CN102866807B - The touch screen that the manufacture method of a kind of touch screen and employing the method make - Google Patents
The touch screen that the manufacture method of a kind of touch screen and employing the method make Download PDFInfo
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- CN102866807B CN102866807B CN201210362186.6A CN201210362186A CN102866807B CN 102866807 B CN102866807 B CN 102866807B CN 201210362186 A CN201210362186 A CN 201210362186A CN 102866807 B CN102866807 B CN 102866807B
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Abstract
The embodiment of the present invention provides the manufacture method of a kind of touch screen and uses the touch screen of the method making, and described method includes: provide glass plate；Described glass plate is cut into size and meets the substrate of pre-provisioning request；Described substrate is carried out intensive treatment；Detector layer is being made on the described substrate of intensive treatment；Light shield layer is made on the first presumptive area on described detector layer and the region outside the second presumptive area；The first conductive layer is made on the first presumptive area of described detector layer；Making protective layer on the second presumptive area of described detector layer, described protective layer covers light shield layer described in Part I；Making FPC layer, described FPC layer covers described first conductive layer, and described FPC layer is electrically connected with described detector layer by described first conductive layer.Relative to prior art, the touch screen that the manufacture method of the touch screen that the embodiment of the present invention provides and employing the method make is easier to realize.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, the manufacture method being specifically related to a kind of touch screen and the touch screen using the method to make.
Background technology
Along with hand-hold electronic equipments constantly develops to miniaturization and slimming direction, it is desirable to more and more thinner for the touch screen of these hand-hold electronic equipments.In order to meet this requirement, touch screen is generally embedded on glass cover-plate by prior art.The manufacturing process of touch screen substantially uses following steps: first big sheet glass is carried out intensive treatment, then perform the sequence of operations such as light shield layer printing, conductive layer making, photoetching on the glass after intensive treatment, finally this sheet glass-cutting is become little sheet glass.
But, big sheet glass is difficult to processing cutting after intensive treatment, therefore the final step (will large stretch of glass-cutting become the step of little sheet glass) causing above-mentioned manufacturing process is difficult to, and in turn results in that to use the method to make the mode of touch screen relatively difficult to achieve.
Summary of the invention
In view of this, the manufacture method that it is an object of the invention to provide the touch screen of a kind of easy realization and the touch screen using the method to make.
For achieving the above object, one embodiment of the present of invention provides the manufacture method of a kind of touch screen, and described method includes:
Glass plate is provided；
Described glass plate is cut into size and meets the substrate of pre-provisioning request；
Described substrate is carried out intensive treatment；
Detector layer is being made on the described substrate of intensive treatment；
Light shield layer is made on the first presumptive area on described detector layer and the region outside the second presumptive area；
The first conductive layer is made on the first presumptive area of described detector layer；
Making protective layer on the second presumptive area of described detector layer, described protective layer covers light shield layer described in Part I；
Making FPC layer, described FPC layer covers described first conductive layer, and described FPC layer is electrically connected with described detector layer by described first conductive layer.
Preferably, described on the described substrate of intensive treatment make detector layer, including:
The first transparency conducting layer is being formed on the described substrate of intensive treatment；
On described first transparency conducting layer, make detector layer pattern form described detector layer.
Preferably, described on the described substrate of intensive treatment make detector layer, including:
The second transparency conducting layer is being formed on the described substrate of intensive treatment；
Detector bridge pattern is made on described second transparency conducting layer；
Insulating layer pattern is made on described detector bridge pattern；
The 3rd transparency conducting layer is formed on described insulating layer pattern；
On described 3rd transparency conducting layer, make detector layer pattern form described detector layer.
Preferably, the thickness of described first conductive layer is more than or equal to the thickness of described light shield layer.
Preferably, described first conductive layer covers light shield layer described in Part II.
Preferably, described method also includes:
The second conductive layer is made on described first conductive layer, the resistivity of described second conductive layer material therefor is not more than the resistivity of described first conductive layer material therefor, and described FPC layer is electrically connected by described first conductive layer and described second conductive layer with described detector layer.
Preferably, the color of described second conductive layer is identical with the color of described first conductive layer.
Preferably, the color of described first conductive layer is identical with the color of described light shield layer.
It addition, the embodiment of the present invention also provides for a kind of touch screen, described touch screen includes:
Size meets the substrate of pre-provisioning request, and described substrate is through intensive treatment；
Detector layer, is positioned on described substrate；
Light shield layer, is positioned on the region outside the first presumptive area of described detector layer and the second presumptive area；
First conductive layer, is positioned on the first presumptive area of described detector layer；
Protecting film, is positioned on the second presumptive area of described detector layer and covers light shield layer described in Part I；
FPC layer, is covered described first conductive layer, and is electrically connected with described detector layer by described first conductive layer.
Preferably, described detector layer includes:
First transparency conducting layer, is positioned on described substrate；
Detector layer pattern, is formed on described first transparency conducting layer.
Preferably, described detector layer includes:
Second transparency conducting layer, is positioned on described substrate；
Detector bridge pattern, is formed on described second transparency conducting layer；
Insulating layer pattern, is formed on described detector bridge pattern；
3rd transparency conducting layer, is formed on described insulating layer pattern；
And detector layer pattern, it is formed on described 3rd transparency conducting layer.
Preferably, the thickness of described first conductive layer is more than or equal to the thickness of described light shield layer.
Preferably, described first conductive layer covers light shield layer described in Part II.
Preferably, described touch screen also includes:
Second conductive layer, is positioned on described first conductive layer, and described FPC layer covers described second conductive layer；And the resistivity of described second conductive layer material therefor is not more than the resistivity of described first conductive layer material therefor, described FPC layer is electrically connected by described first conductive layer and described second conductive layer with described detector layer.
Preferably, the color of described second conductive layer is identical with the color of described first conductive layer.
Preferably, the color of described light shield layer is identical with the color of described first conductive layer.
The manufacture method embodiments providing a kind of touch screen and the touch screen using the method to make, first glass plate is cut into and meet the substrate that preliminary dimension requires, substrate is carried out intensive treatment, and meet making touch screen on the substrate that preliminary dimension requires at this, use the touch screen that the method makes without cutting further, thus avoid the problem that in traditional handicraft, cutting further to touch screen is difficult to, relative to prior art, the touch screen that the manufacture method of the touch screen that the embodiment of the present invention provides and employing the method make is easier to realize；Meanwhile, the touch screen in the embodiment of the present invention makes light shield layer after making detector layer again, thus avoids and first make light shield layer in traditional handicraft and make the generation of the problems such as light shield layer deformation or fracture that detector layer causes again；Simultaneously; reserved on detector in the embodiment of the present invention it is not blocked the first presumptive area and the second presumptive area that layer covers, and in the first presumptive area and the second presumptive area, makes the first conductive layer and protective layer used electrical connection to realize FPC layer and detector layer respectively and protect detector layer and light shield layer.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, labelling identical in figure represents identical parts, apparently, accompanying drawing in describing below is some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.The part that reference instruction identical in whole accompanying drawings is identical.The most deliberately draw accompanying drawing by actual size equal proportion scaling, it is preferred that emphasis is the purport of the present invention is shown.
Fig. 1 is the flow chart of the manufacture method of the touch screen of the embodiment of the present invention one；
Fig. 2 a ~ 2h is the structural representation in the cross section in each stage of the touch screen of the manufacture method making of the touch screen using the embodiment of the present invention one；
Fig. 3 is the structural representation of another touch screen of the embodiment of the present invention one；
Fig. 4 is the flow chart of the manufacture method of the touch screen of the embodiment of the present invention two；
Fig. 5 a ~ 5i is the structural representation in the cross section in each stage of the touch screen of the manufacture method making of the touch screen using the embodiment of the present invention two；
Fig. 6 is the structural representation of the light shield layer 13 of the touch screen of the embodiment of the present invention two；
Fig. 7 is the flow chart of the manufacture method of the light shield layer 13 shown in Fig. 6；
Reference:
10-glass plate, 11-substrate, the intensive treatment part of 11a-substrate 11; 12-detector layer, 13-light shield layer, 14-the first conductive layer; 15-protective layer, 16-FPC layer, 17-the second conductive layer; the first presumptive area on A-detector layer 12, the second presumptive area on B-detector layer 12,18-the second transparency conducting layer; 19-detector bridge pattern; 20-insulating layer pattern, 21-the 3rd transparency conducting layer, 22-detector layer pattern.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
For the manufacture method providing a kind of touch screen being easier and realizing and the touch screen using the method to make, present inventor is through research, it is proposed that techniques below scheme.
Embodiment one
The embodiment of the present invention one provides the manufacture method of a kind of touch screen, Fig. 1 shows the flow chart of this manufacture method, Fig. 2 a ~ 2f shows the structural representation in each stage using the method making touch screen, and in the lump with reference to Fig. 1 and Fig. 2 a ~ 2f, this manufacture method includes:
Step S101: provide glass plate 10, as shown in Figure 2 a；
Glass plate 10 in the embodiment of the present invention typically requires has higher transparency, relatively low reflectance, preferable heat stability and corrosion resistance, higher mechanical strength and machining characteristics.
Glass plate in the embodiment of the present invention can use the glass that can carry out intensive treatment, as being borosilicate glass, alkali-free aluminosilicate glass or the aluminum silicon material glass etc. without basic ion.
Step S102: glass plate 10 is cut into size and meets the substrate 11 of pre-provisioning request, as shown in Figure 2 b；
Specifically, glass plate 10 can cut into length, width, thickness are satisfied by the substrate 11 of pre-provisioning request, depending on this " pre-provisioning request " can be needed by actual design, such as, the length of substrate 11 can between 20 ~ 500mm, width can between 10 ~ 300mm, thickness can be between 0.3 ~ 2mm, such as thickness can be 0.3mm, 0.5mm, 0.7mm or 2mm etc..
Step S103: substrate 11 is carried out intensive treatment, as shown in Figure 2 c；
Specifically, can use chemical ion exchange method that substrate 11 is carried out intensive treatment, make the strengthening degree of depth of substrate 11 (as Fig. 2 c shows intensive treatment part 11a of substrate 11) between 10 ~ 50 microns, for example, it is possible to substrate 11 is processed 600 minutes at 450 DEG C with potassium nitrate melt liquid；Alternatively, it is also possible to use the physical strengthening method of high temperature fast cooling that substrate 11 is carried out intensive treatment.
In addition, before substrate 11 is carried out intensive treatment, first substrate 11 can also be carried out pretreatment, such as, can use Digit Control Machine Tool CNC bistrique that the profile of substrate 11 is processed, substrate 11 can be punched, edging and/or three-dimensional profile processing etc. process.Those skilled in the art can also require substrate 11 is carried out other kinds of pretreatment according to specific design, does not repeats them here.
Step S104: make detector layer 12 on the substrate 11 after intensive treatment, as shown in Figure 2 d；
Can have graphic structure in detector layer 12, this detector layer 12 can be the transparency conducting layer of monolayer, it is also possible to be the detector of multi-layer rack bridge construction, and the concrete structure of detector layer 12 can be in this no limit depending on design requires.
When the transparency conducting layer that detector layer 12 is monolayer, the thickness of detector layer 12 can be in the range of 10 ~ 200nm；When detector layer 12 uses the detector of multi-layer rack bridge construction, detector layer 12 can be conventional capacitive touch screen structure, can be made up of bridge formation conductive layer, insulating barrier, detector conductive layer etc..
Detector layer 12 in the embodiment of the present invention one can be the transparent conducting structures of monolayer, and now step S104 specifically may comprise steps of (not shown):
Step M: forming the first transparency conducting layer on the substrate 11 of intensive treatment；The method that can use vacuum sputtering coating forms this first transparency conducting layer, first transparency conducting layer can use the materials such as ITO, IZO, if using ITO, then the surface resistance of this first transparency conducting layer can be 10 ~ 200 ohm/mouthful, and light transmittance can be more than more than 80%.
Step N: make detector layer pattern on the first transparency conducting layer and form detector layer 12；This step can operate on special production line, such as can use resist coating, expose, develop, solidify, acid etch, the series of steps such as one chip photoetching make detector layer pattern, step N is referred to conventional process and completes, and does not repeats them here.
Certainly, in the embodiment of the present invention, detector layer 12 can also include other steps.
Step S105: make light shield layer 13 on the first presumptive area A on detector layer 12 and the region outside the second presumptive area B, as shown in Figure 2 e；
Light shield layer 13 can use black matrix", white or other monochromatic light screening materials commonly used in the art, and its thickness can be between 1 ~ 50 micron, and this light shield layer 13 can be with covering the unexpected region of display screen vision area scope.
Specifically, light shield layer 13(can be made as shown in Figure 3) to use the modes such as silk screen printing, intaglio plate letterpress, inkjet printing fixed position directly on detector layer 12, wherein, light shield layer 13 the whole detector layer of non-covered 12, such as light shield layer 13 can not cover the first presumptive area A on detector layer 12 and the second presumptive area B, and only covers the region in addition to the first presumptive area A and the second presumptive area B；
It should be noted that, light shield layer 13 can be single layer structure, its color can be the monochromes such as black, white, blueness, redness, pink colour, yellow, it is also possible to is the polychrome (i.e. light shield layer 13 can be divided into multiple region, and each region uses different colors) that splices and combines of above-mentioned shades of colour；Light shield layer 13 can also be multiple structure, when light shield layer 13 is multiple structure, each Rotating fields can use identical color, such as monochromes such as black, white, blueness, redness, pink colour, yellow, different colors can also be used, those skilled in the art can make the appropriate adjustments according to specific requirement, and this is not limited by the present invention.
Step S106: make the first conductive layer 14 on the first presumptive area A on detector layer 12, as shown in figure 2f；Actually, the thickness of detector layer 12 can be far smaller than the thickness of light shield layer 13, the such as thickness of detector layer 12 can be nanoscale, and the thickness of light shield layer 13 can be micron order, for clarity, in the accompanying drawing of the embodiment of the present invention, the thickness of detector layer 12 and light shield layer 13 is not illustrated by actual ratio.
First conductive layer 14 can use opaque conductive material commonly used in the art to be made, such as opaque metal or metallic compound, the thin film-forming methods such as sputtering, physical vapor deposition (PVD) specifically can be used to make the first conductive layer 14 on the first presumptive area A of detector layer 12, the thickness of this first conductive layer 14 is generally less than the thickness of light shield layer 13, conductive layer 14 thickness is between 10 ~ 500nm, and light shield layer 13 thickness is in 1 ~ 50 micrometer range.
It should be noted that illustrate only the structural representation of the first presumptive area A that the first conductive layer 14 is filled on detector layer 12 in Fig. 2 f, the i.e. first conductive layer 14 does not covers light shield layer 13；Actually, first conductive layer 14 not only can fill the first presumptive area A on detector layer 12, when the height of the first conductive layer 14 is higher than detector layer 12, first conductive layer 14 can be with the light shield layer 13 of covering part, shown in Figure 3, wherein, the first conductive layer 14 covers the size of light shield layer 13 can be depending on design needs, in this no limit, as long as ensure that FPC layer 16 can be electrically connected with detector layer 12 by the first conductive layer 14.
Step S107: making protective layer 15 on the second presumptive area B of detector layer 12, wherein protective layer 15 covers Part I light shield layer 13, as shown in Figure 2 g；
The thickness of protective layer 15 can be in the range of 0.05 ~ 0.2mm, and this protective layer 15 can use the materials as protecting film commonly used in the art such as the PVC film to be made.
Step S108: making FPC layer 16, wherein FPC layer 16 covers the first conductive layer 14, and FPC layer 16 is electrically connected, as shown in fig. 2h with the first conductive layer 14 by anisotropic conducting film (AnisotropicConductiveFilm, ACF).
This FPC layer is that the flexible circuit board that touch screen industry is conventional, typically all surface standard join technology basic electrical component, and bonding drive integrated circult IC.
In addition, the manufacture method of the touch screen in the embodiment of the present invention one is additionally may included on touch screen formation infrared layer, trade mark, anti-fingerprint oil and attaches the steps such as anisotropic conductive film (ACF), in view of these steps are not the emphasis of the present invention, it is not described in detail here.
The embodiment of the present invention one provides the manufacture method of a kind of touch screen and uses the touch screen of the method making, first glass plate is cut into and meet the substrate that preliminary dimension requires, substrate is carried out intensive treatment, and meet making touch screen on the substrate that preliminary dimension requires at this, use the touch screen that the method makes without cutting further, thus avoid the problem that in traditional handicraft, cutting further to touch screen is difficult to, relative to prior art, the touch screen that the manufacture method of the touch screen that the embodiment of the present invention one provides and employing the method make is easier to realize；Meanwhile, the touch screen in the embodiment of the present invention one makes light shield layer after making detector layer again, thus avoids and first make light shield layer in traditional handicraft and make the generation of the problems such as light shield layer deformation or fracture that detector layer causes again；Simultaneously; reserved on detector in the embodiment of the present invention one it is not blocked the first presumptive area and the second presumptive area that layer covers, and in the first presumptive area and the second presumptive area, makes the first conductive layer and protective layer used electrical connection to realize FPC layer and detector layer respectively and protect detector layer and light shield layer.
It should be noted that, Fig. 2 h illustrate only and realizes the structure of FPC layer 16 and light shield layer 13 electrical connection in touch screen and be only the structural representation of the first conductive layer 14, actually, the second conductive layer 17 can also be included on the first conductive layer 14, now, FPC layer 16 and light shield layer 13 can realize electrical connection by the first conductive layer 14 and the second conductive layer 16, as shown in Figure 3.
Additionally, the manufacture method of the touch screen of embodiment of the present invention offer can also include other steps, correspondingly, the embodiment of the present invention also provides for the touch screen of other structures.
Embodiment two
The embodiment of the present invention two provides the manufacture method of a kind of touch screen, Fig. 4 shows the flow chart of this manufacture method, Fig. 5 a ~ 5i shows the structural representation in each stage using the method making touch screen, compared with the embodiment of the present invention one, the detector layer 12 of the touch screen that the embodiment of the present invention two provides is multiple structure.Step S401 ~ step S403 is identical with step S101 in embodiment one ~ step S103, the structural representation of the touch screen in each stage of the making step of step S403 ~ step S403 is shown in that Fig. 5 a ~ 5c(with Fig. 2 a ~ 2c is corresponding), for simplicity, the embodiment of the present invention two only introduces the difference of itself and embodiment one, the corresponding description that may refer to the something in common of embodiment one in embodiment one is known, does not repeats them here.
Step S404: make detector layer 12 on the substrate after intensive treatment, as fig 5d.
The structure of the detector layer 12 in the embodiment of the present invention two as shown in Figure 6, can correspondingly make the flow chart of this detector layer 12 and may refer to Fig. 7.
Seeing Fig. 6 and Fig. 7 in the lump, in the embodiment of the present invention two, step S404 may comprise steps of:
Step S701: forming the second transparency conducting layer 18 on the substrate 11 of intensive treatment；The method that specifically can use vacuum sputtering coating makes this second transparency conducting layer 20 on substrate 11, this second transparency conducting layer 18 can use ITO, IZO etc., if using ITO, then the thickness of this second transparency conducting layer 18 can be 20 ~ 500nm, surface resistance can be 10 ~ 300 ohm/mouthful, and light transmittance can be in the range of 80% ~ 92%；
Step S702: make detector bridge pattern 19 on the second transparency conducting layer 18；Resist coating that this step is referred in traditional handicraft, expose, develop, solidify, acid etch, the series of steps such as one chip photoetching complete, be not described in detail here；
Step S703: make insulating layer pattern 20 on detector bridge pattern 19；Resist coating that this step is referred in traditional handicraft, expose, develop, solidify, acid etch, the series of steps such as one chip photoetching complete, be not described in detail here；
Step S704: form the 3rd transparency conducting layer 21 on insulating layer pattern 20；The method that specifically can use vacuum sputtering coating makes the 3rd transparency conducting layer 21 on insulating layer pattern 20,3rd transparency conducting layer 21 can use ITO, IZO etc., if using ITO, then the surface resistance of the 3rd transparency conducting layer 21 can be 10 ~ 300 ohm/mouthful, and light transmittance can be in the range of 80% ~ 92%；
Step S705: make detector layer pattern 22 on the 3rd transparency conducting layer 21, thus complete the making of detector layer 12；Resist coating that this step is referred in traditional handicraft, expose, develop, solidify, acid etch, the series of steps such as one chip photoetching complete, be not described in detail here.
After completing the making of detector layer 12, then performing subsequent step, wherein step S405 ~ step S406 is similar with step S105 ~ step S106, does not repeats them here.Wherein, the thickness of the first conductive layer 14 in the embodiment of the present invention two is generally less than the thickness of light shield layer 13.
Step S407: make the second conductive layer 17 on the first conductive layer 14, as shown in fig. 5g；
Wherein, the resistivity of the second conductive layer 17 material therefor is not more than the resistivity of the first conductive layer 14 material therefor, and FPC layer 16 is electrically connected by the first conductive layer 14 and the second conductive layer 17 with detector layer 12.
Specifically, the second conductive layer 17 can use identical material with the first conductive layer 14, it would however also be possible to employ the material that the resistivity of resistivity ratio the first conductive layer 14 material therefor is little, it is preferred to use the material that the resistivity of resistivity ratio the first conductive layer 14 material therefor is little；Depending on the thickness of the second conductive layer 17 can require with design, can be less than, equal to or more than the thickness of the first conductive layer 14.Second conductive layer 17 can use the transparent conductive material commonly used in the art such as tin indium oxide (ITO) or indium zinc oxide (IZO) to be made, and the thin film-forming methods such as sputtering, physical vapor deposition (PVD) specifically can be used to make this second conductive layer 17 on the first conductive layer 14.
It addition, the color of the second conductive layer 17 in the embodiment of the present invention two can be identical with the color of the first conductive layer 14, it is also possible to differ with the color of the first conductive layer 14；But the color of the first conductive layer 14 can be identical with the color of light shield layer 13.
Step S408: making protective layer 15 on the second presumptive area B of detector layer 12, wherein protective layer 15 covers Part I light shield layer 13, as shown in figure 5h；
Step S409: making FPC layer 16, wherein FPC layer 16 covers the second conductive layer 17, and FPC layer 16 is electrically connected with detector layer 12, as shown in figure 5i by the first conductive layer 14 and the second conductive layer 17.
The touch screen that the manufacture method of the touch screen of the embodiment of the present invention two and employing the method make, on the first conductive layer, make the second conductive layer that the resistivity of material therefor is not more than the resistivity of the first conductive layer material therefor, the trace resistances of touch screen can be reduced further.
The above is only the preferred embodiment of the present invention; it should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (14)
1. the manufacture method of a touch screen, it is characterised in that described method includes:
Glass plate is provided；
Described glass plate is cut into size and meets the substrate of pre-provisioning request；
Described substrate is carried out intensive treatment；
Detector layer is being made on the described substrate of intensive treatment；
Light shield layer is made on the first presumptive area on described detector layer and the region outside the second presumptive area；
Making the first conductive layer on the first presumptive area of described detector layer, the thickness of described first conductive layer is more than the thickness of described light shield layer；
Making protective layer on the second presumptive area of described detector layer, described protective layer covers light shield layer described in Part I；
Making FPC layer, described FPC layer covers described first conductive layer, and described FPC layer is electrically connected with described detector layer by described first conductive layer.
Manufacture method the most according to claim 1, it is characterised in that described on the described substrate of intensive treatment make detector layer, including:
The first transparency conducting layer is being formed on the described substrate of intensive treatment；
On described first transparency conducting layer, make detector layer pattern form described detector layer.
Manufacture method the most according to claim 1, it is characterised in that described on the described substrate of intensive treatment make detector layer, including:
The second transparency conducting layer is being formed on the described substrate of intensive treatment；
Detector bridge pattern is made on described second transparency conducting layer；
Insulating layer pattern is made on described detector bridge pattern；
The 3rd transparency conducting layer is formed on described insulating layer pattern；
On described 3rd transparency conducting layer, make detector layer pattern form described detector layer.
Manufacture method the most according to claim 1, it is characterised in that described first conductive layer covers light shield layer described in Part II.
Manufacture method the most according to claim 1, it is characterised in that described method also includes:
The second conductive layer is made on described first conductive layer, the resistivity of described second conductive layer material therefor is not more than the resistivity of described first conductive layer material therefor, and described FPC layer is electrically connected by described first conductive layer and described second conductive layer with described detector layer.
Manufacture method the most according to claim 5, it is characterised in that the color of described second conductive layer is identical with the color of described first conductive layer.
7. according to the manufacture method described in any one of claim 1-6, it is characterised in that the color of described first conductive layer is identical with the color of described light shield layer.
8. a touch screen, it is characterised in that described touch screen includes:
Size meets the substrate of pre-provisioning request, and described substrate is through intensive treatment；
Detector layer, is positioned on described substrate；
Light shield layer, is positioned on the region outside the first presumptive area of described detector layer and the second presumptive area；
First conductive layer, is positioned on the first presumptive area of described detector layer, and the thickness of described first conductive layer is more than the thickness of described light shield layer；
Protecting film, is positioned on the second presumptive area of described detector layer and covers light shield layer described in Part I；
FPC layer, is covered described first conductive layer, and is electrically connected with described detector layer by described first conductive layer.
Touch screen the most according to claim 8, it is characterised in that described detector layer includes:
First transparency conducting layer, is positioned on described substrate；
Detector layer pattern, is formed on described first transparency conducting layer.
Touch screen the most according to claim 8, it is characterised in that described detector layer includes:
Second transparency conducting layer, is positioned on described substrate；
Detector bridge pattern, is formed on described second transparency conducting layer；
Insulating layer pattern, is formed on described detector bridge pattern；
3rd transparency conducting layer, is formed on described insulating layer pattern；
And detector layer pattern, it is formed on described 3rd transparency conducting layer.
11. touch screens according to claim 8, it is characterised in that described first conductive layer covers light shield layer described in Part II.
12. touch screens according to claim 8, it is characterised in that described touch screen also includes:
Second conductive layer, is positioned on described first conductive layer, and described FPC layer covers described second conductive layer；And the resistivity of described second conductive layer material therefor is not more than the resistivity of described first conductive layer material therefor, described FPC layer is electrically connected by described first conductive layer and described second conductive layer with described detector layer.
13. touch screens according to claim 12, it is characterised in that the color of described second conductive layer is identical with the color of described first conductive layer.
14. touch screens described in-13 any one according to Claim 8, it is characterised in that the color of described light shield layer is identical with the color of described first conductive layer.
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| CN104123045A (en) * | 2013-04-28 | 2014-10-29 | 北京京东方光电科技有限公司 | Touch screen, liquid-crystal display device and infrared material surface modification method |
| CN108153448A (en) * | 2017-12-26 | 2018-06-12 | 信利光电股份有限公司 | A kind of curved touch screen and preparation method thereof |
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| KR20120032734A (en) * | 2010-09-29 | 2012-04-06 | 삼성모바일디스플레이주식회사 | Touch screen panel and fabricating method thereof |
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