CN102116455A

CN102116455A - Efficient light-emitting LED (Light Emitting Diode) packaging surface

Info

Publication number: CN102116455A
Application number: CN2010105905558A
Authority: CN
Inventors: 郭小华
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-12-11
Filing date: 2010-12-11
Publication date: 2011-07-06

Abstract

The invention provides an efficient light-emitting LED (Light Emitting Diode) packaging surface. A light source packaging bracket integrally formed with the efficient light-emitting LED packaging surface is arranged on a substrate; the packaging surface of the light source packaging bracket is spherical; and LED chips are regularly distributed on the packaging surface, wherein the arc radius of the spherical packaging surface is 10 mm to 120 mm. In the invention, each LED chip is ensured to have no interference from other light and heat within the range of light emitting angles per se; the light emitting efficiency is increased; and the light emitting angles of a circle of chips at surrounding edges are ensured to be not affected by the external structure of the packaging; as the chips are regularly distributed on the spherical packaging surface, the heat balance of the whole light source body is ensured, and the problem of thermal turbulence is effectively solved, therefore, all the chips can work normally.

Description

A kind of efficient luminous LED encapsulating face

Technical field

The present invention relates to the encapsulating structure of light fixture, refer to a kind of encapsulating structure that guarantees the led light source efficiently of the effective light emission rate of all led chips on the aluminium base especially.

Background technology

At present, the LED lamp is subjected to people's attention and use all the more owing to energy-saving high-efficiency environment-friendly, but existing light fixture major part is to encapsulate on the aluminium base circuit of plane, during light fixture work, the chip that is encapsulated in light source edge one circle is subjected to the influence of planar structure, light emission rate is no more than 70%, and other chip is super only 90%, and it is not high to go out light effect, and the chip of planar package goes out hot concentrating, thereby can cause hot vortex phenomenon to occur, influencing the operate as normal of chip, even defective chip.

Summary of the invention

For addressing the above problem, the invention provides a kind of light extraction efficiency height, avoid heat to concentrate, guarantee the encapsulating face of the LED of chip operate as normal.

For achieving the above object, the technical solution used in the present invention is: on substrate, be equipped with the light source package support integrally formed with it, the package surface of described light source is sphere, and rule is distributed with led chip on this package surface.

The spherical arc radius of the package surface of described light source package support is 10～120mm.

The diameter of described light source package support is less than substrate diameter, and places substrate center.

Substrate around the described light source package support is equipped with more than two and encapsulates locating hole.

Beneficial effect of the present invention is: the sphere design of led chip encapsulating face, guaranteed that each led chip does not have the interference of other light and heats in the rising angle scope of self, improved light extraction efficiency, the rising angle that has guaranteed the chip of edge one circle is not subjected to the influence of package outside structure yet, makes all chip light-emitting rates that are encapsulated on the aluminium base circuit reach 98%; Chip rule on the encapsulating face of sphere distributes, and has guaranteed the thermal balance of whole light source body, has solved hot vortex phenomenon effectively, makes that chip all can operate as normal.

Description of drawings

Fig. 1 is a surface structure stereogram of the present invention.

Fig. 2 is a full sectional view of the present invention.

Fig. 3 is a structure side view of the present invention.

The specific embodiment

See also shown in Fig. 1-3, the present invention is about a kind of efficient luminous LED encapsulating face, on substrate 1, be equipped with the light source package support 2 integrally formed with it, the package surface 21 of light source package support 2 is sphere, its arc radius is 10～120mm, guaranteed that each led chip 3 does not have the interference of other light and heats in the rising angle scope of self, improved light extraction efficiency, the rising angle that has guaranteed the chip of edge one circle is not subjected to the influence of package outside structure yet, make all chip light-emitting rates that are encapsulated on aluminium base 1 circuit reach 98%, rule is distributed with led chip 3 on this package surface 21, guaranteed the thermal balance of whole light source body, solved hot vortex phenomenon effectively, made that led chip 3 all can operate as normal, the diameter of light source package support 2 is less than substrate 1 diameter, and place substrate 1 center, the substrate 1 around the light source package support 2 is equipped with encapsulation locating hole 11 more than two.

Above embodiment only is that preferred implementation of the present invention is described; be not that scope of the present invention is limited; design under the prerequisite of spirit not breaking away from the present invention; various distortion and improvement that the common engineers and technicians in this area make technical scheme of the present invention all should fall in the definite protection domain of claims of the present invention.

Claims

1. an efficient luminous LED encapsulating face on substrate, is equipped with the light source package support integrally formed with it, and it is characterized in that: the package surface of described light source is sphere, and rule is distributed with led chip on this package surface.

2. a kind of efficient luminous LED encapsulating face according to claim 1, it is characterized in that: the spherical arc radius of the package surface of described light source package support is 10～120mm.

3. a kind of efficient luminous LED encapsulating face according to claim 2 is characterized in that: the diameter of described light source package support is less than substrate diameter, and places substrate center.

4. a kind of efficient luminous LED encapsulating face according to claim 3, it is characterized in that: the substrate around the described light source package support is equipped with more than two and encapsulates locating hole.