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CN102700224A - Method for laminating thin molded laminate flooring by laminating device - Google Patents

Method for laminating thin molded laminate flooring by laminating device Download PDF

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Publication number
CN102700224A
CN102700224A CN2012101706056A CN201210170605A CN102700224A CN 102700224 A CN102700224 A CN 102700224A CN 2012101706056 A CN2012101706056 A CN 2012101706056A CN 201210170605 A CN201210170605 A CN 201210170605A CN 102700224 A CN102700224 A CN 102700224A
Authority
CN
China
Prior art keywords
steel plate
flat plate
consolidated floor
cushion pad
overlays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101706056A
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Chinese (zh)
Inventor
林青
陆勤芳
罗奕强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJIAN HUIYANG FORESTRY INVESTMENT Co Ltd
Original Assignee
FUJIAN HUIYANG FORESTRY INVESTMENT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJIAN HUIYANG FORESTRY INVESTMENT Co Ltd filed Critical FUJIAN HUIYANG FORESTRY INVESTMENT Co Ltd
Priority to CN2012101706056A priority Critical patent/CN102700224A/en
Publication of CN102700224A publication Critical patent/CN102700224A/en
Pending legal-status Critical Current

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Abstract

The invention provides a method for laminating a thin molded laminate flooring by a laminating device. The laminating device is arranged on a hot press; the hot press is provided with an upper hot flat plate and a lower hot flat plate; the laminating device comprises an upper hot flat plate, a first copper net buffering pad, a first silica gel buffering pad, an upper steel plate, a laminate flooring blank, a lower steel plate, a second silica gel buffering pad, a second copper net buffering pad and a lower hot flat plate; and the method comprises the steps of mounting the laminating device, assembling the blank, laminating the blank, and the like. According to the invention, the problem that the thin laminate flooring blank is liable to be cracked in the laminating process is solved; and the method provided by the invention can be used for laminating the thin laminate flooring.

Description

Pressing device overlays the method for slim mold pressing consolidated floor
[technical field]
The present invention is specifically related to the method that a kind of pressing device overlays slim mold pressing consolidated floor.
[background technology]
The pressing device of existing consolidated floor is to be arranged on the hot press, and the method that overlays of existing pressing device is that the consolidated floor base is adopted a precompressed, the method that overlays of second positioning moulding.It is medium density fibre board (MDF) or the high density fiberboard of thickness more than 9mm that this kind method can only overlay thicker; When overlaying thickness and be medium density fibre board (MDF) or the high density fiberboard below the 9mm; The plate bursting phenomenon takes place easily, and it is long to overlay the time, the easy positioning of consolidated floor base when overlaying.
[summary of the invention]
Technical problem to be solved by this invention is to provide a kind of pressing device to overlay the method for slim mold pressing consolidated floor, can be used for overlaying slim consolidated floor, and in overlaying process, the plate bursting problem can not take place.
The present invention solves the problems of the technologies described above through following technical scheme: a kind of pressing device overlays the method for slim mold pressing consolidated floor, and said pressing device is arranged on the hot press, and this hot press has on one flat plate heat and flat plate heat once; Said pressing device comprises last flat plate heat, the first copper mesh cushion pad, the first silica gel cushion pad, upper steel plate, consolidated floor base, lower steel plate, the second silica gel cushion pad, the second copper mesh cushion pad and the following flat plate heat that sets gradually from top to bottom; The said method that overlays slim mold pressing consolidated floor may further comprise the steps:
Step 1: the installation of pressing device: respectively upper steel plate is fixed under the last flat plate heat of hot press, lower steel plate is fixed on the following flat plate heat of hot press; Then between upper steel plate and last flat plate heat, spread the first copper mesh cushion pad, the first silica gel cushion pad successively, between lower steel plate and following flat plate heat, spread the second silica gel cushion pad, the second copper mesh cushion pad successively;
Step 2: assembly: on the platform of mating formation, spread melamine-impregnated abrasion-proof paper, melamine-impregnated facing paper, base material and melamine-impregnated balance paper from top to down successively; Form the consolidated floor base; Then the consolidated floor base is positioned between upper steel plate and the lower steel plate, said base material is medium density fibre board (MDF) or the high density fiberboard of thickness below 9mm;
Step 3: overlay: start hot press, configure and overlay closed hot press after the parameter, treat to pick up counting after hot press is forced into the pressure of setting, wait to reach and open press after the time of overlaying and accomplish and overlay;
The said parameter that overlays is: go up 185 ℃~195 ℃ of flat plate heat temperature, and 200 ℃~210 ℃ of following flat plate heat temperature, pressure 13MPa~18MPa overlays time 30s~35s.
Further; Said medium density fibre board (MDF) or high density fiberboard must satisfy following the requirement: necessary smooth, the no scratch, pollution-free of density>=830g/cm3 plate face; Must be through the processing of scraping of 180 order washed ores, thickness≤9mm, moisture content 4-5%; Internal bond strength>=1.2MPa, thickness swelling rate≤8%.
Further, the lower surface of said upper steel plate is provided with a plurality of model frames that are used for ccontaining consolidated floor base, and the splicing side by side each other of said a plurality of model frame, and whenever this model frame surrounds by four upright steel bars of being located at the upper steel plate lower surface.
Further, the inboard of the upper surface of said lower steel plate is provided with locating unit, and this positioning unit comprises that correspondence is located at first keeper and second keeper of said inboard upper/lower terminal.
Further, the cross section of said first keeper is " 7 " font structure, and the cross section of said second keeper is a rectangle.
Beneficial effect of the present invention is: the invention solves slim consolidated floor base the plate bursting problem takes place in overlaying process easily, can be used for overlaying slim consolidated floor.
[description of drawings]
Combine embodiment that the present invention is done further description with reference to the accompanying drawings.
Fig. 1 is a structural representation of the present invention.
Fig. 2 is the upward view of upper steel plate among the present invention.
Fig. 3 is the structural representation view of lower steel plate among the present invention.
Fig. 4 is the structural representation view of consolidated floor base among the present invention.
[specific embodiment]
See also Fig. 1, a kind of pressing device overlays the method for slim mold pressing consolidated floor, and said pressing device is arranged on the hot press (not shown), and this hot press has on one flat plate heat 1 and flat plate heat 9 once; Said pressing device comprises the last flat plate heat that sets gradually from top to bottom 1, the first copper mesh cushion pad 2, the first silica gel cushion pad 3, upper steel plate 4, consolidated floor base 5, lower steel plate 6, the second silica gel cushion pad 7, the second copper mesh cushion pad 8 and following flat plate heat 9.When pressing device is worked; The said first copper mesh cushion pad 2 and the second copper mesh cushion pad 8 can receive a very big impulsive force respectively; The cause first copper mesh cushion pad 2 and the second copper mesh cushion pad 8 have toughness and can deform, thereby the consolidated floor base 5 that is overlayed is had cushioning effect, have avoided because of the thin plate bursting phenomenon that causes of consolidated floor base 5; In addition, the first copper mesh cushion pad 2 and the second copper mesh cushion pad 8 also have good heat conduction effect, the fast advantage of heat transfer rate.
Please consult Fig. 2 again; The lower surface 41 of said upper steel plate 4 is provided with a plurality of model frames 42 that are used for ccontaining consolidated floor base 5; And the splicing side by side each other of said a plurality of model frame 42, whenever this model frame 42 surrounds by four upright steel bars 421 of being located at upper steel plate 4 lower surfaces 41.The setting of said a plurality of model frames 42, the upper surface of the feasible slim mold pressing consolidated floor of producing has a plurality of grooves to lower recess (not shown), with the slim mold pressing consolidated floor of the fritter that conveniently cuts into a required size.
Please consult Fig. 3 again, the inboard 61 of the upper surface of said lower steel plate 6 is provided with locating unit 62, and this positioning unit 62 comprises that correspondence is located at first keeper 621 and second keeper 622 at said inboard 61 left and right two ends.The cross section of said first keeper 621 is " 7 " font structure, and the cross section of said second keeper 622 is a rectangle.The design of said first keeper 621 and second keeper 622 can effectively be avoided in the problem that overlays 5 positionings of process intensification floor blank.
The said method that overlays slim mold pressing consolidated floor may further comprise the steps:
Step 1: the installation of pressing device: respectively upper steel plate 4 is fixed under the last flat plate heat 1 of hot press, lower steel plate 6 is fixed on the following flat plate heat 9 of hot press; Then between upper steel plate 4 and last flat plate heat 1, spread the first copper mesh cushion pad 2, the first silica gel cushion pad 3 successively, between lower steel plate 6 and following flat plate heat 9, spread the second silica gel cushion pad 7, the second copper mesh cushion pad 8 successively;
Step 2: assembly: on the platform of mating formation, spread melamine-impregnated abrasion-proof paper, melamine-impregnated facing paper, base material and melamine-impregnated balance paper from top to down successively; Form consolidated floor base 5, then consolidated floor base 5 is positioned between upper steel plate 4 and the lower steel plate 6, said base material is medium density fibre board (MDF) or the high density fiberboard of thickness below 9mm; And medium density fibre board (MDF) or high density fiberboard require below must satisfying: necessary smooth, the no scratch, pollution-free of density>=830g/cm3 plate face; Must be through the processing of scraping of 180 order washed ores, thickness≤9mm, moisture content 4-5%; Internal bond strength>=1.2MPa, thickness swelling rate≤8%.;
Step 3: overlay: start hot press, configure and overlay closed hot press after the parameter, treat to pick up counting after hot press is forced into the pressure of setting, wait to reach and open press after the time of overlaying and accomplish and overlay;
The said parameter that overlays is: go up 185 ℃~195 ℃ of flat plate heat 1 temperature, and 200 ℃~210 ℃ of following flat plate heat 9 temperature, pressure 13MPa~18MPa overlays time 30s~35s.
The present invention has reduced cost, has improved production efficiency, has avoided distortion, rebounds, warps, problem such as crack, and it is specious, durable that the back is installed, and long service life; Solve consolidated floor base 5 the plate bursting problem has taken place in overlaying process easily, can be used for overlaying slim consolidated floor.

Claims (5)

1. a pressing device overlays the method for slim mold pressing consolidated floor, and it is characterized in that: said pressing device is arranged on the hot press, and this hot press has on one flat plate heat and flat plate heat once; Said pressing device comprises last flat plate heat, the first copper mesh cushion pad, the first silica gel cushion pad, upper steel plate, consolidated floor base, lower steel plate, the second silica gel cushion pad, the second copper mesh cushion pad and the following flat plate heat that sets gradually from top to bottom; The said method that overlays slim mold pressing consolidated floor may further comprise the steps:
Step 1: the installation of pressing device: respectively upper steel plate is fixed under the last flat plate heat of hot press, lower steel plate is fixed on the following flat plate heat of hot press; Then between upper steel plate and last flat plate heat, spread the first copper mesh cushion pad, the first silica gel cushion pad successively, between lower steel plate and following flat plate heat, spread the second silica gel cushion pad, the second copper mesh cushion pad successively;
Step 2: assembly: on the platform of mating formation, spread melamine-impregnated abrasion-proof paper, melamine-impregnated facing paper, base material and melamine-impregnated balance paper from top to down successively; Form the consolidated floor base; Then the consolidated floor base is positioned between upper steel plate and the lower steel plate, said base material is medium density fibre board (MDF) or the high density fiberboard of thickness below 9mm;
Step 3: overlay: start hot press, configure and overlay closed hot press after the parameter, treat to pick up counting after hot press is forced into the pressure of setting, wait to reach and open press after the time of overlaying and accomplish and overlay;
The said parameter that overlays is: go up 185 ℃~195 ℃ of flat plate heat temperature, and 200 ℃~210 ℃ of following flat plate heat temperature, pressure 13MPa~18MPa overlays time 30s~35s.
2. pressing device as claimed in claim 1 overlays the method for slim mold pressing consolidated floor; It is characterized in that: said medium density fibre board (MDF) or high density fiberboard must satisfy following the requirement: necessary smooth, the no scratch, pollution-free of density>=830g/cm3 plate face; Must be through the processing of scraping of 180 order washed ores, thickness≤9mm, moisture content 4-5%; Internal bond strength>=1.2MPa, thickness swelling rate≤8%.
3. pressing device as claimed in claim 1 overlays the method for slim mold pressing consolidated floor; It is characterized in that: the lower surface of said upper steel plate is provided with a plurality of model frames that are used for ccontaining consolidated floor base; And said a plurality of model frame is splicing side by side each other, and whenever this model frame surrounds by four upright steel bars of being located at the upper steel plate lower surface.
4. pressing device as claimed in claim 1 overlays the method for slim mold pressing consolidated floor; It is characterized in that: the inboard of the upper surface of said lower steel plate is provided with locating unit, and this positioning unit comprises that correspondence is located at first keeper and second keeper of said inboard upper/lower terminal.
5. pressing device as claimed in claim 4 overlays the method for slim mold pressing consolidated floor, it is characterized in that: the cross section of said first keeper is " 7 " font structure, and the cross section of said second keeper is a rectangle.
CN2012101706056A 2012-05-28 2012-05-28 Method for laminating thin molded laminate flooring by laminating device Pending CN102700224A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012101706056A CN102700224A (en) 2012-05-28 2012-05-28 Method for laminating thin molded laminate flooring by laminating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101706056A CN102700224A (en) 2012-05-28 2012-05-28 Method for laminating thin molded laminate flooring by laminating device

Publications (1)

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CN102700224A true CN102700224A (en) 2012-10-03

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102922568A (en) * 2012-12-03 2013-02-13 师宗华海木业有限公司 Method for pasting melamine tissue on board
CN103264428A (en) * 2013-05-16 2013-08-28 福建汇洋林业投资股份有限公司 Production process of low-density light reinforced floor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001074605A2 (en) * 2000-04-03 2001-10-11 Lg Chem Ltd. Abrasion resistant laminate
CN1804337A (en) * 2006-01-20 2006-07-19 孙国范 Wood floor with multilayer impregnated paper structure and its making process
US20070218260A1 (en) * 2004-08-09 2007-09-20 Thierry Miclo Laminate product and method of making same
CN101666150A (en) * 2008-09-01 2010-03-10 吴根水 Pallet board/blank for novel strengthened solid wood multi-layer floor and manufacture method thereof
CN102019739A (en) * 2009-09-10 2011-04-20 福建汇洋林业投资股份有限公司 Method for gluing melamine impregnated paper on glass magnesium board
CN102296781A (en) * 2011-05-27 2011-12-28 苏州凯牌木业有限公司 Impregnated-paper laminated facing material, manufacturing thereof, wood floor faced with material and manufacturing thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001074605A2 (en) * 2000-04-03 2001-10-11 Lg Chem Ltd. Abrasion resistant laminate
US20070218260A1 (en) * 2004-08-09 2007-09-20 Thierry Miclo Laminate product and method of making same
CN1804337A (en) * 2006-01-20 2006-07-19 孙国范 Wood floor with multilayer impregnated paper structure and its making process
CN101666150A (en) * 2008-09-01 2010-03-10 吴根水 Pallet board/blank for novel strengthened solid wood multi-layer floor and manufacture method thereof
CN102019739A (en) * 2009-09-10 2011-04-20 福建汇洋林业投资股份有限公司 Method for gluing melamine impregnated paper on glass magnesium board
CN102296781A (en) * 2011-05-27 2011-12-28 苏州凯牌木业有限公司 Impregnated-paper laminated facing material, manufacturing thereof, wood floor faced with material and manufacturing thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102922568A (en) * 2012-12-03 2013-02-13 师宗华海木业有限公司 Method for pasting melamine tissue on board
CN102922568B (en) * 2012-12-03 2015-06-10 师宗华海木业有限公司 Method for pasting melamine tissue on board
CN103264428A (en) * 2013-05-16 2013-08-28 福建汇洋林业投资股份有限公司 Production process of low-density light reinforced floor

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Application publication date: 20121003