CN102211251A

CN102211251A - Apparatus for processing a substrate

Info

Publication number: CN102211251A
Application number: CN201010619572XA
Authority: CN
Inventors: 李均远; 金圣一; 孟智艺; 崔大洙; 高英材; 吕桓守
Original assignee: LNPHONORS Ltd
Current assignee: LNPHONORS Ltd
Priority date: 2010-04-06
Filing date: 2010-12-22
Publication date: 2011-10-12
Also published as: KR100985018B1

Abstract

A substrate processing apparatus which forms a pattern by emitting laser to a substrate by moving a laser head at a regular speed along a guide rail is provided to increase the efficiently of a patterning process by emitting laser to a plurality of substrates. A substrate processing apparatus comprises a body, a substrate transfer module, and a processing module. The body comprises the upper side. The body comprises an opening. The opening passes through the central part from the upper side. The substrate transfer module has the plane vector of a processing target surface supports one substrate in a horizontal or vertical direction. The substrate transfer module transfers the substrate in order to pass through the upper side.

Description

The equipment that is used for treatment substrate

Technical field

The embodiment of example relates to a kind of equipment that is used for treatment substrate, more particularly relates to a kind ofly be used to use laser to handle the equipment of LGP.

Background technology

Recently, along with developing rapidly of semiconductor and information communication (IT) industry, because that LCD (LCD) device has is in light weight, display quality is high, energy consumption is low and environment amenable characteristic, they have been widely used in many fields.Because these advantages are arranged, from small-sized display, for example, moving screen expands large-scale display to, for example, is used for the monitor or the television set of computer system in the application of nearly more than ten years LCD device.

By and large, the LCD device is passive device (passive device), and wherein offhand self luminous light source is come display image thereby external light source is installed on the LCD device.That is to say that the LCD device must need the light source that adds as display.Therefore, the LCD device comprises liquid panel and back light unit (BLU), data after the various processing that show on the described liquid panel such as font, image and film, described backlight panel (BLU) is located under the described liquid panel and as surface source of light to come to described liquid side Plate supplying light.

According to the position of light source such as cold-cathode fluorescence lamp (CCFL) and light emitting diode (LED), the BLU with prior art is divided into straight-down negative (direct type) and side-light type (edge type) usually.In the BLU of straight-down negative, under described liquid panel, be positioned with a plurality of light sources, thereby light directly and equably is provided on the rear surface of described liquid panel.On the contrary, the light source of the BLU of side-light type is positioned in an edge or two edges of described liquid panel, thereby via LGP (LGP) light is directed on the rear surface of described liquid panel.That is to say that the BLU of side-light type must need with LGP the linear light sorurce of side to be transformed to the straight-down negative surface source of light.The light that produces at the edge part branch of described liquid panel is supplied on the side of described LGP, and, thereby guide described light and it is supplied to the rear surface of described liquid panel equably via the front surface scattering of the scattering pattern on the lower surface of described LGP towards described LGP.Arrange regularly or at random that on the lower surface of described LGP various groovings and the projection such as round dot are as scattering pattern (scattering pattern).

Described scattering pattern normally is formed on the described lower surface via the optical technology and the mechanical technology such as cutting technique and injection moulding (injection) technology of the typography such as photoetching (photolithography) technology of using mask pattern, use laser.

Typography is generally used for forming scattering pattern by this way on the lower surface of medium-sized or large-scale LGP, promptly makes described scattering pattern to be transferred on the lower surface of described LGP via photoetching process according to described mask pattern.But the problem of this typography is that cleaning solution can be penetrated in the dividing surface of described mask pattern and described LGP usually, thereby makes the brightness variation of described LGP, has increased the fault of LGP.In addition, being used for the cutting tool (cutter) of cutting technique and mechanical technology that use is used for the model of injection moulding (injection) technology equally also has problem, be that the shape of described scattering pattern is difficult to change, and the processing time is long, and treatment effeciency is low.

Owing to these reasons, in recent years, extensive use uses the optical technology (hereinafter being called laser technology) of laser to form the scattering pattern of LGP.According to existing laser technology, laser is a particular location that directly focuses on acrylic board (acrylic plate) lower surface, forms a round dot partly in this particular location part of described acrylic board.Then, move according to the pattern of rule and to be used for lasing laser head, on the lower surface of described acrylic board, form a plurality of round dots according to described pattern, thereby form described scattering pattern in the bottom of described LGP.

But, to compare with mechanical technology with typography, the laser head that is used for existing laser technology often moves too slowly, to such an extent as to be difficult to produce in enormous quantities LGP.In typography and mechanical technology, round dot pattern on the described LGP bottom can use mask pattern (mask pattern) each other together and form on main body as the model pattern (mold pattern) of pattern transferring, thereby can carry out the patterned process that is used to form described scattering pattern by plate (plate).On the contrary, can be formed on the round dot pattern on the described LGP bottom by the laser head that moves respectively, thereby can carry out the patterned process that is used to form described scattering pattern by point on the described plate or round dot.Therefore, the treatment effeciency of described laser technology is determined by the translational speed of laser head fatefully.But when carrying out laser treatment, laser head at a high speed can produce variety of issue usually.For example, because curvilinear motion must reduce the translational speed of laser head, so be difficult to form efficiently crooked scattering pattern.In addition, owing to the mechanical shock of laser head when high-speed mobile, often be difficult to accurately control the laser head of existing heaviness.

Especially, recently along with recent LGP size increases gradually, inefficient laser technology can produce serious problem.The trend that the recent LCD or the size of display panels of light-emitting diode display enlarge need improve the treatment effeciency of laser technology strongly.

Therefore, need a kind of equipment that is used for laser technology strongly, so that improving treatment effeciency aspect the trend of nearest flat panel display size increase.

Summary of the invention

Example embodiment provides a kind of equipment that is used for treatment substrate, wherein handles simultaneously a plurality of substrates together.

According to some example embodiment, the invention provides a kind of equipment that is used for treatment substrate.Described treatment facility can comprise a main body, and this main body has the upper surface that defined by perpendicular x axle and y axle and penetrates the opening that penetrates of middle body by described main body; The substrate conveyor module is equipped with a plurality of substrates with this configuration mode on this substrate conveyor module, make that promptly the normal vector of described a plurality of substrates is different and be parallel to described upper surface; And processing module, around the harness motion that penetrates on the upper surface of described main body, and the mode of laser with the normal vector that is parallel to described substrate projected on the described substrate.Described substrate conveyor module can be arranged in the described opening that penetrates, thereby penetrates described main body.

In an example embodiment, described processing module can comprise the laser generator that is used to produce described laser, thereby described laser is projected at least one laser head that on described substrate, forms pattern on the described substrate, be arranged on the upper surface of described main body and surround that (enclosing) is described to penetrate the guide rail (guide rail) of perforate and make the laser head supply unit of described laser head along described guide rail movement, the first of described laser head supply unit removably is fixed on the described laser head, and the second portion of described laser head supply unit is fixed on the described guide rail movably.

In the embodiment of example, described processing module may further include the path changing device, is used to change the optical path of described laser, and the described laser that will come from described laser generator offers described laser head.In this case, described substrate comprises first substrate with first normal vector that points to described x axle, second substrate with second normal vector that points to described y axle, the 3rd substrate and tetrabasal with the 3rd normal direction vector that points to described-x axle with the 4th normal vector that points to described-y axle, on the 4th zone around described laser generator is arranged in the 4th bight of described the above guide rail of upper surface and laser be under situation about sending from described laser generator on the y direction of principal axis, described path changing device comprises on the first area around first bight that is located at described the above guide rail of upper surface and the optical path of described laser is changed to-the axial first path changing device of x from described y direction of principal axis, be positioned on the second area around second bight of described the above guide rail of upper surface and the optical path of described laser is changed to-the axial second path changing device of y and be located at that the 3rd zone around the third angle portion of described the above guide rail of upper surface is gone up and the optical path of described laser is changed to the axial Third Road of x from described-y direction of principal axis and directly change device from described-x direction of principal axis.A plurality of described laser heads can be positioned respectively towards described substrate, and described laser head is individual operation independently of each other, make each laser head independently of one another to the laser projection of each substrate.

In the embodiment of an example, described processing module comprises further and is located on the described upper surface parallelly with described guide rail and drive the drive unit of described laser head supply unit along described guide rail movement that described drive unit comprises the driver element that is connected to described laser head supply unit and is used for driving force is applied to the power supply of described driver element.Described driver element comprises that in chain, driving-belt and the driving tooth bar one and described power supply comprise servomotor.

In example embodiment of the present invention, described processing module comprises first support that is positioned with described laser generator, be set at below described first support and above be useful on the optical path that changes described laser at least one optical path change second support of device and be used to drive the described laser head supply unit that is connected on described second support drive unit along described guide rail movement.

Especially, described first support comprise from the periphery of described upper surface along perpendicular to upwardly extending first post of the z axle of x axle and y axle and from the end parts parallel of described first post in horizontally extending first flat board of described upper surface, on this first flat board, be positioned with described laser generator and be used for the first path changing device that the optical path with described laser changes down, described second support comprise second post that extends from the middle body of described upper surface along described z axle up and from the end parts parallel of described second post in horizontally extending second flat board of described upper surface, under the described first path changing device vertical, be positioned with the second path changing device that is used to change described optical path on described second flat board.Described drive unit comprises the 3rd post that extends from described laser head supply unit along the z axle up, be connected to described the 3rd post and described second dull and stereotypedly goes up and controls the flexible connector of spacing between described the 3rd post and described second flat board flexibly and driving force is applied on described second post by this way, promptly makes described laser head supply unit move along with the rotation of described second post.

Furthermore, described processing module comprises that the office, top that is positioned at described the 3rd post and the Third Road of the described second path changing device coplane directly change device, directly change device from the described second path changing device laser light reflected by described Third Road like this and are provided for described laser head along described the 3rd post.

In an example embodiment, described processing module comprises that further the laser that is used for sending from described laser generator is divided into the spectroscope of a plurality of laser that separate and is used for individually changing the optical path of the described laser that separates and the described laser that separates is offered a plurality of path changing devices of described laser head respectively.

In an example embodiment, thereby described substrate conveyor module comprises and is arranged in the described central shaft that opening penetrates described main body that penetrates that described central shaft carries out linear movement and rotates with respect to described z axle along the z axle perpendicular to x axle and y axle; Be connected to the framework of described central shaft; Be installed on the described framework and the delivery board of described substrate is installed; And be used to drive described central shaft and have the drive unit that the described framework of described delivery board carries out linear movement and rotation.

For example, thus described delivery board comprises that being used for stating substrate by the vacuum pressure absorbing residence is fixed on vavuum pump on the described substrate with described substrate.Described framework is formed rectangle, and four delivery boards are installed on each side of described rectangular frame.

In an example embodiment, described treatment facility further is included in and drives the controller that described substrate conveyor module moves along the z axle perpendicular to x axle and y axle after the width of described substrate is finished the projection of laser to described substrate.

Some example embodiment of design according to the present invention, described laser head moves with constant speed along the guide rail round described a plurality of substrates, and described laser can be projected onto on each substrate from described laser head, thereby forms various patterns on described substrate S.Especially, the constant speed of described laser head has improved the uniformity of described pattern, simultaneously a plurality of substrates is carried out the efficient that patterning has improved the patterned process of described treatment facility.

Description of drawings

Following detailed description in conjunction with the drawings will more be expressly understood example embodiment.

Fig. 1 is the perspective view of diagram equipment that is used for treatment substrate of first example embodiment of design according to the present invention;

Fig. 2 is the vertical view of the diagram equipment that is used for treatment substrate shown in Figure 1;

Fig. 3 is the perspective view of the processing module of the treatment facility shown in the pictorial image 1;

Fig. 4 is the perspective view of diagram equipment that is used for treatment substrate of second example embodiment of design according to the present invention;

Fig. 5 A is the perspective view of diagram equipment that is used for treatment substrate of the 3rd example embodiment of design according to the present invention;

Fig. 5 B is the vertical view of the treatment facility shown in the pictorial image 5A;

Fig. 6 shows the flow chart that is used for forming at the treatment facility shown in Fig. 1 and Fig. 2 the treatment step of method of patterning;

Fig. 7 is the flow chart that described substrate is installed in the treatment step on the described delivery board that shows among Fig. 6;

Fig. 8 is the flow chart that forms the treatment step of first pattern on described substrate that shows among Fig. 6;

Fig. 9 and Figure 10 are the topology views of the laser head supply unit motion of the treatment facility shown in the pictorial image 1;

Figure 11 shows the flow chart of first example embodiment of the design according to the present invention in the motion of the delivery board shown in Fig. 6 (perhaps framework); And

Figure 12 shows the flow chart of second example embodiment of the design according to the present invention in the motion of the delivery board shown in Fig. 6 (perhaps framework).

The specific embodiment

Hereinafter with reference has shown that the accompanying drawing of some example embodiment more completely describes each example embodiment.But the present invention can be presented as different forms, and not should be understood to be subjected to the restriction of the example embodiment of this place explaination.And should be, provide these example embodiment to make this disclosure content detailed and comprehensive, fully scope of the present invention is conveyed to those skilled in the art.In described figure, for the sake of clarity, may exaggerate each layer and the zone size and relative size.

Should be understood that, when claim an element or layer be " ... on ", " being connected to " or " being couple to " another element or layer, it can be directly on another element or the layer, be connected on another element or the layer or be couple to another element or layer, or element or layer in the middle of occuping are arranged.On the contrary, when claim an element be " directly exist ... on ", " being directly connected to " or " directly being couple to " another element or layer, element or layer in the middle of so just not occuping.In whole specification, identical label refers to components identical.Word as used herein " and/or " comprise one or all multinomial combinations in the project of being enumerated that is associated.

Should be understood that though may use words such as first, second, third, etc. to describe various elements, assembly, zone, layer and/or block, these elements, assembly, zone, layer and/or block should not be subjected to the restriction of these words herein.These words only are used to distinguish element, assembly, zone, layer or a block and another zone, layer or block.Therefore, can be known as second element, assembly, zone, layer or block of first element, assembly, zone, layer or the block of Tao Luning hereinafter, and do not depart from instruction of the present invention.

May use the word relevant for convenience of description in this manual with the locus, such as " in ... below ", " ... under ", " bottom ", " ... directly over ", " top " and so on describe the relation of an illustrated in the accompanying drawings element or feature and another element or feature.Should be understood that the word relevant with the locus is intended to contain except the orientation described in the accompanying drawing, device in use or the different azimuth in the operation.For example, if the device in the accompanying drawing turns, then be described as other element or feature " under " or the orientation of the element of " below " for described other element or feature " directly over ".Therefore, the word of example " ... under " can contain two orientation, above and below.Can locate described device (rotate 90 degree or in other orientation) with other mode, the description of relative space position as used in this specification will be done corresponding explanation.

The purpose of used term is not intended to limit the present invention just in order to describe concrete example embodiment in this specification.Singulative " one " and " described " also are intended to comprise plural form as used in this manual, unless at context clearly statement is arranged in addition.Further should be understood that, wording used in specification " comprises ", appointment be the feature of being stated, integer (integer), step, operation, element and/or assembly to have occurred, occur or additional one or more further features, integer (integer), step, operation, element, assembly and/or their combination but do not get rid of.

Here the cutaway view of the schematic diagram of the Utopian example embodiment of reference (and intermediate structure) is described example embodiment.Equally, for example because manufacturing technology and/or tolerance, can reckon with the variation of illustrated shape.Therefore, example embodiment should not be considered to be and be confined to the given shape in illustrated zone herein, but for example should comprise owing to make the deviation in shape that is caused.For example, injection (implant) zone that is illustrated as rectangle is typically feature with circle or curved shape and/or at the gradient implantation concentration at its edge, rather than changes from the binary that injection zone changes to non-injection zone.Similarly, the buried region that forms by injection can cause in described buried zone and produce between the surface of described injection that some injections are arranged.Equally, therefore, the zone shown in the figure comes down to schematically, and their shape is not the true form that is used for the zone of graphic display unit, is not used in to limit the scope of the invention yet.

Unless otherwise defined, all terms as used herein (comprising technical term and scientific terminology) have the common same meaning of understanding with this technical field of the invention technical staff.Further should be understood that, should be interpreted as having and they consistent meanings in background of related, can't be interpreted as meaning Utopian or that extreme is formal, unless definition is arranged herein in addition such as those terms that in dictionary commonly used, define.

Hereinafter will describe example embodiment with reference to the accompanying drawings in detail.

The equipment I that is used for treatment substrate

Fig. 1 is the perspective view of diagram equipment that is used for treatment substrate of first example embodiment of design according to the present invention.Fig. 2 is the vertical view of the equipment that is used for treatment substrate shown in the pictorial image 1.

With reference to Fig. 1 and 2, the equipment that is used for treatment substrate 1000 (hereinafter being called treatment facility) of first example embodiment of design comprises main body 100, substrate conveying (substrate transfer) module 200 and processing module 300 according to the present invention, described main body 100 has the upper surface 110 that defined by perpendicular x and y axle and penetrates opening 112 at the main body middle body, a plurality of substrate S are installed on described substrate conveyor module 200, described processing module 300 on the upper surface 110 around penetrating opening 112 motion and laser being projected on the described substrate S.Described substrate S can be installed on the substrate conveyor module 200 with such configuration mode, promptly make by the surperficial vector of the target surface (object surface) of the described substrate S of described laser treatment parallel with x axle or y axle, thereby laser parallel is projected on the target surface of described substrate S in the surface of described substrate.

In the embodiment of example, main body 100 comprises smooth upper surface 110, and penetrating opening 112 can be at the middle body through-body 100 of main body 100.Therefore, the middle body of upper surface 110 also can be penetrated into the lower surface of main body 100.Penetrate size that opening 112 has and be enough to the framework of mobile conveyor module 200.Described substrate S can be installed on the delivery board, on the framework of conveyor module 200 a plurality of delivery boards can be installed.As hereinafter describing in detail, described framework can be by penetrating opening 112 through-bodies 100.In addition, be arranged in such a way guide rail on the upper surface 110 of main body 100, promptly make described guide rail surround and penetrate opening 112, the laser head supply unit that laser is projected on the described substrate S can move along described guide rail.Therefore, as will be described in further detail below, main body 100 can have sufficient shock resistance, endurance and the rigidity that absorbs described laser head unit motion.

For example, main body 100 can comprise smooth rock and the quartz with adequate thickness, provides for main body 100 and penetrates opening 112 from upper surface 110 to the surface, bottom.On the contrary, main body 100 can comprise the assembly of being made up of last square structure and below structure.Described square structure down comprises the slender member of enough rigidity of having of combination (stiffness) and hardness (rigidness), and part has large-sized opening in the central.The described square structure of going up can have cube member and the hole that penetrates described cube member.The described square structure of going up can be combined to described square structure down in the mode that described hole is connected to described opening, thereby forms main body 100.Described integrated main body can be arranged on the fixed position of large-scale treatment facility, and has improved reliability of technology.On the contrary, in small-scale treatment facility, the main body of described combination can be so that assembly and disassembly, and have improved the mobility of equipment.

In the embodiment of example, with reference to the cartesian coordinate system (Cartesian coordinate system) of figure 1, main body 100 has the width on the x direction, the thickness on length on the y direction and the z direction.Be used for the upper surface 110 that lasing laser generator can be positioned at main body 100.

Can above the main body 100 or below substrate cartridge (substrate cassette) (not shown) is provided.Before the processing that starts described substrate S, can be from described substrate cartridge be packed treatment facility 1000 into described substrate S, and after the processing of finishing described substrate S, it is unloaded to the described substrate cartridge from treatment facility 1000.In this case, described substrate S can load on perpendicular to the z direction of the upper surface 110 of described main body or unloading under.But, as is known to the person skilled in the art, can change loading or the uninstall direction of described substrate S according to treatment conditions and demand.

In example embodiment, substrate conveyor module 200 can comprise the first drive unit (not shown) that extends through the central shaft 210, the framework 220 that is connected to central shaft 210 that penetrate opening 112, is installed in the delivery board 230 on the framework 220 that substrate S is housed and moves or rotate described central shaft linearly.Central shaft 210 can move and rotate with respect to the z axle by described first drive unit is linear on the z direction.As is known to the person skilled in the art, though what example embodiment of the present invention disclosed is that described central shaft 210 vertically penetrates upper surface 110 on the z direction of principal axis, but as long as central shaft 210 can penetrate upper surface 110, central shaft 210 also can favour the upper surface 110 of main body 100.

Central shaft 210 can extend through and penetrate opening 112 and be connected with framework 220.Can central shaft 210 be made cylinder or polyhedron according to the shape of framework 220 and the technological requirement and the operating condition of treatment facility 1000.Framework 220 can comprise the structure that a plurality of slender members are combined mutually and be fixed on the central shaft 210.Delivery board 230 is installed on the framework 220.In illustrated embodiments of the invention, the size of framework 220 is less than the size that penetrates opening 112, thereby described framework can be by opening 112 through-bodies 100 under the situation that is not subjected to blocking-up (interrupt).

For example, framework 220 can comprise rectangle angle (rectangular angle) assembly that moves by opening 112 one in main body 100, and four delivery boards 230 can be installed in each side surface of rectangular frame 220.The described substrate S that handles in described treatment facility can be installed on each delivery board 230.Therefore, the shape and size of framework 220 can change according to the shape and size of substrate S.In embodiments of the present invention, described substrate S can have about 40 inches to 70 inches length, thereby framework 220 has about at least 70 inches side.

Since framework 220 can be on the z direction linear movement and rotate with respect to the z axle, delivery board 230 also can move linearly and rotates according to framework 220.Especially, delivery board 230 can be installed in each side surface of rectangular frame 220, thereby make the normal vector of the normal vector of the substrate S that is installed on the delivery board 230 perpendicular to the upper surface 110 of main body 100.That is to say that the normal vector of the upper surface 110 of main body 100 is parallel with the z axle, and the normal vector of described substrate S can be parallel to one in x axle and the y axle.

When opening 112 was passed in framework 220 motions, delivery board 230 can move integratedly with framework 220.By contrast, delivery board 230 can be with respect to individually (individually) motion of framework 220.Therefore, the substrate S on each delivery board 230 can be according to the action need of treatment facility 1000 motion or independently moving irrelevantly mutually in main body integratedly.

In illustrated embodiments of the invention, because framework 220 can form rectangle, first to fourth substrate S1 to S4 can be installed in respectively on four delivery boards 230, and each substrate can be installed on each side surface of rectangle frame 220.The normal vector of described first to fourth substrate S can be respectively towards x direction of principal axis, y direction of principal axis ,-the x direction of principal axis and-the y direction of principal axis, and parallel with upper surface 110.

Substrate S can be fixed firmly on the delivery board 230, to such an extent as to no matter the linear movement of delivery board 230 and rotation all can not be from separating base plate S on the delivery board 230.For example, delivery board 230 can comprise the additional fixed component (not shown) that is used for fixing described substrate S such as vavuum pump.The inside of delivery board 230 can be evacuated by vavuum pump, and described substrate S can be adsorbed on the delivery board 230 by vacuum pressure.

Can go up at the target surface (object surface) of substrate S by laser and form pattern, thereby, allow substrate S to have arbitrary shape and structure, as long as on substrate S, form pattern.For example, described substrate S can comprise semiconductor substrate such as the wafer that is used for making integrated circuit (IC) device, be used to the LGP (LGP) making the glass substrate of flat-panel monitor and be used for the backlight assembly of flat-panel monitor.In illustrated embodiments of the invention, be formed for the round dot pattern of diffused light on the LGP of the backlight assembly in described LCD device.But, as is known to the person skilled in the art, also can be at the various patterns that form on the LGP except that described round dot pattern in same treatment facility 1000.

Described first drive unit can be transported to driving force on the central shaft 210 of substrate conveyor module 200.That is to say that central shaft 210 can perhaps rotate with respect to the z axle by the motion linearly on the z direction of described first drive unit.For example, described first drive unit can comprise that one surrounds central shaft 210 and shell (not shown), the power supply such as servomotor of the bearing group (bearing set) of supporting central shaft 210 and the linear scale (linear scale) that is used for carrying out in the axial direction linear movement.

Be installed to substrate S on the delivery board 230 and can make the pattern of reservation shape via processing module 300.

Fig. 3 is the perspective view of the processing module of diagram treatment facility shown in Figure 1.

With reference to figure 1 and Fig. 3, thereby processing module 300 comprises that at least one is used for lasing laser generator 310, at least one is used for laser is projected on the described substrate at the laser head 320 that forms pattern on the target surface of described substrate S, the laser head supply unit 340 that is arranged on the upper surface 110 of described main body and surrounds the guide rail 330 of through hole 112 and removably be fixed with described laser head and move along guide rail 330.Especially, laser head 320 is removably mounted in the first of laser head supply unit 340, guide rail 330 is connected with the second portion relative with the described first of laser head supply unit 340, thus along with laser head supply unit 340 along guide rail 330 move and laser head 320 can with the surface of upper surface 110 coplanes of main body 100 on penetrate opening 112 motions around (circulate around).

Laser generator 310 can be positioned on the upper surface 110 of main body 100, and produces the laser that is used for treatment substrate S.For example, can periodically produce pulse laser in laser generator 310, this laser is without any interruptedly supplying with laser head 320.By contrast, can produce continuous laser in laser generator 310, this laser can be supplied with laser head 320 in periodic interruptions ground.Described laser can melt or dissolve the target surface of substrate S, thereby can form the predetermined pattern such as the round dot pattern on substrate S.Therefore, described laser has the frequency that is enough to melt or dissolve described substrate S, and the frequency of described laser can change according to the material properties of substrate S.For example, described laser can comprise such as carbon dioxide (CO ₂) the gaseous state laser of laser, PRK, argon (Ar) laser and krypton (Kr) laser and so on, and such as yttrium-aluminium-garnet (YAG) laser, vanadic acid yttrium (YVO ₄) laser, lithium yttrium fluoride (YLF) laser, yttrium aluminate (YAlO ₃) laser, glass laser, ruby laser, Alexandrite (alexsandrite) laser, titanium-doped sapphire (Ti:Sapphire) laser and yittrium oxide (Y ₂O ₃) solid-state laser of laser and so on.Described solid-state laser can be by YAG, the YVO of the impurity that is mixed with selected any material among Cr, Nd, Er, Ho, Ce, Co, Ti, Yb, the Tm and combination (combination) thereof ₄, YLF and YAlO ₃Crystal produce.In illustrated embodiments of the invention, laser generator 310 can produce the CO of about 1 μ m frequency ₂Laser pulse.

In illustrated embodiments of the invention, laser generator 310 can be located on the upper surface 110 with this configuration mode, and the promptly feasible laser that sends from described laser generator can pass through the target surface of described substrate S abreast.For example, laser generator 310 can be positioned at around the bight that the described first substrate S1 and tetrabasal S4 intersect, and the laser that sends from laser generator 310 can pass through the described first substrate S abreast.Therefore, the laser that sends from laser generator 310 can be parallel to the described first substrate S1 and offers laser head 320.

In the example embodiment of revising, a plurality of laser generators 310 are positioned on the upper surface 110 of main body 100, thereby increase the treatment effeciency of treatment facility 1000.For example, first laser generator can be positioned at around the bight that the described first substrate S1 and tetrabasal S4 intersect, second laser generator can be positioned at another bight that the described second substrate S2 and the 3rd substrate S3 intersect around.Therefore, in example embodiment of the present invention, described first and second laser generators can position for 220 one-tenth diagonally with respect to rectangular frame.In this case, the described first substrate S1 of first laser parallel ground process from described first laser generator sends can pass through described the 3rd substrate S3 abreast with described first laser second laser that sends from described second laser generator simultaneously.Corresponding to laser generator 310, can on described guide rail, provide a plurality of laser heads 320.The number of laser generator 310 and laser head 320 and shape can change according to the structure of framework 220 and the treatment effeciency of shape and treatment facility 1000.

Laser head 320 can move along guide rail 330, thereby laser is projected on the substrate S movably.Specifically, when described substrate S moves on each comfortable z direction independently of one another, can arrange a plurality of laser heads 320, thereby can make each substrate S uncorrelated mutually each other and obtain independently handling corresponding to each substrate S.

In example embodiment, laser head 320 can comprise laser head shell (not shown), be fixed on described laser head shell first end the speculum (not shown) and be fixed on the second end of described laser head shell and towards the condenser lens (not shown) of described substrate S.Described speculum and laser generator 310 can be positioned on the surface of a coplane, and described laser can arrive described speculum as the crow flies from laser generator 310.Then, described laser can be from described mirror reflects to described condenser lens, and described condenser lens can focus on laser on the target surface (object surface) of described substrate S.In the embodiment of example of the present invention, because the described substrate S of the described laser parallel process of meeting, described laser can be reflected in described laser head shell with meeting at right angles, and is focused on the described substrate S.

Especially, institute's laser light reflected can focus on by the condenser lens in described laser head shell, thereby forms the laser beam that is directed to described substrate S.Also can provide focus controlling device (not shown) in a side of described condenser lens.This focus controlling device can be controlled the spacing between described substrate S and the described condenser lens, thereby optimally strengthens being guided the laser beam to described substrate S.

Laser head 320 can move along the curved path that surrounds the guide rail 330 that penetrates opening 112, and the substrate S of laser projection can be arranged in this configuration mode and penetrate opening 112, makes that promptly the normal vector of substrate S is different.Therefore, no matter when when the normal vector of described substrate S changes, need to change the optical path of described laser.For this reason, on the upper surface 110 of main body 100, can arrange the path changing device 350 of the optical path that is used to change described laser.In illustrated embodiments of the invention, path changing device 350 can with described laser generator 310 coplanes, thereby make the laser send from laser generator 310 can shine path changing device 350 as the crow flies.

For example, finish when laser head 320 and laser to be projected after the described first substrate S1 goes up, laser head 320 is turned left so that laser is projected in the described second substrate S2 along guide rail 330, the optical path of described laser need be changed to the direction parallel with the x axle from the direction parallel with the y axle.Thereby the laser that is incident upon on-x direction on the target surface of described substrate S1 need project on the target surface of described substrate S2 on-y direction.

In this case, can change the optical path of described laser by the first path changing device 350a, the described first path changing device 350a can be located on the first area of the upper surface 110 around first bight of guide rail 330.Guide rail 330 can extend as the crow flies in the y direction, and forwards to-the x direction in described first bight.Correspondingly, the laser that is sent from laser generator 310 can be parallel to the described first substrate S1 along the y direction advances, and finally arrives the first path changing device 350a.Then, described laser is reflected to be parallel to the described second substrate S2 and to advance along-x direction.

In the same way, the second path changing device 350b and Third Road directly change the second and the 3rd zone that device 350c lays respectively at the upper surface 110 of main body 100.The second path changing device 350b can be located at the second area of second bight upper surface 110 on every side of guide rail 330, the guide rail 330 that extends along-x direction in this zone can forward to-the y direction, Third Road directly changes the 3rd zone that device 350c can be located at the upper surface 110 around the third angle portion of guide rail 330, can turn to the x direction in this zone along-guide rail 330 that the y direction is extended.Correspondingly, laser head 320 can change around penetrating opening 112 along guide rail 330, and the optical path of the laser that sends from laser generator 310 can change according to the direction of motion of laser head 320 by comprising the first path changing device 350a directly changes device 350c to Third Road path changing device 350.

To be the first path changing device 350a directly change first to the 3rd zone that device 350c is positioned at upper surface 110 as path changing device 350 to Third Road though illustrated embodiments of the invention disclose, also can carry out other modification known to those skilled in the art to path changing device 350.For example, the number of described path changing device and position can change according to the shape of framework 220, the number of substrate that is installed in framework 220 and the position and the number of laser generator 310.Especially, when in treatment facility 1000, preparing a plurality of laser generator, the various combinations that can prepare laser head 330 and path changing device 350 according to the treatment effeciency of treatment facility 1000.

For example, on the 4th zone of the upper surface 110 around described first laser generator is positioned at the 4th bight of described guide rail, the guide rail 330 that extends along-y direction in this zone can forward the x direction to, described second laser generator is positioned at the second area of upper surface 110, thereby described first laser is advanced in the x direction, second laser is in-x direction advances, can a pair of laser head 350 be installed on the guide rail 330 with this configuration mode, laser head is parallel to that the described first substrate S1 moves and second laser head is parallel to described the 3rd substrate S3 along described guide rail and moves along described guide rail even win, thereby described first laser can be offered described first laser head and described second laser is offered described second laser head.In addition, when described first laser head from the y direction forward to-when x direction and described second laser head forwarded the x direction to, the optical path of described first and second laser was also changed by a pair of path changing device on the first and the 3rd zone that is positioned at upper surface 110 350 respectively.The layout of described path changing device and number can be determined by the structure and the treatment conditions of treatment facility 1000.

Especially, when arranging a plurality of laser head 320 corresponding to each substrate S, each laser head 320 can move back and forth in the width of each substrate S along guide rail 330, thereby described substrate S can individually form pattern by the laser from each laser head 320 projection.As known to persons of ordinary skill in the art, the number of laser head 320 and path changing device 350 can be by being used to that the maximized laser head 320 of treatment effeciency of treatment facility 1000 and the optimum organization of path changing device 350 are determined.

In example embodiment, guide rail 330 can be set on the upper surface 110 of main body 100 and surround and penetrate opening 112, and laser head 320 can move along guide rail 330.Guide rail 330 can comprise on the upper surface 110 that is fixed on main body 100 and have the rail body 334 of flat track top surface 332.On track top surface 332, can have the groove 332a that extends along the main body 334 of guide rail 330.Rail body 334 can comprise the internal space S that is connected to groove 332a, thereby groove 332a can be used as the inlet of described internal space S.In example embodiment of the present invention, the laser head supply unit 340 that maintains laser head 320 passes through groove 332a in described internal space S, thereby couples (coupled to) movably to laser head supply unit 340.Correspondingly, along with laser head supply unit 340 moves and laser head 320 can move along guide rail 330 along guide rail 330.

In an example embodiment, the drive member (not shown) that laser head supply unit 340 comprises the conveying body (not shown) that is couple in guide rail 330 internal space S, contacts with the upper surface 110 of main body 100 and moves thereon and be fixed on the described conveying body and removably be fixed with the gripper shoe 346 of laser head 320.

For example, described conveying body and drive member can be maintained in the internal space S of guide rail 330, and described drive member can be with respect to upper surface 110 motions of main body 100.The top of described conveying body can be outstanding from the groove 332a of guide rail 330, and be connected to gripper shoe 346.In illustrated embodiments of the invention, gripper shoe 346 is detachably connected to carries body 342, and laser head 320 is fixed on the gripper shoe 346 of laser head supply unit 340.Thereby, can be easily from laser head supply unit 340 separately with laser head 320.Therefore, laser head 320 helps to change laser head 320 according to the treatment conditions and the maintenance of treatment facility 1000 from the simple separation of laser head supply unit 340.

Laser head supply unit 340 can move along guide rail 330 by second drive unit 360.

For example, second drive unit 360 can comprise the driver element 362 that is couple to laser head supply unit 340 and driving laser head supply unit 340 and moves along guide rail 330, contact and change the power supply 364 that the direction of the driving direction that driver element 362 moves changes the device (not shown) and is used for providing driving force to driver element 362 with driver element 362.Driver element 362 can be parallel on the upper surface 110 that guide rail 330 is arranged in main body 100 and by power supply 364 to be operated.

Driver element 362 can be coupled on the gripper shoe 346 of laser head supply unit 340, thereby the driving force of power supply 364 is transported to laser head supply unit 340 by driver element 362.That is to say that the driving force of power supply 364 can be applied on the driver element 362, the gripper shoe 346 that driver element 362 can driving laser head supply unit 340 is moved along guide rail 330.For example, driver element 362 can comprise the various power transfer members such as chain, driving-belt and driving tooth bar of intervention between drive unit and slave unit.Especially, when driver element 362 comprised such as chain and drives dentation the tooth bar and couple structure, driven tooth can be set on the surface of gripper shoe 346 and the driving gear that is coupled on the described driven tooth can be arranged on the driver element 362.Thereby gripper shoe 346 can be according to the motion campaign of driver element 362, thereby can make 340 motions of laser head supply unit according to the motion of gripper shoe 346.

In illustrated embodiments of the invention, driver element 362 is parallel to guide rail 330 setting, thereby penetrates opening 112 around main body 100.Especially, because guide rail 330 can change its direction in its each bight, therefore, driver element 362 needs to change its direction around the bight of guide rail 330.For this reason, the direction that is used to change the direction of motion of driver element 362 changes first to fourth location that device can be located in the upper surface 110 of the main body 100 around each bight of guide rail 330.Thereby driver element 362 can change its direction when guide rail changes direction, thereby guide rail 330 and driver element 362 can be provided with in parallel with each other, and no matter the change of the direction of motion of the bearing of trend of guide rail 330 and driver element 362.

In example embodiment, first drive unit and second drive unit 360 can be electrically connected to controller 400.Thereby, when thereby laser head 320 can be by laser intactly when first substrate S1 to the tetrabasal S4 forms pattern around penetrating opening 112 commentaries on classics, controller 400 can be controlled and stop that laser projects on the described substrate S, and controls the framework 220 that described substrate S is installed and move the distance of carrying spacing (transfer pitch) along the z axle.

Further, treatment facility 1000 can comprise the laser shielding part 500 that is used for locating laser absorber (not shown) on described optical path.For example, described laser absorption device can be located at first optical path between laser generator 310 and the laser head 320, at second optical path between laser head 320 and the path changing device 350 and on one of them optical path of the 3rd optical path between the adjacent path changing device 350.In illustrated embodiments of the invention, laser shielding part 500 comprise the position that is used for a detection laser supply unit 340 the detector (not shown), be used to the interface that drives the absorber drive unit (not shown) of described laser absorption device and be used for carrying out telecommunication with controller 400.

Controller 400 can systematically be controlled substrate conveyor module 200, processing module 300 and laser shielding part 500, thereby forms pattern on the target surface of substrate S.Laser head supply unit 340 moves around penetrating opening 112 along guide rail 330, thereby rotates around the described framework that described substrate S is installed.When laser head supply unit 340 moves along guide rail 330, described laser is projected onto on the target surface of described substrate S.Thereby,, on described each substrate S, form described pattern in case laser head supply unit 340 is finished the motion around framework 220.Afterwards, stop that laser projects on the described substrate S, and make framework 220 move the distance of carrying spacing along the z direction.In addition, as described above, delivery board 230 also can move with respect to framework 220, and framework 220 keeps static.Then, carry out once more laser head supply unit 340 around the rotation of framework 220 and projecting laser to described substrate S.Motion and the around the movement of laser head supply unit 340 of framework 220 (perhaps delivery board 230) on the z direction systematically controlled by controller 400 to the projection of described substrate S with laser, all forms pattern by laser up to all target surfaces of each substrate S.At last, on each substrate S, can be along single pattern and a plurality of single pattern of width formation such as dotted line of substrate S mutually to carry intervals open.

Though do not show in the drawings, treatment facility 1000 may further include and is used for described substrate S is installed to the loader and being used on the delivery board 230 unloads described substrate S from delivery board 230 emptier.For example, a group substrate is stacked in the substrate cartridge, and is conveyed in the main body by described substrate cartridge.Described substrate cartridge can be used as the loader and the emptier of treatment facility 1000.In this case, can between described substrate cartridge and described framework or delivery board, provide the extraction member that being used to such as mechanical arm loaded or unloaded carried base board S.

The equipment I I that is used for treatment substrate

Fig. 4 is the perspective view of diagram equipment that is used for treatment substrate of second example embodiment of design according to the present invention.Have the structure substantially the same at the treatment facility shown in Fig. 4 1100, except the system of the structure of described laser generator, path changing device be used to drive the driving mechanism of described laser head supply unit with treatment facility 1000 among Fig. 1.In Fig. 4, represent components identical with reference number identical among Fig. 1 and Fig. 2, so the detailed description of similar elements will be omitted.That is to say, the laser head 320 of second treatment facility 1100, guide rail 330 and laser head supply unit 340 can have identical structure with those elements of first treatment facility 1000, can be based on described laser generator, path changing device and the drive unit that is used to drive described laser head supply unit describe treatment facility 1100 in detail.

With reference to figure 4, processing module 300 can comprise on the upper surface 110 that is positioned at main body 100 and thereon first support 370 of 310 of laser generators, below first support 370 and be used to change described laser optical path 352 of path changing devices thereon second support 380 and the 3rd drive unit 390 that is used to drive the laser head supply unit 340 that is connected to second support 380.The laser that sends from laser generator 310 can arrive described path changing system, and described path changing system is used to reflect the laser light to a position of laser generator 310 belows.Institute's laser light reflected may be directed on the laser head 320 that is installed on the laser head supply unit 340 and moves along guide rail 330.

In an example embodiment, first support 370 can comprise first post 372 that the upper surface 110 from main body 100 extends up on the z direction and from the end parts parallel of first post 372 in upper surface 110 horizontally extending first flat boards 374 of main body 100, on this flat board 374, can locate the first path changing device 352a and laser generator 310.Can be from the laser that laser generator 310 sends by first path changing device 352a reflection down on the z direction.

First post 372 is from periphery vertical first height H 1 of extending on the z direction of upper surface 110, can first flat board 374 be fixed on the end of first post 372 with this configuration mode, can be even win flat board 374 towards the middle body horizontal-extending of main body 100.Therefore, first flat board 374 can with upper surface 110 perpendicular separations first height H 1 of main body 100, laser generator 310 can be than upper surface 110 high first height H 1.Especially, described first height H 1 can be set to projecting height h height, thereby first flat board 374 can be across on the framework 220 or on the delivery board 230 than framework 220 or delivery board 230.In addition, described first height H 1 also can be bigger than the length of described substrate S, thereby, can vertically move the distance of carrying spacing along the z direction, on whole base plate S, assign to the lower part and form described pattern from top.

Though what example embodiment of the present invention disclosed is, first flat board 374 extends to the middle body of the upper surface 112 of main body 100 from the periphery of upper surface 112, the first path changing device 352a be set at the middle body that is positioned at main body 100 on first flat board 374 directly over, as is known to the person skilled in the art, can modification being set or changing the configuration of first flat board 374 and the setting of the first path changing device 352a according to the second path changing device 352b that arrives from the first path changing device 352a laser light reflected.

For example, second support 380 can be included in second post 382 of the middle body that extends through main body 100 on the z direction, and be positioned on this second flat board 384 from the end parts parallel of second post 382 in upper surface 110 horizontally extending second flat board, 384, the second path changing device 352b of main body 100 first via directly change device 352a under.The laser that sends from laser generator 310 arrives the second path changing device 352b by first path changing device 352a reflection down on the z direction.In illustrated embodiments of the invention, second post 382 can form with the central shaft in main body 210, perhaps can comprise the additional shaft that is connected to central shaft 210.

Second post 382 can have second height H 2 of the upper surface 110 of the described main body of distance on the z direction, second flat board 384 can be fixed to the end of second post 382 movably with this configuration mode, make that promptly second flat board 384 can be towards the periphery horizontal-extending of described main body 100, and can rotate with respect to second post 382.In illustrated embodiments of the invention, second flat board 384 can rotate in the plane of the upper surface 110 that is parallel to main body 100 and the second path changing device 352b can be positioned on second flat board 384 corresponding to second post 382 under the first path changing device 352a with respect to second post 382.Therefore, the rotation of second flat board 384 can not change the optical path between the first path changing device 352a and the second path changing device 352b.

Second height H 2 can be bigger than the projecting height h of framework 220 or delivery board 230, first height H 1 than first post 372 is little, thereby the second path changing device 352b can be located on second flat board 384 of first dull and stereotyped 374 belows, and above framework 220 or delivery board 230.That is to say that first dull and stereotyped 374 and second flat board 384 can intermesh, and makes second flat board 384 be positioned at below first flat board 374 above framework 220 and delivery board 230.

In addition, described second height H 2 can be bigger than the length of described substrate S, thereby, can move both vertically along the z direction and carry the distance of spacing, on whole base plate S, assign to the lower part and form described pattern from top.

The 3rd drive unit 390 that is used for driving laser head supply unit 340 can be included in and vertically extend on the z direction and be connected to the 3rd post 392 of laser head 320, be connected to the flexible connector 394 of second dull and stereotyped the 384 and the 3rd post 392 and the power supply (not shown) that is used for providing driving force to second post 382 flexibly.Second post 382 can be rotated by driving force, and along with the rotation of second post 382, laser head supply unit 340 can correspondingly move along guide rail 330.In this case, the spacing between second dull and stereotyped the 384 and the 3rd post 392 can be changed flexibly by flexible connector 394.

In example embodiment, the 3rd post 392 can be fixed on the side of laser head supply unit 340, and the 3rd big height of can be on the z direction vertical ratio of elongation second height H 2.Especially, the 3rd post 392 can be made into the column type of hollow, Third Road directly changes the office, top that device 352c can be positioned at the 3rd post 392 with this configuration mode, promptly makes the second path changing device 352b and Third Road directly change device 352c and is positioned on the same plane and toward each other.Therefore, can arrive Third Road from the second path changing device 352b laser light reflected and directly change device 352c.Then, laser directly changes device 352c from the Third Road on the 3rd post 392 and reflects down, thereby arrives the speculum of laser head 320.Afterwards, described laser can be focused on the target surface of described substrate S by the condenser lens of laser head 320.

The 3rd post 392 and second flat board 384 can be connected to each other by flexible connector 394, thereby the 3rd post 394 can be according to the rotation campaign of second flat board 384.Driving force can be applied on second post 382 from power supply, thereby rotates second post 382.Second flat board 384 also can rotate with second post 382, and the 3rd post 392 that is connected to second flat board 384 by flexible connector 394 also can rotate by the rotation of second flat board 384.

Laser head supply unit 340 can move around penetrating opening 112 along guide rail 330, carries out linear movement thereby can be parallel to described substrate S, and in the place, bight of guide rail 330 riding, at place, described bight, the normal vector of described substrate S can change.Being applied to the rotating drive power of second post 382 and the flexibility of flexible connector 394 can allow laser head supply unit 340 to hocket along curvilinear motion and the linear movement that guide rail 330 carries out.

When laser head supply unit 340 during along guide rail 330 linear movements, the curvature of guide rail 330 does not change, thereby, flexible connector 394 can be controlled at the spacing between second dull and stereotyped the 384 and the 3rd post 392 continuously, is used for the rotation of second flat board 384 is converted into along the linear movement of guide rail 330.

For example, can prepare slot (slot) (not shown) along the length direction of second flat board 384, the connecting rod (not shown) that is fixed to the 3rd post 392 can insert in the slot of second flat board 384 as flexible connector 394.Along with second flat board 384 is rotated, described connecting rod can slide along the slot of second flat board 384, thereby according to the rotation of second flat board 384, the spacing between second dull and stereotyped the 384 and the 3rd post 392 can increase continuously or reduce.Therefore, the 3rd post 392 can be parallel to substrate S according to the rotation of second flat board 384 and carries out linear movement.Though what illustrated embodiments of the invention disclosed is that described connecting rod slides along described slot as flexible connector, also can use other member known to those skilled in the art as flexible connector, replace described connecting rod or combination with it, as long as the 3rd post 392 can be moved linearly along guide rail 330 by the flexibility variation of the spacing between second dull and stereotyped the 384 and the 3rd post 392.For example, can be with pneumatic cylinder or hydraulic cylinder as flexible connector.

On the contrary, when laser head supply unit 340 can carry out curvilinear motion at the place, bight of guide rail 330, the 3rd post 392 can rotate according to the curvature of guide rail 330.In this case, the spacing between second dull and stereotyped the 384 and the 3rd post 392 can be by being used to compensate second flat board 384 the radius of gyration and the flexible connector of the difference between the radius of curvature in the bight of guide rail 330 change.

When laser head supply unit 340 during in place, the bight of guide rail 330 riding, described laser absorption device can be located on the described optical path near a period of time laser shielding part 500, thereby can prevent laser arrival laser head 320.For example, described laser absorption device can be located at first optical path between the laser generator 310 and the first path changing device 352a, at second optical path between the first path changing device 352a and the second path changing device 352b and on the second path changing device 352b and Third Road directly change one of them optical path of the 3rd optical path between the device 352c.

Though what example embodiment of the present invention disclosed is the middle body that first flat board 374 can extend to main body 100 from the periphery of main body 100, second flat board 384 can extend to the periphery of main body 100 from the middle body of main body 100, can be according to how driving force being applied to any other modification that use is carried out first dull and stereotyped 374 and second flat board 384 on second post 382.For example, be positioned at second post 382 under the situation of second periphery of main body 100, first flat board 374 need be extended to second periphery in main body 100 to first periphery.But, in this case, the flexible connector that the 3rd post 392 need be longer around the rotation that penetrates opening 112 by the rotation of second flat board 384, second longer flat board and/or the longer move distance of described flexible connector.

Though the laser in first embodiment of Fig. 1 and the treatment facility 1000 shown in Fig. 2 is along the horizontal optical propagated parallel with the upper surface 110 of main body 100, the laser of second embodiment of the treatment facility 1100 in Fig. 4 on the z direction the vertical optical path and be parallel to the horizontal optical propagated of the upper surface 110 of main body 100.

According to the example embodiment of described treatment facility, a plurality of substrates can be surrounded by guide rail, and described laser can project from the laser head along described guide rail movement on the described substrate, thereby can pinpoint accuracy, handle a plurality of substrate S expeditiously.

Especially, the treatment effeciency of described treatment facility can be easily controlled by the variation of the speed of described laser head.When in treatment facility of the present invention, handle be large-scale substrate the time, the linear movement meeting of described laser head surpasses (prevail) its curvilinear motion, thereby significantly increased the treatment effeciency of described treatment facility, this is highly beneficial under the situation that current LCD/LED panel size is tending towards becoming big.

The equipment I II that is used for treatment substrate

Fig. 5 A is the perspective view of diagram equipment that is used for treatment substrate of the 3rd example embodiment of design according to the present invention, and Fig. 5 B is the vertical view of the treatment facility shown in the pictorial image 5A.The treatment facility 1200 of the 3rd example embodiment of design can have identical structure with first embodiment of treatment facility 1000 according to the present invention, except described laser head, described path changing device with spectroscopical be provided with different.In Fig. 5 A and Fig. 5 B, identical reference number mark be components identical among Fig. 1 and Fig. 2, so the detailed description of similar elements will be omitted.That is to say, the laser head 320 of treatment facility 1200, guide rail 330, laser head supply unit 340 and the drive unit 360 that is used for driving laser head supply unit 340 can have identical structure with those elements of treatment facility 1000, thereby, will describe the 3rd treatment facility 1200 in detail based on described laser generator and described path changing device.

With reference to figure 5A and Fig. 5 B, processing module 300 can comprise the periphery of the upper surface 110 that is positioned at main body 100 and be positioned with first support 370 and second support 380 that is positioned with spectroscope 359 of laser generator 310.Can be separately from the laser that laser generator 310 sends by spectroscope 359, the laser that every bundle separates can arrive each path changing device 352,354,356 and 358 at each place, bight that is positioned at guide rail 330.

In example embodiment of the present invention, first substrate S1 to the tetrabasal S4 that is installed on the delivery board 220 can individually be handled respectively by the first laser head 320a to the, four laser head 320d, and first to fourth path changing device 352,354,356 and 358 can be positioned on the upper surface 110.The laser that every bundle separates can be distinguished and arrives described path changing device respectively, and can individually be reflexed to each laser head from each path changing device.The number of described laser head and path changing device and position can change according to the treatment conditions and the environment of treatment facility 1200.

In an example embodiment, first support 370 can comprise first post 372 that the upper surface 110 from main body 100 extends up on the z direction and from the end parts parallel of first post 372 in upper surface 110 horizontal-extendings and 310 first flat boards 374 thereon of laser generator of main body 100.First post 372 and first flat board 374 can have identical structure with those elements among second embodiment of the treatment facility 1100 shown in Fig. 4, thereby, will omit describing in further detail of first post 372 and first flat board 374.

The length of first flat board 374 can change according to the treatment conditions and the environment of treatment facility 1200.For example, first flat board 374 can be positioned at the periphery top of upper surface 110, perhaps can extend to the middle body that penetrates opening 112 as shown in Figure 4, thereby be formed in the main body with second flat board 384.In addition, as is known to the person skilled in the art, described substrate S and framework 220 can be located in any other position, as long as described laser can be assigned to each path changing device by optical splitter 359.

In an example embodiment, second support 380 can be included in second post 382 of the middle body that extends through main body 100 on the z direction and from the end parts parallel of second post 382 in upper surface 110 horizontally extending second flat boards 384, optical splitter 359 is positioned on described second flat board.

Second post 382 can extend predetermined height up with this configuration mode on the z direction, even win and second dull and stereotyped 374 and 384 top surface coplane mutually.But, by at least one is used for changing the laser optics path on the z direction vertical-path change device is set, the top surface of first flat board 374 can be different with the top surface of second flat board 384, thereby, because described vertical-path changes device, can first dull and stereotyped 374 and second flat board 384 be made up mutually with various different modes.In illustrated embodiments of the invention, the height that first dull and stereotyped 374 and second flat board 384 can be same apart from upper surface 110, thus laser generator 310 can have identical height with spectroscope 359.Each path changing device can have identical height with second flat board 384.

For example, the laser that sends from laser generator 310 can be divided into four bundle laser by spectroscope 359, and the laser that every bundle separates can arrive described path changing device respectively.

First to fourth path changing device 352,354,356 and 358 can be positioned at each corner portions located place of guide rail 330, moves thereby can be parallel to described first to fourth substrate S respectively along described guide rail.For example, described path changing device can comprise laser pick-off unit, laser emission element and linkage unit, the laser that separates from every bundle of optical splitter 359 arrives described laser pick-off unit, the laser that separates that comes from described laser emission element can be transmitted into each laser head, and described linkage unit is got involved between described laser pick-off unit and laser emission element and connected described laser pick-off unit and described laser emission element.

Described linkage unit can comprise the cylinder (cylinder) of hollow, described laser emission element can with the speculum coplane of described laser head.Thereby described linkage unit can provide the vertical-path of the described laser that separates between spectroscope 359 and laser head 320.

Therefore, though may provide single laser generator in described treatment facility, the various combinations of laser head and path changing device allow described substrate S individually to be handled.

Use treatment facility I to form method of patterning

Detailed description is used on substrate, form the Patternized technique of various patterns hereinafter at the treatment facility shown in Fig. 1 and Fig. 2.In illustrated embodiments of the invention, can exemplarily on the LGP of backlight assembly, be formed for the round dot pattern of scattered light.But, as is known to the person skilled in the art, in the example embodiment of treatment facility of the present invention, also can on substrate, be formed for any other pattern and the round dot pattern of backlight assembly.

Fig. 6 is presented at the flow chart that forms the treatment step of method of patterning in the treatment facility shown in Fig. 1 and Fig. 2.Fig. 7 is the flow chart that is used for described substrate is installed to the treatment step on the delivery board in the pictorial image 6.

With reference to figure 1,2,6 and 7, on the delivery board 230 of the core that penetrates opening 112 of through-body 100, at least one substrate S (step S100) can be installed.The main body 100 of treatment facility 1000 has the upper surface 110 that is defined by perpendicular x axle and y axle, and the described opening 112 that penetrates can be provided with part in the central.Delivery board 230 can be installed in and penetrate in the opening 112, and can move linearly in the z direction, and can rotate with respect to the central shaft 210 of opening 112.

For example, delivery board 230 can be installed on each side surface of rectangular frame 220, and framework 220 can be installed on the central shaft 210.That is to say, four delivery boards 230 can be installed on rectangle frame 220.At first, Kong delivery board 230 is aimed at (step S110) with the substrate cartridge (not shown) that stacks a plurality of substrate S.

When being used for that the position that described substrate S carries out pretreated process chamber left treatment facility 1000, in described process chamber, finish after the described preliminary treatment, a plurality of substrate S are accommodated in the described card casket.Then, described card casket can be used for preparing patterned process to each substrate S to processing equipment 1000 by conveyance.In this case, a Yu Ding group substrate S can be fed to described treatment facility by described card casket.In contrast be, when the pretreated process chamber that is used to carry out described substrate S is positioned near treatment facility 1000, at described process chamber be used for described substrate S is carried out between the treatment facility 1000 of patterning cushion space to be set and keep through pretreated substrate S, thus described substrate S can by one by one individually conveyance to processing equipment 1000.

Then, can from described card casket, extract described substrate S, and it is contained on the delivery board 230 of treatment facility 1000.For example, between described card casket and framework 220, can get involved supply unit such as mechanical arm.Described substrate S can extract from described card casket successively one by one, installs to delivery board 230 by described supply unit then.Between described card casket and framework 220, can put into load-lock chambers (load lock chamber), described supply unit is positioned at described load-lock chambers, thus prevent with substrate from the conveyance of described card casket to delivery board 230 processes the quick change of processing environment.Substrate S also can manually be installed on the described framework in having the clean room of abundant cleannes.Described substrate S can be installed on the delivery board 230 via the mode of vapor absorption.

When described substrate S was installed on delivery board 230, framework 220 can rotate with respect to central shaft 210, the delivery board of adjacent sky also can align with described card casket (step S130).Then, can on the delivery board of adjacent sky, carry out above-mentioned installation process.Can the repeated rotation framework 220 and process that the delivery board of described sky is installed, be installed on the delivery board of being had time up to described substrate S.In contrast be that when delivery board 230 independently of each other during independently moving, described substrate S is installed to each delivery board 230 independently of each other separately, and without rotating frame 220.In this case, can on each delivery board 230, carry out described patterned process individually.

When described substrate S was installed on the delivery board 230, central shaft 210 can be fixed on the precalculated position of determining on the z axle, thereby prepared described patterned process in treatment facility 1000.Then, described laser is from projecting on the substrate S around the laser head 320 that framework 220 moves along the guide rail 330 that is parallel to upper surface 110, thereby forms first pattern (step S200) on substrate S.Fig. 8 is presented at the flow chart that is used for forming the treatment step of first pattern on substrate shown in Fig. 6.

With reference to figure 1,2,6 and 8, at first, in laser generator 310, produce laser and be used for being installed on the substrate S on the delivery board 230 and form first pattern (step S210).In illustrated embodiments of the invention, laser generator 310 produces the CO2 laser pulse of about 1 μ m frequency.

Then, described laser can be provided for the laser head 320 (step S220) that has towards the condenser lens of described substrate S.When producing pulse laser in laser generator 310, described laser can periodically be offered described laser head.

The laser head supply unit 340 that laser head 320 is installed can be fixed along being positioned on the upper surface 110 and surrounding the guide rail 330 that penetrates opening 112.Therefore, laser head 320 can be parallel to upper surface 110 along guide rail 330 and move, thereby can be around rectangular frame 220 or at the delivery board 230 of each side of framework 220 move (step S230).

Therefore, laser head 320 can move along guide rail 330 continuously, and laser can be projected on the substrate S by the condenser lens of laser head 320 of motion, thereby forms a plurality of processing sections (step S240) on substrate S.Owing to described laser periodically can be offered laser head 320, also can described laser be projected on the described substrate S with the identical cycle.

Laser head 320 can move with constant speed along guide rail 330, thereby corresponding to the projection cycle of described laser and the speed of laser head 320, processed part certain distance that can be spaced apart from each other.In addition, can be parallel to guide rail 330 along the width of described substrate and form described processing section in alignmently, thereby on described substrate S, form described first pattern.

Laser head 320 or the laser head supply unit 340 that is fixed with laser head 320 can drive by second drive unit 360.Fig. 9 and Figure 10 are the topology views of motion of the laser head supply unit of the treatment facility shown in the pictorial image 1.

With reference to figure 9 and Figure 10, laser head 320 can be fixed to laser head supply unit 340, and laser head supply unit 340 can be assembled into guide rail 330.Then, the driver element 362 of second drive unit 360 can be coupled on the guide rail in parallel 330.Power supply 364 by second drive unit 360 imposes on driver element 362 with driving force, thereby driver element 362 can be around through hole 112 motions.For example, the gripper shoe 346 of laser head supply unit 340 can be integrated on the driver element 362 of second drive unit 360 by the mode of tooth coupling, thereby laser head supply unit 340 can move according to the driving of driver element 362.

Substrate S1 to S2 can be installed on each delivery board 230 with this configuration mode, make that promptly the normal vector of described substrate S is different, thereby driver element 362 is alternately carried out linear movement and curvilinear motion.That is to say, when laser head 320 when guide rail 330 is parallel to described substrate S and moves, can on laser head 320, carry out linear movement by driver element 362, thereby make the part after handling on substrate S, to be evenly spaced apart each other with constant speed.

When forming pattern on described laser has the first substrate S1 of first normal vector that points to the x axle fully, laser head 320 need be parallel to the second substrate S2 motion with second normal vector that points to the y axle.That is to say that the direction of motion that needs to change laser head 320 is handled the described second substrate S2.Therefore, guide rail 330 is diverted the left side on-x direction, thereby laser head supply unit 340 can be carried out curvilinear motion in the bight of guide rail 330.So although the direction of motion of laser head 320 changes, laser head 320 still can be towards the second substrate S2.That is to say that irrelevant with the variation of the normal vector of substrate S, described laser head still can be towards substrate S.

In illustrated embodiments of the invention, the direction that contacts with driver element 362 changes the place, bight that device is positioned at guide rail 330, thereby the direction of motion of driver element 362 can change according to the change of the bearing of trend of guide rail 330.In this case, described driving force can be applied to the central shaft that described direction changes device from power supply 364, and because described direction change device contacts with driver element 362 formation, driver element 362 can be changed device by described direction and drive.

In addition, the condenser lens of laser head 320 can be towards described substrate S, thereby, also can change the optical path of the laser that on the laser generator 310 on the upper surface 110 that is positioned at main body 100, produces.

A plurality of path changing devices 350 are positioned on the upper surface 110d zone around the bight of guide rail 330, thereby, can control and make the optical path of the laser that sends from laser generator 310 be parallel to described substrate S.Therefore, described laser can be projected on the described substrate S, and no matter the bearing of trend of guide rail 330.

For example, the laser that sends from laser generator 310 can be parallel to the described first substrate S1 to be propagated, and at first arrives laser head 320, and the condenser lens by laser head 320 projects on the first substrate S1 with first normal vector that points to the x axle then.Afterwards, laser head 320 is transferred to-the x direction, is parallel to the second substrate S2 with second normal vector that points to the y axle and moves along guide rail 330.At this moment wait, when laser head 320 turn to-during the x direction, can propagate along the y direction from the laser that laser generator 310 sends, and arrive the first path changing device 350a.Then, from the described laser of first path changing device 350a reflection can be parallel to the second substrate S2-the x direction propagates, thereby arrives laser head 320.That is to say that described laser can be parallel to the second substrate S2 from the first path changing device 350a and be reflected to the laser head 320 in the face of the described second substrate S2, the condenser lens from laser head 320 projects on the second substrate S2 then.

Thereby the optical path of laser can change according to the profile that surrounds the guide rail 330 that penetrates opening 112, thereby described optical path also can be round penetrating opening 112.Correspondingly, the upper surface 110 that laser can be parallel to main body 100 sends from laser generator 310, and the change of described optical path allows laser to pass through normal vector each substrate S inequality successively abreast.Therefore, the substrate S that is installed on the delivery board 220 of upper surface 110 of through-body 100 can form pattern successively by described laser.

Though, what illustrated embodiments of the invention disclosed is by using a plurality of path changing devices, single laser generator and single laser head to come to form pattern to a plurality of substrate S, also can use a plurality of laser generators and laser head to replace single laser head and single laser generator, thereby increase the treatment effeciency in the treatment facility 1000.For example, can a pair of laser generator and a pair of laser head be set at place, the bight of rectangular frame, the two pairs of laser generators and laser head can be carried out independently of each other.

Especially, can individually first to fourth laser head be faced toward each location among first substrate S1 to the tetrabasal S4, thereby can on substrate S1 to S4, form pattern independently by the indivedual projections that come from each laser head.That is to say that first to fourth laser head can be parallel to first substrate S1 to the tetrabasal S4 respectively along guide rail 330 and move, described laser can individually project on each substrate S1 to S4 from each laser head.Therefore, can on the substrate S that is installed on the rectangular frame 220, carry out four independently patterned process.When finishing described patterned process on certain substrate, the substrate of being finished can individually be taken away from each delivery board 230, and another substrate can be installed on the empty delivery board 230.

In the example embodiment of revising, described laser generator and laser head can be positioned at the diverse location on the z direction.In this case, can be vertically and the optical path that flatly changes described laser, described then laser can arrive described laser head in above-mentioned same mode.

As shown in Figure 4, be fixed on the periphery that second flat board 384 on second post 382 that penetrates opening 112 extends to main body 100, the 3rd post 392 extends upward from laser head supply unit 340 on the z direction.Second dull and stereotyped the 384 and the 3rd post 392 is connected to each other by flexible connector 394, thereby can change the spacing between second dull and stereotyped the 384 and the 3rd post 392 flexibly.Because the rotation of second flat board 384, laser head supply unit 340 can along guide rail 330 move linearly or curve move.When laser head supply unit 340 when guide rail 330 moves linearly, the rotation of second flat board 384 can be converted into the linear movement of laser head supply unit 340 along guide rail 330, and the spacing between the 3rd post 392 and second flat board 384 can be regulated by flexible connector 394.

Laser generator 310 can be positioned on first flat board 374 of delivery board 230 tops.Thereby, the laser that sends from laser generator 310 can via be positioned on first flat board 374 with the first path changing device 352a of laser generator 310 coplanes, be positioned second flat board 384 be positioned at the first via directly change device 352a under on the z direction the second path changing device 352b and be positioned on second flat board 384 Third Road with the second path changing device 352b coplane and directly change device 352c and arrive laser head 320.That is to say that described laser can advance to arrive then laser head 320 along the optical path that changes with vertical direction in the horizontal direction.

When on described substrate S, forming described first pattern, delivery board 230 or the framework 220 that delivery board 230 can the be installed distance of described conveying spacing of can moving on the z direction is carried the distance (step S300) of spacing thereby described substrate S is moved along the z direction.Figure 11 is the flow chart in the motion of the delivery board shown in Fig. 6 (perhaps described framework) that shows first example embodiment of the design according to the present invention.

With reference to shown in Figure 11, can by the detecting unit (not shown) come a detection laser supply unit 340 along guide rail 330 around penetrating moving of opening 112.

For example, can on guide rail 330,320 beginnings of mark laser head get around mouthful terminal points of 112 motions around starting point and laser head 320 closure rings that opening 112 moves.When detecting terminal point by guide rail 330 of laser head supply unit 340, can prevent from laser is offered laser head 320 (step S320), delivery board 230 or framework 220 can move along the z direction and carry the distance (step S330) of spacing.Especially, when framework 220 when the z direction is moved, a plurality of substrate S in main body are motion together mutually.For example, can carry out delivery board 230 or the motion of the framework 220 of delivery board 230 is installed by the linear actuator such as servomotor (operator).

Then, when detecting laser head supply unit 340, delivery board 230 or framework 220 are stopped become static in this position, once more described laser is offered laser head 320 through the starting point of guide rails 330.Subsequently, on substrate S, carry out same patterned process as described above, thereby on described substrate S, form second pattern (step S400).Described second pattern and first pattern spacing are carried the distance of spacing.

In contrast be, forming individually under the situation of pattern on first substrate S1 to the tetrabasal S4 by each laser head, each laser head can move back and forth and the same long length of the width of each substrate S linearly along guide rail 330, and without any curvilinear motion.Thereby, on each substrate, form first and second patterns successively.

Figure 12 is the flow chart that illustrates the motion of the delivery board (perhaps framework) shown in the second embodiment Fig. 6 that conceives according to the present invention.In Figure 12,, the motion of described delivery board is described with reference to a substrate of selecting at random from four substrates of S1 to S4 because described first substrate S1 to the tetrabasal S4 individually forms pattern by each laser head.

With reference to Figure 12, laser head 320 can move upward in first party along guide rail 330, and described laser is projected onto on the described substrate S, thereby forms described first pattern on described substrate.Then, can detect the place, bight (step S350) whether laser head 320 is located at guide rail 330.

For example, can on guide rail 330, load onto first and second marks, represent two ends of the effective width of described substrate S.Laser head 320 can be along guide rail 330 from described first marker motion to described second mark (being designated as first direction), can on described substrate S, form first pattern by laser head 320 in the linear movement on the described first direction.Then, when described laser head detected second mark on the guide rail 330, laser shielding part 500 can prevent from laser is offered laser head 320 (step S360).That is to say, can on the optical path between laser generator 310 and the laser head 320, insert laser shielding part 500, thereby can prevent that laser from arriving laser head 320.Afterwards, the delivery board 230 that substrate S is installed can be carried the distance (step S370) of spacing along moving perpendicular to the z direction of the upper surface 110 of main body 100.When delivery board 230 when the z direction moves to predetermined conveying spacing, just in time delivery board 230 is stopped at this point, laser head 320 can move to described first mark (being designated as second direction) from described second mark linearly along guide rail 330, the described laser that comes from laser generator 310 can arrive laser head 320 once more, thereby forms described second pattern on substrate S.Described second pattern and described first pattern spacing are carried the distance of spacing.

Can assign to the lower part from the top of described substrate and repeat the described patterned process that is used to form described first pattern and second pattern, thereby on the whole surface of substrate S, form a plurality of straight-line patterns.Described straight-line pattern can be evenly spaced apart the distance of described conveying spacing mutually.

After finishing described patterned process on each substrate in described substrate S1 to S4, framework 220 also can align with described card casket, and the substrate S with patterning moves on to the described card casket from delivery board 230 by mechanical arm.

The example embodiment of design according to the present invention, along the guide rail movement round a plurality of substrates, laser projects on described each substrate from described laser head described laser head with constant speed, thereby forms various patterns on substrate S.Especially, the constant speed of described laser head has improved the uniformity of pattern, simultaneously a plurality of substrates is carried out the efficient that patterning has increased the patterned process in described treatment facility.

Design of the present invention is used in during various laser patternings on the flat substrate handle, in the laser labelling technology such as Patternized technique that is used for forming scattering pattern on the LGP of described backlight assembly and the microelectronic circuit pattern in semiconductor devices.

The description of front is the explanation of example embodiment, should not be construed as the restriction to it.Though described some example embodiment, those skilled in the art can easily understand and can carry out the modification that some can not depart from new instruction of the present invention and advantage in essence to example embodiment.Correspondingly, all such modifications are intended to be included in the category of the present invention that claim limits.In the claims, the sentence formula that device adds function is intended to cover the structure of the described function of execution described herein, is not only on the structure equivalent and is equivalent configurations.Therefore, should be understood that the description of front is the explanation of various example embodiment, should not be construed as and be confined to these concrete examples, modification and other embodiment of the example embodiment that disclosed is intended to be included in the category of claim of the present invention.

Claims

1. equipment that is used for treatment substrate comprises:

Main body, the opening that penetrates that it has the upper surface that is defined by perpendicular x axle and y axle and penetrates this main body middle body;

The substrate conveyor module, on this substrate conveyor module, adorn a plurality of substrates with this configuration mode, make that promptly the normal vector of described a plurality of substrates is different and be parallel to described upper surface, described substrate conveyor module is arranged in the described opening that penetrates, thereby penetrates described main body; And

Processing module, it around the described harness motion that penetrates, and projects the normal vector of laser parallel in described substrate on the described substrate on the upper surface of described main body.

2. equipment according to claim 1, wherein said processing module comprises:

Be used to produce the laser generator of described laser;

Thereby described laser is projected at least one laser head that on described substrate, forms pattern on the described substrate;

Be arranged on the upper surface of described main body and round the described guide rail that penetrates opening; And

Make the laser head supply unit of described laser head along described guide rail movement, the first of described laser head supply unit removably is fixed on the described laser head, and the second portion of described laser head supply unit is fixed on the described guide rail movably.

3. equipment according to claim 2, wherein said processing module also comprise optical path that is used to change the described laser that comes from described laser generator and the path changing device that described laser is supplied to described laser head.

4. equipment according to claim 3, wherein said substrate comprises first substrate with first normal vector that points to the x axle, second substrate with second normal vector that points to the y axle, the 3rd substrate and tetrabasal with the 3rd normal direction vector of sensing-x axle with the 4th normal vector of sensing-y axle, on the 4th zone around described laser generator is located at the 4th bight of described the above guide rail of upper surface and described laser be under the situation that the y direction of principal axis sends from described laser generator, described path changing device comprise on the first area around first bight that is positioned at described the above guide rail of upper surface and with the optical path of described laser from the y direction of principal axis be converted to-x axial first changes device, be positioned on the second area around second bight of described the above guide rail of upper surface and with the optical path of described laser from-x direction of principal axis be converted to-y axial second changes device and is positioned at that the 3rd zone around the third angle portion of described the above guide rail of upper surface is gone up and the optical path of described laser is converted to x the axial the 3rd and changes device from-y direction of principal axis.

5. equipment according to claim 4, wherein said a plurality of laser heads lay respectively at the position in the face of described substrate, and described laser head quilt is individual operation independently of each other, make that each laser head is mutually independently to the laser projection of each substrate.

6. equipment according to claim 3, wherein said processing module comprises also being positioned at and is parallel to described guide rail on the described upper surface and drives the drive unit of described laser head supply unit along described guide rail movement that described drive unit comprises the driver element that is connected to described laser head supply unit and is used for applying the power supply of driving force to described driver element.

7. equipment according to claim 6, wherein said driver element comprise in chain, driving-belt and the driving tooth bar, and described power supply comprises servomotor.

8. equipment according to claim 2, have above wherein said processing module comprises described laser generator first support, be arranged on below described first support and above be useful on the optical path that changes described laser at least one path changing device second support and be used to drive the described laser head supply unit that is connected to described second support drive unit along described guide rail movement.

9. equipment according to claim 8, wherein said first support comprise from the periphery of described upper surface along perpendicular to upwardly extending first post of the z axle of x axle and y axle and from the end parts parallel of described first post in horizontally extending first flat board of described upper surface, on described first flat board, be positioned with described laser generator and be used for optical path with described laser and change down the first path changing device into, described second support comprise second post that extends from the middle body of described upper surface along the z axle up and from the end parts parallel of described second post in horizontally extending second flat board of described upper surface, described second dull and stereotyped the going up is positioned with the second path changing device that is used to change described optical path under the described first path changing device.

10. equipment according to claim 9, wherein said drive unit comprises the 3rd post that extends from described laser head supply unit along the z axle up, be connected to described the 3rd post and second dull and stereotypedly goes up and controls the flexible connector of the spacing between described the 3rd post and second flat board and the power supply that is used for by this way driving force being applied to described second post flexibly, promptly makes described laser head supply unit motion along with the rotation of described second post.

11. equipment according to claim 10, wherein said processing module also comprises the top that is positioned at the 3rd post and directly changes device with the Third Road of the described second path changing device coplane, makes that directly changing device from the described laser of described second path changing device reflection by described Third Road offers described laser head along described the 3rd post.

12. equipment according to claim 2, wherein said processing module comprise that also the laser that is used for sending from described laser generator is divided into the spectroscope of a plurality of laser that separate and is used for individually changing the optical path of the described laser that separates and the described laser that separates is offered a plurality of path changing devices of described laser head respectively.

13. equipment according to claim 1, thereby wherein said substrate conveyor module comprises and is arranged in the described central shaft that opening penetrates described main body that penetrates, and described central shaft is motion and rotate with respect to described z axle linearly on perpendicular to the z axle of x axle and y axle; Be connected the framework on the described central shaft; Be installed in the delivery board on the described framework, described substrate is housed on the described delivery board; And be used to drive described central shaft and have the drive unit that the framework of described delivery board carries out linear movement and rotation.

14. equipment according to claim 13, thereby wherein said delivery board comprises that being used for holding described substrate by vacuum pressure is fixed on vavuum pump on the described substrate with described substrate.

15. equipment according to claim 13, wherein said framework be shaped as rectangle, and four delivery boards are installed on each side of described rectangular frame.

16. equipment according to claim 2 further is included in and finishes described laser after the width of described substrate projects described substrate, drives the controller that described substrate conveyor module moves along the z axle perpendicular to x axle and y axle.