CN101038808A - Coil with leads and manufacturing method thereof - Google Patents

Abstract

The invention discloses a manufacturing method of a coil with pins, which comprises the following steps: at least one conductive bump is formed on a substrate having at least one pin, and at least one end of at least one coil body is disposed on the pin, and the end of the coil body contacts with the corresponding conductive bump. And then, changing the shape of the conductive bump to connect the coil body and the pin together by the conductive bump.

Description

Coil with leads and manufacturing method thereof

technical field

The invention relates to a coil and a manufacturing method thereof, in particular to a coil with pins and a manufacturing method thereof.

Background technique

The coil is one of the important electronic components. The bonding of the coil body and the metal pins in the prior art includes generating thousands of volts of ultra-high voltage discharge through a high-voltage spot welder, and welding the coil body and the pins one by one by manual operation. Solder joint method is performed. However, neither of these two joining methods can meet the manufacturing requirements of mass production. Although high-pressure spot welding can obtain sufficient joint strength and reliability, it needs spot welding processing point by point and requires precise positioning, so the production speed is slow, and it is not easy to inspect the quality after spot welding. Manual operation requires a lot of labor and man-hours, and it is also difficult to control the quality of solder joints.

Therefore, how to provide a coil with leads and a manufacturing method thereof suitable for mass production and easy for quality control is one of the current important issues.

Contents of the invention

In view of the above problems, the purpose of the present invention is to provide a coil with leads and a manufacturing method thereof suitable for mass production, and the connection between the coil body and the leads has good bonding strength and reliability.

In order to achieve the above object, a method of manufacturing a coil with leads according to the present invention includes the following steps: forming at least one conductive bump on a substrate with at least one lead, and then attaching at least one end of at least one coil body placed on the pin, and the end of the coil body is in contact with the corresponding conductive bump. Afterwards, the shape of the conductive bump is changed so that the coil body and the pin are connected together by the conductive bump.

To achieve the above purpose, a coil with pins according to the present invention includes at least one pin and a coil body. At least one end of the coil body is connected to the pin, and a conductive bump is formed on the coil body or the pin by printing, filling or screening, and the shape of the conductive bump is changed. Engage the coil body and the pin.

To achieve the above object, another manufacturing method of a coil with leads according to the present invention includes the following steps: placing at least one coil body on a substrate with at least one lead, and at least one end of the coil body is located on the on the pin. At least one conductive bump is formed on the pin or the end, and the shape of the conductive bump is changed so that the coil body and the pin are connected together by the conductive bump.

The coil body is located between the paired pins, and the two ends of the coil body respectively correspond to the paired pins, wherein at least one conductive substance is respectively arranged at the end of the coil body or the connection of the paired pins , and change the shape of the conductive substance to join the coil body and the paired pins.

Based on the above, according to a coil with pins and its manufacturing method of the present invention, a conductive substance is formed on the coil body or the connection of the pins by printing, and then the shape of the conductive substance is changed to join the coil Body and this pin. Compared with the prior art, the present invention does not need to use additional spot welding machines or special equipment, only using the template, the jig and the device (such as a heating device) for changing the shape of the conductive substance can easily and accurately The coil body and the pins are ground-bonded, which is suitable for mass production and further reduces manufacturing costs. Since the thickness of the template and the size of the holes can accurately and uniformly control the size of each conductive substance, it is easy to control the effect of production quality. In addition, when the conductive substance is heated to change shape, it will only be adsorbed near the contact part between the coil body and the pin due to capillary phenomenon, not only will not overflow or pollute the pin, the coil body or other parts, but also can improve The bonding strength and reliability of the coil body and the pin can further obtain a coil with pins with good uniformity and pass rate, which is beneficial to subsequent assembly.

Description of drawings

Fig. 1 is a flow chart of a method for manufacturing a coil with leads according to a preferred embodiment of the present invention;

2A to 2F are schematic diagrams of a manufacturing method of a coil with leads according to a preferred embodiment of the present invention.

Description of component symbols:

1 Substrate 11 Pins

2 Templates 21 Holes

3 jig 31 groove

4 Heating device

C Coil body S Conductive bump

S11～S16 Process steps

Detailed ways

A coil with leads and a manufacturing method thereof according to preferred embodiments of the present invention will be described below with reference to related drawings, wherein the same elements will be described with the same reference symbols.

Please refer to Fig. 1 and Fig. 2A to Fig. 2F, a method for manufacturing a coil with pins in a preferred embodiment of the present invention includes the following steps:

In step S11 , at least one conductive bump S is formed on the substrate 1 having at least one pair of pins 11 (as shown in FIG. 2B ). Specifically, a template 2 (as shown in FIG. 2A ) having at least one or more holes 21 is covered on the substrate 1 , and the holes 21 correspond to the ends of the pins 11 respectively. The holes 21 can be circular, polygonal, elliptical, regular or irregular in shape. Next, a conductive material is used to form conductive bumps S in the holes 21 by printing, filling, or screening methods, and the conductive bumps S are in contact with the pins. The conductive bump S is preferably adhered and attached to the ends of the pins 11 .

In addition, in this embodiment, the substrate 1 and the pairs of pins 11 can be formed integrally, and the material of the substrate 1 and the pairs of pins 11 is not limited, it can be a metal or an alloy, And the substrate 1 can be a steel plate. The material of the template 2 can be a metal or an alloy, here a steel plate is taken as an example. The material of the conductive bump S can be solder paste, solder ball, thermally deformable material or easy-to-shape material.

In step S12 , the two ends of at least one coil body C are respectively placed on the ends of the pins 11 , and the two ends of the coil body C are respectively contacted with the corresponding conductive bumps S. What's more, the substrate 1 can also be placed on a jig 3 having a plurality of grooves 31 (as shown in FIG. 2C ), and then the coil body C is placed in these grooves 31 (as shown in FIG. 2D ). shown), so that the two ends of the coil body C can be accurately and quickly positioned on the pin 11. In this way, the reliability and yield of the joint between the coil body C and the pin 11 can be greatly improved. In addition, the distance between the pairs of pins 11 is preferably greater than the winding diameter of the coil body C. As shown in FIG.

In step S13 , the shape of the conductive bump S is changed by means of heating, ultrasonic wave, etc., so that the coil body C and the pin 11 are connected together by the conductive bump S. Specifically, the jig 3 loaded with the coil body C, the conductive bump S and the pin 11 is sent to the heating device 4 for heating, so that the conductive bump S is deformed (such as transformed into a molten state), and At the same time, join the end of the coil body C with the pins 11 . After the deformed conductive bump S is cured, the bonding between the end of the coil body C and the pins 11 is completed. The aforementioned heating device 4 may be an oven, a heat gun, a heater or an infrared heating furnace (IR furnace). At this time, the coil body C is fixed on the substrate 1 .

In addition, when the conductive bump S is in a molten state, the conductive bump S will only be adsorbed near the contact portion between the coil body C and the pins 11 due to capillary action, and the molten conductive bump S will not will overflow or pollute the pins 11, the coil body C or other parts, and can also improve the joint strength and reliability of the coil body C and the pins 11, and further obtain a product with good uniformity and pass rate. The coil with pins is convenient for later assembly.

Then in step S14 , the end of the pin 11 not connected to the coil body C is separated from the substrate 1 to obtain a coil with pins (please refer to FIG. 2F ). When multiple sets of pins 11 are provided on the substrate 1, coils with pins can be produced in large quantities, stably and accurately.

In addition, since the formed conductive bump S can be limited by the size of the hole 21 of the template 2, the usage amount of each conductive bump S is fixed and moderate, so when the conductive bump S melts and deforms, there will be no excess, overflow and other problems, and will not pollute other parts of the pin 11, the substrate 1 or the coil body C and other components. Furthermore, this coil can be used as a coil for an embedded inductor or a coil for a non-embedded inductor.

Also, please refer to FIG. 1 , in the aforementioned method of manufacturing a coil with leads, the aforementioned steps S11 and S12 may also be changed to steps S15 and S16. In step S15 , on the substrate 1 having at least one pair of pins 11 , the two ends of at least one coil body C are respectively stacked on the ends of the pins 11 . In step S16 , at least one conductive bump S is formed at the position where the end of the coil body C and the pin 11 overlap each other. Afterwards, the above-mentioned steps S13 and S14 are performed again to complete the manufacture of the leaded coil.

In summary, according to a coil with pins and its manufacturing method of the present invention, a conductive substance is formed on the coil body or the connection of the pins by printing, and then the shape of the conductive substance is changed to join the coil Body and this pin. Compared with the prior art, the present invention does not need to use additional spot welding machines or special equipment, only using the template, the jig and the device (such as a heating device) for changing the shape of the conductive substance can easily and accurately Joining the coil body and the pins is suitable for mass production and further reduces manufacturing costs. Since the thickness of the template and the size of the holes can accurately and uniformly control the size of each conductive substance, it is easy to control the effect of production quality. In addition, when the conductive substance is heated to change shape, it will only be adsorbed near the contact part between the coil body and the pin due to capillary phenomenon, not only will not overflow or pollute the pin, the coil body or other parts, but also can improve The bonding strength and reliability of the coil body and the pin can further obtain a coil with pins with good uniformity and pass rate, which is beneficial to subsequent assembly.

The above descriptions are illustrative only, not restrictive. Any equivalent modifications or changes made without departing from the spirit and scope of the present invention shall be included in the appended claims.

Claims (19)

1, a kind of manufacture method with pin coil comprises the following steps:

Form at least one conductive projection on a substrate with at least one pin; And

At least one end of at least one coil body is placed on this pin, and this end of this coil body contacts with corresponding this conductive projection, and this coil body and this pin are linked together by this conductive projection.

2, a kind of manufacture method of tool pin coil comprises the following steps:

At least one coil body is placed on the substrate with at least one pin, and at least one end of this coil body is to being positioned on this pin; And

Form at least one conductive projection on this pin or this end, this coil body and this pin are linked together by this conductive projection.

3, manufacture method as claimed in claim 1 or 2 comprises that also the end that this pin is not connected this coil body separates on this substrate.

4, manufacture method as claimed in claim 1 or 2 also comprises and fixes this substrate on a tool.

5, manufacture method as claimed in claim 4, wherein this coil body is positioned at least one groove of this tool, and this end that makes this coil body is to being positioned on this pin.

6, manufacture method as claimed in claim 1 or 2, the method that wherein forms this conductive projection is print process, completion method or screening method.

7, manufacture method as claimed in claim 1 or 2, the mode that wherein connects this coil body and this pin for by heating or ultrasonic waves method to change this conductive projection shape.

8, manufacture method as claimed in claim 7, the method that wherein changes this conductive projection shape by a heater to heat this conductive projection.

9, manufacture method as claimed in claim 8, wherein this heater is a baking box, a heat gun, a heater or an infrared furnace.

10, manufacture method as claimed in claim 1 or 2 also comprises the following steps:

Cover a template on this substrate, have at least one hole on this template, this hole is to should pin; And

Utilize print process, completion method or screening method, in this hole, form this conductive projection.

11, manufacture method as claimed in claim 10, wherein this void shape is circle, polygon, ellipse, regular shape or irregularly shaped.

12, manufacture method as claimed in claim 1 or 2, wherein the material of this substrate and this pin is a metal or an alloy.

13, manufacture method as claimed in claim 1 or 2, wherein this substrate and this pin are formed in one and make.

14, manufacture method as claimed in claim 1 or 2, wherein this conductive projection sticks together or is attached on this pin.

15, manufacture method as claimed in claim 1 or 2, but wherein this conductive projection material is tin cream, tin ball thermal deformation material or easy plastic matter.

16, a kind of coil with pin comprises:

At least one pin; And

At least one coil body, at least one end and this pin of this coil body join;

Wherein on this coil body or this pin, form a conductive projection, and engage this coil body and this pin with print process, completion method or screening method.

17, coil as claimed in claim 16, wherein this pin is formed in one on a substrate.

18, coil as claimed in claim 16, the mode that wherein engages this coil body and this pin for by heating or ultrasonic waves method to change this conductive projection shape.

19, coil as claimed in claim 16, but wherein this conductive projection material is tin cream, tin ball thermal deformation material or easy plastic matter.

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