CN101616570B - Protective cover - Google Patents
Protective cover Download PDFInfo
- Publication number
- CN101616570B CN101616570B CN200810068113.XA CN200810068113A CN101616570B CN 101616570 B CN101616570 B CN 101616570B CN 200810068113 A CN200810068113 A CN 200810068113A CN 101616570 B CN101616570 B CN 101616570B
- Authority
- CN
- China
- Prior art keywords
- radiator
- over cap
- cover plate
- groove
- framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001681 protective effect Effects 0.000 title abstract 6
- 239000003292 glue Substances 0.000 claims abstract description 29
- 230000004308 accommodation Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229920000297 Rayon Polymers 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008385 outer phase Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a protective cover, which is used for protecting heat conducting glue on a radiator. The protective cover corresponds to the top of the radiator coated with the heat conducting glue and is covered above the heat conducting glue; the protective cover comprises a cover plate and a frame body extended from the circumference of the cover plate; the cover plate is correspondingly covered above the top of the radiator; the frame body is attached to the circumference at the top of the radiator; the circumference at the top of the radiator is provided with a groove; and an embedded part which is correspondingly clamped in the groove is formed on the frame body, and the embedded part is formed by the inward heave from the frame body inner wall. Compared with the prior art, the embedded part of the protective cover is correspondingly clamped in the groove at the circumference of the top of the radiator, so the protective cover is firmly matched with the radiator without coating any viscose glue, and can effectively avoid pollution to the heat conducting glue.
Description
Technical field
The present invention relates to a kind of over cap, particularly a kind of not contaminated over cap of heat-conducting glue that is used to protect radiator.
Background technology
Present heat radiation field at electronic component; Usually install a radiator additional at electronical elements surface; So that the heat that it produced is in time discharged, thereby reduce the interface thermal resistance for radiator is closely contacted with electronical elements surface, the dealer usually between the contact surface of radiator and electronic component coating one deck have the heat-conducting glue of viscosity and high thermal conductance preferably; It is tightr to make that radiator contacts with the surface of heat-generating electronic elements, thereby strengthens thermal conduction effect.But, because being a kind of paste, heat-conducting glue is prone to the contaminative chemical substance, therefore be necessary heat-conducting glue is protected.
Existing over cap usually on the heat-conducting glue of radiator top coat corresponding lid with a rectangle be covered with this heat-conducting glue.To a certain extent, prior art can be protected heat-conducting glue effectively.Yet; Common over cap generally is through utilizing the mode of pasting to be fixed on the radiator; It is not only comparatively loaded down with trivial details in operation that this fixed form need be smeared viscose glue, and in the transportation of radiator, makes easily and can slide relative take place between over cap and the radiator and make over cap loosening even come off; One side meeting scratch is also polluted heat-conducting glue, and heat-conducting glue causes the pollution to surrounding environment simultaneously on the other hand.
Summary of the invention
In view of this, being necessary to provide a kind of installs convenient and cooperates firm over cap.
A kind of over cap; Be used to protect the heat-conducting glue on the radiator; This over cap is corresponding with the radiator top that scribbles heat-conducting glue and cover at this heat-conducting glue top, and it comprises a cover plate and a framework of being extended by this cover plate periphery, and the corresponding cover of this cover plate places the radiator over top; This framework fits in the periphery at said radiator top; The periphery at said radiator top offers groove, is formed with correspondence on the said framework and is placed in the Embedded Division in the said groove, and said Embedded Division is formed by framework inwall inwardly protruding.
Compared with prior art, the Embedded Division correspondence of the present invention's over cap is placed in the groove that the top periphery of said radiator offers, and makes said over cap cooperate with radiator firmly and need not to smear any viscose glue, can avoid heat-conducting glue to be polluted effectively.
With reference to the accompanying drawings, in conjunction with specific embodiment the present invention is done further description.
Description of drawings
Fig. 1 is the over cap of one embodiment of the present invention and the three-dimensional exploded view of a radiator.
Fig. 2 is the inversion figure among Fig. 1.
Fig. 3 is the three-dimensional combination figure of over cap and radiator among Fig. 1.
Fig. 4 is the cutaway view of Fig. 3 along the IV-IV line.
Embodiment
See also Fig. 1, be the over cap 10 and a radiator 20 stereograms of one embodiment of the present invention.This radiator 20 is used for absorbing and distributes a heat-generating electronic elements (figure does not show) like heat that central processing unit produced; The top of this radiator 20 contacts with this heat-generating electronic elements; One heat-conducting glue (figure does not show) is coated in the top of this radiator 20, and this over cap 10 covers at the top of this radiator 20 with the protection heat-conducting glue.
Please consult Fig. 2 in the lump, said over cap 10 is a hollow housing on the whole, adopts plastics or metal material etc. integrally formed.This over cap 10 comprises a horizontal cover plate 12, by these lid 12 outer peripheral edges extended framework 14 downwards.Said cover plate 12 is corresponding with the top of said radiator 20 in shape, and this cover plate 12 roughly is the rectangular-shaped of unfilled corner in the present embodiment, and its fore-end inwardly closes up extension and is the trapezoid shape.Said framework 14 is extended by the outer peripheral edges of said cover plate 12 vertically downward, thereby at the said over cap 10 inner accommodation spaces 16 that form.The bottom ora terminalis level of this framework 14 extends outward a flanging 18, is convenient to control said over cap 10.The middle part inwardly protruding of said framework 14 front end faces forms a fin 142, and the rear end face of said framework 14 inwardly protruding at interval forms two fins 142.Said fin 142 is elongated, and its bearing of trend is vertical each other with plane, said cover plate 12 place.The two side faces of said framework 14 inwardly is circular-arc convexity respectively and forms two Embedded Divisions 144 near at.Said Embedded Division 144 is elongated on the whole, and its bearing of trend is parallel to plane, said cover plate 12 place.
Above-mentioned radiator 20 is integrally formed by heat conductivility good metal materials such as copper, aluminium, and it comprises a substrate 22 and by these substrate 22 extended some radiating fins 24.Be tilted to down to external symmetry by the middle part of said substrate 22 bottom surfaces and extend two Thermal Arms 26.The middle part at these substrate 22 tops protrudes out an endothermic section 28 vertically upward.The end face of said endothermic section 28 and the closely contact mutually of said electronic component, said heat-conducting glue correspondence is coated on the end face of this endothermic section 28.The shape of this endothermic section 28 is corresponding consistent with the shape of the accommodation space 16 of over cap 10, and it roughly is the rectangular-shaped of unfilled corner on the whole, and its leading section inwardly closes up extension and is the trapezoid shape.The two side faces of this endothermic section 28 forms a groove 282 respectively near at.Said groove 282 is elongated and parallel with the bottom surface of endothermic section 28.Said two grooves 282 in shape with two Embedded Divisions, the 144 corresponding complementations of said over cap 10, for two Embedded Divisions, 144 corresponding embeddings of said over cap 10.The size of said Embedded Division 144 is slightly larger than groove 282, reaches fastening effect so that Embedded Division 144 interference ground embeds in the groove 282.Said radiating fin 24 is extended by said two Thermal Arms 26, comprises some first radiating fins 240 and second radiating fins 242 of some parallel interval of being extended outward by the relative upper surfaces level of each Thermal Arm 26 that are parallel to each other at interval that extended straight down by each Thermal Arm 26 lower surfaces.
Please consult Fig. 3 and Fig. 4 simultaneously; When using said over cap 10; This over cap 10 is covered on the endothermic section 28 of said radiator 20; Wherein, framework 14 correspondences of said over cap 10 are sheathed on the periphery of the endothermic section 28 of said radiator 20, and two Embedded Divisions 144 of said over cap 10 are corresponding respectively to be placed in the groove 282 of said endothermic section 28; Strain takes place and fits tightly mutually with said endothermic section 28 in three fins 142 of said over cap 10; The cover plate 12 corresponding end faces that cover on the endothermic section 28 that places said radiator 20 and be parallel to this endothermic section 28 of said over cap 10, said over cap 10 surrounds an enclosure space (indicating) jointly with the end face of said endothermic section 28, for holding the heat-conducting glue 30 that is coated on these endothermic section 28 end faces.
In sum; The present invention's over cap 10 only need press down its cover plate 12 end faces or flanging 18; In two grooves 282 with the corresponding respectively endothermic section 28 that snaps in said radiator 20 of said two Embedded Divisions 144; Can make said over cap 10 and radiator 20 secure fit, can avoid over cap 10 landings effectively and heat-conducting glue is polluted and need not to smear any viscose glue.And strains take place and fit tightly with the outer phase of said endothermic section 28 in three fins 142 of said over cap 10, have increased the fastness of assembling said over cap 10.In addition, the bottom ora terminalis of the framework 14 of said over cap 10 extends outward a flanging 18, when the said over cap 10 of dismounting, can be used as stress point, is convenient to dismounting.
Claims (9)
1. over cap; Be used to protect the heat-conducting glue on the radiator; This over cap is corresponding with the radiator top that scribbles heat-conducting glue and cover at this heat-conducting glue top, and it comprises a cover plate and a framework of being extended by this cover plate periphery, and the corresponding cover of this cover plate places the radiator over top; This framework fits in the periphery at said radiator top; It is characterized in that: the periphery at said radiator top offers groove, is formed with correspondence on the said framework and is placed in the Embedded Division in the said groove, and said Embedded Division is formed by framework inwall inwardly protruding.
2. over cap as claimed in claim 1 is characterized in that: said Embedded Division is elongated, and its bearing of trend and said cover plate parallel.
3. over cap as claimed in claim 2 is characterized in that: said Embedded Division is arc-shaped convex, and the shape complementarity of the shape of Embedded Division and said groove, and the size of Embedded Division is slightly larger than groove.
4. over cap as claimed in claim 1 is characterized in that: said groove is elongated, and its bearing of trend is parallel to the end face of said radiator.
5. over cap as claimed in claim 1 is characterized in that: said cover plate is the rectangular-shaped of unfilled corner, and its fore-end inwardly closes up extension and is the trapezoid shape.
6. over cap as claimed in claim 5 is characterized in that: the corresponding consistent and said groove of the shape at said radiator top and cover plate is opened in the relative both sides at said radiator top respectively.
7. over cap as claimed in claim 1 is characterized in that: the framework of said over cap inwardly protruding at interval forms some fins that compress radiator top periphery.
8. over cap as claimed in claim 7 is characterized in that: said fin is elongated, and its bearing of trend and said cover plate are perpendicular.
9. over cap as claimed in claim 1 is characterized in that: said framework is extended by the outer peripheral edges of said cover plate vertically downward, accommodates the accommodation space at said radiator top in the inner formation one of said over cap.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810068113.XA CN101616570B (en) | 2008-06-25 | 2008-06-25 | Protective cover |
| US12/261,048 US20090321048A1 (en) | 2008-06-25 | 2008-10-30 | Heat dissipation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810068113.XA CN101616570B (en) | 2008-06-25 | 2008-06-25 | Protective cover |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101616570A CN101616570A (en) | 2009-12-30 |
| CN101616570B true CN101616570B (en) | 2012-07-04 |
Family
ID=41446004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810068113.XA Active CN101616570B (en) | 2008-06-25 | 2008-06-25 | Protective cover |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20090321048A1 (en) |
| CN (1) | CN101616570B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9072199B2 (en) * | 2010-12-27 | 2015-06-30 | Src, Inc. | Thermal transfer component, apparatus and method including thermally conductive frame penetrated by thermally conductive plug |
| CN113097162A (en) | 2017-10-10 | 2021-07-09 | 北京比特大陆科技有限公司 | Heat dissipation sheet, chip and circuit board |
| USD892753S1 (en) * | 2018-10-31 | 2020-08-11 | Bitmain Technologies Inc. | Heat sink |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0434298A1 (en) * | 1989-12-21 | 1991-06-26 | International Business Machines Corporation | Thermally enhanced electronic component package |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3217793A (en) * | 1962-11-30 | 1965-11-16 | Wakefield Eng Inc | Heat transfer |
| JP3431004B2 (en) * | 2000-01-14 | 2003-07-28 | 松下電器産業株式会社 | Heat sink and cooling device using the same |
| EP1128432B1 (en) * | 2000-02-24 | 2016-04-06 | Infineon Technologies AG | Fixation of semiconductor modules to a heatsink |
| KR100457220B1 (en) * | 2002-02-27 | 2004-11-16 | 잘만테크 주식회사 | Heat sink device for cooling chipset |
| US7139174B1 (en) * | 2003-10-29 | 2006-11-21 | Cisco Technology, Inc. | Techniques for attaching a heat sink assembly to a circuit board component |
| CN2727961Y (en) * | 2004-08-25 | 2005-09-21 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| CN101060763B (en) * | 2006-04-19 | 2011-08-24 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| US7567439B2 (en) * | 2007-08-10 | 2009-07-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device having a rotatable fastener |
| US7639497B2 (en) * | 2007-12-10 | 2009-12-29 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device having a fan mounted thereon |
| TWM337725U (en) * | 2008-03-11 | 2008-08-01 | Tai Sol Electronics Co Ltd | Radiation paste lid |
| CN101562964B (en) * | 2008-04-14 | 2013-01-09 | 鸿富锦精密工业（深圳）有限公司 | Heat-conducting medium protecting cover and heating abstractor with the protecting cover |
-
2008
- 2008-06-25 CN CN200810068113.XA patent/CN101616570B/en active Active
- 2008-10-30 US US12/261,048 patent/US20090321048A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0434298A1 (en) * | 1989-12-21 | 1991-06-26 | International Business Machines Corporation | Thermally enhanced electronic component package |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090321048A1 (en) | 2009-12-31 |
| CN101616570A (en) | 2009-12-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170420 Address after: Guangdong, Chancheng Province West Industrial Zone, 35 North Road, Warburg, No. Patentee after: Quanyida Technology (Foshan) Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: Foxconn Precision Industry Co., Ltd. Patentee before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. |
|
| TR01 | Transfer of patent right |