CN101916788B - Solar panel and encapsulation process - Google Patents
Solar panel and encapsulation process Download PDFInfo
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- CN101916788B CN101916788B CN201010153083XA CN201010153083A CN101916788B CN 101916788 B CN101916788 B CN 101916788B CN 201010153083X A CN201010153083X A CN 201010153083XA CN 201010153083 A CN201010153083 A CN 201010153083A CN 101916788 B CN101916788 B CN 101916788B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to a solar panel and an encapsulation process. The solar panel comprises a silicon wafer, wherein the back of the silicon wafer is adhered to a printed circuit board (PCB) board; a polythylene terephthalate (PET) material light-transmitting layer is arranged on the upside of the silicon wafer; and the PCB board is provided with anode and cathode printed coils which are connected with the anode and cathode of the silicon wafer. The encapsulation process of the solar panel comprises the following steps of: firstly, clamping the silicon wafer and flake-like ethylene vinyl acetate (EVA) hot melt glue between the PCB board and the PET material light-transmitting layer and placing the whole body in a vacuum laminating machine; secondly, vacuumizing the vacuum laminating machine and then heating materials to be processed in the vacuum laminating machine; and finally charging air into air bags in the vacuum laminating machine for pressurization.
Description
Technical field
The present invention relates to a kind of solar panel, and the packaging technology of solar panel.
Background technology
Solar panel is a kind of big sun can be changed into the device of electric energy, because solar energy is the regenerative resource of a kind of green, environmental protection, so it has obtained utilization more and more widely.Traditional solar cell panel structure comprises glass, silicon chip, counterdie, between be packaged as a whole with EVA.Can prevent that so thereby extraneous steam from entering the performance that cell panel influences cell panel.But this structure is because the hardness of glass is bigger, when encapsulation, can cause the damage of silicon chip unavoidably, and therefore, the defect rate of the solar panel work in-process of this structure is higher.Because the hardness property of glass, this solar panel can cause certain risk to the user being used for articles for use such as clothes, shoes.And this solar panel also exists shortcomings such as cost height, weight be big.Publication number is that the Chinese patent of CN201229946 discloses a kind of solar panel, and it comprises: the matte toughened glass layer, EVA adhesive film, solar cell monolithic layer, the 2nd EVA adhesive film and the black notacoria layer that are provided with from top to down successively.Be provided with one deck aluminium sheet in the said black notacoria layer.Black notacoria layer has heat absorptivity preferably, can improve solar energy utilization rate, is convenient in use to the cyclic water tank heat supply of being located at the solar panel below.Be provided with one deck aluminium sheet in the said black notacoria layer,, and can accelerate heat-transfer rate with the heat conductivility of further raising black notacoria layer.The matte toughened glass layer of this patent and the weight of aluminium sheet are bigger, and hardness is big, require the occasion that solar panel is in light weight, hardness is little and are not suitable for being used for clothes, toy etc.Publication number is that the Chinese patent of CN201054357 discloses a kind of solar panel; Comprise plate body; Plate body is made up of through the connection of EVA film solar energy collecting plate, PET package board; It is characterized in that: the edge contour that the edge of said PET package board extends to said solar energy collecting plate plate body becomes the shirt rim, and said PET package board is provided with convexity upwards, and described crowning is the plane; Be connected for circular arc between said crowning and the said shirt rim; Described shirt rim width is 5MM-15MM, and the present invention has changed the encapsulating structure of original solar panel, when adopting the surface encapsulation material of PET package board as solar panel; Extend the shirt rim in the solar cell panel edges, can be directly solar panel firmly be seamed in the equipment surface of knapsack, camping tent etc. for example that needs to install solar panel through the shirt rim.The solar panel of this structure is exposed to the outside with silicon chip (being solar energy collecting plate), make solar panel when installing, using all and impaired easily.
In addition, because the PET package board when through the EVA PUR silicon chip being encapsulated, occurs out-of-flatness easily, problem such as bubble is arranged, therefore, the percent defective of existing packaging technology is higher.
Summary of the invention
The present invention solves the encapsulating material of existing in prior technology solar panel to have that weight is big, hardness is high; Use inconvenient; And have certain technical problems such as potential safety hazard, a kind of in light weight, solar panel that hardness is low, safe and reliable is provided.
The problem that another will solve of the present invention is the problem that the solar panel of the existing employing of existing in prior technology PET material encapsulation has the encapsulation out-of-flatness, bubble is arranged, percent defective is high, and a kind of packaging technology of sealing smooth, no bubble, solar panel that percent defective is low is provided.
Above-mentioned technical problem of the present invention mainly is able to solve through following technical proposals: a kind of solar panel; Comprise silicon chip; The downside that it is characterized in that described silicon chip is bonded on the pcb board; The upside of silicon chip is provided with the photic zone of one deck PET material, and described pcb board is provided with the both positive and negative polarity track that links to each other with the silicon chip both positive and negative polarity.Pcb board has good protective effect to silicon chip, simultaneously its have in light weight, the advantage that hardness is little, and pcb board can print the conducting wire easily, its technology is convenient, compact conformation.The PET material also has characteristics in light weight, that hardness is low, and it also has the high advantage of light transmittance simultaneously, effectively raises the efficient of solar panel.
As preferably, described silicon chip is embedded in one deck EVA glue-line, and mutually bonding with the photic zone of pcb board and PET material respectively through this EVA glue-line.Not only it has arrived bonding effect to EVA glue-line in this structure, has played the effect of resilient coating simultaneously, makes this solar panel when receiving external impacts, obtains efficient buffer, solar panel is played the effect of protection.There is it to make things convenient for this solar panel in structural uses such as clothes, toys.
As preferably, described silicon chip all around and downside all be located in the EVA glue-line, the thickness of EVA glue-line is 0.3-0.5mm, the upside of silicon chip fits in the photic zone downside of PET material.Because the transmittancy of EVA glue-line is limited; If be provided with the EVA layer between the photic zone of EVA glue-line and PET material; Can have influence on penetrating of light, therefore, the photic zone of silicon chip here and PET material is directly fitted; And utilize the EVA glue-line realization of silicon chips periphery fixing, effectively raise its light transmittance.
As preferably, the integral body of described silicon chip is located in the EVA glue-line, and the thickness of EVA glue-line is 0.6-1mm, and the upper and lower both sides of silicon chip are mutually bonding with the photic zone and the pcb board of described PET material through the EVA glue-line respectively.This structure makes that encapsulation is more firm, and the EVA glue-line is when thickness is big in reasonable range, and its bonding fastness is higher; If but thickness is too big; Can have influence on light transmission, after the factor aspect considering these two, the thickness range that draws 0.6-1mm is very rational.
In order to obtain above-mentioned solar panel, the present invention is able to solve through following technical proposals: a kind of packaging technology of solar panel is characterized in that comprising following processing step:
The first step is clipped in silicon chip and sheet EVA PUR between the photic zone of pcb board and PET material;
In second step, the material above-mentioned to be processed that stacks is placed vacuum laminator;
In the 3rd step, vacuum laminator is carried out vacuum pumping;
The 4th step, the material of being located in the vacuum laminator to be processed is heated, make this temperature reach 120 ℃ to 140 ℃;
The 5th step carried out pneumatic compression to the air bag in the vacuum laminator, made its pressure of treating rapidoprint reach 4 * 104 to 7 * 104Pa, and exerted pressure 3-10 minute to material to be processed.
The 6th step, cooling, and take out finished product.
This process using vacuum laminator; Under the environment that vacuumizes, carry out lamination, can prevent the generation of its bubble, treat rapidoprint through the air bag in the laminating machine and pressurize; Make it stressed evenly; That pastes is more smooth, reliable, and this lamination mode has also played the protective effect to silicon chip, makes it be difficult in lamination process, occurring breaking.
As preferably, in the first step, the photic zone of pcb board, sheet EVA PUR, silicon chip, PET material is arranged in order from top to bottom.This arrangement mode makes through after the hot pressing, realized silicon chip all around and downside all be located in the EVA glue-line, the upside of silicon chip fits in the photic zone downside of PET material.The photic zone of silicon chip and PET material is directly fitted, and utilizes the EVA glue-line of silicon chips periphery to realize fixing, and effectively raises its light transmittance.Because lamination process is very carrying out in this, the subsides between silicon chip and the photic zone also can guarantee very tight, bubble can not occur.
As preferably, in the first step, the photic zone of pcb board, sheet EVA PUR, silicon chip, sheet EVA PUR, PET material is arranged in order from top to bottom.This technology has realized that the integral body of silicon chip is located in the EVA glue-line, makes that encapsulation is more firm.
As preferably, the thickness of described sheet EVA PUR is 0.3-0.5mm.Sheet EVA PUR select for use behind thickness and the lamination thickness of EVA glue-line approaching, glue-line is too thin can influence adhesive strength, glue-line is too thick to be understood influence light transmittance.
The beneficial effect that brings of the present invention is; The encapsulating material that solves the existing in prior technology solar panel has that weight is big, hardness is high; Use inconvenient; And have certain technical problems such as potential safety hazard; The problem that the solar panel that has also solved the encapsulation of existing employing PET material simultaneously has the encapsulation out-of-flatness, bubble is arranged, percent defective is high provides a kind of in light weight, solar panel that hardness is low, safe and reliable, and the packaging technology of sealing smooth, no bubble, solar panel that percent defective is low.
Description of drawings
Accompanying drawing 1 is a kind of structural representation of the present invention;
Accompanying drawing 2 is a kind of cutaway views of embodiments of the invention 1;
Accompanying drawing 3 is a kind of cutaway views of embodiments of the invention 2.
Embodiment
Pass through embodiment below, and combine accompanying drawing, do further bright specifically technical scheme of the present invention.
Embodiment 1:
Like Fig. 1, shown in Figure 2, the present invention is a kind of solar panel, comprises silicon chip 2, and described silicon chip is embedded in one deck EVA glue-line 3, and mutually bonding with the photic zone 1 of pcb board 4 and PET material respectively through this EVA glue-line.Silicon chip all around and downside all be located in the EVA glue-line, the thickness of EVA glue-line is 0.3-0.5mm, the upside of silicon chip fits in the photic zone downside of PET material.Described pcb board is provided with the both positive and negative polarity track that links to each other with the silicon chip both positive and negative polarity.
This solar panel is made through following technology, may further comprise the steps:
The first step is arranged in order the photic zone of pcb board, sheet EVA PUR, silicon chip, sheet EVA PUR, PET material from top to bottom.This arrangement mode makes through after the hot pressing, realized silicon chip all around and downside all be located in the EVA glue-line, the upside of silicon chip fits in the photic zone downside of PET material.The photic zone of silicon chip and PET material is directly fitted, and utilizes the EVA glue-line of silicon chips periphery to realize fixing, and effectively raises its light transmittance.Because lamination process is very carrying out in this, the subsides between silicon chip and the photic zone also can guarantee very tight, bubble can not occur;
In second step, the material above-mentioned to be processed that stacks is placed vacuum laminator;
In the 3rd step, vacuum laminator is carried out vacuum pumping;
The 4th step, the material of being located in the vacuum laminator to be processed is heated, make this temperature reach 120 ℃ to 140 ℃;
The 5th step carried out pneumatic compression to the air bag in the vacuum laminator, made its pressure of treating rapidoprint reach 4 * 104 to 7 * 104Pa, and exerted pressure 3-10 minute to material to be processed.
The 6th step, cooling, and take out finished product.
Embodiment 2:
As shown in Figure 3, the present invention is a kind of solar panel, comprises silicon chip 2, and described silicon chip is embedded in one deck EVA glue-line 3, and mutually bonding with the photic zone 1 of pcb board 4 and PET material respectively through this EVA glue-line.Silicon chip all around and downside all be located in the EVA glue-line, the thickness of EVA glue-line is 0.3-0.5mm, the upside of silicon chip fits in the photic zone downside of PET material.Described pcb board is provided with the both positive and negative polarity track that links to each other with the silicon chip both positive and negative polarity.
This solar panel is made through following technology, may further comprise the steps:
The first step is arranged in order the photic zone of pcb board, sheet EVA PUR, silicon chip, sheet EVA PUR, PET material from top to bottom.This technology has realized that the integral body of silicon chip is located in the EVA glue-line, makes that encapsulation is more firm;
In second step, the material above-mentioned to be processed that stacks is placed vacuum laminator;
In the 3rd step, vacuum laminator is carried out vacuum pumping;
The 4th step, the material of being located in the vacuum laminator to be processed is heated, make this temperature reach 120 ℃ to 140 ℃;
The 5th step carried out pneumatic compression to the air bag in the vacuum laminator, made its pressure of treating rapidoprint reach 4 * 104 to 7 * 104Pa, and exerted pressure 3-10 minute to material to be processed.
The 6th step, cooling, and take out finished product.
This process using vacuum laminator; Under the environment that vacuumizes, carry out lamination, can prevent the generation of its bubble, treat rapidoprint through the air bag in the laminating machine and pressurize; Make it stressed evenly; That pastes is more smooth, reliable, and this lamination mode has also played the protective effect to silicon chip, makes it be difficult in lamination process, occurring breaking.
So invention has characteristics in light weight, that hardness is low, safe and reliable, its technology has characteristics such as smooth, the no bubble of sealing, percent defective are low.
Claims (4)
1. solar panel; Comprise silicon chip, it is characterized in that the back side of described silicon chip (2) is bonded on the pcb board (4), the upside of silicon chip is provided with the photic zone (1) of one deck PET material; Described pcb board is provided with the both positive and negative polarity track that links to each other with the silicon chip both positive and negative polarity; Described silicon chip is embedded in one deck EVA glue-line (3), and through this EVA glue-line mutually bonding with the photic zone (1) of pcb board (4) and PET material respectively, described silicon chip (2) all around and downside all be located in the EVA glue-line (3); The thickness of EVA glue-line is 0.3-0.5mm, and the upside of silicon chip fits in photic zone (1) downside of PET material.
2. the packaging technology of a solar panel is characterized in that comprising following processing step:
The first step is clipped in silicon chip and sheet EVA PUR between the photic zone of pcb board and PET material, and the photic zone of pcb board, sheet EVA PUR, silicon chip, PET material is arranged in order from top to bottom;
In second step, the material above-mentioned to be processed that stacks is placed vacuum laminator;
In the 3rd step, vacuum laminator is carried out vacuum pumping;
The 4th step, the material of being located in the vacuum laminator to be processed is heated, make this temperature reach 120 ℃ to 140 ℃;
The 5th step carried out pneumatic compression to the air bag in the vacuum laminator, made its pressure of treating rapidoprint reach 4 * 10
4To 7 * 10
4Pa, and exerted pressure 3-10 minute to material to be processed;
The 6th step, cooling, and take out finished product.
3. the packaging technology of a kind of solar panel according to claim 2 is characterized in that, in the first step, the photic zone of pcb board, sheet EVA PUR, silicon chip, sheet EVA PUR, PET material is arranged in order from top to bottom.
4. according to the packaging technology of claim 2 or 3 described a kind of solar panels, the thickness that it is characterized in that described sheet EVA PUR is 0.3-0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201010153083XA CN101916788B (en) | 2010-04-23 | 2010-04-23 | Solar panel and encapsulation process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010153083XA CN101916788B (en) | 2010-04-23 | 2010-04-23 | Solar panel and encapsulation process |
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| CN101916788A CN101916788A (en) | 2010-12-15 |
| CN101916788B true CN101916788B (en) | 2012-12-26 |
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Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102332486A (en) * | 2011-04-13 | 2012-01-25 | 东旭集团有限公司 | Packaging process for substrate glass and back plate glass in solar cell module |
| CN102909929B (en) * | 2011-08-01 | 2015-03-04 | 兰蔚 | Solar cell panel lamination apparatus and lamination method |
| CN103325873B (en) * | 2013-05-14 | 2017-02-08 | 保定嘉盛光电科技股份有限公司 | Solar cell module and manufacturing process thereof |
| KR101610042B1 (en) * | 2014-06-26 | 2016-04-08 | 주식회사 엘에스텍 | a multiple solar cell battery using FPCB connector and the connecting method |
| CN104647844B (en) * | 2015-01-27 | 2017-05-31 | 中山市索伦太阳能光电有限公司 | A kind of preparation method of laminated waterproof circuit board |
| CN104795467A (en) * | 2015-04-14 | 2015-07-22 | 四川和鼎环保工程有限责任公司 | Manufacturing method of solar panel |
| CN104900753A (en) * | 2015-04-14 | 2015-09-09 | 四川和鼎环保工程有限责任公司 | EVA adhesive film packaging technology |
| CN105974774A (en) * | 2016-06-30 | 2016-09-28 | 苏州天诚创达电子有限公司 | Environment-friendly quartz clock |
| CN106571406A (en) * | 2016-11-09 | 2017-04-19 | 成都聚立汇信科技有限公司 | Miniature solar cell panel structure |
| CN106784158B (en) * | 2017-01-10 | 2018-04-17 | 上海空间电源研究所 | A kind of bonding method of solar cell |
| CN109360864A (en) * | 2018-12-03 | 2019-02-19 | 江苏中宇光伏科技有限公司 | A kind of packaging technology of solar panel |
| CN111128018B (en) * | 2019-12-13 | 2021-10-15 | Oppo广东移动通信有限公司 | Display screen assembly attaching method and sealing plug |
| CN113524840A (en) * | 2021-07-16 | 2021-10-22 | 深圳市光瑞实业有限公司 | Integrated laminated solar panel |
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| CN101916788A (en) | 2010-12-15 |
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