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CN101883306B - Diaphragm and capacitance microphone comprising diaphragm - Google Patents

Diaphragm and capacitance microphone comprising diaphragm Download PDF

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Publication number
CN101883306B
CN101883306B CN2010101637216A CN201010163721A CN101883306B CN 101883306 B CN101883306 B CN 101883306B CN 2010101637216 A CN2010101637216 A CN 2010101637216A CN 201010163721 A CN201010163721 A CN 201010163721A CN 101883306 B CN101883306 B CN 101883306B
Authority
CN
China
Prior art keywords
torsion beam
vibrating part
diaphragm
supporting
vibrating diaphragm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010101637216A
Other languages
Chinese (zh)
Other versions
CN101883306A (en
Inventor
杨斌
张睿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aac Microelectroincs Technology (changzhou) Co Ltd
AAC Technologies Pte Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Microtech Changzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Microtech Changzhou Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Priority to CN2010101637216A priority Critical patent/CN101883306B/en
Publication of CN101883306A publication Critical patent/CN101883306A/en
Priority to US12/978,577 priority patent/US20110261979A1/en
Application granted granted Critical
Publication of CN101883306B publication Critical patent/CN101883306B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/207—Shape aspects of the outer suspension of loudspeaker diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Telephone Set Structure (AREA)

Abstract

The invention relates to a diaphragm, which comprises a vibrating part and a supporting part which is connected with the vibrating part. The supporting part and the vibrating part are connected through a lug boss which protrudes at the periphery of the vibrating part, and a first gap is formed between the vibrating part and the supporting part. The supporting part comprises a supporting beam, a torsion beam and a fixing beam, wherein the supporting beam is positioned at the periphery of the vibrating part and is separated from the lug boss; and the torsion beam is connected with the lug boss and the fixing beam is connected with the supporting beam. A second gap is formed between the fixing beam and the torsion beam. The diaphragm can release the stress of the diaphragm formed in the deposition process.

Description

Vibrating diaphragm and comprise the capacitance microphone of this vibrating diaphragm
Technical field
The present invention relates to a kind of vibrating diaphragm and comprise the capacitance microphone of this vibrating diaphragm.
Background technology
Development along with wireless telecommunications; Global Mobile Phone Users is more and more, and the user not only is satisfied with conversation to the requirement of mobile phone, and wants high-quality communication effect can be provided; Especially at present the development of mobile multimedia technology; The speech quality of mobile phone becomes more important, and the microphone of mobile phone is as the voice pick device of mobile phone, and its design quality directly influences speech quality.
And the microphone of using more and better performances at present is microelectromechanical-systems microphone (Micro-Electro-Mechanical-System Microphone is called for short MEMS), and in the correlation technique, the MEMS microphone comprises substrate, backboard and vibrating diaphragm.Vibrating diaphragm is the vitals of MEMS microphone, and vibrating diaphragm generally adopts equally distributed built-in beam to support.But the membrane stress of this diaphragm structure is difficult to discharge, thereby has influenced the sensitivity and the consistency of microphone.So microphone that is necessary a kind of novel vibrating diaphragm is provided and comprises this novel vibrating diaphragm.
Summary of the invention
The technical problem that the present invention need solve provides a kind of vibrating diaphragm that can discharge film formed stress in deposition process and a kind ofly can improve sensitivity and conforming capacitance microphone.
According to the above-mentioned technical problem that needs solution; Designed a kind of vibrating diaphragm; Its involving vibrations portion and the support portion that links to each other with the vibration section, said support portion is connected through the projection that protrudes from the vibration section periphery with the vibration section, and between vibration section and the support portion first slit is arranged; The support portion comprises and is positioned at vibration section periphery and the brace summer that separates with projection, torsion beam that links to each other with projection and the built-in beam that links to each other with brace summer that second slit is arranged between built-in beam and the torsion beam.
Preferably, said torsion beam is connected with brace summer.
Preferably, said vibration section, projection and torsion beam coplane.
Preferably, has normal throw between vibration section and the torsion beam.
Preferably, projection and vibration section coplane are provided with step between projection and the torsion beam.
The present invention also provides a kind of capacitance microphone, and it comprises aforesaid vibrating diaphragm.
Beneficial effect of the present invention is: be positioned at vibration section periphery and the brace summer that separates with projection, torsion beam that links to each other with projection and the built-in beam that links to each other with brace summer because the support portion comprises; Second slit is arranged, so can discharge the stress that vibrating diaphragm is produced in deposition process between built-in beam and the torsion beam through torsion beam.
Because projection and vibration section coplane are provided with step between projection and the torsion beam, so can further discharge the stress of film.
Because capacitance microphone has adopted aforesaid vibrating diaphragm, so improved the sensitivity and the consistency of capacitance microphone.
Description of drawings
Fig. 1 is the stereogram of an embodiment of vibrating diaphragm provided by the invention;
Fig. 2 is the stereogram of second embodiment of vibrating diaphragm provided by the invention.
Embodiment
Below in conjunction with accompanying drawing and execution mode the present invention is described further.
Silicon capacitor microphone provided by the invention is mainly used in the electronic equipments such as mobile phone, is used to receive sound.Vibrating diaphragm is used for this silicon capacitor microphone.
First embodiment provided by the invention, referring to Fig. 1, vibrating diaphragm 1 provided by the invention, involving vibrations portion 11 and support portion 12, vibration section 11 links to each other through projection 15 with support portion 12, and between vibration section 11 and the support portion 12 first slit 13 is arranged.Projection 15 protrudes in the periphery of vibration section 11.
Support portion 12 comprises and is positioned at vibration section 11 peripheries and the brace summer 121 that separates with projection 15, torsion beam 122 that links to each other with projection 15 and the built-in beam 123 that links to each other with brace summer 121.Second slit 14 is arranged between built-in beam 123 and the torsion beam 122.
Torsion beam 122 can be connected with brace summer 123.
Among Fig. 1, vibration section 11, projection 15 and torsion beam 122 are coplanes.
Can discharge the stress that vibrating diaphragm 1 is produced through torsion beam 122 in deposition process.
Referring to Fig. 2, in another one embodiment provided by the invention, the vibrating diaphragm 1a that provides, vibration section 11a and torsion beam 122a not in one plane promptly do not have normal throw between vibration section 11a and the torsion beam 122a.
A kind of mode is projection 15a and vibration section 11a coplane, is provided with step 16a between projection 15a and the torsion beam 122a.
Because projection 15a and vibration section 11a coplane are provided with step 16a between projection 15a and the torsion beam 122a, so can further discharge the stress of vibrating diaphragm 1a.
Capacitance microphone provided by the invention comprises aforesaid vibrating diaphragm.
Above-described only is plurality of embodiments of the present invention, should be pointed out that for the person of ordinary skill of the art at this, under the prerequisite that does not break away from the invention design, can also make improvement, but these all belongs to protection scope of the present invention.

Claims (6)

1.一种振膜，其包括振动部和与所述振动部相连的支撑部，所述支撑部与所述振动部通过凸出于振动部外周的凸块连接，且所述振动部与所述支撑部之间有第一缝隙，其特征在于：所述支撑部包括位于所述振动部外周且与凸块分离的支撑梁、与所述凸块相连的扭转梁和与所述支撑梁相连的固定梁，所述固定梁与所述扭转梁之间有第二缝隙。1. A vibrating membrane, comprising a vibrating part and a supporting part connected to the vibrating part, the supporting part is connected to the vibrating part through a bump protruding from the outer periphery of the vibrating part, and the vibrating part is connected to the vibrating part There is a first gap between the supporting parts, and it is characterized in that: the supporting part includes a supporting beam located on the outer periphery of the vibrating part and separated from the bump, a torsion beam connected to the bump, and a torsion beam connected to the supporting beam. There is a second gap between the fixed beam and the torsion beam. 2.根据权利要求1所述的振膜，其特征在于：所述扭转梁与支撑梁连接。2. The diaphragm according to claim 1, wherein the torsion beam is connected to a support beam. 3.根据权利要求1所述的振膜，其特征在于：所述振动部、凸块和扭转梁共面。3. The diaphragm according to claim 1, characterized in that: the vibrating part, the protrusion and the torsion beam are in the same plane. 4.根据权利要求1所述的振膜，其特征在于：所述振动部与所述扭转梁之间具有垂直落差。4. The diaphragm according to claim 1, characterized in that there is a vertical drop between the vibrating part and the torsion beam. 5.根据权利要求4所述的振膜，其特征在于：所述凸块与所述振动部共面，所述凸块与所述扭转梁之间设有台阶。5 . The diaphragm according to claim 4 , wherein the protrusion is coplanar with the vibrating part, and a step is provided between the protrusion and the torsion beam. 6.一种电容麦克风，其特征在于：其包括权利要求1所述的振膜。6. A condenser microphone, characterized in that it comprises the diaphragm according to claim 1.
CN2010101637216A 2010-04-27 2010-04-27 Diaphragm and capacitance microphone comprising diaphragm Expired - Fee Related CN101883306B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010101637216A CN101883306B (en) 2010-04-27 2010-04-27 Diaphragm and capacitance microphone comprising diaphragm
US12/978,577 US20110261979A1 (en) 2010-04-27 2010-12-26 Diaphragm and condenser microphone using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010101637216A CN101883306B (en) 2010-04-27 2010-04-27 Diaphragm and capacitance microphone comprising diaphragm

Publications (2)

Publication Number Publication Date
CN101883306A CN101883306A (en) 2010-11-10
CN101883306B true CN101883306B (en) 2012-12-12

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CN (1) CN101883306B (en)

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DE102014108984B4 (en) * 2014-06-26 2017-04-06 Tdk Corporation transducer element
PE20181440A1 (en) 2015-09-14 2018-09-12 Wing Acoustics Ltd IMPROVEMENTS IN OR RELATED TO AUDIO TRANSDUCERS
WO2018167538A1 (en) 2017-03-15 2018-09-20 Wing Acoustics Limited Improvements in or relating to audio systems
TW201904310A (en) 2017-03-22 2019-01-16 紐西蘭商威恩音響有限公司 System, method and device for audio converter, thin electronic device and hinge system
CN111918179B (en) * 2020-07-10 2021-07-09 瑞声科技（南京）有限公司 Sound generating device and electronic equipment with same

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DE102005031601A1 (en) * 2005-07-06 2007-01-11 Robert Bosch Gmbh Capacitive, micromechanical microphone, has balancing volume whose section is laterally arranged to height of diaphragm volume, and damping channel designed in curved, bent and unrolled manner in flow direction of air column
CN101203066A (en) * 2006-10-16 2008-06-18 雅马哈株式会社 Electrostatic pressure transducer and manufacturing method therefor
CN101448193A (en) * 2008-11-07 2009-06-03 瑞声声学科技(深圳)有限公司 Capacitive microphone

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JPH0726887B2 (en) * 1986-05-31 1995-03-29 株式会社堀場製作所 Condenser Microphone type detector diaphragm
US5633552A (en) * 1993-06-04 1997-05-27 The Regents Of The University Of California Cantilever pressure transducer
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
EP1878305B1 (en) * 2005-03-28 2012-10-03 Knowles Electronics, LLC Acoustic assembly for a transducer
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Publication number Priority date Publication date Assignee Title
DE102005031601A1 (en) * 2005-07-06 2007-01-11 Robert Bosch Gmbh Capacitive, micromechanical microphone, has balancing volume whose section is laterally arranged to height of diaphragm volume, and damping channel designed in curved, bent and unrolled manner in flow direction of air column
CN101203066A (en) * 2006-10-16 2008-06-18 雅马哈株式会社 Electrostatic pressure transducer and manufacturing method therefor
CN101448193A (en) * 2008-11-07 2009-06-03 瑞声声学科技(深圳)有限公司 Capacitive microphone

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Publication number Publication date
CN101883306A (en) 2010-11-10
US20110261979A1 (en) 2011-10-27

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20170526

Address after: Singapore Ang Mo Kio 65 Street No. 10 techpoint Building 1 floor, No. 8

Co-patentee after: AAC Microelectroincs Technology (Changzhou) Co., Ltd.

Patentee after: AAC Technologies (Singapore) Co., Ltd.

Address before: 518057 Nanshan District province high tech Industrial Park, Shenzhen, North West New Road, No. 18

Co-patentee before: AAC Microelectroincs Technology (Changzhou) Co., Ltd.

Patentee before: AAC Acoustic Technologies (Shenzhen) Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121212

Termination date: 20210427