronic installation to produce in order to avoid loudspeaker monomer and the rear operatic tunes cannot the defects at interval etc completely, generally loudspeaker monomer is arranged in a peripheral frame in advance and forms a speaker module, be then installed in electronic installation again.
Yet with the slimming increasingly of electronic installation, the thickness of speaker module is also affected by strict restriction, and the size of loudspeaker monomer is also affected by great restriction simultaneously, thus have impact on acoustical behavior and the output of speaker module.It is additionally the realization being mounted and electrically connected on simple position between speaker module and the electronic installation of traditional structure, it does not have utilize the space within electronic installation fully.Therefore, it is necessary to speaker module and electronic installation to this traditional structure improve, to take into account slimming and the acoustical behavior of product.
Summary of the invention
In order to solve above-mentioned technical problem, the present invention provides a speaker module and uses the electronic installation of this speaker module, it is possible to effectively reduce the height of product, can improve acoustical behavior and the output of product simultaneously.
To achieve these goals, the present invention provides a kind of speaker module, is fixed on the loudspeaker monomer within described peripheral frame including peripheral frame and collecting, described peripheral frame is additionally provided with outlet sound mouth, wherein, described outlet sound mouth is positioned at the side of described peripheral frame；Described peripheral frame includes being positioned at the upper side on the upside of described loudspeaker monomer and is positioned at the downside on the downside of described loudspeaker monomer, the upper side of described peripheral frame and/or downside are communicated with speaker module internal and extraneous opening, described opening seals with the board within electronic installation and combines, it is spaced structure that described peripheral frame, board and described loudspeaker monomer form the front operatic tunes and the rear operatic tunes, the described front operatic tunes and the described rear operatic tunes.
Furthermore it is preferred that scheme be that the upper side of described peripheral frame is provided with opening, described peripheral frame, board and described loudspeaker monomer and forms the described front operatic tunes, and the described front operatic tunes is connected with the described outlet sound mouth of side.
In addition, preferred scheme is, described opening is arranged at just position to described loudspeaker monomer, and described loudspeaker monomer includes just vibrating diaphragm to described opening, and described vibrating diaphragm described opening orthographic projection in the plane be contained in inside described opening.
Furthermore it is preferred that scheme be that described peripheral frame includes being positioned at the upper casing of upper side, mesochite and being positioned at the lower casing of downside；Described opening is arranged on described upper casing just position to described vibrating diaphragm；Described mesochite and described lower casing house fixing described loudspeaker monomer, and described mesochite, lower casing and described loudspeaker monomer form the described rear operatic tunes.
Furthermore it is preferred that scheme be that described loudspeaker monomer also includes magnetic circuit system, described magnetic circuit system includes Magnet and be incorporated into the magnetic conductive board on the downside of described Magnet, and described lower casing is provided with the resettlement section housing described lower magnetic conductive board that material is formed.
Furthermore it is preferred that scheme be that the described rear operatic tunes is arranged at the side of described loudspeaker monomer, the corner of described Magnet is communicated with that described loudspeaker monomer is internal and the perforate of the rear operatic tunes.
A kind of electronic installation, comprises above-mentioned speaker module, and the inside of described electronic installation is provided with board, and described board seals with described opening and combines.
Furthermore it is preferred that scheme be that the upper surface of described board and the described upper casing mode secure bond by gluing, described board covers described opening region and also seals described opening.
Furthermore it is preferred that scheme be between described board and described upper casing, be combined with ring-type foam, described foam is arranged at described upper casing upper surface and described opening adjoining position.
Furthermore it is preferred that scheme be that described board is wiring board or display screen.
Adopting after technique scheme, compared with traditional structure, the speaker module of the present invention only comprises loudspeaker monomer on the direction affect its thickness, thus namely can ensure that the slimming of speaker module it is also ensured that its acoustical behavior and output.Board within electronic installation is incorporated into the opening of speaker module, board and opening seal combination make speaker module can normal operation, make use of the space within electronic installation fully, be conducive to the realization of electronic installation slimming.
Accompanying drawing explanation
By below in conjunction with accompanying drawing, present invention is described, the features described above of the present invention and technological merit will become apparent with easy to understand.
Fig. 1 is the explosive view of speaker module of the present invention.
Fig. 2 is the profile of speaker module shown in Fig. 1.
Fig. 3 is the board perspective view with speaker module of electronic installation of the present invention.
Fig. 4 is the perspective view after board is combined with speaker module.
Fig. 5 is the structural representation of the another embodiment after board is combined with speaker module.
Fig. 6 is the cross-sectional view of structure shown in Fig. 4.
Fig. 7 is the board profile with speaker module of a kind of improvement project.
Fig. 8 is the structure for amplifying schematic diagram of part A shown in Fig. 7.
Fig. 9 is the structural representation of electronic installation of the present invention.
Figure 10 is the A-A cross-sectional view of electronic installation shown in Fig. 9.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is done further detailed description.
As depicted in figs. 1 and 2, speaker module includes peripheral frame and the loudspeaker monomer being contained in peripheral frame, described peripheral frame includes upper casing 11, mesochite 12 and lower casing 13, loudspeaker monomer includes vibrational system and magnetic circuit system, and described loudspeaker monomer secure bond is between mesochite 12 and lower casing 13.The vibrational system of loudspeaker monomer includes vibrating diaphragm 21 and is incorporated into the voice coil loudspeaker voice coil 20 on the downside of vibrating diaphragm 21, and magnetic circuit system includes the washer 22, Magnet 23 and the magnetic conductive board 24 that from top to bottom combine successively.
The present embodiment vibrating diaphragm 21 is incorporated into the upper surface of mesochite 12, surrounded the front operatic tunes of speaker module by upper casing 11, mesochite 12 and loudspeaker monomer on the upside of vibrating diaphragm 21, surrounded the rear operatic tunes of loudspeaker monomer on the downside of vibrating diaphragm 21 by loudspeaker monomer, mesochite 12 and lower casing 13, the front operatic tunes and the rear operatic tunes are spaced structure.For the ease of the slimming of speaker module, lower casing 13 is provided with the resettlement section housing magnetic conductive board 24 that material is formed, and the present embodiment resettlement section is the structure hollowed out, and the shape of resettlement section is corresponding with magnetic conductive board 24.The speaker module of this structure, on the vertical direction affecting speaker module thickness, lower casing 13 is not take up space, thus advantageously reduce the height (thickness) of speaker module, or improve the volume of loudspeaker monomer when speaker module height is certain, thereby may be ensured that the acoustical behavior of product and output.In the present embodiment, the rear operatic tunes is positioned at the side of loudspeaker monomer, Magnet 23 corner openings to connect inside loudspeaker monomer and the rear operatic tunes, the rear operatic tunes height being not take up speaker module vertical direction equally on the side, be conducive to the slimming of product.
Wherein the outlet sound mouth 120 of speaker module is positioned at the side of speaker module, outlet sound mouth 120 is on the side can make the sound of speaker module from the side radiation of electronic installation out, it is positioned at just side to vibrating diaphragm 21 with the outlet sound mouth of traditional structure speaker module, the structure being positioned at electronic installation front or bottom surface is compared, can avoiding owing to the outlet sound mouth caused that keeps flat of electronic installation blocks, therefore practicality is higher.
The position of vibrating diaphragm 21 is just being provided with the opening 110 that cavate connection loudspeaker monomer is internal with extraneous by upper casing 11 of the present invention, the area of opening 110 is more than the area of vibrating diaphragm 21, and can comprise vibrating diaphragm 21 opening 110 orthographic projection in the plane, to prevent from vibrating diaphragm 21 vibration processes collides with upper casing 11.The structure of this set opening 110, be conducive to increasing the size of loudspeaker monomer, more precisely, it is possible to space is dodged in the vibration offer for vibrating diaphragm 21, this structure can ensure that the size of loudspeaker monomer when the thickness of speaker module is less, it is ensured that the acoustical behavior of product.Additionally, opening is not limited to this structure arranged on upper casing 11, it is possibility to have other deformation, for instance, opening can also be the upper end of mesochite 12, and namely speaker module is not provided with upper casing 11, the position at whole upper casing 11 place and the opening of speaker module.
As shown in Figure 3 and Figure 4, the upside of opening 110 is provided with board 3, board 3 is the structure within terminal electronics, board 3 seals with speaker module and combines, thus formed the front operatic tunes of speaker module by the vibrating diaphragm 21 of loudspeaker monomer, mesochite 12, upper casing 11 and board 3, the front operatic tunes is connected with the outlet sound mouth 120 of side.Wherein, board 3 and opening 110 are the structure mutually agreed with, and combine with the sealing both ensureing.
Board 3 is be not provided with perforate or passage etc. to affect the structure of sealing effectiveness corresponding to the position of opening 110, as shown in Figure 5, the position of opening 110 just can not arranging the structure such as perforate or passage to coordinate the application of end product at board 3, through hole in position shown in Fig. 5 or passage do not affect the sealing of board 3 and opening 110.
As shown in Figure 6, board 3 is directly combined to upper casing 11 upper surface by modes such as gluings, and board 3 covers the region at opening 110 place, and seals opening 110.The sound that vibrating diaphragm 21 produces is via being transferred to outside outlet sound mouth 120 of front operatic tunes I of upside.Structure shown in Fig. 7 with the addition of the foam 4 of the sealing of ring-type compared with Fig. 6, as shown in Figure 8, foam 4 is arranged at upper casing 11 upper surface and opening 110 adjoining position, foam 4 is set and can increase the sealing of board 4 and speaker module further, anti-leak-stopping sound, additionally, the oscillation space of vibrating diaphragm 21 also includes the height of foam 4.
Fig. 9 and Figure 10 is the structural representation under speaker module use state in an electronic of the present invention, in figure, electronic installation is for mobile phone, it is only simple signal, as shown in the figure, board 3 is the structure within electronic installation, such as wiring board or display screen etc., opening on speaker module upper casing 11 is sealed the front operatic tunes forming speaker module by board 3, the outlet sound mouth 120 of speaker module side is only simple signal with the shell 5(of electronic installation) on acoustic aperture corresponding, board 3 installs the side of speaker module can install other electronic components 6, as shown in the figure, this mounting means of speaker module does not have the extra space taken within electronic installation.
The speaker module of this structure, the height of speaker module only comprises the height of loudspeaker monomer, the peripheral frame of module and cavity be vacant any space on the vertical direction affect its thickness, and the front operatic tunes and the rear operatic tunes are separated, thus the size of loudspeaker monomer need not be reduced when speaker module is relatively thin, the slimming namely achieving speaker module also ensure that acoustical behavior and the output of speaker module.Equally, the speaker module of this structure seals with board and forms its front operatic tunes, will not increasing the thickness of speaker module and electronic installation, and take full advantage of the space within electronic installation, the slimming namely achieving electronic installation in turn ensure that its acoustical behavior and output.
Under the above-mentioned instruction of the present invention; those skilled in the art can carry out other improvement and deformation on the basis of above-described embodiment; and these improve and deformation; all it is within the scope of the present invention; those skilled in the art should be understood that; above-mentioned specific descriptions simply better explain the purpose of the present invention, and protection scope of the present invention is limited by claim and equivalent thereof.
Claims (8)
1. a speaker module, is fixed on the loudspeaker monomer within described peripheral frame including peripheral frame and collecting, described peripheral frame is additionally provided with outlet sound mouth, it is characterised in that
Described outlet sound mouth is positioned at the side of described peripheral frame；
Described peripheral frame includes being positioned at the upper side on the upside of described loudspeaker monomer and is positioned at the downside on the downside of described loudspeaker monomer；Being communicated with speaker module internal and extraneous opening on the upper side of described peripheral frame, described opening seals with the board within electronic installation and combines；
Described peripheral frame includes being positioned at the upper casing of upper side, mesochite and being positioned at the lower casing of downside；Described opening is arranged on described upper casing just position to the vibrating diaphragm of described loudspeaker monomer；
Described upper casing, board and described loudspeaker monomer form the front operatic tunes, and the described front operatic tunes is connected with the described outlet sound mouth of side；Described peripheral frame forms, with described loudspeaker monomer, the rear operatic tunes closed；The described front operatic tunes and the described rear operatic tunes are spaced structure；
Described loudspeaker monomer includes magnetic circuit system, and described magnetic circuit system includes Magnet and is incorporated into the magnetic conductive board on the downside of described Magnet, and described lower casing is provided with the resettlement section housing described magnetic conductive board that material is formed.
2. speaker module according to claim 1, it is characterized in that, described loudspeaker monomer includes vibrational system, and described vibrational system includes described vibrating diaphragm and voice coil loudspeaker voice coil, and described vibrating diaphragm described opening orthographic projection in the plane be contained in inside described opening.
3. speaker module according to claim 2, it is characterised in that
Described mesochite and described lower casing house fixing described loudspeaker monomer, and described mesochite, lower casing and described loudspeaker monomer form the described rear operatic tunes.
4. speaker module according to claim 1, it is characterised in that the described rear operatic tunes is arranged at the side of described loudspeaker monomer, the corner of described Magnet is communicated with the internal perforate with the rear operatic tunes of described loudspeaker monomer.
5. an electronic installation, it is characterised in that comprise the speaker module described in Claims 1-4 any claim, the inside of described electronic installation is provided with board, and described board seals with described opening and combines.
6. electronic installation according to claim 5, it is characterised in that the upper surface of described board and the described upper casing mode secure bond by gluing, described board covers described opening region and also seals described opening.
7. electronic installation according to claim 5, it is characterised in that be combined with ring-type foam between described board and described upper casing, described foam is arranged at described upper casing upper surface and described opening adjoining position.
8. electronic installation according to claim 5, it is characterised in that described board is wiring board or display screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310048600.0A CN103108269B (en) | 2013-02-07 | 2013-02-07 | Speaker module and apply the electronic installation of this speaker module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310048600.0A CN103108269B (en) | 2013-02-07 | 2013-02-07 | Speaker module and apply the electronic installation of this speaker module |
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| Publication Number | Publication Date |
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| CN103108269A CN103108269A (en) | 2013-05-15 |
| CN103108269B true CN103108269B (en) | 2016-06-29 |
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| CN201310048600.0A Active CN103108269B (en) | 2013-02-07 | 2013-02-07 | Speaker module and apply the electronic installation of this speaker module |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103458326B (en) * | 2013-08-27 | 2017-03-01 | 上海创功通讯技术有限公司 | Horn seal structure and its processing method |
| CN103747398B (en) * | 2013-12-25 | 2017-05-17 | 歌尔股份有限公司 | Loudspeaker module and electronic device comprising the loudspeaker module |
| CN104105038B (en) * | 2014-07-17 | 2017-09-22 | 歌尔股份有限公司 | The assemble method of loudspeaker module and the loudspeaker module |
| CN104602168B (en) * | 2014-12-31 | 2018-01-09 | 宇龙计算机通信科技(深圳)有限公司 | A kind of Microspeaker module and its design method |
| CN104754487B (en) * | 2015-03-23 | 2018-08-03 | 歌尔股份有限公司 | A kind of sound wave filter structure and a kind of side are spoken loud speaker module |
| CN104754454B (en) | 2015-03-25 | 2019-03-26 | 歌尔股份有限公司 | Loudspeaker mould group |
| CN106792398A (en) * | 2017-02-28 | 2017-05-31 | 上海传英信息技术有限公司 | The speaker chamber structure and the loudspeaker with the cavity of a kind of mobile terminal |
| CN107124686B (en) * | 2017-06-29 | 2021-01-08 | 维沃移动通信有限公司 | Loudspeaker, assembling method and electronic equipment |
| CN108289265B (en) * | 2017-12-21 | 2020-10-23 | 瑞声科技(新加坡)有限公司 | Loudspeaker box and processing method thereof |
| CN111246349A (en) * | 2020-03-27 | 2020-06-05 | 歌尔股份有限公司 | Sound generating device single body, sound generating device module and electronic terminal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011035572A (en) * | 2009-07-30 | 2011-02-17 | Sanyo Electric Co Ltd | Electronic device with built-in speaker |
| CN102333263A (en) * | 2011-08-22 | 2012-01-25 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN202634637U (en) * | 2012-04-25 | 2012-12-26 | 深圳天珑移动技术股份有限公司 | Horn assembly and electronic equipment |
| CN203225864U (en) * | 2013-02-07 | 2013-10-02 | 歌尔声学股份有限公司 | Loudspeaker module and electronic device using same |
-
2013
- 2013-02-07 CN CN201310048600.0A patent/CN103108269B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011035572A (en) * | 2009-07-30 | 2011-02-17 | Sanyo Electric Co Ltd | Electronic device with built-in speaker |
| CN102333263A (en) * | 2011-08-22 | 2012-01-25 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN202634637U (en) * | 2012-04-25 | 2012-12-26 | 深圳天珑移动技术股份有限公司 | Horn assembly and electronic equipment |
| CN203225864U (en) * | 2013-02-07 | 2013-10-02 | 歌尔声学股份有限公司 | Loudspeaker module and electronic device using same |
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| CN103108269A (en) | 2013-05-15 |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |