CN102347430A - Surface-mounted LED (Light-Emitting Diode) device - Google Patents
Surface-mounted LED (Light-Emitting Diode) device Download PDFInfo
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- CN102347430A CN102347430A CN2011102641247A CN201110264124A CN102347430A CN 102347430 A CN102347430 A CN 102347430A CN 2011102641247 A CN2011102641247 A CN 2011102641247A CN 201110264124 A CN201110264124 A CN 201110264124A CN 102347430 A CN102347430 A CN 102347430A
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Abstract
The invention discloses a surface-mounted LED (Light-Emitting Diode) device. The LED device comprises metal lead frames, an LED wafer and injection molding plastic bodies, wherein the metal lead frames are connected with a positive electrode and a negative electrode of the LED wafer respectively; the LED wafer is fixed on the metal lead frame surface; the injection molding plastic bodies are packaged above and below the metal lead frame and distributed at the periphery; hollow regions are arranged in a reverse-surface injection molding plastic body of the surface of the metal lead frame fixed with the LED wafer; transparent fillers are filled in the hollow regions; and the LED wafer is packaged by the fillers; the transparent fillers pass through a hollowed gap between the metal lead frames and are filled in the upper hollow region and the lower hollow region of the injection molding plastic bodies and used for packaging the LED wafer and the metal lead frames. In the invention, the injection molding plastic bodies, the transparent fillers and the metal lead frames are combined in multiple regions, and the LED device has the advantages of more compact integrated structure and excellent of waterproof property.
Description
Technical field
The present invention relates to the LED technical field, particularly a kind of paster LED device.
Background technology
Existing paster class LED resistance to elevated temperatures is poor; Because of injection moulding plastic cement and transparent filler are the bondings of face and face; And they belong to the inhomogeneity material; Cold and hot shrinkage ratio is different, uses of a specified duration under the adverse circumstances out of doors the injection moulding plastic cement will to occur to separate with transparent filler, causes problems such as paster apparatus inner inlet, led circuit broken string.
As shown in Figure 1; Paster LED device at present commonly used comprises metal lead frame 03, be arranged on LED wafer 02 on the metal lead frame 03, be located at the peripheral transparent filler 04 of LED wafer 02; Be wrapped in the injection moulding plastic body 01 of metal lead frame about in the of 03; The below of metal lead frame 03 is full of injection moulding plastic body 01, and injection moulding plastic body 01 and the bonding that transparent filler 04 is face and face have used under the hot environment injection moulding plastic body 01 and transparent filler 04 easy separation of a specified duration; Cause problems such as inner LED wafer circuit opens circuit, cause the paster LED device to damage.
Summary of the invention
In order to overcome the defective that above-mentioned prior art exists, the present invention provides a kind of paster LED device, and inner each building block is that the multiaspect territory combines, fixing more jail, and LED Global Macros performance is better, and waterproof is better, longer service life.
To achieve these goals, technical scheme of the present invention is following:
A kind of paster LED device; Comprise the metal lead frame that connects LED wafer both positive and negative polarity respectively, be fixed on the LED wafer on metal lead frame surface, be wrapped in said metal lead frame upper and lower and be distributed in peripheral injection moulding plastic body; Be characterized in; In the reverse side injection moulding plastic body of said metal lead frame fixed L ED wafer one side hollow region is set, is full of transparent filler in the said hollow region, said LED wafer is by the transparent filler parcel of its upper area;
Be provided with penetrating hollow out gap between said metal lead frame and the metal lead frame, said hollow out is full of transparent filler in the gap;
The transparent filler in above-mentioned each zone is connected as a single entity; The hollow out gap of passing between said metal lead frame and the metal lead frame is filled the hollow region of injection moulding plastic body up and down and is wrapped up said LED wafer and metal lead frame; It is tightr to make that like this each several part combines; Transparent filler is as a whole metal lead frame and LED wafer parcel, and with injection moulding plastic body bonding, transparent filler also is not easy to come off simultaneously.
The upper area of said LED wafer is full of transparent filler, and being convenient to light that the LED wafer sends, to pass said transparent filler directive extraneous.
The transparent filler in above-mentioned each zone is epoxy resin, silicones or transparent silica gel etc.;
Said LED wafer is fixed on the surface of metal lead frame, general employing insulation colloid bonding or elargol welding etc.
Further; Said metal lead frame is the framework of a semi-surrounding through injection mo(u)lding; Around in framework inside is enclosure wall formula injection moulding plastic body; Be provided with hollow region in the cavity of said injection moulding plastic body, said hollow region is penetrating up and down through the hollow out gap between metal lead frame and the metal lead frame.
Preferably, the metal lead frame that is provided with in the hollow cavity of said injection moulding plastic body is the spring-plate type structure, can let transparent filler and metal lead frame contact area more, in conjunction with tightr.
Further, the hollow region cross section in the reverse side injection moulding plastic body of said metal lead frame fixed L ED wafer one side is rectangular-shaped, makes transparent filler be connected more firmly closely difficult drop-off with metal lead frame.
Hollow region cross section in the reverse side injection moulding plastic body of said metal lead frame fixed L ED wafer one side is polygon-shaped; Wherein the base of the inclined side of step injection moulding plastic cement and metal lead frame offsets; Have supporting role, make LED matrix more firm, not yielding.
Hollow region in the reverse side injection moulding plastic body of said metal lead frame fixed L ED wafer one side is " irrigation canals and ditches " shape; This hollow region is not extended outside the injection moulding plastic cement; Remain the injection moulding plastic body in bottom, " irrigation canals and ditches " zone; The design of " irrigation canals and ditches " shape makes transparent filler be connected more firmly closely difficult drop-off with metal lead frame.
Further, the hollow region cross section in the reverse side injection moulding plastic body of said metal lead frame fixed L ED wafer one side is a trapezoidal shape;
Above-mentioned hollow region also can be designed to other shape as required, to satisfy concrete paster LED device performance requirement.
The invention has the beneficial effects as follows that injection moulding plastic body, transparent filler in the paster LED device are that the multiaspect territory combines with metal lead frame, fixing more jail, water resistance is better;
The overall structure advantages of simple, economical with materials is effectively enhanced productivity, and the LED display effect is desirable; Brightness is high, and the visual angle is more evenly broad, and resistance to elevated temperatures is superior; It is relatively low to decay, and long working life has truly realized being used for the Surface Mount LED of outdoor LED display screen.
Description of drawings
Fig. 1 is a paster LED apparatus structure sketch map commonly used in the past;
Fig. 2 is the structural representation of the embodiment of the invention one;
Fig. 3 is the structural representation of the embodiment of the invention two;
Fig. 4 is the structural representation of the embodiment of the invention three.
Among the figure, 01, the injection moulding plastic body, 02, the LED wafer, 03, metal lead frame; 04, transparent filler, 1, the injection moulding plastic body, 2, the LED wafer, 21, upper area; 3, metal lead frame, 31, the hollow out gap, 4, transparent filler; 41, the hollow region of the rectangular shape in cross section, 42, the cross section is polygon-shaped hollow region, 43, the hollow region of " irrigation canals and ditches " shape;
Embodiment:
Be easy to understand understanding in order to make creation characteristic of the present invention, technological means and to reach purpose, further set forth the present invention below in conjunction with specific embodiment.
Embodiment one:
Referring to Fig. 2, a kind of paster LED device, comprise metal lead frame 3, be fixed on metal lead frame 3 surface LED wafer 2, be wrapped in the enclosure wall formula injection moulding plastic body 1 and the transparent filler 4 of metal lead frame 3 upper and lowers.
The upper area 21 of LED wafer 2 is full of transparent filler 4, and it is extraneous that the light of being convenient to send passes said transparent filler 4 directives;
The hollow region 41 of the rectangular shape in cross section is set in the reverse side injection moulding plastic body 1 of said metal lead frame 3 fixed L ED wafers 2 one sides; Be full of transparent filler 4 in the hollow region 41 of the rectangular shape in said cross section; Rectangular-shaped design makes transparent filler 4 be connected more firmly closely difficult drop-off with metal lead frame 3.
Be penetrating hollow out gap 31 between said metal lead frame 3 and the metal lead frame 3, be full of transparent filler 4 in the said hollow out gap 31;
The above-mentioned interior transparent filler 4 of hollow region 41 and 31 each zones, hollow out gap that is filled in upper area 21, the rectangular shape in cross section is connected as a single entity; Transparent filler 4 is filled the penetrating zone parcel LED wafer 2 and metal lead frame 3 of injection moulding plastic body 1 up and down through the hollow out gap 31 between said metal lead frame 3 and the metal lead frame 3; It is tightr to make that like this each several part combines; Transparent filler 4 is as a whole metal lead frame 3 and LED wafer 2 parcels; With injection moulding plastic body 3 bondings, transparent filler 4 also is not easy to come off simultaneously.
Embodiment two:
Referring to Fig. 3, a kind of paster LED device, comprise metal lead frame 3, be fixed on metal lead frame 3 surface LED wafer 2, be wrapped in the enclosure wall formula injection moulding plastic body 1 and the transparent filler 4 of metal lead frame 3 upper and lowers.
The upper area 21 of LED wafer 2 is full of transparent filler 4, and it is extraneous that the light of being convenient to send passes said transparent filler 4 directives;
In the reverse side injection moulding plastic body 1 of said metal lead frame 3 fixed L ED wafers 2 one sides the cross section is set and is polygon-shaped hollow region 42; Said cross section is in the polygon-shaped hollow region 42 and is full of transparent filler 4; Inclined side and the base of metal lead frame 3 that the cross section is the outlying station stepwise injection moulding plastic cement of polygon-shaped hollow region 42 offset; Have supporting role, metal lead frame 3 is not yielding, makes LED matrix more firm.
Be penetrating hollow out gap 31 between said metal lead frame 3 and the metal lead frame 3, be full of transparent filler 4 in the said hollow out gap 31;
Above-mentionedly be filled in that upper area 21, cross section are polygon-shaped hollow region 42 and the transparent fillers 4 in 31 each zones, hollow out gap are connected as a single entity; Transparent filler 4 is filled the hollow region parcel LED wafer 2 and metal lead frame 3 of injection moulding plastic body 1 up and down through the hollow out gap 31 between said metal lead frame 3 and the metal lead frame 3; It is tightr to make that like this each several part combines; Transparent filler 4 is as a whole metal lead frame 3 and LED wafer 2 parcels; With injection moulding plastic body 3 bondings, transparent filler 4 also is not easy to come off simultaneously.
Embodiment three:
Referring to Fig. 4, a kind of paster LED device, comprise metal lead frame 3, be fixed on metal lead frame 3 surface LED wafer 2, be wrapped in the enclosure wall formula injection moulding plastic body 1 and the transparent filler 4 of metal lead frame 3 upper and lowers.
The upper area 21 of LED wafer 2 is full of transparent filler 4, and it is extraneous that the light of being convenient to send passes said transparent filler 4 directives;
The hollow region 43 of " irrigation canals and ditches " shape is set in the reverse side injection moulding plastic body 1 of said metal lead frame 3 fixed L ED wafers 2 one sides; Be full of transparent filler 4 in the hollow region 43 of said " irrigation canals and ditches " shape; The hollow region 43 of being somebody's turn to do " irrigation canals and ditches " shape is not extended outside the injection moulding plastic body 1, remains injection moulding plastic body 1 in hollow region 43 bottoms of " irrigation canals and ditches " shape.
The design of " irrigation canals and ditches " shape makes transparent filler 4 and metal lead frame 3 be connected more firmly closely difficult drop-off with injection moulding plastic body 1.
Be penetrating hollow out gap 31 between said metal lead frame 3 and the metal lead frame 3, be full of transparent filler 4 in the said hollow out gap 31;
The above-mentioned interior transparent filler 4 of hollow region 43 and 31 each zones, hollow out gap that is filled in upper area 21, " irrigation canals and ditches " shape is connected as a single entity; Transparent filler 4 is filled the hollow region parcel LED wafer 2 and metal lead frame 3 of injection moulding plastic body 1 up and down through the hollow out gap 31 of said metal lead frame 3; It is tightr to make that like this each several part combines; Transparent filler 4 is as a whole metal lead frame 3 and LED wafer 2 parcels; With injection moulding plastic body 3 bondings, transparent filler 4 also is not easy to come off simultaneously.
Further; Hollow region cross section in the reverse side injection moulding plastic body 1 of said metal lead frame 3 fixed L ED wafers 2 one sides also can be trapezoidal shape; Also can become corresponding other shape, to satisfy the requirement of different characteristics paster LED device according to the performance design of paster LED device.
In sum, paster LED device overall structure advantages of simple, it is tightr that each several part is connected; Economical with materials is effectively enhanced productivity, and the LED display effect is desirable; Brightness is high, and the visual angle is evenly broad, and resistance to elevated temperatures is superior; It is relatively low to decay, and long working life has truly realized being used for the Surface Mount LED of outdoor LED display screen.
More than show and described basic principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; The present invention also has various changes and modifications under the prerequisite that does not break away from spirit and scope of the invention, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.
Claims (7)
1. paster LED device; Comprise the metal lead frame that connects LED wafer both positive and negative polarity respectively, be fixed on the LED wafer on metal lead frame surface, be wrapped in said metal lead frame upper and lower and be distributed in peripheral injection moulding plastic body; It is characterized in that; In the reverse side injection moulding plastic body of said metal lead frame fixed L ED wafer one side hollow region is set, is full of transparent filler in the said hollow region, said LED wafer is by the transparent filler parcel of its upper area;
Be provided with penetrating hollow out gap between said metal lead frame and the metal lead frame, said hollow out is full of transparent filler in the gap;
The transparent filler in above-mentioned each zone is connected as a single entity, and the hollow out gap of passing between said metal lead frame and the metal lead frame is filled the hollow region of injection moulding plastic body up and down and wrapped up said LED wafer and metal lead frame.
2. a kind of paster LED device according to claim 1; It is characterized in that; Said metal lead frame is the framework of a semi-surrounding through injection mo(u)lding; Around in framework inside is enclosure wall formula injection moulding plastic body, is provided with hollow region in the cavity of said injection moulding plastic body, and said hollow region is penetrating up and down through the hollow out gap between metal lead frame and the metal lead frame.
3. a kind of paster LED device according to claim 2 is characterized in that the metal lead frame that is provided with in the hollow cavity of said injection moulding plastic body is the spring-plate type structure.
4. a kind of paster LED device according to claim 1 is characterized in that, the hollow region cross section in the reverse side injection moulding plastic body of said metal lead frame fixed L ED wafer one side is rectangular-shaped.
5. a kind of paster LED device according to claim 1 is characterized in that, the hollow region cross section in the reverse side injection moulding plastic body of said metal lead frame fixed L ED wafer one side is polygon-shaped.
6. a kind of paster LED device according to claim 1 is characterized in that, the hollow region in the reverse side injection moulding plastic body of said metal lead frame fixed L ED wafer one side is " irrigation canals and ditches " shape.
7. a kind of paster LED device according to claim 1 is characterized in that, the hollow region cross section in the reverse side injection moulding plastic body of said metal lead frame fixed L ED wafer one side is a trapezoidal shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102641247A CN102347430A (en) | 2011-09-07 | 2011-09-07 | Surface-mounted LED (Light-Emitting Diode) device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102641247A CN102347430A (en) | 2011-09-07 | 2011-09-07 | Surface-mounted LED (Light-Emitting Diode) device |
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| CN102347430A true CN102347430A (en) | 2012-02-08 |
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| CN2011102641247A Pending CN102347430A (en) | 2011-09-07 | 2011-09-07 | Surface-mounted LED (Light-Emitting Diode) device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623623A (en) * | 2012-03-26 | 2012-08-01 | 李海涛 | Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber |
| CN102683552A (en) * | 2012-05-04 | 2012-09-19 | 佛山市蓝箭电子有限公司 | Surface mount light-emitting diode (LED) with waterproof function and bracket thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5298768A (en) * | 1992-02-14 | 1994-03-29 | Sharp Kabushiki Kaisha | Leadless chip-type light emitting element |
| JP2004207363A (en) * | 2002-12-24 | 2004-07-22 | Kyocera Corp | Package for housing light emitting element and light emitting device |
| KR20100035957A (en) * | 2008-09-29 | 2010-04-07 | 서울반도체 주식회사 | Light emitting device |
| TWI326497B (en) * | 2006-10-25 | 2010-06-21 | Lextar Electronics Corp | |
| CN101752352A (en) * | 2008-12-08 | 2010-06-23 | 瑞莹光电股份有限公司 | Light emitting diode package and production method thereof |
| CN202210537U (en) * | 2011-09-07 | 2012-05-02 | 李海涛 | Paster LED device |
-
2011
- 2011-09-07 CN CN2011102641247A patent/CN102347430A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5298768A (en) * | 1992-02-14 | 1994-03-29 | Sharp Kabushiki Kaisha | Leadless chip-type light emitting element |
| JP2004207363A (en) * | 2002-12-24 | 2004-07-22 | Kyocera Corp | Package for housing light emitting element and light emitting device |
| TWI326497B (en) * | 2006-10-25 | 2010-06-21 | Lextar Electronics Corp | |
| KR20100035957A (en) * | 2008-09-29 | 2010-04-07 | 서울반도체 주식회사 | Light emitting device |
| CN101752352A (en) * | 2008-12-08 | 2010-06-23 | 瑞莹光电股份有限公司 | Light emitting diode package and production method thereof |
| CN202210537U (en) * | 2011-09-07 | 2012-05-02 | 李海涛 | Paster LED device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623623A (en) * | 2012-03-26 | 2012-08-01 | 李海涛 | Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber |
| CN102683552A (en) * | 2012-05-04 | 2012-09-19 | 佛山市蓝箭电子有限公司 | Surface mount light-emitting diode (LED) with waterproof function and bracket thereof |
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Application publication date: 20120208 |