CN101943350A - Backlight module - Google Patents
Backlight module Download PDFInfo
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- CN101943350A CN101943350A CN2009101518750A CN200910151875A CN101943350A CN 101943350 A CN101943350 A CN 101943350A CN 2009101518750 A CN2009101518750 A CN 2009101518750A CN 200910151875 A CN200910151875 A CN 200910151875A CN 101943350 A CN101943350 A CN 101943350A
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- heat
- lgp
- module backlight
- heat sink
- supporting walls
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Abstract
The invention relates to a backlight module which comprises a back plate, a light guide plate, at least one light source assembly, at least one heat radiating plate and at least one elastic device, wherein the light guide plate is arranged on the back plate and provided with a light emergent face, a bottom face corresponding to the light emergent face and a first light incident face connected with the light emergent face and the bottom face; the light source assembly is adjacent to the first light incident face of the light guide plate and comprises a light bar, and the light bar is arranged on the heat radiating plate between the heat radiating plate and the light guide plate; and the elastic device is arranged between the heat radiating plate and the back plate. The backlight module can enable the light bar to be abutted against the light incident face of the light guide plate and can provides proper expansion space for the possible expansion of the light guide plate.
Description
[technical field]
The invention relates to a kind of light source module, and particularly be applied to LCD (liquid crystal display is LCD) as the module backlight (backlightmodule) of area source about a kind of.
[background technology]
LCD mainly comprises liquid crystal panel and module backlight, and module wherein backlight is the area source that is arranged at the liquid crystal panel rear.According to light source assembly, for example cold cathode ray tube or light emitting diode, the configuration difference, module backlight can be divided into down straight aphototropism mode set and side-light type module backlight.Side-light type module backlight is the side that light source assembly is arranged at LGP, makes that light beam that light source assembly sent can be from the side incident of LGP, again from the exiting surface outgoing of LGP.
Figure 1A is the explosive view of existing a kind of module backlight, Figure 1B is the part sectioned view of module backlight after assembling of Figure 1A, please refer to Figure 1A and Figure 1B, existing module 100 backlight comprises a LGP 110, two light source assemblies 120, two heat sinks 130, a reflector plate 112, several blooming pieces 150 and a framework 140.Module 100 backlight is the module backlight of bilateral side incident type, so the quantity of light source assembly 120 and heat sink 130 is all two.This two light source assembly 120 is made of a pair of cold cathode ray tube or a pair of light-emitting diode light bar, and is arranged at this respectively in the heat sink 130.
LGP 110 has an exiting surface 110a, a bottom surface 110b with respect to exiting surface 110a, one and connects exiting surface 110a is connected exiting surface 110a, bottom surface 110b and the first side 110c with the first side 110c and of bottom surface 110b the second side 110d.
Each heat sink 130 has a supporting walls 132, one first heat-conducting part 134 and one second heat-conducting part 136, and this is disposed at this respectively in the supporting walls 132 to light source assembly 120.First heat-conducting part 134 extends to the bottom surface 110b of LGP 110 from a side of the supporting walls 132 of correspondence.Second heat-conducting part 136 extends to the second side 110d of LGP 110 from first heat-conducting part 134 of correspondence.The structure of this heat sink 130 helps to increase the heat conduction approach of light source assembly 120.
It should be noted that; the heat that produces when being subjected to extraneous moisture or light source assembly 120 runnings easily owing to LGP 110 produces dilatancy; therefore prior art can keep a clearance D usually between LGP 110 and light source assembly 120; to avoid LGP 110 limited because of the expansion space after expansion; make whole LGP 110 buckling deformations; and the liquid crystal panel above being pushed through causes display quality impaired.
Yet, above-mentioned clearance D also makes relatively and can't closely cooperate between LGP 110 and the light source assembly 120, therefore after 120 groups of LGP 110 and light source assemblies stand, just may rock owing to external force makes LGP 110 produce, and because LGP 110 clashes into mutually with light source assembly 120 and produces different sound, and therefore LGP 110 also may be worn or damage with light source assembly 120.In addition, the briliancy of module 100 backlight also reduces because of the clearance D between LGP 110 and the light source assembly 110.
In order to solve the above problems, more existing prior aries are suggested in succession.TaiWan, China patent announcement M270369 and Taiwan patent publication No. 200720768, these prior aries adopt and on the framework of module backlight elastic device are set, and directly push against light emitting diode by elastic device, so that light emitting diode is near to LGP.Yet elastic device directly pushes against light emitting diode and may cause the heat radiation of light emitting diode bad, damages to such an extent as to shortening in the service life of light emitting diode even Yin Wendu are too high.
[summary of the invention]
The invention provides a kind of module backlight, can make the lamp bar be connected to the incidence surface of LGP, and can provide suitable expansion space the issuable expansion of LGP.
Other purposes of the present invention and advantage can be further understood from the disclosed technical characterictic of the present invention.
For reaching one of above-mentioned or partly or all purposes or other purposes, the invention provides a kind of module backlight, comprising: a backboard; One LGP is arranged on this backboard, and this LGP has an exiting surface, with respect to a bottom surface of this exiting surface, connect one first incidence surface of this exiting surface and this bottom surface and be connected a side of this bottom surface, this exiting surface and this first incidence surface; At least one light source assembly, this first incidence surface of contiguous this LGP, this light source assembly comprises a lamp bar; At least one heat sink, wherein this lamp bar is arranged on this heat sink, between this heat sink and this first incidence surface; And at least one elastic device, be arranged between this heat sink and this backboard.
One embodiment of the invention propose a kind of module backlight, comprise a backboard, a LGP, at least one light source assembly, at least one heat sink and at least one elastic device.LGP is arranged on the backboard, and LGP has an exiting surface, the bottom surface with respect to exiting surface, connection exiting surface and one first incidence surface of bottom surface and a side that is connected bottom surface, exiting surface and first incidence surface.First incidence surface of the contiguous LGP of light source assembly, light source assembly comprises a lamp bar, and the lamp bar is arranged on the heat sink, between the heat sink and first incidence surface.Elastic device is arranged between heat sink and the backboard.
In one of the present invention embodiment, module backlight more comprises a framework, a reflector plate, an optical diaphragm group.Framework is arranged on the backboard, and LGP is between framework and backboard, and framework provides an opening, exposes LGP.Reflector plate is arranged between the bottom surface of backboard and LGP.
In one of the present invention embodiment, elastic device is suitable for forcing in heat sink and makes the lamp bar be connected to first incidence surface of LGP.
In one of the present invention embodiment, heat sink comprises a supporting walls, and supporting walls is relative with first incidence surface, and the lamp bar is arranged on the supporting walls, and elastic device is arranged between supporting walls and the backboard.
In one of the present invention embodiment, heat sink more comprises one first heat-conducting part that connects supporting walls, and first heat-conducting part extends to the bottom surface of LGP from a side of supporting walls, and supporting walls and first heat-conducting part constitute the cross-sectional shape of a L font.
In one of the present invention embodiment, heat sink more comprises at least one second heat-conducting part that connects first heat-conducting part, and second heat-conducting part extends to the side of LGP from a side of first heat-conducting part.
In one of the present invention embodiment, at least one second heat-conducting part comprises 2 second heat-conducting parts, and supporting walls and these second heat-conducting parts constitute the cross-sectional shape of a ㄇ font, and elastic device is arranged between second heat-conducting part and the backboard.
In one of the present invention embodiment, heat sink more comprises at least one the 3rd heat-conducting part that connects supporting walls, and the 3rd heat-conducting part extends to the side of LGP from supporting walls.
In one of the present invention embodiment, at least one the 3rd heat-conducting part comprises 2 the 3rd heat-conducting parts, and supporting walls and these the 3rd heat-conducting parts constitute the cross-sectional shape of a ㄇ font, and elastic device is arranged between the 3rd heat-conducting part and the backboard.
In one of the present invention embodiment, elastic device comprises the material of high thermal conductivity coefficient.
In one of the present invention embodiment, elastic device and heat sink are one of the forming.
Compared to prior art, in the module backlight of embodiments of the invention, owing between heat sink and backboard, elastic device is set, elastic device forces in heat sink and makes light source assembly contact the incidence surface of LGP after assembling, can improve the briliancy of module bright dipping backlight whereby, and be heated or make moist and produce when expanding at LGP, elastic device can be suitably can be provided the expansion space of LGP by deformation and heat sink to the gap between the backboard, prevents that whereby the problem of LGP buckling deformation from taking place.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below.
[description of drawings]
Figure 1A is the explosive view of existing a kind of module backlight.
Figure 1B is the part sectioned view of module backlight after combination of Figure 1A.
Fig. 2 A is the explosive view of a kind of module backlight of the first embodiment of the present invention.
Fig. 2 B is the local enlarged diagram of the module backlight of the first embodiment of the present invention.
Fig. 2 C is the vertical view of the module backlight of the first embodiment of the present invention.
Fig. 2 D is the profile of the module backlight of Fig. 2 C along the A-A line.
Fig. 3 A is the schematic diagram of the module backlight of the second embodiment of the present invention.
Fig. 3 B is the partial enlarged drawing of the module backlight of Fig. 3 A.
Fig. 4 A is the schematic diagram of the module backlight of the third embodiment of the present invention.
Fig. 4 B is the partial enlarged drawing of the module backlight of Fig. 4 A.
100,200,300,400: module backlight
110,210: LGP
110a, 210a: exiting surface
110b, 210b: bottom surface
110c: first side
110d: second side
112,212: reflector plate
120,220: light source assembly
130,230: heat sink
132,232: supporting walls
134,234: the first heat-conducting parts
136,236: the second heat-conducting parts
140,240: framework
150,250: blooming piece
D: gap
210c: first incidence surface
210d: side
210e: second incidence surface
222: the lamp bar
224: light emitting diode
260: backboard
270: spring
370: shell fragment
470: extension spring
[specific embodiment]
About aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to one of graphic preferred embodiment, can clearly present.The direction term of being mentioned in following examples, for example: upper and lower, left and right, front or rear etc. only are the directions with reference to annexed drawings.Therefore, the direction term of use is to be used for illustrating not to be to be used for limiting the present invention.
Fig. 2 A is the explosive view of a kind of module backlight of the first embodiment of the present invention, Fig. 2 B is the local enlarged diagram of the module backlight of the first embodiment of the present invention, Fig. 2 C is the vertical view of the module backlight of the first embodiment of the present invention, and Fig. 2 D is the profile of the module backlight of Fig. 2 C along the A-A line.Please also refer to Fig. 2 A, Fig. 2 B, Fig. 2 C and Fig. 2 D, the module backlight 200 of present embodiment comprises a LGP 210, at least one light source assembly 220, at least one heat sink 230, a backboard 260, at least one elastic device 270 and a framework 240.In present embodiment, module 200 backlight is the module backlight of bilateral side incident type, and therefore the quantity of at least one light source assembly 220 is example with two.This comprises a lamp bar 222 to each light source assembly 220 in the light source assembly 220, lamp bar 222 comprises at least one light emitting diode 224 (Fig. 2 A is illustrated as several) that is arranged at lamp bar 222 surfaces, and this one of them lamp bar 222 to light source assembly 220 is arranged on the heat sink 230, in the present embodiment, another light source assembly 220 can not be arranged on the heat sink 230.LGP 210 has an exiting surface 210a, a bottom surface 210b with respect to exiting surface 210a, one and connects exiting surface 210a is connected exiting surface 210a, bottom surface 210b and the first incidence surface 210c with the first incidence surface 210c and of bottom surface 210b side 210d.This is arranged at the position of the first incidence surface 210c of contiguous LGP 210 to one of them of light source assembly 220, between the heat sink 230 and the first incidence surface 210c.Framework 240 is arranged on the backboard 260, and LGP 210 is between framework 240 and backboard 260, and framework 240 provides an opening, exposes LGP 210.
In the present embodiment, LGP 210 more comprises one second incidence surface 210e with respect to the first incidence surface 210c, the second incidence surface 210e connects exiting surface 210a and bottom surface 210b, and this is to the second incidence surface 210e of another contiguous LGP 210 wherein of light source assembly 220.
Elastic device 270 is arranged between heat sink 230 and the backboard 260, and elastic device 270 is suitable for forcing in heat sink 230 and makes the light emitting diode 224 of lamp bar 222 be connected to the first incidence surface 210c of LGP 210.In the present embodiment, elastic device 270 for example is a spring.Spring 270 is suitable for heat sink 230 is applied elastic force, make the lamp bar 222 that is arranged on the heat sink 230 be subjected to the power of one day to the first incidence surface 210c of LGP 210, in the present embodiment, spring 270 forces in heat sink 230 and makes lamp bar 222 be connected to the first incidence surface 210c of LGP 210; In another embodiment, lamp bar 222 can not be connected to the first incidence surface 210c of LGP 210, and keeps one at interval with the first incidence surface 210c of LGP 210.In the present embodiment, length before spring 270 not stressed greater than heat sink 230 to the distance between the backboard 260, when spring 270 is installed between heat sink 230 and the backboard 260 and behind the stress deformation, spring 270 can apply elastic force to heat sink 230, light source assembly 220 is pushed away closely towards LGP 210, and the exiting surface of luminescence component 220 is contacted with the first incidence surface 210c of LGP 210, thereby improve the bright dipping briliancy of module 200 backlight; In addition, because spring 270 has elasticity and heat sink 230 has a gap between the backboard 260, so when LGP 210 is heated or makes moist back generation expansion, spring 270 can suitably be compressed, and heat sink 230 to the gap between the backboard 260 can provide the expansion space of LGP 210, with avoid LGP 210 after expansion because the expansion space is limited, make LGP 210 buckling deformations, and blooming piece or liquid crystal panel above being pushed through cause the impaired situation of display quality to take place.
Because the light emitting diode 224 in the running can generate heat, for these heat energy of dissipation reduce temperature, heat sink 230 comprises a supporting walls 232 and connects one first heat-conducting part 234 of supporting walls 232, the supporting walls 232 and first heat-conducting part 234 constitute the cross-sectional shape of L font, supporting walls 232 is relative with the first incidence surface 210c, lamp bar 222 is arranged on the supporting walls 232, first heat-conducting part 234 extends to the bottom surface 210b of LGP 210 from a side of the supporting walls 232 of correspondence, and contact backboard 260, thereby increase the heat conduction approach; In addition, in the present embodiment, spring 270 is arranged between supporting walls 232 and the backboard 260, and spring 270 has the material of high thermal conductivity coefficient, can further improve the efficient of heat conduction.According to the design of present embodiment, when first heat-conducting part 234 is made in integrally formed mode with supporting walls 232, also can improve heat-conducting effect.
In the present embodiment, each heat sink 230 more can have at least one second heat-conducting part (not illustrating), second heat-conducting part extends to the side 210d of LGP 210 from first heat-conducting part 234 of correspondence, wherein, each heat sink 230 for example has 2 second heat-conducting parts, be positioned at the relative both sides of supporting walls 232, make supporting walls 232 and this constitute the cross-sectional shape of a ㄇ font, so as to the heat conduction approach of further increase light source assembly 220 to second heat-conducting part.In the present embodiment, spring 270 can also be one of the forming with heat sink 230.
Hold, module 200 backlight more can comprise a reflector plate 212, to improve the light utilization ratio.Reflector plate 212 is arranged between the bottom surface 210b of backboard 260 and LGP 210; Reflector plate 212 more is arranged between the bottom surface 210b and first heat-conducting part 234 of LGP 210 in an embodiment.
Except that the embodiment of the above, in another embodiment of the present invention, heat sink 230 comprises supporting walls 232 and at least one the 3rd heat-conducting part (not illustrating), and supporting walls 232 is relative with the first incidence surface 210c, and the 3rd heat-conducting part extends to the side 210d of LGP from a side of supporting walls.Wherein, heat sink 230 for example has 2 the 3rd heat-conducting parts, is positioned at the relative both sides of supporting walls 232, makes supporting walls 232 and this constitute the cross-sectional shape of a ㄇ font to the 3rd heat-conducting part.
In the present embodiment, module 200 backlight more can comprise an optical diaphragm group, optical diaphragm group is arranged on the exiting surface 210a of LGP 210, and optical diaphragm group comprises several blooming pieces 250, these blooming pieces 250 comprise a diffusion barrier, a prismatic lens or a bright enhancement film at least one of them, blooming piece 250 is stacked and placed on the top of the exiting surface 210a of LGP 210.In the present embodiment, these blooming pieces 250 are limited between framework 240 and the LGP 210.Particularly, the edge of these blooming pieces 250 is subjected to the spacing of framework 240.
Fig. 3 A is the schematic diagram of the module backlight 300 of the second embodiment of the present invention, and Fig. 3 B is the partial enlarged drawing of the module backlight 300 of Fig. 3 A.Please also refer to Fig. 3 A and Fig. 3 B, the module backlight 300 in the present embodiment is similar to module backlight 200, and for convenience of description, similarly member all illustrates with same numeral, but blooming piece 250 does not illustrate at this.The module backlight 300 of present embodiment and the difference of above-mentioned module 200 backlight are that the elastic device 370 of module 300 backlight is shell fragment, the gap of shell fragment 370 between supporting walls 232 that can be placed in heat sink 230 behind the stress deformation and backboard 260, the module backlight 300 of present embodiment has and the similar effect of above-mentioned module 200 backlight (illustrating as Fig. 2), no longer repeats at this.
Fig. 4 A is the schematic diagram of the module backlight 400 of the third embodiment of the present invention, and Fig. 4 B is the partial enlarged drawing of the module backlight 400 of Fig. 4 A.Please also refer to Fig. 4 A and Fig. 4 B, the module backlight 400 in the present embodiment is similar to module backlight 200, and for convenience of description, similarly member all illustrates with same numeral, but blooming piece 250 does not illustrate at this.The module backlight 400 of present embodiment and the difference of above-mentioned module 200 backlight are that the elastic device 470 of module 400 backlight is extension spring.Have two extension springs in the present embodiment.This is arranged at the relative both sides of heat sink 230 respectively to extension spring 470, one end of each extension spring 470 is connected with heat sink 230, and the other end of each extension spring 470 is connected with the frame parallel with the side 210d of LGP 210 of backboard 260, makes this be held heat sink 230 to extension spring 470.The not stressed length of each extension spring 470 is less than the distance between the affixed position of the affixed position extension spring so far 470 of this extension spring 470 and heat sink 230 and backboard 260.Because extension spring 470 is connected between heat sink 230 and the backboard 260, extension spring 470 provides pulling force to make the lamp bar 222 on the heat sink 230 be subjected to the power of one day to the first incidence surface 210c of LGP 210; In the present embodiment, heat sink 230 is subjected to the pulling force of extension spring 470 and makes lamp bar 222 be connected to the first incidence surface 210c of LGP 210, thereby improve the bright dipping briliancy of module 400 backlight, in another embodiment, lamp bar 222 can not be connected to the first incidence surface 210c of LGP 210, and keeps one at interval with the first incidence surface 210c of LGP 210.In addition, because extension spring 470 has elastic force, so when LGP 210 was heated or makes moist back generation expansion, extension spring 470 can suitably be stretched, and heat sink 230 to the gap between the backboard 260 can provide the expansion space of LGP 210, to avoid LGP 210 buckling deformations.
Specifically, in the present embodiment, this colludes respectively between the relative both sides and backboard 260 and parallel relative two frames of side 210d LGP 210 of the supporting walls 232 of being located at heat sink 230 extension spring 470, but the set-up mode of extension spring 470 is not as limit.
It should be noted that, except that the embodiment of the above, in another embodiment of the present invention, heat sink 230 is the above-mentioned form of 2 the 3rd heat-conducting parts that comprises supporting walls 232 and be connected in the relative both sides of supporting walls 232, this end to one of extension spring 470 is connected one of the 3rd heat-conducting part with this, and this other end to one of extension spring 470 is connected with the frame parallel with the side 210d of LGP 210 of backboard 260; This another end to extension spring 470 is connected another of the 3rd heat-conducting part with this, and this another other end to extension spring 470 is connected with another frame parallel with side 210d LGP 210 backboard 260.
In sum, in the above embodiment of the present invention, light source assembly is arranged on the heat sink, and between heat sink and backboard elastic device is set.Compared to prior art, module backlight of the present invention can be avoided making light source assembly because of dispelling the heat the bad problem of damaging because elastic device directly pushes against light source assembly; In addition, elastic device forces in heat sink and makes light source assembly be subjected to power towards the incidence surface of LGP after assembling, can effectively improve the briliancy of module bright dipping backlight; In addition, when LGP produce to expand, elastic device can be suitably can be provided the expansion space of LGP by deformation and heat sink to the gap between the backboard, avoids the problem of LGP buckling deformation to take place, and makes module backlight of the present invention have better reliability degree.
The above, it only is preferred embodiment of the present invention, when not limiting scope of the invention process with this, promptly the simple equivalent of being done according to the present patent application claim and invention description content generally changes and modifies, and all still belongs in the scope that patent of the present invention contains.Arbitrary embodiment of the present invention in addition or claim must not reached the disclosed whole purposes of the present invention or advantage or characteristics.In addition, summary part and title only are the usefulness that is used for assisting the patent document search, are not to be used for limiting interest field of the present invention.
Claims (14)
1. module backlight comprises:
One backboard;
One LGP is arranged on this backboard, and this LGP has an exiting surface, with respect to a bottom surface of this exiting surface, connect one first incidence surface of this exiting surface and this bottom surface and be connected a side of this bottom surface, this exiting surface and this first incidence surface;
At least one light source assembly, this first incidence surface of contiguous this LGP, this light source assembly comprises a lamp bar;
At least one heat sink, wherein this lamp bar is arranged on this heat sink, between this heat sink and this first incidence surface; And
At least one elastic device is arranged between this heat sink and this backboard.
2. module backlight as claimed in claim 1 is characterized in that: this elastic device is suitable for forcing in this heat sink and makes this lamp bar be connected to this first incidence surface of this LGP.
3. module backlight as claimed in claim 1 is characterized in that: this elastic device comprises the material of high thermal conductivity coefficient.
4. module backlight as claimed in claim 1 is characterized in that: this at least one light source assembly comprises two these light source assemblies, is respectively adjacent to this side of this first incidence surface and this LGP of this LGP.
5. module backlight as claimed in claim 1 is characterized in that: this heat sink comprises a supporting walls, and this supporting walls is relative with this first incidence surface, and this lamp bar is arranged on this supporting walls.
6. module backlight as claimed in claim 5 is characterized in that: this elastic device is arranged between this supporting walls and this backboard.
7. module backlight as claimed in claim 5, it is characterized in that: this heat sink also comprises one first heat-conducting part that connects this supporting walls, this first heat-conducting part extends to this bottom surface of this LGP from a side of this supporting walls, and this supporting walls and this first heat-conducting part constitute the cross-sectional shape of a L font.
8. module backlight as claimed in claim 7 is characterized in that: this heat sink also comprises at least one second heat-conducting part that connects this first heat-conducting part, and this second heat-conducting part extends to this side of this LGP from a side of this first heat-conducting part.
9. module backlight as claimed in claim 8 is characterized in that: this at least one second heat-conducting part comprises two these second heat-conducting parts, and this supporting walls and those second heat-conducting parts constitute the cross-sectional shape of a ㄇ font.
10. module backlight as claimed in claim 8 is characterized in that: this elastic device is arranged between this second heat-conducting part and this backboard.
11. module backlight as claimed in claim 5 is characterized in that: this heat sink also comprises at least one the 3rd heat-conducting part that connects this supporting walls, and the 3rd heat-conducting part extends to this side of this LGP from this supporting walls.
12. module backlight as claimed in claim 11 is characterized in that: this at least one the 3rd heat-conducting part comprises 2 the 3rd heat-conducting parts, and this supporting walls and those the 3rd heat-conducting parts constitute the cross-sectional shape of a ㄇ font.
13. module backlight as claimed in claim 11 is characterized in that: this elastic device is arranged between the 3rd heat-conducting part and this backboard.
14. module backlight as claimed in claim 1 is characterized in that: this elastic device and this heat sink are one of the forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101518750A CN101943350A (en) | 2009-07-03 | 2009-07-03 | Backlight module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101518750A CN101943350A (en) | 2009-07-03 | 2009-07-03 | Backlight module |
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|---|---|
| CN101943350A true CN101943350A (en) | 2011-01-12 |
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| CN2009101518750A Pending CN101943350A (en) | 2009-07-03 | 2009-07-03 | Backlight module |
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| CN102352985A (en) * | 2011-06-01 | 2012-02-15 | 友达光电股份有限公司 | Backlight module |
| CN102737557A (en) * | 2011-03-30 | 2012-10-17 | 索尼公司 | Display device |
| CN102777812A (en) * | 2011-05-11 | 2012-11-14 | 隆达电子股份有限公司 | Backlight module |
| CN102878480A (en) * | 2012-08-22 | 2013-01-16 | 深圳市华星光电技术有限公司 | Sidelight backlight module |
| CN103175024A (en) * | 2011-12-26 | 2013-06-26 | 康佳集团股份有限公司 | Light emitting diode (LED) backlight module |
| WO2013117010A1 (en) * | 2012-02-09 | 2013-08-15 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display |
| CN103439831A (en) * | 2013-08-05 | 2013-12-11 | 青岛海信电器股份有限公司 | Sidelight type liquid crystal module, direct type liquid crystal module and television |
| CN104090425A (en) * | 2014-07-02 | 2014-10-08 | 深圳市华星光电技术有限公司 | Liquid crystal display device and curved surface backlight module thereof |
| WO2014169532A1 (en) * | 2013-04-19 | 2014-10-23 | 深圳市华星光电技术有限公司 | Fixing structure of light guide plate and backlight module using fixing structure |
| CN105546403A (en) * | 2014-10-23 | 2016-05-04 | 美蓓亚株式会社 | Planar illumination device, liquid crystal display apparatus, and method of assembling same |
| CN105739182A (en) * | 2016-04-27 | 2016-07-06 | 合肥惠科金扬科技有限公司 | Heat radiating structure of display device and display device |
| CN110706583A (en) * | 2018-07-09 | 2020-01-17 | 中强光电股份有限公司 | Backlight module and display device |
| WO2020118810A1 (en) * | 2018-12-13 | 2020-06-18 | 惠州市华星光电技术有限公司 | Backlighting structure and liquid crystal display |
| CN112666753A (en) * | 2020-12-31 | 2021-04-16 | 厦门天马微电子有限公司 | Backlight module, liquid crystal display module and liquid crystal display device |
| CN113625486A (en) * | 2020-05-08 | 2021-11-09 | 中强光电股份有限公司 | Backlight module and display device |
| CN113759602A (en) * | 2021-09-07 | 2021-12-07 | 京东方科技集团股份有限公司 | Backlight module, display device and display system |
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- 2009-07-03 CN CN2009101518750A patent/CN101943350A/en active Pending
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| CN102777812A (en) * | 2011-05-11 | 2012-11-14 | 隆达电子股份有限公司 | Backlight module |
| CN102352985B (en) * | 2011-06-01 | 2014-05-28 | 友达光电股份有限公司 | Backlight module |
| CN102352985A (en) * | 2011-06-01 | 2012-02-15 | 友达光电股份有限公司 | Backlight module |
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| WO2013117010A1 (en) * | 2012-02-09 | 2013-08-15 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display |
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Application publication date: 20110112 |