CN102374392B

CN102374392B - Manufacturing method of LED (light emitting diode) lamp fitting

Info

Publication number: CN102374392B
Application number: CN 201010251721
Authority: CN
Inventors: 黄建郎
Original assignee: Liquidleds Lighting Corp
Current assignee: Liquidleds Lighting Corp
Priority date: 2010-08-11
Filing date: 2010-08-11
Publication date: 2013-09-25
Anticipated expiration: 2030-08-11
Also published as: CN102374392A

Abstract

The invention relates to a manufacturing method of an LED (light emitting diode) lamp fitting. The method comprises the steps of combining a core column and a circuit board set, drying, enclosing a bulb, sucking gas, filling gas, sealing and combining a lamp seat and a lamp cover. Because a glass integrated lamp cover is manufactured according to the invention, and in the bulb enclosing step, an ear part of an insulation base and the neck part of the lamp cover are combined in a sintering mode, and the internal space of the lamp cover is subjected to air tight in a mode of conduit melting; because the internal space of the lamp cover can be subjected to air tight, the circuit board set in the LED illumination lamp manufactured by the treatment of drying, gas sucking and gas filling is difficult to be affected by external environment, and the reliability is difficult to be oxidized or be affected with damp; and the service life of the LED illumination device lamp fitting can be prolonged, and the device is extremely practical.

Description

The manufacture method of LED lighting

Technical field

The present invention relates to a kind of method of making light fixture, especially a kind of manufacture method of LED lighting.

Background technology

General existing LED lighting is combined type at present, as shown in Figure 6, be provided with heat dissipating housing 60, be positioned at circuit substrate group, lampshade 70, stem stem seat and the lamp socket 80 of heat dissipating housing 60 inside, the apical margin of heat dissipating housing 60 and lampshade 70 set firmly, circuit substrate group is positioned at lampshade 70 and heat dissipating housing 60, the stem stem seat sets firmly with heat dissipating housing 60 combinations and with circuit substrate group with detachably assembling, and lamp socket 80 covers are fixed in the stem stem seat; Wherein, heat dissipating housing 60 is used for the heat radiation of circuit substrate group, and heat dissipating housing 60 is generally that metal is made and is light tight.Yet there is following shortcoming in the LED lighting of prior art:

1. the combined type design causes producing seam and moisture-sensitive or oxidation: because heat dissipating housing 60 is that the combination back is fixed in the mode of gluing with lampshade 70, if bind and still can not produce small seam entirely, cause the space seal in lampshade 70 and the heat dissipating housing 60 not good, and the stem stem seat also can produce seam with heat dissipating housing 60 combinations with detachably assembling, cause circuit substrate group to be subject to external environment and influence its reliability, make moist and aging impaired as PCB, the easy oxidation of conductor, make the life-span of LED lighting lower, extremely impracticable.

2. combined type designs no change elasticity: because prior art is to belong to the combined type design, the form of heat dissipating housing 60 and lampshade 70 is fixed and just is beneficial to assembling, but but can't change shape neatly, then need spend the heat dissipating housing 60 that very high cost is made new form if will change shape, extremely impracticable.

3. illumination efficiency is not good: the LED lighting of prior art sends evenly only to reflect by being coated with in the lampshade 70 and forms, and heat dissipating housing 60 also can cover down the light of photograph, can dimming, make illumination efficiency and poor effect.

4. insulating properties is not good: because heat dissipating housing 60 is in order dispelling the heat, to be made of metal mostly, but can to cause the insulating properties of LED lighting of prior art not good, the safety issue that causes the user to get an electric shock.

Other has a kind of manufacture method of LED lighting, please refer to the patent case " glass packaging LED bulb and manufacture method thereof " of TW200940897A.TW200940897A is and the immediate prior art of the application.

Summary of the invention

For the LED lighting that solves prior art relevant for moisture-sensitive or oxidation, no change elasticity, illumination efficiency is not good and insulating properties is not good deficiency and restriction, the object of the present invention is to provide a kind of manufacture method of LED lighting, be preparation by the integrated lampshade of glass, and in the step of envelope bubble, the neck of the ear of insulating base and lampshade is combined back and make that in the mode of melting the conduit that breaks the lampshade inner space can be airtight with sintering processing; Because the lampshade inner space can be airtight, so via oven dry, bleed and the processing of aeration after the circuit substrate group of the made LED lighting inside of coming out its reliability that is difficult for being affected by the external environment, be difficult for oxidation or make moist, can prolong the life-span of LED lighting, very practical.

The technological means that the present invention uses is to provide a kind of manufacture method of LED lighting, and its step comprises:

In conjunction with stem stem and circuit substrate group: a stem stem is combined fixing with a circuit substrate group; Wherein, this stem stem is provided with an insulating base, two seal wires and a conduit, and this insulating base is a housing of being made by glass and is provided with an ear that this ear is radially convex shape; These two seal wires fasten in this insulating base respectively and respectively are provided with a support end and a binding end, and each support end is to expose to this insulating base; This conduit is made and is fastened by glass in this insulating base; This circuit substrate group be set firmly and electrical ties in these two support ends and include more than one LED;

Oven dry: with this circuit substrate group oven dry;

Envelope bubble: prepare a lampshade, this circuit substrate group is placed in this lampshade, this lampshade is to make and be provided with an opening and a neck by glass is one-body molded, and this neck is adjacent to the opening of this lampshade; Make this ear be resisted against the opening part that this neck is adjacent to this lampshade, rotate this lampshade and this stem stem, and utilize thermal-flame that this ear and this neck are sintered to fix; Wherein this conduit is that the inner space that partly exposes to this lampshade and this lampshade communicates with the external world by this conduit;

Bleed: utilize this conduit that the residual air in this lampshade is extracted out;

Aeration: nitrogen or inert gas are poured in this lampshade by this conduit;

Seal: melt disconnected this conduit and make the inner space of this lampshade become airtight conditions with thermal-flame; And

In conjunction with lamp socket and lampshade: a lamp holder sleeve is fixed in this neck, this lamp socket and this two binding ends are fixed according to corresponding polarity electrical ties.

The manufacture method of described LED lighting, wherein in aforesaid baking step, the time of drying aforesaid circuit substrate group is 10～15 minutes, and the temperature of drying aforesaid circuit substrate group is 120 ℃～125 ℃.

The manufacture method of described LED lighting wherein in the step of aforesaid envelope bubble, is inverted aforesaid lampshade and is handstand state, and the thermal-flame level penetrates also aims at aforesaid ear.

The manufacture method of described LED lighting, wherein in the step of aforesaid envelope bubble, aforesaid lampshade is erectility, thermal-flame penetrates and aims at aforesaid ear towards having a down dip, the folded angle of the horizontal plane at thermal-flame and this ear place is a flame angle, and the scope at this flame angle is 5 °～15 °.

The manufacture method of LED lighting provided by the present invention, the concrete benefit that can obtain and effect enhancement comprise at least:

1. form airtight space in the lampshade: because the present invention's preparation is by the integrated lampshade of glass, and in the step of envelope bubble, the neck of the ear of insulating base and lampshade is combined back and make that in the mode of melting the conduit that breaks the lampshade inner space can be airtight with sintering processing; Because the lampshade inner space can be airtight, so via oven dry, bleed and the processing of aeration after the circuit substrate group of the made LED lighting inside of coming out its reliability that is difficult for being affected by the external environment, be difficult for oxidation or make moist, can prolong the life-span of LED lighting, very practical.

2. it is good that lampshade changes elasticity: because the non-combined type design of lampshade of the present invention is to make by glass is one-body molded, lampshade can utilize heating and change shape neatly, the lamp socket that is easy to produce various form and is disposed at different types, it is splendid to change elasticity.

3. illumination efficiency is good: the luminous LED lighting in four sides is not that light luminous and that send can not blocked by heat dissipating housing by being coated with reflection in the lampshade because made of the present invention comes out evenly, and most light all can project, and illumination efficiency is good.

4. insulating properties is good: because the present invention does not have the heat dissipating housing of the LED lighting of prior art, and lampshade is to be made by the insulator of glass, the safety issue that can avoid the user to get an electric shock.

Description of drawings

Fig. 1 is the flow chart of the preferred embodiment of the present invention.

Fig. 2 is the stereogram of preferred embodiment of the present invention stem stem after circuit substrate group is combined.

Fig. 3 is the generalized section of preferred embodiment of the present invention envelope bubble step.

Fig. 4 is the generalized section of preferred embodiment of the present invention envelope bubble step.

Fig. 5 is the stereo appearance figure of preferred embodiment of the present invention LED lighting.

Fig. 6 is the side view of prior art LED lighting.

The primary clustering symbol description

10 stem stems

11 insulating bases, 111 ears

12 seal wires, 121 support ends

122 binding ends, 13 conduits

20 circuit substrate group

30 lampshades, 31 necks

40 lamp sockets, 60 heat dissipating housings

70 lampshades, 80 lamp sockets

F flame gun F1 thermal-flame

θ flame angle

The specific embodiment

Being can detail knowledge technical characterictic of the present invention and practical effect, and can implement according to the content of specification, further with as shown in the figure preferred embodiment, describes in detail as the back:

The preferred embodiment of the manufacture method of a kind of LED lighting provided by the present invention, as shown in Figure 1, 2, its step comprises:

In conjunction with stem stem and circuit substrate group: with a stem stem 10 and a circuit substrate group 20 in conjunction with fixing; Wherein, this stem stem 10 is provided with an insulating base 11, two seal wires 12 and a conduit 13, the circular shell that this insulating base 11 is made by glass also is provided with a top, a bottom and an ear 111, this ear 111 is positioned at the bottom of this insulating base 11 and is radially convex shape, and this ear 111 roughly is funnel-form; These two seal wires 12 fasten in this insulating base 11 respectively and respectively are provided with a support end 121 and a binding end 122, and each support end 121 is to expose to the top of this insulating base 11 and made by hard material steel material; This conduit 13 is made and is fastened by glass in this insulating base 11; These circuit substrate group 20 solid weldings and electrical ties are in these two support ends 121; Because support end 121 is to make with the converted steel material, can support the weight of this circuit substrate group 20;

This circuit substrate group 20 includes more than one LED (Light Emitting Diode);

Oven dry: with these circuit substrate group 20 oven dry; The purpose of drying circuit substrate in batch 20 is that the aqueous vapor of avoiding substrate to absorb evaporates the life-span that is condensed in substrate part surface or lampshade 30 inner surfaces and the circuit substrate group 20 that detracts in the future; In the manufacture method of the LED lighting of prior art, even what essence effect the circuit substrate group oven dry is not had yet, because extraneous aqueous vapor still can be entered by no airtight seam between heat dissipating housing 60 and the lampshade 70;

Preferably, the time of drying circuit substrate in batch 20 is 10～15 minutes, and the temperature of drying circuit substrate in batch 20 is 120 ℃～125 ℃;

Envelope bubble: prepare a lampshade 30 (as shown in Figure 3), this circuit substrate group 20 is placed in this lampshade 30, this lampshade 30 is to make and be provided with a bottom, an opening and a neck 31 by glass is one-body molded, and this opening is formed at the bottom of this lampshade 30, and this neck 31 is adjacent to the opening of this lampshade 30; Make this ear 111 be resisted against the opening part that this neck 31 is adjacent to this lampshade 30, rotate this lampshade 30 and this stem stem 10, and utilize the thermal-flame F1 of a flame gun F that this ear 111 and this neck 31 are sintered to fix; Wherein this conduit 13 is that the inner space that partly exposes to this lampshade 30 and this lampshade 30 communicates with the external world by this conduit 13;

Preferably, as shown in Figure 3, this lampshade 30 is erectility, and the thermal-flame F1 that this flame gun F sprays penetrates towards having a down dip and aims at this ear 111, and the folded viewpoint definition of the horizontal plane at thermal-flame F1 and this ear 111 places is a flame angle θ; Preferably, the scope of this flame angle θ is 5 °～15 °; The purpose that forms flame angle θ is: utilize thermal-flame F1 to tilt to make Temperature Distribution to change, allow circuit substrate group 20 unlikely burning out;

Preferably, or as shown in Figure 4, be inverted this lampshade 30 and be handstand state, the thermal-flame F1 level that this flame gun F sprays penetrates also aims at this ear 111; Owing to can heat the residual gas in the lampshade 30 during thermal-flame F1 sintering, the gaseous exchange after the purpose of being inverted lampshade 30 is to avoid heating up is to circuit substrate group 20, and then avoids high-temperature gas to cause the damage of circuit substrate group 20;

Bleed: utilize this conduit 13 that the residual air in this lampshade 30 is extracted out;

Aeration: with inert gas, for example neon, argon gas etc., or nitrogen are poured in this lampshade 30 by this conduit 13; The purpose of the step of aeration is to avoid the risk of circuit substrate group 20 oxidations, can prolong the service life of circuit substrate group 20, and institute's aeration body can increase the radiating effect of this circuit substrate group 20, and does not need to install the heat dissipating housing 60 of the LED lighting of prior art; Among the present invention, because lampshade 30 inner spaces can be airtight, just can bleed and the step of aeration;

Seal: melt disconnected this conduit 13 and make the inner space of this lampshade 30 become airtight conditions with thermal-flame F1;

In conjunction with lamp socket and lampshade: as shown in Figure 5, the mode cover of the high warm hardening of a lamp socket 40 usefulness lamp holder glue is fixed in the outer peripheral face of this neck 31, this lamp socket 40 and this two binding ends 122 are fixed according to corresponding polarity electrical ties.

But the above only is the preferred embodiments of the present invention, can not limit scope of the invention process with this, and every simple equivalent of doing according to claim of the present invention and description changes and modifies, and all should still belong in the scope that claim of the present invention contains.

Claims

1. the manufacture method of a LED lighting, its step comprises:

In conjunction with stem stem and circuit substrate group: a stem stem is combined fixing with a circuit substrate group; This stem stem is provided with two seal wires and a conduit; These two seal wires respectively are provided with a support end and a binding end, and this conduit is made by glass; This circuit substrate group be set firmly and electrical ties in these two support ends and include more than one LED;

Envelope bubble: prepare a lampshade, this circuit substrate group is placed in this lampshade, this lampshade is to make and be provided with an opening and a neck by glass is one-body molded, and this neck is adjacent to the opening of this lampshade; Rotate this lampshade and this stem stem, and utilize thermal-flame that this lampshade and this stem stem are sintered to fix, wherein this conduit is that the inner space that partly exposes to this lampshade and this lampshade communicates with the external world by this conduit;

Aeration: nitrogen or inert gas are poured in this lampshade by this conduit;

In conjunction with lamp socket and lampshade: a lamp holder sleeve is fixed in this neck; This lamp socket and this two binding ends are fixed according to corresponding polarity electrical ties;

It is characterized in that:

In the step in conjunction with stem stem and circuit substrate group, this stem stem is provided with an insulating base, and this insulating base is a housing of being made by glass and is provided with an ear that this ear is radially convex shape; These two seal wires fasten respectively in this insulating base, and each support end is to expose to this insulating base; This conduit fastens in this insulating base;

Be provided with the step of an oven dry between the step of steeping in conjunction with step and the envelope of stem stem and circuit substrate group, the step of oven dry is with this circuit substrate group oven dry;

In the step of envelope bubble, make this ear be resisted against the opening part that this neck is adjacent to this lampshade, and utilize thermal-flame that this ear and this neck are sintered to fix.

2. according to the manufacture method of claim 1 a described LED lighting, wherein in aforesaid baking step, the time of drying aforesaid circuit substrate group is 10～15 minutes, and the temperature of drying aforesaid circuit substrate group is 120 ℃～125 ℃.

3. the manufacture method of LED lighting according to claim 1 and 2 wherein in the step of aforesaid envelope bubble, is inverted aforesaid lampshade and is handstand state, and the thermal-flame level penetrates also aims at aforesaid ear.

4. the manufacture method of LED lighting according to claim 1 and 2, wherein in the step of aforesaid envelope bubble, aforesaid lampshade is erectility, thermal-flame penetrates and aims at aforesaid ear towards having a down dip, the folded angle of the horizontal plane at thermal-flame and this ear place is a flame angle, and the scope at this flame angle is 5 °～15 °.