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CN101496458A - 用于将电气或电子部件、尤其是印刷电路板固定在壳体中的方法及其固定元件 - Google Patents

用于将电气或电子部件、尤其是印刷电路板固定在壳体中的方法及其固定元件 Download PDF

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CN101496458A
CN101496458A CNA2007800277741A CN200780027774A CN101496458A CN 101496458 A CN101496458 A CN 101496458A CN A2007800277741 A CNA2007800277741 A CN A2007800277741A CN 200780027774 A CN200780027774 A CN 200780027774A CN 101496458 A CN101496458 A CN 101496458A
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CN101496458B (zh
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U·亨内尔
A·盖斯勒
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Robert Bosch GmbH
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49947—Assembling or joining by applying separate fastener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49947—Assembling or joining by applying separate fastener
    • Y10T29/49954—Fastener deformed after application
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5327—Means to fasten by deforming

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  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本发明涉及一种用于将电气或电子部件、尤其是印刷电路板(2)固定在起部件支座作用的壳体中的方法，还涉及一种用于通过夹紧方式来固定所述部件(2)的固定元件(14)。所述部件(2)配备有至少一个固定元件(14)，所述固定元件(14)包括能够弹性挠曲的压紧部分(20)，在将所述部件(2)夹紧在所述壳体中时，所述压紧部分(20)与所述壳体(6，34，48，58)的一部分接触并且在发生变形的情况下压靠在所述壳体部分上。

Description

用于将电气或电子部件、尤其是印刷电路板固定在壳体中的方法及其固定元件
技术领域
本发明涉及一种根据权利要求1前序部分所述的用于将电气或电子部件、尤其是印刷电路板固定在起部件支座作用的壳体中的方法，还涉及一种根据权利要求4前序部分所述的用于通过夹紧方式将电气或电子部件固定在壳体中的固定元件，本发明还涉及一种根据权利要求14前序部分所述的电气或电子部件、尤其是印刷电路板。
背景技术
用于将电气或电子部件、尤其是印刷电路板固定在周围壳体中的技术方案多种多样。例如，印刷电路板可被拧紧或粘紧在壳体中，或者通过用夹子夹紧的方式与壳体连接。然而，这些连接都有缺点。粘接在形成后无法松开，另外由于所用的粘接剂的化学成分可能导致印刷电路板或组装在印刷电路板上的部件损坏，而螺纹连接和用夹子夹紧连接虽然可以松开，但是对印刷电路板和壳体的公差要求高。后一问题也同样存在于公知的夹紧连接中，例如印刷电路板在合上壳体时被直接夹紧在两个半壳体之间。此外，印刷电路板在此处的机械负载可能非常高。
发明内容
因此，本发明的目的在于进一步改进以上所述类型的方法、固定元件以及电气或电子部件，使得在没有特别的公差要求的情况下可将部件可靠、牢固且持久地固定在壳体中。
此目的根据本发明如下实现，所述部件配备有至少一个固定元件，该固定元件包括能够弹性挠曲的压紧部分，在所述部件被夹紧在壳体中时，该压紧部分与壳体的一部分接触并且在发生变形的情况下压靠在所述壳体部分上。
本发明的构思如下，在电气或电子部件与壳体之间的交界处(也就是在夹紧力从壳体传递到部件的地方)，选择通过嵌在部件和壳体之间的能够弹性挠曲的中间件的间接夹紧力传递取代直接夹紧力传递，以便在夹紧连接区域中补偿公差或可能存在的间隙。因为能够弹性挠曲的压紧部分可根据相应的安装条件或多或少地变形，所以对壳体和部件本身的公差要求可显著降低。另外，通过至少一个固定元件的能够弹性挠曲的压紧部分可以补偿部件与壳体的热膨胀差异。此外，借助能够弹性挠曲的压紧部分能增大部件与壳体之间的接触面，这因较小的单位面积压力而使由夹紧连接产生的机械载荷减少，由此导致部件的使用寿命延长。另外，在材料的选择适当时，能够弹性挠曲的压紧部分还起到减振件的作用，该减振件抑制振动从壳体传递到部件，由此至少部分地使部件与壳体之间在振动技术上解耦。
在根据本发明的方法的一种优选设计方案中，固定元件通过焊接方式固定在部件上，尤其在部件是印刷电路板的情况下。这类固定方式的优点在于，固定元件以与其它待组装到印刷电路板上的部件相同的方式通过现有的自动装配机来安装，从而在印刷电路板的制造过程中以很小的额外花费就可为其装备一个或多个固定元件。
对于同样能通过夹紧方式固定在壳体中的其它电子或电气部件(例如电解电容器、接点片或类似件)，可以适当地通过粘紧方式将固定元件固定在所述部件上，这在将部件组装到壳体中之前同样无需大的额外花费就能实现。
有利地，固定元件的压紧部分至少部分地由弹性塑料材料(例如聚四氟乙烯(PTFE))或弹性体材料(例如聚氨酯泡沫或热塑性弹性体(TPE))制成。但是也可以使用弹性橡胶材料，例如三元乙丙橡胶(EPDM)或硅树脂，只要在施加夹紧力时这些材料能够弹性挠曲并且能毫无困难地安装到固定元件的适当支架上即可。
在本发明的另一种优选设计方案中，通过使固定元件的压紧部分和作用在该压紧部分上的壳体部分至少部分地由导电材料制成，固定元件也用于在电气或电子部件(例如印刷电路板)和周围壳体之间形成触点接通，该压紧部分可优选由填充有石墨的弹性体组成，而该壳体部分可优选构造成金属接触指。通过这种方式省去了在电气或电子部件与其壳体之间的附加接触措施。
附图说明
下面在一些实施方式中借助附图详细描述本发明。
图1示出了装备有四个固定元件的印刷电路板的立体图；
图2示出了图1的一个固定元件的俯视图；
图3示出了图2的固定元件在组装到印刷电路板上之前的侧视图；
图4示出了图2的固定元件在组装到印刷电路板上之后的侧视图；
图5示出了另一种固定元件的俯视图；
图6示出了图5的固定元件在组装到印刷电路板上之前的侧视图；
图7示出了图5的固定元件在组装到印刷电路板上之后的局部侧剖视图；
图8示出了图7中的剖面A的放大视图；
图9示出了带有接地的固定元件的印刷电路板的一部分的侧视图和俯视图，该固定元件具有不导电的压紧部分；
图10示出了带有接地的固定元件的印刷电路板的一部分的侧视图和俯视图，该固定元件具有导电的压紧部分；
图11至17示出了具有不同形状的压紧部分的固定元件的侧视图或剖视图。
具体实施方式
通过从上方将印刷电路板2以其底面压靠在固定的平的底座4(例如壳体的底部)上，在图中(在图1中最佳)所示的印刷电路板2借助夹紧连接被固定在壳体中。借助多个圆柱形定位芯棒或类似的纵向延伸的壳体凸起6将印刷电路板2压紧在底座4上，这些凸起6例如伸出超过壳体的盖(未示出)的底面并且在合上盖时从组装在印刷电路板上侧的多个电子部件(例如电容器8、存储芯片10、处理器12等等)旁边向下伸至印刷电路板2附近，在此处，凸起6分别将夹紧力(箭头F)施加到在每个凸起6下方刚性地组装在印刷电路板2上侧上的固定元件14，将固定元件14并且通过固定元件14将印刷电路板2向下压紧在底座4上，由此实现印刷电路板2在壳体中的固定。
如图2、3和4中清楚所示，固定元件14主要包括基座16，基座16借助四个侧向伸出的引脚18焊紧在印刷电路板2上，并且在基座16背朝印刷电路板2的上侧设有能够弹性挠曲或可变形的压紧部分20，壳体凸起6与该压紧部分20接合，以将印刷电路板2夹紧在壳体凸起6和底座4之间。
底座16和引脚18由焊接性好的导电金属(例如铜)组成，而压紧部分20根据待补偿的公差和所施加的夹紧力而由弹性体材料(例如聚氨酯泡沫或热塑性弹性体(TPE))、能够弹性挠曲的热塑性塑料材料(例如聚四氟乙烯(PTFE))或弹性橡胶材料(例如三元乙丙橡胶(EPDM)或硅树脂)制成，在施加夹紧力时，所述材料以较大或较小的程度发生弹性变形并且在卸载后回复到其初始状态。
在给印刷电路板2装备固定元件14之前，在与基座连成一体的扁平引脚18的预设支承面下方，将软焊料22涂在印刷电路板2的上侧并且在配备固定元件14的过程中熔化该软焊料，从而将图2、3和4中所示的固定元件14以回流焊接工艺组装到印刷电路板2上；而图5、6、7和8所示的固定元件14以常规的焊接工艺固定在印刷电路板2上，这通过以下方式实现，即当将与图2、3和4所示的固定元件14的基座16不同的基座16以其底面放置在印刷电路板2的上侧时，将向下伸出超过基座16的弯曲的金属丝状的引脚18从上方插入印刷电路板2的通孔24中并通过焊牢方式将其刚性地与印刷电路板2连接(见图7)。
图1的固定元件在印制导线(未示出)旁边被固定在印刷电路板2上，与该固定元件不同，图9和10示出了固定元件14，其引脚18被焊接在两根印制导线段26、28上，这两根印制导线段与接地的接地印制导线30并联。然而，与上述固定元件14的压紧部分20一样，图9所示的固定元件14的压紧部分20由不导电的材料制成，从而在壳体的逐渐变细的接触指34和印刷电路板2的接地导线30之间的电流路径在压紧部分20的区域中被断开，所述接触指用于夹紧印刷电路板2并且从上方压紧在压紧部分20上；而图10所示的固定元件14的压紧部分20由弹性导电材料(例如填充石墨的弹性体)组成，从而通过压紧部分20在接触指34和固定元件14的基座16之间建立触点接通，由此接触指34和接地导线30之间的电流路径在将接触指34压靠在固定元件14的压紧部分20上时被闭合。例如，组装在印刷电路板2上的部件8、10、12与接地导线30连接的接地线能够以这种方式通过接触指34与位于壳体外部的外部接地线连接。
虽然图1至10中所示的固定元件14的压紧部分20在无变形状态下具有方形结构，但是更有利的是，压紧部分20在需要时可根据相应的应用场合而具有其它形状，如在图11至17中所示。
例如，图11示出了固定元件14，其带有砧形横截面的压紧部分20，通过该压紧部分20能够补偿可能存在于印刷电路板2或基座16的上侧和贴紧在压紧部分20的上侧上的平坦的壳体部分(未示出)之间的轻微倾斜。在此，如果倾斜仅出现在一个方向，那么压紧部分20在俯视图中可具有方形或矩形或其它非旋转对称的轮廓，如果倾斜能以无特定方向的方式出现，那么压紧部分20可具有圆形轮廓。
图12示出了带有梯形横截面的压紧部分20的固定元件，例如当压紧部分20以其上侧直接贴紧在壳体盖或其类似物的底面上时，在基座16的上侧的面积相同的情况下，压紧部分20在壳体上的接触面可通过梯形横截面的压紧部分达到最大。
图13示出了固定元件14，其压紧部分20的横截面具有平的上侧36和下侧38以及凸圆形的侧面40以吸收高的载荷或夹紧力，并且该压紧部分20优选地由弹性橡胶材料制成，该材料通过在压紧部分20的上侧36上沿竖直方向作用的夹紧力F(见图1)而被压缩的程度很小。
图14示出了固定元件14，其包括用于相对于壳体对印刷电路板2定中心的压紧部分20，该压紧部分20在其上侧36设有旋转对称的凹槽42，该凹槽42与壳体凸起6或接触指34的互补形成的前端(未示出)共同作用，以使凹槽42的中心轴线和壳体凸起的中心轴线同轴。
图15示出了固定元件14，其压紧部分20具有球形表面44并且因此很适合于不确定的安装位置，在这些安装位置中，作用在压紧部分20上的夹紧力F(见图1)沿着与印刷电路板的上侧或下侧非正交的方向和/或以远离中心的方式施加在固定元件14的压紧部分20上。
图16示出了带有压紧部分20的固定元件14，该压紧部分20设有圆柱形的凹槽46，当包围芯棒或销50的环形凸肩52围绕凹槽46贴靠或压靠在压紧部分20的平的上侧上时，向下伸出超过壳体部分48的芯棒或销50插在该凹槽中，凹槽46和芯棒50之间存在径向间隙。
对于图17所示的固定元件14而言，情况也相似，固定元件14的能够弹性挠曲的压紧部分20具有向上伸出的圆柱形凸起54，当壳体部分58被从上方压靠在固定元件14的压紧部分20上以将印刷电路板2夹紧于壳体中时，该凸起54同样以存在径向间隙的方式插入与固定元件14共同作用的壳体部分58的互补的容纳凹槽56中。与图16中的压紧部分不同，凸起54和凹槽56具有更大的横截面尺寸并且具有这样的高度或深度，即在壳体部分58和压紧部分20之间最初接触时，仅仅将凸起54的端面压靠在凹槽56的底部上，并且只有在开始对压紧部分20进行压缩的过程中才围绕凹槽56或凸起54建立壳体部分58和压紧部分20之间的接触。

Claims (14)

1.用于将电气或电子部件、尤其是印刷电路板固定在壳体中的方法，在该方法中，所述部件被夹紧在壳体中，其特征在于：所述部件(2)配备有至少一个固定元件(14)，所述固定元件(14)包括能够弹性挠曲的压紧部分(20)，在将所述部件(2)夹紧在所述壳体中时，所述压紧部分(20)与所述壳体(6，34，48，58)的一部分接触并且在发生变形的情况下压靠在所述壳体部分上。
2.根据权利要求1所述的方法，其特征在于，所述固定元件(14)通过焊接方式固定在所述部件(2)上。
3.根据权利要求1所述的方法，其特征在于，所述固定元件通过粘接方式固定在所述部件上。
4.固定元件，用于通过夹紧方式将电气或电子部件固定在壳体中，尤其是用于将印刷电路板固定在壳体中，其特征在于，设有用于刚性地固定在所述部件(2)上的固定装置(18，22)以及能够弹性挠曲的压紧部分(20)，在将所述部件(2)夹紧在所述壳体中时，所述压紧部分(20)与所述壳体(6，34，48，58)的一部分接触并且在发生变形的情况下压靠在所述壳体部分上。
5.根据权利要求4所述的固定元件，其特征在于，设有刚性支架(18)，所述刚性支架(18)设有所述固定装置(18，22)的至少一部分(18)以固定到所述部件(2)上并且支承所述能够弹性挠曲的压紧部分(20)。
6.根据权利要求4或5所述的固定元件，其特征在于，所述固定装置包括用于将所述固定元件粘接在所述部件上的粘接剂。
7.根据权利要求4或5所述的固定元件，其特征在于，所述固定装置(18，22)包括多个焊接引脚(18)，所述焊接引脚(18)伸出超过所述固定元件(14)并且能通过焊接方式与所述部件(2)连接。
8.根据权利要求4至7中任一项所述的固定元件，其特征在于，所述压紧部分(20)至少部分地由弹性塑料材料、弹性体材料或弹性橡胶材料制成。
9.根据权利要求4至8中任一项所述的固定元件，其特征在于，所述压紧部分(20)至少部分地由导电材料制成。
10.根据权利要求4至9中任一项所述的固定元件，其特征在于，所述压紧部分(20)具有用于相对于所述壳体定中心的装置(42)。
11.根据权利要求4至10中任一项所述的固定元件，其特征在于，所述压紧部分(20)具有砧形或梯形横截面。
12.根据权利要求4至10中任一项所述的固定元件，其特征在于，所述压紧部分(20)具有圆化的或部分球形的接触面(40、44)。
13.根据权利要求4至12中任一项所述的固定元件，其特征在于，所述压紧部分(20)具有用于与所述壳体的凸起(50)或凹槽(56)共同作用的凸起(50)或凹槽(46)。
14.电气或电子部件、尤其是印刷电路板，其特征在于，设有固定在其上的至少一个根据权利要求4至13中任一项所述的固定元件(14)。
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