CN101257063A - Drip glue encapsulation method of solar paster component - Google Patents
Drip glue encapsulation method of solar paster component Download PDFInfo
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- CN101257063A CN101257063A CNA2008100473090A CN200810047309A CN101257063A CN 101257063 A CN101257063 A CN 101257063A CN A2008100473090 A CNA2008100473090 A CN A2008100473090A CN 200810047309 A CN200810047309 A CN 200810047309A CN 101257063 A CN101257063 A CN 101257063A
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Abstract
The present invention discloses a dripping adhesive encapsulation method of a solar paster component, the steps are: A, placing the solar paster plate in the bake oven for baking; B, the mix gum is stirred to colloid transparent by stirring implement after the A gum and the B gum are mixed by volume ratio; C, the homogeneous mix gum is injected into dripping gum tools to inject mix gum on the front face of the paster; D, the mix gum on the paster plate is uniform by the glass rod; E, the dripping rubber plate is arranged in the vacuum box to start-up the vacuum switch; F, the dripping slab rubber with a vacuum treating is placed in the bake oven to solid the dripping slab rubber in the bake oven; G, the dripping slab rubber is taken out from the bake oven, and the redundant gum is removed at the temperature below 50EDG C. The method of present invention is good, the produced dripping rubber plate has high light transmittance ratio, good sealability, beautiful external shape, long length of life, reasonable process design, easy operations, short curing time, tight combination between the colloid and the silicon plate.
Description
Technical field
The invention belongs to the semi-finished product processing technique field of solar photovoltaic battery component, more specifically relate to a kind of drip glue encapsulation method of solar paster component, be particularly useful for the semi-finished product processing of solar photovoltaic battery component.
Background technology
Solar module is meant the solar photovoltaic device of being made up of solar battery sheet, encapsulating material, terminal box etc.Solar paster component is meant through paster technique the silica-based solar cell sheet is welded in the silicon crystal slate assembly that epoxy resin board or plastic plate are made.Its no pad in surface, the little and homogeneous in the gap between solar battery sheet can improve the photoelectric conversion rate of solar module.Silicon crystal slate can be the monocrystalline silicon plate, also can be polysilicon films.
The silica-based solar cell sheet encapsulation process method that is used for solar module preparation technology at present mainly contains following two kinds: a kind of is the surface that is covered in silicon crystal slate with the solar energy packaged glass, the centre is filled out with EVA, but forms the assembly of practical application behind lamination.Because of solar energy packaged glass self intensity height, so help protecting following silicon crystal slate to avoid the damage of extraneous hail, snow, rain, dust storm etc.; And the packaged glass light transmittance is higher than simple glass, thereby sunlight fully seen through be beneficial to solar cell and carry out opto-electronic conversion.Therefore the solar components that adopts the packaged glass lamination to come out can be applicable to aspects such as various solar photovoltaic power plants, power station intelligence control system, optoelectronic integration building, wind-light complementary system, all kinds of photo-voltaic power supply, light letter communication signal system, multifuctional solar user power supply and anti-low temperature high brightness solar energy garden lamp, Lawn lamp, signal lamp, street lamp.
The method of another kind of silica-based solar cell sheet encapsulation process is that solar paster component or solar components surface are dripped glue; its effect also is in order to provide enough intensity to avoid artificial or natural factors to protect following silicon crystal slate; damage as hail, snow, rain, dust storm etc.; prolong the useful life of solar module; guarantee the Gaoyang light transmission rate simultaneously, and satisfy the requirement of user product appearance.
This preparation method mainly is made up of the following step: prebake conditions, impregnation, injecting glue, take off glue, vacuumize, solidify, cut glue.Chinese patent grant number CN1825633A discloses the sealing adhesive process of solar photovoltaic cell panel, but it does not relate to the complete process flow of make dripping offset plate, and Control Parameter and the preparation method that the present invention relates to are different.
Summary of the invention
The objective of the invention is to be to provide a kind of drip glue encapsulation method of solar paster component, encapsulation is convenient, and is easy to implement the method, can guarantee that glue-line has excellent transparency, good airproof performance, and curing time is short, and combining between colloid and the silicon crystal slate is tight.
Below the present invention is described in detail, but the present invention is not limited only to this.The present invention, the drip glue encapsulation method of promptly a kind of solar paster component or solar module, the step that relates to is as follows:
1) the solar paster plate is placed baking oven baking 8-12 minute, baking temperature is 70-80 ℃;
2) measure A glue, B glue by 2: 1 volume ratios, it is transparent fully to colloid with mixer epoxy glue to be stirred after mixing, and mixing speed is: 200-300 rev/min;
3) epoxy glue that stirs is poured in the glue instrument, with dripping the glue instrument to the positive epoxy glue that injects of patch plate, coating weight is 800-1800g/m
2
4) make the epoxy glue above the patch plate even with glass bar, make it evenly cover whole patch plate;
5) will drip offset plate and place in the vacuum tank, start vacuum switch, and make vacuum degree reach-1 * 10
5Pa also kept 3-5 minute;
6) will put into 80-90 ℃ baking oven through vacuum treated offset plate, and with the oven door good seal, allow an offset plate solidify in baking oven, the time is 80-90 minute;
7) will drip offset plate takes out in the baking oven and is cooled to back below 50 ℃ and removes the unnecessary glue in the back side.
The drip glue encapsulation method of solar paster component of the present invention, the ratio of A, B glue is a volume ratio in the step 2, the recommendation ratio is 2: 1, can be by regulating ambient temperature or adding industrial alcohol and control viscosity to reach the purpose of reasonable coating, the viscosity that the applicant recommends is: 20-40 second (using liquid viscosimeter (cup-1 or-4)).
The drip glue encapsulation method of solar paster component of the present invention, A glue is meant epoxide-resin glue, B glue is to be the low-molecular-weight synthetic resin of Main Ingredients and Appearance with polyamine or multi-anhydride.
In the drip glue encapsulation method of solar paster component of the present invention, step 2 can be carried out simultaneously with step 1, can shorten whole process flow, improves working (machining) efficiency.
In the drip glue encapsulation method of solar paster component of the present invention, dripping the glue instrument in the step 3 is decided by silicon crystal slate area size, if area can adopt the coating machine coating greatly, if other equivalent utensils such as the less available syringe of area, a glue kettle drip glue.
The drip glue encapsulation method of solar paster component of the present invention, the ambient temperature in impregnation place and coating place is controlled to be 15-35 ℃, and ambient humidity is controlled at below 70%.
The drip glue encapsulation method of solar paster component of the present invention, the glass pallet that is distributed with screw, can fixes the special use of dripping offset plate is used in described pallet suggestion, must guarantee steadily in the pallet operation process, accomplishes during operation to handle with care.
The drip glue encapsulation method of solar paster component of the present invention, described patch plate are meant monocrystalline or polycrystal silicon cell are welded on the base plate through chip mounter.
The drip glue encapsulation method of solar paster component of the present invention, described base plate are meant the base plate of finishing the electrode welding procedure and carrying out the silicon wafer cleaning surfaces.
The drip glue encapsulation method of solar paster component of the present invention, described PCB is meant printed circuit board (PCB), the surfacing no concave-convex.Described printed circuit board (PCB) through after the careful neat planning, is etched in circuit copper cash complicated between the part on the plank.Printed circuit board (PCB) all has the design prebored hole so that electronic component to be installed usually with the made flat board of electrically non-conductive material on this flat board.The metal path that the hole of element helps to allow preliminary election be defined in and prints on the plate face couples together in the electronics mode, the pin of electronic component is passed PCB after, be attached on PCB with the metal electrode of conductivity again and go up and form circuit.
The drip glue encapsulation method of solar paster component of the present invention, described base plate is meant epoxy resin board or plastic plate, the surfacing no concave-convex.
The drip glue encapsulation method of solar paster component of the present invention, described base plate material can be any one in epoxy resin board or the plastic plate, but is not limited to above two kinds.
The present invention has the following advantages: owing to earlier base plate is carried out prebake conditions before dripping glue, so can improve the effect of glue levelling on base plate and can allow glue tightr with combining of base plate, reduce and divide the rate of taking off; The temperature of each step in the whole technical process, time, humidity, pressure etc. have all been done parameters selection, high transmission rate, appearance looks elegant, the encapsulation of an energy assurance offset plate tightly are regardless of takes off, have higher working (machining) efficiency simultaneously, reasonable in design, operate easy rapidly.
Embodiment
To more help to understand this preparation method's essence by example given below, but example can not be used for being construed as limiting the invention.
As photovoltaic conversion components and parts, must be very exquisite to the material that the solar paster component surface is covered, therefore drip the selected colloid of glue must select for use transparency height, smell little, ageing-resistant, solidify the damage-resistant energy that back hardness height is beneficial to improve solar paster component or solar components.At present, drip the used glue of glue select for use usually with epoxy resin be the A glue of main component and as the B glue of curing agent both are in harmonious proportion under the uniform temperature condition by a certain percentage.Mixed glue is easy to adhere to dust and tiny foreign material at uncured front surface, so the cleanliness factor of environment is had certain requirement, requires usually to carry out in airtight workshop, is equipped with exhausting system and dustproof work clothes simultaneously.
Embodiment 1:
1) chooses A glue that the Main Ingredients and Appearance of being produced by Dongguan power polyelectron Materials Co., Ltd is an epoxy resin and as the B glue of curing agent; Take by weighing by weight 2: 1, under 25 ℃ ambient temperatures, 60% environmental damp condition, it is transparent fully to use mixer to be stirred well to range estimation, and viscosity is 25 seconds, promptly gets stand-by epoxy glue.Meanwhile silicon crystal slate is fixed on the special glass pallet, makes to be screwed, put into baking oven and be heated to 80 ℃ of bakings 10 minutes;
2) silicon crystal slate after baking together takes out together with pallet and places workbench, drips glue with dripping the glue kettle, and coating weight is 850g/m
2
3) make the epoxy glue above the silicon crystal slate even with glass bar;
4) silicon crystal slate behind the gluing is put into vacuum tank reposefully together with pallet, be evacuated to-1 * 10
5Pa also kept 5 minutes;
5) silicon crystal slate is taken out reposefully together with pallet, flatly send into curing oven, shelf must the maintenance level can not have foreign material in the baking oven, and it is 80 minutes that oven temperature is controlled to be 85 ℃, time;
6) in baking oven, get same silicon crystal slate, promptly get after glue is then removed with cutter if having a surplus in the silicon crystal slate back side and drip the offset plate finished product.
Embodiment 2:
1) chooses A glue that the Main Ingredients and Appearance of being produced by Dongguan power polyelectron Materials Co., Ltd is an epoxy resin and as the B glue of curing agent, took by weighing by weight 2: 1, under 20 ℃ ambient temperatures, 70% environmental damp condition, it is transparent fully to use mixer to be stirred well to range estimation, viscosity is 28 seconds, promptly gets stand-by epoxy glue.Meanwhile silicon crystal slate is fixed on the special glass pallet, makes to be screwed, put into 80 ℃ of bakings of baking oven 10 minutes;
2) silicon crystal slate after baking together takes out together with pallet and places workbench, uses the syringe injecting glue, and coating weight is 920g/m
2
3) make the epoxy glue above the silicon crystal slate even with glass bar;
4) silicon crystal slate behind the gluing is put into vacuum tank reposefully together with pallet, be evacuated to-1 * 10
5Pa also kept 5 minutes;
5) silicon crystal slate is taken out reposefully together with pallet, flatly send into curing oven, shelf must the maintenance level can not have foreign material in the baking oven, and it is 90 minutes that oven temperature is controlled to be 80 ℃, time;
6) in baking oven, get same silicon crystal slate, promptly get after glue is then removed with cutter if having a surplus in the silicon crystal slate back side and drip the offset plate finished product.
Claims (1)
1, a kind of drip glue encapsulation method of solar paster component, it may further comprise the steps:
A, the solar paster plate was placed baking oven baking 8-12 minute, baking temperature is 70-80 ℃;
B, measure A glue, B glue by 2: 1 volume ratios, mix the back and with mixer epoxy glue is stirred transparently to colloid, mixing speed is: 200-300 rev/min;
C, the epoxy glue that stirs poured into drip in the glue instrument, with dripping the glue instrument to the positive epoxy glue that injects of patch plate, coating weight is 800-1800g/m
2
D, make the epoxy glue above the patch plate even, make it evenly cover whole patch plate with glass bar;
E, will drip offset plate and place in the vacuum tank, start vacuum switch, and make vacuum degree reach-1 * 10
5Pa also kept 3-5 minute;
F, will put into 80-90 ℃ baking oven through vacuum treated offset plate, and with the oven door good seal, allow and drip an offset plate and solidify in baking oven, the time is 80-90 minute;
G, will drip offset plate and take out in the baking oven and be cooled to back below 50 ℃ and remove the unnecessary glue in the back side;
The ambient temperature in described impregnation place and coating place is controlled to be 15-35 ℃, and ambient humidity is controlled at below 70%;
Described patch plate is meant monocrystalline or polycrystal silicon cell is welded on the base plate through the chip mounter paster;
Described PCB is a printed circuit board (PCB), the surfacing no concave-convex;
Described base plate material is any one in epoxy resin board or the plastic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100473090A CN101257063A (en) | 2008-04-11 | 2008-04-11 | Drip glue encapsulation method of solar paster component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100473090A CN101257063A (en) | 2008-04-11 | 2008-04-11 | Drip glue encapsulation method of solar paster component |
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| CN101257063A true CN101257063A (en) | 2008-09-03 |
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| CNA2008100473090A Pending CN101257063A (en) | 2008-04-11 | 2008-04-11 | Drip glue encapsulation method of solar paster component |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102468360A (en) * | 2010-11-03 | 2012-05-23 | 上海太阳能科技有限公司 | Silica gel injection module for junction box of solar module |
| CN102544227A (en) * | 2012-02-10 | 2012-07-04 | 广州奥鹏能源科技有限公司 | Integrated technology of solar dispensing |
| CN104201251A (en) * | 2014-09-19 | 2014-12-10 | 厦门惟华光能有限公司 | Solar cell packaging method |
| CN111609385A (en) * | 2020-06-24 | 2020-09-01 | 泉州格瑞特电子科技有限公司 | Fully-integrated solar panel |
-
2008
- 2008-04-11 CN CNA2008100473090A patent/CN101257063A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102468360A (en) * | 2010-11-03 | 2012-05-23 | 上海太阳能科技有限公司 | Silica gel injection module for junction box of solar module |
| CN102468360B (en) * | 2010-11-03 | 2014-08-06 | 上海太阳能科技有限公司 | Silica gel injection module for junction box of solar module |
| CN102544227A (en) * | 2012-02-10 | 2012-07-04 | 广州奥鹏能源科技有限公司 | Integrated technology of solar dispensing |
| CN104201251A (en) * | 2014-09-19 | 2014-12-10 | 厦门惟华光能有限公司 | Solar cell packaging method |
| CN111609385A (en) * | 2020-06-24 | 2020-09-01 | 泉州格瑞特电子科技有限公司 | Fully-integrated solar panel |
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Open date: 20080903 |