CN101564832A - Resin mill with diamond mill-grain groups and processing method thereof - Google Patents
Resin mill with diamond mill-grain groups and processing method thereof Download PDFInfo
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- CN101564832A CN101564832A CNA2008100709686A CN200810070968A CN101564832A CN 101564832 A CN101564832 A CN 101564832A CN A2008100709686 A CNA2008100709686 A CN A2008100709686A CN 200810070968 A CN200810070968 A CN 200810070968A CN 101564832 A CN101564832 A CN 101564832A
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- diamond abrasive
- abrasive grain
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Abstract
The invention discloses a resin mill with diamond mill-grain groups and a processing method thereof. The processing method comprises the following steps: step 1: producing diamond mill-grain groups and preparing the diamond mill-grain groups, wherein the diamond mill-grain group comprises a plurality of diamond mill grains which are fixed together by a metal binding agent or a ceramic binding agent; and step 2: producing the resin mill and binding the diamond mill-grain groups together by a resin binding agent to form the resin mill. The mill is formed by the binding of the mill groups which are made by preprocessing, thus, the mill has the following advantages that the metal binding agent or the ceramic binding agent is used for improving the holding force and the exit lip of the diamond by the resin mill, the abrasion of the resin mill is reduced, and the milling efficiency and the service life of the mill are obviously improved and prolonged.
Description
Technical field
The present invention is relevant for a kind of resin abrasive tools and processing method thereof with diamond abrasive grain group.
Background technology
Resin abrasive tools is a kind of polissoir, belongs to the parts technical field of polissoir.It can be widely used in carries out in the polishing rough surfaces such as stone material, pottery, glass, concrete, and whole polishing process is divided into corase grind, fine grinding, correct grinding, polishing four-stage.Existing resin abrasive tools is divided into diamond disk and emery wheel two classes, and this abrasive disc structure is for having grinding layer, matrix and the backing of song (directly) line tank, and backing has velcro or snail snap close or has the joint of nut.This emery wheel structure is grinding layer, matrix and endoporus.Existing this diamond disk and emery wheel all are to be abrasive material with the diamond, and it is cement that this diamond abrasive adopts liquid state or solid resin, mix metal or metal oxide and make resin abrasive tools as filler mixing back molded curing.Because this diamond abrasive directly adopts the resin-bonded agent affixed, therefore have following deficiency: one, not enough to the diamond abrasive hold, diamond easily comes off, and service life is short; Its two, it is little that the resin abrasive tools diamond goes out sword, grinding efficiency is not high.
Summary of the invention
The invention provides a kind of resin abrasive tools and processing method thereof with diamond abrasive grain group, it has overcome, and the existing diamond abrasive of background technology grinding tool easily comes off, service life short; Diamond goes out the deficiency that sword is little, grinding efficiency is not high.
One of the technical solution adopted for the present invention to solve the technical problems is:
Resin abrasive tools with diamond abrasive grain group, include a plurality of diamond abrasive grain group in this resin abrasive tools, those diamond abrasive grain groups bond together by resinoid bond, wherein, this diamond abrasive grain group comprises a plurality of diamond abrasive grains, and those diamond abrasive grains utilize metallic bond or vitrified bond to be fixed together.
In the preferred embodiment of the present invention, this comprises the diamond abrasive grain group of a plurality of diamond abrasive grains, be after utilizing metallic bond or vitrified bond to mix, adopt sintering process to make piece again, and then this diamond abrasive grain piece of Mechanical Crushing to be to generate diamond abrasive grain group.
In the preferred embodiment of the present invention, this diamond abrasive grain group that comprises a plurality of diamond abrasive grains adopts soldering processes directly to make.
In the preferred embodiment of the present invention, this diamond abrasive grain group that comprises a plurality of diamond abrasive grains adopts electroplating technology directly to make.
Two of the technical solution adopted for the present invention to solve the technical problems is:
Have the processing method of the resin abrasive tools of diamond abrasive grain group, it comprises the steps:
Step 1, diamond abrasive grain group production stage, in order to prepare diamond abrasive grain group, this diamond abrasive grain group comprises a plurality of diamond abrasive grains, those diamond abrasive grains utilize metallic bond or vitrified bond sintering to be fixed together; And
Step 2, the resin abrasive tools production stage bonds together those diamond abrasive grain groups in order to adopt resinoid bond, to form resin abrasive tools.
In the preferred embodiment of the present invention, the diamond abrasive grain of this step 1 group production stage, it comprises:
Step a, a plurality of diamond abrasive grains adopt sintering process to make piece after utilizing metallic bond or vitrified bond to mix again; And
Step b, broken this diamond abrasive grain piece is to generate diamond abrasive grain group.
In the preferred embodiment of the present invention, the diamond abrasive grain of this step 1 group production stage, it comprises:
Step a, a plurality of diamond abrasive grains adopt soldering processes to make abrasive particle group.
In the preferred embodiment of the present invention, the diamond abrasive grain of this step 1 group production stage, it comprises:
Step a, a plurality of diamond abrasive grains adopt electroplating technology to make abrasive particle group.
In the preferred embodiment of the present invention, the resin abrasive tools production stage of this step 2, it comprises:
Step 1 is put into mould with this diamond abrasive grain group, adds the resin-bonded agent, maybe will join in the mould after this diamond abrasive grain group and the resinoid bond mixing; And
Step 2 is pressurizeed by heating or this diamond abrasive grain in the mould is rolled into a ball in the normal temperature pressurization and the mixture of resinoid bond is cured, to be shaped to resin abrasive tools.
Compare with background technology, the present invention has following useful effect: because this grinding tool is by the abrasive particle group that formerly processes is adopted resin-bonded agent bonding combination forming, and abrasive particle group by diamond abrasive by metal or ceramic bond is affixed forms, because the metal bond agent is more a lot of greatly to durability of diamond than directly adopting resin to durability of diamond, therefore overcome the existing deficiency of background technology, and have a following advantage: one, utilize metal or ceramic bond to improve resin abrasive tools to durability of diamond with adamantinely go out sword; Its two, reduce the resin abrasive tools wearing and tearing, significantly improve the service life and the grinding efficiency of grinding tool; Its three, big and rough surface of abrasive particle group surface area and resin bonding are firm, difficult drop-off.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the schematic top plan view of resin abrasive disc of the present invention.
Fig. 2 looks schematic diagram for the master of resin abrasive disc of the present invention.
Fig. 3 is the A place enlarged diagram of Fig. 2.
Fig. 4 is the schematic diagram of the diamond abrasive grain group among Fig. 3.
Fig. 5 is the cross-sectional schematic of resin emery wheel of the present invention.
Fig. 6 is the B place enlarged diagram of Fig. 5.
The specific embodiment
Have the processing method of the resin abrasive tools of diamond abrasive grain group, it comprises the steps:
Step 1, diamond abrasive grain group production stage, in order to prepare diamond abrasive grain group, this diamond abrasive grain group comprises a plurality of diamond abrasive grains, those diamond abrasive grains utilize metallic bond or vitrified bond to be fixed together; It comprises:
Step a, a plurality of diamond abrasive grains utilize metallic bond or vitrified bond to mix, and adopt sintering process to make piece again; And
Step b adopts this diamond abrasive grain piece of Mechanical Crushing to generate diamond abrasive grain group, and the size and the shape of this abrasive particle group are any;
Step 2, the resin abrasive tools production stage bonds together those diamond abrasive grain groups in order to adopt resinoid bond, and to form resin abrasive tools, it comprises:
Step 1 is being put into mould to diamond abrasive grain group earlier;
Step 2, the resinoid bond that again will be mixes with metal or metal oxide joins in the mould as material powder or liquid sizing material, maybe will this diamond abrasive grain group and the resinoid bond mixing after join in the mould; And
Step 3 by to mold heated pressurization or normal temperature pressurization and continue for some time, is shaped to resin abrasive tools to the mixture of this diamond abrasive grain group and resinoid bond.
Wherein, adopt sintering process to make again because this diamond abrasive grain group utilizes metallic bond or vitrified bond to mix by a plurality of diamond abrasive grains, so diamond abrasive grain is bonding firmly, reliable.
Wherein, adopt different moulds, can process the diamond disk and the emery wheel of different shape.
Again in another specific embodiment, the diamond abrasive grain of this step 1 group production stage, it comprises: step a, a plurality of diamond abrasive grains group adopts soldering processes to make, wherein, in this diamond abrasive grain group between each abrasive particle bonding firmly, reliable.
In another specific embodiment, the diamond abrasive grain of this step 1 group production stage, it comprises: step a, a plurality of diamond abrasive grains group adopts electroplating technology to make, wherein, in this diamond abrasive grain group between each abrasive particle bonding firmly, reliable.
In another specific embodiment, the resin abrasive tools production stage of this step 2, it comprises: step 1 adds diamond abrasive grain group earlier in mould; Step 2, again should liquid state or the resinoid bond of powdery join in the mould maybe will this diamond abrasive grain group and the resinoid bond mixing after join in the mould; Step 3 is by to mold heated pressurization or normal temperature pressurization and continue for some time, to be shaped to resin abrasive tools.
Please refer to Fig. 1, Fig. 2, Fig. 3 and Fig. 4, it has illustrated a kind of schematic diagram of resin abrasive disc.This resin abrasive disc comprises that one has grinding layer 10, matrix and the backing 20 of song (directly) line tank, and they bond together by resinoid bond.This backing 20 has velcro or snail snap close or has the joint of nut.This grinding layer 10 includes a plurality of diamond abrasive grains and rolls into a ball 11, those diamond abrasive grain groups bond together by resinoid bond 14, wherein, this diamond abrasive grain group comprises a plurality of diamond abrasive grains 12, and those diamond abrasive grains 12 utilize metallic bond or vitrified bond 13 to be fixed together.
Please refer to Fig. 5 and Fig. 6, it has illustrated a kind of schematic diagram of resin emery wheel.This emery wheel comprises grinding layer 40, matrix 50 and endoporus 60.They bond together by resinoid bond.This grinding layer 50 includes a plurality of diamond abrasive grains and rolls into a ball 41, those diamond abrasive grain groups bond together by resinoid bond, wherein, this diamond abrasive grain group comprises a plurality of diamond abrasive grains, and those diamond abrasive grains utilize metallic bond or vitrified bond to be fixed together.
The above person only is the present invention's preferred embodiment wherein, is not to be used for limiting practical range of the present invention, and promptly all equalizations of being done according to the present patent application claim change and modify, and are all claim of the present invention and contain.
Claims (9)
1. the resin abrasive tools that has diamond abrasive grain group, it is characterized in that: include a plurality of diamond abrasive grain group in this resin abrasive tools, those diamond abrasive grain groups bond together by resinoid bond, wherein, this diamond abrasive grain group comprises a plurality of diamond abrasive grains, and those diamond abrasive grains utilize metallic bond or vitrified bond to be fixed together.
2. the resin abrasive tools with diamond abrasive grain group according to claim 1, it is characterized in that: a plurality of diamond abrasive grains of this diamond abrasive grain group utilize metallic bond or vitrified bond to mix, adopt sintering process to make piece again, adopt mechanical system to be broken into abrasive particle group then.
3. the resin abrasive tools with diamond abrasive grain group according to claim 1 is characterized in that: this diamond abrasive grain group adopts soldering processes to make.
4. the resin abrasive tools with diamond abrasive grain group according to claim 1 is characterized in that: this diamond abrasive grain group adopts electroplating technology to make.
5. have the processing method of the resin abrasive tools of diamond abrasive grain group, it is characterized in that: it comprises the steps:
Step 1, diamond abrasive grain group production stage, in order to prepare diamond abrasive grain group, this diamond abrasive grain group comprises a plurality of diamond abrasive grains, those diamond abrasive grains utilize metallic bond or vitrified bond to be fixed together; And
Step 2, the resin abrasive tools production stage bonds together those diamond abrasive grain groups in order to adopt resinoid bond, to form resin abrasive tools.
6. the processing method with resin abrasive tools of diamond abrasive grain group according to claim 5 is characterized in that: the diamond abrasive grain group production stage of this step 1, and it comprises:
Step a, a plurality of diamond abrasive grains utilize metallic bond or vitrified bond mixing to adopt sintering process to make piece again; And
Step b, broken this diamond abrasive grain piece is to generate diamond abrasive grain group.
7. the processing method with resin abrasive tools of diamond abrasive grain group according to claim 5 is characterized in that: the diamond abrasive grain group production stage of this step 1, and it comprises:
Step a, a plurality of diamond abrasive grains adopt soldering processes to make diamond abrasive grain group.
8. the processing method with resin abrasive tools of diamond abrasive grain group according to claim 5 is characterized in that: the diamond abrasive grain group production stage of this step 1, and it comprises:
Step a, a plurality of diamond abrasive grains adopt electroplating technology to make abrasive particle group.
9. according to claim 5,6,7,8 described processing methods, it is characterized in that with resin abrasive tools of diamond abrasive grain group: the resin abrasive tools production stage of this step 2, it comprises:
Step 1 is put into mould with this diamond abrasive grain group, adds the resin-bonded agent, maybe will join in the mould after this diamond abrasive grain group and the resinoid bond mixing; And
Step 2 by mould being adopted hot pressing or the mixture of cold pressing this diamond abrasive grain group and resinoid bond and continuing for some time, is resin abrasive tools with the curing molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100709686A CN101564832A (en) | 2008-04-24 | 2008-04-24 | Resin mill with diamond mill-grain groups and processing method thereof |
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| CNA2008100709686A CN101564832A (en) | 2008-04-24 | 2008-04-24 | Resin mill with diamond mill-grain groups and processing method thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103521752A (en) * | 2013-09-26 | 2014-01-22 | 秦皇岛星晟科技有限公司 | Method for machining abrasive wheel with metal and resin composite material matrix |
| CN104097153A (en) * | 2014-07-08 | 2014-10-15 | 郑州磨料磨具磨削研究所有限公司 | Superhard material abrasive layer, grinding wheel, and manufacturing method of superhard material abrasive layer |
| CN104175240A (en) * | 2014-07-30 | 2014-12-03 | 郑州磨料磨具磨削研究所有限公司 | Electroplated superhard abrasive grinding tool, preparation method thereof as well as preparation method of abrasive units |
| CN105538177A (en) * | 2015-12-09 | 2016-05-04 | 河南广度超硬材料有限公司 | Composite binder grinding wheel and manufacturing method thereof |
| CN105856089A (en) * | 2016-06-01 | 2016-08-17 | 东莞市中微纳米科技有限公司 | Grinding composite body and preparation method thereof |
| CN108453636A (en) * | 2018-01-18 | 2018-08-28 | 南京航空航天大学 | A kind of composite wheel and preparation method thereof containing super hard abrasive |
| CN111113271A (en) * | 2019-12-30 | 2020-05-08 | 无锡市星火金刚石工具有限公司 | Method for manufacturing diamond grinding wheel cutter |
| CN112720285A (en) * | 2020-12-24 | 2021-04-30 | 深圳市宏通新材料有限公司 | Method for manufacturing diamond grinding tool |
| CN116042179A (en) * | 2022-12-26 | 2023-05-02 | 河南省惠丰金刚石有限公司 | Preparation method of self-sharpening agglomerated abrasive for resin grinding tool |
| CN116218469A (en) * | 2022-12-26 | 2023-06-06 | 河南省惠丰金刚石有限公司 | Self-sharpening agglomerated abrasive |
-
2008
- 2008-04-24 CN CNA2008100709686A patent/CN101564832A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103521752A (en) * | 2013-09-26 | 2014-01-22 | 秦皇岛星晟科技有限公司 | Method for machining abrasive wheel with metal and resin composite material matrix |
| CN104097153A (en) * | 2014-07-08 | 2014-10-15 | 郑州磨料磨具磨削研究所有限公司 | Superhard material abrasive layer, grinding wheel, and manufacturing method of superhard material abrasive layer |
| CN104175240A (en) * | 2014-07-30 | 2014-12-03 | 郑州磨料磨具磨削研究所有限公司 | Electroplated superhard abrasive grinding tool, preparation method thereof as well as preparation method of abrasive units |
| CN105538177A (en) * | 2015-12-09 | 2016-05-04 | 河南广度超硬材料有限公司 | Composite binder grinding wheel and manufacturing method thereof |
| CN105856089A (en) * | 2016-06-01 | 2016-08-17 | 东莞市中微纳米科技有限公司 | Grinding composite body and preparation method thereof |
| CN108453636A (en) * | 2018-01-18 | 2018-08-28 | 南京航空航天大学 | A kind of composite wheel and preparation method thereof containing super hard abrasive |
| CN111113271A (en) * | 2019-12-30 | 2020-05-08 | 无锡市星火金刚石工具有限公司 | Method for manufacturing diamond grinding wheel cutter |
| CN112720285A (en) * | 2020-12-24 | 2021-04-30 | 深圳市宏通新材料有限公司 | Method for manufacturing diamond grinding tool |
| CN112720285B (en) * | 2020-12-24 | 2022-05-17 | 深圳市宏通新材料有限公司 | Method for manufacturing diamond grinding tool |
| CN116042179A (en) * | 2022-12-26 | 2023-05-02 | 河南省惠丰金刚石有限公司 | Preparation method of self-sharpening agglomerated abrasive for resin grinding tool |
| CN116218469A (en) * | 2022-12-26 | 2023-06-06 | 河南省惠丰金刚石有限公司 | Self-sharpening agglomerated abrasive |
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Open date: 20091028 |