CN101726673B - Spot measurement device - Google Patents
Spot measurement device Download PDFInfo
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- CN101726673B CN101726673B CN200810169742.1A CN200810169742A CN101726673B CN 101726673 B CN101726673 B CN 101726673B CN 200810169742 A CN200810169742 A CN 200810169742A CN 101726673 B CN101726673 B CN 101726673B
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- swing arm
- measurement device
- spot measurement
- probe
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Abstract
The invention relates to a spot measurement device comprising a curved probe, an edge sensor and a probe fixing device and is characterized in that the edge sensor is provided with a swing arm and a sensor, and the swing arm can swing relative to a fulcrum, thereby enabling contacts of the sensor to trip or contact; and the curved probe is fixed on the swing arm by the probe fixing device. The invention has the advantage that the spot measurement device can be extremely thinned.
Description
Technical field
The present invention relates to a kind of testing apparatus of semiconductor device, specifically, is a kind of spot measurement device of luminescence component.
Background technology
In order to understand the performance performance or the parameter of semiconductor device, use spot measurement device to come measuring semiconductor device.For example after making light emitting diode (LED) on the wafer, all earlier through test, key parameters such as, colour temperature well-illuminated according to predominant wavelength, luminous intensity, light, WV, breakdown reverse voltage are with the LED classification before dispatching from the factory.Spot measurement device promptly is used to test the characteristics of luminescence of LED.
Fig. 1 shows a kind of known spot measurement device 10, and it comprises that probe 12 injects the LED crystal grain on the tested wafer 20 with electric current, so that observe its characteristics of luminescence.Spot measurement device 10 also comprises edge sensor (edge sensor), is used for judging contacting between probe 12 and the wafer 20.In the sensor, swing arm 161 can swing up and down with respect to fulcrum 162 on the edge of, and the front end of bar 163 is provided with contact 164, and pin presses the elastic 165 of adjusting gear supporting swing arm 161, and it is applied downward pressure.Probe 12 mat probe fixing apparatus 14 are fixed in the swing arm 161.Probe fixing apparatus 14 is one group of anchor clamps normally, and probe 12 in clamping firmly.When probe 12 and wafer 20 the two near, probe 12 can be pressed in case the acting force of 20 pairs of probes 12 of wafer surpasses pin by wafer 20 jack-up, swing arm 161 will be upturned and cause contact 164 to break off, so spot measurement device 10 injects LED crystal grain with electric current.The setting that pin is pressed is extremely important, and excessive if pin is pressed, probe 12 may damage the surface of LED crystal grain, and also easy abrasion of probe 12.Otherwise too little if pin is pressed, then probe 12 contacts bad with the surface of LED crystal grain.Pin presses adjusting gear to comprise that still screw rod connects an end of elastic 165, and it moves up and down the pressure of adjusting 165 pairs of swing arms 161 of elastic mat.Elastic 165 is stablized the effect of swing arm 161 in addition, when spot measurement device 10 moves, reduces rocking of probe 12, and it can be pressed on the LED crystal grain down behind location fast and accurately.
Recently, in order to obtain test value more accurately, use integrating sphere (integrating sphere) to help measure.Yet,, make measuring value inaccurate because integrating sphere 30 can't be pressed close to wafer 20.As shown in Figure 1, for clamping probe 12 firmly, just probe fixing apparatus 14 must very thickly can provide very big retaining part, probe 12 also must be very long, could make things convenient for its installation exercise.These two factors cause the nose thickness of spot measurement device 10 very big, and therefore when using the integrating sphere 30 of reduced size, the input port of integrating sphere 30 can be far near the distance H 1 of wafer 20.In addition, pin presses the mechanism of adjusting gear very high, makes spot measurement device 10 be difficult to reduce thickness, and when using the integrating sphere 30 of large-size, the distance H 2 between the input port of integrating sphere 30 and the wafer 20 is too far away, causes error in measurement very big.Make being quick on the draw of contact 164, it must be near that end of probe 12.It is far away more that contact 164 leaves probe 12, and then swing arm 161 amplitude of facing upward must just can make contact 164 break off greatlyyer.Therefore, the position of contact 164 is usually below the front end of swing arm 161.If press adjusting gear to move on pin backward, but can receive the restriction of mechanism itself.Because fulcrum 162 is at the tail end of swing arm 161, and elastic 165 is between fulcrum 162 and probe 12, so pin presses adjusting gear the long arm of force just can be arranged near probe 12.If the length of swing arm 161 is increased, then swing arm 161 amplitude of facing upward must just can make contact 164 break off greatlyyer.Various reasons causes most mechanism to concentrate on the front end of spot measurement device 10, makes its slimming difficulty.Because can't slimming, so another shortcoming of spot measurement device is a massiveness.
Therefore known spot measurement device exists above-mentioned all inconvenience and problem.
Summary of the invention
The object of the invention is to propose a kind of spot measurement device.
For realizing above-mentioned purpose, technical solution of the present invention is:
A kind of spot measurement device comprises a curved probe, and an one edge sensor and a probe fixing apparatus is characterized in that:
Said edge sensor has a swing arm and an inductor, and said swing arm can make the contact escape or the contact of said inductor with respect to the swing of fulcrum do;
Said probe fixing apparatus is fixed on said curved probe in the said swing arm.
Spot measurement device of the present invention can also adopt following technical measures further to realize.
Aforesaid spot measurement device, wherein said curved probe, fulcrum and contact have a relative spatial relationship, and promptly said contact is between said curved probe and fulcrum.
Aforesaid spot measurement device, wherein said curved probe, fulcrum and contact have a relative spatial relationship, and promptly said fulcrum is between said curved probe and contact.
Aforesaid spot measurement device, wherein said edge sensor comprise pin pressure adjusting gear, press with the pin of adjusting said curved probe.
Aforesaid spot measurement device, wherein said pin press adjusting gear to comprise that an elastic contacts said swing arm, and said swing arm is applied a pressure.
Aforesaid spot measurement device, wherein said pin press adjusting gear to comprise that an elastic contacts said swing arm, and said swing arm is applied a pulling force.
Aforesaid spot measurement device, wherein said pin press adjusting gear to comprise two magnetic things against each other, and wherein a magnetic thing is fixed in the said swing arm, said two magnetic thing mutual exclusions of mat and said swing arm is applied a pressure.
Aforesaid spot measurement device, wherein said pin press adjusting gear to comprise a magnetic thing and a ferroelectric thing against each other, and said ferroelectric thing is fixed in the said swing arm, and the said magnetic thing of mat attracts said ferroelectric thing and said swing arm is applied a pulling force.
Aforesaid spot measurement device comprises more that wherein an integrating sphere is above said curved probe.
Aforesaid spot measurement device, distance is less than 15 millimeters between the input port of wherein said integrating sphere and the needle point of said curved probe.
Aforesaid spot measurement device, distance is less than 3 millimeters between the input port of wherein said integrating sphere and the needle point of said curved probe.
After adopting technique scheme, spot measurement device of the present invention has makes the extremely advantage of slimming of said spot measurement device.
Description of drawings
Fig. 1 is known spot measurement device synoptic diagram;
Fig. 2 is a first embodiment of the present invention synoptic diagram;
Fig. 3 is a second embodiment of the present invention synoptic diagram;
Fig. 4 is a third embodiment of the present invention synoptic diagram;
Fig. 5 is a fourth embodiment of the present invention synoptic diagram;
Fig. 6 is a fifth embodiment of the present invention synoptic diagram;
Fig. 7 is the three-dimensional icon intention of Fig. 6 embodiment;
Fig. 8 is a sixth embodiment of the present invention synoptic diagram;
Fig. 9 is the synoptic diagram of Fig. 6 embodiment when work;
Figure 10 is the another embodiment synoptic diagram of curved probe of the present invention.
Embodiment
Below in conjunction with embodiment and accompanying drawing thereof the present invention is illustrated further.
See also Fig. 2, Fig. 2 is a first embodiment of the present invention synoptic diagram at present.As shown in the figure, said spot measurement device 40 uses known edge sensor, and its operation is identical with the explanation of Fig. 1.Said curved probe 42 mat probe fixing apparatus 44 are fixed in the swing arm 161.The probe fixing apparatus 44 that uses at present embodiment also is anchor clamps, the back segment needle body 42a of clamping curved probe 42.The back segment needle body 42a of curved probe 42 roughly is horizontal-extending, and the clamping firmly of the enough probe fixing apparatus 44 of its length.Owing to use curved probe 42, so the superjacent air space of probe fixing apparatus 44 can headroom.Be the back segment needle body 42a of clamping level because of probe fixing apparatus 44 again, so its thickness can be very thin.Thus, the not only weight saving of spot measurement device 40, and integrating sphere can also have been shortened near the distance h of wafer 20, and said distance h can be less than 15 millimeters.
Fig. 3 is the variation of Fig. 2 embodiment, and pin presses adjusting gear to comprise magnetic thing 466 respect to one another and 467.Magnetic thing 466 is fixed in the swing arm 161, magnetic thing 467 can the oscilaltion adjustment and magnetic thing 466 between distance. Magnetic thing 466 and 467 pole orientation are opposite, use the strength compressing swing arm 161 that produces mutual exclusion.Through the distance between adjustment magnetic thing 466 and 467, can adjust pin and press.
Fig. 4 is the third embodiment of the present invention, and two embodiment are different with the front, and said pin pressure adjusting gear is positioned at the right side of fulcrum 562, that is fulcrum 562 is pressed between the adjusting gear at curved probe 42 and pin.Pin presses 165 pairs of swing arms 561 of elastic of adjusting gear to bestow pulling force.Contact 564 is positioned at the front end of bar 563, therefore still near curved probe 42.Before wafer 20 did not contact curved probe 42, curved probe 42 was because the cause of gravity is sagging, and the pulling force of 165 pairs of swing arms 561 of elastic strengthens the strength that curved probe 42 presses down.When curved probe 42 drops to by wafer 20 jack-up, cause the left end of swing arm 561 to be upturned to contact 564 disengagings, inductor can conclude that curved probe 42 and wafer 20 reach excellent contact.Present embodiment can let the thickness of spot measurement device thinner, and has bigger space to hold integrating sphere 30.
Fig. 5 is the variation of Fig. 4 embodiment, the ferroelectric thing 468 that pin presses adjusting gear to comprise to be fixed in the swing arm 561 and the magnetic thing 467 of top thereof.Borrowing the attractive force of 467 pairs of ferroelectric things 468 of magnetic thing, producing pulling force swing arm 561.Magnetic thing 467 can move up and down, and the distance adjustment pin between mat itself and the ferroelectric thing 468 is pressed.
Fig. 6 is the fifth embodiment of the present invention, and Fig. 7 is the stereographic map of Fig. 6.Different with the embodiment of front, the fulcrum 662 of spot measurement device 60 is between curved probe 42 and contact 664.Use a reed to be used as fulcrum 662, the one of which end is fixed on the support 669, and swing arm 661 respectively has an end to be fixed on the free end of reed 662 with bar 663.Because contact 664 moves on to the opposite side away from curved probe 42, so the thickness of the front end of spot measurement device 60 can reduce to minimum.When curved probe 42 was made progress jack-up, reed 662 itself can provide downward pressure to swing arm 661.One screw rod 670 moving up and down is arranged in addition on the support 669 above contact 664, bar 663 is applied downward pressure.In the time will adjusting curved probe 42 and bestow the pin of wafer and press, can screw rod 670 be descended or rise and changes the position of contact 664.If screw rod 670 pushes away contact 664 lower, then swing arm 661 amplitude of facing upward must just can make contact 664 break off greatlyyer, and in other words, contact 664 moves down and pin pressed increase.Present embodiment has lacked the pin of front embodiment needs and has pressed adjusting gear, therefore reduces part and cost, has also significantly reduced the thickness of spot measurement device.
Fig. 8 is the variation of Fig. 6 embodiment, on bar 663, installs ferroelectric thing 468 additional, installs magnetic thing 467 on the support 669 additional facing to ferroelectric thing 468, uses that bar 663 is produced pulling force upwards.Magnetic thing 467 can move up and down, and the distance between mat itself and the ferroelectric thing 468 is adjusted pin and pressed.
The synoptic diagram that Fig. 9 is Fig. 6 embodiment when measuring, because the slimming of spot measurement device 60, so integrating sphere 30 can be very near wafer, and integrating sphere 30 can use large-sized assembly.In the application of reality, the distance h between the needle point of the input port of integrating sphere 30 and curved probe 42 can shorten to below 3 millimeters.Fig. 9 has also shown mobile device 68 simultaneously, and with the mechanism that is used to spot measurement device 60 is moved on X, Y, Z axle, this is a known technology.
The alleged curved probe of the present invention is not limited to shaft-like probe, and for example in the embodiment of Figure 10, needle point 421 is fixed on the needle stand 422, and needle stand 422 tail ends have empennage 423 to be fixed in the swing arm.This curved probe can let the thickness of spot measurement device front end thinner.
Above embodiment only supplies to explain the present invention's usefulness, but not limitation of the present invention, the technician in relevant technologies field under the situation that does not break away from the spirit and scope of the present invention, can also make various conversion or variation.Therefore, all technical schemes that are equal to also should saidly belong to category of the present invention, should be limited each claim.
The element numbers explanation
10 spot measurement devices
12 probes
14 probe fixing apparatus
161 swing arms
162 fulcrums
163 bars
164 contacts
165 elastic
20 wafers
30 integrating spheres
40 spot measurement devices
42 curved probes
The back segment needle body of 42a curved probe
421 needle points
422 needle stands
423 empennages
44 probe fixing apparatus
466 magnetic things
467 magnetic things
468 ferroelectric things
50 spot measurement devices
561 swing arms
562 fulcrums
563 bars
564 contacts
60 spot measurement devices
661 swing arms
662 fulcrums
663 bars
664 contacts
669 supports
670 screw rods
68 mobile devices
Claims (8)
1. a spot measurement device comprises a curved probe, and an one edge sensor and a probe fixing apparatus is characterized in that:
Said edge sensor has a swing arm and an inductor, and said swing arm can make the contact escape or the contact of said inductor with respect to the swing of fulcrum do;
The back segment needle body of the said curved probe of said probe fixing apparatus clamping is fixed on said curved probe in the said swing arm;
Said fulcrum is between said curved probe and contact.
2. spot measurement device as claimed in claim 1 is characterized in that, said edge sensor comprises pin pressure adjusting gear, presses with the pin of adjusting said curved probe.
3. spot measurement device as claimed in claim 2 is characterized in that, said pin presses adjusting gear to comprise that an elastic contacts said swing arm, and said swing arm is applied a pressure.
4. spot measurement device as claimed in claim 2 is characterized in that, said pin presses adjusting gear to comprise that an elastic contacts said swing arm, and said swing arm is applied a pulling force.
5. spot measurement device as claimed in claim 2 is characterized in that, said pin presses adjusting gear to comprise two magnetic things against each other, and wherein a magnetic thing is fixed in the said swing arm, said two magnetic thing mutual exclusions of mat and said swing arm is applied a pressure.
6. spot measurement device as claimed in claim 2; It is characterized in that; Said pin presses adjusting gear to comprise a magnetic thing and a ferroelectric thing against each other, and said ferroelectric thing is fixed in the said swing arm, and the said magnetic thing of mat attracts said ferroelectric thing and said swing arm is applied a pulling force.
7. spot measurement device as claimed in claim 1 is characterized in that, comprises that more an integrating sphere is above said curved probe.
8. spot measurement device as claimed in claim 7 is characterized in that, distance is less than 15 millimeters between the input port of said integrating sphere and the needle point of said curved probe.
9. spot measurement device as claimed in claim 7 is characterized in that, distance is less than 3 millimeters between the input port of said integrating sphere and the needle point of said curved probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810169742.1A CN101726673B (en) | 2008-10-16 | 2008-10-16 | Spot measurement device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810169742.1A CN101726673B (en) | 2008-10-16 | 2008-10-16 | Spot measurement device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101726673A CN101726673A (en) | 2010-06-09 |
| CN101726673B true CN101726673B (en) | 2012-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200810169742.1A Expired - Fee Related CN101726673B (en) | 2008-10-16 | 2008-10-16 | Spot measurement device |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102141596B (en) * | 2010-12-29 | 2014-02-05 | 豪勉科技股份有限公司 | Point measurement system capable of controlling point measurement pressure |
| CN102169159A (en) * | 2011-01-04 | 2011-08-31 | 豪勉科技股份有限公司 | Point measurement device with strain gauge |
| CN102544254B (en) * | 2011-10-14 | 2017-03-15 | 东莞市鼎力自动化科技有限公司 | A kind of LED semi-finished product are cut and outward appearance and electrical inspection equipment automatically |
| TW201329483A (en) * | 2012-01-12 | 2013-07-16 | Mpi Corp | Probe pressure calibration method and calibration apparatus thereof |
| TW201337287A (en) * | 2012-03-01 | 2013-09-16 | Mpi Corp | Probe probing force setting method and probing method and system using the method |
| TW201344213A (en) * | 2012-04-17 | 2013-11-01 | Mpi Corp | Electromagnetic controlled point contact apparatus |
| TWI495880B (en) * | 2013-12-31 | 2015-08-11 | Mpi Corp | Probe module |
| TWI598974B (en) * | 2015-11-27 | 2017-09-11 | 樹德科技大學 | Non-destructive evaluation method for wafer-level piezoelectric material and equipment for measurement of the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2757300Y (en) * | 2004-10-11 | 2006-02-08 | 卢彦豪 | Pressure adjustable probe base device |
| CN1877277A (en) * | 2005-06-09 | 2006-12-13 | Tdk株式会社 | Micro structure, cantilever, scanning probe microscope and a method of measuring deformation quantity for the fine structure |
-
2008
- 2008-10-16 CN CN200810169742.1A patent/CN101726673B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2757300Y (en) * | 2004-10-11 | 2006-02-08 | 卢彦豪 | Pressure adjustable probe base device |
| CN1877277A (en) * | 2005-06-09 | 2006-12-13 | Tdk株式会社 | Micro structure, cantilever, scanning probe microscope and a method of measuring deformation quantity for the fine structure |
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| Publication number | Publication date |
|---|---|
| CN101726673A (en) | 2010-06-09 |
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