CN101840292B - Capacitance type touch control circuit pattern and manufacturing method thereof - Google Patents
Capacitance type touch control circuit pattern and manufacturing method thereof Download PDFInfo
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- CN101840292B CN101840292B CN2009101295038A CN200910129503A CN101840292B CN 101840292 B CN101840292 B CN 101840292B CN 2009101295038 A CN2009101295038 A CN 2009101295038A CN 200910129503 A CN200910129503 A CN 200910129503A CN 101840292 B CN101840292 B CN 101840292B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000012545 processing Methods 0.000 claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 230000002093 peripheral effect Effects 0.000 claims description 58
- 239000000758 substrate Substances 0.000 claims description 41
- 125000006850 spacer group Chemical group 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 18
- 238000010292 electrical insulation Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 abstract description 6
- 239000011159 matrix material Substances 0.000 description 9
- 239000007769 metal material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
The invention relates to a capacitance type touch control circuit pattern and a manufacturing method thereof. Two adjacent first axial electrode blocks, a first axial lead and two adjacent second axial electrode blocks are distributed on the surface of a base plate by first processing; the first axial lead is connected with the two first axial electrode blocks, and the two second axial electrode blocks are respectively arranged at both sides of the first axial lead; an insulating layer is covered on the first axial lead by second processing, and a second axial lead made of metal is connected between the two second axial electrode blocks by third processing; and the electric insulation is formed between the first axial lead and the second axial lead for forming the touch control circuit pattern.
Description
Technical Field
The present invention relates to a touch circuit pattern and a method for fabricating the same, and more particularly, to a capacitive touch circuit pattern formed on a surface of a transparent substrate and a layout technique thereof.
Background
Currently, the Touch input methods of the existing Touch Panel (Touch Panel) include resistance type, capacitance type, optical type, electromagnetic induction type, acoustic wave induction type, and the like; the resistive and capacitive touch panel is configured to detect a touch position on the panel surface by a user touching the panel surface with a finger or an induction pen to generate a voltage and current change in the panel at the touched position, so as to achieve the purpose of touch input.
In order to detect the position of a user touching a touch pad with a finger or a sensing pen, various capacitive touch sensing technologies have been developed. For example, a lattice-shaped capacitive touch circuit pattern structure includes two capacitive sensing layers separated by an intermediate insulating layer to form a capacitive effect, each capacitive sensing layer includes conductive elements arranged substantially in parallel, the two capacitive sensing layers are substantially perpendicular to each other, each conductive element includes a sequence of rhombic electrode blocks made of a transparent conductive material (e.g., Indium Tin Oxide (ITO)), the electrode blocks are connected together by narrow conductive wires, the conductive elements on each capacitive sensing layer are electrically connected to a peripheral circuit, and a control circuit provides signals to the two groups of conductive elements through the peripheral circuits, respectively, and receives touch signals generated by the electrode blocks when the surface is touched to determine a touch position on each layer.
In addition, the conventional method for manufacturing the capacitive touch circuit pattern structure includes forming a plurality of electrode blocks of the first capacitive sensing layer by first processing, forming a peripheral circuit by second processing, connecting the electrode blocks with the plurality of electrode blocks of the first capacitive sensing layer, forming an insulating layer on the whole surface by third processing, forming a plurality of electrode blocks of the second capacitive sensing layer by fourth processing, forming another peripheral circuit by fifth processing, and connecting the electrode blocks with the plurality of electrode blocks of the second capacitive sensing layer; however, the drawback is that the electrode blocks, the insulating layer and the two sets of peripheral circuits of the two sets of capacitive sensing layers must be processed five times, which results in a complicated process, and the wires connecting the electrode blocks are also made of ito, which makes it difficult to effectively reduce the impedance between the electrode blocks and the peripheral circuits, and to improve the signal transmission sensitivity between the electrode blocks and the peripheral circuits.
Disclosure of Invention
In order to overcome the problems disclosed in the prior art, an object of the present invention is to provide a capacitive touch circuit pattern and a method for fabricating the same, in particular, a dual axial electrode block can be integrated in a single process, thereby simplifying the number of processes required for laying out the touch circuit pattern.
To achieve the above object, a capacitive touch circuit pattern according to the present invention includes:
the substrate is provided with at least two adjacent transparent first axial electrode blocks, a transparent first axial lead and at least two adjacent transparent second axial electrode blocks;
the first axial lead is formed between the two adjacent first axial electrode blocks so as to connect the two adjacent first axial electrode blocks, and the two adjacent second axial electrode blocks are respectively arranged on two sides of the first axial lead;
a second metal axial lead crossing the first axial lead and connecting the two adjacent second axial electrode blocks;
the insulating isolated point is formed between the first axial lead and the second axial lead so as to electrically insulate the first axial lead and the second axial lead;
and a first axial peripheral circuit and a second axial peripheral circuit are respectively formed at two adjacent end edges of the substrate, the first axial peripheral circuit is connected with the first axial electrode block, and the second axial peripheral circuit is connected with the second axial electrode block.
In addition, a method for manufacturing the capacitive touch circuit pattern comprises the following steps:
the first processing and one-time layout are used for forming two adjacent first axial electrode blocks, a first axial lead and two adjacent second axial electrode blocks on the surface of a substrate;
the first axial lead is arranged between the two adjacent first axial electrode blocks so as to connect the two adjacent first axial electrode blocks;
the two adjacent second axial electrode blocks are respectively arranged on two sides of the first axial lead;
forming an insulating layer on the surface of the substrate in a second processing mode to cover the first axial lead;
and processing for the third time to form a second metal axial lead on the insulating layer, and connecting the two adjacent second axial electrode blocks to form electrical insulation between the first axial lead and the second axial lead so as to form a touch circuit pattern. Wherein,
and respectively arranging a first axial peripheral circuit and a second axial peripheral circuit on two adjacent end edges of the substrate while forming the second axial lead, so that the first axial peripheral circuit is connected with the first axial electrode block, and the second axial peripheral circuit is connected with the second axial electrode block.
The insulating layer is an insulating spacer, and the second axial lead crosses the insulating spacer. Or the insulating layer covers the two adjacent first axial electrode blocks and the two adjacent second axial electrode blocks, the surface of the insulating layer is provided with two adjacent through holes which are respectively formed above the two adjacent second axial electrode blocks, and the second axial lead is positioned between the two adjacent through holes and is overlapped on the two adjacent through holes to be connected with the two adjacent second axial electrode blocks.
In addition, another manufacturing method of the capacitive touch circuit pattern comprises the following steps:
a second axial lead made of metal is arranged on the surface of a substrate in a first processing way;
forming an insulating layer on the surface of the substrate in a second processing mode to cover the second axial lead;
the three-time processing is carried out once to form two adjacent first axial electrode blocks, a first axial lead and two adjacent second axial electrode blocks on the substrate;
the two adjacent second axial electrode blocks are respectively connected with the two ends of the second axial lead;
the two adjacent first axial electrode blocks are respectively arranged on two sides of the second axial lead;
the first axial lead is positioned on the insulating layer and connected with the two adjacent first axial electrode blocks, so that the first axial lead and the second axial lead are electrically insulated to form a touch circuit pattern. Wherein,
and respectively arranging a first axial peripheral circuit and a second axial peripheral circuit on two adjacent end edges of the substrate while forming the second axial lead, so that the first axial electrode block is connected with the first axial peripheral circuit, and the second axial electrode block is connected with the second axial peripheral circuit.
The insulating layer is an insulating spacer, and the first axial lead crosses the insulating spacer. Or the surface of the insulating layer is provided with two adjacent through holes which are respectively formed above two ends of the second axial lead, the two adjacent first axial electrode blocks and the two adjacent second axial electrode blocks are positioned on the insulating layer, and the two adjacent second axial electrode blocks are respectively superposed on the through holes and are respectively connected with the two ends of the second axial lead.
The touch control circuit pattern layout method has the beneficial effects that the first axial electrode blocks and the second axial electrode blocks can be arranged and formed in a single processing, so that the processing times required for arranging the touch control circuit pattern are simplified.
Drawings
Fig. 1 to 3 are schematic diagrams illustrating steps performed according to an embodiment of the present invention.
FIG. 4 is a schematic diagram of an additional embodiment of the present invention.
Fig. 5 to 7 are schematic diagrams illustrating steps performed according to another embodiment of the present invention.
Fig. 8 to 10 are schematic diagrams illustrating implementation steps of another embodiment of the present invention.
Fig. 11 to 13 are schematic diagrams illustrating implementation steps of still another embodiment of the present invention.
Description of reference numerals: 1. 1a, 1b, 1 c-a first axial electrode block; 10-a first axially conductive element; 11. 11a, 11b, 11c — a first axial lead; 2. 2a, 2b, 2 c-second axial electrode zone; 20-a second axially conductive element; 21. 21a, 21b, 21c, 22-second axial conductors; 3. 3a, 3b, 3 c-substrate; 4. 4 a-insulating spacer; 40b, 40 c-insulating layer; 41b, 41 c-through holes; 51. 51a, 51b, 51 c-a first axial perimeter line; 52. 52a, 52b, 52 c-second axial perimeter line.
Detailed Description
The above and further features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.
Referring to fig. 3, a plan view of a capacitive touch circuit pattern of the present invention is disclosed, and fig. 1 and fig. 2 are combined to illustrate that at least two adjacent transparent first axial electrode blocks 1, a transparent first axial lead 11 and at least two adjacent transparent second axial electrode blocks 2 are formed on a surface of a substrate 3 according to the present invention, the first axial lead 11 is formed between the two adjacent first axial electrode blocks 1, so as to connect the two adjacent first axial electrode blocks 1, the two adjacent second axial electrode blocks 2 are respectively arranged at two sides of the first axial lead 11, and a second axial lead 21 made of metal material is connected between two adjacent second axial electrode blocks 2, crosses the first axial lead 11, and an insulating spacer 4 is formed between the first and second axial leads 11, 21 to electrically insulate the first and second axial leads. Wherein,
two adjacent end edges of the substrate 3 respectively form a first axial peripheral circuit 51 and a second axial peripheral circuit 52 (as shown in fig. 3), the first axial peripheral circuit 51 is connected to the first axial electrode block 1, and the second axial peripheral circuit 52 is connected to the second axial electrode block 2. The method for manufacturing the capacitive touch circuit pattern can be practiced by yellow light processing in the embodiment, and comprises the following steps:
(1) forming two adjacent first axial electrode blocks 1, a first axial lead 11 and two adjacent second axial electrode blocks 2 (as shown in fig. 1) on the surface of a transparent substrate 3 by first yellow light processing and one-time layout; the first axial lead 11 is arranged between the two adjacent first axial electrode blocks 1 to connect the two adjacent first axial electrode blocks 1; the two adjacent second axial electrode blocks 2 are respectively arranged on two sides of the first axial lead 11; the first and second axial electrode blocks 1 and 2 and the first axial conductive line 11 may be made of a transparent conductive material, and the transparent conductive material may be Indium Tin Oxide (ITO).
The first and second axial electrode blocks 1 and 2 and the first axial lead 11 can be implemented in multiple groups in this embodiment; the first axial electrode blocks 1 are parallel to each other and arranged at intervals in a matrix, and the second axial electrode blocks 2 are also parallel to each other and arranged at intervals in a matrix, so that the first axial leads 11 are also arranged at intervals in a matrix.
(2) According to the positions of the first and second axial electrode blocks 1 and 2 and the first axial lead 11, an insulating spacer 4 (as shown in fig. 2) is formed on the surface of the substrate 3 by a second yellow light processing to cover the first axial lead 11, the insulating spacer 4 may be made of a transparent insulating material, the insulating material may be silicon oxide or other equivalent materials with insulating ability, and the insulating spacers 4 may also be implemented in multiple groups in this embodiment and arranged at intervals in a matrix.
(3) According to the position of the insulation spacer 4, a second axial lead 21, a first axial peripheral circuit 51 and a second axial peripheral circuit 52 (as shown in fig. 3) made of metal material are formed on the surface of the substrate 3 by a third yellow light processing; the second axial lead 21 is connected between the two adjacent second axial electrode blocks 2 and spans over the insulating spacer 4, so that the first axial lead 11 and the second axial lead 21 are electrically insulated; the first and second axial peripheral lines 51, 52 are respectively disposed at two adjacent end edges of the substrate 3, such that the first axial peripheral line 51 is connected to the first axial electrode block 1, and the second axial peripheral line 52 is connected to the second axial electrode block 2.
The second axial lead 21, the first and second axial peripheral lines 51 and 52 can be made of a metal material with good conductivity, such as gold, silver, copper, aluminum, etc., and the second axial lead 21, the first and second axial peripheral lines 51 and 52 can be implemented in multiple sets in this embodiment. Alternatively, the second axial lead 22 may be connected in series to the plurality of second axial electrode blocks 2 in a stacked manner (as shown in fig. 4).
In this way, the first axial electrode block 1 and the first axial lead 11 constitute a first axial conductive element 10, each first axial conductive element 10 constitutes a capacitive sensing layer, the second axial electrode block 2 and the second axial lead 21 constitute a second axial conductive element 20, each second axial conductive element 20 constitutes another capacitive sensing layer, and the capacitive sensing layers, the insulating spacer 4 and the peripheral circuits 51 and 52 constitute a touch circuit pattern (as shown in fig. 3 and 4). In addition, the substrate 3 may be made of glass, plastic or other transparent insulating materials.
When the touch circuit pattern of the present invention is implemented in a Display Panel (Display Panel), the second axial wires 21 and 22 can be overlapped with a plurality of shading shielding layers arranged in a Black Matrix (Black Matrix) in the Display Panel; alternatively, the shielding layer may be omitted, the second axial wires 21 and 22 may be used as light shielding elements of the display panel, and the second axial wires 21 and 22 made of metal material may also reduce the impedance between the second axial electrode blocks 2 and the second axial peripheral circuit 52 in practice, so as to improve the sensitivity of signal transmission between the electrode blocks and the peripheral circuit; in addition, the plurality of insulating spacers 4 are arranged in a matrix at intervals, which also has the benefit of improving the panel transmittance compared with the conventional whole-surface insulating layer design.
According to the above, the first and second axial electrode blocks 1 and 2 of the present invention can be arranged and formed on the surface of the transparent substrate 3 in a single processing, so that the touch circuit pattern can be processed in three times, thereby simplifying the number of yellow light processing required for arranging the touch circuit pattern.
Referring to fig. 7, a plan view of another capacitive touch circuit pattern of the present invention is disclosed, which is similar to fig. 3, and the difference lies in the sequence of layout to the substrate surface, and the manufacturing method of the capacitive touch circuit pattern can be practiced by yellow light processing in this embodiment, and includes the following steps:
(1) a second axial lead 21a, a first axial peripheral circuit 51a and a second axial peripheral circuit 52a (as shown in fig. 5) made of metal material are formed on the surface of the substrate 3a by first yellow light processing, and the second axial lead 21a, the first and second axial peripheral circuits 51a and 52a can be implemented in multiple sets in this embodiment; wherein the second axial wires 21a are arranged in an array.
(2) According to the position of the second axial line 21a, an insulation spacer 4a (as shown in fig. 6) is formed on the surface of the substrate 3a by a second yellow light processing, and covers the second axial line 21a, and the insulation spacer 4a may be implemented in multiple groups in this embodiment.
(3) According to the positions of the second axial lead 21a, the insulation spacer 4a, the first and second axial peripheral circuits 51a, 52a, two adjacent first axial electrode blocks 1a, a first axial lead 11a and two adjacent second axial electrode blocks 2a (as shown in fig. 7) are formed on the surface of the substrate 3a by a third yellow light processing; the two adjacent second axial electrode blocks 2a are respectively connected with two ends of the second axial lead 21 a; the two first axial electrode blocks 1a are respectively arranged on two sides of the second axial lead 21 a; the first axial lead 11a crosses over the insulation spacer 4a and is connected to the two adjacent first axial electrode blocks 1a, so that the first axial lead 11a and the second axial lead 21a are electrically insulated.
In this embodiment, the first and second axial electrode blocks 1a and 2a and the first axial lead 11a can be implemented in multiple sets, respectively, so that the first and second axial electrode blocks 1a and 2a form a touch circuit pattern, and the composition and implementation of the remaining components are the same as those in the embodiment of fig. 1 to 3.
Referring to fig. 10, a plan view of another capacitive touch circuit pattern of the present invention is disclosed, and fig. 8 and 9 are combined to illustrate that the present invention forms two adjacent first axial electrode blocks 1b, a first axial lead 11b and two adjacent second axial electrode blocks 2b on a substrate 3b, the first axial lead 11b is formed between the two adjacent first axial electrode blocks 1b to connect the two adjacent first axial electrode blocks 1b, the two adjacent second axial electrode blocks 2b are respectively disposed on both sides of the first axial lead 11b, a second axial lead 21b made of a metal material is connected between the two adjacent second axial electrode blocks 2b, the second axial lead crosses over the first axial lead 11b, and an insulating layer 40b is disposed on the surface of the substrate 3b and fills the first axial electrode block 1b, The second axial electrode block 2b, the first axial lead 11b and the second axial lead 21b are electrically insulated from each other, so that the first axial lead 11b and the second axial lead 21b are electrically insulated from each other. Wherein,
two adjacent end edges of the substrate 3b respectively form a first axial peripheral circuit 51b and a second axial peripheral circuit 52b, the first axial peripheral circuit 51b is connected with the first axial electrode block 1b, and the second axial peripheral circuit 52b is connected with the second axial electrode block 2 b. The method for manufacturing the capacitive touch circuit pattern can be practiced by yellow light processing in the embodiment, and comprises the following steps:
(1) a second axial lead 21b, a first axial peripheral circuit 51b and a second axial peripheral circuit 52b (as shown in fig. 8) made of metal material are formed on the surface of the substrate 3b by a first yellow light processing, and the second axial lead 21b, the first and second axial peripheral circuits 51b and 52b can be implemented in multiple sets respectively in this embodiment.
(2) Forming an insulating layer 40b on the surface of the substrate 3b by a second yellow light processing according to the position of the second axial wire 21b (as shown in fig. 9), wherein the insulating layer 40b has two adjacent through holes 41b on the surface thereof, and the through holes are respectively formed above both ends of the second axial wire 21 b; the insulating layer 40b may be made of a transparent insulating material, the insulating material may be silicon oxide or other equivalent materials with insulating ability, and the two adjacent through holes 41b may be implemented in multiple groups in this embodiment.
(3) According to the positions of the two adjacent through holes 41b, a third yellow light processing is performed to form two adjacent first axial electrode blocks 1b, a first axial lead 11b and two adjacent second axial electrode blocks 2b (as shown in fig. 10) on the insulating layer 40b on the surface of the substrate 3b in one layout; the two adjacent second axial electrode blocks 2b are respectively superposed on the through holes 41b on the surface of the insulating layer 40b and respectively connected with the two ends of the second axial lead 21b, and the two adjacent first axial electrode blocks 1b are respectively arranged on the two sides between the two through holes 41 b; the first axial lead 11b is formed on the surface of the insulating layer 40b between the two through holes 41b and connected between the two adjacent first axial electrode blocks 1b, so that the first axial lead 11b and the second axial lead 21b are electrically insulated.
The first and second axial electrode blocks 1b and 2b and the first axial lead 11b may be implemented in multiple sets in this embodiment, so that the first and second axial electrode blocks 1b and 2b form a touch circuit pattern, and the rest of the components are the same as those in the embodiment of fig. 1 to 3.
Referring to fig. 13, a plan view of another capacitive touch circuit pattern of the present invention is disclosed, which is similar to fig. 10, and the difference lies in the sequence of the layout to the substrate surface, and the manufacturing method of the capacitive touch circuit pattern can be practiced by using a yellow light process in the present embodiment, including the following steps:
(1) forming two adjacent first axial electrode blocks 1c, a first axial lead 11c and two adjacent second axial electrode blocks 2c (as shown in fig. 11) on the surface of a transparent substrate 3c by first yellow light processing; the first axial lead 11c is arranged between the two adjacent first axial electrode blocks 1c to connect the two adjacent first axial electrode blocks 1 c; the two adjacent second axial electrode blocks 2c are respectively arranged on two sides of the first axial lead 11 c; the first and second axial electrode blocks 1c and 2c and the first axial lead 11c can be implemented in multiple groups in this embodiment; the first axial electrode blocks 1c are parallel to each other and arranged at intervals in a matrix, and the second axial electrode blocks 2c are also parallel to each other and arranged at intervals in a matrix.
(2) According to the positions of the first and second axial electrode blocks 1c and 2c and the first axial lead 11c, an insulating layer 40c is formed on the surface of the substrate 3c by a second yellow light processing (as shown in fig. 12) to cover the first and second axial electrode blocks 1c and 2c and the first axial lead 11c, and the surface of the insulating layer 40c has two adjacent through holes 41c formed above the second axial electrode block 2c, respectively, and the two adjacent through holes 41c may be implemented in multiple sets in this embodiment.
(3) According to the positions of the two adjacent through holes 41c, a second axial lead 21c, a first axial peripheral circuit 51c and a second axial peripheral circuit 52c (as shown in fig. 13) made of a metal material are formed on the surface of the substrate 3c by a third yellow light processing in a one-time manner; the second axial lead 21c is located on the surface of the insulating layer 40c between the two adjacent through holes 41c, and is overlapped on the two adjacent through holes 41c to connect the two adjacent second axial electrode blocks 2c, so that the first axial lead 11c and the second axial lead 21c are electrically insulated; the first and second axial peripheral lines 51c, 52c are respectively disposed on two adjacent end edges of the substrate 3c, such that the first axial peripheral line 51c is connected to the first axial electrode block 1c, and the second axial peripheral line 52c is connected to the second axial electrode block 2 c.
The second axial lead 21c, the first and second axial peripheral lines 51c, 52c can be implemented in multiple sets in this embodiment, so that the first and second axial electrode blocks 1c, 2c form a touch circuit pattern, and the rest of the components are the same as those in the embodiment of fig. 8 to 10.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations, or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. A capacitive touch circuit pattern manufacturing method is characterized by comprising the following steps:
the first processing and one-time layout are used for forming two adjacent first axial electrode blocks, a first axial lead and two adjacent second axial electrode blocks on the surface of a substrate;
the first axial lead is arranged between the two adjacent first axial electrode blocks so as to connect the two adjacent first axial electrode blocks;
the two adjacent second axial electrode blocks are respectively arranged on two sides of the first axial lead;
forming an insulating layer on the surface of the substrate by secondary processing to cover the first axial lead;
and laying a second metal axial lead on the insulating layer by third processing, and connecting the two adjacent second axial electrode blocks to form electrical insulation between the first axial lead and the second axial lead so as to form a touch circuit pattern.
2. The method for fabricating a capacitive touch circuit pattern according to claim 1, further comprising forming a first axial peripheral circuit and a second axial peripheral circuit on two adjacent end edges of the substrate while forming the second axial conductive line, respectively, such that the first axial peripheral circuit is connected to the first axial electrode block and the second axial peripheral circuit is connected to the second axial electrode block.
3. The method for fabricating a capacitive touch circuit pattern according to claim 1, wherein the insulating layer is an insulating spacer, and the second axial conductive line crosses the insulating spacer.
4. The method for fabricating a capacitive touch circuit pattern according to claim 1, wherein the insulating layer covers the two adjacent first axial electrode blocks and the two adjacent second axial electrode blocks, and the surface of the insulating layer has two adjacent through holes respectively formed above the two adjacent second axial electrode blocks, and the second axial wire is located between the two adjacent through holes and overlapped on the two adjacent through holes to connect the two adjacent second axial electrode blocks.
5. A capacitive touch circuit pattern manufacturing method is characterized by comprising the following steps:
a second axial lead made of metal is arranged on the surface of a substrate in a first processing way;
forming an insulating layer on the surface of the substrate in a second processing mode to cover the second axial lead;
the three-time processing is carried out once to form two adjacent first axial electrode blocks, a first axial lead and two adjacent second axial electrode blocks on the substrate;
the two adjacent second axial electrode blocks are respectively connected with the two ends of the second axial lead;
the two adjacent first axial electrode blocks are respectively arranged on two sides of the second axial lead;
the first axial lead is positioned on the insulating layer and connected with the two adjacent first axial electrode blocks, so that the first axial lead and the second axial lead are electrically insulated to form a touch circuit pattern.
6. The method for fabricating a capacitive touch circuit pattern according to claim 5, further comprising forming a first axial peripheral circuit and a second axial peripheral circuit on two adjacent end edges of the substrate while forming the second axial conductive lines, respectively, such that the first axial electrode block is connected to the first axial peripheral circuit and the second axial electrode block is connected to the second axial peripheral circuit.
7. The method for fabricating a capacitive touch circuit pattern according to claim 5, wherein the insulating layer is an insulating spacer, and the first axial conductive line crosses the insulating spacer.
8. The method for fabricating the capacitive touch circuit pattern as claimed in claim 5, wherein the surface of the insulating layer has two adjacent through holes respectively formed above two ends of the second axial lead, the two adjacent first axial electrode blocks and the two adjacent second axial electrode blocks are located on the insulating layer, and the two adjacent second axial electrode blocks are respectively stacked on the through holes and respectively connected to the two ends of the second axial lead.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101295038A CN101840292B (en) | 2009-03-20 | 2009-03-20 | Capacitance type touch control circuit pattern and manufacturing method thereof |
| EP10753074.3A EP2410411B1 (en) | 2009-03-20 | 2010-03-19 | Capacitive touch circuit pattern |
| JP2012500043A JP5829206B2 (en) | 2009-03-20 | 2010-03-19 | Capacitive touch circuit pattern and manufacturing method thereof |
| US13/256,933 US10282040B2 (en) | 2009-03-20 | 2010-03-19 | Capacitive touch circuit pattern and manufacturing method thereof |
| KR1020107026862A KR101304787B1 (en) | 2009-03-20 | 2010-03-19 | Capacitive touch circuit pattern and manufacturing method thereof |
| PCT/CN2010/000334 WO2010105507A1 (en) | 2009-03-20 | 2010-03-19 | Capacitive touch circuit pattern and manufacturing method thereof |
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| CN2009101295038A CN101840292B (en) | 2009-03-20 | 2009-03-20 | Capacitance type touch control circuit pattern and manufacturing method thereof |
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| CN201110311005.2A Division CN102419673B (en) | 2009-03-20 | 2009-03-20 | Capacitance type touch circuit graphic structure and preparation method thereof |
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