CN101221849A - Magnetic multilayer film with geometrical shape and preparation method and application thereof - Google Patents
Magnetic multilayer film with geometrical shape and preparation method and application thereof Download PDFInfo
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- CN101221849A CN101221849A CNA2007100633521A CN200710063352A CN101221849A CN 101221849 A CN101221849 A CN 101221849A CN A2007100633521 A CNA2007100633521 A CN A2007100633521A CN 200710063352 A CN200710063352 A CN 200710063352A CN 101221849 A CN101221849 A CN 101221849A
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Abstract
The invention relates to a magnetic multiplayer film with geometric shape, comprising all layers of a magnetic multiplayer film unit deposited on a substrate, wherein the cross section of the magnetic multiplayer film unit is polygonal closing ring shaped, magnetic moments or magnetic fluxes of film layers with ferromagnetism in the magnetic multiplayer film unit become in a clockwise or counter clockwise closing state; the invention also comprises a metal core arranged on the geometric center of the polygonal closed ring shaped magnetic multiplayer film, wherein the cross section of the metal core is a corresponding polygon; the invention also relates to a magnetic storage made of the magnetic multiplayer film which comprises(or does not comprise) the metal core; in the invention, the closing shape magnetic multiplayer film is prepared based on the micro processing method; the closing with(or without) metal core polygonal closing ring shaped magnetic multiplayer film is widely applicable to devices which takes the magnetic multiplayer film such as magnetic random access memory, computer magnetic reading head, magneto-dependent sensor, magnetic logic device and self-rotation transistor, etc. as the core.
Description
Technical field
The present invention relates to a kind of magnetism multi-film process method and purposes, particularly relate to the magnetoresistance effect of polygonal circuit shape such as triangle, pentagon, hexagon, octagon, decagon, ten hexagons of a kind of magnetoresistance effect with polygonal circuit shapes such as triangle, pentagon, hexagon, octagon, decagon, ten hexagons and containing metal core and their preparation method and based on the magnetic RAM (MRAM) and the control method thereof of these closed hoop magnetoresistance effects.
Background technology
Because magneto-resistance effect can be widely applied to fields such as magnetoelectricity resistance type transducer, magnetic recording magnetic reading head, therefore from people such as phase late 1980s Baibich in the magnetoresistance effect system first observed to giant magnetoresistance effect (GiantMagneto Resistance, GMR) since, the research of magnetoresistance effect system is a problem of scientific research personnel's common concern always.Because the GMR effect has very high magneto-resistor ratio, therefore the device made from GMR not only have highly sensitive, volume is little, good characteristics such as low in energy consumption, can also bring many new features such as radioresistance, non-volatile information storage.Particularly the GMR effect is used for the magnetic recording magnetic reading head and has brought a deepgoing revolution then for whole information record field, and related industry has been produced directly and far-reaching influence.IBM Corporation utilized the GMR effect successfully to develop the hard disc magnetic reading head in 1994, and the packing density of disk storage system has been improved nearly 20 times, made computer industry obtain breakthrough; The various kinds of sensors part of making based on the GMR effect then makes designs greatly simplify owing to output signal strengthens, and this has directly caused miniaturization of devices and cheap.
After giant magnetoresistance effect is found, nineteen ninety-five Japan scientist T.Miyazaki and U.S. scientist J.S.Moodera have independently obtained under the room temperature 18% and 10% tunnel magneto resistance (Tunneling Magneto Resistance respectively in MTJ (MTJ), TMR) ratio, thus started the research climax of MTJ.The researcher is based on GMR effect and MTJ and designed a kind of novel magnetic random access memory (MagneticRandom Access Memory, MRAM) device model, this device is owing to having adopted brand-new design to have many breathtaking new features, such as radioresistance, non-volatile information storage etc.Typical its core structure of MRAM designs is made of four parts: bit line (Bit Line), write word line (Word Line), readout word line (Read Line) and memory cell.Bit line and write word line, readout word line lay respectively at the above and below of memory cell, are cross arrangement in length and breadth, and memory cell then is positioned at the infall of bit line and word line.The write operation process of mram memory cell then is to reverse by the common resultant magnetic field driving bit-level magnetic moment that produces of two pulse currents of flow through word line and bit line to finish, therefore this working method obviously depends on the magnetized state that the such intermediate link of word line and two magnetic fields that pulse current produced of bit line is controlled memory cell, cause its structure and prepared process very complicated, give the processing and the integrated great inconvenience and the higher cost brought of MRAM device.
1996, U.S. scientist J.Slonczewski has foretold a kind of new physical mechanism-spin-torque (Spin Torque theoretically, ST) effect, this physical mechanism can utilize electric current self to realize that the electric current that flows through is less than certain specific critical value I to the controlling of memory cell magnetized state in memory cell
CThe time, the memory cell magnetized state can not be stored the electric current that flows through in the unit and change, thereby can realize read operation; And the electric current that flows through in memory cell is greater than this critical value I
CThe time, the memory cell magnetized state will be determined by the sense of current that flows through in the memory cell, thereby can be realized write operation.In the more than ten years subsequently, scientists has been carried out a large amount of extensive and deep researchs to this new effect.If this new mechanism is applied in the devices such as magnetoresistance effect system and MRAM, then can greatly simplify device architecture and processing technology, this will bring revolutionary breakthrough again for area information storage.
In the prior art memory cell of Shi Yonging such as bit-level (soft magnetosphere) and other pinned magnetosphere (or hard magnetic layer)-geometry all adopt non-closing structure, as rectangle, ellipse etc., this structure will be brought bigger demagnetizing field and shape anisotropy under high density small size memory cell, this defective can increase the adverse field (coercive force) and the power consumption of bit-level (soft magnetosphere) undoubtedly, simultaneously under high-density state the magnetic coupling between the magnetic cell with mutual interference is inevitable mutually, uniformity and consistency to the magnetic electricity performance of memory cell are also brought many adverse influences and magnetic noise, and give the design of memory cell and preparation brings on many structures and technical process in complexity.At present for reducing demagnetizing field, as the MTJ of memory cell about it carbon electrode generally mostly adopt compound bit-level of the artificial pinning of sandwich style and bottom pinning layer (as: Co-Fe/Ru/Co-Fe-B and Py/Ru/Co-Fe-B).But the adverse field of its bit-level and power consumption still are not reduced to the minimum of an ideal and expectation.In order to overcome these problems, must adopt new geometry and designs principle to reduce the shape anisotropy of memory cell bit-level, and further eliminate the demagnetizing field that magnetoresistance effect produces through memory cell self after little processing and the nanoprocessing small size patternization.
Summary of the invention
The objective of the invention is to overcome the structural defective of existing magnetoresistance effect system physical,, provide a kind of close-shaped magnetoresistance effect that does not have demagnetizing field and weak shape anisotropy by changing the geometry of multilayer film system.
Another object of the present invention is to overcome the structural defective of existing magnetoresistance effect system physical,, provide a kind of close-shaped magnetoresistance effect that does not have the containing metal core of demagnetizing field and weak shape anisotropy by changing the geometry of multilayer film system.
A further object of the present invention is to provide the above-mentioned close-shaped magnetoresistance effect and the close-shaped magnetism multi-film process method of containing metal core.
When an also purpose of the present invention is to overcome magnetoresistance effect that existing magnetic RAM uses non-closing structure as memory cell, because the influence of the demagnetizing field of non-closing structure memory cell and shape anisotropy and under high-density state, have magnetic coupling and mutual interference mutually between the magnetic cell, make some technical difficulties and the defective that MRAM produces on the write and read method of operation, thereby provide a kind of based on the above-mentioned close-shaped magnetoresistance effect and the close-shaped magnetoresistance effect of containing metal core, can eliminate the demagnetizing field of memory cell, weaken the MAGNETIC RANDOM ACCESS MEMORY of its shape anisotropy and magnetic interaction and interference, and control method.
The objective of the invention is to realize by the following technical solutions:
Magnetoresistance effect with geometry provided by the invention comprises each layer of the magnetoresistance effect unit that is deposited on the substrate; It is characterized in that, described magnetoresistance effect unit is the polygonal circuit shape, and this polygonal circuit shape comprises N limit shapes such as triangle, quadrangle, pentagon, hexagon, octagon, decagon, ten hexagons (N is the integer more than or equal to 3) closed hoop; Magnetic moment or magnetic flux that in the wherein said magnetoresistance effect unit each has ferromagnetic thin layer can form clockwise or counterclockwise closure state.Preferably, the inner edge length of side of the polygonal circuit of described magnetoresistance effect unit is 10～100000nm, and the length of side of outside is 20～200000nm, and the width of closed hoop is between 10～100000nm.
In above-mentioned technical scheme, also comprise one metal-cored, this metal-cored geometric center position that is arranged on the polygonal circuit of described magnetoresistance effect unit is formed and to be contained metal-cored close-shaped magnetoresistance effect.The shape of shape that this is metal-cored and closed hoop polygon magnetoresistance effect is complementary; This metal-cored cross section is a polygon correspondingly, comprises N limit shapes such as triangle, quadrangle, pentagon, hexagon, octagon, decagon, ten hexagons (N is the integer more than or equal to 3), and wherein each metal-cored length of side of polygon is 5～50000nm.
In above-mentioned technical scheme, described metal-cored material is the less metal material of resistivity, preferred Au, Ag, Pt, Ta, W, Ti, Cu, Al or Si-Al alloy etc.; This metal-cored effect is to apply electric current from the outside, the magnetized state of the memory cell after the magnetoresistance effect patternization is controlled in the toroidal magnetic field that produces by electric current, thereby can carry out the read-write operation of magnetoresistance effect memory cell more easily, can avoid simultaneously bigger pulse write current repeatedly during write operation to the issuable damage of barrier layer (current transfer atomic effects).
In above-mentioned technical scheme, the magnetoresistance effect of the polygon closed form of the magnetoresistance effect of described polygon closed form and containing metal core according to the materials classification that forms, comprises no pinning type, pinning type and two middle stratotype.
For the magnetoresistance effect of no pinning type polygon closed form, as shown in figures 1 and 3, it is followed successively by buffering conductive layer 1, hard magnetic layer 2, intermediate layer 3, soft magnetosphere 4 and cover layer 5.
For the magnetoresistance effect of pinning type polygon closed form, as Fig. 2 and shown in Figure 4, it is followed successively by buffering conductive layer 1, antiferromagnetic pinning layer 8, pinned magnetosphere 9, intermediate layer 3, soft magnetosphere 4 and cover layer 5.
For two intermediate layers magnetic multilayer film of no pinning type polygon closed form, as Fig. 5 and shown in Figure 7, it is followed successively by buffering conductive layer 1, first hard magnetic layer 21, first intermediate layer 31, soft magnetosphere 4, second intermediate layer 32, second hard magnetic layer 22, reaches cover layer 5.
Two intermediate layers magnetic multilayer film for pinning type polygonal circuit shape, as Fig. 6 and shown in Figure 8, it is followed successively by buffering conductive layer 1, first antiferromagnetic pinning layer 81, the first pinned magnetosphere 91, first intermediate layer 31, soft magnetosphere 4, second intermediate layer, 32, second pinned magnetosphere 92, second antiferromagnetic pinning layer 82 and the cover layer 5.
In above-mentioned technical scheme, described substrate is conventional substrate, as Si, Si/SiO
2, SiC, SiN or GaAs substrate etc., thickness is 0.3～1mm;
Described bottom buffering conductive layer 1 is made up of metal material, preferably Ta, Ru, Cr, Au, Ag, Pt, Ta, W, Ti, Cu, Al or Si-Al alloy etc., and thickness is 2～200nm;
Described hard magnetic layer 2, first hard magnetic layer 21 and second hard magnetic layer 22 be by the big material of giant magnetoresistance effect, as Co, and Fe, Ni, CoFe, NiFeCo, CoFeB, compositions such as CoFeSiB, thickness are 2～20nm;
Described intermediate layer 3, first intermediate layer 31 and second intermediate layer 32 constitute by non-magnetic metal layer or insulator barrier layer, the wherein material of non-magnetic metal layer such as Ti, Zn, ZnMn, Cr, Ru, Cu, V or TiC, the material of insulator barrier layer such as Al
2O
3, MgO, TiO, ZnO, (ZnMn) O, CrO, VO, or TiCO, thickness are 0.5～10nm;
The composition material of described soft magnetosphere 4 is the spin polarizability height, and the ferromagnetic material that coercive force is less comprises: Co, Fe, Ni or their metal alloy NiFe, CoFeSiB, NiFeSiB, or amorphous Co
100-x-yFe
xB
y(0＜x＜100,0＜y≤20), or Heusler alloy are as Co
2MnSi, Co
2Cr
0.6Fe
0.4Al; The preferred Co of the composition material of soft magnetosphere
90Fe
10, Co
75Fe
25, Co
40Fe
40B
20, or Ni
79Fe
21The thickness of described soft magnetosphere is 1～20nm;
Described cover layer 5 is formed by being difficult for metal material oxidized and that have big resistance, preferably Ta, Cu, Ru, Pt, Ag, Au, Cr etc. or its alloy, and thickness is 2～20nm, it is not oxidized to be used for protective material.
Described antiferromagnetic pinning layer 8, the first antiferromagnetic pinning layer 81 and the second antiferromagnetic pinning layer 82 be by having anti-ferromagnetic alloy composition, preferred IrMn, and FeMn, PtMn, CrMn or Pt (Cr, Mn) alloy, thickness are 3～30nm;
The composition material of described pinned magnetosphere 9, the first pinned magnetosphere 91 and the second pinned magnetosphere 92 is the ferromagnetic metal that has than high spinning polarizability, as Fe, Co, Ni and alloy thereof, preferred CoFe alloy, the NiFe alloy, amorphous CoFeB alloy, CoFeSiB alloy etc., thickness is 2～20nm;
The method of utilizing micro-processing method to prepare described close-shaped magnetoresistance effect provided by the invention comprises following step:
1) selects a substrate, adopt conventional cleaning to clean this substrate;
2) on substrate, deposit each layer of described magnetoresistance effect then successively; When deposition has ferromagnetic thin layer, can select to apply the plane induced magnetic field that magnetic field intensity is 50～5000Oe;
3) adopt micro fabrication with step 2) in deposited magnetoresistance effect substrate be processed into closed polygon circulus; The concrete steps of described micro fabrication are: at first pass through gluing, preceding baking, again on ultraviolet, deep ultraviolet exposure or electron beam exposure apparatus, according to required closed form figure (comprising polygon rings such as triangle, quadrangle, pentagon, hexagon, octagon, decagon, ten hexagons) the sheet base is exposed, then development, photographic fixing, back baking, with ion etching process magnetoresistance effect is carved into close-shapedly then, soaks with glue-dispenser at last and remove photoresist;
Can also utilize reactive ion etching machine to assist in case of necessity removes photoresist;
On the magnetoresistance effect of the polygon closed form that the etching that 4) step 3) obtained is shaped, deposit a layer insulating again, described polygonal circuit shape multilayer film unit is buried and isolate different unit mutually;
5) utilize micro fabrication, for example ultraviolet, deep ultraviolet expose or electron beam exposure method, and focused-ion-beam lithography or chemical reaction are done and are carved or chemical reaction is wet carves, on the position that deposits the closed hoop multilayer film, insulating barrier is carried out etching the magnetoresistance effect of burying under the insulating barrier is exposed, obtain the magnetoresistance effect unit of polygonal circuit shape of the present invention;
For the magnetism multi-film process method of the polygonal circuit shape of containing metal core, between the step 4) and step 5) of above-mentioned close-shaped magnetism multi-film process method, comprise step 4 '):
4 ') utilize micro fabrication, metal-cored one of the geometric center position of polygonal circuit shape multilayer film preparation, this metal-cored cross section is a polygon: the carrying out that step 4) is obtained the geometric center location positioning of the insulating barrier polygonal circuit shape multilayer film unit of burying, then utilize focused-ion-beam lithography, ultraviolet, the deep ultraviolet exposure, electron beam exposure, micro-processing methods such as chemical reaction etching carry out etching to insulating barrier, forming the level cross-sectionn is polygonal column hole, utilize electrochemical deposition method afterwards, magnetron sputtering, methods such as focused ion beam assistant depositing form metal-cored in the hole location deposit metallic material;
Wherein, each metal-cored length of side of described polygon is 5～50000nm, the shape of the magnetoresistance effect of metal-cored shape and polygon closed form is complementary, this metal-cored cross section is a polygon correspondingly, comprises N limit shapes such as triangle, quadrangle, pentagon, hexagon, octagon (N is the integer more than or equal to 3).
In above-mentioned technical scheme, also comprise step 6) making top electrode, concrete steps are as follows:
6) utilize conventional film growth means, deposition one deck conductive layer on the magnetoresistance effect unit of the polygonal circuit shape that step 5) obtains, utilize conventional semiconductor microactuator processing technology again, conductive layer is processed into electrode, each closed hoop structure is drawn four electrodes, promptly obtains containing the components and parts of magnetoresistance effect of the present invention, and this conductive layer is the less metal of resistivity, preferred Au, Ag, Pt, Cu, Al, SiAl etc. or its metal alloy, thickness is 2～200nm.
In above-mentioned technical scheme, the thin film growth process of described routine comprises technologies such as magnetron sputtering, electron beam evaporation, pulsed laser deposition, electrochemical deposition, molecular beam epitaxy.
In above-mentioned technical scheme, described micro fabrication comprises: at first pass through gluing, preceding baking, again on ultraviolet, deep ultraviolet exposure machine or electron beam exposure apparatus, utilization has the reticle of pattern to be processed and exposes, then development, photographic fixing, back baking, with ion etching process the conductive layer on the magnetoresistance effect is carved into the shape that will make, the technology of removing photoresist with immersions such as glue-dispensers at last then.
In above-mentioned technical scheme, be conventional insulating material at the insulating barrier described in the step 4), preferred SiO
2, Al
2O
3, ZnO, TiO, SnO or organic molecule material (as polyvinylchloride, polythene PE, polypropylene PP etc.), thickness is 50～1000nm.
In above-mentioned technical scheme, described metal-cored material is the less metal material of resistivity, preferred Au, Ag, Pt, Ta, W, Ti, Cu, Al or Si-Al alloy etc.
It is the various devices of core that the magnetoresistance effect that contains (or not containing) metal-cored shape of polygon closure of the present invention can be widely used in the magnetoresistance effect, for example, magnetic RAM, computer magnetic reading head, magneto-dependent sensor, magnetic logical device and spin transistor etc.
The invention provides a kind of magnetic RAM based on the polygon closed magnetic multilayer film, its magnetoresistance effect of polygon closed form that uses above-mentioned close-shaped magnetoresistance effect and containing metal core is as memory cell.
Magnetic RAM based on the polygon closed magnetic multilayer film provided by the invention comprises following several types:
1. the invention provides a kind of magnetic RAM, shown in Fig. 9 A, 9B and Fig. 9 C, comprising based on the polygon closed magnetic multilayer film:
The memory read/write control unit array that transistor unit 0 (comprising transistorized source electrode 0b, drain electrode 0a and lightly doped region 0c) constitutes, this read-write control unit array is integrated in the Semiconductor substrate;
The transition metal layer (4a, 4b) that connects above-mentioned transistor unit 0 and closed magnetic multilayer film memory cell 65; And word line 62, bit line 4c, ground wire 4a, described word line also is the grid of described transistor 0 simultaneously, described bit line 4c is arranged in the top of described closed magnetic multilayer film memory cell 65, and vertical mutually, and directly be connected with described closed magnetic multilayer film memory cell 65 with described word line 62.
Be provided with first respectively in the source electrode of wherein said transistor unit 0 and first drain electrode and contact conductive hole 3a, the second contact conductive hole 3b, on the first contact conductive hole 3a ground wire 4a is set, second contacts on the conductive hole 3b the first transition metal layer 4b is set; The first transition metal layer 4b is connected with the lower end of magnetoresistance effect memory cell 65; Described word line 62 also is the grid of described transistor 0 simultaneously; Described bit line 4c is arranged in the top of described magnetoresistance effect memory cell 65, and is vertical mutually with described word line 62, and directly is connected with described magnetoresistance effect memory cell 65; 1a, 1b and 1c are the insulation isolated materials.And on described bit line 4c, cover one deck insulating passivation layer 1f.
In this technical scheme, the polygon ring that has width that is shaped as intermediate hollow of described magnetoresistance effect memory cell 65; The length on each limit of inner polygon of described polygon ring is that 10～100000nm, outer polygonal each edge lengths are 20～200000nm; Described closed form containing metal core magnetoresistance effect comprises non-pinning type and pinning type two classes, and its feature as previously mentioned.
Closed form magnetic field effect according to spinning moment effect of introducing in the background technology and electric current generation, the invention provides a kind of control method of above-mentioned magnetic RAM based on the polygon closed magnetic multilayer film, it is read operation and the write operation of realizing MRAM by the size and Orientation of the electric current in the memory cell 65 of flowing through, and is specific as follows:
Electric current in polygon closed magnetic multilayer film memory cell 65 is less than a specific low critical value I
C1(corresponding current density, J
C1=10～10
2A/cm
2, electric current=current density * closed magnetic multilayer film sectional area) time, the magnetized state of its bit-level (soft magnetosphere) can not changed, thereby realizes the read operation of MRAM;
Electric current in polygon closed magnetic multilayer film memory cell is greater than this low critical value I
C1And less than high critical value I
C2(corresponding current density, J
C2=10
2～10
6A/cm
2Electric current=current density * closed magnetic multilayer film sectional area) time, sense of current will change the magnetized state of closed magnetic multilayer film memory cell bit-level (soft magnetosphere), by forward and negative sense spin polarization tunnelling current (i.e. the driving action in the belt magnetic field of inducing by the polarization tunnelling current and the synergy of spinning moment), the magnetized state of realizing its bit-level (soft magnetosphere) is orientated clockwise or counterclockwise, make bit-level (soft magnetosphere) be orientated with magnetized state difference identical clockwise or counterclockwise or opposite (being the parallel or antiparallel of the magnetization) counter-rotating of pinned magnetosphere (or hard magnetic layer), thereby obtain low resistance and high resistance two states (promptly obtaining high output voltage and low output voltage two states), just just can realize the write operation of MRAM by the size and Orientation of Control current;
If write current surpasses high critical current value I
C2(promptly greater than behind this critical current), the original edge of pinned magnetosphere (or hard magnetic layer) magnetized state clockwise or orientation counterclockwise will be inverted, promptly can cause bit-level (soft magnetosphere) with pinned magnetosphere (or hard magnetic layer) thus be inverted together and produce identical magnetization orientation, so write current must be less than high critical current value I
C2Be that read current is less than low critical electric current value I
C1, write current must be greater than low critical current I
C1And less than high critical current I
C2
2. the invention provides the magnetic RAM of another kind, shown in Figure 10 A, 10B and 10C, comprising based on the magnetoresistance effect of polygon closed form containing metal core:
The memory read/write control unit array that transistor unit 0 (comprising transistorized source electrode 0b, drain electrode 0a and lightly doped region 0c) constitutes, this read-write control unit array is integrated in the Semiconductor substrate;
The transition metal layer 4b that connects the magnetoresistance effect memory cell 65 of above-mentioned transistor unit 0 and polygon closed form containing metal core; And word line 62, the first bit line 4e and the second bit line 4d, described word line also is the grid of described transistor 0 simultaneously, described two bit lines 4e and 4d are arranged in the top of the magnetoresistance effect memory cell of described polygon closed form containing metal core, the first bit line 4e is vertical mutually with described word line 62, and directly be connected with the magnetoresistance effect memory cell 65 of described polygon closed form containing metal core, metal-cored in the magnetoresistance effect memory cell 65 of the second bit line 4d and described closed form containing metal core directly links to each other, and isolated mutually by a layer insulating and the first bit line 4e.1a, 1b, 1c, 1e and 1f are the insulation isolated materials.
The invention provides the access storage method of the magnetic RAM of above-mentioned magnetoresistance effect based on polygon closed form containing metal core, it is by the metal-cored electric current that applies in the memory cell being realized the write operation of MRAM, realize the read operation of MRAM by the tunnelling current that the closed magnetic multilayer film in the memory cell is applied, specific as follows:
The electric current that applies in the magnetoresistance effect of the magnetoresistance effect memory cell of closed form containing metal core is less than a specific low critical value I
C1(corresponding current density, J
C1=10～10
2A/cm
2, electric current=current density * closed magnetic multilayer film sectional area) time, the magnetized state of its bit-level (soft magnetosphere) can not changed, thereby realizes the read operation of MRAM;
Apply electric current in metal-cored in polygon closed form containing metal core magnetoresistance effect memory cell, because the magnetic field that electric current produces distributes in the form of a ring, therefore can control the magnetized state of closed magnetic multilayer film easily, concrete grammar is: apply electric current greater than low critical value I in metal-cored in the polygon closed form containing metal core magnetoresistance effect memory cell 65
C1And less than high critical value I
C2(corresponding current density, J
C2=10
2～10
6A/cm
2Electric current=current density * metal-cored sectional area) time, sense of current will change the magnetized state of closed magnetic multilayer film memory cell 65 bit-level (soft magnetosphere), drive current by forward and negative sense produces clockwise or anticlockwise magnetic field, the magnetized state of realizing its bit-level (soft magnetosphere) is orientated clockwise or counterclockwise, make bit-level (soft magnetosphere) distinguish identical clockwise or counterclockwise or opposite (being the parallel or antiparallel of the magnetization) with the magnetized state of pinned magnetosphere (or hard magnetic layer), thereby obtain low resistance and high resistance two states (promptly obtaining high output voltage and low output voltage two states), just just can realize the write operation of MRAM by the direction of Control current.
If write current surpasses high critical current value I
C2(promptly greater than behind this critical current), pinned magnetosphere (or hard magnetic layer) is original will to be inverted along magnetized state clockwise or orientation counterclockwise, promptly can cause bit-level (soft magnetosphere) with pinned magnetosphere (or hard magnetic layer) thus be inverted together and produce identical magnetization orientation, so write current must be less than high critical current value I
C2Be that read current is less than low critical current I
C1, write current must be greater than low critical current I
C1And less than high critical current I
C2
3. each shown in Figure 11 A, 11B and 11C, comprising with the magnetic RAM based on the magnetoresistance effect of polygon closed form containing metal core of a transistor controls respectively to the invention provides another kind of read and write process:
The memory read/write control unit array that described first and second transistor units 0 (comprising the first and second transistorized source electrode 0b1 and 0b2, shared drain electrode 0a1, lightly doped region 0c) constitute, this read-write control unit array is integrated in the Semiconductor substrate; The first transistor switch control read operation, transistor seconds switch control write operation.The grid 67 of the first transistor is also as first word line 67 (shared), and the grid 63 of transistor seconds is also as second word line 63 (shared);
The first conduction contact hole 3a, the second conduction contact hole 3b, the 3rd conduction contact hole 3b2 are set respectively on the source electrode 0b1 of described transistor common drain 0a1, the first transistor, the source electrode 0b2 of transistor seconds, and respectively with and on the first transition metal layer 4a be connected with 4b; Transition metal layer 4a on the first contact hole 3a also constitutes set ground wire 4a simultaneously; The 4th conduction contact hole 3d links to each other with the second transition metal layer 4f; This second transition metal layer 4f links to each other as the lower end of bottom conducting electrode with described polygon ring-shaped magnetic multi-layer film memory cell 65, and the upper end of the magnetoresistance effect memory cell 65 of this polygon ring-type is provided with bit line 4c and is attached thereto; The described metal-cored upper end of polygon shape that is arranged on magnetoresistance effect memory cell 65 centers of polygon ring-type contacts with bit line 4c, and the lower end is connected with the first transition metal layer 4b; Pentasyllabic quatrain edge passivation layer 1f covers on the bit line 4c.
Polygon closure provided by the invention contains the magnetoresistance effect of (or not containing) metal-cored shape, uses the polygonal circuit shape structure of micro-processing method preparation, replaces conventional magnetoresistance effect.When prior art is used conventional non-closed hoop structure, because the demagnetizing field that conventional structure brings and the influence of shape anisotropy, the magnetized state that makes magnetoresistance effect is malleable not, on device application, must rely on the outside big magnetic field that applies or control its magnetized state by the resultant magnetic field that big pulse current produces, power consumption is big, the cost height, and the processing of giving device, integrated and use brings many unfavorable factors, as the magnetic coupling between noise and neighbour unit and magnetic disturbance and thermal effect and heat dissipation problem etc., and the performance of device exerted an adverse impact.And the present invention is by changing the geometry of magnetoresistance effect, can overcome above-mentioned defective, improve the performance of magnetoresistance effect, make it under the situation that keeps original feature of magnetoresistance effect and performance, also have no demagnetizing field and minimum magnetic anisotropy, magnetized state is easy to change and can advantage such as directly controls by electric current, avoided using external magnetic field or controlled structure and the technologic complexity that magnetized state brings by the resultant magnetic field that big pulse current produces, can satisfy the requirement of mass productization, the magnetoresistance effect that polygon closure promptly of the present invention contains (or not containing) metal-cored shape is more suitable for the magnetic RAM in device, the preparation of novel magnetic multilayer film transducer.
The data write operation of MRAM is to rely on the acting in conjunction in the magnetic field that write word line and bit line produced to control the magnetized state of memory cell bit-level in the prior art, and therefore needing two metal wiring layers on process structure arranges write word line and bit line respectively.And compared with prior art, magnetic RAM based on the polygon closed magnetic multilayer film provided by the invention, magnetoresistance effect geometry by adopting new polygon ring-type is as memory cell, utilize belt magnetic field that the polarization tunnelling current self of positive and negative both direction produces or metal-cored in the toroidal magnetic field that produces of the drive current of positive and negative both direction, and in conjunction with spinning moment effect, carry out data write operation, make that the control of MRAM is easier: utilize free torque effect to make reading of data, write operation is finished by a bit lines; The toroidal magnetic field that utilizes metal-cored middle electric current to produce drives the bit-level magnetized state of polygon closed magnetic multilayer film, and the geometric match of driving magnetic field spatial distribution and memory cell is better, therefore makes the driving of device be more prone to.These characteristics make the magnetic RAM based on the polygon closed magnetic multilayer film of the present invention avoid the adverse effect of bringing owing to the magnetic field space skewness, help the prolongation of the stable and device lifetime of device service behaviour; Simultaneously owing to the magnetic RAM based on the polygon closed magnetic multilayer film of the present invention has been removed a write word line that is specifically designed to write operation in the prior art, greatly reduce the complexity of traditional MRAM structure, the difficulty and the cost of manufacturing process, and overcome the shortcoming that exists in the prior art, improved the using value of MRAM.
Description of drawings
Fig. 1-the 1st, the top view of the magnetoresistance effect of a kind of polygonal circuit shape that does not have a pinning type of the present invention
Fig. 1-2 is the sectional structure chart of Fig. 1-1
Fig. 2-the 1st, the top view of the magnetoresistance effect of the polygonal circuit shape of a kind of pinning type of the present invention
Fig. 2-2 is the sectional structure chart of Fig. 2-1
Fig. 3-the 1st, a kind of top view that does not have the polygonal circuit shape magnetoresistance effect of pinning type, containing metal core of the present invention
Fig. 3-2 is the sectional structure chart of Fig. 3-1
Fig. 4-the 1st, the magnetoresistance effect top view of the polygonal circuit shape of a kind of pinning type of the present invention, containing metal core
Fig. 4-2 is the sectional structure chart of Fig. 4-1
Fig. 5-the 1st, a kind of top view that does not have two intermediate layers magnetic multilayer film of pinning type, polygonal circuit shape of the present invention
Fig. 5-2 is the profile of Fig. 5-1
Fig. 6-the 1st, the top view figure of two intermediate layers magnetic multilayer film of a kind of pinning type of the present invention, polygonal circuit shape
Fig. 6-2 is the profile of Fig. 6-1
Fig. 7-the 1st, a kind of top view that does not have two intermediate layers pinning type, containing metal core, the polygonal circuit shape magnetic multilayer film of the present invention
Fig. 7-2 is Fig. 7-1 sectional structure chart
Fig. 8-the 1st, the top view of two intermediate layers a kind of pinning type of the present invention, containing metal core, the polygonal circuit shape magnetic multilayer film
Fig. 8-2 is Fig. 8-1 sectional structure chart
Among Fig. 1-1-Fig. 8-2: 1-cushions conductive layer; The 2-hard magnetic layer; The 3-intermediate layer; The 4-soft magnetosphere; The 5-cover layer; 6-is metal-cored; The antiferromagnetic pinning layer of 8-; The pinned magnetosphere of 9-; 21-first hard magnetic layer; 22-second hard magnetic layer; 31-first intermediate layer; 32-second intermediate layer; The 81-first antiferromagnetic pinning layer; The 82-second antiferromagnetic pinning layer; 91 first pinned magnetospheres; The 92-second pinned magnetosphere; 31-first intermediate layer; 32-second intermediate layer;
Fig. 9 A be among the embodiment 34 based on the magnetic RAM of polygon closed form (comprising polygon ring-types such as triangle, quadrangle, pentagon, hexagon, octagon) magnetoresistance effect the mram cell structural representation;
Fig. 9 B is the sectional structure chart of Fig. 9 A;
Fig. 9 C is the three-dimensional structure diagram of Fig. 9 A;
Figure 10 A be among the embodiment 35 based on polygon closed form (comprising polygon ring-types such as triangle, quadrangle, pentagon, hexagon, octagon) containing metal core magnetoresistance effect, utilize a memory cell read and write of transistor controls process, simultaneously utilize metal-cored in the mram cell structural representation of magnetic RAM of the field drives mode work that produces of electric current;
Figure 10 B is the sectional structure chart of Figure 10 A;
Figure 10 C is the three-dimensional structure diagram of Figure 10 A;
Figure 11 A be among the embodiment 36 based on polygon closed form (comprising polygon ring-types such as triangle, pentagon, hexagon, octagon) containing metal core magnetoresistance effect, utilize two transistors control respectively a memory cell read and write process, simultaneously utilize metal-cored in the mram cell sectional structure chart of magnetic RAM of the field drives mode work that produces of electric current;
Figure 11 B is the sectional structure chart of Figure 11 A;
Figure 11 C is the three-dimensional structure diagram of Figure 11 A;
Among Fig. 9 A-Figure 11 C, the 0th, transistor, 0a is a transistor drain, 0b is transistorized source electrode, 0b1 and 0b2 are respectively the source electrodes of the first transistor and transistor seconds, 0a1 is the common drain of the first transistor and transistor seconds, 0c transistor light doping section, the 62nd, the grid of transistor 0,63 and 67 is respectively the grid of transistor seconds and the first transistor, 1a, 1b, 1c, 1d, 1e is each insulating barrier in the mram cell, 1f is a pentasyllabic quatrain edge passivation layer, 3a is the first conduction contact hole, 3b is the second conduction contact hole, 3b2 is the 3rd conduction contact hole, 3d is the 4th conduction contact hole, the 4a ground wire, 4b is first transition metal layer, 4e is first bit line, 4d is second bit line, 4f is the second transition metal layer, 65 is the closed magnetic multilayer film memory cell.
Embodiment
To polygonal circuit shape magnetoresistance effect of the present invention, and utilize the structure of the magnetic RAM of this polygonal circuit shape magnetic multilayer film formation to be described in detail below in conjunction with accompanying drawing and preparation method
Utilize the no pinning type regular hexagon closed hoop magnetoresistance effect of micro-processing method preparation.
On the high vacuum magnetron sputtering apparatus, through the thick SiO of 1mm after the conventional method cleaning
2On/Si the substrate, adopt conventional film plating process successively deposit thickness be that the Au of 2nm is as bottom buffering conductive layer 1, thickness be the Co of 3nm as hard magnetic layer 2, thickness be the Cu of 1nm as intermediate layer 3, thickness is that the Co of 1nm is that the Ru of 4nm is as cover layer 5 as soft magnetosphere 4 and thickness.The growth conditions of above-mentioned magnetoresistance effect: be equipped with end vacuum: 5 * 10
-7Handkerchief; Sputter high purity argon air pressure: 0.07 handkerchief; Sputtering power: 120 watts; The specimen holder speed of rotation: 20rmp; Growth temperature: room temperature; Growth rate: 0.3～1.1 dust/second; Growth time: film thickness/growth rate; And when deposition hard magnetic layer 2 and soft magnetosphere 4, apply 150Oe plane induced magnetic field.The magnetoresistance effect that deposition is good adopts micro-processing technology of the prior art, promptly at first pass through gluing, preceding baking, again on electron beam exposure apparatus, according to required polygon ring-type figure the sheet base is exposed, then development, photographic fixing, back baking, with ion etching process magnetoresistance effect is carved into polygonal circuit then, soak with glue-dispenser at last and remove photoresist, promptly form orthohexagonal circulus, the interior regular hexagon length of side of this regular hexagon ring is 500nm, and the outer orthohexagonal length of side is 800nm.On the polygon ring-shaped magnetic multi-layer film that erosion is shaped at the moment, utilize conventional film growth means then, the thick SiO of deposition one deck 100nm
2Insulating barrier is buried each polygon ring-type multilayer film and isolation mutually, carries out the focused ion etching again, promptly at first navigates to the position that deposits polygon ring-type multilayer film on focused ion beam equipment, then utilizes the focused-ion-beam lithography method to SiO
2Insulating barrier carries out etching, makes the ring-shaped magnetic multi-layer film of burying under the insulating barrier expose.Utilize the high vacuum magnetron sputtering apparatus to deposit the Au conductive layer of a layer thickness at last for 2nm, growth conditions as previously mentioned, process electrode with conventional semiconductor microactuator processing technology, promptly at first on the Au conductive layer, pass through gluing, preceding baking, again in ultraviolet, on the deep ultraviolet exposure machine, utilization has the reticle of pattern to be processed and exposes, then develop, photographic fixing, the back baking, with ion etching process the conductive layer on the magnetoresistance effect is carved into the shape of four electrodes then, soak with glue-dispenser at last and remove photoresist, promptly obtain no pinning type regular pentagon closed hoop magnetoresistance effect of the present invention, its structural representation is shown in Fig. 1-1-Fig. 1-2.
According to the identical method of embodiment 1, utilize the no pinning type regular pentagon closed hoop magnetoresistance effect of micro-processing method preparation, the layers of material and the thickness of its magnetoresistance effect are listed in the table 1.
Table 1, the structure of utilizing the no pinning type regular pentagon closed hoop magnetoresistance effect of micro-processing method preparation of the present invention
Utilize micro-processing method to prepare pinning type regular hexagon closed hoop magnetoresistance effect
Utilize the high vacuum magnetron sputtering apparatus at the thick Si/SiO of 0.8mm that cleans through conventional method
2On the substrate successively deposit thickness be the Au bottom buffering conductive layer 1 of 2nm, thickness is the antiferromagnetic pinning layer 8 of the IrMn of 10nm, thickness is the Co of 3nm
90Fe
10Pinned magnetosphere 9; Deposit the thick Al of 1nm then, the insulating barrier that forms through plasma oxidation 50 seconds is as intermediate layer 3; Deposit thickness is the Co of 3nm successively on this intermediate layer 3
90Fe
10Soft magnetosphere 4 and thickness are the Au cover layer 5 of 2nm.The growth conditions of above-mentioned magnetoresistance effect: be equipped with end vacuum: 5 * 10
-7Handkerchief; Sputter high purity argon air pressure: 0.07 handkerchief; Sputtering power: 120 watts; The specimen holder speed of rotation: 20rmp; Growth temperature: room temperature; Growth rate: 0.3～1.1 dust/second; Growth time: film thickness/growth rate; When pinned magnetosphere 9 of deposition and soft magnetosphere 4, apply the plane induced magnetic field of 150Oe.The magnetoresistance effect that deposition is good adopts micro-processing technology of the prior art, promptly at first pass through gluing, preceding baking, again on electron beam exposure apparatus, according to required ring-type figure the sheet base is exposed, then development, photographic fixing, back baking are carved into polygonal circuit to magnetoresistance effect with ion etching process then, soak with glue-dispenser at last and remove photoresist, promptly form regular hexagon closed hoop geometry, the orthohexagonal interior regular hexagon length of side is 300nm, and the outer orthohexagonal length of side is 600nm.On the polygonal circuit shape magnetoresistance effect that erosion is shaped at the moment, utilize conventional film growth means then, for example magnetron sputtering, electron beam evaporation, pulsed laser deposition, electrochemical deposition, molecular beam epitaxy etc. deposit the thick SiO of one deck 50nm
2Insulating barrier, each polygonal circuit shape multilayer film is buried and isolation mutually, adopt micro-processing technology of the prior art to carry out etching, promptly at first on focused ion beam equipment, navigate to the position that deposits polygon ring-type multilayer film, then utilize the focused-ion-beam lithography method SiO
2Insulating barrier carries out etching, makes the polygon ring-shaped magnetic multi-layer film of burying under the insulating barrier expose.Utilize the high vacuum magnetron sputtering apparatus to deposit the conductive layer Cu of a layer thickness at last for 5nm, growth conditions as previously mentioned, process electrode with conventional semiconductor microactuator processing technology, promptly at first pass through gluing, preceding baking, again in ultraviolet, on the deep ultraviolet exposure machine, utilization has the reticle of pattern to be processed and exposes, then develop, photographic fixing, the back baking, with ion etching process the conductive layer on the magnetoresistance effect is carved into the shape of four electrodes then, soak with glue-dispenser at last and remove photoresist, promptly obtain pinning type regular hexagon closed hoop magnetoresistance effect of the present invention, its structural representation is shown in Fig. 2-1-Fig. 2-2.
According to the identical method of embodiment 8, utilize micro-processing method to prepare pinning type regualr decagon closed hoop magnetoresistance effect, the layers of material and the thickness of its magnetoresistance effect are listed in the table 2.
Table 2, the structure of utilizing micro-processing method to prepare pinning type regualr decagon closed hoop magnetoresistance effect of the present invention
Embodiment 15,
Utilize the magnetoresistance effect of the no pinning type regular hexagon closed hoop containing metal core of micro-processing method preparation
In the high vacuum magnetron sputtering apparatus, will be through the 1mm that cleans up thick SiO
2On/Si the substrate, adopt common film plating process successively deposit thickness be that the Ru of 5nm is as bottom buffering conductive layer 1, thickness be the Co of 3nm as hard magnetic layer 2, thickness be the Cu of 1nm as intermediate layer 3, thickness is that the Co of 1nm is that the Ru of 4nm is as cover layer 5 as soft magnetosphere 4 and thickness.The growth conditions of above-mentioned magnetoresistance effect: be equipped with end vacuum: 5 * 10
-7Handkerchief; Sputter high purity argon air pressure: 0.07 handkerchief; Sputtering power: 120 watts; The specimen holder speed of rotation: 20rmp; Growth temperature: room temperature; Growth rate: 0.3～1.1 dust/second; Growth time: film thickness/growth rate; When deposition hard magnetic layer 2 and soft magnetosphere 4, add induced magnetic field 150Oe.The magnetoresistance effect that deposition is good adopts micro-processing technology of the prior art, promptly at first pass through gluing, preceding baking, again on electron beam exposure apparatus, according to required polygonal circuit shape figure the sheet base is exposed, then development, photographic fixing, back baking, with ion etching process magnetoresistance effect is carved into the polygon ring then, soak with glue-dispenser at last and remove photoresist, promptly form regular hexagon closed hoop geometry, the interior regular hexagon length of side of regular hexagon ring is 500nm, and the outer orthohexagonal length of side is 1000nm.On the polygonal circuit shape magnetoresistance effect that erosion is shaped at the moment, utilize conventional film growth means then, deposit the thick SiO of one deck 100nm again
2Insulating barrier is buried each polygonal circuit shape multilayer film and isolation mutually.Adopt micro-processing technology of the prior art, promptly at first on focused ion beam equipment, navigate to the geometric center position of polygonal circuit shape multilayer film, then utilize the focused-ion-beam lithography method SiO
2Insulating barrier carries out etching, and forming the length of side is the polygon hole of 200nm, utilizes focused ion beam assistant depositing method at hole location deposit metallic material Au afterwards, the regular hexagon Au metal-cored 6 that to form a length of side be 200nm.Adopt micro-processing technology of the prior art to carry out etching then, promptly at first on focused ion beam equipment, navigate to the position that deposits polygon ring-type multilayer film, then utilize the focused-ion-beam lithography method SiO
2Insulating barrier carries out etching, makes the polygon ring-shaped magnetic multi-layer film of burying under the insulating barrier expose.Utilize the high vacuum magnetron sputtering apparatus to deposit the conductive layer Au of a layer thickness at last for 2nm, growth conditions as previously mentioned, process electrode with conventional semiconductor microactuator processing technology, promptly at first pass through gluing, preceding baking, again in ultraviolet, on the deep ultraviolet exposure machine, utilization has the reticle of pattern to be processed and exposes, then develop, photographic fixing, the back baking, with ion etching process the conductive layer on the magnetoresistance effect is carved into the shape of four electrodes then, soak with glue-dispenser at last and remove photoresist, promptly obtain the magnetoresistance effect of no pinning type regular hexagon closed hoop containing metal core of the present invention, its structural representation is shown in Fig. 3-1-Fig. 3-2.
Embodiment 16～21
According to the identical method of embodiment 15, utilize the magnetoresistance effect of the no pinning type dodecagon closed hoop containing metal core of micro-processing method preparation, the layers of material and the thickness of its magnetoresistance effect are listed in the table 3.
Table 3, the structure of utilizing the magnetoresistance effect of the no pinning type dodecagon closed hoop containing metal core of micro-processing method preparation of the present invention
Utilize micro-processing method to prepare the magnetoresistance effect of pinning type regular hexagon closed hoop containing metal core
Utilize the high vacuum magnetron sputtering apparatus at the thick SiO of 0.8mm that cleans through conventional method
2On/Si the substrate successively deposit thickness be the Cr of 25nm as bottom buffering conductive layer 1, thickness be the IrMn of 10nm as antiferromagnetic pinning layer 8, thickness is the Co of 3nm
90Fe
10Pinned magnetosphere 9; Deposit the Al of 1nm then, the insulating barrier that forms through plasma oxidation 50 seconds is as intermediate layer 3; Deposit thickness is the Co of 1nm successively on this intermediate layer
90Fe
10Soft magnetosphere 4 and thickness are the Cu cover layer 5 of 2nm.The growth conditions of above-mentioned magnetoresistance effect: be equipped with end vacuum: 5 * 10
-7Handkerchief; Sputter high purity argon air pressure: 0.07 handkerchief; Sputtering power: 120 watts; The specimen holder speed of rotation: 20rmp; Growth temperature: room temperature; Growth rate: 0.3～1.1 dust/second; Growth time: film thickness/growth rate; When pinned magnetosphere 9 of deposition and soft magnetosphere 4, add induced magnetic field 150Oe.The magnetoresistance effect that deposition is good adopts micro-processing technology of the prior art through little processing of introducing in the background technology, promptly at first pass through gluing, preceding baking, again on electron beam exposure apparatus, according to required ring-type figure the sheet base is exposed, then development, photographic fixing, back baking, with ion etching process magnetoresistance effect is carved into polygonal circuit shape then, soak with glue-dispenser at last and remove photoresist, promptly form polygonal circuit shape geometry, the interior regular hexagon length of side of regular hexagon ring is 300nm, and the outer orthohexagonal length of side is 600nm.On the polygonal circuit shape magnetoresistance effect that erosion is shaped at the moment, utilize conventional film growth means then, for example magnetron sputtering, electron beam evaporation, pulsed laser deposition, electrochemical deposition, molecular beam epitaxy etc. deposit the thick SiO of one deck 50nm
2Insulating barrier is buried each polygon ring-type multilayer film and isolation mutually.Adopt micro-processing technology of the prior art, promptly at first on focused ion beam equipment, navigate to the geometric center position of polygonal circuit shape multilayer film, then utilize the focused-ion-beam lithography method SiO
2Insulating barrier carries out etching, and forming the length of side is the polygon hole of 100nm, utilizes focused ion beam assistant depositing method at hole location deposit metallic material Cu afterwards, forms the positive icosagon Cu metal-cored 6 that a length of side is 100nm.Adopt micro-processing technology of the prior art to carry out etching then, promptly at first on focused ion beam equipment, navigate to the position that deposits polygon ring-type multilayer film, then utilize the focused-ion-beam lithography method SiO
2Insulating barrier carries out etching, makes the polygon ring-shaped magnetic multi-layer film of burying under the insulating barrier expose.Utilize the high vacuum magnetron sputtering apparatus to deposit the conductive layer Cu of a layer thickness at last for 5nm, growth conditions as previously mentioned, process electrode with conventional semiconductor microactuator processing technology, promptly at first pass through gluing, preceding baking, again in ultraviolet, on the deep ultraviolet exposure machine, utilization has the reticle of pattern to be processed and exposes, then develop, photographic fixing, the back baking, with ion etching process the conductive layer on the magnetoresistance effect is carved into the shape of four electrodes then, remove photoresist with the glue-dispenser immersion, promptly obtain the magnetoresistance effect of pinning type regular hexagon closed hoop containing metal core of the present invention, its structure is shown in Fig. 4-1-Fig. 4-2.
Embodiment 23～28
According to the identical method of embodiment 22, utilize micro-processing method to prepare the magnetoresistance effect of the positive ten hexagonal close ring-type containing metal cores of pinning type, the layers of material and the thickness of its magnetoresistance effect are listed in the table 4.
Table 4, the structure of utilizing micro-processing method to prepare the magnetoresistance effect of the positive ten hexagonal close ring-type containing metal cores of pinning type of the present invention
Embodiment 29,
The two middle stratotype magnetoresistance effect for preparing no pinning type octagon closed hoop
Utilize the high vacuum magnetron sputtering apparatus at the thick SiO of 1mm that cleans through conventional method
2On/Si the substrate successively deposit thickness be the Ta of 2nm as bottom buffering conductive layer 1, thickness be the Co of 3nm as first hard magnetic layer 21, thickness is the Al of 1nm
2O
3First intermediate layer 31, thickness are the NiFe soft magnetosphere 4 of 1nm, and thickness is the Al of 1nm
2O
3Second intermediate layer 32, thickness are the Co of 3nm
90Fe
10Second hard magnetic layer 22 and thickness are the Ru cover layer 5 of 4nm.The growth conditions of above-mentioned magnetoresistance effect: be equipped with end vacuum: 5 * 10
-7Handkerchief; Sputter high purity argon air pressure: 0.07 handkerchief; Sputtering power: 120 watts; The specimen holder speed of rotation: 20rmp; Growth temperature: room temperature; Growth rate: 0.3～1.1 dust/second; Growth time: film thickness/growth rate; When the deposited iron magnetosphere, apply the plane induced magnetic field of 150Oe.The magnetoresistance effect that deposition is good adopts micro-processing technology of the prior art, promptly at first pass through gluing, preceding baking, again on electron beam exposure apparatus, according to required polygonal circuit shape structure the sheet base is exposed, then development, photographic fixing, back baking, with ion etching process magnetoresistance effect is carved into the polygonal circuit shape then, soak with glue-dispenser at last and remove photoresist, promptly form octagon closed hoop geometry, the interior octagon length of side of octagon is 300nm, and the length of side of outer octagon is 500nm.On the magnetoresistance effect of the polygonal circuit shape of erosion shaping at the moment, utilize conventional film growth means then, for example magnetron sputtering, electron beam evaporation, pulsed laser deposition, electrochemical deposition, molecular beam epitaxy etc. deposit the thick SiO of one deck 50nm
2Insulating barrier, each polygonal circuit shape multilayer film is buried and isolation mutually, adopt micro-processing technology of the prior art to carry out etching, promptly at first on focused ion beam equipment, navigate to the position that deposits polygonal circuit shape multilayer film, then utilize the focused-ion-beam lithography method SiO
2Insulating barrier carries out etching, makes the magnetoresistance effect of the polygon closed form of burying under the insulating barrier expose.Utilize the high vacuum magnetron sputtering apparatus to deposit the conductive layer Cu of a layer thickness at last for 5nm, growth conditions as previously mentioned, process electrode with conventional semiconductor microactuator processing technology, promptly at first pass through gluing, preceding baking, again in ultraviolet, on the deep ultraviolet exposure machine, utilization has the reticle of pattern to be processed and exposes, then develop, photographic fixing, the back baking, with ion etching process the conductive layer on the magnetoresistance effect is carved into the shape of four electrodes then, soak with glue-dispenser at last and remove photoresist, promptly obtain the two middle stratotype magnetoresistance effect of octagon closed hoop of the present invention, its structural representation is shown in Fig. 5-1-Fig. 5-2.
Embodiment 30,
The two middle stratotype magnetoresistance effect of preparation pinning type octagon closed hoop
Utilize the high vacuum magnetron sputtering apparatus at the thick SiO of 1mm that cleans through conventional method
2On/Si the substrate successively deposit thickness be the Ta of 2nm as bottom buffering conductive layer 1, thickness be the IrMn of 10nm as the first antiferromagnetic pinning layer 81, thickness is the CoFeB first pinned magnetosphere 91 of 5nm, thickness is the Al of 1nm
2O
3First intermediate layer 31, thickness are the Co soft magnetosphere 4 of 1nm, and thickness is the Al of 1nm
2O
3Second intermediate layer 32, thickness are the CoFeB second pinned magnetosphere 92 of 5nm, and thickness is that IrMn second antiferromagnetic pinning layer 82 and the thickness of 10nm is the Ru cover layer 5 of 4nm.The growth conditions of above-mentioned magnetoresistance effect: be equipped with end vacuum: 5 * 10
-7Handkerchief; Sputter high purity argon air pressure: 0.07 handkerchief; Sputtering power: 120 watts; The specimen holder speed of rotation: 20rmp; Growth temperature: room temperature; Growth rate: 0.3～1.1 dust/second; Growth time: film thickness/growth rate; When deposition first antiferromagnetic pinning layer 81, second antiferromagnetic pinning layer 82, first pinned magnetosphere 91, second pinned magnetosphere 92 and soft magnetosphere 4, apply the plane induced magnetic field of 150Oe.The magnetoresistance effect that deposition is good adopts micro-processing technology of the prior art, promptly at first pass through gluing, preceding baking, again on electron beam exposure apparatus, according to required polygonal circuit the sheet base is exposed, then development, photographic fixing, back baking, with ion etching process magnetoresistance effect is carved into the polygonal circuit shape then, soak with glue-dispenser at last and remove photoresist, promptly form octagon closed hoop geometry, the interior octagon length of side of octagon ring is 400nm, and the outer positive six decagonal length of sides are 800nm.On the magnetoresistance effect of the polygonal circuit shape of erosion shaping at the moment, utilize conventional film growth means then, for example magnetron sputtering, electron beam evaporation, pulsed laser deposition, electrochemical deposition, molecular beam epitaxy etc. deposit the thick SiO of one deck 50nm
2Insulating barrier, each polygonal circuit shape multilayer film is buried and isolation mutually, adopt micro-processing technology of the prior art to carry out etching, promptly at first on focused ion beam equipment, navigate to the position that deposits the closed hoop multilayer film, then utilize the focused-ion-beam lithography method SiO
2Insulating barrier carries out etching, makes the close-shaped magnetoresistance effect of burying under the insulating barrier expose.Utilize the high vacuum magnetron sputtering apparatus to deposit the conductive layer Cu of a layer thickness at last for 5nm, growth conditions as previously mentioned, process electrode with conventional semiconductor microactuator processing technology, promptly at first pass through gluing, preceding baking, again in ultraviolet, on the deep ultraviolet exposure machine, utilization has the reticle of pattern to be processed and exposes, then develop, photographic fixing, the back baking, with ion etching process the conductive layer on the magnetoresistance effect is carved into the shape of four electrodes then, soak with glue-dispenser at last and remove photoresist, promptly obtain the two middle stratotype magnetoresistance effect of octagon closed hoop of the present invention, its structural representation is shown in Fig. 6-1-Fig. 6-2.
The two middle stratotype magnetoresistance effect for preparing no pinning type octagon closed hoop containing metal core
Utilize the high vacuum magnetron sputtering apparatus at the thick SiO of 1mm that cleans through conventional method
2On/Si the substrate successively deposit thickness be the Ta of 2nm as bottom buffering conductive layer 1, thickness be the Co of 3nm as first hard magnetic layer 21, thickness is the Al of 1nm
2O
3First intermediate layer 31, thickness are the NiFe soft magnetosphere 4 of 1nm, and thickness is the Al of 1nm
2O
3Second intermediate layer 32, thickness are the Co of 3nm
90Fe
10Second hard magnetic layer 22 and thickness are the Ru cover layer 5 of 4nm.The growth conditions of above-mentioned magnetoresistance effect: be equipped with end vacuum: 5 * 10
-7Handkerchief; Sputter high purity argon air pressure: 0.07 handkerchief; Sputtering power: 120 watts; The specimen holder speed of rotation: 20rmp; Growth temperature: room temperature; Growth rate: 0.3～1.1 dust/second; Growth time: film thickness/growth rate; When the deposited iron magnetosphere, apply 150Oe plane induced magnetic field.The magnetoresistance effect that deposition is good adopts micro-processing technology of the prior art, promptly at first pass through gluing, preceding baking, again on electron beam exposure apparatus, according to required polygonal circuit the sheet base is exposed, then development, photographic fixing, back baking, with ion etching process magnetoresistance effect is carved into the polygonal circuit shape then, soak with glue-dispenser at last and remove photoresist, promptly form octagon closed hoop geometry, the interior octagon length of side of octagon ring is 500nm, and the length of side of outer octagon is 800nm.On the magnetoresistance effect of the polygonal circuit shape of erosion shaping at the moment, utilize conventional film growth means then, for example magnetron sputtering, electron beam evaporation, pulsed laser deposition, electrochemical deposition, molecular beam epitaxy etc. deposit the thick SiO of one deck 50nm
2Insulating barrier is buried each polygonal circuit shape multilayer film and isolation mutually.Adopt micro-processing technology of the prior art, promptly at first on focused ion beam equipment, navigate to the geometric center position of closed hoop multilayer film, then utilize the focused-ion-beam lithography method SiO
2Insulating barrier carries out etching, forming cross section is polygonal hole, wherein the polygon hole length of side is 200nm, utilize focused ion beam assistant depositing method at hole location deposit metallic material Au afterwards, the Au of the column that to form a cross section be octagon is metal-cored 6, and cross sectional shape as previously mentioned.Adopt micro-processing technology of the prior art to carry out etching then, promptly at first on focused ion beam equipment, navigate to the position that deposits polygonal circuit shape multilayer film, then utilize the focused-ion-beam lithography method SiO
2Insulating barrier carries out etching, makes the close-shaped magnetoresistance effect of polygon of burying under the insulating barrier expose.Utilize the high vacuum magnetron sputtering apparatus to deposit the conductive layer Cu of a layer thickness at last for 5nm, growth conditions as previously mentioned, process electrode with conventional semiconductor microactuator processing technology, promptly at first pass through gluing, preceding baking, again in ultraviolet, on the deep ultraviolet exposure machine, utilization has the reticle of pattern to be processed and exposes, then develop, photographic fixing, the back baking, with ion etching process the conductive layer on the magnetoresistance effect is carved into the shape of four electrodes then, soak with glue-dispenser at last and remove photoresist, promptly obtain the two middle stratotype magnetoresistance effect of octagon closed hoop containing metal core of the present invention, its structural representation is shown in Fig. 7-1-Fig. 7-2.
The two middle stratotype magnetoresistance effect of preparation pinning type octagon closed hoop containing metal core
Utilize the high vacuum magnetron sputtering apparatus at the thick SiO of 1mm that cleans through conventional method
2On/Si the substrate successively deposit thickness be 2nm Ta as the buffering conductive layer 1, thickness is the IrMn first antiferromagnetic pinning layer 81 of 10nm, thickness is the CoFeB first pinned magnetosphere 91 of 5nm, thickness is the Al of 1nm
2O
3First intermediate layer 31, thickness are the Co soft magnetosphere 4 of 1nm, and thickness is the Al of 1nm
2O
3Second intermediate layer 32, thickness are the CoFeB second pinned magnetosphere 92 of 5nm, and thickness is that IrMn second antiferromagnetic pinning layer 82 and the thickness of 10nm is the Ru cover layer 5 of 4nm.The growth conditions of above-mentioned magnetoresistance effect: be equipped with end vacuum: 5 * 10
-7Handkerchief; Sputter high purity argon air pressure: 0.07 handkerchief; Sputtering power: 120 watts; The specimen holder speed of rotation: 20rmp; Growth temperature: room temperature; Growth rate: 0.3～1.1 dust/second; Growth time: film thickness/growth rate; When deposition first antiferromagnetic pinning layer 81, second antiferromagnetic pinning layer 82, first pinned magnetosphere 91, second pinned magnetosphere 92 and soft magnetosphere 4, apply 150Oe plane induced magnetic field.The magnetoresistance effect that deposition is good adopts micro-processing technology of the prior art, promptly at first pass through gluing, preceding baking, again on electron beam exposure apparatus, according to required polygonal circuit the sheet base is exposed, then development, photographic fixing, back baking, it is close-shaped with ion etching process magnetoresistance effect to be carved into polygon then, soak with glue-dispenser at last and remove photoresist, promptly form octagon closed hoop geometry, the interior octagon length of side of octagon ring is 500nm, and the length of side of outer octagon is 800nm.On the close-shaped magnetoresistance effect of the polygon that is shaped of erosion at the moment, utilize conventional film growth means then, for example magnetron sputtering, electron beam evaporation, pulsed laser deposition, electrochemical deposition, molecular beam epitaxy etc., the thick SiO of deposition one deck 50nm
2Insulating barrier is buried each polygonal circuit shape multilayer film and isolation mutually.Adopt micro-processing technology of the prior art, promptly at first on focused ion beam equipment, navigate to the geometric center position of polygonal circuit shape multilayer film, then utilize the focused-ion-beam lithography method SiO
2Insulating barrier carries out etching, forming cross section is the hole of octagon, and wherein the length of side is 200nm, utilizes focused ion beam assistant depositing method at hole location deposit metallic material Au afterwards, the Au of the column that to form a cross section be octagon is metal-cored 6, and cross sectional shape as previously mentioned.Adopt micro-processing technology of the prior art to carry out etching then, promptly at first on focused ion beam equipment, navigate to the position that deposits polygonal circuit shape multilayer film, then utilize the focused-ion-beam lithography method SiO
2Insulating barrier carries out etching, makes the magnetoresistance effect of the polygonal circuit shape of burying under the insulating barrier expose.Utilize the high vacuum magnetron sputtering apparatus to deposit the conductive layer Cu of a layer thickness at last for 5nm, growth conditions as previously mentioned, process electrode with conventional semiconductor microactuator processing technology, promptly at first pass through gluing, preceding baking, again in ultraviolet, on the deep ultraviolet exposure machine, utilization has the reticle of pattern to be processed and exposes, then develop, photographic fixing, the back baking, with ion etching process the conductive layer on the magnetoresistance effect is carved into the shape of four electrodes then, soak with glue-dispenser at last and remove photoresist, promptly obtain the two middle stratotype magnetoresistance effect of octagon closed hoop containing metal core, its structure is shown in Fig. 8-1-Fig. 8-2.
Embodiment 33,
Press the oblique triangle closed hoop of described method the no pinning type of preparation of embodiment 1 magnetoresistance effect, its each layer is followed successively by: thickness be the Cr of 20nm as cushioning conductive layer 1, thickness is the Co of 3nm
75Fe
25As hard magnetic layer 2, thickness be the Cu of 3nm as intermediate layer 3, thickness is that the NiFe of 5nm is that the Ta of 4nm is as cover layer 5 as soft magnetosphere 4 and thickness., the interior triangle length of side of this triangle ring-type is respectively 250nm, 350nm, 450nm, corresponding 300nm, 420nm, the 540nm of being respectively of the length of side of outer triangle.
Embodiment 34
Shown in Fig. 9 A-C, the magnetic RAM memory cell array is combined by a large amount of mram cells, in a mram cell, comprise a polygonal circuit shape magnetoresistance effect memory cell 65, transistor 0, the first transition metal layer 4b, contact hole (3a, 3b) and one group of wiring, i.e. bit line 4c, word line 62 and ground wire 4a.
The structure of the magnetoresistance effect in this polygonal circuit shape magnetoresistance effect memory cell 65 is to be grown in the first transition metal layer 4b to go up thickness be that the Au of 2nm is as buffering conductive layer 1, thickness is that the CoFe of 5nm is as hard magnetic layer 2, thickness is the Cu intermediate layer 3 of 1nm, and thickness is the NiFe soft magnetosphere 4 of 1nm and the Ru cover layer 5 that thickness is 4nm, the conductive layer Au that thickness is 10nm.In the described polygonal circuit shape geometry, the interior regular hexagon length of side of regular hexagon ring is 50nm, and the outer orthohexagonal length of side is 100nm, and ring width is 43.3nm.
This regular hexagon closed hoop magnetoresistance effect memory cell 65 and transistor 0 interconnect by the first transition metal layer 4b and contact hole 3b.On the layout bit line 4c is arranged in polygonal circuit shape magnetoresistance effect memory cell 65 above and directly link to each other with regular hexagon closed magnetic multilayer film memory cell 65.
Shown in Fig. 9 B, the whole M ram cell is made of several layers 1a, 1b, 1c, 1f, and the non-functional area in these layers is buried medium such as SiO by insulation
2Bury Deng institute.In mram cell metal wiring layer only have two-layer, i.e. bit line 4c and ground wire 4a and the first transition metal layer 4b, closed magnetic multilayer film memory cell 65 is arranged in bit line 4c below and its upper electrode directly is connected with bit line 4c; The lower electrode of closed magnetic multilayer film memory cell 65 is connected with the drain electrode 0b of transistor 0 by transition metal layer 4b, contact hole 3b.
In the read-write operation of MRAM, according to the spinning moment effect of introducing in the background technology, the electric current in bit line 4c is less than a low critical value I
C1(corresponding current density, J
C1=10
2A/cm
2, electric current=current density * closed magnetic multilayer film sectional area) time, the electric current among the bit line 4c can not change the magnetized state of closed magnetic multilayer film memory cell 65, thereby realizes the read operation of MRAM; And the electric current in bit line 4c is greater than this low critical value I
C1And less than high critical value I
C2(corresponding current density, J
C2=10
5A/cm
2Electric current=current density * closed magnetic multilayer film sectional area) time, sense of current among the bit line 4c will determine the magnetized state of the bit-level (or soft magnetosphere) of closed magnetic multilayer film memory cell 65, make bit-level (or soft magnetosphere) distinguish identical clockwise or counterclockwise or opposite (being the parallel or antiparallel of the magnetization) with the magnetized state of pinned magnetosphere (or hard magnetic layer), thereby obtain low resistance and high resistance two states (promptly obtaining high output voltage and low output voltage two states), just just can realize the write operation of MRAM by the direction of Control current.The MRAM of Here it is present embodiment utilizes the operation principle of spinning moment effect mode.
Thus, with the unit shown in Fig. 9 A, the 9B is example, in the addressing read operation of MRAM, at first provide a suitable level and make transistor 0 work in conducting state by selecteed word line 62, derive a value less than low critical value I by selecteed bit line 4c then
C1Read current, then read current by bit line 4c via source electrode 0a, the contact hole 3a of the drain electrode 0b of closed magnetic multilayer film memory cell 65, the first transition metal layer 4b, contact hole 3b, transistor 0, transistor 0 and arrive ground wire 4a, thereby obtain the current magnetized state of closed magnetic multilayer film memory cell 65 bit-level (or soft magnetosphere), i.e. data of storing in the mram cell; In the addressing write operation of MRAM, at first provide a suitable level and make transistor 0 work in conducting state by selecteed word line 62, derive a value greater than low critical value I by selecteed bit line 4c then
C1And less than high critical value I
C2Write current, because the effect of spinning moment effect, the magnetized state of polygon closed magnetic multilayer film memory cell 65 will be determined by the direction of write current, therefore when write current by bit line 4c via closed magnetic multilayer film memory cell 65, the first transition metal layer 4b, contact hole 3b, the drain electrode 0b of transistor 0, the source electrode 0a of transistor 0, after contact hole 3a arrives ground wire 4a, the magnetized state of the bit-level (soft magnetosphere) of polygon closed magnetic multilayer film memory cell 65 also write by write current immediately, so finished writing of data in the mram cell.
Embodiment 35
Shown in Figure 10 A-C, the magnetic RAM memory cell array is combined by a large amount of mram cells, in a mram cell, comprise a polygonal circuit shape magnetoresistance effect memory cell 65, be arranged in metal-cored 6, transistor 0, the first transition metal layer 4b, contact hole 3a, 3b and one group of wiring, the i.e. first bit line 4e, the second bit line 4d, word line 62 and the ground wire 4a of the geometric center of polygonal circuit shape magnetoresistance effect memory cell 65.Polygonal circuit shape magnetoresistance effect memory cell 65 and transistor 0 interconnect by the first transition metal layer 4b and contact hole 3b.On the layout bit line second bit line 4d is arranged in polygonal circuit shape magnetoresistance effect memory cell 65 above and directly link to each other with this polygonal circuit shape magnetoresistance effect memory cell, the first bit line 4e is arranged in the top of the second bit line 4d, and parallel with the second bit line 4d, isolate by insulating barrier 1e between the two.
The structure of the magnetoresistance effect in this polygonal circuit shape magnetoresistance effect memory cell 65 is to be grown in the first transition metal layer 4b to go up the Cr buffering conductive layer 1 that thickness is 10nm, and thickness is the antiferromagnetic pinning layer 8 of the PtMn of 10nm, and thickness is the Ni of 2nm
79Fe
21Pinned magnetosphere 9, thickness are the TiO intermediate layer 3 of 0.8nm, and thickness is the Ni of 1nm
79Fe
21Soft magnetosphere 4 and thickness are the Pt cover layer 5 of 2nm.In the described polygonal circuit shape geometry, the interior octagon length of side of octagon ring is 500nm, and the length of side of outer octagon is 600nm.Be arranged in octagon closed magnetic multilayer film memory cell 65 geometric center metal-cored 6 for the cross section is that the Au of octagon is metal-cored, the length of side is 300nm.
Shown in Figure 10 B, the whole M ram cell is made of several layers 1a, 1b, 1c, 1e, 1f, and the non-functional area in these layers is buried medium such as SiO by insulation
2Bury Deng institute.Metal wiring layer only has three layers in mram cell, the i.e. first bit line 4e, the second bit line 4d and ground wire 4a and the first transition metal layer 4b, closed magnetic multilayer film memory cell 65 is arranged in second bit line 4d top and its upper electrode directly is connected with the first bit line 4e; The lower electrode of closed magnetic multilayer film memory cell 65 is connected with the drain electrode 0b of transistor 0 by the first transition metal layer 4b, contact hole 3b; Be arranged in metal-cored 6 directly being connected of geometric center of closed magnetic multilayer film memory cell 65 with the first bit line 4e at top and the first transition metal layer 4b of bottom.
Thus, with the unit shown in Figure 10 A, the 10B is example, in the addressing read operation of MRAM, at first provide a suitable level and make transistor 0 work in conducting state by selecteed word line 62, derive a value less than low critical value I by the selecteed second bit line 4d then
C1Read current (corresponding current density, J
C1=10
2A/cm
2Electric current=current density * closed magnetic multilayer film sectional area), then read current by second bit line via drain electrode 0a, the contact hole 3a of the source electrode 0b of closed magnetic multilayer film memory cell 65, the first transition metal layer 4b, contact hole 3b, transistor 0, transistor 0 and arrive ground wire 4a, thereby obtain the current magnetized state of closed magnetic multilayer film memory cell 65 bit-level (or soft magnetosphere), i.e. data of storing in the mram cell; In the addressing write operation of MRAM, at first provide a suitable level and make transistor 0 work in conducting state by selecteed word line 62, derive a value greater than low critical value I by the selecteed first bit line 4e then
C1And less than high critical value I
C2Write current (corresponding current density, J
C2=10
5A/cm
2Electric current=current density * metal-cored sectional area), because the magnetic field that write current produces also distributes in the form of a ring, thereby the magnetized state that can control the bit-level (soft magnetosphere) of closed magnetic multilayer film memory cell 65 is orientated clockwise or counterclockwise, make bit-level (soft magnetosphere) distinguish identical clockwise or counterclockwise or opposite (being the parallel or antiparallel of the magnetization) with the magnetized state of pinned magnetosphere 9, thereby obtain low resistance and high resistance two states (promptly obtaining high output voltage and low output voltage two states), just just can realize the write operation of MRAM by the direction of Control current.After write current arrives ground wire 4a by the first bit line 4e via drain electrode 0a, the contact hole 3a of the source electrode 0b of metal-cored 6, the first transition metal layer 4b, contact hole 3b, transistor 0, transistor 0, the magnetized state of the bit-level of closed magnetic multilayer film memory cell 65 (soft magnetosphere) also write by write current immediately, so finished writing of data in the mram cell.
Embodiment 36
Shown in Figure 11 A-C, the magnetic RAM memory cell array is combined by a large amount of mram cells, in a mram cell, comprise a polygonal circuit shape magnetoresistance effect memory cell 65, be arranged in metal-cored 6, transistor 0, the first transition metal layer 4b, ground wire 4a, contact hole (3a, 3b, 3b2) and one group of wiring, i.e. bit line 4c, second word line 63, first word line 67 and the ground wire 4a of the geometric center of polygonal circuit shape magnetoresistance effect memory cell 65.Polygonal circuit shape magnetoresistance effect memory cell 65 and transistor 0 interconnect by the first transition metal layer 4b and contact hole 3b.On the layout bit line 4c is arranged in polygonal circuit shape magnetoresistance effect memory cell 65 above and directly link to each other with polygonal circuit shape magnetoresistance effect memory cell 65.
The structure of the magnetoresistance effect in this polygonal circuit shape magnetoresistance effect memory cell 65 is the Ta buffering conductive layer 1 of 2nm for the thickness that deposits successively on the second transition metal layer 4f, thickness is the antiferromagnetic pinned magnetic 8 of the IrMn of 5nm, thickness is the pinned magnetosphere 9 of the CoFeB of 2nm, and thickness is the Al of 0.8nm
2O
3Intermediate layer 3, thickness are the CoFeB soft magnetosphere 4 of 1nm and the Ta cover layer 5 that thickness is 2nm.Described polygon is a regualr decagon closed hoop geometry, and the interior regualr decagon length of side of regualr decagon ring is 400nm, and the length of side of outer regualr decagon is 700nm.Be arranged in polygonal circuit shape magnetoresistance effect memory cell 65 geometric center metal-cored 6 for the cross section is the Au of regualr decagon, the length of side is 200nm.
Shown in Figure 11 B, the whole M ram cell is made of several layers 1a, 1b, 1c, 1d, 1f, and the non-functional area in these layers is buried medium such as SiO by insulation
2Bury Deng institute.Metal wiring layer only has three layers in mram cell, i.e. bit line 4c, the second transition metal layer 4f, the first transition metal layer 4b, and polygon closed magnetic multilayer film memory cell 65 is arranged in bit line 4c below and its upper electrode directly is connected with bit line 4c; The lower electrode of polygon closed magnetic multilayer film memory cell 65 is connected with the first drain electrode 0b1 of transistor 0 by the first transition metal layer 4b, contact hole 3b, contact hole 3d; Be arranged in metal-cored 6 directly being connected of geometric center of polygon closed magnetic multilayer film memory cell 65 with the bit line 4c at top and the second transition metal layer 4f of bottom; Transistor 0 is made up of two service areas, two shared same drain electrode 0a1 in service area, the source electrode of the first transistor and transistor seconds is respectively 0b1 and 0b2, and two transistors operating state is separately controlled by first word line 67 and second word line, the 63 given level that are arranged in the grid top respectively.
Thus, with the unit shown in Figure 11 A, the 11B is example, in the addressing read operation of MRAM, at first provide a suitable level and make the first transistor of transistor 0 work in conducting state by selecteed first word line 67, derive a value less than low critical value I by selecteed bit line 4c then
C1Read current (corresponding current density, J
C1=10
2A/cm
2Electric current=current density * closed magnetic multilayer film sectional area), then read current by bit line 4c via public drain electrode 0a1, the contact hole 3a of the first source electrode 0b1 of closed magnetic multilayer film memory cell 65, the second transition metal layer 4f, contact hole 3b, the first transition metal layer 4b, contact hole 3b, transistor 0, transistor 0 and arrive ground wire 4a, thereby obtain the current magnetized state of closed magnetic multilayer film memory cell 65 bit-level (soft magnetosphere), i.e. data of storing in the mram cell; In the addressing write operation of MRAM, at first provide a suitable level and make the transistor seconds of transistor 0 work in conducting state by selecteed second word line 63, derive a value greater than low critical value I by selecteed bit line 4c then
C1And less than high critical value I
C2Write current (corresponding current density, J
C2=10
5A/cm
2Electric current=current density * metal-cored sectional area), because the magnetic field that write current produces also distributes in the form of a ring, thereby the magnetized state that can control the bit-level (soft magnetosphere) of closed magnetic multilayer film memory cell 65 is orientated clockwise or counterclockwise, make bit-level (soft magnetosphere) distinguish identical clockwise or counterclockwise or opposite (being the parallel or antiparallel of the magnetization) with the magnetized state of pinned magnetosphere 9, thereby obtain low resistance and high resistance two states (promptly obtaining high output voltage and low output voltage two states), just just can realize the write operation of MRAM by the direction of Control current.After write current arrives ground wire 4a by bit line 4c via public drain electrode 0a, the contact hole 3a of the second source electrode 0b2 of metal-cored 6, the first transition metal layer 4b, contact hole 3b2, transistor 0, transistor 0, the magnetized state of the bit-level of closed magnetic multilayer film memory cell 65 (soft magnetosphere) also write by write current immediately, so finished writing of data in the mram cell.
Utilize conventional film growth means in the above-described embodiments, for example magnetron sputtering, electron beam evaporation, pulsed laser deposition, electrochemical deposition, molecular beam epitaxy etc. all can.
Claims (20)
1. magnetoresistance effect with geometry comprises each layer of the magnetoresistance effect unit that is deposited on the substrate; It is characterized in that the cross section of described magnetoresistance effect unit is closed hoop, magnetic moment with ferromagnetic thin layer or magnetic flux in this magnetoresistance effect unit form clockwise or counterclockwise closure state.
2. by the described magnetoresistance effect of claim 1, it is characterized in that the cross section of described magnetoresistance effect unit is N limit shape closed hoop with geometry; Wherein N is 3 or is positive integer more than 3.
3. by claim 1 or 2 described magnetoresistance effects with geometry, it is characterized in that, the inner edge length of side of the polygonal circuit of described magnetoresistance effect unit is 10～100000nm, and the length of side of outside is 20～200000nm, and the width of closed hoop is between 10～100000nm.
4. by the described magnetoresistance effect of claim 1 with geometry, it is characterized in that: described cross section is the magnetoresistance effect of the magnetoresistance effect of polygonal circuit shape for no pinning type, comprises buffering conductive layer, hard magnetic layer, intermediate layer, soft magnetosphere and cover layer;
Described buffering conductive layer is made up of metal material, and thickness is 2～200nm;
Described hard magnetic layer is made up of the material of giant magnetoresistance effect, and thickness is 2～20nm;
Described intermediate layer is made of non-magnetic metal layer or insulator barrier layer, and the thickness in intermediate layer is 0.5～10nm;
The composition material of described soft magnetosphere is the spin polarizability height, and the ferromagnetic material that coercive force is little, the thickness of described soft magnetosphere are 1～20nm;
Described cover layer is formed by being difficult for oxidized metal material, and thickness is 2～20nm.
5. the magnetoresistance effect of stating by claim 4 with geometry is characterized in that:
The composition material of described buffering conductive layer is Ta, Ru, Cr, Au, Ag, Pt, Ta, W, Ti, Cu, Al or Si-Al alloy;
The composition material of described hard magnetic layer is Co, Fe, Ni, CoFe, NiFeCo, CoFeB or CoFeSiB;
The non-magnetic metal layer in described intermediate layer is Ti, Zn, ZnMn, Cr, Ru, Cu, V or TiC; The insulator barrier layer in described intermediate layer is Al
2O
3, MgO, TiO, ZnO, (ZnMn) O, CrO, VO, or TiCO;
The composition material of described soft magnetosphere is Co, Fe, and Ni or their metal alloy, this alloy are NiFe, CoFeSiB or NiFeSiB, or amorphous Co
100-x-yFe
xB
y, wherein 0＜x＜100,0＜y≤20, or Co
2MnSi, Co
2Cr
0.6Fe
0.4Al;
Described tectal composition material is Ta, Cu, Ru, Pt, Ag, Au, Cr or its alloy.
6. by the described magnetoresistance effect of claim 1 with geometry, it is characterized in that: the magnetoresistance effect of described polygonal circuit shape is the magnetoresistance effect of pinning type, comprises buffering conductive layer, antiferromagnetic pinning layer, pinned magnetosphere, intermediate layer, soft magnetosphere and cover layer;
Described buffering conductive layer is made up of metal material, and this buffering conductive layer thickness is 2～200nm;
Described antiferromagnetic pinning layer is by having anti-ferromagnetic alloy composition, and its thickness is 3～30nm;
Described pinned magnetospheric composition material is a ferromagnetic metal, and its thickness is 2～20nm;
Described intermediate layer is made of non-magnetic metal layer or insulator barrier layer, and its thickness is 0.5～10nm;
The ferromagnetic material that the composition material of described soft magnetosphere is the spin polarizability height, coercive force is little, thickness are 1～20nm;
Described cover layer is formed by being difficult for oxidized metal material, and thickness is 2～20nm.
7. by the described magnetoresistance effect of claim 6, it is characterized in that with geometry:
The composition material of described buffering conductive layer is Ta, Ru, Cr, Au, Ag, Pt, Ta, W, Ti, Cu, Al or Si-Al alloy;
The composition material of described antiferromagnetic pinning layer is IrMn, FeMn, PtMn, CrMn or Pt (Cr, Mn) alloy;
Described pinned magnetospheric composition material is Fe, Co, Ni or its alloy;
The non-magnetic metal layer in described intermediate layer is Ti, Zn, ZnMn, Cr, Ru, Cu, V or TiC; The insulator barrier layer in described intermediate layer is Al
2O
3, MgO, TiO, ZnO, (ZnMn) O, CrO, VO, or TiCO;
The composition material of described soft magnetosphere is Co, Fe, Ni or their metal alloy, or amorphous Co
100-x-yFe
xB
y, wherein, 0＜x＜100,0＜y≤20, or NiFeSiB, or Heusler alloy;
Described tectal composition material is Ta, Cu, Ru, Pt, Ag, Au, Cr or its alloy.
8. by the described magnetoresistance effect of claim 1 with geometry, it is characterized in that: the magnetoresistance effect of described polygonal circuit shape is followed successively by buffering conductive layer, first hard magnetic layer, first intermediate layer, soft magnetosphere, second intermediate layer, second hard magnetic layer and cover layer for the two intermediate layers of no pinning magnetic multilayer film;
Described buffering conductive layer is made up of metal material, and thickness is 2～200nm;
Described first and second hard magnetic layers are made up of the big material of giant magnetoresistance effect, and thickness is 2～20nm;
Described first and second intermediate layers are made of non-magnetic metal layer or insulator barrier layer, and the thickness in intermediate layer is 0.5～10nm;
The composition material of described soft magnetosphere is the spin polarizability height, and the ferromagnetic material that coercive force is little, the thickness of described soft magnetosphere are 1～20nm;
Described cover layer is formed by being difficult for oxidized metal material, and thickness is 2～20nm.
9. by the described magnetoresistance effect of claim 8, it is characterized in that with geometry:
The composition material of described buffering conductive layer is Ta, Ru, Cr, Au, Ag, Pt, Ta, W, Ti, Cu, Al or Si-Al alloy;
The composition material of described first and second hard magnetic layers is Co, Fe, Ni, CoFe, NiFeCo, CoFeB or CoFeSiB;
The non-magnetic metal layer in described first and second intermediate layers is Ti, Zn, ZnMn, Cr, Ru, Cu, V or TiC; The insulator barrier layer in described intermediate layer is Al
2O
3, MgO, TiO, ZnO, (ZnMn) O, CrO, VO, or TiCO;
The composition material of described soft magnetosphere is Co, Fe, Ni or their metal alloy NiFe, CoFeSiB, NiFeSiB, or amorphous Co
100-x-yFe
xB
y, wherein 0＜x＜100,0＜y≤20, or Co
2MnSi, Co
2Cr
0.6Fe
0.4Al;
Described tectal composition material is Ta, Cu, Ru, Pt, Ag, Au, Cr or its alloy.
10. by the described magnetoresistance effect of claim 1 with geometry, it is characterized in that: the magnetoresistance effect of described polygonal circuit shape is two intermediate layers magnetic multilayer film of pinning type closed hoop, comprising: buffering conductive layer, the first antiferromagnetic pinning layer, the first pinned magnetosphere, first intermediate layer, soft magnetosphere, second intermediate layer, the second pinned magnetosphere, second antiferromagnetic pinning layer and the cover layer;
Described buffering conductive layer is made up of metal material, and thickness is 2～200nm;
The described first and second antiferromagnetic pinning layers are by having anti-ferromagnetic alloy composition, and thickness is 3～30nm;
The described first and second pinned magnetospheric composition materials are the ferromagnetic metal with high spinning polarizability, and thickness is 2～20nm;
Described first and second intermediate layers are made of non-magnetic metal layer or insulator barrier layer, and the thickness in intermediate layer is 0.5～10nm;
The ferromagnetic material that the composition material of described soft magnetosphere is the spin polarizability height, coercive force is little, thickness are 1～20nm;
Described cover layer is formed by being difficult for oxidized metal material, and thickness is 2～20nm.
11., it is characterized in that by the described magnetoresistance effect of claim 10 with geometry:
The composition material of described buffering conductive layer is Ta, Ru, Cr, Au, Ag, Pt, Ta, W, Ti, Cu, Al or Si-Al alloy;
The composition material of the described first and second antiferromagnetic pinning layers is IrMn, FeMn, PtMn, CrMn or Pt (Cr, Mn) alloy;
The described first and second pinned magnetospheric composition materials are Fe, Co, Ni or its alloy;
The non-magnetic metal layer in described first and second intermediate layers is Ti, Zn, ZnMn, Cr, Ru, Cu, V or TiC; The insulator barrier layer in described intermediate layer is Al
2O
3, MgO, TiO, ZnO, (ZnMn) O, CrO, VO, or TiCO;
The composition material of described soft magnetosphere is Co, Fe, Ni or their metal alloy, or amorphous Co
100-x-yFe
xB
y, wherein, 0＜x＜100,0＜y≤20, or NiFeSiB, or Heusler alloy;
Described tectal composition material is Ta, Cu, Ru, Pt, Ag, Au, Cr or its alloy.
12. a method for preparing claim 4,6,8,10 described polygonal circuit shape magnetoresistance effects comprises following step:
1) selects a substrate, adopt the cleaning method of conventional micro fabrication to clean this substrate;
2) utilize conventional film growth means, on above-mentioned substrate, deposit each layer of magnetoresistance effect successively; When deposition has ferromagnetic thin layer, select to apply the plane induced magnetic field of magnetic field intensity 50～5000 Oe;
3) adopt micro fabrication, with step 2) deposited the sheet base of magnetoresistance effect on the substrate that obtains, carry out micro fabrication and be processed into polygonal circuit shape structure;
4) on the close-shaped magnetoresistance effect of the polygon that the etching that step 3) obtains is shaped, utilize conventional film growth means, deposition one deck 100～1000nm insulating barrier is buried each polygonal circuit shape multilayer film and is isolated different unit mutually;
5) utilize the ultraviolet of micro fabrication, deep ultraviolet to expose or electron beam exposure method, and focused-ion-beam lithography or chemical reaction are done and are carved or chemical reaction is wet carves, the magnetoresistance effect of burying under the insulating barrier is exposed on the position that deposits polygonal circuit shape multilayer film insulating barrier being carried out etching, obtain the magnetoresistance effect of polygonal circuit shape;
6) utilize conventional film growth means to make top electrode, deposition one deck conductive layer on the magnetoresistance effect unit of the polygonal circuit shape that step 5) obtains, utilize conventional semiconductor microactuator processing technology again, conductive layer is processed into electrode, each closed hoop structure is drawn four electrodes, this conductive layer is Au, Ag, Pt, Cu, Al, SiAl metal or its their alloy, and its thickness is 2～200nm;
The thin film growth process of described routine comprises technologies such as magnetron sputtering, electron beam evaporation, pulsed laser deposition, electrochemical deposition, molecular beam epitaxy.
The concrete steps of described micro fabrication are: at first pass through gluing, preceding baking, again on ultraviolet, deep ultraviolet exposure or electron beam exposure apparatus, according to required closed form figure the sheet base is exposed, then development, photographic fixing, back baking, with ion etching process magnetoresistance effect is carved into close-shapedly then, soaks with glue-dispenser at last and remove photoresist.
13. by claim 1,4,6,8,10 described magnetoresistance effects with geometry, it is characterized in that, also comprise one metal-cored, this metal-cored geometric center position that is arranged on the polygonal circuit of described magnetoresistance effect unit, the shape of shape that this is metal-cored and closed hoop polygon magnetoresistance effect is complementary, this metal-cored cross section correspondingly is a N limit shape, and wherein N is the integer more than or equal to three; Described N limit each metal-cored length of side of shape is 5～50000nm.
14., it is characterized in that described metal-cored material comprises Ag, Pt, Ta, W, Ti, Cu, Al or Si-Al alloy by the described magnetoresistance effect of claim 13 with geometry.
15. one kind prepares the described method that comprises the magnetoresistance effect of metal-cored polygonal circuit shape of claim 13, comprises following step:
1) select a substrate, after cleaning through conventional method, deposition buffering conductive layer on the film growth apparatus of routine, this buffering conductive layer becomes conductive electrode when following process;
2) utilize conventional film growth means, on the buffering conductive layer, deposit each layer of magnetoresistance effect successively; When the deposition magnetosphere, select to apply the plane induced magnetic field that magnetic field intensity is 50～5000 Oe;
3) adopt micro fabrication and method with step 2) in deposited magnetoresistance effect substrate be processed into polygonal circuit shape structure;
4) on the magnetoresistance effect of the polygonal circuit shape that etching that step 3) obtains is shaped, utilize conventional film growth means, deposition one deck 100～1000nm insulating barrier is buried each closed hoop multilayer film and is isolated different unit mutually;
5) utilize micro fabrication, metal-cored one of the geometric center position of polygonal circuit shape multilayer film preparation, the shape of the magnetoresistance effect of shape that this is metal-cored and polygon closed form is complementary, and its cross section is a polygon;
6) utilize the ultraviolet of micro fabrication, deep ultraviolet to expose or electron beam exposure method, and focused-ion-beam lithography or chemical reaction are done and are carved or chemical reaction is wet carves, the magnetoresistance effect of burying under the insulating barrier is exposed on the position that deposits the closed hoop multilayer film insulating barrier being carried out etching, obtains the magnetoresistance effect that comprises metal-cored polygonal circuit shape of the present invention:
The concrete steps of described micro fabrication are: at first pass through gluing, preceding baking, again on ultraviolet, deep ultraviolet exposure or electron beam exposure apparatus, according to required polygonal circuit shape figure the sheet base is exposed, then development, photographic fixing, back baking, with ion etching process magnetoresistance effect is carved into closed hoop then, soaks with glue-dispenser at last and remove photoresist;
16. the magnetic RAM of a claim 1,4,6,8,10 described magnetic multilayer film formations comprises:
The memory read/write control unit array that transistor unit and magnetoresistance effect unit constitute, this read-write control unit array is integrated in the Semiconductor substrate;
The transition metal layer that connects described transistor unit and described magnetoresistance effect memory cell; And word line, bit line and ground wire, described word line also is described transistorized grid simultaneously, described bit line is arranged in the top of described magnetoresistance effect memory cell, and vertical mutually with described word line, and directly is connected with described magnetoresistance effect memory cell; It is characterized in that the cross section of described magnetoresistance effect unit is the polygonal circuit shape, the inner edge length of side of this polygonal circuit is 10～100000nm, and the length of side of outside is 20～200000nm, and the width of closed hoop is between 10～100000nm.
17. an application rights requires the magnetic RAM of 13 described magnetic multilayer film formations, comprising:
The memory read/write control unit array that transistor unit and magnetoresistance effect unit constitute, this read-write control unit array is integrated in the Semiconductor substrate;
Memory cell and array thereof; Be characterised in that, the cross section of the magnetoresistance effect unit of described memory cell is the polygonal circuit shape, and being provided with one metal-coredly in the geometric center position of the magnetoresistance effect of described memory cell, this is metal-cored to have the corresponding shape of cross section in magnetoresistance effect unit with described memory cell; The inner edge length of side of described polygonal circuit is 10～100000nm, and the length of side of outside is 20～200000nm, and the width of closed hoop is between 10～100000nm;
The transition metal layer that connects the closed magnetic multilayer film memory cell of transistor unit and containing metal core; And word line and two bit lines, described word line also is described transistorized grid simultaneously, described two bit lines are arranged in the top of the closed magnetic multilayer film memory cell of described containing metal core, wherein article one bit line is vertical mutually with described word line, and directly be connected with the closed magnetic multilayer film memory cell of described containing metal core, metal-cored in the closed magnetic multilayer film memory cell of second bit line and described containing metal core directly links to each other, and isolated mutually by a layer insulating and article one bit line.
18. an application rights requires the 13 described magnetic RAMs that comprise metal-cored polygonal circuit shape magnetoresistance effect, comprising:
The memory read/write control unit array that the first transistor unit, transistor seconds unit and magnetoresistance effect unit constitute, this read-write control unit array is integrated in the Semiconductor substrate; The first transistor switch control read operation, transistor seconds switch control write operation; The grid of the first transistor is also as first word line, and the grid of transistor seconds is also as second word line;
Memory cell and array thereof; It is characterized in that: the cross section of the magnetoresistance effect unit of described memory cell is the polygonal circuit shape, and being provided with one metal-coredly in the geometric center position of the magnetoresistance effect of described memory cell, this is metal-cored to have the corresponding shape of cross section in magnetoresistance effect unit with described memory cell; The inner edge length of side of described polygonal circuit is 10～100000nm, and the length of side of outside is 20～200000nm, and the width of closed hoop is between 10～100000nm;
On the source electrode of the source electrode of the common drain of the first transistor and transistor seconds, the first transistor, transistor seconds, the first conduction contact hole, the second conduction contact hole, the 3rd conduction contact hole are set respectively, and respectively with and on transition metal layer be connected separately; Transition metal layer on first contact hole also constitutes set ground wire simultaneously; The 4th conduction contact hole links to each other with second transition metal layer; This second transition metal layer links to each other as the lower end of bottom conducting electrode with the magnetoresistance effect of described closed form containing metal core, and the upper end of the magnetoresistance effect of this closed form containing metal core is provided with bit line and is attached thereto; The described metal-cored upper end that is arranged on the magnetoresistance effect center of closed form containing metal core contacts with bit line, and the lower end is connected with first transition metal layer; Cover on the bit line by insulating barrier.
19. the method for the access of the magnetic RAM of the described closed magnetic multilayer film of claim 16 storage, it is read operation and the write operation of realizing MRAM by the size and Orientation of the electric current in the memory cell of flowing through, and is specific as follows:
By the electric current of control flows in the closed magnetic multilayer film memory cell, when less than low critical value I
C1, its bit-level magnetized state can not changed, and realizes the read operation of MRAM, and described bit-level is a soft magnetosphere;
By the electric current of control flows in the closed magnetic multilayer film memory cell, when greater than low critical value I
C1And less than high critical value I
C2The time, sense of current will change the magnetized state of closed magnetic multilayer film memory cell bit-level, by the driving action of forward and negative sense spin polarization tunnelling current and the synergy of spinning moment, the magnetized state of realizing its bit-level is orientated clockwise or counterclockwise, make bit-level identical clockwise or counterclockwise or opposite respectively with the magnetized state of pinned magnetosphere or hard magnetic layer, obtain high output voltage and low output voltage two states, realize the MRAM write operation;
Described low critical value I
C1=current density, J
C1* closed magnetic multilayer film sectional area, current density, J
C1=10～10
2A/cm
2
Described high critical value I
C2=current density, J
C2* closed magnetic multilayer film sectional area, current density, J
C2=10
2～10
6A/cm
2
20. the method for the access of the magnetic RAM of the described polygonal circuit shape of claim 17 magnetoresistance effect storage, it is by the metal-cored electric current that applies in the memory cell being realized the write operation of MRAM, realize the read operation of MRAM by the tunnelling current that the closed magnetic multilayer film among the memory cell RML is applied, specific as follows:
By control flows through the electric current of the magnetoresistance effect memory cell of closed form containing metal core less than low critical value I
C1The time, the magnetized state of its bit-level can not changed, and realizes the read operation of MRAM;
By the electric current in control flows metal-cored in closed form containing metal core magnetoresistance effect memory cell, because the magnetic field that electric current produces distributes in the form of a ring, the magnetized state of control closed magnetic multilayer film, realize the write operation of MRAM, concrete grammar is: apply electric current greater than low critical value I in metal-cored in the closed form containing metal core magnetoresistance effect memory cell
C1And less than high critical value I
C2The time, sense of current will change the magnetized state of closed magnetic multilayer film memory cell bit-level, drive current by forward and negative sense produces clockwise or anticlockwise magnetic field, the magnetized state of realizing its bit-level is orientated clockwise or counterclockwise, obtain low resistance and high resistance two states, realize the write operation of MRAM.
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