CN101702402B - Glue overflow-preventing device and baseplate-laminating method using same - Google Patents
Glue overflow-preventing device and baseplate-laminating method using same Download PDFInfo
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- CN101702402B CN101702402B CN2009102118933A CN200910211893A CN101702402B CN 101702402 B CN101702402 B CN 101702402B CN 2009102118933 A CN2009102118933 A CN 2009102118933A CN 200910211893 A CN200910211893 A CN 200910211893A CN 101702402 B CN101702402 B CN 101702402B
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- colloid
- sidewall
- framework
- substrate
- adhesive dispenser
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Abstract
The invention relates to a glue overflow-preventing device, comprising a frame body and at least one glue-solidifying member, wherein the frame body is provided with a side wall arranged along a closed trajectory, and the side wall is provided with at least one notch. The glue-solidifying member is arranged on the external surface of the side wall. The glue overflow-preventing device can improve the condition of glue overflow. Besides, the invention also provides a baseplate-laminating method using the glue overflow-preventing device.
Description
Technical field
The present invention relates to a kind of anti-overflow adhesive dispenser, and relate in particular to a kind of anti-overflow adhesive dispenser of baseplate-laminating technology and method for bonding substrate that uses this anti-overflow adhesive dispenser of being used for.
Background technology
In recent years, along with the progress of plane Display Technique, add that flat-panel screens has advantages such as in light weight, thin thickness and power saving, flat-panel screens has replaced traditional cathode ray tube (cathode ray tube, CRT) display gradually.At present common flat-panel screens comprise LCD (liquid crystal display, LCD), plasma display (plasma display panel, PDP), electrophoretic display device (EPD) (electrophoretic display, EPD) etc.Can be covered with substrate on the display floater of these flat-panel screens, and substrate can be baffle or the optical sheet of three-dimensional display function can be provided, as column type lens plate (lenticular lens plate) etc.
Fig. 1 is the schematic diagram that produces the glue that overflows when carrying out the baseplate-laminating processing procedure in the prior art.Please refer to Fig. 1, in the prior art, when desire fits in display floater 60 with substrate 50, normally on display floater 60, be coated with colloid 70 earlier, then substrate 50 is repeatedly placed on the display floater 60.Afterwards, apply pressure to substrate 50, with pressing substrate 50 and display floater 60.Then, carry out the colloid curing process, colloid 70 is solidified, so can come adhesive base plate 50 and display floater 60 by colloid 70.
Yet, when applying pressure to substrate 50, because colloid 70 meetings are mobile, so cause the situation that excessive glue takes place of substrate 50 and display floater 60 easily all around.
Summary of the invention
The invention provides a kind of anti-overflow adhesive dispenser, the situation of the glue that takes place when improving baseplate-laminating to overflow.
The present invention provides a kind of method for bonding substrate in addition, to improve the situation of the glue that overflows.
For reaching above-mentioned purpose, the present invention proposes a kind of anti-overflow adhesive dispenser, and it comprises that framework and at least one colloid solidify part.Framework has the sidewall that is provided with along the sealing track, and wherein sidewall has at least one breach.Colloid solidifies the outer surface that part is arranged at sidewall.
In one embodiment of this invention, the material of above-mentioned sidewall is a transparent material.
In one embodiment of this invention, the material of above-mentioned sidewall comprise polymethyl methacrylate (polymethyl methacrylate, PMMA), Merlon (polycarbonate, PC) or its combination.
In one embodiment of this invention, above-mentioned at least one colloid curing part comprises uviol lamp, heating member or its combination.
In one embodiment of this invention, above-mentioned heating member comprises infrared lamp.
In one embodiment of this invention, above-mentioned at least one colloid solidifies part around sidewall.
In one embodiment of this invention, above-mentioned framework also comprises the bottom, and sidewall connects the bottom and center on the bottom.
For reaching above-mentioned advantage, the present invention proposes a kind of method for bonding substrate in addition, its two substrates that are suitable for fitting.This method for bonding substrate comprises the following steps: at first, and above-mentioned anti-overflow adhesive dispenser is provided.Then, substrate is positioned in the framework, and is coated with colloid between the substrate.Afterwards, pressing substrate.Then, solidify part by at least one colloid and solidify colloid.
In one embodiment of this invention, above-mentioned method for bonding substrate also comprises the substrate that takes out after fitting, and then carries out the colloid curing process with further curing colloid.
In one embodiment of this invention, one of them is connected with circuit board to two above-mentioned substrates at least, and circuit board stretches out outside the framework via the breach of sidewall.
In one embodiment of this invention, above-mentioned colloid comprises UV glue, heat-curable glue or its combination.
In anti-overflow adhesive dispenser of the present invention, the sidewall of framework can allow colloid only can overflow from the breach of sidewall, so can improve the situation of the glue that overflows.In addition, the colloid curing part that is arranged at the sidewall outer surface can solidify the colloid of substrate edges after the substrate pressing, take out the situation that excessive glue takes place in the back so can prevent substrate.In addition, method for bonding substrate of the present invention is because of using this anti-overflow adhesive dispenser, so can improve the situation of the glue that overflows.
Description of drawings
Fig. 1 is the schematic diagram that produces the glue that overflows when carrying out baseplate-laminating technology in the prior art;
Fig. 2 is the schematic diagram of a kind of anti-overflow adhesive dispenser of one embodiment of the invention;
Fig. 3 A to Fig. 3 D illustrates the flow chart of the method for bonding substrate of one embodiment of the invention.
Wherein, Reference numeral:
50,210,220: substrate
60: display floater
70,230: colloid
100: the anti-overflow adhesive dispenser
102: the sealing track
110: framework
112: sidewall
113: breach
114: outer surface
116: the bottom
120: colloid solidifies part
212,222: circuit board
Embodiment
Fig. 2 is the schematic diagram of a kind of anti-overflow adhesive dispenser of one embodiment of the invention.Please refer to Fig. 2, the anti-overflow adhesive dispenser 100 of present embodiment comprises that framework 110 and at least one colloid solidify part 120, and is that to solidify parts 120 with a plurality of colloids be example in the present embodiment.Framework 110 has the sidewall 112 that is provided with along sealing track 102, and in the present embodiment, sealing track 102 for example is the rectangular closed track.In addition, sidewall 112 has at least one breach 113, and is to be example with a breach 113 at present embodiment.In addition, colloid solidifies the outer surface 114 that part 120 is arranged at sidewall 112.
In the above-mentioned anti-overflow adhesive dispenser 100, the material of sidewall 112 for example is a transparent material, as polymethyl methacrylate, Merlon or its combination, but not as limit.The material of sidewall 112 can be selected for use and can easy removal be stained with the material that sticks at the colloid on the sidewall 112, and sidewall 112 selected materials need allow colloid solidify the colloid that part 120 can be positioned at framework 110 across sidewall 112 curing.In addition, sidewall 112 can be made up of the transparent plate body of multi-disc.In addition, framework 110 can also comprise bottom 116, and sidewall 112 connects bottom 116 and center on bottom 116.It should be noted that in other embodiments, framework 110 can not comprise bottom 116.
Above-mentioned colloid solidifies part 120 and can be uviol lamp, heating member or its combination, and wherein heating member can be infrared lamp, but not as limit.In addition, colloid curing part 120 is the sidewall 112 around framework 110.
Hereinafter will cooperate the graphic method of introducing the baseplate-laminating of one embodiment of the invention.
Fig. 3 A to Fig. 3 D illustrates the flow chart of the method for bonding substrate of one embodiment of the invention.Please earlier with reference to Fig. 3 A, the method for bonding substrate of present embodiment two substrates 210,220 that are suitable for fitting.Two substrates 210,220 of indication can be glass substrate and glass substrate, display floater and baffle, display floater and three-dimensional display function optical sheet (as column type lens plate), display floater and Trackpad or Trackpad and baffle etc. can be provided herein, but not as limit.That is to say that the method for bonding substrate of present embodiment does not limit the kind of substrate 210,220.In addition, the method for bonding substrate of present embodiment is to come adhesive substrates 210,220 by colloid 230.Colloid 230 for example is UV glue, heat-curable glue or its combination.In addition, one of them is connected with circuit board to substrate 210,220 at least, and is that to be connected with circuit board 212,222 respectively with substrate 210,220 be example in the present embodiment.
Please refer to Fig. 3 B, the method for bonding substrate of present embodiment comprises the following steps: at first, and above-mentioned anti-overflow adhesive dispenser 100 is provided.Then, substrate 210,220 is positioned in the framework 110, and is coated with colloid 230 between the substrate 210,220.In more detail, substrate 210,220 is centered on by the sidewall 112 of framework 110, and only has small gap between the sidewall 112 of substrate 210,220 and framework 110, or substrate 210,220 touches the sidewall 112 of framework 110.And the circuit board 212,222 that is connected in substrate 210,220 stretches out outside the framework 110 via the breach 113 of sidewall 112.In addition, in the present embodiment, can earlier substrate 220 be stacked on the substrate 210, afterwards, again the substrate behind the storehouse 210,220 be positioned in the framework 110.Perhaps, earlier substrate 210 is positioned in the framework 110, again substrate 220 is stacked on the substrate 210 afterwards.
Afterwards, shown in Fig. 3 C, pressing substrate 210,220.Particularly, can exert pressure F on substrate 220 by pressing piece, with pressing substrate 210,220.Though pressing substrate 210,220 o'clock, the colloid 230 between substrate 210,220 can flow, and the sidewall 112 of framework 110 can prevent that colloid 230 from overflowing, so 230 in colloid can overflow from the breach 113 of sidewall 112.So, can prevent the situation that excessive glue takes place of substrate 210,220 all around.
Then, solidify part 120 by colloid and solidify colloid 230.In more detail, when colloid 230 was UV glue, colloid solidified part 120 and can be uviol lamp.When colloid 230 was heat-curable glue, colloid solidified part 120 and can be heating member, as infrared lamp.When the colloid of selecting for use 230 is subjected to ultraviolet irradiation or is heated all can solidify the time, then colloid solidifies part 120 and can comprise uviol lamp and heating member.
Because the method for bonding substrate of present embodiment solidifies part 120 by colloid and solidifies colloid 230,, can not produce the situation of the glue that overflows so take out substrate 210,220 backs (shown in Fig. 3 D) from framework 110.
It should be noted that, because above-mentioned colloid solidifies part 120 can only be positioned at substrate 210,220 edges in order to primary solidification colloid 230, so behind framework 110 taking-up substrates 210,220, can carry out one time the colloid curing process again, with further curing colloid 230.That is to say, the part colloid 230 that is not cured is as yet solidified by this colloid curing process.
In sum, have following advantage at least at anti-overflow adhesive dispenser of the present invention and method for bonding substrate:
1. the sidewall of framework can allow colloid can not overflow around substrate, but only overflows from the breach of sidewall, so can improve the situation of excessive glue.
2. after the substrate pressing, can utilize the colloid that is arranged at the sidewall outer surface to solidify part and solidify the colloid of substrate edges, in framework, take out the situation that excessive glue takes place in the back so can prevent substrate.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (10)
1. an anti-overflow adhesive dispenser is characterized in that, comprising:
One framework has a sidewall that is provided with along a sealing track, and wherein this sidewall has at least one breach; And
At least one colloid solidifies part, is arranged at an outer surface of this sidewall,
Wherein, this framework also comprises a bottom, and this sidewall connects this bottom and centers on this bottom.
2. according to the described anti-overflow adhesive dispenser of claim 1, it is characterized in that the material of this sidewall is a transparent material.
3. according to the described anti-overflow adhesive dispenser of claim 1, it is characterized in that the material of this sidewall comprises polymethyl methacrylate, Merlon or its combination.
4. according to the described anti-overflow adhesive dispenser of claim 1, it is characterized in that this at least one colloid solidifies part and comprises uviol lamp, heating member or its combination.
5. according to the described anti-overflow adhesive dispenser of claim 4, it is characterized in that this heating member comprises infrared lamp.
6. according to the described anti-overflow adhesive dispenser of claim 1, it is characterized in that this at least one colloid solidifies part around this sidewall.
7. method for bonding substrate, two substrates that are suitable for fitting is characterized in that, this method for bonding substrate comprises:
One anti-overflow adhesive dispenser is provided, this anti-overflow adhesive dispenser comprises that a framework and at least one colloid solidify part, wherein this framework has a sidewall that is provided with along a sealing track, this sidewall has at least one breach, this colloid solidifies the outer surface that part is arranged at this sidewall, wherein, this framework also comprises a bottom, and this sidewall connects this bottom and centers on this bottom;
Those substrates are positioned in this framework, and are coated with colloid between those substrates;
Those substrates of pressing; And
Solidify part by this at least one colloid and solidify this colloid.
8. according to the described method for bonding substrate of claim 7, it is characterized in that, also comprise:
Take out those substrates after fitting; And
Carry out the colloid curing process with this colloid of further curing.
9. according to the described method for bonding substrate of claim 7, it is characterized in that one of them is connected with a circuit board to those substrates at least, and this circuit board stretches out outside this framework via this breach of this sidewall.
10. according to the described method for bonding substrate of claim 7, it is characterized in that this colloid comprises UV glue, heat-curable glue or its combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102118933A CN101702402B (en) | 2009-11-09 | 2009-11-09 | Glue overflow-preventing device and baseplate-laminating method using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102118933A CN101702402B (en) | 2009-11-09 | 2009-11-09 | Glue overflow-preventing device and baseplate-laminating method using same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100052125A Division CN102148170B (en) | 2009-11-09 | 2009-11-09 | Substrate adhesion method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101702402A CN101702402A (en) | 2010-05-05 |
| CN101702402B true CN101702402B (en) | 2011-05-04 |
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| CN2009102118933A Active CN101702402B (en) | 2009-11-09 | 2009-11-09 | Glue overflow-preventing device and baseplate-laminating method using same |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102166877B (en) * | 2010-12-10 | 2013-07-24 | 林英志 | Gluing method by using UV adhesive |
| CN102588820A (en) * | 2011-01-18 | 2012-07-18 | 英志企业股份有限公司 | Backlight source structure of backlight module and manufacturing method thereof |
| JP5468039B2 (en) * | 2011-04-11 | 2014-04-09 | 株式会社ジャパンディスプレイ | Manufacturing method of display device |
| CN103149738B (en) * | 2013-02-22 | 2015-11-25 | 深圳市华星光电技术有限公司 | liquid crystal display substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1362737A (en) * | 2001-01-04 | 2002-08-07 | 矽品精密工业股份有限公司 | Semiconductor packaging part with glue overflow preventer |
| CN101478305A (en) * | 2009-01-08 | 2009-07-08 | 深圳市中显微电子有限公司 | Capacitance touch screen and manufacturing process thereof |
-
2009
- 2009-11-09 CN CN2009102118933A patent/CN101702402B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1362737A (en) * | 2001-01-04 | 2002-08-07 | 矽品精密工业股份有限公司 | Semiconductor packaging part with glue overflow preventer |
| CN101478305A (en) * | 2009-01-08 | 2009-07-08 | 深圳市中显微电子有限公司 | Capacitance touch screen and manufacturing process thereof |
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| Publication number | Publication date |
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| CN101702402A (en) | 2010-05-05 |
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