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CN102482481B - Resin compositions, resin sheet, prepreg, metal-clad laminate, printed wiring board, and semiconductor device - Google Patents

Resin compositions, resin sheet, prepreg, metal-clad laminate, printed wiring board, and semiconductor device Download PDF

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Publication number
CN102482481B
CN102482481B CN201080031042.1A CN201080031042A CN102482481B CN 102482481 B CN102482481 B CN 102482481B CN 201080031042 A CN201080031042 A CN 201080031042A CN 102482481 B CN102482481 B CN 102482481B
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China
Prior art keywords
mentioned
resin
weight
resin combination
printed wiring
Prior art date
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Expired - Fee Related
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CN201080031042.1A
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Chinese (zh)
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CN102482481A (en
Inventor
大东范行
森清治
村上阳生
飞泽晃彦
小俣浩
正木隆义
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Filing date
Publication date
Priority claimed from JP2009172630A external-priority patent/JP5703547B2/en
Priority claimed from JP2009264857A external-priority patent/JP5589363B2/en
Priority claimed from JP2009265256A external-priority patent/JP5589364B2/en
Priority claimed from JP2010038652A external-priority patent/JP2011173985A/en
Priority claimed from JP2010044145A external-priority patent/JP5703570B2/en
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN102482481A publication Critical patent/CN102482481A/en
Application granted granted Critical
Publication of CN102482481B publication Critical patent/CN102482481B/en
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Provided are resin compositions which satisfactorily infiltrate into base materials and with which it is possible to produce a prepreg, a metal-clad laminate, and a printed wiring board that have excellent properties such as low warpage, flame retardancy, low thermal expansion, drillability, and resistance to desmear. Also provided are a resin sheet produced using one of the resin compositions, a prepreg produced using one of the resin compositions, a metal-clad laminate produced using one of the resin compositions or the prepreg, a printed wiring board produced using at least one of the metal-clad laminate, the prepreg, and the resin compositions, and a semiconductor device having excellent performance produced using the printed wiring board. The first of the resin compositions comprises an epoxy resin, a first inorganic filler of an indefinite shape, and a second inorganic filler which differs in average particle diameter from the first inorganic filler and in which the average particle diameter is 10-100 nm. The second of the resin compositions comprises an epoxy resin, fine silicone rubber particles having an average particle diameter of 1-10 [mu]m, fine boehmite particles having an average particle diameter of 0.2-5 [mu]m, and silica nanoparticles having an average particle diameter of 10-100 nm.

Description

Resin combination, resin sheet, prepreg, metal-clad, printed wiring board and semiconductor device
Technical field
The present invention relates to resin combination, resin sheet, prepreg, metal-clad, printed wiring board and semiconductor device.
Background technology
In recent years, along with the requirement such as multifunction of e-machine, the high-density lamination of electronic unit and then high-density installation etc. are developed.Be accompanied by this, the printed wiring board etc. of the reply high-density installation used in them, with since compared with, its small-sized slimming, densification and multiple stratification more obtain propelling.
Therefore, for printed wiring board or metal-clad, not only require that it meets the basic demands such as flame retardant resistance, and require that there is following characteristic.That is, (1) is in order to tackle the decline of substrate self rigidity caused by slimming, requires that low heat expansion property or low warpage properties are excellent, by Reflow Soldering on metal-clad or printed wiring board during interconnecting piece size distortion or warpage little; (2) in order to tackle the multiple stratification of printed wiring board, requiring that de-smear during shikishima plating process is excellent, fully can guarantee the powered of upper strata metal line and lower metal; (3) in order to the production that answer up is a large amount of, require the excellences such as drill processability, productivity is high.
The prepreg used in the manufacture of printed wiring board normally makes in the following way: the resin combination that is principal constituent with heat-curing resins such as epoxy resin be dissolved in solvent and make varnish, make it flood in the substrate and carry out heat drying, making prepreg thus.In the past, in order to improve the thermotolerance, low heat expansion property, low warpage properties, de-smear patience etc. of prepreg, plywood and printed wiring board, the resin combination containing inorganic filling material is used to make prepreg.In addition, in order to improve the drill processability etc. of prepreg, the resin combination containing flexible composition is used to make prepreg.
Such as, disclosed in patent documentation 1, the feature of resin combination is, comprises: epoxy resin, solidifying agent, inorganic filling material containing aluminium hydroxide or spherical silicon dioxide and aluminium hydroxide; Have nucleocapsid structure, and shell part contains the flexible composition be made up of a kind of micropartical, described micropartical is made up of the resin mixed with above-mentioned epoxy resin, and the thermalexpansioncoefficientα on thickness (Z) direction under solid state zbe less than 48.Record the dimensional stability that uses plywood made by above-mentioned resin combination in patent documentation 1 and perforate processibility good, the generation that perforate adds the be full of cracks in man-hour receives the content of suppression.
Again, disclose in patent documentation 2 and have: using aluminium hydroxide-boehmite complex body as must the prepreg of the hot curing resin composition that contains of composition and substrate combination.In the technology that patent documentation 2 is recorded, in order to tackle the high temperature of Reflow Soldering temperature, use as inorganic filling material the inorganic filling material that the thermotolerance such as boehmite or aluminium hydroxide-boehmite complex body is high.
Again, the technology having the packing material of filling at communicating pores and/or the recess of base material is disclosed in patent documentation 3.Specifically, to prevent the technology chapping or improve for the purpose of drill processability in the base material being filled with packing material, disclose the aqueous packing material at least containing solidifying agent, mineral filler, organic filler and fluid resin.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2009-74036 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2004-59643 publication
Patent documentation 3: Japanese Unexamined Patent Publication 2007-250966 publication
Summary of the invention
The problem that invention will solve
But contain in a large number in the resin composition Chinese varnish of inorganic filling material micropartical or flexible ingredient microparticles, atomic dispersiveness is easily impaired, makes viscosity (thixotroping) uprise.Therefore, be difficult to make the resin combination of substantial amount to impregnated in base material, and be difficult to make micropartical homogeneous impregnation in base material.There is following problem in result: the pressure caused due to the concavo-convex of prepreg and micropartical is uneven, easily produces resin and be separated with atomic, gained metal-clad produces muscle shape spot.
Again, when using as unbodied inorganic filling materials such as boehmites, there is following problem: the mobility especially easily producing resin composition Chinese varnish declines, and is difficult to highly-filled inorganic filling material.
The present invention completes in view of above-mentioned practical situation, its object is to, a kind of well immersion to base material is provided, and the resin combination of characteristic characteristics such as () such as low warpage properties, flame retardant resistance, low heat expansion property, drill processability and de-smear patience of being given by packing material excellent prepreg, metal-clad and printed wiring board can be made.
Another object of the present invention is to, provide: use the resin sheet made by above-mentioned resin combination; Use the prepreg that above-mentioned resin combination makes; Use the metal-clad that above-mentioned resin combination or above-mentioned prepreg make; Use at least any one printed wiring board made in above-mentioned metal-clad, above-mentioned prepreg and above-mentioned resin combination; And the semiconductor device of the excellent performance using above-mentioned printed wiring board to make.
Solve the means of problem
Above-mentioned purpose is the present invention of being recorded by following (1) ~ (27) and reaches.
(1) resin combination, for the formation of plywood, is characterized in that, contains: epoxy resin; Unbodied first inorganic filling material; And median size and its median size different from above-mentioned first inorganic filling material is second inorganic filling material of 10 ~ 100nm.
(2) as the resin combination of above-mentioned (1), wherein, the content of above-mentioned second inorganic filling material is 0.5 ~ 5 % by weight of above-mentioned resin combination total amount.
(3) as the resin combination of above-mentioned (1) or (2), wherein, use and above-mentioned second inorganic filling material is scattered in prepared by the slurry of organic solvent in advance.
(4) resin combination any one of above-mentioned (1) to (3), wherein, above-mentioned second inorganic filling material is silicon-dioxide.
(5) resin combination any one of above-mentioned (1) to (4), wherein, above-mentioned first inorganic filling material is boehmite.
(6) resin combination any one of above-mentioned (1) to (5), wherein, the median size of above-mentioned first inorganic filling material is 0.5 ~ 5 μm.
(7) resin combination any one of above-mentioned (1) to (6), wherein, the content of above-mentioned first inorganic filling material is 20 ~ 65 % by weight of above-mentioned resin combination total amount.
(8) resin combination any one of above-mentioned (1) to (7), wherein, also comprises the 3rd inorganic filling material that median size is 0.2 ~ 3 μm.
(9) as the resin combination of above-mentioned (8), wherein, the maximum particle diameter of above-mentioned 3rd inorganic filling material is less than 10 μm.
(10) as the resin combination of above-mentioned (8) or (9), wherein, the content (w2) of above-mentioned second inorganic filling material is 0.02 ~ 1.5 with the weight ratio (w2/w3) of the content (w3) of above-mentioned 3rd inorganic filling material.
(11) resin combination any one of above-mentioned (1) to (10), wherein, the content (w1) of above-mentioned first inorganic filling material is 0.02 ~ 0.5 with the weight ratio (w2/w1) of the content (w2) of above-mentioned second inorganic filling material.
(12) resin combination any one of above-mentioned (1) to (11), wherein, also containing cyanate ester resin.
(13) resin combination any one of above-mentioned (1) to (12), wherein, at least one selected in the group that above-mentioned epoxy resin is made up of biphenyl dimethylene type epoxy resin, phenolic resin varnish type epoxy resin, naphthalene modification cresol novolac epoxy and anthracene type epoxy resin.
(14) resin combination, is characterized in that, contains: epoxy resin; Median size is the polysiloxane rubber micropartical of 1 μm ~ 10 μm; Median size is the boehmite micropartical of 0.2 μm ~ 5 μm; And median size is the Nano particles of silicon dioxide of 10nm ~ 100nm.
(15) as the resin combination of above-mentioned (14), wherein, above-mentioned polysiloxane rubber micropartical is with the coated nucleocapsid structure particle of polysilicone by the core portion that is made up of polysiloxane rubber.
(16) as the resin combination of above-mentioned (14) or (15), wherein, the median size of above-mentioned Nano particles of silicon dioxide is more than 40nm and below 100nm.
(17) resin combination any one of above-mentioned (14) to (16), wherein, also containing cyanate ester resin.
(18) resin combination any one of above-mentioned (14) to (17), wherein, also containing maleimide resin.
(19) resin combination any one of above-mentioned (14) to (18), wherein, at least one selected in the group that above-mentioned epoxy resin is made up of biphenyl aralkyl-type epoxy resin, naphthalene framework modification epoxy resin and cresol novolak type epoxy resin.
(20) resin sheet, is characterized in that, base material is formed the resin layer that the resin combination any one of above-mentioned (1) to (19) forms and forms.
(21) prepreg, is characterized in that, is formed in the substrate by resin combination dipping any one of above-mentioned (1) to (19).
(22) metal-clad, is characterized in that, is immersed at least one side of the resin impregnation substrate layer of base material, has tinsel at resin combination any one of above-mentioned (1) to (19).
(23) as the metal-clad of above-mentioned (22), wherein, by at least one side of the prepreg in above-mentioned (21) or at least one side laminated metal paper tinsel at the duplexer by overlapping for this prepreg two panels, and carry out heating and pressurizing and obtain.
(24) printed wiring board, is characterized in that, the metal-clad of above-mentioned (22) or (23) is used for internal layer circuit substrate and forms.
(25) printed wiring board, it is on internal layer circuit, the prepreg of above-mentioned (21) is used for insulation layer and forms.
(26) printed wiring board, it is on internal layer circuit, resin combination any one of above-mentioned (1) to (19) is used for insulation layer and forms.
(27) semiconductor device, is characterized in that, on printed wiring board any one of above-mentioned (24) to (27), semiconductor element mounted thereon forms.
(invention effect)
Be first resin combination of the present invention of second inorganic filling material of 10 ~ 100nm by using combination containing unbodied first inorganic filling material and median size different from this first inorganic filling material with median size, the varnish containing unbodied first inorganic filling material can be obtained when not damaging mobility, the warpage of metal-clad can be suppressed.
Again, by using second resin combination of combination containing polysiloxane rubber micropartical, boehmite particle and Nano particles of silicon dioxide, can obtain with the state of low-viscosity in a large number containing the varnish of above-mentioned three kinds of particles, well immersion to base material of above-mentioned resin combination.Again, by using above-mentioned second resin combination, the metal-clad that the generation of surperficial muscle shape spot is considerably less can be obtained.
Use the excellents such as the flame retardant resistance of the resin sheet made by above-mentioned resin combination, prepreg and metal-clad, low heat expansion property, drill processability, low warpage properties and de-smear patience.And then, use at least one in above-mentioned metal-clad, above-mentioned prepreg, above-mentioned resin sheet and above-mentioned resin combination, the printed wiring board of availability excellence.Again, according to the present invention, above-mentioned printed wiring board is used, the semiconductor device of availability excellence.
Accompanying drawing explanation
The sketch chart of one example of the dip coated equipment that Fig. 1 uses when being and representing and manufacture prepreg of the present invention.
Fig. 2 is the sketch chart of an example of the manufacture method representing metal-clad of the present invention.
Fig. 3 is the sketch chart of another example of the manufacture method representing metal-clad of the present invention.
Fig. 4 is: the photo that the photo that (1) is the metal foil layer surface of the metal-clad obtained in shooting Embodiment B 1, (2) are the metal foil layer surface of the metal-clad obtained in shooting comparative example B1, (3) are the figure be described the photo on the metal foil layer surface of metal-clad.
Fig. 5 is: the photo that the photo that (1) is the metal foil layer surface of the metal-clad obtained in shooting reference example C1, (2) are the metal foil layer surface of the metal-clad obtained in shooting reference comparative example C1, (3) are the figure be described the photo on the metal foil layer surface of metal-clad.
Fig. 6 is: the photo that the photo that (1) is the metal foil layer surface of the metal-clad obtained in shooting reference example D1, (2) are the metal foil layer surface of the metal-clad obtained in shooting reference Comparative Example D 1, (3) are the figure be described the photo on the metal foil layer surface of metal-clad.
Fig. 7 is the photo of the section of the metal-clad obtained in shooting reference example E1.
Fig. 8 is the photo of the section of the metal-clad obtained in shooting reference example E9.
Embodiment
Below, to resin combination of the present invention and use the resin sheet of this resin combination, prepreg, metal-clad, printed wiring board and semiconductor device to be described.
First, resin combination of the present invention is described.
Even if the first ~ five resin combination of the present invention contains packing material with height ratio, the mobility of the varnish of this resin combination and solvent also can be suppressed to decline.Therefore, well immersion in base material of resin combination of the present invention.Its result is, the effect that resin combination of the present invention obtains by using packing material is high, such as, the effect improving the characteristics such as the low warpage properties of prepreg, plywood or printed wiring board, flame retardant resistance, low heat expansion property, drill processability and de-smear patience is high.
The varnish of resin combination of the present invention is under the state guaranteeing mobility, and the reason that namely this varnish can contain packing material with height ratio under the state of low-viscosity thinks as follows.First, resin combination of the present invention contains multiple packing material particle.This different types of packing material particle contained in resin combination of the present invention is the packing material particle being selected as producing between its particle gravitation.Its result is, can contain each packing material particle in resin combination with high dispersion state, and the mobility of varnish declines and is suppressed.
First ~ five resin combination of the present invention has common concept as above.
In addition, in the present invention, the packing material particle under above-mentioned graviational interaction each other, both can exist with the state between particle with gap, also can exist with the state of adhering to (contact).When different sorts packing material particle be combined as the strong combination of above-mentioned graviational interaction when, packing material particle exists with the state of attachment each other, specifically, the state of the packing material particle such as having particle diameter little with the surface attachment of the large packing material particle of particle diameter exists.
Again, above-mentioned gravitation comprises by the surface potential of packing material particle (zeta-potential, the zeta current potential) gravitation produced, the gravitation produced by Van der Waals force, the gravitation etc. that produced by the chemical bonded refractory such as coupling agent treatment, the gravitation wherein preferably produced by surface potential.
[the first resin combination]
First resin combination of the present invention is the resin combination for the formation of plywood, it is characterized in that, containing epoxy resin, unbodied first inorganic filling material and median size, and its median size different from above-mentioned first inorganic filling material is second inorganic filling material of 10 ~ 100nm.
In the first resin combination containing above-mentioned epoxy resin, above-mentioned unbodied first inorganic filling material and above-mentioned second inorganic filling material, above-mentioned unbodied first inorganic filling material and above-mentioned second inorganic filling material (such as nano silicon) are attracted by the interaction produced by surface potential difference.Therefore, above-mentioned second inorganic filling material is present in around above-mentioned unbodied first inorganic filling material, and the second inorganic filling material shows the effect of the spacer as above-mentioned unbodied first inorganic filling material.Its result is, the mutual attractive force produced by the Van der Waals force acted between above-mentioned unbodied first inorganic filling material lowers, and prevents its aggegation.Thus, above-mentioned unbodied first inorganic filling material is included in the first resin combination with high dispersion state, suppresses the decline of varnish mobility.
As mentioned above, according to the present invention, unbodied inorganic filling material is used also not damage the mobility of varnish and suppress the resin combination of the warpage of prepreg or plywood even if can obtain.
First resin combination of the present invention contains epoxy resin.Thus, metal-clad or the printed wiring board of electrical characteristic excellence can be obtained.
Above-mentioned epoxy resin is not particularly limited, but is preferably not halogen atom-containing person in fact.Wherein, so-called " in fact not halogen atom-containing " refers to and allows following situation: from the halogen of the halogen set member used in the building-up process of epoxy resin, even if through halogen removal step, still remain in epoxy resin.Usually, in preferred epoxy, the content of halogen atom is no more than 30ppm.
As the epoxy resin of above-mentioned not halogen atom-containing in fact, include, for example: bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol E-type epoxy resin, bisphenol-s epoxy resin, bisphenol Z type epoxy resin (4,4 '-cyclohexadiene bisphenol-type epoxy resin), bis-phenol P type epoxy resin (4,4 '-(1,4)-benzene diisopropylidene) bisphenol-type epoxy resin), bis-phenol M type epoxy resin (4,4 '-(1,3-benzene diisopropylidene) bisphenol-type epoxy resin) etc. bisphenol-type epoxy resin; The phenolic resin varnish type epoxy resins such as phenol novolak type epoxy resin, cresol novolak type epoxy resin; Biphenyl type epoxy resin, xylylene type epoxy resin, phenol aralkyl type epoxy resin, biphenyl aralkyl-type epoxy resin, biphenyl dimethylene type epoxy resin, tris-phenol phenolic resin varnish type epoxy resin, 1,1, the Racemic glycidol ethers of 2,2-(four phenol) ethane, 3 officials can or 4 officials can the aryl alkene fundamental mode epoxy resin such as Racemic glycidol amine, tetramethyl biphenyl type epoxy resin; The naphthalene type epoxy resin such as naphthalene framework modification epoxy resin, methoxynaphthalene modification cresol novolak type epoxy resin, methoxynaphthalene dimethylene type epoxy resin; Anthracene type epoxy resin, phenoxy group type epoxy resin, dicyclopentadiene-type epoxy resin, norbornene-type epoxy resin, diamantane type epoxy resin, fluorenes type epoxy resin, by the fire-retarded epoxy resin etc. of above-mentioned epoxy resin halogenation.
A kind of epoxy resin in above-mentioned can be used alone, also can have the two or more epoxy resin of Different Weight molecular-weight average and use, also the prepolymer of one or more epoxy resin and epoxy resin can be used.
In these epoxy resin, at least one particularly preferably for selecting in the group that is made up of biphenyl dimethylene type epoxy resin, phenolic resin varnish type epoxy resin, naphthalene modification cresol novolac epoxy and anthracene type epoxy resin.By using these epoxy resin, moisture absorption scolding tin thermotolerance and the flame retardant resistance of resultant layer lamination and printed wiring board can be improved.
The content of above-mentioned epoxy resin is not particularly limited, but is preferably more than 5 % by weight, less than 60 % by weight of above-mentioned resin combination total amount.If content is lower than above-mentioned lower value, then the solidified nature of resin combination is had to decline, or, use this resin combination and situation that the wet fastness of the prepreg that obtains or printed wiring board declines.Again, if exceed above-mentioned higher limit, then the linear thermal expansion ratio of prepreg or printed wiring board is had to become large, or, the situation that thermotolerance declines.Particularly preferably the content of above-mentioned epoxy resin is more than 10 % by weight, less than 50 % by weight of resin combination total amount.
The weight average molecular weight of above-mentioned epoxy resin is not particularly limited, but is preferably 1.0 × 10 2above, 2.0 × 10 4below.If weight average molecular weight is lower than above-mentioned lower value, then there is the insulating resin layer surface using above-mentioned resin combination to be formed to produce the situation of stickiness, if exceed above-mentioned higher limit, then have the situation that the scolding tin thermotolerance of this insulating resin layer declines.By weight average molecular weight being set in above-mentioned scope, the balance of excellent above-mentioned characteristic can be obtained.
In the present invention, the weight average molecular weight of above-mentioned epoxy resin measures by example gel permeation chromatography (GPC), and defines as the weight molecular weight of polystyrene conversion.
First resin combination of the present invention contains unbodied first inorganic filler.Thus, the low heat expansion property of plywood or the printed wiring board using this resin combination to obtain, thermotolerance and drill processability can be improved.
As above-mentioned unbodied first inorganic filler, include, for example: broken silicon-dioxide, zinc borate, talcum, aluminium hydroxide, boehmite (alumina monohydrate that gibbsite modification is obtained) etc.
Wherein, aluminium hydroxide, boehmite is preferably.Its reason is, can further improve thermotolerance and the drill processability of plywood and the printed wiring board using resin combination to obtain.
The median size of above-mentioned first inorganic filler is not particularly limited, but is preferably 0.3 ~ 5 μm, is particularly preferably 0.5 ~ 5 μm, is more preferably 0.5 ~ 3 μm.If median size is in above-mentioned scope, then can obtain the highly-filled property of the first inorganic filling material and the excellent especially resin combination of mobility.
The mensuration of the median size of above-mentioned first inorganic filling material measures by laser diffraction and scattering method.By ultrasonic wave, inorganic filling material is scattered in water, (HORIBA manufactures to utilize laser diffraction formula particle size distribution device, LA-500), make the size-grade distribution of inorganic filling material with volume reference, its median particle diameter is measured as median size.Specifically, the median size of inorganic filling material is specified by D50.
The content of above-mentioned first inorganic filling material is not particularly limited, but is preferably 20 ~ 65 % by weight of above-mentioned resin combination total amount, is particularly preferably 25 ~ 55 % by weight.If content is in above-mentioned scope, then the balance of thermotolerance and mobility is excellent especially.
1% heat decomposition temperature of above-mentioned first inorganic filling material is preferably more than 260 DEG C, is particularly preferably more than 300 DEG C.Above-mentioned 1% heat decomposition temperature is defined as: utilize differential thermobalance (TG/DTA), with the heat-up rate of 10 DEG C/min, and temperature when reducing by 1% weight from initial weight.As first inorganic filling material of 1% heat decomposition temperature with more than 300 DEG C, include, for example boehmite etc.
First resin combination of the present invention contains the second inorganic filling material that median size and median size different from above-mentioned first inorganic filling material is 10 ~ 100nm.Thus, the decline of the varnish mobility produced when using above-mentioned unbodied first inorganic filling material can be suppressed.
As above-mentioned second inorganic filling material, include, for example: the fused silica obtained by the drying process such as combustion method, to be fallen the sol-gel silica etc. that the damp process such as method or gel method obtains by Shen.
From the dispersiveness that can improve the second inorganic fill agent material, and can suppress the decline aspect of varnish mobility further, the first resin combination preferably uses the slurry be scattered in advance in organic solvent by the second inorganic filling material to prepare.The slurry be scattered in advance in organic solvent by the silicon-dioxide of nano-scale is particularly preferably used to prepare.
By using this slurry be scattered in advance by second inorganic filling material (especially for silicon-dioxide) in organic solvent, the reason that the varnish mobility produced when using unbodied first inorganic filler can be suppressed to decline thinks as follows.First, easily there is aggegation in the nano size particles as nano-size silica etc., forms the situations such as secondary agglomeration more when being matched with in resin combination, but by using pulp-like person, above-mentioned secondary aggegation can be prevented, can prevent mobility from declining thus.Secondly, the difference of the surface potential of above-mentioned second inorganic filling material (silicon-dioxide of nano-scale) and the surface potential of above-mentioned unbodied first inorganic filler, can improve the effect preventing above-mentioned unbodied first inorganic filler aggegation.
The median size of above-mentioned second inorganic filling material is particularly preferably 15 ~ 90nm, most preferably is 25 ~ 75nm.If median size is in above-mentioned scope, then also can improve the highly-filled property of the second inorganic filling material in resin combination and the high workability of varnish.
Above-mentioned median size such as measures by ultrasonic vibration electric current (zeta-potential), ultrasonic-attenuation optical spectroscopy (size-grade distribution), laser diffraction and scattering method, dynamic light scattering method.
Such as, ultrasonic wave can be utilized to make inorganic filling material be scattered in water, (HORIBA manufactures to utilize dynamic light scattering formula size-grade distribution device, LB-550), make the size-grade distribution of inorganic filling material with volume reference, using its median particle diameter as median size, measure thus.Specifically, the median size of inorganic filling material is specified by D50.
The content of above-mentioned second inorganic filling material is not particularly limited, but is preferably 0.5 ~ 20 % by weight of above-mentioned resin combination total amount, is particularly preferably 1 ~ 10 % by weight, is more preferably 0.5 ~ 5 % by weight.If content is in above-mentioned scope, then immersion the and formability of the resin combination in prepreg is excellent especially.
The content (w1) of above-mentioned first inorganic filling material is not particularly limited with the weight ratio (w2/w1) of the content (w2) of above-mentioned second inorganic filling material, but is preferably 0.02 ~ 0.5, is particularly preferably 0.06 ~ 0.4.If weight ratio is in above-mentioned scope, then especially formability can be improved.
Though be not particularly limited, preferably the first resin combination contains the 3rd inorganic filling material that median size is 0.2 ~ 3 μm.By there is the 3rd inorganic filling material of above-mentioned median size and above-mentioned first inorganic filling material and the second inorganic filling material and use, thermotolerance and the dimensional stability of plywood and the printed wiring board using above-mentioned resin combination to obtain especially can be improved.Again, by the first inorganic filling material, the second inorganic filling material and the 3rd inorganic filling material are combinationally used, compared with the resin combination in the past sub-micron grade inorganic filling material of such as the 3rd inorganic filling material and the amorphous inorganic filling material of such as the first packing material combined, the immersion of resinous varnish can be improved.
The median size of above-mentioned 3rd inorganic filling material is particularly preferably 0.3 ~ 2.5 μm, most preferably is 0.4 ~ 1.5 μm.If median size is in above-mentioned scope, then especially can improve highly-filledization of the 3rd inorganic filler in resin combination and the balance of the workability such as the extrusion molding of prepreg using resin combination to obtain or the perforate processing of plywood.
The mensuration of the median size of above-mentioned 3rd inorganic filling material measures by laser diffraction and scattering method.Specifically, by the method identical with the first inorganic filling material, measure the median size of the 3rd inorganic filling material.
The maximum particle diameter of above-mentioned 3rd inorganic filler is not particularly limited, but is preferably less than 10 μm, is particularly preferably less than 5 μm.Thus, the drill bit damage rate during Drilling operation in printed wiring board making can be reduced.
As above-mentioned 3rd inorganic filler, can enumerate: silicon-dioxide, titanium oxide, silicon nitride, aluminium nitride, boron nitride, aluminum oxide etc.Wherein, be preferably silicon-dioxide, be particularly preferably spheroidal fused silicon-dioxide.Its reason is: this fused silica is low heat expansion property excellence compared with other inorganic filling material.Again, the manufacture method of above-mentioned spherical silicon dioxide is not particularly limited, and obtains by known method.As the manufacture method of above-mentioned spherical silicon dioxide, include, for example: dry type titanium dioxide silicon process, wet silicon dioxide method, sol-gel method etc.
The content (w2) of above-mentioned second inorganic filling material is not particularly limited with the weight ratio (w2/w3) of the content (w3) of above-mentioned 3rd inorganic filling material, but is preferably 0.02 ~ 1.5, is particularly preferably 0.05 ~ 1.2.If weight ratio is in above-mentioned scope, then the plywood time prepreg that employs resin combination is in addition stacked or the formability of printed wiring board excellent especially.
The specific surface area of above-mentioned 3rd inorganic filling material (being especially silicon-dioxide) is not particularly limited, but is preferably 1m 2/ more than g, 250m 2/ below g.If specific surface area exceedes above-mentioned higher limit, then have the easily aggegation each other of the 3rd inorganic filling material, the structure of resin combination becomes unstable situation.Again, if lower than above-mentioned lower value, then there is the situation being difficult to be filled in by the 3rd inorganic filling material in resin combination.In addition, specific surface area is obtained by BET method.
Above-mentioned 3rd inorganic filling material (especially for silicon-dioxide) uses after can utilizing in advance and carrying out surface treatment containing the silicane of functional group and/or alkyl silicon azane class to it.By implementing surface treatment in advance, the aggegation of the 3rd inorganic filling material can be suppressed, silicon-dioxide can be made to be scattered in well in resin combination of the present invention.Again, because the surperficial adherence of epoxy resin and the 3rd inorganic filling material improves, therefore, it is possible to obtain the insulation layer of mechanical strength.
As the silicane containing functional group in the above-mentioned silicane containing functional group and/or alkyl silicon azane class, known silicane can be used.Include, for example: epoxy radicals silicone hydride, styryl silane, methacryloxypropyl silane, acryloxy silane, hydrosulphonyl silane, N-butyl TSL 8330, N-ethylamino trimethoxysilane, N-dimethylaminopropyl Trimethoxy silane, N-phenyl-3-TSL 8330, 3-(N-allyl amino) propyl trimethoxy silicane, (Cyclohexylaminomethyl) triethoxyl silane, N-Cyclohexylamino propyl trimethoxy silicane, N-ethylamino isobutyl-methoxyl group diethoxy silane, (phenvlaminomethvl) methyl dimethoxysilane, N-phenvlaminomethvl triethoxyl silane, N-dimethylaminopropyl methyl dimethoxysilane, vinyl silanes, isocyanato silanes, sulfenyl silane (Sulfide Silanes), chloropropyl silane, ureido silane compound etc.
As abovementioned alkyl silazane class, include, for example: hexamethyldisilazane (HMDS), 1,3-divinyl-1,1,3,3-tetramethyl-disilazane, prestox three silazane, pregnancy basic ring three silazane etc.Wherein, as alkyl silicon azane class, be preferably hexamethyldisilazane (HMDS).
Being not particularly limited containing the silicane of functional group and/or the amount of alkyl silicon azane class when surface treatment carried out in advance to above-mentioned 3rd inorganic filling material (especially for silicon-dioxide), but relative to above-mentioned 3rd inorganic filling material 100 weight part, be preferably more than 0.01 weight part, below 5 weight parts.Be more preferably below more than 0.1 weight part, 3 weight parts.If exceed above-mentioned higher limit containing the silicane of functional group and/or the content of alkyl silicon azane class, then there is insulation layer to occur the situation of be full of cracks when manufacturing printed wiring board, if lower than above-mentioned lower value, then there is the situation that the bonding force of resinous principle and the 3rd inorganic filling material declines.
Utilize the silicane containing functional group and/or alkyl silicon azane class to carry out surface-treated method to above-mentioned 3rd inorganic filling material (being especially silicon-dioxide) to be in advance not particularly limited, but be preferably wet-format or dry type mode.Be particularly preferably wet-format.During by wet-format compared with dry type mode, wet-format can carry out even processing to the surface of above-mentioned 3rd inorganic filling material.
The content of above-mentioned 3rd inorganic filling material (being especially silicon-dioxide) is not particularly limited, but is preferably more than 20 % by weight, less than 85 % by weight of resin combination total amount.Be more preferably more than 25 % by weight, less than 75 % by weight.If the content of above-mentioned 3rd inorganic filling material lower than above-mentioned lower value, then has the linear thermal expansion ratio of the cured article of resin combination to increase, or the situation that water-intake rate increases.Again, if exceed above-mentioned higher limit, then due to the decline of resin combination mobility, the situation that the formability of insulating resin layer or prepreg etc. declines can be made.By being set in above-mentioned scope by the content of above-mentioned 3rd inorganic filling material, the coefficient of linear thermal expansion of the cured article of resin combination can be made to become below 35ppm.
In addition, in the present invention, so-called containing the content of composition relative to resin combination, refer to and will eliminate to dissolve and/or disperse the composition total amount after containing the solvent added for the purpose of composition to be set to 100 % by weight content calculated.
First resin combination is not particularly limited, but preferably containing cyanate ester resin.Thus, can further improve flame retardant resistance.
Above-mentioned cyanate ester resin is not particularly limited, and such as, by making halogen cyan compound and phenols or aphthols react, and carries out pre-polymerization materialization with methods such as heating as required and obtains.Again, so commercially available product of preparation can also be used.
As the kind of above-mentioned cyanate ester resin, be not particularly limited, include, for example: the bisphenol type cyanate ester resins etc. such as phenolic varnish type cyanate ester resin, bisphenol A cyanate ester resin, bisphenol E-type cyanate resin, tetramethyl bisphenol F cyanate resin.
Preferred above-mentioned cyanate ester resin has more than 2 cyanate ester based (-O-CN) in molecule.Include, for example: 2, 2 '-bis-(4-cyanatophenyl) isopropyl alkane, 1, 1 '-bis-(4-cyanatophenyl) ethane, two (4-cyanato-3, 5-3,5-dimethylphenyl) methane, 1, two (4-cyanatophenyl-1-(1-methyl the ethylidene)) benzene of 3-, dicyclopentadiene-type cyanate, phenol novolak type cyanate, two (4-cyanatophenyl) thioether, two (4 cyanatophenyl) ether, 1, 1, 1-tri-(4-cyanatophenyl) ethane, three (4-cyanatophenyl) phosphorous acid ester, two (4-cyanatophenyl) sulfone, 2, two (4-cyanatophenyl) propane of 2-, 1, 3-, 1, 4-, 1, 6-, 1, 8-, 2, 6-or 2, 7-dicyan acyl-naphthaline, 1, 3, 6-tri-cyanato naphthalene, 4, 4-bis-cyanato biphenyl, and by cyanate ester resin that the polyatomic phenol of phenol novolak type, cresol novolak type etc. and halogen cyan react and obtain, make the cyanate ester resin etc. that the polynary aphthols of naphthols aralkyl-type and halogen cyan react and obtain.
Wherein, the flame retardant resistance of phenol novolak type cyanate ester resin and low heat expansion property excellence, control and the moisture-proof of the cross-linking density of 2,2 '-bis-(4-cyanatophenyl) isopropyl alkane and dicyclopentadiene-type cyanate are excellent in reliability.With regard to low heat expansion property aspect, be particularly preferably phenol novolak type cyanate ester resin.Again, also other cyanate ester resin, with one or more, can be not particularly limited.
Above-mentioned cyanate ester resin can be used alone, also can by cyanate ester resins different for weight average molecular weight and with two or more, or above-mentioned cyanate ester resin and its prepolymer is used.
Above-mentioned cyanate ester resin is normally such as carried out trimerizing by reacting by heating etc. and obtains by above-mentioned prepolymer, is the formability in order to adjust resin combination, mobility and preferably using.
Above-mentioned prepolymer is not particularly limited, and such as, when using trimerization rate to be the prepolymer of 20 ~ 50 % by weight, can show good formability, mobility.
The content of above-mentioned cyanate ester resin is not particularly limited, but preferably counts 5 ~ 60 % by weight with the solids component benchmark of resin combination total amount, is more preferably 10 ~ 50 % by weight, is particularly preferably 10 ~ 40 % by weight.If content is in above-mentioned scope, then cyanate ester resin can effectively show thermotolerance and flame retardant resistance.If the content of cyanate ester resin is lower than above-mentioned lower limit, then there is thermal expansivity to become large, the situation that thermotolerance declines, if exceed above-mentioned higher limit, then have the situation of the strength degradation of the prepreg used made by resin combination.
Again, though be not particularly limited, preferably the first resin combination contains coupling agent.Thus, the physical strength using resin combination and the plywood that obtains or printed wiring board can be improved.
Especially, when using boehmite as above-mentioned first inorganic filler, preferably use aromatic amine base silane as coupling agent.Thus, the effect that is multiplied of boehmite and aromatic amine base silane can be utilized, the water-absorbent of the cured article of resin combination is declined further, and in the test of the multilayer printed-wiring board using this resin combination to obtain after moisture absorption process, the adherence between tinsel and prepreg, prepreg is excellent.
As above-mentioned aromatic amine base silane, include, for example: the secondary aromatic amino base silanes such as N-phenyl-3-TSL 8330, (phenvlaminomethvl) methyl dimethoxysilane, N-phenvlaminomethvl triethoxyl silane; And the primary aromatic amine such as 3-(m-aminophenyl oxygen base) propyl trimethoxy silicane, p-aminophenyl Trimethoxy silane, m-aminophenyl base Trimethoxy silane.Wherein, the secondary aromatic amino base silanes such as N-phenyl-3-TSL 8330 are preferably.By using this aromatic amine base silane, the decline of combining the rate of moisture absorption brought with boehmite can not only be obtained, and in gum residue removal step after the laser radiation that can obtain in multilayer printed-wiring board manufacturing process, the resin combination of de-smear excellence.
The content of above-mentioned coupling agent (being especially aromatic amine base silane) is not particularly limited, but relative to above-mentioned first inorganic filling material 100 weight part, is preferably more than 0.05 weight part, below 5 weight parts.Be more preferably below more than 0.2 weight part, 2.5 weight parts.If the content of above-mentioned coupling agent exceedes above-mentioned higher limit, the situation of the formability decline that impregnated of the prepreg of the first resin combination of the present invention is then there is when the manufacture of plywood, if lower than above-mentioned lower value, then there is the situation that circuit declines with the friction pull of the insulation layer formed by the first resin combination of the present invention.
First resin combination also can use phenol system solidifying agent.As phenol system solidifying agent, the known usual resin such as phenol resol resins, alkylphenol novolac resin, bisphenol A novolac resin, dicyclopentadiene type phenol resin, new phenol (Xyloc) type resol, terpene modified resol, polyvinylphenol class can be used alone, or be used in combination of two or more.
The use level of above-mentioned phenol system solidifying agent is not particularly limited, but to be preferably with the equivalence ratio (phenolic hydroxyl group equivalent/epoxide equivalent) of epoxy resin lower than 1.0 and more than 0.1.Thus, there is not the residual of unreacted phenol system solidifying agent, the plywood using resin combination to obtain or the moisture absorption thermotolerance of printed wiring board improve.And then when needing strict moisture absorption thermotolerance, above-mentioned equivalence ratio is particularly preferably the scope of 0.2 ~ 0.5.Again, resol not only can be used as solidifying agent and plays a role, and can promote solidification that is cyanate ester based and epoxy group(ing).
As required, the first resin combination can add the additive beyond mentioned component in the scope not damaging characteristic.As the composition beyond mentioned component, include, for example: the curing catalysts such as imidazoles, triphenylphosphine and quaternary alkylphosphonium salt, the interfacial agents such as esters of acrylic acid, the tinting materials etc. such as dye well pigment.
In addition, when making resin sheet or making prepreg, resin combination of the present invention is dissolved in and makes varnish in solvent and use.The preparation method of above-mentioned varnish is not particularly limited, include, for example following method etc.: prepare epoxy resin, the first inorganic filling material and the second inorganic filling material dispersion slurry in a solvent, in this slurry, add the composition of other resin combination, and then add above-mentioned solvent and make it dissolve, mix.
As above-mentioned solvent, be not particularly limited, be preferably the solvent above-mentioned resin combination being shown to good solubility, include, for example: acetone, methyl ethyl ketone (MEK), pimelinketone (ANON), methyl iso-butyl ketone (MIBK) (MIBK), cyclopentanone, dimethyl formamide, N,N-DIMETHYLACETAMIDE, N-Methyl pyrrolidone etc.In addition, not causing in dysgenic scope, also Weak solvent can be used.
The solids component of the resin combination contained by above-mentioned varnish is not particularly limited, but is preferably 30 ~ 80 % by weight, is particularly preferably 40 ~ 70 % by weight.Thus, immersion to base material of resin combination can be improved.
[the second resin combination]
Below, the second resin combination of the present invention is described.
The feature of the second resin combination of the present invention is: be the boehmite micropartical of 0.2 μm ~ 5 μm and median size containing epoxy resin, median size be 1 μm ~ 10 μm polysiloxane rubber (シ リ コ mono-Application go system) micropartical, median size be the Nano particles of silicon dioxide of 10nm ~ 100nm.
In second resin combination, by by above-mentioned polysiloxane rubber micropartical, above-mentioned boehmite particle and above-mentioned Nano particles of silicon dioxide and with and be included in resin combination, in a large number contain above-mentioned three kinds of particles under the state that can be low-viscosity at the varnish of above-mentioned resin combination.Its reason is, have around the boehmite particle of front surface zeta-potential, selectivity attachment has the Nano particles of silicon dioxide of negative surperficial zeta-potential, the repulsion had between the polysiloxane rubber micropartical of the surperficial zeta-potential of same-sign and boehmite particle weakens, thus, even if comprise a large amount of particles, varnish also becomes low-viscosity.
Again, even if by using second resin combination also low containing packing material particle viscosity as above a large amount of, the prepreg that fully to be impregnated in by this resin combination in base material can be obtained.The flame retardant resistance of gained prepreg, low heat expansion property, drill processability and de-smear patience are excellent.
Again, use the metal-clad of the second resin combination as above and/or the prepreg containing this resin combination, varnish because of above-mentioned resin combination is low-viscosity and mobility is large, but also use due to above-mentioned resin combination and contain polysiloxane rubber micropartical, boehmite particle and Nano particles of silicon dioxide, therefore, the mobility of these particles and the balance of Resin Flow good, by the atomic buffering effect of polysiloxane rubber, the pressure produced because of particle is uneven less, and the muscle shape spot on surface is considerably less.
As long as above-mentioned polysiloxane rubber micropartical is the caoutchouc elasticity micropartical formed by organopolysiloxane, is then not particularly limited, include, for example: the micropartical be made up of polysiloxane rubber (organopolysiloxane cross-linked elastomer) itself; And by the nucleocapsid structure particle etc. in the coated core portion be made up of polysiloxane rubber of polysilicone.As above-mentioned polysiloxane rubber micropartical, can use: KMP-605, KMP-600, KMP-597, KMP-594 (SHIN-ETSU HANTOTAI's chemistry (strain) manufacture), the commercially available products such as Trefil E-500, Trefil E-600 (Dow Corning Toray (strain) manufacture).
The atomic median size of above-mentioned polysiloxane rubber is 1 ~ 10 μm, with regard to the aspect of immersion excellence, is preferably 1 ~ 5 μm.
The atomic content of above-mentioned polysiloxane rubber is not particularly limited, and preferably counts 5 ~ 50 % by weight with the solids component benchmark of resin combination total amount, with regard to immersion excellent aspect, is particularly preferably 10 ~ 40 % by weight.
Above-mentioned boehmite particle is the monohydrate of aluminum oxide, also can use AOH-30, AOH-60 (being Tesco (strain) to manufacture); Granular BMB series, tabular BMT series, Yi are Ji commercially available products such as Phosphonium sheet BMF series (be river and close lime industry (strain) manufacture).
The median size of above-mentioned boehmite particle is 0.2 ~ 5 μm, with regard to immersion excellent aspect, is preferably 0.5 ~ 4 μm.
The content of above-mentioned boehmite particle is not particularly limited, and preferably counts 5 ~ 50 % by weight with the solids component benchmark of resin combination total amount, with regard to immersion excellent aspect, is particularly preferably 10 ~ 40 % by weight.
The median size of above-mentioned Nano particles of silicon dioxide is 10 ~ 100nm, with regard to immersion aspect, is preferably 40 ~ 100nm.Its reason is, if median size is lower than 10nm, then, between the long filament cannot expanding base material, in addition, if be greater than 100nm, has the situation that cannot enter between long filament.
As above-mentioned Nano particles of silicon dioxide, be not particularly limited, such as can use by combustion methods such as VMC (Vaperized Metal Combution) method, PVS (Physical Vapor Synthesis) methods, by the Nano particles of silicon dioxide manufactured by the methods such as the scorification of broken silicon-dioxide flame melting, Shen Jiangfa, gel method.Wherein, VMC method is particularly preferably.Above-mentioned VMC method, refers to by dropping into Si powder in the chemical flame formed in oxygen-containing gas, after making it burn, is cooled and forms the method for silicon dioxide particles.In above-mentioned VMC method, by adjusting the particle diameter, input amount, flame temperature etc. of input Si powder, the particle diameter of adjustable gained silicon dioxide particles.
Again, the commercially available products such as NSS-5N (Tokuyama (strain) manufacture), Sicastar 43-00-501 (manufacture of Micromod company) can also be used.
The content of above-mentioned Nano particles of silicon dioxide is not particularly limited, but preferably counts 1 ~ 10 % by weight with the solids component benchmark of resin combination total amount, is particularly preferably 2 ~ 5 % by weight.If content is in above-mentioned scope, then immersion excellent especially.
The atomic content of above-mentioned polysiloxane rubber is not particularly limited relative to the weight ratio (weight of the atomic weight/Nano particles of silicon dioxide of polysiloxane rubber) of the content of above-mentioned Nano particles of silicon dioxide, but be preferably 1 ~ 15, be more preferably 1 ~ 10, be particularly preferably 2 ~ 5.
The content of above-mentioned boehmite particle is not particularly limited relative to the weight ratio (weight of the weight/Nano particles of silicon dioxide of boehmite particle) of the content of above-mentioned Nano particles of silicon dioxide, but is preferably 1 ~ 50, is particularly preferably 2 ~ 20.
If the atomic content of above-mentioned polysiloxane rubber relative in the above-mentioned scope of the weight ratio of the content of above-mentioned Nano particles of silicon dioxide, then especially can improve formability relative to the weight ratio of the content of above-mentioned Nano particles of silicon dioxide and the content of above-mentioned boehmite particle; If be greater than or less than above-mentioned scope, then immersion variation, easily causes that the scolding tin thermotolerance that causes because producing hole is abnormal, the decline of insulating reliability.
In addition, the median size of above-mentioned polysiloxane rubber micropartical, above-mentioned boehmite particle and above-mentioned Nano particles of silicon dioxide measures by such as laser diffraction and scattering method and dynamic light scattering method.Such as, ultrasonic wave is utilized to make particle dispersion in water, (HORIBA manufactures to utilize laser diffraction formula particle size distribution device, LA-500) or dynamic light scattering formula particle size distribution device (HORIBA manufacture, LB-550), the size-grade distribution of particle is measured, using its median particle diameter as median size with volume reference.Specifically, the median size of polysiloxane rubber micropartical, boehmite particle, Nano particles of silicon dioxide is by D50 (median particle diameter) defined.
And then resin combination of the present invention can contain the inorganic fillers such as silicon-dioxide, aluminium hydroxide, talcum in the scope of lossless characteristic.
Above-mentioned epoxy resin is not particularly limited, due to such as identical with above-mentioned first resin combination, therefore, in this description will be omitted.
In above-mentioned epoxy resin, at least one particularly preferably for selecting in the group that is made up of biphenyl aralkyl-type epoxy resin, naphthalene framework modification epoxy resin and cresol novolak type epoxy resin.By using this epoxy resin, the thermotolerance of gained prepreg, plywood and printed wiring board and flame retardant resistance are improved.
The content of above-mentioned epoxy resin is not particularly limited, but preferably counts 5 ~ 30 % by weight with the solids component benchmark of resin combination total amount.If content is lower than above-mentioned lower value, then the solidified nature of resin combination is had to decline, or the situation that the wet fastness of the prepreg obtained by this resin combination or printed wiring board declines.Again, if exceed above-mentioned higher limit, then the linear thermal expansion ratio of prepreg or printed wiring board is had to increase, the situation that thermotolerance declines.
The weight average molecular weight of above-mentioned epoxy resin is not particularly limited, but is preferably 40 ~ 18000.If weight average molecular weight is lower than above-mentioned lower limit, then there is the situation that glass transition temperature declines, if exceed above-mentioned higher limit, then have mobility to decline and the situation that cannot be impregnated in base material.By making weight average molecular weight be adjusted in above-mentioned scope, the immersion of excellence can be obtained.
Second resin combination is not particularly limited, but preferably containing cyanate ester resin.Thus, flame retardant resistance can be made to improve further.
Above-mentioned cyanate ester resin is not particularly limited, because concrete example is identical with above-mentioned first resin combination with content, therefore, in this description will be omitted.
Again, the second resin combination is not particularly limited, but preferably containing maleimide resin.Thus, thermotolerance can be made to improve.
Above-mentioned maleimide resin is not particularly limited, can enumerate: N, N '-(4,4 '-ditan) bimaleimide resin such as bismaleimides, two (3-ethyl-5-methyl-4-maleimide phenyl) methane, 2,2-two [4-(4-maleimidephenoxy) phenyl] propane.Again, other maleimide resin, with one or more, can also be not particularly limited.
Above-mentioned maleimide resin can be used alone, also can by maleimide resins different for weight average molecular weight and use, or above-mentioned maleimide resin and its prepolymer is used.
The content of above-mentioned maleimide resin is not particularly limited, but preferably counts 1 ~ 30 % by weight with the solids component benchmark of resin combination total amount, is particularly preferably 5 ~ 20 % by weight.
And the second resin combination can containing at least one selected in the group be made up of polyimide resin, cyanate resin, phenol resins and melamine resin.
Second resin combination can use phenol system solidifying agent.Phenol system solidifying agent is not particularly limited, because concrete example is identical with above-mentioned first resin combination with content, therefore, in this description will be omitted.
As required, the second resin combination can add the additive beyond mentioned component in the scope of lossless characteristic.Composition beyond mentioned component include, for example: the coupling agent such as epoxy silane coupling, cationic silane coupling agent, amino silicane coupling agent, titanic acid ester system coupling agent, silicone oil type coupling agent; Imidazoles, triphenylphosphine He the curing catalysts such as quaternary alkylphosphonium salt; The surface conditioners such as acrylic acid polymer; The tinting material such as dyestuff and pigment etc.
[the 3rd resin combination]
Below, the 3rd resin combination of the present invention is described.
The feature of the 3rd resin combination of the present invention is: be the polysiloxane rubber micropartical of 1 μm ~ 10 μm and median size containing epoxy resin, median size be the Nano particles of silicon dioxide of 10nm ~ 150nm.
By by polysiloxane rubber micropartical and Nano particles of silicon dioxide and with and be contained in resin combination, contain above-mentioned three kinds of particles in a large number under the state that can be low-viscosity at the varnish of above-mentioned resin combination.Its reason is, attracted each other with the Nano particles of silicon dioxide with negative surperficial zeta-potential by the poly-silica micropartical with front surface zeta-potential, even if containing a large amount of particle, varnish also becomes low-viscosity.
Even if as above a large amount of containing packing material particle the 3rd resin combination that also viscosity is low by using, the prepreg being fully impregnated with this resin combination in base material can be obtained.The flame retardant resistance of gained prepreg, low heat expansion property, drill processability and de-smear patience are excellent.
Again, use the 3rd resin combination as above and/or comprise the metal-clad of prepreg of this resin combination, varnish due to above-mentioned resin combination is low-viscosity and mobility is large, but also used by above-mentioned resin combination and contain polysiloxane rubber micropartical and Nano particles of silicon dioxide, the mobility of these particles and the balance of Resin Flow good, utilize the atomic buffering effect of polysiloxane rubber, can reduce pressure uneven because particle produces, therefore the muscle shape spot on surface is considerably less.
As long as above-mentioned polysiloxane rubber micropartical is the caoutchouc elasticity micropartical formed by organopolysiloxane, be then not particularly limited, because concrete example is identical with above-mentioned second resin combination with content, therefore, in this description will be omitted.
The median size of above-mentioned Nano particles of silicon dioxide is 10 ~ 150nm, with regard to immersion aspect, is preferably 40 ~ 100nm.Its reason is, if median size is lower than 10nm, then having cannot situation between expansion base material long filament, again, if be greater than 150nm, has the situation that cannot enter between long filament.
Above-mentioned Nano particles of silicon dioxide is not particularly limited, and because concrete example is identical with above-mentioned second resin combination with content, therefore omits the description.
In 3rd resin combination, the atomic content of above-mentioned polysiloxane rubber is not particularly limited relative to the weight ratio (weight of the atomic weight/Nano particles of silicon dioxide of polysiloxane rubber) of the content of above-mentioned Nano particles of silicon dioxide, but be preferably 1 ~ 50, be particularly preferably 2 ~ 20.If weight ratio is in above-mentioned scope, then especially formability can be improved.If weight ratio is greater than or less than above-mentioned scope, then immersion variation, easily causes that the scolding tin thermotolerance that causes because producing hole is abnormal, the decline of insulating reliability.
In addition, the median size of above-mentioned polysiloxane rubber micropartical and above-mentioned Nano particles of silicon dioxide measures by such as laser diffraction and scattering method and dynamic light scattering method.Ultrasonic wave is utilized to make particle dispersion in water, (HORIBA manufactures to utilize laser diffraction formula particle size distribution device, LA-500) or dynamic light scattering formula size-grade distribution (HORIBA manufacture, LB-550), the size-grade distribution of particle is measured, using its median particle diameter (D50) as median size with volume reference.
And then the 3rd resin combination can contain the inorganic filling materials such as boehmite, silicon-dioxide, aluminium hydroxide, talcum in the scope of lossless characteristic.
Above-mentioned epoxy resin is not particularly limited, and concrete example is identical with above-mentioned first resin combination.
In above-mentioned epoxy resin, at least one selected in the group be particularly preferably made up of biphenyl aralkyl-type epoxy resin, naphthalene framework modification epoxy resin and cresol novolak type epoxy resin.By using this epoxy resin, the thermotolerance of prepreg, plywood, printed wiring board and flame retardant resistance are improved.
About the content of epoxy resin, due to identical with above-mentioned second resin combination, therefore omit the description.
The weight average molecular weight of above-mentioned epoxy resin is not particularly limited, but is preferably 400 ~ 18000.If weight average molecular weight is lower than above-mentioned lower limit, then there is the situation that glass transition temperature declines, if exceed above-mentioned higher limit, then have mobility to decline, sometimes cannot be impregnated in base material.By making weight average molecular weight be adjusted in above-mentioned scope, the immersion of excellence can be obtained.
Though be not particularly limited, preferably the 3rd resin combination contains cyanate ester resin.Thus, flame retardant resistance can be made to improve further.
Above-mentioned cyanate ester resin is not particularly limited, because concrete example is identical with above-mentioned first resin combination with content, in this description will be omitted.
Again, though be not particularly limited, preferably the 3rd resin combination contains maleimide resin.Thus, thermotolerance can be made to improve.The concrete example of maleimide resin is identical with above-mentioned second resin combination.
The content of above-mentioned maleimide resin is not particularly limited, but preferably counts 1 ~ 30 % by weight with the solids component benchmark of the 3rd resin combination total amount, is more preferably 5 ~ 25 % by weight, and more preferably 5 ~ 20 % by weight.
And then the 3rd resin combination also can containing at least one selected in the group be made up of polyimide resin, cyanate resin, phenol resins and melamine resin.
3rd resin combination can use phenol system solidifying agent.Phenol system solidifying agent is not particularly limited, and its concrete example is identical with above-mentioned first resin combination with content.
3rd resin combination is identical with the second resin combination, as required, can add the additive beyond mentioned component in the scope of lossless characteristic.Composition beyond mentioned component is identical with the second resin combination.
[the 4th resin combination]
Below, the 4th resin combination of the present invention is described.
The feature of the 4th resin combination is: the barium sulfate particles and the inorganic filling material that containing epoxy resin, median size are 10nm ~ 150nm.
By make in composition epoxy resin containing median size be the barium sulfate particles of 10nm ~ 150nm, even if use the resinous varnish of above-mentioned resin combination for high viscosity state, also can contain inorganic filling material in a large number.Infer that its reason is, the barium sulfate particles of median size 10nm ~ 150nm enters the gap of the long filament of base material and the gap expanded between base material, thus can containing more substantial inorganic filling material than ever.
Again, by the combination with inorganic filling material, resinous varnish can be made to be the state of low-viscosity, can more substantial inorganic filling material to be contained.Infer that reason is that, by the relation with surperficial zeta-potential, the inorganic filling material attracted each other with barium sulfate particles, can make the viscosity of resinous varnish entirety reduce, even if thus containing a large amount of inorganic filling material, immersion also excellent.
Again, even if by using a large amount of four resin combination also low containing packing material particle viscosity as above, the prepreg being fully impregnated with this resin combination in base material also can be obtained.The flame retardant resistance of gained prepreg, low heat expansion property, drill processability and de-smear patience are excellent.
Again, use the 4th resin combination as above and/or comprise the metal-clad of prepreg of this resin combination, varnish due to above-mentioned resin combination is low-viscosity and mobility is large, but also used by above-mentioned resin combination and contain polysiloxane rubber micropartical and barium sulfate particles, therefore, the mobility of these particles and the balance of Resin Flow good.Again, when using resin combination atomic containing polysiloxane rubber, due to the atomic buffering effect of polysiloxane rubber, the pressure produced because of particle is uneven less, thus the metal-clad that the muscle shape spot obtaining surface is considerably less.
Median size is that the barium sulfate particles of 10nm ~ 150nm is not particularly limited, and preferably its shape is spherical.
Thus, the amount of inorganic filling material can be increased further.
The median size of above-mentioned barium sulfate particles is 10 ~ 150nm, with regard to immersion aspect, is preferably 40 ~ 100nm.Its reason is, if median size is lower than 10nm, then, between the long filament cannot expanding base material, again, if be greater than 150nm, then has the situation that cannot enter between long filament.
As above-mentioned barium sulfate particles, the commercially available products such as BF-21, BF-25 (Sakai chemistry manufactures) also can be used.
The content of above-mentioned barium sulfate particles is not particularly limited, but preferably counts 1 ~ 10 % by weight with the solids component benchmark of resin combination total amount, is particularly preferably 2 ~ 5 % by weight.If content is in above-mentioned scope, then immersion excellent especially.
The inorganic filling material used in 4th resin combination is not particularly limited, and include, for example: the inorganic fillers such as boehmite, silicon-dioxide, aluminium hydroxide, talcum.
Preferably the 4th resin combination is also containing polysiloxane rubber micropartical.
Thus, not only improve boring abradability, also can reduce linear expansivity.
As long as above-mentioned polysiloxane rubber micropartical is the caoutchouc elasticity micropartical formed by organopolysiloxane, be then not particularly limited, because concrete example is identical with above-mentioned second resin combination with content, therefore, in this description will be omitted.
The atomic content of above-mentioned polysiloxane rubber is not particularly limited relative to the weight ratio (weight of the atomic weight/barium sulfate particles of polysiloxane rubber) of the content of above-mentioned barium sulfate particles, but is preferably 1 ~ 50, is particularly preferably 2 ~ 20.If weight ratio is in above-mentioned scope, then especially formability can be improved.If weight ratio is greater than or less than above-mentioned scope, then immersion variation, easily causes that the scolding tin thermotolerance that causes because producing hole is abnormal, the decline of insulating reliability.
In addition, the median size of above-mentioned polysiloxane rubber micropartical and above-mentioned barium sulfate particles measures by such as laser diffraction and scattering method and dynamic light scattering method.Ultrasonic wave is utilized to make particle dispersion in water, (HORIBA manufactures to utilize laser diffraction formula particle size distribution device, LA-500) or dynamic light scattering formula size-grade distribution device (HORIBA manufacture, LB-550), the size-grade distribution of particle is measured, using its median particle diameter (D50) as median size with volume reference.
The epoxy resin used in 4th resin combination is not particularly limited, because concrete example is identical with above-mentioned first resin combination, therefore, in this description will be omitted.
In above-mentioned epoxy resin, be particularly preferably biphenyl aralkyl-type epoxy resin, naphthalene framework modification epoxy resin and cresol novolak type epoxy resin.By using these epoxy resin, the thermotolerance of prepreg, plywood and printed wiring board and flame retardant resistance are improved.
About the content of epoxy resin, due to identical with above-mentioned second resin combination, therefore omit the description.
Again, the weight average molecular weight of above-mentioned epoxy resin is not particularly limited, identical with above-mentioned 3rd resin combination.
Though be not particularly limited, preferably the 4th resin combination contains cyanate ester resin.Thus, flame retardant resistance can be made to improve further.
Above-mentioned cyanate ester resin is not particularly limited, and because concrete example is identical with above-mentioned first resin combination with content, therefore omits the description.
Again, though be not particularly limited, preferably the 4th resin combination contains maleimide resin.Thus, thermotolerance can be made to improve.The concrete example of maleimide resin is identical with above-mentioned second resin combination, again, because the content of maleimide resin is identical with above-mentioned 3rd resin combination, therefore, in this description will be omitted.
And then the 4th resin combination can containing at least one selected in the group be made up of polyimide resin, cyanate resin, phenol resins and melamine resin.
4th resin combination can use phenol system solidifying agent.Phenol system solidifying agent is not particularly limited, because concrete example is identical with above-mentioned first resin combination with content, therefore, in this description will be omitted.
Identical with the second resin combination, as required, the additive beyond mentioned component can be added in the scope of lossless characteristic in the 4th resin combination.Because the composition beyond mentioned component is identical with the second resin combination, therefore, omit the description herein.
[the 5th resin combination]
Below, the 5th resin combination of the present invention is described.
The feature of the 5th resin combination is: containing (A) first the periphery attachment particle diameter of packing material be less than (A) first (B) second packing material of packing material of packing material.
By making in resin combination, containing at (A) first periphery attachment (B) second packing material of packing material of packing material, to make packing material be scattered in equably in resin combination, that improves base material is immersion.By using this resin combination, the prepreg of thermotolerance, low expansion and excellent in flame retardance can be obtained.
(A) the first packing material is not particularly limited, and being preferably median size is 0.2 μm ~ 10 μm.More preferably median size is 0.5 ~ 5 μm.
By using the packing material of above-mentioned median size, make immersion further raising.
(A) the first packing material is not particularly limited, and include, for example: the oxide compounds such as titanium oxide, aluminum oxide, silicon-dioxide, fused silica; The carbonate such as calcium carbonate, magnesiumcarbonate, hydrotalcite; The oxyhydroxide such as aluminium hydroxide, magnesium hydroxide, calcium hydroxide; The silicate such as talcum, calcination of talc, claying, non-claying, mica, glass; Vitriol or the sulphite such as barium sulfate, calcium sulfate, calcium sulfite; The nitride such as aluminium nitride, boron nitride, silicon nitride, carbonitride; The borates such as zinc borate, barium metaborate, aluminum borate, lime borate, Sodium Tetraborate; The titanate such as strontium titanate, barium titanate etc.; The silicone such as polysiloxane rubber (polysiloxane) and the rubber particles such as styrene butadiene ribber particle, acrylic rubber particle.
As (A) first packing material, one wherein can be used alone, also can by two or more and use.
As long as the caoutchouc elasticity micropartical of above-mentioned silicone for being formed by organopolysiloxane, then be not particularly limited, include, for example: the micropartical be made up of polysiloxane rubber (organopolysiloxane cross-linked elastomer) itself, the nucleocapsid structure particle etc. in core portion utilizing the coated polysiloxane being cross-linked main body by two dimension of the polysiloxane of three-dimensional cross-linked type main body to form.As above-mentioned polysiloxane rubber micropartical, the commercially available product such as KMP-605, KMP-600, KMP-597, KMP-594 (SHIN-ETSU HANTOTAI's chemistry (strain) manufacture), Trefil E-500, Trefil E-600 (Dow Coing Toray (strain) manufacture) can be used.
Above-mentioned rubber particles is not particularly limited, but is preferably nucleocapsid type rubber particle, crosslinking-type rubber particle.
So-called nucleocapsid type rubber particle, refers to that particle has the rubber particles of stratum nucleare and shell, include, for example: outer field shell is made up of glassy polymers, and the double-layer structure that the stratum nucleare of internal layer is made up of rubbery polymer; Or outer field shell is made up of glassy polymers, and middle layer is made up of rubbery polymer, and the three-decker etc. that stratum nucleare is made up of glassy polymers.As the rubbery polymer in the stratum nucleare in double-layer structure or the middle layer in three-decker, can select: the cross-linked rubber of ethene, propylene, vinylbenzene, divinyl, isopropyl alkene, methyl acrylate, methyl methacrylate, vinyl cyanide etc.Again, as the glassy polymers of the stratum nucleare in the shell (skin) of stratum nucleare coated in double-layer structure or three-decker, can select: methyl methacrylate, vinylbenzene, vinyl cyanide or its multipolymer etc.Also can import the epoxy group(ing), carboxyl etc. as functional group in glassy polymers, can select according to purposes.
As crosslinking-type rubber particle, include, for example: acrylonitrile butadiene rubber (NBR) particle, styrene butadiene ribber (SBR) particle, acrylic rubber particle etc.
In addition, this rubber particles can improve the physical strength of the cured article of the 5th resin combination, the effects such as the stress also can giving this cured article relaxes, the low-thermal-expansion of this cured article.
In above-mentioned first packing material, be more preferably the high especially person of thermotolerance.So-called thermotolerance is high, specifically refers to that 1% heat decomposition temperature of inorganic filling material is more than 260 DEG C, is particularly preferably more than 300 DEG C.Above-mentioned 1% heat decomposition temperature is defined as: utilize differential thermobalance (TG/DTA), with the heat-up rate of 10 DEG C/min, and temperature when reducing by 1% weight from initial weight.As the packing material of 1% heat decomposition temperature with more than 300 DEG C, include, for example: boehmite, aluminum oxide, talcum, calcination of talc, silicon-dioxide.Wherein be particularly preferably boehmite, talcum, calcination of talc.Thus, can further improve thermotolerance and drill processability.
The organic particles such as above-mentioned silicone, above-mentioned rubber particles are not dissolved in organic solvent when preparing resin combination, and with become the immiscible person of leaflet in the resin combinations such as resin.Therefore, organic particle exists with dispersion state in the varnish of resin combination.
The content of above-mentioned first packing material is not particularly limited, and is preferably 40 ~ 75 % by weight of above-mentioned resin composition total amount, is particularly preferably 50 ~ 70 % by weight.If content is in above-mentioned scope, then thermotolerance and mobility are excellent especially.
In addition, when using above-mentioned silicone as above-mentioned first packing material, the content of above-mentioned silicone is not particularly limited, but is preferably 5 ~ 50 % by weight of resin combination total amount, with regard to immersion excellent aspect, is particularly preferably 10 ~ 40 % by weight.If above-mentioned content is more than 50 % by weight, then the rigidity of gained prepreg declines, and the degradation such as the low warpage properties of printed wiring board likely occur.
Then, the second packing material is described.Above-mentioned (B) as long as the second packing material is for being attached to (A) the first packing material person, is then not particularly limited.
Above-mentioned be attached to (A) first packing material (B) second packing material include, for example: from (A) first packing material zeta-potential the different person of symbol, because of Van der Waals force the person of attracting each other, carry out chemical bonded refractory person etc. by coupling agent treatment etc.
Above-mentioned (B) second the particle diameter of packing material be not particularly limited, but preferably median size is 10 ~ 100nm.
Thus, improve immersion although varnish viscosity is high, hole can be suppressed to produce, and then scolding tin excellent heat resistance, insulating reliability improves.
In addition, when using median size to be the packing material of 10 ~ 100nm, preferably making the slurry that is scattered in advance in organic solvent and using.Its reason is, median size is the easy aggegation of packing material of 10 ~ 100nm, has form secondary agglomeration etc. and the situation that reduces mobility when being matched with in resin combination.
Above-mentioned (B) second the median size of packing material be particularly preferably 15 ~ 90nm, most preferably be 25 ~ 75nm.If median size is in above-mentioned scope, then obtain the resin combination that highly-filled property and high workability are also excellent.
Above-mentioned (A) first packing material and (B) second the median size of packing material such as measure by ultrasonic vibration electric current (zeta-potential), ultrasonic-attenuation optical spectroscopy (size-grade distribution) and laser diffraction and scattering method.
Above-mentioned (B) second packing material be not particularly limited, include, for example: the silicate such as talcum, calcination of talc, claying, non-claying, mica, glass; The oxide compounds such as titanium oxide, aluminum oxide, silicon-dioxide, fused silica; The carbonate such as calcium carbonate, magnesiumcarbonate, hydrotalcite; The oxyhydroxide such as aluminium hydroxide, magnesium hydroxide, calcium hydroxide; Vitriol or the sulphite such as barium sulfate, calcium sulfate, calcium sulfite; The borates such as zinc borate, barium metaborate, aluminum borate, lime borate, Sodium Tetraborate; The nitride such as aluminium nitride, boron nitride, silicon nitride, carbonitride; The titanate such as strontium titanate, barium titanate etc.One wherein can be used alone, or also can by two or more and use.
Wherein, with regard to the linear thermal expansion ratio aspect of lower layer lamination, be preferably silicon-dioxide.
(B) shape of the second packing material is not particularly limited, but preferably spherical.Thus, immersion raising can be made.
Make glomerate method to be not particularly limited, such as, when being silicon-dioxide, the dry melt silicon-dioxide of combustion method etc. or the wet type sol-gel silica of Shen Jiangfa or gel method etc. etc. can being utilized and make spherical.
The combination of the first packing material and the second packing material is not particularly limited, such as be preferably: use at least one selected in the group be made up of boehmite, talcum and silicone particle as the first packing material, and use the combination of silicon-dioxide as the second packing material.When for this combination, resin combination not only plays good immersion to base material, and drill processability is also good, can manufacture the plywood of low thermal coefficient of expansion.
Above-mentioned (A) first packing material content and above-mentioned (B) second the weight ratio of content of packing material be not particularly limited, but preferably above-mentioned (B) second packing material content (w2) relative to above-mentioned (A) first the weight ratio (w2/w1) of content (w1) of packing material be 0.02 ~ 0.5, be particularly preferably 0.06 ~ 0.4.If weight ratio is in above-mentioned scope, then especially formability can be improved.
Above-mentioned (A) first packing material and/or (B) second packing material can carrying out surface treatment containing the silicane of functional group and/or alkyl silicon azane class and using in advance with the coupling agents such as such as epoxy silane coupling, cationic silane coupling agent, amino silicane coupling agent, titanic acid ester system coupling agent, silicone oil type coupling agent etc.By implementing surface treatment in advance, can make (A) first packing material and (B) second the adsorptivity of packing material improve.Again, the resin used in resin combination and (A) first packing material or (B) second the adherence of packing material improve, prepreg or the plywood of mechanical strength can be obtained.
Contain the silicane of functional group and/or the silicane containing functional group of alkyl silicon azane class as above-mentioned, known person can be used.Be preferably epoxy radicals silicone hydride, styryl silane, methacryloxypropyl silane, acryloxy silane, hydrosulphonyl silane, triethoxyl silane, N-Cyclohexylamino propyl trimethoxy silicane, methyl dimethoxysilane, vinyl silanes, isocyanato silanes, sulfenyl silane, chloropropyl silane, ureido silane compound.Be more preferably epoxy radicals silicone hydride, vinyl silanes.Especially, with the tack of the unbodied inorganic filling materials such as boehmite and improve with the adherence of resin.
To above-mentioned (A) first packing material and/or (B) second packing material carry out surface-treated in advance and be not particularly limited containing the amount of the silicane containing functional group of the silicane of functional group and/or alkyl silicon azane class, but relative to above-mentioned packing material ((A) first packing material or (B) second packing material) 100 weight parts, be preferably more than 0.01 weight part, below 5 weight parts.Be more preferably below more than 0.1 weight part, 3 weight parts.If exceed above-mentioned higher limit containing the content of the silicane of functional group and/or the silicane containing functional group of alkyl silicon azane class, then there is the situation causing thermotolerance and insulating reliability to decline because of remaining coupling agent, if lower than above-mentioned lower value, the adherence of packing material and resinous principle is then had to decline, the situation that the physical strength of the cured article of resin combination and resin combination mobility decline.
To above-mentioned (A) first packing material and/or (B) second packing material be not particularly limited to carry out surface-treated method containing the silicane of functional group and/or alkyl silicon azane class in advance, be preferably wet-format or dry type mode.Be particularly preferably wet-format.Time compared with dry type mode, wet-format can treat surface equably.
The resin used in 5th resin combination is not particularly limited, such as, can use: epoxy resin, phenol resins, cyanate ester resin, maleimide resin etc.
Above-mentioned epoxy resin is not particularly limited, and its concrete example is identical with above-mentioned first resin combination.
In above-mentioned epoxy resin, at least one selected in the group be particularly preferably made up of biphenyl aralkyl-type epoxy resin, naphthalene framework modification epoxy resin and cresol novolak type epoxy resin.By using this epoxy resin, the thermotolerance of prepreg, plywood and printed wiring board and flame retardant resistance can be made to improve.
In 5th resin combination, the preferred content of above-mentioned epoxy resin is identical with above-mentioned second resin combination.
The weight average molecular weight of above-mentioned epoxy resin is not particularly limited, but preferred weight molecular-weight average is 4.0 × 10 2~ 1.8 × 10 3.If weight average molecular weight is lower than above-mentioned lower limit, then there is the situation that glass transition temperature declines, if exceed above-mentioned higher limit, then have mobility to decline and the situation that cannot be impregnated in base material.By making weight average molecular weight in above-mentioned scope, the immersion of excellence can be obtained.
Above-mentioned cyanate ester resin is not particularly limited, and concrete example is identical with above-mentioned first resin combination with content.
Above-mentioned maleimide resin is not particularly limited, and concrete example is identical with above-mentioned second resin combination, and content is identical with above-mentioned 3rd resin combination.
Above-mentioned phenol resins is not particularly limited, with to be illustrated as phenol system solidifying agent person in above-mentioned first resin combination identical.
As required, in the scope of lossless characteristic, the additive beyond mentioned component can be added in the 5th resin combination.Composition beyond mentioned component include, for example: imidazoles, triphenylphosphine He the curing catalysts such as quaternary alkylphosphonium salt; The surface conditioners such as acrylic acid polymer; The tinting material such as dyestuff and pigment etc.
(resin sheet)
Resin sheet of the present invention is that the resin layer of the resin combination formed containing the invention described above on base material forms.This resin layer can be used as the insulation layer of printed wiring board.
The method making resin sheet is not particularly limited, include, for example following methods etc.: resin combination dissolves by (1), be scattered in solvent etc. in and make resinous varnish, various apparatus for coating is used to be coated after on base material by the resinous varnish obtained, the method be dried; (2) spraying plant is utilized to be sprayed at after on base material by above-mentioned resinous varnish, the method be dried.
Wherein, preferably use the various apparatus for coating such as comma (comma) coating machine, mould coating machine (die coater), resinous varnish is coated after on base material, the method be dried.Thus, can effectively form imporosity on base material, there is the resin layer of uniform thickness.
In resin sheet of the present invention, the thickness of insulation layer is not particularly limited, but is preferably 5 ~ 100 μm.Thus, when using this resin sheet to manufacture printed wiring board, the concavo-convex of internal layer circuit can be filled and carry out shaping, and suitable thickness of insulating layer can be guaranteed.
The solvent used when preparing above-mentioned resinous varnish, preferably shows good solubility to the resinous principle in resin combination, but not causing in dysgenic scope, also can use Weak solvent.As the solvent showing good solubility, include, for example: the ketones such as acetone, methyl ethyl ketone, methyl iso-butyl ketone (MIBK), pimelinketone, tetrahydrofuran (THF), the acetate esters such as ethyl acetate, butylacetate, acetic acid Cellosolve, propylene glycol methyl ether acetate, carbitol acetate, the Cellosolve classes such as cellosolve, butyl Cellosolve, the Trivalin SF such as Trivalin SF, diethylene glycol monobutyl ether class, the aromatic hydrocarbons such as toluene, dimethylbenzene; Dimethyl formamide, N,N-DIMETHYLACETAMIDE, dimethyl sulfoxide (DMSO), ethylene glycol etc. can be enumerated in addition.These can be used alone, or are used in combination of two or more.
The base material used in resin sheet of the present invention is not particularly limited, such as can use: the vibrin such as polyethylene terephthalate, polybutylene terephthalate, fluorine resin, polyimide resins etc. have the thermoplastic resin film of thermotolerance, can use the tinsel etc. of copper and/or copper series alloy, aluminium and/or aluminum series alloy, iron and/or iron-based alloy, silver and/or silver system alloy, gold and gold system alloy, zinc and Zn based alloy, nickel and nickel system alloy, tin and tin system alloy etc. in addition.
The thickness of above-mentioned base material is not particularly limited, if but the base material of use 10 ~ 70 μm, then operability when manufacturing resin sheet is good, thus preferably.
In addition, when manufacturing resin sheet of the present invention, the substrate surface preferably contacted with resin layer concavo-convex minimum.Thus, when using this resin sheet to form insulation layer on conductor circuit, fine wiring processing becomes easy.
(prepreg)
Below, prepreg is described.
Prepreg of the present invention be impregnated in base material by above-mentioned resin combination, and then carry out heat drying as required and form.
As above-mentioned base material, include, for example: by fiberglass substrates such as glass woven fabric, glass non-woven fabric, glassine papers, weaving cotton cloth or non-woven fabrics of the synthon such as paper, aromatic polyamide, polyester, aromatic polyester, fluoro-resin etc.; By the weaving cotton cloth of steel fiber, carbon fiber, mineral fibre etc., non-woven fabrics, felt class etc.These base materials can be used alone, or used in combination.Wherein, fiberglass substrate is preferably.Thus, rigidity, the dimensional stability of prepreg can be improved.
When above-mentioned resin combination be impregnated in base material, as mentioned above, be that above-mentioned resin combination is dissolved in solvent, make resinous varnish and use.
Make above-mentioned resin combination impregnated in method in above-mentioned base material, include, for example: base material is immersed in the method in resinous varnish, utilizes various coating machine resinous varnish to be coated method on base material, resinous varnish is blown by spraying the method etc. be attached on base material.Wherein, preferably base material is immersed in the method in resinous varnish.Thus, immersion to base material of resin combination can be improved.In addition, when being impregnated in resinous varnish by base material, common dip coated equipment can be used.
Such as, as shown in Figure 1, base material 1 is immersed in the resinous varnish 3 of steeping vat 2, resinous varnish 3 is impregnated in base material 1.Now, the dip roll 4 (in Fig. 1 being 3) utilizing steeping vat 2 to possess, is immersed in base material 1 in resinous varnish 3.Then, lift is in vertical direction impregnated with the base material 1 of resinous varnish 3, it is made to pass through to be set up in parallel in the horizontal direction and between a pair extrusion roll of subtend or comma roller (comma roll) (5 of Fig. 1 is extrusion roll), the glue spread of adjustment resinous varnish 3 pairs of base materials 1.Then, the base material 1 being coated with resinous varnish 3 is heated with specified temperature in drying machine 6, makes the solvent evaporates in be coated with varnish, and make resin combination semicure and manufacture prepreg 7.In addition, in order to make prepreg 7 move to direct of travel, the upper roll 8 in Fig. 1 is with rotation equidirectional with the direct of travel of prepreg 7.At specified temperature, such as 90 ~ 180 DEG C, carry out drying by will be immersed in above-mentioned base material the solvent of resinous varnish, the prepreg of semicure can be obtained.
(metal-clad)
Below, metal-clad is described.
Metal-clad of the present invention has tinsel person at least one side of the resin impregnation substrate layer making above-mentioned resin combination be impregnated in base material.
Metal-clad of the present invention, such as, by manufacturing at above-mentioned prepreg or by least one side attaching tinsel of duplexer more than overlapping for this prepreg a slice.
Above-mentioned Heating temperature is not particularly limited, but is preferably 120 ~ 250 DEG C, is particularly preferably 120 ~ 220 DEG C, is more preferably 150 ~ 220 DEG C, is wherein preferably 150 ~ 200 DEG C.Above-mentioned applied pressure is not particularly limited, and is preferably 0.5 ~ 5MPa.Again, as required, also in high temperature groove etc., after fixing can be carried out with the temperature of 150 ~ 300 DEG C.
Again, as the other method manufacturing metal-clad of the present invention, the manufacture method of the metal-clad of the tinsel of the attached insulating resin layer of use shown in Fig. 2 can be enumerated.First, obtain the prepreg of attached tinsel by the following method, namely, prepare the tinsel 10 being coated with the attached insulating resin layer of uniform insulating resin layer 12 in tinsel 11 with coating machine, in the both sides of the base materials such as glass fibre 20, take insulating resin layer as the tinsel 10,10 (Fig. 2 (a)) that inner side configures attached insulating resin layer, again in vacuum to heat 60 ~ 130 DEG C, the condition of pressurization 0.1 ~ 5MPa carries out the method for lamination dipping, obtains the prepreg 41 (Fig. 2 (b)) of attached tinsel.Then, by the prepreg 41 direct heating extrusion forming to attached tinsel, metal-clad 51 (Fig. 2 (c)) can be obtained.
And then, as the other method manufacturing metal-clad of the present invention, the manufacture method of the metal-clad of the macromolecule membrane sheet material of the attached insulating resin layer of use shown in Fig. 3 also can be enumerated.First, the prepreg of attached macromolecule membrane sheet material is obtained by following method, namely, prepare the macromolecule membrane sheet material 30 being coated with the attached insulating resin layer of uniform insulating resin layer 32 on macromolecule membrane sheet material 31 with coating machine, be the macromolecule membrane sheet material 30,30 (Fig. 3 (a)) that inner side configures attached insulating resin layer with insulating resin layer in the both sides of base material 2, in a vacuum to heat 60 ~ 130 DEG C, the condition of pressurization 0.1 ~ 5MPa carries out the method for lamination dipping, obtains the prepreg 42 (Fig. 3 (b)) of attached macromolecule membrane sheet material.Then, after the macromolecule membrane sheet material 31 of at least one side of the prepreg 42 of attached macromolecule membrane sheet material is peeled off (Fig. 3 (c)), in face configuration tinsel 11 (Fig. 3 (d)) of having peeled off macromolecule membrane sheet material 31, carry out heating and pressurizing shaping, metal-clad 52 (Fig. 3 (e)) can be obtained thus.And then, when peeling off the macromolecule membrane sheet material on two sides, also can in the same manner as above-mentioned prepreg more than stacked two panels.When the above prepreg of stacked two panels, at the outermost upper and lower surface of stacked prepreg or one side configuration tinsel or macromolecule membrane sheet material, it is shaping to carry out heating and pressurizing, can obtain metal-clad thus.As the condition that above-mentioned heating and pressurizing is shaping, temperature is not particularly limited, but is preferably 120 ~ 250 DEG C, is more preferably 120 ~ 220 DEG C, is particularly preferably 150 ~ 220 DEG C.Above-mentioned applied pressure is not particularly limited, but is preferably 0.1 ~ 5MPa, is particularly preferably 0.5 ~ 3MPa.In the present invention, owing to making prepreg in the mode of attached base material, therefore, the surface smoothness Gao Erke of prepreg carries out low pressure molding.Again, as required, also in high temperature groove etc., after fixing can be carried out with the temperature of 150 ~ 300 DEG C.
The metal-clad of Fig. 2 ~ 3 etc. is not particularly limited, such as, the device of the device of the tinsel manufacturing attached insulating resin layer and manufacture metal-clad can be used to manufacture.
In the device of the tinsel of the attached insulating resin layer of above-mentioned manufacture, strip sheet material product are rolled into the tinsel etc. of youngster by metal foil as used, supply thus by rolling out continuously.Utilize the feedway of insulating resin, continuously aqueous insulating resin is supplied in tinsel with specified amount.Wherein, as aqueous insulating resin, use resin combination dissolving of the present invention, the coating fluid be scattered in solvent.The glue spread of insulating resin can utilize the gap of comma roller and this comma roller and supporting roll to control.Be coated with the tinsel of the insulating resin of specified amount, mobile in the inside of the hot-air drying device of horizontal conveyance type, thus the dry in fact organic solvent etc. removed contained by aqueous insulating resin, and as required, make the tinsel that curing reaction can be made to proceed to the attached insulating resin layer of midway.The tinsel of attached insulating resin layer can directly be batched, and laminating roll also can be utilized to stress folded protective membrane being formed with insulating resin layer, and the curling tinsel being laminated with the attached insulating resin layer of this protective membrane, and obtain the tinsel of the attached insulating resin layer of rolling.
The device of above-mentioned manufacture metal-clad is the device can implementing above-mentioned Fig. 2 (a) ~ (b) operation.Include, for example device described in Japanese Unexamined Patent Publication 8-150683 and WO2007/040125 etc.In the device of above-mentioned manufacture metal-clad, (a) operation uses laminater and implements.In the inside of laminater, tinsel and the base material of the attached insulating resin layer obtained is set in above-mentioned (a) operation in the mode that can supply continuously respectively.The tinsel of attached insulating resin layer, due to the said protection film in insulating resin layer surface laminated, therefore, utilizes winding roller, peels off the supply continuously of this protective membrane.Again, base material supplies continuously from the base material of rolling.The tinsel of attached insulating resin layer is with superimposed in the form of insulating resin layer side gripping fibers cloth respectively, utilizes laminating roll carry out heating and pressurizing and engage.Now, insulating resin layer is the uncured thing or the semicure thing that are roughly solvent-free state, but can be flowed by heat fusing, therefore, it is possible to be impregnated in base material.Joiner after joint can directly transport to subsequent processing, also can utilize laminating roll, operative temperature and pressure and adjust the tinsel of attached insulating resin layer and the junction temperature of base material.Joiner after joint moves between the hot-air drying device of horizontal conveyance type, heat treated at the temperature more than the melt temperature of insulating resin.Thus, the non-filling part remaining in joiner inside can be made to disappear.By the metal-clad after heat treated while with pinch roll clamping, it is batched continuously, can be made into the metal-clad of rolling thus.In addition, lamination can carry out at ambient pressure, also can carry out under vacuo, preferably carry out under vacuo.
(printed wiring board)
Below, printed wiring board of the present invention is described.
Printed wiring board of the present invention above-mentioned metal-clad is used for internal layer circuit substrate form.
Again, printed wiring board of the present invention is on internal layer circuit, and above-mentioned prepreg is used as insulation layer.
Again, printed wiring board of the present invention is on internal layer circuit, and above-mentioned resin combination is used as insulation layer.
In the present invention, printed wiring board refers to and forms circuit person by electrical conductor such as tinsels on the insulating layer, can be any one in the running board that is printed on one side (laminate), two-face printing running board (two laminates) and multilayer printed-wiring board (multi-ply wood).Multilayer printed-wiring board refers to the printed wiring board utilizing overlapping more than three layers of plating coating ventilating hole method or lamination method etc., undertaken heating and pressurizing shaping by lapped insulation layer on internal layer circuit substrate and obtains.
As above-mentioned internal layer circuit substrate, such as, can be preferably used on the metal level of metal-clad of the present invention, be waited the conductor circuit forming regulation by etching, and conductor circuit part is carried out to the internal layer circuit substrate of Darkening process.
As above-mentioned insulation layer, the resin molding by prepreg of the present invention or resin combination of the present invention can be used.In addition, when using the resin molding by above-mentioned prepreg or above-mentioned resin combination as above-mentioned insulation layer, above-mentioned internal layer circuit substrate also can not adopt by the circuit substrate of metal-clad of the present invention.
Below, as the typical example of printed wiring board of the present invention, be used as internal layer circuit substrate to by metal-clad of the present invention, and multilayer printed-wiring board when prepreg of the present invention and resin sheet of the present invention being used as insulation layer is described.In addition, as insulation layer, also commercially available resin sheet can be used.
Form circuit in the one or two sides of above-mentioned metal-clad and make internal layer circuit substrate.Optionally, also by Drilling operation, laser processing and form through hole, and implemented the electrical connection on two sides by plating etc.By the resin layer of above-mentioned prepreg overlapping on this internal layer circuit substrate or resin sheet, and carry out heating and pressurizing shaping and form insulation layer.Similarly, by being alternately concatenated to form the conductor circuit layers and insulation layer that are formed by etching etc., and multilayer printed-wiring board is obtained.
Specifically, by above-mentioned prepreg and above-mentioned internal layer circuit substrate, or by the resin layer of above-mentioned resin sheet and above-mentioned internal layer circuit substrates while stacking, vacuum pressure type laminater etc. is used to carry out heating under vacuum extrusion forming, then, by hot-air drying device etc., insulation layer is heating and curing.Wherein, the condition of carrying out heating and pressurizing shaping is not particularly limited, if enumerate an example, then can implement under temperature 60 ~ 160 DEG C, pressure 0.2 ~ 3MPa.Again, the condition of carrying out being heating and curing is not particularly limited, if enumerate an example, then can implement under temperature 140 ~ 240 DEG C, the condition of 30 ~ 120 minutes time.
Or, above-mentioned prepreg is overlapped on above-mentioned internal layer circuit substrate, or the resin layer of above-mentioned resin sheet is overlapped on above-mentioned internal layer circuit substrate, with dull and stereotyped squeezing device etc., heating and pressurizing carried out to it shaping.Wherein, the condition shaping as heating and pressurizing is not particularly limited, if enumerate an example, then can implement under the condition of temperature 140 ~ 240 DEG C, pressure 1 ~ 4MPa.In utilizing the heating and pressurizing of this dull and stereotyped squeezing device etc. shaping, while being shaped with heating and pressurizing, carry out being heating and curing of insulation layer.
In order to make the removal of follow-up laser radiation and gum residue (glue slag) easily carry out, and improving de-smear, making the solidification of the insulation layer formed by above-mentioned resin sheet or above-mentioned prepreg rest on semi-cured state sometimes.Again, it is made to carry out partially cured (semicure) by heating the insulation layer of the first layer at the temperature lower than usual Heating temperature, form one or more layers insulation layer on which insulating layer further, be heating and curing the insulation layer of semicure degree again no problem to practicality, can make between insulation layer thus and friction pull raising between insulation layer and circuit.Semicure temperature is now preferably 80 DEG C ~ 200 DEG C, is more preferably 100 DEG C ~ 180 DEG C.
Then, to insulation layer irradiating laser, aperture portion is formed.Above-mentioned laser can use excimer laser, UV laser and carbonic acid gas laser etc.
For (glue slags) such as the gum residues after laser radiation, preferably carry out the process utilizing the removings such as the oxygenant such as permanganate, dichromate, i.e. de-smear process.If de-smear process is insufficient, fully do not guarantee de-smear patience, even if then carry out metal-plated process to aperture portion, due to glue slag, there is the problem fully cannot guaranteeing the powered of upper strata metal line and lower metal.Again, simultaneously by level and smooth surface of insulating layer roughening, thus the adherence of the conducting wiring circuit formed by follow-up metal-plated can be improved.
In addition, when using resin sheet to form insulation layer, required peeling base.The opportunity of peeling base is not particularly limited, and such as, the stripping of base material can be carried out in the either phase of the front and back that are heating and curing of insulation layer, again, also can carry out in the either phase by the laser radiation formation front and back of aperture portion, the front and back of de-smear process.Such as, as the preferred opportunity of peeling base, when the base material of resin sheet is resin molding, be preferably: being heating and curing of (1) insulation layer, peeling base, by the formation of the aperture portion of laser radiation, the order of de-smear process; Or (2) order being heating and curing, being formed aperture portion, de-smear process by laser radiation of peeling base, insulation layer.Again, when the base material of resin sheet is tinsel, be preferably: the order being heating and curing, being formed aperture portion, de-smear process, peeling base by laser radiation of (1) insulation layer; Or (2) order being heating and curing, being formed aperture portion, peeling base, de-smear process by laser radiation of insulation layer.
Then, outer circuit is formed.In the formation of outer circuit, realized the connection between insulation layer by metal-plated, and carry out the formation of outer circuit pattern by etching.
Also can so that stacked insulation layer, and carry out circuit formation as described above, but in multilayer printed-wiring board, after circuit is formed, form solder mask at outermost layer.The formation method of solder mask is not particularly limited, and include, for example: stacked for the solder mask of dry-film type (lamination) is carried out the method that exposes and develop on circuit; Or print aqueous resist and carry out the method etc. that exposes and develop.In addition, when by gained multilayer printed wiring board-use in semiconductor device when, for installing semiconductor element and arrange connecting electrode portion.Connecting electrode portion can carry out suitably coated with the metal epithelium of gold-plated, nickel plating and plating scolding tin etc.
As one of above-mentioned gold-plated representative method, there is nickel-palladium-Jin non-electrolytic plating.In the method, after utilizing the proper methods such as clearer to carry out pre-treatment to connecting electrode portion, give palladium catalyst, then, sequentially carry out process for electroless nickel plating process, the process of electroless plating palladium and electroless plating gold process further.
ENEPIG method (chemical nickel plating palladium leaching gold) is the method for carrying out immersion gold plating process the electroless plating gold of above-mentioned nickel-palladium-Jin non-electrolytic plating treatment stage.By arranging electroless plating palladium epithelium as between the process for electroless nickel plating epithelium of substrate coating and electroless plating gold epithelium, the diffusion resistance of the conductor material in connecting electrode portion, solidity to corrosion are improved.Due to the non-proliferation of substrate nickel plating epithelium can be realized, this improves the reliability that Au-Au engages, again, due to the nickel oxidation caused by gold can be prevented, therefore, also can improve the reliability that the large Pb-free solder of thermal load engages.In ENEPIG method, usually must carry out surface treatment before carrying out the process of electroless plating palladium, to prevent from, in plating operation, poor flow occurs, when poor flow is serious, the reason producing short circuit between adjacent terminal can be become.On the other hand, even if printed wiring board of the present invention does not carry out surface treatment, also can not produce poor flow as above, plating process can be carried out simply.
(semiconductor device)
Below, semiconductor device of the present invention is described.
Printed wiring board obtained above is installed the semiconductor element with solder bump, realizes the connection with above-mentioned printed wiring board by solder bump.Then, between printed wiring board and semiconductor element, fill aqueous sealing resin, form semiconductor device.Solder bump is preferably made up of the alloy comprising tin, lead, silver, copper, bismuth etc.
The method of attachment of semiconductor element and printed wiring board, by using flip-chip bond machine etc., after carrying out the position alignment of the solder bump of connecting electrode portion on substrate and semiconductor element, use IR reflow soldering apparatus, hot plate, other heating unit, solder bump is heated to more than fusing point, printed wiring board is engaged with solder bump melting and is connected.In addition, for making connection reliability good, also the layer of the relatively low metal of the fusing points such as solder paster can be formed in the connecting electrode portion in advance on printed wiring board.Also before this bonding process, soldering flux can be coated with, to improve connection reliability by the top layer in the connecting electrode portion on solder bump and/or printed wiring board.
[embodiment]
Below, based on embodiment and comparative example, the present invention is described in detail, but the present invention is not limited thereto.
[embodiment A series]
Below, the embodiment of use first resin combination is disclosed.
(embodiment A 1)
(1) preparation of the varnish (resinous varnish) of resinous composition
Using the phenolic resin varnish type epoxy resin (EOCN-1020-75 as epoxy resin, chemical drug Inc. of Japan makes, epoxy equivalent (weight) is 200) 17.5 % by weight, as boehmite (the He He lime company manufacture of the first inorganic filling material, production code member BMT-3L, median size is 2.9 μm, 1% heat decomposition temperature is 420 DEG C) 61.4 % by weight, as spherical nano silicon (the production code member NSS-5N of the second inorganic filling material, Tokuyama company manufactures, median size is 70nm) 3.5 % by weight, as the resol (MEH7851-4L of solidifying agent, bright and the company that changes into manufactures, hydroxyl equivalent is 187) 17.5 % by weight, and as curing catalyst imidazoles (four countries change into industrial manufacture, production code member 2E4MZ) 0.1 % by weight dissolving, be mixed in methyl iso-butyl ketone (MIBK).Then, use high-speed stirring apparatus to stir the mixture obtained, thus prepared resinous varnish (W2/W1=0.06).
(2) making of prepreg
Above-mentioned resinous varnish be impregnated in glass woven fabric (thickness 94 μm, the E glass woven fabric that day east weaving manufactures, WEA-2116), in, drying 2 minutes in the process furnace of 150 DEG C, the varnish solids component obtained in prepreg is the prepreg of about 50 % by weight.
(3) making of metal-clad
The prepreg obtained 4 is overlapping, and on its two sides the Copper Foil (the 3EC-VLP paper tinsel that mining company of Mitsui Metal Co., Ltd. manufactures) of overlapping 12 μm, shaping 2 hours of heating and pressurizing at pressure 3MPa, temperature 220 DEG C, the thickness that acquisition two sides has Copper Foil is the metal-clad of 0.40mm.
(4) manufacture of printed wiring board
After with drilling machine two sides being had to the above-mentioned metal-clad perforate of Copper Foil, realize the conducting between upper and lower Copper Foil by non-electrolytic plating.And then, by etching the Copper Foil on two sides, thus form internal layer circuit (L (conductor circuit width)/S (between conductor circuit width)=120/180 μm, reach through hole (clearance hole) 1mm φ, 3mm φ, gap 2mm) on two sides.
Then, on internal layer circuit, blown by spraying that to be accompanied by aquae hydrogenii dioxidi and sulfuric acid be that the roughened of the reagent solution (the Tech SO-G that rising sun electrochemical industry (strain) manufactures) of principal constituent is formed concavo-convex.
Then, use vacuum laminated device, by commercially available resin molding (also referred to as " layered material "), (aginomoto Fine-Techno company manufactures, ABF GX-13, thickness 40 μm) be laminated on internal layer circuit, be heating and curing at temperature 170 DEG C 60 minutes and obtain the duplexer with insulation layer.
Then, on the prepreg of gained duplexer, (Hitachi Via Mechanics (strain) manufactures: LG-2G212) formed to use carbonic acid laser aid aperture portion (blind via hole, blind via hole), at the swelling liquid of 70 DEG C, (Atotech Japan company manufactures, Swelling Dip Securiganth P) in dipping 5 minutes, and then 80 DEG C potassium permanganate solution (Atotech Japan company manufacture, Concentrate Compact CP) in dipping 15 minutes after, neutralized and carried out roughened.
Then, after the operation of degreasing, imparting catalyzer, sensitization, electroless plating copper sheet film is utilized to form the power supply layer of about 0.5 μm.On the surface of this power supply layer, hot roll laminator is utilized to attach the UV light sensitivity dry film (Asahi Kasei Corporation manufactures AQ-2558) of thickness 25 μm, use and describe have minimum line width/distance between centers of tracks to be the chromium deposition mask (manufacture of Touwa Process company) of 20/20 μm of pattern, aligned position, exposure apparatus (UX-1100SM-AJN01 that Ushio Motor Corporation manufactures) is utilized to expose, and utilize aqueous sodium carbonate to develop, form plating resist layer.
Then, using power supply layer as electrode, with 3A/dm 2carry out the copper electroplating (81-HL that Ao Ye drugmaker manufactures) of 30 minutes, form the thin copper film that thickness is about 25 μm.Herein, use two benches stripping machine, peel off above-mentioned plating resist layer.About each reagent solution, monoethanolamine solution (R-100 that gas chemical company of Mitsubishi manufactures) is used in the alkali aqueous solution layer of first stage, use with potassium permanganate and the sodium hydroxide aqueous solution (MacuDizer 9275,9276 that Japanese MacDermid company manufactures) that is principal constituent in the oxidisability resin etching reagent of subordinate phase, in and time use acid amine aqueous solution (MacuDizer 9279 that Japanese MacDermid company manufactures).
Then, by carrying out dip treating with ammonium persulfate aqueous solution (Meltex (strain) manufactures AD-485) and etch removal power supply layer, guarantee the insulation between connecting up.Then, with temperature 200 DEG C, 60 minutes time, insulation layer is finally solidified, finally form solder mask (PSR4000/AUS308 that sun ink Inc. makes) at circuit surface and obtain printed wiring board.
(5) manufacture of semiconductor device
To the printed wiring board obtained, configuration and the solder bump of semiconductor element arrange suitable, behind the connecting electrode portion of plating nickel gold process, cut into 50mm × 50mm size and use.Semiconductor element (TEG chip; size 15mm × 15mm; thickness 0.8mm) there is the solder bump that the eutectic that is made up of Sn/Pb formed, the circuit protection film of semiconductor element uses the film formed by normal Photosensitive resin (CRC-8300 that Sumitomo Bakelite company manufactures).
For the assembling of semiconductor device, first, utilize transfer printing even spread flux material on solder bump, then using flip-chip bond device, by adding thermo-compressed, solder bump being equipped on printed wiring board.Then, after solder bump melting being engaged with IR reflow soldering, fill aqueous sealing resin (Sumitomo Bakelite company manufactures, CRP-4152S), aqueous sealing resin is solidified, obtains semiconductor device thus.In addition, the condition of cure of aqueous sealing resin is temperature 150 DEG C, the condition of 120 minutes.
(embodiment A 2)
Except by the cooperation of resinous varnish by except shown below carrying out, other operates identically with embodiment A 1.
Be used as phenol novolacs cyanate ester resin (the Primaset PT-30 of cyanate ester resin, Lonza company manufactures) 17.5 % by weight, as the biphenyl dimethylene type epoxy resin (NC3000 of epoxy resin, chemical drug Inc. of Japan makes, epoxy equivalent (weight) is 275) 9.5 % by weight, as boehmite (the He He lime company manufacture of the first inorganic filling material, production code member BMT-3L, median size is 2.9 μm, 1% heat decomposition temperature is 420 DEG C) 61.4 % by weight, as spherical nano silicon (the production code member NSS-5N of the second inorganic filling material, Tokuyama company manufactures, median size is 70nm) 3.5 % by weight, and as the resol (MEH7851-4L of solidifying agent, bright and the company that changes into manufactures, hydroxyl equivalent is 187) 8.1 % by weight (W2/W1=0.06).
(embodiment A 3)
Except by the cooperation of resinous varnish by except shown below carrying out, other operates identically with embodiment A 1.
Be used as phenol novolacs cyanate ester resin (the Primaset PT-30 of cyanate ester resin, Lonza company manufactures) 17.5 % by weight, as the biphenyl dimethylene type epoxy resin (NC3000 of epoxy resin, chemical drug Inc. of Japan makes, epoxy equivalent (weight) is 275) 9.5 % by weight, as boehmite (the He He lime company manufacture of the first inorganic filling material, production code member BMT-3L, median size is 2.9 μm, 1% heat decomposition temperature is 420 DEG C) 31.6 % by weight, as spherical nano silicon (the production code member NSS-5N of the second inorganic filling material, Tokuyama company manufactures, median size is 70nm) 3.5 % by weight, as the spherical silicon dioxide (SO-31R of the 3rd inorganic filling material, Admatechs company manufactures, specific surface area is 4.5m 2/ g, median size is 1.2 μm) 29.8 % by weight and resol (MEH7851-4L, the bright and company that changes into manufactures, and hydroxyl equivalent is 187) 8.1 % by weight (W2/W1=0.11, W2/W3=0.12) as solidifying agent.
(embodiment A 4)
Except being used as except the second inorganic filling material by following material, other operates identically with embodiment A 3.
Spherical nano silicon (production code member Admanano, Admatechs company manufactures, and median size is 50nm, 40wt% pimelinketone slurry) (W2/W1=0.11, W2/W3=0.12) is used as the second inorganic filling material.In addition, above-mentioned pimelinketone slurry converts with the dry powder of spherical nano silicon and coordinates.
(embodiment A 5)
Except being used as except the second inorganic filling material by following material, other operates identically with embodiment A 3.
Spherical nano silicon (production code member Admanano, Admatechs company manufactures, and median size is 25nm, 30wt% pimelinketone slurry) (W2/W1=0.11, W2/W3=0.12) is used as the second inorganic filling material.In addition, above-mentioned pimelinketone slurry converts with the dry powder of spherical nano silicon and coordinates.
(embodiment A 6)
Except being used as except the second inorganic filling material by following material, other operates identically with embodiment A 3.
Spherical nano silicon (production code member PL-1, chemical industrial company of Japan manufactures, and median size is 15nm, 12wt% pimelinketone slurry) (W2/W1=0.11, W2/W3=0.12) is used as the second inorganic filling material.In addition, above-mentioned pimelinketone slurry converts with the dry powder of spherical nano silicon and coordinates.
(embodiment A 7)
Except being used as except the first inorganic filling material by following material, other operates identically with embodiment A 3.
Aluminium hydroxide (production code member ALH-3L, He He lime company manufactures, and median size is 4.5 μm, and 1% heat decomposition temperature is 280 DEG C) (W2/W1=0.11, W2/W3=0.12) is used as the first inorganic filling material.
(embodiment A 8)
Except being used as except the first inorganic filling material by following material, other operates identically with embodiment A 3.
Talcum (production code member LMS-400, talcum industrial of Fuji manufactures, and median size is 3.8 μm, and 1% heat decomposition temperature is 375 DEG C) (W2/W1=0.11, W2/W3=0.12) is used as the first inorganic filling material.
(embodiment A 9)
Except using except following resin as epoxy resin, other operates identically with embodiment A 3.
Naphthalene modification cresol novolac epoxy (HP-5000, DIC company manufactures, and epoxy equivalent (weight) is 250) (W2/W1=0.11, W2/W3=0.12) is used as epoxy resin.
(embodiment A 10)
Except using except following resin as epoxy resin, other operates identically with embodiment A 3.
Anthracene type epoxy resin (epoxy equivalent (weight) is 181 for YX8800, japan epoxy resin) (W2/W1=0.11, W2/W3=0.12) is used as epoxy resin.
(embodiment A 11)
Except by the cooperation of resinous varnish by except shown below carrying out, other operates identically with embodiment A 1.
Be used as phenol novolacs cyanate ester resin (the Primaset PT-30 of cyanate ester resin, Lonza company manufactures) 17.5 % by weight, as the biphenyl dimethylene type epoxy resin (NC3000 of epoxy resin, chemical drug Inc. of Japan makes, epoxy equivalent (weight) is 275) 9.5 % by weight, as boehmite (the He He lime company manufacture of the first inorganic filling material, production code member BMT-3L, median size is 2.9 μm, 1% heat decomposition temperature is 420 DEG C) 21.1 % by weight, as spherical nano silicon (the production code member NSS-5N of the second inorganic filling material, Tokuyama company manufactures, median size is 70nm) 10.5 % by weight, as the spherical silicon dioxide (SO-31R of the 3rd inorganic filling material, Admatechs company manufactures, specific surface area is 4.5m 2/ g, median size is 1.2 μm) 33.3 % by weight and resol (MEH7851-4L, the bright and company that changes into manufactures, and hydroxyl equivalent is 187) 8.1 % by weight (W2/W1=0.5, W2/W3=0.32) as solidifying agent.
(embodiment A 12)
Except by the cooperation of resinous varnish by except shown below carrying out, other operates identically with embodiment A 1.
Be used as phenol novolacs cyanate ester resin (the Primaset PT-30 of cyanate ester resin, Lonza company manufactures) 17.5 % by weight, as the biphenyl dimethylene type epoxy resin (NC3000 of epoxy resin, chemical drug Inc. of Japan makes, epoxy equivalent (weight) is 275) 9.5 % by weight, as boehmite (the He He lime company manufacture of the first inorganic filling material, production code member BMT-3L, median size is 2.9 μm, 1% heat decomposition temperature is 420 DEG C) 45.6 % by weight, as spherical nano silicon (the production code member NSS-5N of the second inorganic filling material, Tokuyama company manufactures, median size is 70nm) 10.5 % by weight, as the spherical silicon dioxide (SO-31R of the 3rd inorganic filling material, Admatechs company manufactures, specific surface area is 4.5m 2/ g, median size is 1.2 μm) 8.8 % by weight and resol (MEH7851-4L, the bright and company that changes into manufactures, and hydroxyl equivalent is 187) 8.1 % by weight (W2/W1=0.23, W2/W3=1.2) as solidifying agent.
(Comparative examples A 1)
Except not using the second inorganic filling material, and by the cooperation of resinous varnish by beyond shown below carrying out, other operates identically with embodiment A 1.
Be used as phenol novolacs cyanate ester resin (the Primaset PT-30 of cyanate ester resin, Lonza company manufactures) 17.5 % by weight, as the biphenyl dimethylene type epoxy resin (NC3000 of epoxy resin, chemical drug Inc. of Japan makes, epoxy equivalent (weight) is 275) 9.5 % by weight, as boehmite (the He He lime company manufacture of the first inorganic filling material, production code member BMT-3L, median size is 2.9 μm, 1% heat decomposition temperature is 420 DEG C) 56.1 % by weight, as the spherical silicon dioxide (SO-31R of the 3rd inorganic filling material, Admatechs company manufactures, specific surface area is 4.5m 2/ g, median size is 1.1 μm) 8.8 % by weight and resol (MEH7851-4L, the bright and company that changes into manufactures, and hydroxyl equivalent is 187) 8.1 % by weight as solidifying agent.
(Comparative examples A 2)
Except not using the first inorganic filling material, and by the cooperation of resinous varnish by beyond shown below carrying out, other operates identically with embodiment A 1.
Be used as phenol novolacs cyanate ester resin (the Primaset PT-30 of cyanate ester resin, Lonza company manufactures) 17.5 % by weight, as the biphenyl dimethylene type epoxy resin (NC3000 of epoxy resin, chemical drug Inc. of Japan makes, epoxy equivalent (weight) is 275) 9.5 % by weight, as spherical nano silicon (the production code member NSS-5N of the second inorganic filling material, Tokuyama company manufactures, median size is 70nm) 10.5 % by weight, as the spherical silicon dioxide (SO-31R of the 3rd inorganic filling material, Admatechs company manufactures, specific surface area is 4.5m 2/ g, median size is 1.1 μm) 54.4 % by weight and resol (MEH7851-4L, the bright and company that changes into manufactures, and hydroxyl equivalent is 187) 8.1 % by weight (W2/W3=0.19) as solidifying agent.
For the resinous varnish obtained in embodiment and comparative example, multilayer printed-wiring board, semiconductor device etc., carry out following evaluation.Assessment item and content are represented in the lump.Acquired results is shown in Table A 1.
(1) thixotropy
Use E type viscosmeter (cone-plate type rotational viscosimeter), and measure the thixotropy of resinous varnish according to JIS K7117-2.Specifically, resinous varnish 1mL is put into and measures cup central authorities and estimated viscosity, evaluate the ratio of viscosities of 5rpm/20rpm.
(2) falling property of filler Shen
After making resinous varnish, it is highly injected the graduated cylinder of 100cc with 10cm and leaves standstill.After 24 hours, the length (cm) of the transparent part be separated with visual confirmation.Calculate (10-transparent part length)/10 × 100%, evaluate falling property of filler Shen.
(3) Resin Flow
Resin Flow is according to JIS C 6521, with temperature 170 DEG C and pressure 15kgf/cm 2heating and pressurizing 5 minutes, evaluates discharge.In addition, test sample uses the uneven surface varnish obtained in embodiment being cast in 12 μm of Copper Foils, at temperature 150 DEG C after dry 5 minutes, the resin molding of the attached Copper Foil of obtained 30 μm overlap five obtained person.
(4) prepreg is immersion
The immersion of resinous varnish in prepreg, after the prepreg of above-mentioned making is solidified 1 hour with 180 DEG C of temperature in hot-air oven, observes the section of 35 and evaluate in width 530mm with 15mm interval.Use scanning electronic microscope when section is observed, observe the hole (not flooding hole) with or without non-solvent impregnated resin.Each symbol in table is as follows.
◎: position a little all do not find not flood hole.
Zero: more than 1, lower than 5 positions find do not flood hole, but be can practicality degree.
△: find not flood hole more than 5, lower than the positions of 30, can not be practical.
×: the position more than 30 finds not flood hole, can not be practical.
(5) formability
By overlapping four of the prepreg of above-mentioned making, at the Copper Foil (the 3EC-VLP paper tinsel that mining company of Mitsui Metal Co., Ltd. manufactures) of its two sides overlap 12 μm, shaping 2 hours of heating and pressurizing at pressure 3MPa, temperature 220 DEG C, obtains the metal-clad that two sides has the thickness 0.40mm of Copper Foil.In addition, when temperature is 120 DEG C, 3MPa was boosted to 5 minutes.
After whole of the Copper Foil by etching removing resultant layer lamination (510mm × 510mm size), with its formability of visual observation.
Each symbol in table is as follows.
◎: imporosity.
Zero: only have the hole being less than 10 μm in 10mm end, but be can be practical degree.
△: have the hole more than 10 μm, can not be practical.
×: there are many holes, can not be practical.
(6) thermotolerance
The thermotolerance of semiconductor device evaluates with the multi-reflow (Multi-reflow) at 260 DEG C.
Specifically, according to the J-STD-20 of IPC/JEDEC, make semiconductor device obtained above by the reflow soldering of 260 DEG C, often by 10 times, utilize UT (Ultrasonic Testing) inspection units to evaluate the stripping of the insulation layer of semiconductor device, be full of cracks, the stripping at the semiconductor element back side and the defect of solder bump, and evaluate poor flow on the hot plate of 125 DEG C.Each symbol is as follows.
After more than ◎: 40 times pass through, stripping of naked layer etc. and without poor flow.
More than zero: 20 time, be less than in 40 times pass through, stripping of naked layer etc. and without poor flow.
More than △: 10 times, be less than in 20 times pass through, create stripping of insulation layer etc. and poor flow.
×: lower than in 10 times pass through, create stripping of insulation layer etc. and poor flow.
(7) coefficient of linear thermal expansion
The Copper Foil of the metal-clad obtained is removed by etching, cut out the test piece of thickness 100 μm, area 4mm × 40mm, use TMA device (manufacture of TA Instrument company), with 5 DEG C/min of intensifications, measure the coefficient of linear thermal expansion of the scope of 25 DEG C to 150 DEG C.
(8) plating after Drilling operation infiltrates
It is evaluate as follows that plating after Drilling operation infiltrates.First, by overlapping for the above-mentioned plywood of two panels thickness 0.4mm, then, after utilizing the boring of diameter 0.2mm to implement 3000 perforates processing, the through hole plating of thickness 25 μm is implemented to formed communicating pores and forms through hole.Measure the degree of depth of plating solution in the inwall penetrating layer lamination of this through hole.In addition, boring is the production code member KMC L253 using Union Tool to manufacture, and boring revolution during perforate is 250krpm/min, and the chip load of boring is 9.6 μm/rev.Each symbol in table is as follows.
◎: depth of penetration is lower than 20 μm (well).
Zero: depth of penetration is more than 20 μm, is less than 50 μm (no problem in fact).
△: depth of penetration is more than 50 μm, is less than 100 μm (cannot use in fact).
×: depth of penetration is more than 100 μm (cannot use).
(9) through hole insulating reliability
For processing with the condition via through holes identical with the Drilling operation in above-mentioned (8), the sample of through hole plating and circuit fabrication, evaluate through hole insulating reliability as follows.That is, between 2 through holes being spaced apart 0.2mm each other between inwall, apply voltage 20V 85% time in temperature 130 DEG C, humidity, METHOD FOR CONTINUOUS DETERMINATION is until insulating resistance value reaches lower than 10 8time till Ω.
Each symbol in table is as follows.
◎: until insulating resistance value reaches lower than 10 8till Ω, be more than 500 hours (well).
Zero: until insulating resistance value reaches lower than 10 8till Ω, it is more than 200 hours, lower than 500 hours (in fact no problem).
△: until insulating resistance value reaches lower than 10 8till Ω, it is more than 100 hours, lower than 200 hours (cannot use in fact).
×: until insulating resistance value reaches lower than 10 8till Ω, for lower than 100 hours (cannot use).
(10) amount of warpage in the printed wiring board portion (encapsulation) of semiconductor device
Measure the amount of warpage in the printed wiring board portion (encapsulation) of the semiconductor device of above-mentioned making as follows.
With the chip face of semiconductor device (semiconductor element face) for lower and be positioned over and can heat in the chamber of cooling, under semiconductor device being exposed to respectively the environment of-50 DEG C and 125 DEG C, measure the change of amount of warpage in the printed wiring board portion (size in printed wiring board portion: 50mm × 50mm) of semiconductor device backside, namely with BGA face for upper and measure the change of the amount of warpage in the printed wiring board portion of 48mm × 48mm scope.Each symbol in table is as follows.
◎: the change of amount of warpage is lower than 200 μm (well).
Zero: amount of warpage be changed to more than 200 μm, lower than 300 μm (in fact no problems).
△: amount of warpage be changed to more than 300 μm, lower than 350 μm (cannot use in fact).
×: being changed to more than 350 μm (cannot use) of amount of warpage.
(11) flame retardant resistance
By overlapping for ten above-mentioned prepregs, at the Copper Foil of its two sides overlap 12 μm, shaping 2 hours of heating and pressurizing at pressure 3MPa, temperature 200 DEG C, obtains the two sides copper-clad laminated board of thickness 0.12mm.The Copper Foil of gained copper-clad laminated board is etched, according to UL-94 specification, utilizes normal beam technique to measure the flame retardant resistance of the thick test piece of 1.0mm.In addition, " V-0 " in table represents the V-0 prerequisite meeting UL-94 specification.
As table 1 is clearly known, the mobility of the resin combination obtained in embodiment A 1 ~ A12 is excellent, and the generation of warpage when making plywood (multilayer printed-wiring board) have also been obtained suppression.
Again, the thixotropy of the resinous varnish obtained in embodiment A 1 ~ A12 and filler Shen falling property excellence.Therefore, the volume production stability of this resinous varnish and the immersion excellence in prepreg.Again, the Resin Flow of this resinous varnish is also excellent, and therefore, even if highly-filled inorganic filling material, formability during making layer lamination is also good.Again, use the thermotolerance of the printed wiring board made by above-mentioned resinous varnish, low linear expansion rate, drill processability excellent.Because the through hole insulating reliability of this printed wiring board is excellent, and be low linear expansion rate, therefore PKG amount of warpage is also little, also excellent.
In contrast, the immersion and Resin Flow of the resinous varnish obtained in Comparative examples A 1 because thixotropic ratio is high, in prepreg is poor, and therefore, above-mentioned formability and thermotolerance, through hole insulating reliability are poor.Again, Comparative examples A 2 due to drill processability poor, therefore, through hole insulating reliability is poor.
[Embodiment B series]
Below, the embodiment of use second resin combination is disclosed.
(Embodiment B 1)
(1) preparation of the varnish of resinous composition
First, by polysiloxane rubber micropartical, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures, KMP-600, median size is 5 μm) 26.4 % by weight, boehmite particle (Tesco (strain) manufacture, AOH-30, median size is 1.8 μm) 18.2 % by weight and Nano particles of silicon dioxide (Tokuyama (strain) manufacture, NSS-5N, median size is 70nm) 2.4 % by weight be scattered in the solvent of ANON: MIBK=1: 1 (v/v), preparation concentration is the slurry of 65 % by weight.
In this slurry, dissolve, (Japanese chemical drug (strain) manufactures blending epoxy, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 25.4 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 21.2 % by weight and as solidifying agent resol (Japanese chemical drug (strain) manufacture, GPH-103, biphenyl aralkyl-type phenol resin) 6.4 % by weight, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark.
(2) making of prepreg
Above-mentioned resinous varnish be impregnated in glass woven fabric (thickness 94 μm, the E glass woven fabric that day east weaving manufactures, WEA-2116), in, drying 2 minutes in the process furnace of 180 DEG C, the resin combination obtained in prepreg counts the prepreg of about 49 % by weight with solids component benchmark.
(3) making of metal-clad
Use the prepreg obtained, obtain the two sides metal-clad of thickness 0.130mm in the mode identical with embodiment A 1.
(4) manufacture of printed wiring board
On obtained two sides metal-clad, in the mode identical with embodiment A 1 after two sides forms internal layer circuit [L (conductor circuit width (μm))/S (between conductor circuit width (μm))=50/50], formed concavo-convex on internal layer circuit by roughened.
Then, use vacuum laminated device, above-mentioned prepreg is layered on internal layer circuit, is heating and curing at temperature 170 DEG C 60 minutes and obtains duplexer.
Then, use the duplexer obtained, make printed wiring board in the mode identical with embodiment A 1.
The printed wiring board obtained implements ENEPIG process in the connecting electrode portion of the solder bump arrangement being equivalent to semiconductor element.ENEPIG process is undertaken by the step of following [1] ~ [8].
Observed by SEM, the metal precipitation between the fine rule of the printed wiring board made by ENEPIG operation is carried out in confirmation.
[1] clean
Use ACL-007 that village's industry (strain) manufactures as cleaning liquor, after above-mentioned test piece is flooded 5 minutes in the cleaning liquor of liquid temperature 50 DEG C, wash 3 times.
[2] soft etch processes
After clean, use the mixed solution of Sodium Persulfate and sulfuric acid as soft etching solution, after above-mentioned test piece is flooded 1 minute in the soft etching solution of liquid temperature 25 DEG C, wash 3 times.
[3] cleanup acid treatment
After soft etch processes, after above-mentioned test piece is flooded 1 minute in the sulfuric acid of liquid temperature 25 DEG C, wash 3 times.
[4] pre-preg
After cleanup acid treatment, above-mentioned test piece is flooded 1 minute in the sulfuric acid of liquid temperature 25 DEG C.
[5] palladium catalyst is given
After pre-preg, in order to give palladium catalyst to terminal part, the KAT-450 using village's industry (strain) to manufacture gives liquid as palladium catalyst.Give dipping in liquid by above-mentioned test piece at this palladium catalyst of liquid temperature 25 DEG C, after 2 minutes, to wash 3 times.
[6] electroless plating Ni process
After giving palladium catalyst operation, above-mentioned test piece is bathed dipping in (NPR-4 that upper village's industry (strain) manufactures) at the electroless plating Ni of liquid temperature 80 DEG C and, after 35 minutes, washes 3 times.
[7] electroless plating Pd process
After electroless plating Ni process, above-mentioned test piece is bathed dipping in (TPD-30 that upper village's industry (strain) manufactures) at the electroless plating Pd of liquid temperature 50 DEG C and, after 5 minutes, washes 3 times.
[8] electroless plating Au process
After electroless plating Pd process, above-mentioned test piece is bathed dipping in (TWX-40 that upper village's industry (strain) manufactures) at the electroless plating Au of liquid temperature 80 DEG C and, after 30 minutes, washes 3 times.
(5) manufacture of semiconductor device
Use printed wiring board gained being implemented ENEPIG process to cut into the size person of 50mm × 50mm, make semiconductor element in the mode identical with embodiment A 1.
(Embodiment B 2)
Except the one-tenth of slurry being divided into polysiloxane rubber micropartical, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures, KMP-600, median size is 5 μm) 32.4 % by weight, boehmite particle (Tesco (strain) manufacture, AOH-30, median size is 1.8 μm) 12.2 % by weight and Nano particles of silicon dioxide (Tokuyama (strain) manufacture, NSS-5N, median size is 70nm) beyond 2.4 % by weight, other operates identically with Embodiment B 1.
(Embodiment B 3)
In the slurry prepared in the mode identical with Embodiment B 1, dissolve, (Japanese chemical drug (strain) manufactures blending epoxy, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 18.6 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 34.4 % by weight and zinc octoate (Tokyo changes into (strain) manufacture) 0.02 % by weight as curing catalysts, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with Embodiment B 1.
(Embodiment B 4)
In the slurry prepared in the mode identical with Embodiment B 1, dissolve, (Japanese chemical drug (strain) manufactures blending epoxy, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 19.6 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 13.3 % by weight, (KI changes into (strain) manufactures maleimide resin, BMI-70, (3-ethyl-5-methyl-4-maleimide phenyl) methane, bimaleimide resin) 20.1 % by weight and zinc octoate (Tokyo changes into (strain) manufacture) 0.02 % by weight as curing catalysts, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with Embodiment B 1.
(Embodiment B 5)
In the slurry prepared in the mode identical with Embodiment B 1, dissolve, (Dongdu changes into (strain) manufactures blending epoxy, ESN-375, naphthalene type epoxy resin, weight average molecular weight is 700, softening temperature is 75 DEG C, epoxy equivalent (weight) is 167g/eq) 25.4 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 21.2 % by weight and as solidifying agent resol (Japanese chemical drug (strain) manufacture, GPH-103, biphenyl aralkyl-type phenol resin) 6.4 % by weight, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with Embodiment B 1.
(Embodiment B 6)
In the slurry prepared in the mode identical with Embodiment B 1, dissolve, (Japanese chemical drug (strain) manufactures blending epoxy, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 25.4 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 21.2 % by weight and as solidifying agent resol (bright and change into (strain) manufacture, MEH-7500, triphenyl methane type resol, hydroxyl equivalent is 97g/eq) 6.4 % by weight, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with Embodiment B 1.
(comparative example B1)
By polysiloxane rubber micropartical, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures, KMP-600, median size is 5 μm) 37.5 % by weight and silicon dioxide granule (Admatechs (strain) manufacture, SO-25R, median size is 0.5 μm) 2.5 % by weight be scattered in the solvent of ANON: MIBK=1: 1 (v/v), the slurry of preparation concentration 65 % by weight.
In this slurry, dissolve, (Dongdu changes into (strain) manufactures blending epoxy, ESN-375, naphthalene type epoxy resin, weight average molecular weight is 700, softening temperature is 75 DEG C, epoxy equivalent (weight) is 167g/eq) 38.0 % by weight and as solidifying agent resol (bright and change into (strain) manufacture, MEH-7500, triphenyl methane type resol, hydroxyl equivalent is 97g/eq) 22.0 % by weight, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example D1.
(comparative example B2)
Except the one-tenth of slurry being divided into boehmite particle, (Tesco (strain) manufactures, AOH-30, median size is 1.8 μm) 18.2 % by weight, Nano particles of silicon dioxide (Tokuyama (strain) manufacture, NSS-5N, median size is 70nm) 2.4 % by weight and silicon dioxide granule (Admatechs (strain) manufacture, SO-25R, median size is 0.5 μm) beyond 26.4 % by weight, operate identically with Embodiment B 1.
(comparative example B3)
Except the one-tenth of slurry being divided into polysiloxane rubber micropartical, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures, KMP-600, median size is 5 μm) 18.2 % by weight, Nano particles of silicon dioxide (Tokuyama (strain) manufacture, NSS-5N, median size is 70nm) 2.4 % by weight and silicon dioxide granule (Admatechs (strain) manufacture, SO-25R, median size is 0.5 μm) beyond 26.4 % by weight, operate identically with Embodiment B 1.
(comparative example B4)
Except the one-tenth of slurry being divided into boehmite particle, (Tesco (strain) manufactures, AOH-30, median size is 1.8 μm) 20.6 % by weight and silicon dioxide granule (Admatechs (strain) manufacture, SO-25R, median size is 0.5 μm) beyond 26.4 % by weight, operate identically with Embodiment B 1.
(comparative example B5)
Except the one-tenth of slurry being divided into boehmite particle, (Tesco (strain) manufactures, AOH-30, median size is 1.8 μm) 44.6 % by weight and Nano particles of silicon dioxide (Tokuyama (strain) manufacture, NSS-5N, median size is 70nm) beyond 2.4 % by weight, operate identically with Embodiment B 1.
For the prepreg obtained in embodiment and comparative example, metal-clad, printed wiring board and semiconductor device etc., carry out following evaluation.Assessment item and content are represented in the lump.
Acquired results is shown in table B1.
(1) coefficient of linear thermal expansion
The Copper Foil of the metal-clad obtained is removed by etching, cut out 2mm × 2mm as evaluation sample, use TMA device (manufacture of TA Instrument company), be warming up to 30 ~ 150 DEG C with the condition of 10 DEG C/min, measure the coefficient of linear thermal expansion (CTE) of the thickness direction (Z-direction) of 50 ~ 100 DEG C.
(2) flame retardant resistance
The two sides metal-clad of thickness 1.02mm is obtained in the mode identical with embodiment A 1.The Copper Foil of the metal-clad obtained is etched, according to UL-94 specification, measures by normal beam technique the flame retardant resistance that thickness is the test piece of 1.0mm.
V-0: the prerequisite meeting the V-0 of UL-94 specification.
Outside specification: in 5 test pieces, not burning person is completely more than 1.
(3) boring abradability
The metal level lamination obtained three is overlapping, utilizes the drill bit (UVL0950) that Union Tool (strain) manufactures, and under the boring Drilling operation condition of speed of rotation 160rpm, transfer rate 3.2m/ minute, carries out perforate process in 3000 times (3000 hole).Bore cutter width before using is set to 100%, measures the survival rate of the bore cutter width after using, evaluate boring abradability.
(4) prepreg is immersion
Observe the section of gained metal-clad.It is use scanning electronic microscope that section is observed.Immersion is evaluate with the area of hole viewed in section observations.
Zero: lower than the total area 10% position find do not flood hole, but be can practicality degree.
△: the total area 10 ~ 30% position find not flood hole, can not be practical.
×: the total area more than 50% position find not flood hole, can not be practical.
(5) de-smear patience
The structure obtained for being removed by the Copper Foil of above-mentioned metal-clad by etching, (Hitachi Via Mechanics (strain) manufactures: LG-2G212), form 500 to use carbonic acid laser aid through hole, and 70 DEG C swelling liquid (Atotech Japan company manufacture, Swelling Dip Securiganth P) in dipping 5 minutes, and then 80 DEG C potassium permanganate solution (Atotech Japan company manufacture, Concentrate Compact CP) in dipping 15 minutes after, neutralized and carried out roughened, being carried out de-smear process thus.Measure the thickness of the structure before and after de-smear process, evaluated for film reduction [(before process the rear thickness of thickness-process)/(before process thickness)].
(6) the generation situation of muscle shape spot
In Fig. 4, (1) for the surface of metal-clad obtained in shooting Embodiment B 1 and obtain photo, (2) for the surface of metal-clad obtained in shooting comparative example B1 and the photo that obtains be the figure that the surface picture of the metal foil layer of metal-clad is described with (3).As shown in the photo, create muscle shape spot on the surface of the metal foil layer of the metal-clad of comparative example B1, and do not find muscle shape spot on the surface of the metal foil layer of the metal-clad of Embodiment B 1.
(7) ENEPIG characteristic
Metal between the fine rule of the above-mentioned printed wiring board made through ENEPIG process is separated out and carries out SEM observation, and by confirming with the identical evaluation of embodiment A series.
[table 2]
Table B1
(1) part that due to the immersion difference of prepreg of test piece, therefore, selected fillibility is high measures.
(2) although the result of numerical value and embodiment is equal, test piece is the state containing very a large amount of holes, cannot contrast objectively with embodiment.
According to the evaluation result described in table B1, known following situation.
In comparative example B1, owing to not using specific Nano particles of silicon dioxide and boehmite particle in the present invention, cause the immersion difference of prepreg, therefore linear expansivity, flame retardant resistance, de-smear patience and ENEPIG characteristic do not reach degree that can be practical.
In comparative example B2, owing to not using specific polysiloxane rubber micropartical and Nano particles of silicon dioxide in the present invention, cause the immersion difference of prepreg, therefore, de-smear patience and ENEPIG characteristic do not reach degree that can be practical.
In addition, although the result of the numerical value of comparative example B1 boring abradability and embodiment on an equal basis, test piece is the state containing very a large amount of holes, cannot contrast objectively with embodiment.
Again, in the linear expansivity test of comparative example B1, the immersion difference of the prepreg due to test piece, therefore, the part that have selected fillibility high measures.
The linear expansivity of the resin combination of the present invention, prepreg, metal-clad, printed wiring board and the semiconductor device that obtain in Embodiment B 1 ~ B6, flame retardant resistance, boring abradability, prepreg are immersion, de-smear patience and ENEPIG characteristic all good.Therefore known, specific in the application of the invention, be characterized as resin combination containing epoxy resin, polysiloxane rubber micropartical, boehmite particle and Nano particles of silicon dioxide, the prepreg of availability excellence, metal-clad, printed wiring board and semiconductor device.
[reference example C series]
Below, the reference example using the 3rd resin combination of the present invention is disclosed.
(reference example C1)
(1) preparation of the varnish (resinous varnish) of resinous composition
First, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures to make polysiloxane rubber micropartical, KMP-600, median size is 5 μm) 37.5 % by weight and Nano particles of silicon dioxide (Tokuyama (strain) manufacture, NSS-5N, median size is 70nm) 2.5 % by weight be scattered in pimelinketone (ANON): in the solvent of methyl iso-butyl ketone (MIBK) (MIBK)=1: 1 (v/v), preparation concentration is the slurry of 65 % by weight.
In this slurry, dissolve, (Japanese chemical drug (strain) manufactures blending epoxy, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 28.7 % by weight, cyanate ester resin (Lonza Japan (strain) manufacture, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 24.0 % by weight, resol (Japanese chemical drug (strain) manufacture, GPH-103, biphenyl aralkyl-type phenol resin) 7.3 % by weight as solidifying agent.Then, use high-speed stirring apparatus to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark.
(2) making of prepreg
Use above-mentioned resinous varnish, obtain prepreg in the mode identical with Embodiment B 1.
(3) making of metal-clad
Use the prepreg obtained, obtain the two sides metal-clad of thickness 0.130mm in the mode identical with embodiment A 1.
(4) manufacture of printed wiring board
Use the two sides metal-clad obtained, in the mode identical with Embodiment B 1, make printed wiring board, and implement ENEPIG process.
(5) manufacture of semiconductor device
Use the size person printed wiring board through ENEPIG process obtained being cut into 50mm × 50mm, make semiconductor device in the mode identical with embodiment A 1.
(reference example C2)
Except the one-tenth of slurry being divided into polysiloxane rubber micropartical, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures, KMP-600, median size is 5 μm) 32.5 % by weight, Nano particles of silicon dioxide (Tokuyama (strain) manufacture, NSS-5N, median size is 70nm) 2.5 % by weight and silicon dioxide granule (Admatechs (strain) manufacture, SO-25R, median size is 0.5 μm) beyond 5.0 % by weight, other operates identically with reference example C1.
(reference example C3)
(SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures to make polysiloxane rubber micropartical, KMP-600, median size is 5 μm) 37.5 % by weight and Nano particles of silicon dioxide (Tokuyama (strain) manufacture, NSS-5N, median size is 70nm) 2.5 % by weight be scattered in the solvent of ANON: MIBK=1: 1 (v/v), preparation concentration is the slurry of 65 % by weight.
In this slurry, dissolve, (Japanese chemical drug (strain) manufactures blending epoxy, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 21.0 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 39.0 % by weight and zinc octoate (Tokyo changes into (strain) manufacture) 0.02 % by weight as curing catalysts, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example C1.
(reference example C4)
In the slurry prepared in the mode identical with reference example C3, dissolve, (Japanese chemical drug (strain) manufactures blending epoxy, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 22.2 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 15.0 % by weight, (KI changes into (strain) manufactures maleimide resin, BMI-70, (3-ethyl-5-methyl-4-maleimide phenyl) methane, bimaleimide resin) 22.8 % by weight and zinc octoate (Tokyo changes into (strain) manufacture) 0.02 % by weight as curing catalysts, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example C1.
(reference example C5)
In the slurry prepared in the mode identical with reference example C3, dissolve, (Dongdu changes into (strain) manufactures blending epoxy, ESN-375, naphthalene type epoxy resin, weight average molecular weight is 700, softening temperature is 75 DEG C, epoxy equivalent (weight) is 167g/eq) 28.7 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 24.0 % by weight and as solidifying agent resol (Japanese chemical drug (strain) manufacture, GPH-103, biphenyl aralkyl-type phenol resin) 7.3 % by weight, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example C1.
(reference example C6)
In the slurry prepared in the mode identical with reference example C3, dissolve, (Japanese chemical drug (strain) manufactures blending epoxy, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 28.7 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 24.0 % by weight and as solidifying agent resol (bright and change into (strain) manufacture, MEH-7500, triphenyl methane type resol, hydroxyl equivalent is 97g/eq) 7.3 % by weight, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example C1.
(reference example C7)
Except the one-tenth of slurry being divided into polysiloxane rubber micropartical, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures, KMP-605, median size is 2 μm) 37.5 % by weight and Nano particles of silicon dioxide (Tokuyama (strain) manufacture, NSS-5N, median size is 70nm) beyond 2.5 % by weight, other operates identically with reference example C1.
(reference example C8)
Except the one-tenth of slurry being divided into polysiloxane rubber micropartical, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures, KMP-597, median size is 5 μm) 37.5 % by weight and Nano particles of silicon dioxide (Tokuyama (strain) manufacture, NSS-5N, median size is 70nm) beyond 2.5 % by weight, other operates identically with reference example C1.
(with reference to comparative example C1)
(SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures to make polysiloxane rubber micropartical, KMP-600, median size is 5 μm) 37.5 % by weight and silicon dioxide granule (Admatechs (strain) manufacture, SO-25R, median size is 0.5 μm) 2.5 % by weight be scattered in the solvent of ANON: MIBK=1: 1 (v/v), preparation concentration is the slurry of 65 % by weight.
In this slurry, dissolve, (Dongdu changes into (strain) manufactures blending epoxy, ESN-375, naphthalene type epoxy resin, weight average molecular weight is 700, softening temperature is 75 DEG C, epoxy equivalent (weight) is 167g/eq) 38.0 % by weight and as solidifying agent resol (bright and change into (strain) manufacture, MEH-7500, triphenyl methane type resol, hydroxyl equivalent is 97g/eq) 22.0 % by weight, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example C1.
(with reference to comparative example C2)
Except the one-tenth of slurry being divided into polysiloxane rubber micropartical, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures, KMP-600, median size is 5 μm) 37.5 % by weight and silicon dioxide granule (Admatechs (strain) manufacture, SO-25R, median size is 0.5 μm) beyond 2.5 % by weight, other operates identically with reference example C1.
(with reference to comparative example C3)
Except the one-tenth of slurry being divided into silicon dioxide granule, (Admatechs (strain) manufactures, SO-25R, median size is 0.5 μm) 37.5 % by weight and Nano particles of silicon dioxide (Tokuyama (strain) manufacture, NSS-5N, median size is 70nm) beyond 2.5 % by weight, other operates identically with reference example C1.
(with reference to comparative example C4)
Beyond the one-tenth of slurry being divided into polysiloxane rubber micropartical (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures, KMP-600, and median size is 5 μm) 40.0 % by weight, other operates identically with reference example C1.
For reference example and with reference to prepreg, metal-clad, printed wiring board and the semiconductor device etc. that obtain in comparative example, carry out that (1) coefficient of linear thermal expansion, (2) flame retardant resistance, (3) boring abradability, (4) prepreg are immersion, (5) de-smear patience, the generation situation of (6) muscle shape spot, the evaluation of (7) ENEPIG characteristic.The evaluation of projects, except (5), is carry out in the mode identical with Embodiment B series.
Acquired results is shown in table C1.
About (5) de-smear patience, except to being undertaken except de-smear process by the duplexer of overlapping four of above-mentioned prepreg, other is serial with Embodiment B operates identically.
About the generation situation of (6) muscle shape spot, in Fig. 5, (1) is the surface of metal-clad obtained in shooting reference example C1 and the photo, (2) that obtain are the surface of metal-clad obtained in shooting reference comparative example C1 and the photo that obtains and (3) are the figure be described the photo on the surface of the metal foil layer of metal-clad.As shown in the photo, create muscle shape spot on the surface of the metal foil layer of the metal-clad with reference to comparative example C1, and do not find muscle shape spot on the surface of the metal foil layer of the metal-clad of reference example C1.
Evaluation result described in table 3, learns following situation.
At reference comparative example C1 and with reference in comparative example C2, owing to not using specific Nano particles of silicon dioxide in the 3rd resin combination of the present invention, cause the immersion difference of prepreg, therefore, linear expansivity, flame retardant resistance, de-smear patience and ENEPIG characteristic do not reach degree that can be practical.
With reference in comparative example C3, owing to not using specific polysiloxane rubber micropartical in the 3rd resin combination of the present invention, boring abradability does not reach degree that can be practical.
With reference in comparative example C4, owing to employing specific polysiloxane rubber micropartical in a large amount of the 3rd resin combinations of the present invention, therefore, although linear expansivity is good, but owing to not using specific Nano particles of silicon dioxide in the 3rd resin combination of the present invention, cause the immersion difference of prepreg, therefore flame retardant resistance, de-smear patience and ENEPIG characteristic do not reach degree that can be practical.
In addition, although the result of the numerical value of reference comparative example C1, reference comparative example C2 and reference comparative example C4 boring abradability and embodiment on an equal basis, test piece is the state containing very a large amount of holes, cannot contrast objectively with reference example.
Again, with reference to comparative example C1, with reference to comparative example C2 with in testing with reference to the linear expansivity of comparative example C4, the immersion difference of the prepreg due to test piece, therefore, the part that selected fillibility is high measures.
The linear expansivity of the resin combination of the present invention, prepreg, metal-clad, printed wiring board and the semiconductor device that obtain in reference example C1 ~ C8, flame retardant resistance, boring abradability, prepreg are immersion, de-smear patience and ENEPIG characteristic all good.Therefore known, specific in the application of the invention, be characterized as comprise epoxy resin, polysiloxane rubber micropartical and Nano particles of silicon dioxide containing the atomic resin combination of polysiloxane rubber, the prepreg of availability excellence, metal-clad, printed wiring board and semiconductor device.
[reference example D series]
Below, the reference example using the 4th resin combination of the present invention is disclosed.
(reference example D1)
(1) preparation of the varnish (resinous varnish) of resinous composition
(Japanese chemical drug (strain) manufactures to make epoxy resin, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 21.0 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 39.0 % by weight, zinc octoate (Tokyo changes into (strain) manufactures) 0.02 % by weight, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures polysiloxane rubber micropartical, KMP-605, median size is 2 μm) 37.0 % by weight and barium sulfate particles (Sakai chemistry manufacture, BF-21, median size is 50nm) 3.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark.
(2) making of prepreg
Use above-mentioned resinous varnish, obtain prepreg in the mode identical with Embodiment B 1.
(3) making of metal-clad
Use the prepreg obtained, obtain in the mode identical with embodiment A 1 the two sides metal-clad that thickness is 0.430mm.
(4) manufacture of printed wiring board
Use the two sides metal-clad obtained, in the mode identical with Embodiment B 1, make printed wiring board, and implement ENEPIG process.
(5) manufacture of semiconductor device
Use the size person printed wiring board through ENEPIG process obtained being cut into 50mm × 50mm, make semiconductor device in the mode identical with embodiment A 1.
(reference example D2)
(Japanese chemical drug (strain) manufactures to make epoxy resin, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 21.0 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 39.0 % by weight, zinc octoate (Tokyo changes into (strain) manufactures) 0.02 % by weight, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures polysiloxane rubber micropartical, KMP-605, median size is 2 μm) 32.0 % by weight, (Sakai chemistry manufactures barium sulfate particles, BF-21, median size is 50nm) 3.0 % by weight and silicon dioxide granule (Admatechs (strain) manufacture, SO-25R, median size is 0.5 μm) 5.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example D1.
(reference example D3)
(Japanese chemical drug (strain) manufactures to make epoxy resin, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 22.2 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 15.0 % by weight, (KI changes into (strain) manufactures maleimide resin, BMI-70, (3-ethyl-5-methyl-4-maleimide phenyl) methane, bimaleimide resin) 22.8 % by weight, zinc octoate (Tokyo changes into (strain) manufactures) 0.02 % by weight, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures polysiloxane rubber micropartical, KMP-605, median size is 2 μm) 37.0 % by weight and barium sulfate particles (Sakai chemistry manufacture, BF-21, median size is 50nm) 3.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example D1.
(reference example D4)
(Japanese chemical drug (strain) manufactures to make epoxy resin, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 28.7 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 24.0 % by weight, resol (bright and change into (strain) manufacture, MEH-7851-H, biphenyl aralkyl-type phenol resin) 7.3 % by weight, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures polysiloxane rubber micropartical, KMP-605, median size is 2 μm) 37.0 % by weight, (Sakai chemistry manufactures barium sulfate particles, BF-21, median size is 50nm) 3.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example D1.
(reference example D5)
(Japanese chemical drug (strain) manufactures to make epoxy resin, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 28.7 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 24.0 % by weight, resol (bright and change into (strain) manufacture, MEH-7500, triphenyl methane type resol, hydroxyl equivalent is 97g/eq) 7.3 % by weight, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures polysiloxane rubber micropartical, KMP-605, median size is 2 μm) 37.0 % by weight, (Sakai chemistry manufactures barium sulfate particles, BF-21, median size is 50nm) 3.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example D1.
(reference example D6)
(Dongdu changes into (strain) manufactures to make epoxy resin, ESN-375, naphthalene type epoxy resin, weight average molecular weight is 700, softening temperature is 75 DEG C, epoxy equivalent (weight) is 167g/eq) 21.0 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 39.0 % by weight, zinc octoate (Tokyo changes into (strain) manufactures) 0.02 % by weight, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures polysiloxane rubber micropartical, KMP-605, median size is 2 μm) 37.0 % by weight, (Sakai chemistry manufactures barium sulfate particles, BF-21, median size is 50nm) 3.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, identical with reference example D1 operates.
(reference example D7)
(Japanese chemical drug (strain) manufactures to make epoxy resin, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 21.0 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 39.0 % by weight, zinc octoate (Tokyo changes into (strain) manufactures) 0.02 % by weight, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures polysiloxane rubber micropartical, KMP-597, median size is 5 μm) 37.0 % by weight, (Sakai chemistry manufactures barium sulfate particles, BF-21, median size is 50nm) 3.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example D1.
(reference example D8)
(Japanese chemical drug (strain) manufactures to make epoxy resin, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 21.0 % by weight, cyanate ester resin (is synthesized by the method for Japanese Unexamined Patent Publication 2009-35728, naphthols aralkyl-type cyanate ester resin) 39.0 % by weight, zinc octoate (Tokyo changes into (strain) manufactures) 0.02 % by weight, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures polysiloxane rubber micropartical, KMP-605, median size is 2 μm) 37.0 % by weight, (Sakai chemistry manufactures barium sulfate particles, BF-21, median size is 50nm) 3.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example D1.
(reference example D9)
(Japanese chemical drug (strain) manufactures to make epoxy resin, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 21.0 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 39.0 % by weight, zinc octoate (Tokyo changes into (strain) manufactures) 0.02 % by weight, (Sakai chemistry manufactures barium sulfate particles, BF-21, median size is 50nm) 3.0 % by weight, (Admatechs (strain) manufactures silicon dioxide granule, SO-25R, median size is 0.5 μm) 37.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example D1.
(with reference to Comparative Example D 1)
(Dongdu changes into (strain) manufactures to make epoxy resin, ESN-375, naphthalene type epoxy resin, weight average molecular weight is 700, softening temperature is 75 DEG C, epoxy equivalent (weight) is 167g/eq) 38.0 % by weight, resol (bright and change into (strain) manufacture, MEH-7500, triphenyl methane type resol, hydroxyl equivalent is 97g/eq) 22.0 % by weight, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures polysiloxane rubber micropartical, KMP-605, median size is 2 μm) 37.0 % by weight, (Admatechs (strain) manufactures silicon dioxide granule, SO-25R, median size is 0.5 μm) 3.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example D1.
(with reference to Comparative Example D 2)
(Japanese chemical drug (strain) manufactures to make epoxy resin, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 21.0 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 39.0 % by weight, zinc octoate (Tokyo changes into (strain) manufactures) 0.02 % by weight, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures polysiloxane rubber micropartical, KMP-605, median size is 2 μm) 37.0 % by weight, (Admatechs (strain) manufactures silicon dioxide granule, SO-25R, median size is 0.5 μm) 3.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example D1.
(with reference to Comparative Example D 3)
(Japanese chemical drug (strain) manufactures to make epoxy resin, NC3000, biphenyl aralkyl-type epoxy resin, weight average molecular weight is 1300, softening temperature is 57 DEG C, epoxy equivalent (weight) is 276g/eq) 21.0 % by weight, (Lonza Japan (strain) manufactures cyanate ester resin, PT30, phenolic varnish type cyanate ester resin, weight average molecular weight is 380) 39.0 % by weight, zinc octoate (Tokyo changes into (strain) manufactures) 0.02 % by weight, (SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures polysiloxane rubber micropartical, KMP-605, median size is 2 μm) 40.0 % by weight dissolvings, be mixed in pimelinketone, high-speed stirring apparatus is used to stir, obtain the resinous varnish containing the resin combination counting 70 % by weight with solids component benchmark, in addition, operate identically with reference example D1.
For reference example and with reference to prepreg, metal-clad, printed wiring board and the semiconductor device etc. that obtain in comparative example, carry out that (1) coefficient of linear thermal expansion, (2) flame retardant resistance, (3) boring abradability, (4) prepreg are immersion, (5) de-smear patience, the generation situation of (6) muscle shape spot, the evaluation of (7) ENEPIG characteristic.The evaluation of projects carries out in the mode identical with Embodiment B series.
Acquired results is shown in table D1 and table D2.
In addition, about (2) flame retardant resistance, " burning completely " in table represents in 5 test pieces, and not burning person is completely more than 1.
About the generation situation of (6) muscle shape spot, in Fig. 6, (1) is the photo on the surface of metal-clad obtained in shooting reference example D1, (2) be the photo of shooting with reference to the surface of the metal-clad obtained in Comparative Example D 1 are the figure be described the photo on the metal foil layer surface of metal-clad with (3).As shown in the photo, create muscle shape spot on the surface of the metal foil layer of the metal-clad with reference to Comparative Example D 1, and do not find muscle shape spot on the surface of the metal foil layer of the metal-clad of reference example D1.
[table 4]
Table D1
[table 5]
Table D2
In table D1 and table D2 1) ~ 11) as follows.
1) Japanese chemical drug (strain) manufactures, NC3000
2) Dongdu changes into (strain) manufacture, ESN-375
3) Lonza Japan (strain) manufactures, PT30
4) bright and change into (strain) manufacture, MEH-7851-H
5) bright and change into (strain) manufacture, MEH-7500
6) KI changes into (strain) manufacture, BMI-70
7) Tokyo changes into (strain) manufacture, reagent
8) SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures, and KMP-605, median size is 2 μm
9) SHIN-ETSU HANTOTAI's chemical industry (strain) manufactures, and KMP-597, median size is 5 μm
10) Sakai chemistry manufactures, and BF-21, median size is 50nm
11) Admatechs (strain) manufactures, and SO-25R, median size is 0.5 μm
According to the evaluation result described in table D1 and table D2, learn following situation.
With reference to Comparative Example D 1 and with reference in Comparative Example D 2, owing to not using specific barium sulfate particles in the present invention, cause the immersion difference of prepreg, therefore linear expansivity, flame retardant resistance, de-smear patience and ENEPIG characteristic do not reach degree that can be practical.
With reference in Comparative Example D 3, owing to using a large amount of polysiloxane rubber microparticals, therefore, linear expansivity is good, but owing to not using specific barium sulfate particles in the present invention, cause the immersion difference of prepreg, therefore flame retardant resistance, de-smear patience and ENEPIG characteristic do not reach degree that can be practical.
The linear expansivity of the resin combination of the present invention, prepreg, metal-clad, printed wiring board and the semiconductor device that obtain in reference example D1 ~ D9, flame retardant resistance, prepreg are immersion, de-smear patience and ENEPIG characteristic all good.Therefore known, specific in the application of the invention, be characterized as the resin combination of barium sulfate-containing particle comprising epoxy resin, barium sulfate particles, the prepreg of availability excellence, metal-clad, printed wiring board and semiconductor device.
[reference example E series]
Below, the reference example using the 5th resin combination of the present invention is disclosed.
(reference example E1)
(1) preparation of the varnish (resinous varnish) of resinous composition
Make naphthalene type 4 functional epoxy resins (the production code member HP-4700 as epoxy resin, DIC company manufactures, epoxy equivalent (weight) is 165) 17.5 % by weight, as biphenyl alkylene fundamental mode novolac resin (the production code member MEH-7851-3H of phenol solidifying agent, bright and the company that changes into manufactures, hydroxyl equivalent is 230) 17.3 % by weight, as curing catalyst imidazoles (four countries change into industrial manufacture, production code member 2E4MZ) 0.1 % by weight, as boehmite (the He He lime company manufacture of the first packing material, production code member BMT-3L, median size is 2.9 μm, 1% heat decomposition temperature is 420 DEG C) 61.4 % by weight, as spherical nano silicon (the production code member NSS-5N of the second packing material, Tokuyama company manufactures, median size is 70nm, vinyl silanes item for disposal) 3.5 % by weight, as epoxy radicals silicone hydride (the production code member A-187 of coupling agent, organosilicon company of GE Toshiba manufactures) 0.2 % by weight, dissolve, be mixed in methyl iso-butyl ketone (MIBK).Then, use high-speed stirring apparatus to stir the mixture obtained, thus prepare resinous varnish.
(2) making of prepreg
Use above-mentioned resinous varnish, obtain prepreg in the mode identical with embodiment A 1.
(3) making of metal-clad
Use the prepreg obtained, obtain in the mode identical with embodiment A 1 the two sides metal-clad that thickness is 0.40mm.
(4) manufacture of printed wiring board
Use two sides to have the above-mentioned metal-clad of Copper Foil, obtain printed wiring board in the mode identical with embodiment A 1.
(5) manufacture of semiconductor device
Use the printed wiring board obtained, make semiconductor device in the mode identical with embodiment A 1.
(reference example E2 ~ E12 and reference Comparative Example E 1)
In reference example E2 ~ E12, reference Comparative Example E 1, except preparing except resinous varnish according to the cooperation composition table described in table E1 and table E2, other makes resinous varnish, prepreg, metal-clad, printed wiring board and semiconductor device in the mode identical with reference example E1.
In addition, the raw material used is as follows.
(1) cyanate ester resin/phenolic varnish type cyanate ester resin: Lonza Japan company manufactures, and " Primaset PT-30 ", cyanate equivalent is 124
(2) epoxy resin/naphthalene type 4 functional epoxy resins: DIC company manufactures, and " HP-4700 ", epoxy equivalent (weight) is 165g/eq
(3) epoxy resin/biphenyl dimethylene type epoxy resin: Japanese chemical drug Inc. makes, " NC-3000H ", and epoxy equivalent (weight) is 275
(4) phenol solidifying agent/biphenyl alkylene fundamental mode novolac resin: the bright and company that changes into manufactures, and " MEH-7851-3H ", hydroxyl equivalent is 230
(5) curing catalyst/imidazoles: four countries change into industrial and manufacture, " 2E4MZ "
(6) the first packing materials/boehmite: He He lime company manufactures, and " BMT-3L ", median size is 2.9 μm
(7) the first packing materials/thermotolerance aluminium hydroxide: He He lime company manufactures, and " AHL-F ", median size is 3 μm
(8) the first packing materials/talcum: talcum company of Fuji manufactures, and " LMS-200 ", median size is 5.0 μm
(9) the first packing materials/spherical silicon dioxide: Admatechs company manufactures, and " SO-25R ", median size is 0.5 μm
(10) the first packing materials/spherical silicon dioxide: Admatechs company manufactures, and " SO-31R ", median size is 1.0 μm
(11) the first packing materials/polysiloxane powder: chemical industrial company of SHIN-ETSU HANTOTAI manufactures, and " KMP-605 ", median size is 2 μm
(12) the first packing materials/polysiloxane powder: chemical industrial company of SHIN-ETSU HANTOTAI manufactures, and " KMP-600 ", median size is 5 μm
(13) the second packing materials/spherical silicon dioxide: Tokuyama company manufactures, and " NSS-5N ", median size is 70nm, vinyl silanes item for disposal
(14) the second packing materials/spherical silicon dioxide: Tokuyama company manufactures, and " NSS-5N ", median size is 70nm, epoxy radicals silicone hydride item for disposal
(15) the second packing materials/spherical silicon dioxide: Admatechs company manufactures, and " Admanano ", median size is 50nm, vinyl silanes item for disposal
(16) the second packing materials/spherical silicon dioxide: Admatechs company manufactures, and " Admanano ", median size is 25nm, vinyl silanes item for disposal
(17) coupling agent/epoxy radicals silicone hydride: organosilicon company of GE Toshiba manufactures, " A-187 "
For reference example and with reference to comparative example resinous varnish, use the prepreg made by this resinous varnish, metal-clad, printed wiring board and semiconductor device etc. to evaluate, show the result in table E1 and table E2.
[table 6]
Table E1
[table 7]
Table E2
Below the content of the assessment item recorded in above-mentioned table E1 and table E2 is described.Again, Fig. 7 represents the section FE-SEM photo of the plywood obtained in reference example E1.Again, Fig. 8 represents the section FE-SEM photo of the plywood obtained in reference example E9.
(1) thixotropy
With the thixotropy of the mode evaluating resin varnish identical with embodiment A series.
(2) dispersed (hondrometer)
The dispersiveness of resinous varnish uses hondrometer (Cotec company manufactures, Elcometer KP-2020-2) to evaluate.Specifically, by hondrometer (grind gauge) horizontal positioned, flow into resinous varnish in darker groove after, by scraper with the direction of groove vertical on the speed of equalization, and to scrape to the degree of depth as zero with 1 ~ 2 second.Within in 3 seconds, with relative to groove direction for right angle and angle 20 ~ 30 ° are observed, measure and occur the number of division (particle diameter of agglutinator) of significant spot.The each symbol recorded in table E1 and E2 is as follows.
Zero: without the agglutinator of more than 20 μm.
△: have more than 20 μm, agglutinator lower than 50 μm.
×: the agglutinator having more than 50 μm.
(3) dispersed (size-grade distribution)
The dispersiveness of resinous varnish uses laser diffraction formula particle size distribution device (HORIBA manufactures, LA-500) to evaluate.Specifically, resinous varnish about 100 μ L is fed in the evaluation groove filling ketone system organic solvent, reads the value after stablizing.Make the size-grade distribution of packing material with volume reference, its median particle diameter is evaluated as median size.The each symbol recorded in table E1 and E2 is as follows.
Zero: without the agglutinator of more than 20 μm.
△: have more than 20 μm, agglutinator lower than 50 μm.
×: the agglutinator having more than 50 μm.
(4) prepreg is immersion
The immersion of prepreg evaluates in the mode identical with embodiment A series.
(5) formability
Evaluation reference embodiment and the formability with reference to the plywood (510mm × 510mm is square) obtained in comparative example.Specifically, after being divided into about 250mm × 250mm square the plywood the obtained cutting fourth class with stapling machine, by Copper Foil etching removing.With visual observation plywood surface and evaluate.
The each symbol recorded in table E1 and E2 is as follows.
◎: imporosity.
Zero: only have the hole being less than 10 μm in 10mm end.
△: have the hole more than 10 μm.
×: there are many holes.
(6) thermotolerance
The thermotolerance of semi-conductor is evaluated in the mode identical with embodiment A series.
(7) coefficient of linear thermal expansion
Use the metal-clad obtained, measure coefficient of linear thermal expansion in the mode identical with embodiment A series.
(8) the plating accessibility after Drilling operation
Use the metal-clad obtained, evaluate the plating after Drilling operation in the mode identical with embodiment A series and infiltrate.
(9) through hole insulating reliability
Use the metal-clad obtained, evaluate through hole insulating reliability in the mode identical with embodiment A series.
(10) amount of warpage in the printed wiring board portion of semiconductor device
The amount of warpage in the printed wiring board portion of above-mentioned made semiconductor device is measured in the mode identical with embodiment A series.
(11) flame retardant resistance
In the manufacture of above-mentioned plywood, except carrying out at heating and pressurizing being formed in temperature 200 DEG C, obtain the two sides copper-clad laminated board of thickness 0.4mm in an identical manner.The Copper Foil of the copper-clad laminated board obtained is etched, according to UL-94 specification, measures by normal beam technique the flame retardant resistance that thickness is the test piece of 0.4mm.
From table E1 clearly, the mobility of the resinous varnish obtained in reference example El ~ E12 is excellent, and the generation of warpage when making plywood have also been obtained suppression.Again, can confirm according to Fig. 7, be adsorbed with the ball filler (silicon-dioxide) as the second packing material in the periphery of the first packing material (being boehmite in Fig. 1).Also can confirm in Fig. 8, be adsorbed with the ball filler (silicon-dioxide) as the second packing material in the periphery of the silicone as the first packing material.
The thixotropy of the resinous varnish obtained in reference example E1 ~ E12 and filler Shen falling property excellence.Therefore, the volume production stability of this resinous varnish and the immersion excellence in prepreg.Again, this resinous varnish due to Resin Flow also excellent, therefore, even if highly-filled inorganic filling material, formability during making layer lamination is also good.Again, thermotolerance, low linear expansion rate, drill processability excellence during printed wiring board is made.Therefore, through hole insulating reliability is excellent, and linear expansivity is low, and thus, the amount of warpage in the printed wiring board portion of semiconductor device is also less and excellent.
In contrast to this, with reference to Comparative Example E 1 because thixotropy is high, and immersion and Resin Flow in prepreg is poor, therefore, causes the result of formability and thermotolerance, through hole insulating reliability difference.
The explanation of Reference numeral
1 base material
2 steeping vats
3 resinous varnishs
4 dip rolls
5 extrusion rolls
6 drying machines
7 prepregs
8 upper roll
The tinsel of 10 attached insulating resin layers
11 tinsels
12 insulating resin layers
20 base materials
The polymeric membrane sheet material of 30 attached insulating resin layers
31 polymeric membrane sheet materials
32 insulating resin layers
40 prepregs
The prepreg of 41 attached tinsels
The prepreg of 42 attached polymeric membrane sheet materials
51 metal-clads
52 metal-clads

Claims (35)

1. a resin combination, for the formation of plywood, is characterized in that, contains:
Epoxy resin;
Unbodied first inorganic filling material, its to be median size be boehmite of 2.9 ~ 5 μm;
Second inorganic filling material, the silicon-dioxide of its to be median size be 15 ~ 70nm; And
3rd inorganic filling material, its to be median size be silicon-dioxide of 0.4 ~ 1.5 μm,
The weight ratio w2/w1 of the content w1 of above-mentioned first inorganic filling material and the content w2 of above-mentioned second inorganic filling material is 0.11 ~ 0.5,
The weight ratio w2/w3 of the content w3 of above-mentioned 3rd inorganic filling material and the content w2 of above-mentioned second inorganic filling material is 0.12 ~ 1.2,
The content w1 of above-mentioned first inorganic filling material is 20 ~ 55 % by weight of above-mentioned resin combination total amount, the content w2 of above-mentioned second inorganic filling material is 0.5 ~ 5 % by weight of above-mentioned resin combination total amount, and the content w3 of above-mentioned 3rd inorganic filling material is 25 ~ 33.3 % by weight of above-mentioned resin combination total amount.
2. resin combination as claimed in claim 1, wherein, uses the slurry preparation above-mentioned second inorganic filling material being scattered in advance organic solvent.
3. resin combination as claimed in claim 1, wherein, the maximum particle diameter of above-mentioned 3rd inorganic filling material is less than 10 μm.
4. resin combination as claimed in claim 1, wherein, also containing cyanate ester resin.
5. resin combination as claimed in claim 1, wherein, at least one selected in the group that above-mentioned epoxy resin is made up of biphenyl dimethylene type epoxy resin, phenolic resin varnish type epoxy resin, naphthalene modification cresol novolac epoxy and anthracene type epoxy resin.
6. a resin combination, is characterized in that, contains:
Epoxy resin;
Median size is the polysiloxane rubber micropartical of 1 μm ~ 10 μm;
Median size is the boehmite micropartical of 0.2 μm ~ 5 μm; And
Median size is the Nano particles of silicon dioxide of 10nm ~ 100nm,
The atomic content of above-mentioned polysiloxane rubber is 40/7 ~ 13.5 relative to the weight ratio of the content of above-mentioned Nano particles of silicon dioxide and the weight of the atomic weight/Nano particles of silicon dioxide of polysiloxane rubber,
The content of above-mentioned boehmite particle is 61/12 ~ 316/35 relative to the weight of the weight ratio of the content of above-mentioned Nano particles of silicon dioxide and the weight/Nano particles of silicon dioxide of boehmite particle,
The content of above-mentioned boehmite particle is 10 ~ 40 % by weight of above-mentioned resin combination total amount, the content of above-mentioned Nano particles of silicon dioxide is 2 ~ 5 % by weight of above-mentioned resin combination total amount, and the atomic content of above-mentioned polysiloxane rubber is 10 ~ 40 % by weight of above-mentioned resin combination total amount.
7. resin combination as claimed in claim 6, wherein, above-mentioned polysiloxane rubber micropartical is with the coated nucleocapsid structure particle of polyorganosiloxane resin by the core portion that is made up of polysiloxane rubber.
8. resin combination as claimed in claim 6, wherein, the median size of above-mentioned Nano particles of silicon dioxide is more than 40nm and below 100nm.
9. resin combination as claimed in claim 6, wherein, also containing cyanate ester resin.
10. resin combination as claimed in claim 6, wherein, also containing maleimide resin.
11. resin combinations as claimed in claim 6, wherein, at least one selected in the group that above-mentioned epoxy resin is made up of biphenyl aralkyl-type epoxy resin, naphthalene framework modification epoxy resin and cresol novolak type epoxy resin.
12. 1 kinds of resin sheets, is characterized in that, base material is formed the resin layer be made up of resin combination according to claim 1 and forms.
13. 1 kinds of prepregs, is characterized in that, are formed in the substrate by resin combination dipping according to claim 1.
14. 1 kinds of metal-clads, is characterized in that, flood at least one side of the resin impregnation substrate layer of resin combination according to claim 1 in the substrate, have tinsel.
15. 1 kinds of metal-clads, is characterized in that, by least one side at prepreg according to claim 13 or at least one side overlapped metal paper tinsel of duplexer that obtains more than by overlapping for this prepreg two panels, and carry out heating and pressurizing and obtain.
16. 1 kinds of printed wiring boards, is characterized in that, metal-clad according to claim 14 is used in internal layer circuit substrate and forms.
17. 1 kinds of printed wiring boards, it on internal layer circuit, prepreg according to claim 13 is used in insulation layer to form.
18. 1 kinds of printed wiring boards, it on internal layer circuit, resin combination according to claim 1 is used in insulation layer to form.
19. 1 kinds of semiconductor devices, is characterized in that, semiconductor element mounted thereon forms on printed wiring board according to claim 16.
20. 1 kinds of printed wiring boards, is characterized in that, metal-clad according to claim 15 is used in internal layer circuit substrate and forms.
21. 1 kinds of semiconductor devices, is characterized in that, semiconductor element mounted thereon forms on printed wiring board according to claim 17.
22. 1 kinds of semiconductor devices, is characterized in that, semiconductor element mounted thereon forms on printed wiring board according to claim 18.
23. 1 kinds of semiconductor devices, is characterized in that, semiconductor element mounted thereon forms on printed wiring board according to claim 20.
24. 1 kinds of resin sheets, is characterized in that, base material is formed the resin layer be made up of resin combination according to claim 6 and forms.
25. 1 kinds of prepregs, is characterized in that, are formed in the substrate by resin combination dipping according to claim 6.
26. 1 kinds of metal-clads, is characterized in that, flood at least one side of the resin impregnation substrate layer of resin combination according to claim 6 in the substrate, have tinsel.
27. 1 kinds of metal-clads, is characterized in that, by least one side at prepreg according to claim 25 or at least one side overlapped metal paper tinsel of duplexer that obtains more than by overlapping for this prepreg two panels, and carry out heating and pressurizing and obtain.
28. 1 kinds of printed wiring boards, is characterized in that, metal-clad according to claim 26 is used in internal layer circuit substrate and forms.
29. 1 kinds of printed wiring boards, it on internal layer circuit, prepreg according to claim 25 is used in insulation layer to form.
30. 1 kinds of printed wiring boards, it on internal layer circuit, resin combination according to claim 6 is used in insulation layer to form.
31. 1 kinds of semiconductor devices, is characterized in that, semiconductor element mounted thereon forms on printed wiring board according to claim 28.
32. 1 kinds of printed wiring boards, is characterized in that, metal-clad according to claim 27 is used in internal layer circuit substrate and forms.
33. 1 kinds of semiconductor devices, is characterized in that, semiconductor element mounted thereon forms on printed wiring board according to claim 29.
34. 1 kinds of semiconductor devices, is characterized in that, semiconductor element mounted thereon forms on printed wiring board according to claim 30.
35. 1 kinds of semiconductor devices, is characterized in that, semiconductor element mounted thereon forms on printed wiring board according to claim 32.
CN201080031042.1A 2009-07-24 2010-07-21 Resin compositions, resin sheet, prepreg, metal-clad laminate, printed wiring board, and semiconductor device Expired - Fee Related CN102482481B (en)

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JP2009-172630 2009-07-24
JP2009172630A JP5703547B2 (en) 2009-07-24 2009-07-24 Resin composition, prepreg, laminate, multilayer printed wiring, and semiconductor device
JP2009264857A JP5589363B2 (en) 2009-11-20 2009-11-20 Silicone rubber fine particle-containing epoxy resin composition, prepreg, metal-clad laminate, printed wiring board, and semiconductor device
JP2009-265256 2009-11-20
JP2009265256A JP5589364B2 (en) 2009-11-20 2009-11-20 Silicone rubber fine particle-containing epoxy resin composition, prepreg, metal-clad laminate, printed wiring board, and semiconductor device
JP2009-264857 2009-11-20
JP2010-038652 2010-02-24
JP2010038652A JP2011173985A (en) 2010-02-24 2010-02-24 Epoxy resin composition containing barium sulfate particle, prepreg, metal clad laminate, printed wiring board, and semiconductor device
JP2010-044145 2010-03-01
JP2010044145A JP5703570B2 (en) 2010-03-01 2010-03-01 Prepreg, laminated board, multilayer printed wiring board, and semiconductor device
PCT/JP2010/062259 WO2011010672A1 (en) 2009-07-24 2010-07-21 Resin compositions, resin sheet, prepreg, metal-clad laminate, printed wiring board, and semiconductor device

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Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5348332B2 (en) * 2010-10-06 2013-11-20 日立化成株式会社 Multilayer resin sheet and method for producing the same, resin sheet laminate and method for producing the same, multilayer resin sheet cured product, multilayer resin sheet with metal foil, and semiconductor device
JP5779962B2 (en) * 2011-04-27 2015-09-16 日立化成株式会社 Resin composition for package substrate and prepreg and laminate using the same
US9512329B2 (en) 2011-05-27 2016-12-06 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, and laminate
JP5879757B2 (en) * 2011-06-07 2016-03-08 住友ベークライト株式会社 Resin composition, prepreg and method for producing prepreg
JP2013035980A (en) * 2011-08-10 2013-02-21 Toray Ind Inc Flame retardant thermoplastic polyester resin composition and molded article
US20130043067A1 (en) * 2011-08-17 2013-02-21 Kyocera Corporation Wire Substrate Structure
JP2013040298A (en) * 2011-08-18 2013-02-28 Sekisui Chem Co Ltd Epoxy resin material and multilayer board
EP2759400B1 (en) * 2011-09-22 2020-04-15 Hitachi Chemical Company, Ltd. Laminated body, laminated board, multi-layer laminated board, printed wiring board, and production method for laminated board
JP5397717B2 (en) 2011-09-26 2014-01-22 三菱瓦斯化学株式会社 Molybdenum compound powder, prepreg and laminate
SG11201401906SA (en) * 2011-11-07 2014-10-30 Mitsubishi Gas Chemical Co Resin composition, and prepreg and laminate using the same
KR101303595B1 (en) * 2011-12-21 2013-09-11 엘지이노텍 주식회사 A heat radiating printed circuit board, method of manufacturing the heat radiating printed circuit board, backlight unit including the heat radiating printed circuit board and liquid crystal display including the same
EP2845877B1 (en) 2012-03-30 2017-02-15 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg and laminate
US20130316180A1 (en) * 2012-05-07 2013-11-28 Case Western Reserve University Biocompatible Packaging Suitable for Long-term Implantation and Method of Formation
TWI602873B (en) * 2012-06-11 2017-10-21 味之素股份有限公司 Resin composition
WO2014007327A1 (en) * 2012-07-06 2014-01-09 日本発條株式会社 Laminate for circuit boards, metal-based circuit board, and power module
JP6410405B2 (en) * 2012-08-01 2018-10-24 住友ベークライト株式会社 Resin substrate, prepreg, printed wiring board, semiconductor device
CN104303605B (en) * 2012-08-02 2018-10-09 学校法人早稻田大学 Metal base printed circuit board
JP2014111719A (en) * 2012-11-12 2014-06-19 Panasonic Corp Laminate, metal-clad laminate, printed wiring board, and multilayer printed wiring board
WO2014112464A1 (en) * 2013-01-15 2014-07-24 三菱瓦斯化学株式会社 Resin composition, prepreg, laminate, metal foil-clad laminate, and printed wiring board
JP6221387B2 (en) 2013-06-18 2017-11-01 日亜化学工業株式会社 Light emitting device and manufacturing method thereof
CN104327772B (en) * 2013-07-22 2016-10-26 北京京东方光电科技有限公司 Sealant composition and preparation method thereof, liquid crystal panel
KR102267654B1 (en) * 2013-08-28 2021-06-21 신에쓰 가가꾸 고교 가부시끼가이샤 Resin compositions for sealing semiconductor and semiconductor device with the cured product thereof
KR102219584B1 (en) * 2013-08-29 2021-02-23 신에쓰 가가꾸 고교 가부시끼가이샤 Resin compositions for sealing semiconductor and semiconductor device with the cured product thereof
US11535750B2 (en) 2013-09-30 2022-12-27 Lg Chem, Ltd. Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same
JP6258347B2 (en) * 2013-10-29 2018-01-10 京セラ株式会社 Wiring board and mounting structure using the same
CN103665775B (en) * 2013-11-21 2016-04-27 无锡创达电子有限公司 Epoxy molding plastic that a kind of silicon powder height is filled and preparation method thereof
KR102256525B1 (en) * 2013-11-27 2021-05-26 도레이 카부시키가이샤 Semiconductor resin composition, semiconductor resin film, and semiconductor device using same
JP6409362B2 (en) * 2014-06-25 2018-10-24 味の素株式会社 Resin composition
TWI689418B (en) * 2014-12-01 2020-04-01 日商三菱瓦斯化學股份有限公司 Resin sheet and print circuit board
JP6413915B2 (en) * 2015-05-11 2018-10-31 信越化学工業株式会社 Semiconductor sealing resin composition and semiconductor device provided with cured product thereof
KR20170002179A (en) * 2015-06-29 2017-01-06 삼성전기주식회사 Printed Circuit Board and Method of the Same
JP2017052884A (en) * 2015-09-10 2017-03-16 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
US20170287838A1 (en) * 2016-04-02 2017-10-05 Intel Corporation Electrical interconnect bridge
KR20220084442A (en) 2016-05-25 2022-06-21 쇼와덴코머티리얼즈가부시끼가이샤 Metal-clad laminate, printed wiring board and semiconductor package
JP6520872B2 (en) * 2016-09-01 2019-05-29 信越化学工業株式会社 Thermosetting resin composition for semiconductor encapsulation
JP7231821B2 (en) 2016-10-14 2023-03-02 株式会社レゾナック Sealing resin composition, electronic component device, and method for manufacturing electronic component device
CN109923947B (en) * 2016-11-09 2022-04-05 昭和电工材料株式会社 Printed wiring board and semiconductor package
JP6354884B1 (en) * 2017-03-13 2018-07-11 横浜ゴム株式会社 Cyanate ester resin composition and prepreg
CN110612603B (en) * 2017-05-10 2021-06-01 积水化学工业株式会社 Insulating sheet and laminate
WO2019142747A1 (en) * 2018-01-19 2019-07-25 Ａｇｃ株式会社 Method for producing resin-equipped metal foil
JP6989086B6 (en) 2018-02-13 2022-02-28 エルジー・ケム・リミテッド Thermosetting resin composition for semiconductor packaging and prepreg using this
JP7124355B2 (en) * 2018-03-09 2022-08-24 Tdk株式会社 Resin substrate
TWI811215B (en) * 2018-04-13 2023-08-11 日商力森諾科股份有限公司 Sealing resin composition, electronic component apparatus and manufacturing method for electronic component apparatus
JP7575861B2 (en) * 2018-12-03 2024-10-30 味の素株式会社 Resin composition
CN111757911B (en) * 2018-12-29 2023-02-28 广东生益科技股份有限公司 Resin composition, prepreg, laminate, metal-clad laminate, and printed wiring board
JP7491668B2 (en) * 2019-02-13 2024-05-28 味の素株式会社 Resin composition
CN111688304A (en) * 2019-03-12 2020-09-22 合正科技股份有限公司 Melamine plate for PCB drilling and manufacturing method thereof
CN110312366A (en) * 2019-07-03 2019-10-08 安捷利电子科技（苏州）有限公司 Buried capacitor material and its preparation process, buried capacitor circuit board and its manufacture craft
CN115785542B (en) * 2022-12-15 2024-04-30 广东生益科技股份有限公司 Resin composition, circuit material, and preparation method and application thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101328301A (en) * 2008-07-18 2008-12-24 曾灿旺 Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05331263A (en) * 1992-06-02 1993-12-14 Mitsui Toatsu Chem Inc Resin composition
JPH07165949A (en) * 1993-11-10 1995-06-27 Hitachi Chem Co Ltd Prepreg with high dielectric constant and laminated board
JPH10146917A (en) * 1996-11-15 1998-06-02 Sumitomo Bakelite Co Ltd Laminate for printed circuit
JP2000344917A (en) * 1999-06-04 2000-12-12 Sumitomo Bakelite Co Ltd Flame-retardant prepreg and laminate
JP2001105443A (en) * 1999-10-07 2001-04-17 Toagosei Co Ltd Method for producing laminated sheet
JP3920582B2 (en) * 2001-03-23 2007-05-30 トヨタ自動車株式会社 Filler-containing slurry composition
JP4804671B2 (en) * 2001-08-22 2011-11-02 京セラケミカル株式会社 Prepreg
JP2005281634A (en) * 2004-03-31 2005-10-13 Toray Ind Inc Flame-retardant master batch for use in thermosetting resin, and method for producing thermosetting resin composition, prepreg, and fiber-reinforced composite material
JP2008144071A (en) * 2006-12-12 2008-06-26 Sumitomo Bakelite Co Ltd Resin composition for printed circuit board, prepreg, insulation board with supporting base, laminate and multilayered printed circuit board
JP2008184472A (en) * 2007-01-26 2008-08-14 Sumitomo Bakelite Co Ltd Method for producing resin-adhered substrate
KR101141902B1 (en) * 2007-04-10 2012-05-03 스미토모 베이클리트 컴퍼니 리미티드 Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board
JP2009051978A (en) * 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd Epoxy resin composition for printed wiring board, prepreg, metal foil clad laminated plate, and multilayer printed wiring board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101328301A (en) * 2008-07-18 2008-12-24 曾灿旺 Liquid thermosetting resin composition and method for manufacturing printed circuit board using the same

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