CN102664234B - Piezoelectric ceramic actuation element and manufacturing method thereof - Google Patents
Piezoelectric ceramic actuation element and manufacturing method thereof Download PDFInfo
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Abstract
The invention discloses a piezoelectric ceramic actuation element, which comprises a substrate with substrate electrodes and one or two piezoelectric ceramic plates each of which the front and back surfaces are bonded with electrode layers, wherein the piezoelectric ceramic plates and the substrate electrodes are bonded through bonding agents; and at least one bonding agent-free area filled with conductive materials is formed on the bonded surfaces of the piezoelectric ceramic plates and the substrate electrodes. The bonding agent-free area filled with conductive materials is formed on the bonded surfaces of the piezoelectric ceramic plates and the substrate electrodes, so that the electrode layers on the bonded surfaces of the substrate electrodes and the piezoelectric ceramic plates are fully conductive, the capability of the piezoelectric ceramic actuation element during working is improved, and the service life of the piezoelectric ceramic actuation element is prolonged; and through holes filled with conductive materials are formed in the substrate corresponding to the bonding agent-free area, so that the manufacturing process difficulty is reduced. Besides, the invention also provides a method for manufacturing the piezoelectric ceramic actuation element.
Description
Technical field
The present invention relates to a kind of piezoelectric ceramic actuator element and preparation method thereof, relate in particular to a kind of piezo ceramic unimorph or twin lamella actuation element and preparation method thereof, belong to piezoelectric element technical field.
Background technology
Piezoelectric refers to be under pressure makes the crystalline material that voltage can appear in the used time between both ends of the surface, and this phenomenon is called piezoelectric effect; Meanwhile, piezoelectric can produce distortion under external electric field, and this phenomenon is called as inverse piezoelectric effect.Utilize these characteristics of piezoelectric can realize the mutual conversion of mechanical oscillation and alternating current, thereby piezoelectric is widely used in making the element such as transducer, transducer.
Piezoelectric is broadly divided into inorganic piezoelectric material and organic piezoelectric materials, and wherein inorganic piezoelectric material comprises again piezoelectricity polycrystalline material (being piezoelectric ceramic) and piezoelectric single crystal material.In existing piezoelectric, piezoelectric ceramic is most widely used one.The anti-interference of the impact electric current of piezoelectric ceramic own is very strong, and it is little to generate heat, the transient process while not there is not current transients and the nuisance vibration that occurs does not more exist phenomenons such as being subject to the interference of electromagnetic field, and particularly in high speed motion, stability is very high, and error rate is low.Piezoelectric ceramic also has easy to control, lightweight, and volume is little, and electromagnetic noise is low, and displacement is directly proportional to voltage, safeguards that easily energy conversion efficiency is high, is easy to be processed into the advantages such as arbitrary shape, has been widely used in various precision optical machineries and electromechanical integration equipment.
Piezoelectric actuated and drive in application, application be mainly the single, double wafer of piezoelectric ceramic.The single, double wafer actuation element of piezoelectric ceramic is the inverse piezoelectric effect of utilizing piezoelectric ceramic, makes piezoelectric element produce the flexible actuation ends (one end is corresponding thereto conventionally fixing, is referred to as stiff end) that drives and produces large displacement bending and exert oneself.Conventionally piezoelectric ceramic actuator element is by substrate and piezoelectric ceramic piece is bonding forms, substrate can adopt the electric conducting material such as metal, carbon fiber, now substrate can be directly as substrate electrod, with two drive electrodes that form input driving voltage together with electrode surface on the non-bonding plane of piezoelectric ceramic piece; Substrate also can use non-conducting material to make, and now needs to utilize the modes such as brush silver slurry, copper membrane to produce substrate electrod on its surface.
All there is the actuation ends less defect of exerting oneself in existing piezoelectric ceramic list/twin lamella actuation element, its actual exerting oneself cannot reach theoretical level far away; And along with service time is elongated, actual exert oneself and can decline more and more that it can produce, that is its actual life is shorter; What is more, and at present the voltage on the per unit thickness of domestic piezoelectric ceramic list/twin lamella is very limited, and can on-load voltage do not reach independently piezoelectric ceramic piece far away and can bear voltage.
Summary of the invention
Technical problem to be solved by this invention is to overcome the existing actuation ends of the prior art defect less, can on-load voltage is not high and actual life is shorter of exerting oneself, provide a kind of have more greatly exert oneself, higher can on-load voltage and the piezoelectric ceramic actuator element and preparation method thereof of long life more.
The present invention specifically solves the problems of the technologies described above by the following technical solutions.
A kind of piezoelectric ceramic actuator element, comprise the substrate with substrate electrod, and a slice or two positive and negative surfaces are attached with respectively the piezoelectric ceramic piece of electrode layer, described piezoelectric ceramic piece and substrate electrod by stick mutually bonding, on the bonding plane of piezoelectric ceramic piece and substrate electrod, exist at least one place be filled with conductive materials without stick region.
As one of them preferred version, the described position that is positioned at the stiff end of close described Piezoelectric Ceramic element without stick region.
As another preferred version wherein, described conductive materials is conducting resinl or liquid metal.
A manufacture method for piezoelectric ceramic actuator element described above, described piezoelectric ceramic piece is a slice, comprises the following steps:
Steps A, described piezoelectric ceramic piece wherein one side electrode layer on apply one deck stick, when coating, form at least one place without stick region in electrode layer surface;
Step B, injecting appropriate conductive materials without stick region;
Step C, above-mentioned piezoelectric ceramic piece is scribbled to one of the stick horizontal positioned that faces up, substrate is covered thereon, then apply suitable pressure, make substrate and the piezoelectric ceramic piece under it form more stable entirety;
Step D, make described stick solidify.
A manufacture method for piezoelectric ceramic actuator element described above, described piezoelectric ceramic piece is two, it is characterized in that, comprises the following steps:
Steps A, respectively two piezoelectric ceramic pieces wherein one side electrode layer on apply one deck stick, when coating, form at least one place without stick region in electrode layer surface;
Step B, inject appropriate conductive materials at two piezoelectric ceramic pieces without stick region respectively;
Step C, a slice piezoelectric ceramic piece is wherein scribbled to one of the stick horizontal positioned that faces up, substrate is covered thereon, then apply suitable pressure, make substrate and the piezoelectric ceramic piece under it form more stable entirety;
Step D, another sheet piezoelectric ceramic piece is scribbled to one of the stick horizontal positioned that faces up, make substrate another side down, substrate is covered in to this piezoelectric ceramic piece upper surface, then applies suitable pressure, make two piezoelectric ceramic pieces and substrate form more stable entirety;
Step e, make described stick solidify.
In order to reduce manufacture craft difficulty, scheme as a further improvement on the present invention, on described substrate, be provided with on the bonding plane of quantity, position and size and described piezoelectric ceramic piece and substrate electrod without the identical through hole in stick region, through hole forms intercommunicating pore with corresponding without stick region, is full of conductive materials in intercommunicating pore.
A manufacture method for piezoelectric ceramic actuator element as described in further improvement project, described piezoelectric ceramic piece is a slice, the method comprises the following steps:
Steps A, described piezoelectric ceramic piece wherein one side electrode layer on apply one deck stick, when coating, form at least one place without stick region in electrode layer surface;
Step B, above-mentioned piezoelectric ceramic piece is scribbled to one of the stick horizontal positioned that faces up, substrate is covered thereon, on substrate, set in advance the through hole adapting with the described quantity without stick region, position and size, make on-chip through hole with without stick regional alignment, then apply suitable pressure, make substrate and the piezoelectric ceramic piece under it form more stable entirety;
Step C, in on-chip through hole, fill conductive materials;
Step D, generate a cover layer at substrate upper surface, make the conductive materials injecting be packaged in through hole;
Step e, make described stick solidify.
A kind of as described in further improvement project the manufacture method of piezoelectric ceramic actuator element, described piezoelectric ceramic piece is two, the quantity without stick region, position and size on the bonding plane of two piezoelectric ceramic pieces and substrate electrod are all identical, and the method comprises the following steps:
Steps A, a slice piezoelectric ceramic piece wherein one side electrode layer on apply one deck stick, when coating, form at least one place without stick region in electrode layer surface;
Step B, above-mentioned piezoelectric ceramic piece is scribbled to one of the stick horizontal positioned that faces up, substrate is covered thereon, on substrate, set in advance the through hole adapting with the described quantity without stick region, position and size, make on-chip through hole with without stick regional alignment, then apply suitable pressure, make substrate and the piezoelectric ceramic piece under it form more stable entirety;
Step C, in on-chip through hole, fill conductive materials;
Step D, wherein on the electrode layer of one side, apply one deck stick at another sheet piezoelectric ceramic piece, when coating electrode layer surface form with substrate on the quantity, position of through hole and size adapt without stick region; Order is coated with one of stick and faces down, and piezoelectric ceramic piece is covered in to substrate upper surface, make on piezoelectric ceramic piece without stick region and on-chip through-hole alignment, then apply suitable pressure, make two piezoelectric ceramic pieces and the more stable entirety of substrate formation;
Step e, make described stick solidify.
The present invention by the bonding plane at piezoelectric ceramic piece and substrate electrod arrange be filled with conductive materials without stick region, make to realize and fully conducting between substrate electrod and the electrode layer of piezoelectric ceramic piece bonding plane, exerting oneself while effectively having improved the work of piezoelectric ceramic actuator element, and increased the useful life of piezoelectric ceramic actuator element; And further by substrate with without corresponding position, stick region, the through hole that is full of conductive materials being set, reduce manufacture craft difficulty.
Brief description of the drawings
Fig. 1 is a kind of structural representation of existing piezoelectric bimorph actuation element;
Fig. 2 is the equivalent circuit diagram of existing piezoelectric ceramic actuator element;
Fig. 3 is the structural representation of the embodiment of the present invention one;
Fig. 4 is the structural representation of the embodiment of the present invention two;
Fig. 5 is the structural representation of the embodiment of the present invention three;
Fig. 6 is the structural representation of the embodiment of the present invention four;
Fig. 7 is the structural representation of the embodiment of the present invention five;
Fig. 8 is the structural representation of the embodiment of the present invention six;
The test platform schematic diagram that Fig. 9 uses for contrast test;
In figure, each label implication is as follows: 1 is substrate, 11 is substrate electrod, 2,3 is piezoelectric ceramic piece, 21,22 is two electrode layers of piezoelectric ceramic piece 2,31,32 is two electrode layers of piezoelectric ceramic piece 3, and 4,5 is adhesive layer, 6,7 be respectively in adhesive layer 4 and adhesive layer 5 without stick region, 8 is the through hole on substrate 1, and 9 is cover layer.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is elaborated:
A kind of structure of existing piezoelectric bimorph actuation element as shown in Figure 1, comprise: substrate 1, piezoelectric ceramic piece 2, piezoelectric ceramic piece 3, there is respectively one deck electrode layer on two surfaces of piezoelectric ceramic piece 2 and 3: 21,22 and 31,32, the electrode layer 22 of piezoelectric ceramic piece 2 is a surface binded with substrate 1 by adhesive layer 4, and the electrode layer 31 of piezoelectric ceramic piece 3 is another surface binded with substrate 1 by adhesive layer 5.Substrate 1 can directly use the electric conducting material such as metal material or carbon fiber to make, thereby using itself as piezoelectric ceramic piece 2 with 3 shared substrate electrods; Also can form substrate electrod on its surface by criticizing methods such as covering silver slurry, copper film.One end of this piezoelectric bimorph actuation element is fixed, the other end is as actuation ends, when apply driving voltage between substrate electrod and the electrode layer 21,32 of piezoelectric ceramic piece 2 and 3 time, due to the effect of inverse piezoelectric effect, piezoelectric ceramic piece 2 and 3 produces distortion, drive actuation ends is subjected to displacement, thereby promotes load movement.
But this type of piezoelectric ceramic list/twin lamella actuation element all exists actual the exerting oneself of actuation ends cannot reach the phenomenon of theoretical level far away; And along with service time is elongated, it can produce actual exert oneself and can decline more and more, that is its actual life is shorter, What is more, and its reality can making alive can be subject to voltage well below piezoelectric ceramic piece independently.
Find through test and research, the generation of this kind of phenomenon is because the existence of adhesive layer 4 and 5 produces.As everyone knows, in the time making piezoelectric ceramic list/twin lamella actuation element, need to be by bonding to play fixing effect to piezoelectric ceramic piece and substrate.In order to ensure bonding fastness, common used bonding agent is nonconducting organism glue, and under pressure, the adhesive layer that bonding agent forms is very thin, it is generally acknowledged and can not affect conducting between the substrate electrod at its two ends and piezoelectric ceramic electrode layer.But in fact, due to the existence of adhesive layer, presenting a kind of situation contacting of putting between substrate electrod and piezoelectric ceramic electrode layer on microcosmic, is to be realized and being conducted by some discontinuous contact points between the two, therefore in fact easily forms bad conducting.
The piezoelectric effect of piezoelectric ceramic piece meets following formula:
Q＝Fd (1)
Wherein d is piezoelectric modulus, and F is the active force to piezoelectric ceramic piece, and Q is the quantity of electric charge on piezoelectric ceramic piece two end electrodes face.The formula of inverse piezoelectric effect can be obtained by above fortran:
F＝Q/d (2)
Because d is material parameter, therefore the quantity of electric charge of known piezoelectric ceramic piece two end electrodes face is larger, the active force that piezoelectric ceramic piece produces is larger.
The situation of considering to be bonded in on-chip piezo ceramic unimorph, piezoelectric ceramic piece is equivalent to an electric capacity, represents with C1.Under ideal state, be between substrate electrod and its bonding piezoelectric ceramic electrode layer, to be good conducting, the driving voltage being carried between another electrode layer of substrate electrod and piezoelectric ceramic equates with capacitor C 1 both end voltage, and now actual the exerting oneself of piezoelectric ceramic piece can reach theoretical value.But, due to the existence of adhesive layer, make to present between substrate electrod and piezoelectric ceramic electrode layer the situation of incomplete conducting, as shown in the equivalent electric circuit of Fig. 2, be equivalent to capacitor C 1 resistance R 1 of having connected, from circuit theory, in the time being carried in driving voltage between another electrode layer of substrate electrod and piezoelectric ceramic and being the alternating voltage of a fixed value, due to large (can reach 200～250nF) of capacitor C 1, within a half period of driving voltage, can think positive charge, but because resistance R 1 is also very large, cause the electric current of circuit very little, also just very slow to the charging effect of capacitor C 1 so.So under a frequency, electric weight does not all reach the full value of capacitor C 1 chargeable lotus, therefore the working value of capacitor C 1 cannot reach actual value C1 all the time at every turn.Known in conjunction with formula (2), traditional actual the exerting oneself of piezoelectric ceramic list/twin lamella actuation element actuation ends being operated in equally under alternating voltage situation cannot reach theoretical level far away.In situation about working long hours, bad conducting situation between substrate electrod and piezoelectric ceramic electrode layer can be more serious, be equivalent to resistance R 1 and progressively increasing, cause thus maximum electric weight on the positive and negative polarities of piezoelectric ceramic piece to become more and more less, actuation element is actual exert oneself more and more less.What is more, the positive and negative polarities voltage that is added in piezoelectric ceramic piece when alternating current is timing, because the alternating voltage of actuation element is generally square wave, so impact because of large resistance R 1 near glue-line one side at piezoelectric ceramic piece, when its electric charge is not also full of, and piezoelectric ceramic piece near the one side of glue-line with around the some contact position of substrate near the one side of glue-line, have thin low-k glue-line, just form a high potential difference on the two sides of these thin layers, and the anti-puncture voltage of glue-line is very low, therefore caused the electric discharge phenomena at these thin layer places, and be the generation of forbidding electric discharge phenomena in actuation element especially piezoelectric ceramic list/twin lamella, very easily cause contact position thin adhesive layer peeling off on microcosmic around, make invocation point contact effect more severe, more easily cause piezoelectric ceramic piece because electric discharge produces dark crackle and breakdown effect.
Known by above analysis, solve conventional piezoelectric pottery list/twin lamella actuation element actual exert oneself lower, cannot add high pressure and problem that the life-span is shorter, must make to realize good conducting between substrate electrod and piezoelectric ceramic electrode layer.A solution of the most easily expecting is the bonding agent that adopts high conductivity, but existing conducting resinl is to add metal dust in glue, although improved electric conductivity, but also can cause the severe problem of overall bonding state, be mainly reflected in the deterioration of the performance such as coefficient of elasticity and thermal coefficient of expansion of gluing effect, piezoelectric ceramic list twin lamella, can have a strong impact on reliability and the useful life of element.For this reason, the present invention is by the following technical solutions:
A kind of piezoelectric ceramic actuator element, comprise the substrate with substrate electrod, and a slice or two positive and negative surfaces are attached with respectively the piezoelectric ceramic piece of electrode layer, described piezoelectric ceramic piece and substrate electrod are mutually bonding by stick, it is characterized in that, on the bonding plane of piezoelectric ceramic piece and substrate electrod, exist at least one place be filled with conductive materials without stick region.
Adopt technique scheme, can be in the situation that not reducing bonding fastness, by the conductive materials without filling in stick region of bonding plane, the electrode layer of substrate electrod and piezoelectric ceramic piece being realized fully conducts, thereby avoid the effect that separates that under the harmful effect that adhesive layer directly brings and the state that works long hours, thereby stick peeling off on microcosmic caused a contact position, the service behaviour that improves element, increases the service life.And the present invention to realize technique simple, be conducive to produce in enormous quantities manufacture.
In technique scheme, be preferably positioned at the position near the stiff end of described Piezoelectric Ceramic element without stick region, thereby avoid the issuable harmful effect of actuation ends long-term action.Described conductive materials can be gas, liquid, solid or the compounding substances of conduction, but in order to be beneficial to simplification manufacture craft, preferably adopts conducting resinl or liquid metal.
For the ease of public understanding technical solution of the present invention, with several specific embodiments, piezoelectric ceramic actuator element of the present invention and preparation method thereof is described below.
Embodiment mono-,
Fig. 3 has shown a kind of piezo ceramic unimorph actuation element that adopts technical solution of the present invention, its structure as shown in the figure, comprise metal substrate 1 and piezoelectric ceramic piece 2, two surfaces of piezoelectric ceramic piece 2 have two electrode layers 21,22, electrode layer 22 is bonding with the wherein one side of substrate 1 by adhesive layer 4, in adhesive layer 4, exist a place without stick region 6, without being filled with the conductive materials such as conducting resinl or liquid metal in stick region 6.In the present embodiment, adhesive layer 4 uses the non-conductive organic gel that cementability is strong, without the position in stick region 6 near stiff end.Metal substrate 1 itself is simultaneously as substrate electrod, between itself and electrode layer 22 by having realized good conducting without the conductive materials in stick region 6.Above-mentioned piezo ceramic unimorph actuation element can be manufactured and obtain by the following method:
Steps A, on the electrode layer 22 of piezoelectric ceramic piece 2, apply one deck stick, when coating, form places without stick region 6 on electrode layer 22 surfaces; For example, can be by reserve the figure of correspondence position on Printing screen, thus while reaching printing stick, form the effect without stick region in electrode surface 22 corresponding positions of piezoelectric ceramic piece 2;
The conductive materials such as step B, (for example can use the device such as syringe, dropper or other automation equipment) the appropriate conducting resinl of injection in without stick region 6 or liquid metal (such as mercury);
Step C, piezoelectric ceramic piece 2 is scribbled to electrode layer 22 horizontal positioned upward of stick, substrate 1 is covered thereon, then apply suitable pressure, make substrate 1 and the piezoelectric ceramic piece 2 under it form more stable entirety;
Step D, adopt heating or the appropriate ways such as dry in the shade solidifies it according to the characteristic of used stick, so far obtained the piezo ceramic unimorph actuation element of the present embodiment.Make to have realized good conducting between metal substrate 1 and electrode layer 22 without the conductive materials in stick region 6, and due to without stick region 6 for whole bonding plane, shared area is minimum, therefore on adhesive effect without impact.
Embodiment bis-,
Fig. 4 has shown a kind of piezoelectric bimorph actuation element that adopts technical solution of the present invention, its structure as shown in the figure, comprise substrate 1, piezoelectric ceramic piece 2, piezoelectric ceramic piece 3, there is respectively one deck electrode layer on two surfaces of piezoelectric ceramic piece 2 and 3: 21,22 and 31,32,1 of substrate is as non-conducting material, its surface is covered with one deck copper film 11 as substrate electrod, the electrode layer 22 of piezoelectric ceramic piece 2 is a surface binded with substrate 1 by adhesive layer 4, and the electrode layer 31 of piezoelectric ceramic piece 3 is another surface binded with metal substrate 1 by adhesive layer 5.As shown in the figure, in adhesive layer 4, adhesive layer 5, have respectively one without stick region 6, without stick region 7, without stick region 6 with without being filled with respectively conductive materials in stick region 7.In the present embodiment, the strong non-conductive organic gel of the preferred cementability of adhesive layer 4,5, its location optimization, near stiff end place, can be the same or different without stick region 6 with without position, shape and the size in stick region 7.Substrate electrod 11 respectively by without stick region 6, without in stick region 7 fill conductive materials and electrode layer 22,31 between realized good conducting.Above-mentioned piezoelectric bimorph actuation element can be made and obtain by the following method:
Steps A, on the electrode layer 31 of the electrode layer 22 of piezoelectric ceramic piece 2, piezoelectric ceramic piece 3, apply one deck stick respectively, when coating, form respectively a place without stick region 6, without stick region 7 on the surface of electrode layer 22, electrode layer 31; For example, can be by reserve the figure of correspondence position on Printing screen, thus while reaching printing stick, form the effect without stick region in the electrode layer surface corresponding position of piezoelectric ceramic piece;
Step B, respectively two piezoelectric ceramic pieces without stick region 6,7 in inject appropriate conductive materials;
Step C, piezoelectric ceramic piece 2 is scribbled to electrode layer 22 horizontal positioned upward of stick, substrate 1 is covered thereon, then apply suitable pressure, make substrate 1 and the piezoelectric ceramic piece 2 under it form more stable entirety;
Step D, piezoelectric ceramic piece 3 is scribbled to electrode layer 31 horizontal positioned upward of stick, make substrate 1 another side down, substrate 1 is covered in to the upper surface of piezoelectric ceramic piece 3, then applies suitable pressure, make two piezoelectric ceramic pieces and substrate form more stable entirety;
Step e, adopt heating or the appropriate ways such as dry in the shade solidifies it according to the characteristic of used stick, so far obtained the piezoelectric bimorph actuation element of the present embodiment.
Embodiment tri-,
Fig. 5 has shown a kind of piezo ceramic unimorph actuation element that adopts technical solution of the present invention, its structure as shown in the figure, comprise metal substrate 1 and piezoelectric ceramic piece 2, two surfaces of piezoelectric ceramic piece 2 have two electrode layers 21, 22, electrode layer 22 is bonding with the wherein one side of substrate 1 by adhesive layer 4, the another side of substrate 1 is fixed with a cover layer 9, on substrate 1, there is a through hole 8, in adhesive layer 3, have one without stick region 6, the position of through hole 8, shape and size are with identical without stick region 6, form an intercommunicating pore without stick region 6 and through hole 8, in this intercommunicating pore, be full of conductive materials.In the present embodiment, adhesive layer 4 uses the non-conductive organic gel that cementability is strong, the preferred conducting resinl of conductive materials or liquid metal in intercommunicating pore, and the position of intercommunicating pore is near stiff end.Metal substrate 1 itself is simultaneously as substrate electrod, between itself and electrode layer 22, realized good conducting by the conductive materials in intercommunicating pore.Above-mentioned piezo ceramic unimorph actuation element can be manufactured and obtain by the following method:
Steps A, on the electrode layer 22 of piezoelectric ceramic piece 2, apply the non-conductive organic stick 4 of one deck, when coating, form places without stick region 6 on electrode layer 22 surfaces; For example, can be by reserve the figure of correspondence position on Printing screen, thus while reaching printing stick, form the effect without stick region in the surperficial corresponding position of electrode layer 22 of piezoelectric ceramic piece 2;
Step B, piezoelectric ceramic piece 2 is scribbled to electrode surface 22 horizontal positioned upward of stick, metal substrate 1 is covered thereon, on metal substrate 1, set in advance a through hole 8 adapting with position, shape and size without stick region 6, make aiming at without stick region 6 of through hole 8 on metal substrate 1 and electrode layer 22 surfaces, then apply suitable pressure, make metal substrate 1 and the piezoelectric ceramic piece 2 under it form more stable entirety;
Step C, in the through hole 8 on metal substrate 1, fill the conductive materials such as conducting resinl or liquid metal (such as mercury);
Step D, generate a cover layer 9 at metal substrate 1 upper surface, for example, can adopt the mode that applies one deck packaging plastic, make the conductive materials injecting be packaged in through hole 8;
Step e, adopt heating or the appropriate ways such as dry in the shade solidifies stick according to the characteristic of used stick, so far obtained the piezo ceramic unimorph actuation element of the present embodiment.Electrode layer 22 surfaces together with the through hole 8 of stick region 6 and metal substrate 1, formed intercommunicating pore, the conductive materials of wherein filling makes to have realized good conducting between metal substrate 1 and electrode layer 22, and because intercommunicating pore is for bonding plane, shared area is minimum, therefore on adhesive effect without impact.
Embodiment tetra-,
Fig. 6 has shown the another kind of piezo ceramic unimorph actuation element that adopts technical solution of the present invention, basic structure and embodiment tri-are basic identical, difference part is that substrate 1 is for non-conducting material, has covered one deck silver slurry 11 as substrate electrod on its surface batch, and its structure as shown in the figure.This element can adopt the manufacture method identical with embodiment mono-, repeats no more herein.The conductive materials of filling in intercommunicating pore makes to have realized good conducting between substrate electrod 11 and electrode layer 22.
Embodiment five,
Fig. 7 has shown a kind of piezoelectric bimorph actuation element that adopts technical solution of the present invention, its structure as shown in the figure, comprise metal substrate 1, piezoelectric ceramic piece 2, piezoelectric ceramic piece 3, there is respectively one deck electrode layer on two surfaces of piezoelectric ceramic piece 2 and 3: 21, 22 and 31, 32, the electrode layer 22 of piezoelectric ceramic piece 2 is a surface binded with substrate 1 by adhesive layer 4, the electrode layer 31 of piezoelectric ceramic piece 3 is another surface binded with metal substrate 1 by adhesive layer 5, adhesive layer 4, in adhesive layer 5, there is respectively one without stick region 6, 7, on metal substrate 1, there is a through hole 8, without stick region 6, without the position of stick region 7 and through hole 8, shape and size are all identical, thereby jointly form an intercommunicating pore, in this intercommunicating pore, be full of conductive materials.In the present embodiment, adhesive layer 4,5 uses the strong non-conductive organic gel of cementability, the preferred conducting resinl of conductive materials or liquid metal in intercommunicating pore, and the position of intercommunicating pore is near stiff end.Metal substrate 1 itself is simultaneously as substrate electrod, between itself and electrode layer 22,31, realized good conducting by the conductive materials in intercommunicating pore.Above-mentioned piezoelectric bimorph actuation element can be manufactured and obtain by the following method:
Steps A, on the electrode layer 22 of piezoelectric ceramic piece 2, apply one deck stick, when coating, form places without stick region 6 on electrode layer 22 surfaces; For example, can be by reserve the figure of correspondence position on Printing screen, thus while reaching printing stick, form the effect without stick region in the surperficial corresponding position of electrode layer 22 of piezoelectric ceramic piece 2;
Step B, piezoelectric ceramic piece 2 is scribbled to electrode layer 22 horizontal positioned upward of stick, metal substrate 1 is covered thereon, on metal substrate 1, set in advance position, shape and the big or small through hole 8 adapting in being and not being stick region 6, make aiming at without stick region 6 of through hole 8 on metal substrate 1 and electrode layer 22 surfaces, then apply suitable pressure, make metal substrate 1 and the piezoelectric ceramic piece 2 under it form more stable entirety;
Step C, in the through hole on metal substrate 1, fill the conductive materials such as conducting resinl or liquid metal (such as mercury);
Step D, on electrode layer 31 surfaces of piezoelectric ceramic piece 3, apply one deck stick, when coating, utilize in steps A similar method electrode layer 31 surfaces form with metal substrate 1 on position, shape and the size of through hole 8 adapt without stick region 7; Make electrode layer 31 surfaces down, piezoelectric ceramic piece 3 is covered in to the upper surface of metal substrate 1, make aiming at the through hole 8 on metal substrate 1 without stick region 7 on piezoelectric ceramic piece 3, then apply suitable pressure, make two piezoelectric ceramic pieces 2,3 and metal substrate 1 form more stable entirety;
Step e, adopt heating or the appropriate ways such as dry in the shade solidifies described stick according to the characteristic of used stick, so far obtained the piezoelectric bimorph actuation element of the present embodiment.Electrode layer 22, electrode layer 31 surfaces formed an intercommunicating pore without stick region with together with through hole on metal substrate 1, the conductive materials of wherein filling makes to have realized good conducting between metal substrate 1 and electrode layer 22, electrode layer 31, and because intercommunicating pore is for bonding plane, shared area is minimum, therefore on adhesive effect without impact, ensured bonding fastness.
Embodiment six,
Fig. 8 has shown the another kind of piezoelectric bimorph actuation element that adopts technical solution of the present invention, basic structure and embodiment five are basic identical, difference part is that substrate 1 is for non-conducting material, has covered one deck silver slurry 11 as substrate electrod on its surface batch, and its structure as shown in the figure.This element can adopt the manufacture method identical with embodiment five, repeats no more herein.The conductive materials of filling in intercommunicating pore makes to have realized good conducting between substrate electrod 11 and electrode layer 22, electrode layer 31.
In order to verify beneficial effect of the present invention, carry out following contrast test.
Make respectively two piezoelectric bimorph actuation element: 1# and 2#, wherein, 1# is the conventional 60-2 two line pressure electric separation faller gills that use metal substrate; 2# is the 60-2 two line pressure electric separation faller gills that adopt the embodiment of the present invention five schemes.Test under the same conditions respectively the exerting oneself of two samples, life-span, electric capacity and high voltage limit.The method of testing of each parameter is as follows:
1, test is exerted oneself
Subjects is pressed to Fig. 9 shown device on test platform, use piezoelectric ceramics power supply load at sample lead-out wire two ends 50V or-50V voltage, the collection of carrying out static state by high accuracy pull and push dynamometer at force-detecting position place and going out force data.
2, the test life-span
Subjects is pressed to Fig. 9 shown device on test platform, use piezoelectric ceramics power supply to continue to produce 50V, 50Hz alternating voltage at sample lead-out wire two ends.When product occurs staticly or dynamically go out force data lower than 110mN by high accuracy pull and push dynamometer at force-detecting position place, think damage of product.
3, testing capacitor
Sample zero load, is used LCR directly to test at the exit of 60-2 two line pressure electric separation faller gills.
4, high voltage limit
With to test out power apparatus identical, in the zero load of force-detecting position place, use piezoelectric ceramics power supply to load a constant voltage, recession in 2 seconds is except power supply testing capacitor, as electric capacity has 50% above variable quantity, thinks high-voltage breakdown; As be less than 50% variable quantity and determine high voltage limit by continuous incremental voltage value.
Table 1
Note: Vo is the free state lower piezoelectric pottery puncture voltage of this thickness
The test result finally obtaining as shown in Table 1, though by test result can very clearly find out sample of the present invention at electric capacity, exert oneself, bear high pressure and on the life-span, be all much better than conventional sample.Technical scheme of the present invention is particularly suited for the application of pin-insertion type piezoelectric selection piece.
Claims (2)
1. the manufacture method of a piezoelectric ceramic actuator element, described piezoelectric ceramic actuator element comprises the substrate with substrate electrod, and the positive and negative surface of a slice is attached with respectively the piezoelectric ceramic piece of electrode layer, described piezoelectric ceramic piece and substrate electrod by stick mutually bonding, on the bonding plane of piezoelectric ceramic piece and substrate electrod, exist at least one place be filled with conductive materials without stick region; On described substrate, be provided with on the bonding plane of quantity, position and size and described piezoelectric ceramic piece and substrate electrod without the identical through hole in stick region, through hole without stick region formation intercommunicating pore, is full of conductive materials with corresponding in intercommunicating pore; On described substrate, on the another side relative with bonding plane, be attached with a cover layer, it is characterized in that, comprise the following steps:
Steps A, described piezoelectric ceramic piece wherein one side electrode layer on apply one deck stick, when coating, form at least one place without stick region in electrode layer surface;
Step B, above-mentioned piezoelectric ceramic piece is scribbled to one of the stick horizontal positioned that faces up, substrate is covered thereon, on substrate, set in advance the through hole adapting with the described quantity without stick region, position and size, make on-chip through hole with without stick regional alignment, then apply suitable pressure, make substrate and the piezoelectric ceramic piece under it form stable entirety; Step C, in on-chip through hole, fill conductive materials;
Step D, generate a cover layer at substrate upper surface, make the conductive materials injecting be packaged in through hole;
Step e, make described stick solidify.
2. the manufacture method of a piezoelectric ceramic actuator element, described piezoelectric ceramic actuator element comprises the substrate with substrate electrod, and two positive and negative surfaces are attached with respectively the piezoelectric ceramic piece of electrode layer, described piezoelectric ceramic piece and substrate electrod by stick mutually bonding, on the bonding plane of piezoelectric ceramic piece and substrate electrod, exist at least one place be filled with conductive materials without stick region; On described substrate, be provided with on the bonding plane of quantity, position and size and described piezoelectric ceramic piece and substrate electrod without the identical through hole in stick region, through hole without stick region formation intercommunicating pore, is full of conductive materials with corresponding in intercommunicating pore; The quantity without stick region, position and size on the bonding plane of two piezoelectric ceramic pieces and substrate electrod are all identical, it is characterized in that, comprise the following steps:
Steps A, a slice piezoelectric ceramic piece wherein one side electrode layer on apply one deck stick, when coating, form at least one place without stick region in electrode layer surface;
Step B, above-mentioned piezoelectric ceramic piece is scribbled to one of the stick horizontal positioned that faces up, substrate is covered thereon, on substrate, set in advance the through hole adapting with the described quantity without stick region, position and size, make on-chip through hole with without stick regional alignment, then apply suitable pressure, make substrate and the piezoelectric ceramic piece under it form stable entirety; Step C, in on-chip through hole, fill conductive materials;
Step D, wherein on the electrode layer of one side, apply one deck stick at another sheet piezoelectric ceramic piece, when coating electrode layer surface form with substrate on the quantity, position of through hole and size adapt without stick region; Order is coated with one of stick and faces down, and piezoelectric ceramic piece is covered in to substrate upper surface, make on piezoelectric ceramic piece without stick region and on-chip through-hole alignment, then apply suitable pressure, make two piezoelectric ceramic pieces and substrate form stable entirety;
Step e, make described stick solidify.
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| CN103594076B (en) * | 2013-11-20 | 2016-04-20 | 常州波速传感器有限公司 | Piezoelectric plate structure |
| JP6764557B2 (en) * | 2015-10-16 | 2020-10-07 | ローム株式会社 | Piezoelectric element utilization device |
| CN106784297B (en) * | 2016-12-09 | 2020-09-25 | 苏州攀特电陶科技股份有限公司 | Piezoelectric ceramic actuating piece and preparation method thereof |
| CN111129283A (en) * | 2019-12-27 | 2020-05-08 | 中国科学院宁波材料技术与工程研究所 | Driving device, dielectric elastomer actuator and manufacturing method thereof |
| CN113541630A (en) * | 2020-04-21 | 2021-10-22 | 济南晶正电子科技有限公司 | Composite single crystal piezoelectric substrate and preparation method thereof |
| CN113323848A (en) * | 2021-06-02 | 2021-08-31 | 北京机械设备研究所 | Liquid metal driving device based on piezoelectric film, control method and manufacturing method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0210790A2 (en) * | 1985-07-24 | 1987-02-04 | Watanabe Kutsushita Kogyo Co. Ltd. | Knitting needle driving mechanism of knitting machine |
| JPH10315485A (en) * | 1997-05-22 | 1998-12-02 | Fuji Electric Co Ltd | Method for adhering piezoelectric element |
| CN1223742A (en) * | 1996-05-23 | 1999-07-21 | 西门子公司 | Piezoelectric element and process for its production |
| CN1990249A (en) * | 2005-12-26 | 2007-07-04 | 兄弟工业株式会社 | Method of manufacturing ink-jet head |
| CN101714607A (en) * | 2009-09-22 | 2010-05-26 | 华南理工大学 | Piezoelectric ceramic element of metal aluminium electrode and preparation method thereof |
| CN102154777A (en) * | 2011-05-16 | 2011-08-17 | 江苏亿隆新能源科技发展有限公司 | Driving slice of piezoelectric ceramic needle selection device |
| CN202564440U (en) * | 2012-05-21 | 2012-11-28 | 花毅 | Piezoelectric ceramic actuating element |
-
2012
- 2012-05-21 CN CN201210157180.5A patent/CN102664234B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0210790A2 (en) * | 1985-07-24 | 1987-02-04 | Watanabe Kutsushita Kogyo Co. Ltd. | Knitting needle driving mechanism of knitting machine |
| CN1223742A (en) * | 1996-05-23 | 1999-07-21 | 西门子公司 | Piezoelectric element and process for its production |
| JPH10315485A (en) * | 1997-05-22 | 1998-12-02 | Fuji Electric Co Ltd | Method for adhering piezoelectric element |
| CN1990249A (en) * | 2005-12-26 | 2007-07-04 | 兄弟工业株式会社 | Method of manufacturing ink-jet head |
| CN101714607A (en) * | 2009-09-22 | 2010-05-26 | 华南理工大学 | Piezoelectric ceramic element of metal aluminium electrode and preparation method thereof |
| CN102154777A (en) * | 2011-05-16 | 2011-08-17 | 江苏亿隆新能源科技发展有限公司 | Driving slice of piezoelectric ceramic needle selection device |
| CN202564440U (en) * | 2012-05-21 | 2012-11-28 | 花毅 | Piezoelectric ceramic actuating element |
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