CN102538672A - CMOS (complementary metal-oxide-semiconductor)-machine-vision-based component size measuring system and measurement test method - Google Patents
CMOS (complementary metal-oxide-semiconductor)-machine-vision-based component size measuring system and measurement test method Download PDFInfo
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Abstract
The invention discloses a CMOS (complementary metal-oxide-semiconductor)-machine-vision-based component size measuring system and a measurement test method. The CMOS-machine-vision-based component size measuring system comprises an image acquisition module, an image processing module and a size measuring module, wherein the image acquisition module acquires images of contour edges of a shot component; the image processing module performs binaryzation and filtering processing on the acquired images, and then performs edge detection to obtain edges of the images of the component; and the size measuring module calculates a pixel value of an edge contour of a measured object through feature extraction, and the pixel value can directly reflect the size of the component through calibration. According to the CMOS-machine-vision-based component size measuring system and the measurement test method disclosed by the invention, the measurement of the contour size can be realized, and the measurement of the aperture of a small through hole can be finished; and after a special assistant tool is provided, the measurement of the bottom width of a trumpet-shaped groove can be realized.
Description
Technical field
The invention belongs to field of machine vision; Relate to a kind of part dimension measurement system and measurement method of inspection based on the CMOS machine vision; Specifically; Be through being contactless accurate measurement and the whether qualified judgement of part that sighting device that core makes up is realized the same specification spare part outside measurement with CMOS camera and optical lens, this system can also realize the measurement of fine through-hole aperture and tubaeform groove bottom land width.
Background technology
In the modern industrial; The recognition application of relate to various checks, producing supervision and part; The for example dimension inspection of spare and accessory parts batch machining, the integrity checking that assembles automatically, the element of electronic assemblies line is located automatically; The character recognition of IC etc., common human eye can't be accomplished these continuously and stably and have brightness repeatability and intelligent work.This moment, people utilized photo electric imaging system to gather the controlled object image; And after computing machine or special image processing module are carried out digitized processing; Carry out the judgement of size, shape etc. according to information such as the pixel distribution brightness of image and colors, produced the notion of machine vision thus.Machine vision is exactly the visual performance with computing machine simulation human eye, and information extraction from image or image sequence is carried out form and Motion Recognition to the object of objective world.Machine vision technique is used comparatively general at present, but it is still rare to be applied to dimensional measurement.Present most of machine vision technique all is based on the CCD technology; But the CCD technical costs is higher; And the CMOS low price of same specification; And show through experimental study: the NI Vision Builder for Automated Inspection measuring accuracy based on CMOS can reach μ m class precision, satisfies the dimensional measurement accuracy requirement of most parts.
The technology contents that comprises hardware components and software section two aspects based on the gordian technique of the dimensional measurement of CMOS machine vision.The contactless dimension measurement method of widespread use at present mainly contains following four types: 1. laser measurement method.Adopt laser projections to workpiece, one laser detector is installed, block the corresponding width X of dash area that bias light produces by workpiece and directly react the measured workpiece size value at the workpiece rear.It is bigger that shortcoming is that device is manufactured difficulty, and cost is higher, and optical system need keep totally, otherwise will influence measurement.Can not there be barrier the centre, and receiver arranged, and can not measure mobile object too greatly because the feedback signal of light changes.2. pneumatic type non-contact measurement method.Its measuring method is that size signal is converted into the variation of measuring gas flow in the pipeline, and comes indicating value through the buoy in the graduated glass tube, or is the light beam indicating value that electric signal is made up of luminotron through pneumatic-to-current converter with the gas conversion of signals.Electronics pillar pneumatic measuring instrument be difficult for to be realized the pneumoelectric conversion, and measurement target has limitation, is used to measure the size of aperture or semi-closed structure mostly, is not suitable for measuring external dimensions, and cost is higher; And gauge head need be near workpiece, and therefore needing certain action can realize dimensional measurement.3. electric vortex type measuring method.Application current vortex technology, current vortex sensor need not to contact the position that measured piece just can the measurement target object, but the necessary close-in measurement of device when measuring can not carry out than telemeasurement, and measuring accuracy is not high, and only is suitable for measuring metal parts.4. image-type measuring method.By optical microscope object under test is carried out high magnification optics amplification imaging; After object image after process CCD camera system will be amplified is sent into computing machine, detect the profile and the surface configuration size of workpiece, but image measurer is based on the CCD technology; Cost is high, and can not carry out on-line measurement.
Four types of above-mentioned contactless dimension measurement methods all have comparatively proven technique at present and more detailed introduction are arranged in many pieces of pertinent literatures, but all there is deficiency separately in these contactless dimension measuring devices.And present existing dimension measurement method is difficult to realize the accurate measurement of fine through-hole aperture and tubaeform groove bottom land width.
Summary of the invention
In order to overcome above-mentioned deficiency of the prior art, the present invention provides a kind of part dimension measurement system and measurement method of inspection based on the CMOS machine vision, can not only realize non-cpntact measurement; Can reach reliability and measuring accuracy preferably, be equipped with special-purpose loading and unloading system after, can also be conveniently implemented in line and measure; And it is simple in structure to be somebody's turn to do invention, and cost is low, high efficiency; Flexibly, measure the restriction that does not receive accessory size basically; Not only can realize the appearance profile dimensional measurement, also can accomplish the inside diameter measurement of small through hole; Be equipped with the measurement that can realize tubaeform bottom land width behind the special-purpose accessory.
The present invention adopts following technical scheme to realize: design, made and a kind ofly comprise image capture module based on CMOS machine vision Size Measuring System, image processing module and dimensional measurement module.At first be transferred to the part edge image of computing machine through USB interface by the CMOS camera through the image capture software collection; Be digital signal with the analog signal conversion that collects then and be input in the calculator memory; Flame Image Process and dimensional measurement belong to the software section of detection system; At first adopt effective image processing method that the image of gathering is carried out pre-service and rim detection, obtain the edge of part image, obtain the pixel value of edge contour then through feature detection, dimensional measurement; Through demarcating, this pixel value directly reflects the size of part.
Part dimension measurement system based on the CMOS machine vision comprises base plate, locating piece, riser, backlight, imaging system, horizontal adjustment plate, vertical adjustable plate etc.; Said locating piece is fixedly mounted on the said base plate;, on said locating piece, said backlight is connected on the riser said riser through screw retention; Said horizontal adjustment plate is fixedly mounted on the said base plate, and said vertical adjustable plate is installed on the said horizontal adjustment plate.
Said imaging system comprises CCD camera assembly, camera mounting blocks, and said CCD camera assembly links to each other with said vertical adjustable plate through the camera mounting blocks.
Said CCD camera assembly comprises eyepiece, object lens, lens barrel, CMOS camera, and said CMOS camera has USB interface, and USB mouth direct plugging-in CMOS camera fixing is at the CCD camera assembly tail end.
Said locating piece front end has draw-in groove, is complementary with the workpiece shape, is convenient to fixation workpiece.
On the said horizontal adjustment plate track is arranged, said vertical adjustable plate is installed on the said horizontal adjustment plate, and said vertical adjustable plate can move on said leveling board through track.
Said vertical adjustable plate is provided with track, and said CCD camera assembly can move up and down on said vertical adjustable plate through said camera mounting blocks.
The present invention provides a kind of part dimension measurement method again; May further comprise the steps (A1) and regulate all parts of mounting hardware part; CCD camera assembly is installed on the camera mounting blocks; Regulate horizontal adjustment plate and vertical adjustable plate, make CCD camera assembly and backlight height roughly the same, measured workpiece is between imaging system and the backlight.(A2) the strict fixation workpiece position of at every turn putting, the accurate location by locating piece is realized workpiece supplies power to backlight through the 1.5V direct current.(A3) system connects the back images acquired, sets up grey level histogram, carries out histogram specification, and medium filtering is handled, and single threshold is cut apart, and arrangement for closed configuration is learned and handled and the Canny rim detection, through least square method the image border profile is carried out match; Calculate the pixel value of edge contour through the sub-VI function that adopts LabVIEW to provide,, after system is demarcated, can set up the corresponding relation of pixel value and size value according to the pixel value that calculates; According to the pixel value that calculates, just can calculate the pairing size value of this pixel value according to the result who demarcates, then can accomplish the dimensional measurement of part.
The present invention also provides a kind of accessory size the whether qualified method of inspection; Concrete steps and part dimension measurement method are similar; (A1) regulate all parts of mounting hardware part, CCD camera assembly is installed on the camera mounting blocks, regulates horizontal adjustment plate and vertical adjustable plate; Make CCD camera assembly and backlight height roughly the same, measured workpiece is between imaging system and the backlight.(A2) the strict fixation workpiece position of at every turn putting, the accurate location by locating piece is realized workpiece supplies power to backlight through the 1.5V direct current.(A3) system connects the back images acquired, and its degree of comparing is strengthened, and noise filtering obtains the image border; Then the edge is carried out match, obtain the pixel value of institute's match edge line according to the algorithm of exploitation through least square method.(A4) whether qualified detect part according to pixel value zone of living in; Adopt the test specimen of upper and lower dimension limit to obtain upper and lower limit pixel value; Judge whether the accessory size of surveying is in the dimensional tolerance range; If the edge contour pixel value that measured piece records is if between upper and lower limit pixel value, then measured piece is qualified, otherwise defective.
The present invention not only can realize the judgement of appearance profile dimensional measurement and tolerance range; Also can accomplish the measurement of fine through-hole aperture; After being equipped with special-purpose accessory, can realize the measurement of tubaeform bottom land width; The said corresponding accessory of measurement that can accomplish tubaeform bottom land width is meant corresponding gauge head, and it is in full accord that gauge head shape and tubaeform groove get shape, but width is slightly larger than the greatest limit width of groove.
The present invention is further improved to be, comprises base plate, locating piece, riser, backlight, imaging system, horizontal adjustment plate, vertical adjustable plate based on CMOS machine vision part dimension measurement system; Said imaging system comprises CCD camera assembly and camera mounting blocks; Said locating piece is fixedly mounted on the said base plate, and said locating piece can be changed according to different part shapes, can realize tested part is better located and measured; Said riser passes through screw retention on said locating piece; Said backlight is connected on the riser; Said imaging system comprises CCD camera assembly, camera mounting blocks; Said CCD camera assembly comprises eyepiece, object lens, lens barrel, CMOS camera, and said CMOS camera has USB interface, and USB mouth direct plugging-in CMOS camera fixing is at the CCD camera assembly tail end; Said CCD camera assembly links to each other with said vertical adjustable plate through the camera mounting blocks; Said horizontal adjustment plate is fixedly mounted on the said base plate; Said vertical adjustable plate is installed on the said horizontal adjustment plate; On the said horizontal adjustment plate track is arranged, said vertical adjustable plate can move on said leveling board through track; Said vertical adjustable plate is provided with track, and said CCD camera assembly can move up and down on said vertical adjustable plate through said camera mounting blocks.When measuring like said step, tested profile can make the zone line that edge of work profile is imaged on image of surveying through horizontal adjustment plate and the vertically adjustment of adjustable plate, adapts to the dimensional measurement requirement of different parts thus; The sharpness of imaging can be passed through the installation site of adjustment mounting blocks and camera mounting blocks, thereby the distance that changes measured workpiece and imaging system realizes.
A kind of part dimension measurement system of the present invention based on the CMOS machine vision; Through experimental analysis, this system's repeatability precision is high, and the linearity is good; The measuring precision receives time and Influence of Temperature little, and measuring accuracy can reach the requirement of micron order measuring accuracy; This system can be used in online part dimension measurement, good economy performance.
The invention has the beneficial effects as follows: the present invention can realize non-cpntact measurement, can reach reliability and measuring accuracy preferably, be equipped with special-purpose loading and unloading system after; Can also be conveniently implemented in line measures; And it is simple in structure to be somebody's turn to do invention, low cost of manufacture, high efficiency; Flexibly, measure the restriction that does not receive accessory size basically; Not only can realize the appearance profile dimensional measurement, also can accomplish the inside diameter measurement of small through hole; Be equipped with the measurement that can realize tubaeform bottom land width behind the special-purpose accessory.
Description of drawings
Fig. 1 is measuring system overall framework figure;
Fig. 2 is the overall construction drawing of measuring system;
Fig. 3 is the whether qualified schematic diagram of check accessory size;
Fig. 4 is fine small through hole inside diameter measurement schematic diagram when being;
Fig. 5 is that tubaeform groove groove width is measured sectional view;
Fig. 6 is tubaeform groove groove width measuring principle figure
Among the figure: 1-base plate, 2-locating piece, 3-riser, 4-backlight, 5-measured workpiece, 6-object lens, 7-lens barrel, 8-camera mounting blocks, 9-horizontal adjustment plate, the vertical adjustable plate of 10-, 11-eyepiece, 12-CMOS camera.
Embodiment
Below in conjunction with specific embodiment, the present invention is elaborated.
Embodiment 1
A kind of based on CMOS machine vision Size Measuring System, comprise image capture module, image processing module and dimensional measurement module.Fig. 1 has provided the overall framework figure based on the automated part Size Measuring System of CMOS machine vision.Image capture module is accomplished the image collecting function to captured parts profile edge; Image processing module again through rim detection, obtains the edge of part image after the image of gathering is carried out binaryzation, Filtering Processing; The dimensional measurement module through feature extraction, calculate the pixel value of the target edges profile of surveying, through demarcating, this pixel value then can directly reflect the size of part.
Said image capture module structure such as Fig. 2; Comprise imaging system and mechanical part, mechanical part comprises base plate 1, locating piece 2, riser 3, backlight 4, horizontal adjustment plate 9, vertical adjustable plate 10, and said locating piece 2 is fixedly mounted on the said base plate 1; Said riser 3 passes through screw retention on said locating piece 2; Said backlight 4 is connected on the riser 3, and said horizontal adjustment plate 9 is fixedly mounted on the said base plate 1, and said vertical adjustable plate 10 is installed on the said horizontal adjustment plate 9.Said imaging system comprises CCD camera assembly, camera mounting blocks 8, and said CCD camera assembly links to each other with said vertical adjustable plate 10 through camera mounting blocks 8.
Said CCD camera assembly comprises eyepiece 11, object lens 6, lens barrel 7, CMOS camera 12, and said CMOS camera 12 has USB interface, and USB mouth direct plugging-in CMOS camera 12 is fixed on the CCD camera assembly tail end.
Said locating piece 2 front ends have draw-in groove, are complementary with the workpiece shape, are convenient to fixation workpiece.
On the said horizontal adjustment plate 9 track is arranged, said vertical adjustable plate 10 is installed on the said horizontal adjustment plate 9, and said vertical adjustable plate 10 can move on said horizontal adjustment plate 9 through track.
10 are provided with track on the said vertical adjustable plate, and said CCD camera assembly can move up and down on said vertical adjustable plate 10 through said camera mounting blocks 8.
The present invention provides a kind of part dimension measurement method simultaneously, may further comprise the steps:
(A1) regulate all parts of mounting hardware part; CCD camera assembly is installed on the camera mounting blocks 8; Regulate horizontal adjustment plate 9 and vertical adjustable plate 10, make CCD camera assembly and backlight 4 highly roughly the same, measured workpiece 5 is between imaging system and the backlight 4.
(A2) the strict fixation workpiece position of at every turn putting, the accurate location by locating piece 2 is realized workpiece supplies power to backlight 4 through the 1.5V direct current.
(A3) system connects the back images acquired, sets up grey level histogram, carries out histogram specification, and medium filtering is handled, and single threshold is cut apart, and arrangement for closed configuration is learned and handled and the Canny rim detection, through least square method the image border profile is carried out match; Calculate the pixel value of edge contour through the sub-VI function that adopts LabVIEW to provide,, after system is demarcated, can set up the corresponding relation of pixel value and size value according to the pixel value that calculates; According to the pixel value that calculates, just can calculate the pairing size value of this pixel value, then can accomplish the dimensional measurement of part.
The present invention also provides a kind of accessory size the whether qualified method of inspection, and the present invention not only can realize the appearance profile dimensional measurement, also can accomplish the measurement of fine through-hole aperture, after being equipped with gauge head (as shown in Figure 5), can realize the measurement of tubaeform bottom land width.
Said based on CMOS machine vision part dimension measurement system, comprise base plate 1, locating piece 2, riser 3, backlight 4, imaging system, horizontal adjustment plate 9, vertical adjustable plate 10; Said imaging system comprises CCD camera assembly and camera mounting blocks 8; Said locating piece 2 is fixedly mounted on the said base plate 1, and said locating piece 2 can be changed according to different part shapes, can realize tested part is better located and measured; Said riser 3 passes through screw retention on said locating piece 2; Said backlight 4 is connected on the riser 3; Said imaging system comprises CCD camera assembly, camera mounting blocks 8; Said CCD camera assembly comprises eyepiece 11, object lens 6, lens barrel 7, CMOS camera 12, and said CMOS camera 12 has USB interface, and USB mouth direct plugging-in CMOS camera fixing is at the CCD camera assembly tail end; Said CCD camera assembly links to each other with said vertical adjustable plate 10 through camera mounting blocks 8; Said horizontal adjustment plate 9 is fixedly mounted on the said base plate 1; Said vertical adjustable plate 10 is installed on the said horizontal adjustment plate 9; On the said horizontal adjustment plate 9 track is arranged, said vertical adjustable plate 10 can move on said leveling board 9 through track; Said vertical adjustable plate 10 is provided with track, and said CCD camera assembly can move up and down on said vertical adjustable plate 10 through said camera mounting blocks 8.When measuring like said step, tested profile can make the zone line that edge of work profile is imaged on image of surveying through horizontal adjustment plate 9 and the vertically adjustment of adjustable plate 10, adapts to the dimensional measurement requirement of different parts thus; The sharpness of imaging can be passed through the installation site of adjustment mounting blocks and camera mounting blocks, thereby the distance that changes measured workpiece and imaging system realizes.
Enumerate three measurements below, check embodiment 2-4 does more the present invention and is described in detail.
Embodiment 2
The method of inspection that whether qualified accessory size is.A kind of based on CMOS machine vision part dimension measurement system by base plate, locating piece, riser, backlight, imaging system, horizontal adjustment plate, vertically adjustable plate etc. is formed; Imaging system is made up of CCD camera assembly and camera mounting blocks; CCD camera assembly comprises eyepiece, object lens, lens barrel and CMOS camera, and said locating piece is fixedly mounted on the said base plate, and said riser passes through screw retention on said locating piece; Said backlight is connected on the riser; Said horizontal adjustment plate is fixedly mounted on the said base plate, and said vertical adjustable plate is installed on the said horizontal adjustment plate, on the said horizontal adjustment plate track is arranged; Said vertical adjustable plate is installed on the said horizontal adjustment plate, and said vertical adjustable plate can move on said leveling board through track.During measurement, the status requirement strict conformance that workpiece is put at every turn, the accurate location of realizing workpiece by locating piece.Backlight is fixed on the riser, through the 1.5V direct supply it is supplied power.After all parts are adjusted in installation, connected system, images acquired; Set up grey level histogram, carry out histogram specification, medium filtering is handled; Single threshold is cut apart, and arrangement for closed configuration is learned and handled and the Canny rim detection, through least square method the image border profile is carried out match; Calculate the pixel value of edge contour through the sub-VI function that adopts LabVIEW to provide,, after system is demarcated, can set up the corresponding relation of pixel value and size value according to the pixel value that calculates; According to the pixel value that calculates, just can calculate the pairing size value of this pixel value.
If whether the check tested part is qualified; Then only need to judge whether accessory size is in the dimensional tolerance range; Be illustrated in figure 3 as the whether qualified schematic diagram of check accessory size; By above-mentioned steps the test specimen of upper and lower dimension limit is measured corresponding upper and lower limit pixel value, demarcate the qualified zone 31 of measured workpiece, according to the corresponding relation of pixel value and size value; If the edge contour pixel value that measured piece records is if be positioned between the upper and lower limit pixel value (i.e. zone 31), then measured piece is qualified; If measured piece edge contour pixel value is positioned at the upper limit (workpiece is the longest) part overlength then more than the contour edge; If measured piece edge contour pixel value is positioned at lower limit (workpiece is the shortest) contour edge with the requirement not up to standard of next part length, part is defective.
Embodiment 3
The measuring method of fine through-hole aperture.A kind of based on CMOS machine vision part dimension measurement system by base plate, locating piece, riser, backlight, imaging system, horizontal adjustment plate, vertically adjustable plate etc. is formed; Imaging system is made up of CCD camera assembly and camera mounting blocks, and USB mouth direct plugging-in CMOS camera fixing is at the CCD camera assembly tail end.CCD camera assembly is installed on the camera mounting blocks; Roughly the same with the backlight height; Measured workpiece is between imaging system and the backlight; Tested profile makes the zone line that edge of work profile is imaged on image of surveying by the adjustment of horizontal adjustment plate and vertical adjustable plate, can adapt to the dimensional measurement requirement of different parts thus; The sharpness of imaging can be passed through the installation site of adjustment mounting blocks and camera mounting blocks, thereby the distance that changes measured workpiece and imaging system realizes.Compare with shape dimension measurement, system only need change different locating pieces and realize that the positioning instant of the workpiece of surveying can.The imaging system homing position is adjusted near the aperture during measurement, forms images to the image middle position, because the irradiation of system's backlight 4 with making the aperture clear-cut; Light obtains the image that a width of cloth comprises aperture photic zone 41 and workpiece shadow region 42 through the small through hole aperture, sees Fig. 4; Concrete measuring method is: after all parts are adjusted in installation, and connected system, images acquired; Set up grey level histogram, carry out histogram specification, medium filtering is handled; Single threshold is cut apart, and arrangement for closed configuration is learned and handled and the Canny rim detection, through least square method the image border profile is carried out match; Calculate the pixel value of small through hole edge contour through the sub-VI function that adopts LabVIEW to provide; According to the pixel value that calculates; System is being demarcated, can set up the corresponding relation of pixel value and small through hole diameter, the diameter of the corresponding different small through hole of pixels with different value.
Embodiment 4
The measuring method of tubaeform groove bottom land width.A kind of based on CMOS machine vision part dimension measurement system by base plate, locating piece, riser, backlight, imaging system, horizontal adjustment plate, vertically adjustable plate etc. is formed; Imaging system is made up of CCD camera assembly and camera mounting blocks; CCD camera assembly comprises eyepiece, object lens, lens barrel and CMOS camera; Said locating piece is fixedly mounted on the said base plate, and on said locating piece, said backlight is connected on the riser said riser through screw retention; Said horizontal adjustment plate is fixedly mounted on the said base plate; Said vertical adjustable plate is installed on the said horizontal adjustment plate, on the said horizontal adjustment plate track is arranged, and said vertical adjustable plate can move on said leveling board through track.When measuring tubaeform groove bottom land width; Need to be equipped with corresponding gauge head 51 (shape of gauge head 51 shapes and tubaeform groove is in full accord, but width is slightly larger than the greatest limit width of groove), measure schematic diagram such as Fig. 5 of tubaeform bottom land width; Because in the process of processing; Point of a knife always has certain fillet, and the bottom land that is therefore processed can not definitely be the right angle, and present existing dimension measurement method is difficult to realize the accurate measurement of tubaeform bottom land width.Like Fig. 5, during measurement, special-purpose accessory be gauge head 51 move to notch near; Slit between CMOS camera aiming gauge head 51 and the workpiece notch, captured image effect such as Fig. 6 are because the slit between backlight 4 irradiation gauge heads 51 and the workpiece notch; Light is through the slit, and the gap area of clapping is clear zone 61 (photic zone), and the width in clear zone 61 is by the width decision in gauge head and bottom land slit; The clear zone width that image shows is big more, shows that then the slit of gauge head and bottom land width is big more, and the numerical value of bottom land width is just big more; According to the corresponding relation of pixel value and size value, can obtain the bottom land width.
Above content is to combine concrete embodiment that the present invention is done further to specify, and can not assert that specific embodiment of the present invention is only limited to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, any type of simple deduction or equivalence replacement all fall within protection scope of the present invention.
Claims (10)
1. one kind based on CMOS machine vision part dimension measurement system, it is characterized in that, comprises image capture module, image processing module and dimensional measurement module; Said image capture module is accomplished the IMAQ to captured parts profile edge; Image processing module again through rim detection, obtains the edge of part image after the image of gathering is carried out binaryzation, Filtering Processing; The dimensional measurement module through feature extraction, calculate the pixel value of the target edges profile of surveying, through demarcating, this pixel value then can directly reflect the size of part.
2. as claimed in claim 1 based on CMOS machine vision part dimension measurement system; It is characterized in that; Said image capture module comprises imaging system and mechanical part, and said mechanical part comprises base plate, locating piece, riser, backlight, horizontal adjustment plate, vertical adjustable plate, and said locating piece is fixedly mounted on the said base plate; Said riser passes through screw retention on said locating piece; Said backlight is connected on the riser, and said horizontal adjustment plate is fixedly mounted on the said base plate, and said vertical adjustable plate is installed on the said horizontal adjustment plate.
3. as claimed in claim 2ly it is characterized in that based on CMOS machine vision part dimension measurement system said imaging system comprises CCD camera assembly, camera mounting blocks, said CCD camera assembly links to each other with said vertical adjustable plate through the camera mounting blocks.
4. as claimed in claim 3 based on CMOS machine vision part dimension measurement system; It is characterized in that; Said CCD camera assembly comprises eyepiece, object lens, lens barrel, CMOS camera, and said CMOS camera is a USB mouth direct plugging-in CMOS camera, and said CMOS camera fixing is at the CCD camera assembly tail end.
5. as claimed in claim 2ly it is characterized in that based on CMOS machine vision part dimension measurement system said locating piece front end has draw-in groove, be complementary, be convenient to fixation workpiece with the workpiece shape.
6. as claimed in claim 2 based on CMOS machine vision part dimension measurement system; It is characterized in that; On the said horizontal adjustment plate track is arranged, said vertical adjustable plate is installed on the said horizontal adjustment plate, and said vertical adjustable plate can move on said horizontal adjustment plate through track.
7. as claimed in claim 2ly it is characterized in that based on CMOS machine vision part dimension measurement system said vertical adjustable plate is provided with track, said CCD camera assembly can move up and down on said vertical adjustable plate through said camera mounting blocks.
8. the part dimension measurement method of inspection based on the CMOS machine vision is characterized by: comprise image capture module, image processing module and dimensional measurement module; Said image capture module is accomplished the IMAQ to captured parts profile edge; Image processing module again through rim detection, obtains the edge of part image after the image of gathering is carried out binaryzation, Filtering Processing; The dimensional measurement module through feature extraction, calculate the pixel value of the target edges profile of surveying, through demarcating, this pixel value then can directly reflect the size of part; Utilization CMOS technology is carried out the accurate non-cpntact measurement of spare part outside measurement.
9. the part dimension measurement method of inspection as claimed in claim 8 is characterized by: conversion locating piece type or measurement accessory, can realize the measurement in different part small through hole aperture.
10. the part dimension measurement method of inspection as claimed in claim 8 is characterized by: be equipped with corresponding gauge head, can realize the accurate measurement of tubaeform groove bottom land width.
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