CN102290354A - Novel IC (integrated circuit) package manufacturing technology - Google Patents
Novel IC (integrated circuit) package manufacturing technology Download PDFInfo
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- CN102290354A CN102290354A CN2011102255355A CN201110225535A CN102290354A CN 102290354 A CN102290354 A CN 102290354A CN 2011102255355 A CN2011102255355 A CN 2011102255355A CN 201110225535 A CN201110225535 A CN 201110225535A CN 102290354 A CN102290354 A CN 102290354A
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Abstract
The invention discloses a novel IC (integrated circuit) package manufacturing technology which comprises a base plate manufacturing technology, a cover plate manufacturing technology and a package technology of a base plate and a cover plate, wherein the base plate manufacturing technology comprises base plate manufacturing; cutting; drilling; copper depositing; copper thickening; graphic transferring; graphic electroplating; film removing; semi-hole processing; etching; solder removing; solder resisting; and chemical plating. The cover plate manufacturing technology comprises preparing materials of the cover plate; cutting the cover plate; carrying out the back glue application process; machining; and cleaning. The package technology of the base plate and the cover plate comprises pressing and fitting; baking; cleaning; and checking finally. The manufacturing technology provided by the invention has the beneficial effects that the manufactured lines have high accuracy, and no residual copper is left and the lines are smooth after etching; the cover plate is not deformed and no serious excessive glue happens; and the combining force of the cover plate and a main board can reach more than 10KG; a substrate is not layered after machining; semi-holes have no burr; and the profile edge is neat and has no dust.
Description
Technical field
The present invention relates to a kind of IC encapsulation technology, relate in particular to a kind of novel IC packaging technology.
Background technology
The IC encapsulation just is meant the circuit pin on the silicon chip, connects with lead and guides to external lug place, so that be connected with other device, packing forms is meant installs the shell that semiconductor integrated circuit chip is used.It not only plays a part to install, fixes, seals, protects aspects such as chip and enhancing electric heating property; but also be wired to by the contact on the chip on the pin of package casing; these pins are connected with other devices by the lead on the printed circuit board (PCB) again, thereby realize being connected of inside chip and external circuit.Because chip must be isolated from the outside, the corrosion of chip circuit is caused electric property descend to prevent airborne acrobatics.
The kind of IC encapsulation is a lot, reach kind more than 70, with regard to present stage PCB in the industry directly the contact also many, present a kind of title gives encapsulation PLCC very common the cover plate mould, and to carry out the manufacture method that this its key point of class encapsulation mode is the IC support plate, the manufacture method of present employed IC encapsulating carrier plate can not satisfy lines required precision height, smooth, the indeformable contour standard-required of cover plate pressing of etching lines because design procedure is unreasonable.
Summary of the invention
The object of the present invention is to provide a kind of novel IC package fabrication process, this processing step is rigorous, methodological science has solved the IC encapsulation that exists in the prior art because problems such as the variable row of the rough cover plate of etching lines cause the not high and not good problem of sealing effectiveness of encapsulation precision.
For addressing the above problem, the technical solution used in the present invention is:
A kind of novel I C package fabrication process comprises the packaging technology of the egative film manufacturing process, cover plate manufacturing process and egative film and the cover plate that carry out successively,
Described egative film manufacturing process comprises:
Step 1.1, negative film making;
Step 1.2 is opened material;
Step 1.3, boring, i.e. drill datum hole on egative film;
Step 1.4, heavy copper, the i.e. thin copper of heavy last layer chemistry on the substrate surface of egative film and datum hole;
Step 1.5, thickening copper, promptly heavy again copper is so that copper layer thickness increases;
Step 1.6, figure transfer;
Step 1.7, graphic plating;
Step 1.8 is moved back film,
Step 1.9, the processing of half hole;
Step 1.10, etching;
Step 1.11 is moved back tin;
Step 1.12, welding resistance;
Step 1.13 is changed gold, finishes the making of egative film;
Described cover plate manufacturing process comprises:
Step 2.1, cover plate is got the raw materials ready;
Step 2.2, cover plate is opened material;
Step 2.3, gum;
Step 2.4, machine work;
Step 2.5 is cleaned, and finishes the making of cover plate;
The packaging technology of described egative film and cover plate comprises:
Step 3.1, pressing;
Step 3.2, baking;
Step 3.3 is cleaned, and finishes packaging technology.
For making the present invention play better technique effect:
Further technical scheme is to need after above-mentioned step 1.11 is finished that egative film is carried out the first time to detect, and described step 1.13 pair egative film carries out the second time and detects.
Further technical scheme is after above-mentioned step 3.3 is finished finished product to be carried out whole inspection, and inspection comprises FQA and physical testing eventually.
Further technical scheme is to carry out must carrying out technological compensa tion when light is painted egative film in the above-mentioned step 1.1, and technological compensa tion must determine that described egative film is a positive according to the lateral erosion of measuring different-thickness Cu.Wherein the live width compensation method is: formula [loss amount (MIL)=basic copper (MIL)/1.2], for example: its loss amount of 35UM base copper is 35/25.4*1.2=1.2miL, and its loss amount is the loss amount+compensation rate of live width, and this live width can be adjusted in claimed range.
Further technical scheme is that the material of above-mentioned step 2.1 cover plate uses the two-sided sheet material of high TG, and with the copper sheet eating away of two-sided sheet material.
Further technical scheme is to comprise following substep in the above-mentioned step 1.6:
Step 1.6.1, nog plate;
Step 1.6.2 uses chemical microetch to handle to the processing of Cu face;
Step 1.6.3 carries out pad pasting immediately after the oven dry;
Whether step 1.6.4 after the development, reaches the drawing requirement with scale magnifying glass slotted line and gap, guarantees the smooth no sawtooth of lines.
Further technical scheme is in the above-mentioned step 1.9, and positive and negative two cutter groove millings are adopted in the processing of half hole, row cutter speed control 1-2 rice/minute.
Further technical scheme is in the above-mentioned step 1.10, and CuCl is adopted in etching
2Solution corrodes, and simultaneously figure BGA is faced down to reduce side etching quantity.
Further technical scheme is that pressing-in temp is controlled at 175 degrees centigrade in the above-mentioned step 3.1, and the time was controlled at 5 minutes, after pressing is finished, clamps with smooth steel plate again, and with 150 degree celsius temperature baking 60 minutes, slotting again frame after the cooling was in order to avoid base plate deformation.
Adopt the beneficial effect that technique scheme produced to be: produced lines precision height, no residual copper and lines are smooth after the etching, cover plate is indeformable, there is not the serious glue that overflows, the adhesion of cover plate and mainboard reaches more than the 10KG, and the machining metacoxal plate does not have layering, and half hole does not have burr, outline edge is neat, no dust.
Description of drawings
Fig. 1 is the flow chart of technology of the present invention.
Embodiment
Below the present invention is done and describes in further detail:
As shown in Figure 1, a kind of novel I C package fabrication process comprises the packaging technology of the egative film manufacturing process, cover plate manufacturing process and egative film and the cover plate that carry out successively,
Described egative film manufacturing process comprises:
Step 1.1, negative film making is promptly carried out light and is painted negative film making; Carrying out to carry out technological compensa tion when light is painted egative film, technological compensa tion must be determined according to the lateral erosion of measuring different-thickness Cu, described egative film is a positive, wherein the live width compensation method is: formula [loss amount (MIL)=basic copper (MIL)/1.2], for example: its loss amount of 35UM base copper is 35/25.4*1.2=1.2miL, its loss amount is the loss amount+compensation rate of live width, and this live width can be adjusted in claimed range.
Step 1.2 is opened material;
Step 1.3, boring, i.e. drill datum hole on egative film;
Step 1.4, heavy copper, the i.e. thin copper of heavy last layer chemistry on the substrate surface of egative film and datum hole;
Step 1.5, thickening copper, promptly heavy again copper is so that copper layer thickness increases;
Step 1.6, figure transfer; Comprise following substep in this step:
Step 1.6.1, nog plate;
Step 1.6.2 uses chemical microetch to handle to the processing of Cu face;
Step 1.6.3 carries out pad pasting immediately after the oven dry;
Whether step 1.6.4 after the development, reaches the drawing requirement with scale magnifying glass slotted line and gap, guarantees the smooth no sawtooth of lines.
Step 1.7, graphic plating; Carry out scratch brushing at the plate face earlier and handle, adopt crossover current control during plating, make two sides circuit coating even, will pay special attention to the quality problem that ladder is electroplated in this step, guarantee that copper face is smooth, bonding is carried out smoothly.
Step 1.8 is moved back film,
Step 1.9, the processing of half hole; In this step, pay special attention to the scarce copper and the half hole copper wire phenomenon in half hole, CNC gong band can adopt positive and negative two cutter groove millings, row cutter speed control 1-2 rice/minute.
Step 1.10, etching; CuCl is adopted in etching
2Solution corrodes, and simultaneously figure BGA is faced down to reduce side etching quantity.
Step 1.11 is moved back tin; Half tone can be selected the mesh of 43T for use in this step, welding resistance must be smooth otherwise be influenced the adhesion of mainboard and cover plate, the wherein preferred automatic screen printer printing of welding resistance, if the thick 1OZ that surpasses of copper, then need earlier with circuit film exposure method, slit between the circuit is filled and led up earlier, and then lid top layer printing ink, make it smooth.
Step 1.12, welding resistance;
Step 1.13 is changed gold; Stop black nickel phenomenon in the step.
After above-mentioned steps 1.11 and 1.13 is finished, all need egative film is detected, can reject as early as possible as substandard product, in order to avoid the material cost in waste later stage.
Described cover plate manufacturing process comprises:
Step 2.1, cover plate is got the raw materials ready; The material of cover plate uses the two-sided sheet material of high TG, and with the copper sheet eating away of two-sided sheet material.
Step 2.2, cover plate is opened material;
Step 2.3, gum; The cover plate gum must guarantee not have bubble, smooth no rubbish, and this step adopts special-purpose gum machine gum, and temperature is 100 degree, speed 1-2 rice/minute, operation is ideal in dustless room.
Step 2.4, machine work; During the profile machine work, should adopt the accurate digital control milling machine, precision is controlled well, the generation of dust and burr can not be arranged.
Step 2.5 is cleaned;
The packaging technology of described egative film and cover plate comprises:
Step 3.1, pressing; Pressing-in temp is controlled at 175 degrees centigrade, and the time was controlled at 5 minutes, after pressing is finished, clamps with 150 degree celsius temperature baking 60 minutes with smooth steel plate again, inserts frame after the cooling again, in order to avoid base plate deformation.
Step 3.2, baking;
Step 3.3 is cleaned; Because dust exists in a large number, can influence the IC packaging effect, so use ultrasonic waves for cleaning in this step.
After above-mentioned technology is finished, need product is carried out whole inspection, comprise and carry out FQA and physical testing, and then shipment.
Claims (9)
1. novel I C package fabrication process is characterized in that: comprise the packaging technology of the egative film manufacturing process, cover plate manufacturing process and egative film and the cover plate that carry out successively,
Described egative film manufacturing process comprises:
Step 1.1, negative film making;
Step 1.2 is opened material;
Step 1.3, boring, i.e. drill datum hole on egative film;
Step 1.4, heavy copper, the i.e. thin copper of heavy last layer chemistry on the substrate surface of egative film and datum hole;
Step 1.5, thickening copper, promptly heavy again copper is so that copper layer thickness increases;
Step 1.6, figure transfer;
Step 1.7, graphic plating;
Step 1.8 is moved back film,
Step 1.9, the processing of half hole;
Step 1.10, etching;
Step 1.11 is moved back tin;
Step 1.12, welding resistance;
Step 1.13 is changed gold, finishes the making of egative film;
Described cover plate manufacturing process comprises:
Step 2.1, cover plate is got the raw materials ready;
Step 2.2, cover plate is opened material;
Step 2.3, gum;
Step 2.4, machine work;
Step 2.5 is cleaned, and finishes the making of cover plate;
The packaging technology of described egative film and cover plate comprises:
Step 3.1, pressing;
Step 3.2, baking;
Step 3.3 is cleaned, and finishes packaging technology.
2. novel I C package fabrication process according to claim 1 is characterized in that: need after described step 1.11 is finished that egative film is carried out the first time and detect, described step 1.13 pair egative film carries out the second time and detects.
3. novel I C package fabrication process according to claim 1 is characterized in that: after described step 3.3 is finished finished product is carried out whole inspection.
4. novel I C package fabrication process according to claim 1 is characterized in that: carrying out must carrying out technological compensa tion when light is painted egative film in the described step 1.1, technological compensa tion must determine that described egative film is a positive according to the lateral erosion of measuring different-thickness Cu.
5. the manufacturing process of IC encapsulating carrier plate according to claim 1 is characterized in that: the material of described step 2.1 cover plate uses the two-sided sheet material of high TG, and with the copper sheet eating away of two-sided sheet material.
6. novel I C package fabrication process according to claim 1 is characterized in that: comprise following substep in the described step 1.6:
Step 1.6.1, nog plate;
Step 1.6.2 uses chemical microetch to handle to the processing of Cu face;
Step 1.6.3 carries out pad pasting immediately after the oven dry;
Whether step 1.6.4 after the development, reaches the drawing requirement with scale magnifying glass slotted line and gap, guarantees the smooth no sawtooth of lines.
7. novel I C package fabrication process according to claim 1 is characterized in that: in the described step 1.9, positive and negative two cutter groove millings are adopted in half hole processing, row cutter speed control 1-2 rice/minute.
8. novel I C package fabrication process according to claim 1 is characterized in that: in the described step 1.10, CuCl is adopted in etching
2Solution corrodes, and simultaneously figure BGA is faced down to reduce side etching quantity.
9. novel I C package fabrication process according to claim 1 is characterized in that: in the described step 3.1, pressing-in temp is controlled at 175 degrees centigrade, and the time was controlled at 5 minutes; After pressing is finished, clamp with smooth steel plate again,, insert frame after the cooling again, in order to avoid base plate deformation with 150 degree celsius temperature baking 60 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2011102255355A CN102290354A (en) | 2011-08-08 | 2011-08-08 | Novel IC (integrated circuit) package manufacturing technology |
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| CN2011102255355A CN102290354A (en) | 2011-08-08 | 2011-08-08 | Novel IC (integrated circuit) package manufacturing technology |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102651946A (en) * | 2012-04-05 | 2012-08-29 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
| CN102917542A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Method for manufacturing copper PCB (Printed Circuit Board) circuit |
| CN103458616A (en) * | 2012-05-29 | 2013-12-18 | 深南电路有限公司 | Printed circuit board processing method |
| CN105307426A (en) * | 2015-09-16 | 2016-02-03 | 深圳市景旺电子股份有限公司 | Curing method used for preventing swelling of glue-free stratified area of multi-layer soft board |
| CN113451142A (en) * | 2020-03-26 | 2021-09-28 | 银特(上海)半导体科技有限公司 | Packaging method based on melt welding |
-
2011
- 2011-08-08 CN CN2011102255355A patent/CN102290354A/en active Pending
Non-Patent Citations (2)
| Title |
|---|
| 蒋培安: "《印制电路板的可制造性设计》", 30 September 2007, 中国电力出版社 * |
| 陈胜华: "《新型的IC封装工艺（PLCC）及其PCB载板制造流程》", 《电子电路与贴装》 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102651946A (en) * | 2012-04-05 | 2012-08-29 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
| CN102651946B (en) * | 2012-04-05 | 2014-06-25 | 深圳崇达多层线路板有限公司 | Manufacturing process for step circuit of PCB (Printed Circuit Board) |
| CN103458616A (en) * | 2012-05-29 | 2013-12-18 | 深南电路有限公司 | Printed circuit board processing method |
| CN103458616B (en) * | 2012-05-29 | 2016-12-14 | 深南电路有限公司 | The processing method of printed circuit board (PCB) |
| CN102917542A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Method for manufacturing copper PCB (Printed Circuit Board) circuit |
| CN102917542B (en) * | 2012-10-17 | 2015-07-08 | 无锡江南计算技术研究所 | Method for manufacturing copper PCB (Printed Circuit Board) circuit |
| CN105307426A (en) * | 2015-09-16 | 2016-02-03 | 深圳市景旺电子股份有限公司 | Curing method used for preventing swelling of glue-free stratified area of multi-layer soft board |
| CN105307426B (en) * | 2015-09-16 | 2018-10-23 | 深圳市景旺电子股份有限公司 | A kind of curing for avoiding multilayer soft board from being heaved without glue demixing zone |
| CN113451142A (en) * | 2020-03-26 | 2021-09-28 | 银特(上海)半导体科技有限公司 | Packaging method based on melt welding |
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Application publication date: 20111221 |