CN102789095A - Solidifying device for sealing frame glue and vacuum folding device - Google Patents
Solidifying device for sealing frame glue and vacuum folding device Download PDFInfo
- Publication number
- CN102789095A CN102789095A CN2012102655225A CN201210265522A CN102789095A CN 102789095 A CN102789095 A CN 102789095A CN 2012102655225 A CN2012102655225 A CN 2012102655225A CN 201210265522 A CN201210265522 A CN 201210265522A CN 102789095 A CN102789095 A CN 102789095A
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- China
- Prior art keywords
- led chip
- frame glue
- envelope frame
- light intensity
- packaging
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a solidifying device for sealing frame glue and a vacuum folding device. A UV (Ultraviolet) LED (Light Emitting Diode) chip is served as an illuminating light source, wherein a luminescence spectrum of the UV LED chip is consistent with an absorbing wavelength of a photoreaction agent in the sealing frame glue. Compared with the present solidifying device for the sealing frame glue which takes a UV mercury lamp as a light source, the solidifying device for the sealing frame glue has the characteristics of small size, less power consumption, long service life, less heat releasing, no requirement for cooling device and concentrated spectrum, due to the UV LED chip being a semiconductor luminescent component. Thus, the solidifying efficiency and the solidifying effect of the sealing frame glue are increased, by solidifying the sealing frame glue by using the UV LED chip as the light source.
Description
Technical field
The present invention relates to liquid crystal display manufacturing technology field, relate in particular to a kind of envelope frame glue solidify device and the involutory equipment of vacuum.
Background technology
At present, the concrete steps of liquid crystal display molding process are: at first, around a substrate, use frame enclosing gum coating apparatus to apply envelope frame glue; Then, use the injection method (ODF, One Drop Fill) that drips to drip liquid crystal in another substrate center; Afterwards, vacuum abutted two substrates promptly carry out box technology; At last; Seal the frame adhesive curing: with ultraviolet light (UV; Ultraviolet Rays) it is partly solidified that short irradiation makes envelope frame glue; Put in the UV curing room photosensitive composition that further solidifies in the envelope frame glue, last in high temperature furnace with uncured envelope frame glue full solidification, thereby the completion molding process.
At present, be used to seal the ultraviolet curing machine of frame adhesive curing in the said process, the ultraviolet of using (UV) light source is extra-high-pressure mercury vapour lamp.Along with the widespread use in the LCD manufacturing industry, traditional use extra-high-pressure mercury vapour lamp exposes following shortcoming as the ultraviolet curing machine of light source:
1, traditional UV mercury vapor lamp is taked high drive, and power consumption is high, and mostly electric power is tens kilowatts, and needs preheating after the start, and the life-span is not long yet, generally will change fluorescent tube in about 1000 hours in work.
2, traditional UV mercury vapor lamp emission wavelength scope is big; Can produce more useless visible light and infrared light, and the absorbing wavelength scope of sealing light reaction agent in the frame glue is as shown in Figure 1 between 300nm-400nm; Therefore, the curing efficiency that the ultraviolet light polymerization that uses mercury vapor lamp to send seals frame glue is lower.And the luminous light intensity in the two ends of UV mercury vapor lamp is generally less than the luminous light intensity of middle part, makes that the UV mercury vapor lamp can not uniformly light-emitting, and this has also influenced the solidification effect of envelope frame glue.
3, can to emit heat big for the useless visible light that sends of traditional U V mercury vapor lamp and infrared light, and the UV mercury vapor lamp needs cooling device, and the cooling device volume is greater than light source itself, and this can increase the cost of envelope frame adhesive curing.In addition, the performance of cooling device also can have influence on the quality of light source luminescent, thereby has influence on the solidification effect of envelope frame glue.
Therefore, in sum, existing use UV mercury vapor lamp is low to the curing efficiency of envelope frame glue as the envelope frame adhesive curing machine of light source, and solidification effect is bad.
Summary of the invention
The embodiment of the invention provides a kind of envelope frame glue solidify device and the involutory equipment of vacuum, in order to improve the curing efficiency and the solidification effect of envelope frame glue.
A kind of envelope frame glue solidify device that the embodiment of the invention provides comprises: base plate for packaging and the ultraviolet light-emitting diodes UV led chip that is arranged on the one side of said base plate for packaging;
Said UV led chip emission wavelength scope is consistent with the absorbing wavelength of light reaction agent in the envelope frame glue.
The involutory equipment of a kind of vacuum that the embodiment of the invention provides comprises the envelope frame glue solidify device that the embodiment of the invention provides.
The beneficial effect of the embodiment of the invention comprises:
A kind of envelope frame glue solidify device that the embodiment of the invention provides and the involutory equipment of vacuum; Use the UV led chip as illuminating source; The luminescent spectrum of this UV led chip is consistent with the absorbing wavelength of light reaction agent in the envelope frame glue; With respect to the envelope frame adhesive curing machine of existing use UV mercury vapor lamp, because the UV led chip is a light emitting semiconductor device, have that volume is little, power consumption is few, the life-span is long, heat release is few, characteristics in no equipment which requires cooling and the spectra collection as light source; Therefore use the UV led chip envelope frame glue to be cured, can improve the curing efficiency and the solidification effect of envelope frame glue as light source.
Description of drawings
Fig. 1 is the abosrption spectrogram of light reaction agent in the envelope frame glue;
The structural representation of the envelope frame glue solidify device that Fig. 2 provides for the embodiment of the invention;
One of synoptic diagram that the UV led chip that Fig. 3 provides for the embodiment of the invention distributes on base plate for packaging;
Two of the synoptic diagram that the UV led chip that Fig. 4 provides for the embodiment of the invention distributes on base plate for packaging;
Three of the synoptic diagram that the UV led chip that Fig. 5 provides for the embodiment of the invention distributes on base plate for packaging;
The structural representation of light intensity control system in the envelope frame glue solidify device that Fig. 6 provides for the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing, the envelope frame glue solidify device that the embodiment of the invention is provided and the embodiment of the involutory equipment of vacuum are at length explained.
The envelope frame glue solidify device that the embodiment of the invention provides, as shown in Figure 2, comprising: the ultraviolet light-emitting diodes UV led chip 2 on base plate for packaging 1 and the one side that is arranged on base plate for packaging;
These UV led chip 2 emission wavelength scopes are consistent with the absorbing wavelength of light reaction agent in the envelope frame glue.
Because the above-mentioned envelope frame glue solidify device that the embodiment of the invention provides; Use the UV led chip as illuminating source; The luminescent spectrum of this UV led chip is consistent with the absorbing wavelength of light reaction agent in the envelope frame glue, with respect to the envelope frame adhesive curing machine of existing use UV mercury vapor lamp as light source, because the UV led chip is a light emitting semiconductor device; Have that volume is little, power consumption is few, the life-span is long, heat release is few, the characteristics in no equipment which requires cooling and the spectra collection; Therefore, use the UV led chip envelope frame glue to be cured, can improve the curing efficiency and the solidification effect of envelope frame glue as light source.
Particularly, as can beappreciated from fig. 1, the absorption spectrum that seals light reaction agent in the frame glue at present is between 300nm-400nm; Therefore, in the specific implementation, the envelope frame glue solidify device that the embodiment of the invention provides can adopt the emission wavelength scope at the UV of 300nm-400nm led chip as light source; Reduce not by the light of other wave band of light reaction agent absorption, improve curing efficiency, reduce cost; Preferably, its luminescence peak can be arranged on about 365nm.
In the specific implementation; The envelope frame glue solidify device that the embodiment of the invention provides can be according to the size of liquid crystal panel; Be prepared into various sizes, and in envelope frame glue solidify device, can be provided with a plurality ofly as the UV led chip of light source, and a plurality of UV led chip is evenly distributed on base plate for packaging.For example: when base plate for packaging 1 is strip, a plurality of UV led chips 2 stripe-arrangement of can on base plate for packaging, growing up, as shown in Figure 3; When base plate for packaging 1 is rectangle when tabular, a plurality of UV led chips 2 can become rectangular arrangement on base plate for packaging, as shown in Figure 4.When base plate for packaging 1 is rectangle when tabular, can also UV led chip 2 be made into one and wholely magnify tabular led board, as shown in Figure 5.At this parameters such as the number of concrete UV led chip and shape are not done concrete qualification.
Further; In order to stablize the luminous light intensity of UV led chip; The envelope frame glue solidify device that the embodiment of the invention provides can also comprise: the light intensity control system, and this light intensity control system is connected with each UV led chip; Be used for its luminous intensity being controlled in the range of light intensity of setting through control UV led chip working current.
Particularly, can be big or small through the working current of following dual mode control UV led chip:
(1) use is provided with resistance: can be through the different transfer resistance of parallel connection at the drive controlling IC of UV led chip pin RSET two ends; Use a DC voltage that the electric current of UV led chip drive IC pin RSET is set; Thereby change the forward working current of UV led chip, reach the effect of regulating UV led chip luminosity.
(2) adopt pulse-length modulation (PWM) technology: the pulse duty factor that changes the drive current of UV led chip with the method for width modulation; The UV led chip is under the brightness adjustment control of PWM; Its luminosity is proportional to the pulse duty factor of PWM, adopts the PWM technology that the UV led chip is regulated and control its light modulation and can reach 3000:1 than scope.
In the specific implementation, this light intensity control system, as shown in Figure 6, can comprise: with the light intensity inductor 3 of UV led chip 2 corresponding settings, the controller 4 that is electrically connected with light intensity inductor 3 and UV led chip 2;
This controller 4 is used for the light intensity sensed according to light intensity inductor 3, the working current of control UV led chip 2.
In the specific implementation, envelope frame glue solidify device can use high-power UV led chip, and so, in order to increase the thermal diffusivity of whole envelope frame glue solidify device, it is base plate for packaging that base plate for packaging can adopt the hard metal with high-cooling property.
Hard metal is that base plate for packaging is to utilize conventional resins substrate or ceramic substrate, gives metallic characters such as high thermal conductivity, processability, electromagnetic shielding property, resistance to sudden heating, constitutes new high-capacity LED base plate for packaging from generation to generation.The high-capacity LED base plate for packaging is to utilize the epoxy resin solid that Copper Foil is pasted the surface at metal base, sees through the combination and variation of metal base and insulation course material, processes the LED base plate for packaging of various uses.High-cooling property is the indispensable fundamental characteristics of high-capacity LED base plate for packaging, and therefore above-mentioned metal is that the LED base plate for packaging uses materials such as aluminium and copper, and insulation course uses the epoxy resin of high thermal conductivity inorganic filler (Filler) mostly.
Therefore, adopting hard metal is the base plate for packaging of base plate for packaging as envelope frame glue solidify device, can significantly reduce the temperature of UV led chip, prolongs its serviceable life.
Further, the envelope frame glue solidify device that the embodiment of the invention provides can also other have the thermal component of heat sinking function, and this thermal component can be positioned at the base plate for packaging one side of UV led chip dorsad.
In the specific implementation; Thermal component is one of following or combination: fans, copper pipe or heat dissipation film; Promptly can increase fans, on base plate for packaging, increase the copper pipe that quickens heat conduction, or on base plate for packaging, paste heat dissipation film quickening heat radiation at the back side of the base plate for packaging that is packaged with the UV led chip.
Preferably, the envelope frame glue solidify device that the embodiment of the invention provides also comprises: be arranged on the outside quartzy outer cover of UV led chip, this quartz outer cover can protect the UV led chip not influenced by extraneous factor, to guarantee the stability of UV led chip work.
Further; The shape of this quartz outer cover can be arc surface; The inner surface of this quartz outer cover can be coated with reflection layer, specifically can adopt silver-plated or other reflecting material, perhaps can the inner increase of quartzy outer cover can adjusting angle reflecting piece and LGP; To change the luminous path of each UV led chip, seal the luminous spot size of frame glue solidify device and the isoparametric purpose of homogeneity of light beam thereby reach control.
Based on same inventive concept, the embodiment of the invention also provides a kind of vacuum involutory equipment, comprises the envelope frame glue solidify device that the embodiment of the invention provides.
On the production line of liquid crystal panel; To seal the frame glue solidify device is applied in the involutory machine of vacuum; Can the production procedure of the involutory machine of traditional vacuum → envelope frame adhesive curing machine → hot setting machine be simplified to: the involutory equipment of vacuum → hot setting machine with envelope frame adhesive curing function; This also helps production line simplifies, and reduces production costs.
And; Carry out involutory technology of vacuum and envelope frame adhesive curing technology simultaneously; Can reduce envelope frame glue greatly and uncured before, contact the possibility that causes liquid crystal and seal the frame glue stain with liquid crystal; Thereby reduced the possibility of bad phenomenon such as disconnected glue of envelope frame glue appearance and bubble, improved the curing quality of envelope frame glue.
Certainly, those skilled in the art can expect that also the envelope frame glue solidify device that the embodiment of the invention is provided is combined in other equipment, repeats no more at this.
A kind of envelope frame glue solidify device that the embodiment of the invention provides and the involutory equipment of vacuum; Use the UV led chip as illuminating source; The luminescent spectrum of this UV led chip is consistent with the absorbing wavelength of light reaction agent in the envelope frame glue; With respect to the envelope frame adhesive curing machine of existing use UV mercury vapor lamp, because the UV led chip is a light emitting semiconductor device, have that volume is little, power consumption is few, the life-span is long, heat release is few, characteristics in no equipment which requires cooling and the spectra collection as light source; Therefore use the UV led chip envelope frame glue to be cured, can improve the curing efficiency and the solidification effect of envelope frame glue as light source.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, belong within the scope of claim of the present invention and equivalent technologies thereof if of the present invention these are revised with modification, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. an envelope frame glue solidify device is characterized in that, comprising: the ultraviolet light-emitting diodes UV led chip on base plate for packaging and the one side that is arranged on said base plate for packaging;
Said UV led chip emission wavelength scope is consistent with the absorbing wavelength of light reaction agent in the envelope frame glue.
2. device as claimed in claim 1 is characterized in that, said UV led chip is a plurality of, and on said base plate for packaging, is evenly distributed.
3. device as claimed in claim 2 is characterized in that, said UV led chip emission wavelength scope is 300-400nm.
4. device as claimed in claim 1 is characterized in that, also comprises: with the light intensity control system that said UV led chip is connected, be used for its luminous intensity being controlled in the range of light intensity of setting through controlling said UV led chip working current.
5. device as claimed in claim 4 is characterized in that, said light intensity control system specifically comprises: with the light intensity inductor of the corresponding setting of said UV led chip, and the controller that is electrically connected with said light intensity inductor and said UVLED chip;
Said controller is used for the light intensity sensed according to said light intensity inductor, controls the working current of said UV led chip.
6. device as claimed in claim 1 is characterized in that, also comprises: thermal component, said thermal component is positioned at the one side of the said dorsad UV led chip of said base plate for packaging.
7. device as claimed in claim 6 is characterized in that, said thermal component is one of following or combination: fans, copper pipe or heat dissipation film.
8. like each described device of claim 1-7, it is characterized in that, also comprise: be arranged on the outside quartzy outer cover of said UV led chip.
9. device as claimed in claim 8 is characterized in that, said quartzy outer cover be shaped as arc surface, the inner surface of said quartzy outer cover is coated with reflection layer.
10. the involutory equipment of vacuum is characterized in that, comprises each described envelope frame glue solidify device like claim 1-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102655225A CN102789095A (en) | 2012-07-27 | 2012-07-27 | Solidifying device for sealing frame glue and vacuum folding device |
| PCT/CN2012/087182 WO2014015632A1 (en) | 2012-07-27 | 2012-12-21 | Frame sealing adhesive curing device and vacuum folding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102655225A CN102789095A (en) | 2012-07-27 | 2012-07-27 | Solidifying device for sealing frame glue and vacuum folding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102789095A true CN102789095A (en) | 2012-11-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102655225A Pending CN102789095A (en) | 2012-07-27 | 2012-07-27 | Solidifying device for sealing frame glue and vacuum folding device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102789095A (en) |
| WO (1) | WO2014015632A1 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014015632A1 (en) * | 2012-07-27 | 2014-01-30 | 京东方科技集团股份有限公司 | Frame sealing adhesive curing device and vacuum folding device |
| CN104021731A (en) * | 2013-03-01 | 2014-09-03 | 群创光电股份有限公司 | Display device |
| WO2014187003A1 (en) * | 2013-05-23 | 2014-11-27 | 深圳市华星光电技术有限公司 | Manufacturing method for liquid crystal display device |
| CN104865753A (en) * | 2015-06-18 | 2015-08-26 | 京东方科技集团股份有限公司 | Vacuum attaching device and display mother board attaching method |
| CN105226141A (en) * | 2014-07-01 | 2016-01-06 | 四川新力光源股份有限公司 | LED technique, encapsulating structure and luminescent device |
| WO2016176874A1 (en) * | 2015-05-07 | 2016-11-10 | 深圳市华星光电技术有限公司 | Frame adhesive curing system, and method for curing frame adhesive therefor |
| CN106200139A (en) * | 2016-09-29 | 2016-12-07 | 京东方科技集团股份有限公司 | Sealant composition, display floater to be solidified, solidification equipment, display floater |
| CN106773164A (en) * | 2016-12-22 | 2017-05-31 | 深圳市华星光电技术有限公司 | A kind of device of LCD frame glues solidification |
| CN114569752A (en) * | 2022-03-09 | 2022-06-03 | 中山市光圣半导体科技有限公司 | Self-monitoring deep ultraviolet LED sterilization module arranged oppositely |
| CN117832363A (en) * | 2024-03-04 | 2024-04-05 | 山东云海国创云计算装备产业创新中心有限公司 | Photoelectrode with light guide function, nerve electrode and preparation method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20180033209A (en) | 2015-07-20 | 2018-04-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Chemical Radiation System for resin-curing |
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| CN102789095A (en) * | 2012-07-27 | 2012-11-21 | 京东方科技集团股份有限公司 | Solidifying device for sealing frame glue and vacuum folding device |
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- 2012-12-21 WO PCT/CN2012/087182 patent/WO2014015632A1/en active Application Filing
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| JP2006235617A (en) * | 2005-01-28 | 2006-09-07 | Shibaura Mechatronics Corp | Ultraviolet-light irradiating device and irradiating method, and substrate manufacturing device and manufacturing method |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014015632A1 (en) * | 2012-07-27 | 2014-01-30 | 京东方科技集团股份有限公司 | Frame sealing adhesive curing device and vacuum folding device |
| CN104021731A (en) * | 2013-03-01 | 2014-09-03 | 群创光电股份有限公司 | Display device |
| WO2014187003A1 (en) * | 2013-05-23 | 2014-11-27 | 深圳市华星光电技术有限公司 | Manufacturing method for liquid crystal display device |
| CN105226141A (en) * | 2014-07-01 | 2016-01-06 | 四川新力光源股份有限公司 | LED technique, encapsulating structure and luminescent device |
| WO2016176874A1 (en) * | 2015-05-07 | 2016-11-10 | 深圳市华星光电技术有限公司 | Frame adhesive curing system, and method for curing frame adhesive therefor |
| CN104865753A (en) * | 2015-06-18 | 2015-08-26 | 京东方科技集团股份有限公司 | Vacuum attaching device and display mother board attaching method |
| CN106200139A (en) * | 2016-09-29 | 2016-12-07 | 京东方科技集团股份有限公司 | Sealant composition, display floater to be solidified, solidification equipment, display floater |
| CN106773164A (en) * | 2016-12-22 | 2017-05-31 | 深圳市华星光电技术有限公司 | A kind of device of LCD frame glues solidification |
| CN114569752A (en) * | 2022-03-09 | 2022-06-03 | 中山市光圣半导体科技有限公司 | Self-monitoring deep ultraviolet LED sterilization module arranged oppositely |
| CN117832363A (en) * | 2024-03-04 | 2024-04-05 | 山东云海国创云计算装备产业创新中心有限公司 | Photoelectrode with light guide function, nerve electrode and preparation method |
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| Publication number | Publication date |
|---|---|
| WO2014015632A1 (en) | 2014-01-30 |
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Application publication date: 20121121 |