CN100561757C - A kind of method for packing that improves photoelectric cell and array optical coupling tolerate degree thereof - Google Patents
A kind of method for packing that improves photoelectric cell and array optical coupling tolerate degree thereof Download PDFInfo
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- CN100561757C CN100561757C CNB2005100958026A CN200510095802A CN100561757C CN 100561757 C CN100561757 C CN 100561757C CN B2005100958026 A CNB2005100958026 A CN B2005100958026A CN 200510095802 A CN200510095802 A CN 200510095802A CN 100561757 C CN100561757 C CN 100561757C
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
A kind of method for packing that improves photoelectric cell and array optical coupling tolerate degree thereof, it is by the location and the fixing microsphere lens embedding seat (Micro ball-lenssocket) of usefulness on the optoelectronic device chip, the microsphere lens that focuses on usefulness is placed reach the purpose that promotes the coupling error tolerance on this embedding seat; This microsphere lens embedding seat is to form in the chip manufacturing process, its center is corresponding to the optical coupling or the output center of optoelectronic device chip, traction by gravity, after can being positioned on the embedding seat, microsphere lens is bumped into automatically in the embedding seat, reach the self-aligned of optical axis, pass through the gap that this microsphere lens embedding seat sidewall keeps in addition, can provide the optical cement of fixing and refractive index match to follow the coupling interface that this gap is inserted microsphere lens and photoelectric cell, improve optical coupling efficiency and improve the integration stability, this photoelectric cell of integrating a microsphere lens adopts passive method for packing when being beneficial to follow-up encapsulation, in no characteristic monitoring, do not rely under the situation of optical alignment, reach high efficiency optical coupled.
Description
[technical field]
The present invention relates to a kind of method for packing that improves photoelectric cell and array optical coupling tolerate degree thereof, relate in particular to a kind of photoelectric cell of integrating microsphere lens, adopt passive method for packing when being beneficial to follow-up encapsulation, monitor, do not rely under the situation of optical alignment in no characteristic, reach the method for packing of high efficiency optical coupled purpose.
[background technology]
Along with increasing substantially of information flow-rate, therefore its demand frequency range of the optical-electric module that communication is used improves, and causes photoelectric cell active region size to be reduced day by day, and it is strict that the required precision of optical coupled is tending towards thereupon.Especially under the monomode fiber environment of applications, the difficulty that highlights optical coupled more and faced.The face coupled mode device for testing light of using with optical-fibre communications is an example, and under the bit rate of 2.5Gb/s, the optical coupling bore dia of device for testing light can have 100 microns approximately, and corresponding monomode fiber can have tens of microns coupling tolerate degree.Yet when Bit Transmission Rate was promoted to 10Gb/s, the optical coupling bore dia to below 40 microns, had reduced coupling tolerate degree with little greatly.The necessary mode that obtains good coupling that is encapsulated as is aimed in the conventional dynamic monitoring.So utilize dynamic monitoring to aim at encapsulation, high coupling efficiency needs high precision equipment and long adjustment time, is reflected on the cost timeliness, has limited the production capacity and the price of high speed optoelectronic module.
U.S.Pat.No.5,963,694 and U.S.Pat.No.6,053, lead type (Pigtail type) encapsulation that discloses in 641, its program all is to finish metal pedestal of optoelectronic device chip (TO-header) and metal housing (Cap) encapsulation (having ball-type lens on this metal housing) earlier, the fiber-optic wire and the photoelectric cell that will be inserted in stainless steel optical fiber sleeve more carry out optical axis alignment, are aided with coaxial laser welding collocation and aim at the trace program automatically and finish that dynamic optical axis alignment and welding are fixing to wait action.U.S.Pat.No.6,340,831 disclose a joint type (Receptacle-type) encapsulation in addition, and it also is to utilize dynamic optical axis alignment and welding fixedly to finish encapsulation.Above-mentioned " initiatively " to such an extent as to finishing from the optoelectronic device chip module package, encapsulation technology all need experience at least 2 to 3 times dynamic monitoring optical axis alignment, therefore inevitable limit production timeliness.
With respect to active pattern encapsulation, the encapsulation of passive pattern means needn't the dynamic monitoring optical axis, can obtain suitable coupling efficiency by suitable guiding mechanism, so can quicken the carrying out that encapsulate.U.S.Pat.No.4,339, disclose light-emitting diode (LED) chip structure of a suitable passive encapsulation in 689, this chip has the semicircle lens that utilize photolithography in semiconductor, etching, form with manufacture craft such as deposition and in alignment with the fiber optic hub (Throughhole) of these lens, this fiber optic hub is to utilize the dark etching process of chip back to form, and manufacturing process is comparatively complicated.U.S.Pat.No.4,355,321 and U.S.Pat.No.4,727,649 mechanism of also utilizing fiber optic hub to aim at as guide optic fibre, only its difference is that fiber optic hub is not to be formed directly on the photoelectric cell, but is formed on earlier on another carrier, utilize aligning soldering bonding mode to combine again, for the usefulness of follow-up packaged fiber guiding with photoelectric cell.U.S.Pat.No.5 then utilizes moulded section that fiber optic hub and photoelectric cell pedestal are encapsulated in the lump in 175,783, and directly forms a fiber optic hub in order to optic fibre guide, promotes packaging efficiency.Case is when being applied to the passive encapsulation of high speed optoelectronic element before above-mentioned, and the technology that is adopted all will face the test on the precision.In addition, U.S.Pat.No.5, required optical element directly was formed on the chip by the gross when 500,540 propositions will encapsulate by semiconductor fabrication process, except that quickening follow-up package speed, also reduced packaging cost; But the optical element by semiconductor fabrication process forms as lenticule, then is restricted on the size, and the lenticule of hundreds of micron-scales or focal length are test for manufacture craft, and also therefore effective optical aperture can not significantly promote.
This shows that above-mentioned prior art still has many disappearances and deficiency, is further improved.
[summary of the invention]
The present invention discloses a kind of method for packing that improves coupling tolerate degree, it reaches the fixedly microsphere lens embedding seat of usefulness (Micro ball-lens socket) by the last location of optoelectronic device chip (as wall emission laser chip, face coupled mode device for testing light chip), the microsphere lens that focuses on usefulness is placed reach the purpose that promotes the coupling error tolerance on this embedding seat.This microsphere lens embedding seat is to form by semiconductor fabrication process in the chip manufacturing process, its center is corresponding to the optical coupling or the output center of optoelectronic device chip, embedding seat size and highly then according to the optical parametric of microsphere lens, as: designs such as lens diameter, the index of refraction in lens are to reach suitable coupling efficiency.By gravity traction, microsphere lens is bumped in the embedding seat after can being placed on the embedding seat automatically, reaches the self-aligned of optical axis.In addition for improving optical coupling efficiency and improving and integrate stability, can be by the gap of microsphere lens embedding seat sidewall reservation, provide the optical cement of fixed lens and refractive index match to follow the coupling interface that this gap is inserted microsphere lens and photoelectric cell, or provide a Freeing Pipe road to avoid bubble to fall into to exist in the embedding seat.This optoelectronic device chip of integrating a microsphere lens have when being beneficial to follow-up encapsulation bigger coupling correcting deviation tolerance or even can adopt passive method for packing, promptly in no characteristic monitoring, do not rely under the situation of optical alignment, reach high efficiency optical coupled; Also can adopt the capping of tool globe lens to cover on the chip when other encapsulates outward, form two globe lens systems, the correcting deviation tolerance when further improving follow-up the encapsulation.In brief, by the present invention, precision coupling required when the conventional core chip level initiatively encapsulates can form the microsphere lens embedding seat of having finished optical axis alignment by the gross by semiconductor fabrication process on chip, be simplified to the passive encapsulation of chip-scale fast, improves the production timeliness.Moreover because of the characteristic that semiconductor fabrication process is handled by the gross, the present invention also can form the array chip with array microsphere lens embedding seat, simplifies the aligning and the encapsulation of array chip.
A kind of method for packing that improves photoelectric cell and array optical coupling tolerate degree thereof with reliability and integrality of the present invention when comparing mutually with other prior art and preceding case, has more and gets the row advantage ready:
1. adopt passive method for packing when the present invention's photoelectric cell that can integrate microsphere lens is beneficial to follow-up encapsulation, in no characteristic monitoring, do not rely under the situation of optical alignment, reach high efficiency optical coupled.
2. by the present invention, precision required in the time of the conventional core chip level initiatively can being encapsulated is coupled, on chip, form the embedding seat that can embed microsphere lens by the gross by semiconductor fabrication process, the subsequent element encapsulation is simplified to low precision form or passive form, improve the production timeliness.
3. the present invention can be by applying optical cement in the embedding seat, reaches the fixedly purpose of microsphere lens and refractive index match, improves structural stability and also improve coupling efficiency.
4. the present invention can be by the gap that keeps at microsphere lens embedding seat sidewall, can avoid bubble to fall into existing in the embedding seat or allows optical cement to follow the coupling interface that this gap is inserted microsphere lens and photoelectric cell.
5. the characteristic that can handle by the gross because of semiconductor fabrication process of the present invention is applied in it on array chip, by microsphere lens embedding seat array, integrates the microsphere lens array, simplifies the aligning and the encapsulation of array chip.
[description of drawings]
Figure 1A is the optoelectronic device chip schematic diagram of tool microsphere lens embedding seat, and microsphere lens does not embed as yet.
Figure 1B is that microsphere lens has embedded the optoelectronic device chip schematic diagram in the microsphere lens embedding seat.
Optoelectronic device chip schematic diagram when Figure 1B ' is microsphere lens embedding microsphere lens embedding seat.
Fig. 1 C is the fixedly optoelectronic device chip schematic diagram of microsphere lens and microsphere lens embedding seat of optical cement.
Fig. 1 D is that optical fiber is tolerated schematic diagram with the coupling deviation of the optoelectronic device chip that contains microsphere lens.
Fig. 2 is the photoelectric cell 1x4 array chip schematic diagram that has contained microsphere lens.
Fig. 3 A to Fig. 3 E is the packaging technology schematic diagram of first embodiment of the invention device for testing light chip.
Fig. 4 is the encapsulation schematic diagram of second embodiment of the invention device for testing light array chip.
Fig. 5 A to Fig. 5 C is the packaging technology schematic diagram of third embodiment of the invention SMD LED surface-mount device LED device for testing light.
[embodiment]
The present invention discloses a kind of method for packing that improves coupling tolerate degree, shown in Figure 1A, utilizes semiconductor fabrication process formation one to be centrally aligned to the microsphere lens embedding seat 14 in light output or optical coupling hole 13 on optoelectronic device chip 10.Be formed with electrode 11,12 on the optoelectronic device chip 10.The function of this embedding seat 14 is in the follow-up Chip Packaging process that the microsphere lens 15 that can embed a suitable size is in embedding seat 14, shown in Figure 1B.The fixing of this microsphere lens can utilize optical cement 16 to insert in the microsphere lens embedding seat 14, exposes to the sun according to optical cement is solidified, shown in Fig. 1 C with ultraviolet light again.This integrates the chip of a microsphere lens and the coupling of optical fiber 17 can have a bigger deviation tolerance 18, with face coupled mode device for testing light chip is example, this scope is a circular cone column volume, and shown in Fig. 1 D, fine nuclear end points 19 is positioned at this volume and all can obtains the coupling efficiency that meets demand.In addition, enforcement of the present invention also can extend to the array chip of microsphere lens embedding seat array.Lift 1x4 array chip 20 as Fig. 2 and be example, the optical coupling or the delivery outlet 23 of the microsphere lens embedding seat 24 all corresponding individual chip on each chip, follow-up encapsulation only needs microsphere lens 25 is embedded in each corresponding embedding seat, and with optical cement 26 insert be attached in the embedding seat fixing, optical cement is solidified, the encapsulation of chip array is simplified because of coupling tolerate degree increases.It must be emphasized that, the telescopiny of microsphere lens is that traction by gravity moves in the embedding seat microsphere lens automatically among Fig. 1 or Fig. 2, but not put by contraposition accurately, that is the optical axis alignment of microsphere lens and chip in fact is an auto-alignment process surely, shown in Figure 1B ', therefore not harsh to the required precision of putting.
Below utilize three embodiment that the present invention is described respectively, the optoelectronic device chip of the tool microsphere lens embedding seat that is adopted in following examples, the needs of its embedding seat height, embedding seat internal diameter and the visual optical coupled of external diameter form by following method for semiconductor manufacturing: (1) utilizes photosensitive macromolecular material, as photoresistance, arrange in pairs or groups little shadow manufacture craft of coating and exposure imaging mode forms microsphere lens embedding seat; (2) utilize thick film photoresistance and exposure imaging technology on element, to form the photoresistance mould of a microsphere lens embedding seat, utilize evaporation or electroplate manufacture craft plated metal in mould, promptly get a metallic microspheres lens embedding seat after removing the photoresistance mould; (3) utilize long-pending extremely hundreds of microns the thickness of tens of microns that forms in dielectric medium coating or Shen, be aided with dark etching process and on element, form microsphere lens embedding seat.
Following examples are example with face coupled mode device for testing light all, but the present invention may be implemented in other photoelectric cell such as wall emission laser, face coupled mode modulator etc. equally.Following examples all adopt the ruby microsphere lens of 300 microns of diameters in addition, but can select other material for use according to the demand of actual optical coupled, as: the microsphere lens of BK-7, Sapphire, LaSF-N9 etc. and suitable diameter.It must be emphasized that, central idea of the present invention is answered broad sense to regard as and is utilized the microsphere lens embedding seat that forms on the element chip, and the apparent variation of embedding seat is also contained in the present invention, and the icon that is presented promptly is to be example with " C " type microsphere lens embedding seat in an embodiment.
First embodiment:
As shown in Figure 3A, device for testing light element chip 30 sets earlier on chip microscope carrier 310 in the present embodiment, but chip microscope carrier material semiconductor substrate, as silicon; Or ceramic substrate, as aluminium nitride, aluminium oxide; Or plastic base, not imperial as iron.Comprise on the chip microscope carrier 310 chip set district's 311, first electrode 312 and with set second electrode 313 that is connected of district, lead 37 connects first electrode 312 of electrode 31 and chip microscope carrier on the chips, electrode then joins with second electrode 313 under the chip.The ruby microsphere lens 35 that one external diameter is 300 microns embeds in the microsphere lens embedding seat 34, the optical cement 36 that is applied in advance on the embedding seat by ultraviolet light polymerization is fixed on the embedding seat 34 microsphere lens again, this optical cement has the function of refractive index match simultaneously, and the gap 38 that embedding seat sidewall keeps can be avoided bubble to fall into to exist causing reflection loss or structural stability problem in the embedding seat.Optical cement 36 also can apply after microsphere lens embeds again, but must be noted that the necessary lower optical cement of stickiness that uses this moment, as the C2505 series that NTT-AT produced.In the present embodiment, optical coupling hole 33 diameters of device for testing light element chip are 30 microns, adopt the ruby microsphere lens of 300 microns of diameters, its refractive index is 1.77, embedding seat on the corresponding chip highly is 130 microns, embedding seat internal diameter is 130 microns, and lens and chip are integrated back optical axis deviation tolerance and can be enlarged more than 3 times.This chip sets the optical coupled that the element 320 of finishing and integrate a microsphere lens helps follow-up when encapsulation.
Shown in Fig. 3 B,, use elargol or scolding tin to set on the pedestal 321 (TO-Header) of TO-46,, carry out capping at last and finish encapsulation with the electrode of lead 322 Connection Elements 320 with pedestal 321 with said elements 320.The capping 323 of Fig. 3 B is the saturating window types in plane.Also can adopt capping 324, utilize two globe lens systems further to improve the coupling correcting deviation tolerance, realize passive and high efficiency optical coupled as Fig. 3 C with globe lens.Follow-up encapsulation can be joint type or lead type, shown in Fig. 3 D and 3E.With the above-mentioned TO element of finishing capping, as 330 of Fig. 3 C, engage a joint type sleeve 331, can finish the joint type encapsulation of Fig. 3 D, the joint fixed form of this sleeve can be modes such as gummed, the urgent method of laser welding or mechanism.
Shown in Fig. 3 E, also can the TO element of capping will be finished, as 330 of Fig. 3 C, engage an optical fiber sleeve 332, engaging fixed form can be modes such as gummed, the urgent method of laser welding or mechanism, again fiber-optic wire 333 is enclosed in the optical fiber sleeve 332, the distance that optical fiber end points and globe lens are 334 can be controlled by the mechanism 335 that stops in the optical fiber sleeve, utilize optical cement or hot-setting adhesive 336 to insert optical fiber sleeve 332 ends at last, and with ultraviolet light expose to the sun according to or modes such as heating finish fixingly, promptly finish the lead type encapsulation.
Remove the TO encapsulation base described in the present embodiment, also can adopt other pattern encapsulation base as SMA high frequency pedestal.
Second embodiment:
Be example with 1x8 device for testing light array chip 40 among this embodiment, have the microsphere lens embedding seat array 44 of corresponding device for testing light array on the chip.Shown in Figure 4 is device for testing light array chip encapsulation schematic diagram, and 1x8 device for testing light array chip 40 sets on chip microscope carrier 410, and chip microscope carrier material can be a semiconductor substrate, as silicon; Or ceramic substrate, as aluminium nitride, aluminium oxide; Or plastic base, not imperial as iron.Comprise on this chip microscope carrier array chip set district's 411, first electrod-array 412 and with set second electrode 413 that is connected of district, the first corresponding electrode 412 on the top electrode 41 that lead 47 connects array chips and the chip microscope carrier, 42 second electrodes 413 with the chip microscope carrier of the bottom electrode of chip array join.By automatic injecting glue equipment equidistantly in microsphere lens embedding seat behind the injection optics glue, the ruby microsphere lens 45 that with 8 external diameters is 300 microns embeds in the microsphere lens embedding seat 44 in regular turn by automatic clamping and placing system, the optical cement 46 that is applied in advance on the embedding seat by ultraviolet light polymerization is fixed on the embedding seat 44 microsphere lens again, this optical cement has the function of refractive index match simultaneously, and each embedding seat sidewall all retention gap can avoid bubble to fall into existing causing reflection loss or structural stability problem in the embedding seat.Optical cement 46 also can apply after microsphere lens embeds again, but must be noted that the necessary lower optical cement of stickiness that uses this moment, as the C2505 series that NTT-AT produced.In the present embodiment, the optical coupling aperture of device for testing light array chip is 30 microns, adopt the ruby microsphere lens of 300 microns of diameters, its refractive index is 1.77, embedding seat on the corresponding chip highly is 130 microns, embedding seat internal diameter is 130 microns, and microsphere lens and array chip are integrated back optical coupled tolerance and can be enlarged more than 3 times, and so-called coupling tolerate degree this moment first embodiment increases dimensions such as the rotation, inclination of array fibre 48 and array chip 40 relative positions.
The 3rd embodiment:
The device for testing light Chip Packaging becomes surface adhesion components in this embodiment, but power circuit board or compound crystal module (Multi-Chip Module, MCM) utilization.Shown in Fig. 5 A, be formed with electrode 51,52 on the device for testing light chip 50, the device for testing light chip 50 of tool microsphere lens embedding seat is set in regular turn on chip microscope carrier 510, mode is described in first and second embodiment, chip microscope carrier material can be a semiconductor substrate, as silicon; Or ceramic substrate, as aluminium nitride, aluminium oxide; Or plastic base, not imperial as iron.By automatic injecting glue equipment equidistantly in microsphere lens embedding seat in regular turn behind the injection optics glue, the ruby microsphere lens 55 of 300 microns of external diameters is embedded in the microsphere lens embedding seat 54 in regular turn by automatic clamping and placing system, the optical cement 56 that solidifies on the embedding seat by line style or face type ultraviolet source is fixed on the embedding seat 54 microsphere lens again, this optical cement has the function of refractive index match simultaneously, can avoid bubble to fall into to exist by the gap of embedding seat sidewall reservation and cause reflection loss or structural stability problem in the embedding seat.Optical cement 56 also can apply after microsphere lens embeds again, but must be noted that the necessary lower optical cement of stickiness that uses this moment, as the C2505 series that NTT-AT produced.In the present embodiment, the aperture in the optical coupling hole 53 of device for testing light element chip is 30 microns, adopt the ruby microsphere lens of 300 microns of diameters, its refractive index is 1.77, embedding seat on the corresponding chip highly is 130 microns, embedding seat internal diameter is 130 microns, and lens and chip are integrated back optical axis deviation tolerance and can be enlarged more than 3 times.
Finished that chip sets and microsphere lens embeds this moment on the chip microscope carrier, lead 57 connects first electrode 512 of electrode 51 and chip microscope carrier 510 on the chips, then promptly carries out the shaping of plastic casing.This chip microscope carrier is inserted in the mould for plastics, inject suitable plastics 521 back hot briquettings.So-called suitably plastics refer to not absorb the plastics of device for testing light receiving wave range light source or the plastics of filtering specific band.Must avoid plastics to contact in addition in the plastic casing mold design, in order to avoid influence the function of microsphere lens with microsphere lens.After the plastic casing encapsulation, utilize cutting machine the chip microscope carrier to be cut into SMD LED surface-mount device LED device for testing light particle by cutting apart, shown in Fig. 5 B, 521 ' is the plane plastic housing of SMD LED surface-mount device LED device for testing light particle, and electrode 514 and 515 joins with first electrode 512 and second electrode 513 of chip microscope carrier respectively by perforation.In addition, shown in Fig. 5 C, also can form lens-type plastic housing 522 with further raising coupling tolerate degree by Mould design.
Above-mentioned explanation only is specifying of the specific embodiment of the invention, and right persons skilled in the art can be understood, and any unsubstantiality change or conversion all comprise within the scope of the present invention, and this embodiment is not in order to limit claim of the present invention.
Claims (10)
1. method for packing that improves photoelectric cell optical coupled tolerance is characterized in that it may further comprise the steps:
(a) optoelectronic device chip that will have a microsphere lens embedding seat sets on a chip microscope carrier;
(b) finishing (a) described optoelectronic device chip is connected with the electrode of chip microscope carrier;
(c) injection optics glue is in (a) described microsphere lens embedding seat;
(d) place a microsphere lens on the microsphere lens embedding seat of (c) described injecting glue, make microsphere lens fall into the embedding seat automatically, reach the optical axis alignment of microsphere lens and photoelectric cell by gravity traction;
(e) by ultraviolet light expose to the sun according to or mode of heating (c) described optical cement is solidified, the microsphere lens of fixing (d) described embedding;
(f) will finish the chip microscope carrier element that chip sets and the microsphere lens embedding is fixed and carry out follow-up encapsulation.
2. the method for packing of raising photoelectric cell optical coupled tolerance as claimed in claim 1 is characterized in that, this optoelectronic device chip, and it comprises face coupled mode and wall emission optoelectronic device chip.
3. the method for packing of raising photoelectric cell optical coupled tolerance as claimed in claim 1 is characterized in that this chip microscope carrier is semiconductor substrate, ceramic substrate, plastic base or circuit board.
4. the method for packing of raising photoelectric cell optical coupled tolerance as claimed in claim 1 is characterized in that this chip microscope carrier is the TO pedestal.
5. the method for packing of raising photoelectric cell optical coupled tolerance as claimed in claim 1, it is characterized in that, the follow-up encapsulation of this chip microscope carrier, its comprise chip microscope carrier level Hermetic Package in the TO of tool capping pedestal or level Hermetic Package in the plastic housing that heating is shaped.
6. the method for packing of raising photoelectric cell optical coupled tolerance as claimed in claim 5 is characterized in that, the TO pedestal of tool capping or plastic housing are the sealing covers of saturating window type in plane or tool ball-type lens.
7. a method for packing that improves optoelectronic component array optical coupled tolerance is characterized in that, this method may further comprise the steps:
(a) the optoelectronic component array chip that will have a microsphere lens embedding seat array sets on an array chip microscope carrier;
(b) the optoelectronic component array chip in the completing steps (a) is connected with the electrode of array chip microscope carrier;
(c) injection optics glue is in the microsphere lens embedding seat array of step (a);
(d) place microsphere lens on the microsphere lens embedding seat array of the injecting glue of step (c), make microsphere lens fall into the embedding seat automatically, reach the optical axis alignment of microsphere lens and photoelectric cell by gravity traction;
(e) by ultraviolet light expose to the sun according to or mode of heating make the optical cement in the step (c) solidify the microsphere lens of the embedding in the fixing step (d);
(f) will finish array chip sets and embeds fixing array chip microscope carrier element with microsphere lens and carry out follow-up encapsulation.
8. the method for packing of raising optoelectronic component array optical coupled tolerance as claimed in claim 7 is characterized in that, this optoelectronic component array chip comprises face coupled mode and wall emission optoelectronic component array chip.
9. the method for packing of raising optoelectronic component array optical coupled tolerance as claimed in claim 7 is characterized in that this array chip microscope carrier is semiconductor substrate, ceramic substrate, plastic base or circuit board.
10. the method for packing of raising optoelectronic component array optical coupled tolerance as claimed in claim 7 is characterized in that this array chip microscope carrier is the TO pedestal.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2005100958026A CN100561757C (en) | 2005-08-15 | 2005-08-15 | A kind of method for packing that improves photoelectric cell and array optical coupling tolerate degree thereof |
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| CNB2005100958026A CN100561757C (en) | 2005-08-15 | 2005-08-15 | A kind of method for packing that improves photoelectric cell and array optical coupling tolerate degree thereof |
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| CN100561757C true CN100561757C (en) | 2009-11-18 |
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| US4826272A (en) * | 1987-08-27 | 1989-05-02 | American Telephone And Telegraph Company At&T Bell Laboratories | Means for coupling an optical fiber to an opto-electronic device |
| US4983009A (en) * | 1987-12-03 | 1991-01-08 | Bt&D Technologies Limited | Light transmitting device utilizing indirect reflection |
| DE3939723C1 (en) * | 1989-12-01 | 1991-02-14 | Ant Nachrichtentechnik Gmbh, 7150 Backnang, De | Optical or opto-electronic coupling - uses spherical lens received in frusto-pyramidal recess of one part and groove of other part |
| CN1053298A (en) * | 1990-01-05 | 1991-07-24 | 菲利浦光灯制造公司 | Lens place the optoelectronic device having coupling comprising between optical fiber and semiconductor laser diode |
| US6053641A (en) * | 1996-12-30 | 2000-04-25 | Hyundai Electronics Industries Co. | Fiber pigtail for optical communication module |
| CN2530369Y (en) * | 2002-01-11 | 2003-01-08 | 财团法人工业技术研究院 | Face jetting laser component packing structure |
| JP2004198514A (en) * | 2002-12-16 | 2004-07-15 | Seiko Epson Corp | Optical component, its manufacturing method, micro lens substrate, display device, imaging device, optical element, and optical module |
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2005
- 2005-08-15 CN CNB2005100958026A patent/CN100561757C/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2097550A (en) * | 1981-02-24 | 1982-11-03 | Nippon Sheet Glass Co Ltd | Silicon substrate structures for fixing optical fibers and lenses |
| US4768199A (en) * | 1985-09-05 | 1988-08-30 | Siemens Aktiengesellschaft | Mechanism for self-adjusting positioning of a semiconductor laser relative to an optical fiber to be coupled thereto |
| US4826272A (en) * | 1987-08-27 | 1989-05-02 | American Telephone And Telegraph Company At&T Bell Laboratories | Means for coupling an optical fiber to an opto-electronic device |
| US4983009A (en) * | 1987-12-03 | 1991-01-08 | Bt&D Technologies Limited | Light transmitting device utilizing indirect reflection |
| DE3939723C1 (en) * | 1989-12-01 | 1991-02-14 | Ant Nachrichtentechnik Gmbh, 7150 Backnang, De | Optical or opto-electronic coupling - uses spherical lens received in frusto-pyramidal recess of one part and groove of other part |
| CN1053298A (en) * | 1990-01-05 | 1991-07-24 | 菲利浦光灯制造公司 | Lens place the optoelectronic device having coupling comprising between optical fiber and semiconductor laser diode |
| US6053641A (en) * | 1996-12-30 | 2000-04-25 | Hyundai Electronics Industries Co. | Fiber pigtail for optical communication module |
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| JP2004198514A (en) * | 2002-12-16 | 2004-07-15 | Seiko Epson Corp | Optical component, its manufacturing method, micro lens substrate, display device, imaging device, optical element, and optical module |
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|---|---|
| CN1832209A (en) | 2006-09-13 |
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