CN100538731C - RFID label manufacture method and RFID label - Google Patents
RFID label manufacture method and RFID label Download PDFInfo
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- CN100538731C CN100538731C CNB2007100801156A CN200710080115A CN100538731C CN 100538731 C CN100538731 C CN 100538731C CN B2007100801156 A CNB2007100801156 A CN B2007100801156A CN 200710080115 A CN200710080115 A CN 200710080115A CN 100538731 C CN100538731 C CN 100538731C
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Abstract
The invention discloses a kind of RFID label manufacture method and RFID label.In the manufacture method of the RFID of Bao Erxiao label, on substrate, form the antenna metal pattern, this antenna metal pattern encloses around dielectric-slab one, and is formed for holding the recess of IC chip on substrate.The band that the IC chip is installed on it is to be connected and to be fixed to substrate as upper/lower positions and direction, and wherein said position and direction make the IC chip be accommodated in the recess.
Description
Technical field
The present invention relates to RFID (radio-frequency (RF) identification) label with noncontact mode and outer equipment exchange information.By the way, " RFID label " as described herein is also referred to as " the RFID label embeds sheet (inlay) " in those skilled in the art, and the meaning is the assembly of putting in the RFID label.In addition, " RFID label " is called as " Wireless IC tag " sometimes.The RFID label also comprises non-contact IC card.
Background technology
Recently, various types of RFID labels have been proposed, with by radio with noncontact mode and outer equipment exchange information, described external unit is representative with the read write line.Proposed a kind of like this configuration as a kind of RFID label: the antenna pattern and the IC chip that wherein are used for radio communication are installed in the substrate of being made by plastics or paper (base sheet) (for example seeing Japanese Patent Laid Open Publication No.2000-311226,2000-200332 and 2001-351082).It is they to be attached to that goods etc. is gone up and by discerning goods with the external unit exchange about the information of goods that this RFID label a kind of may use.
The planimetric map of Fig. 1 shows the example of RFID label.
The IC chip 11 of RFID label 1 can be by carrying out radio communication via antenna 12 and external unit and they exchange messages.
Although the antenna 12 of RFID label 1 is illustrated as coil antenna in Fig. 1, but in general, the antenna 12 that is used for the RFID label is not limited to this shape, but can adopt on both direction all from the antenna of IC chip 11 linear extensions placed in the middle or the antenna of various other shapes.
Have nearby such as RFID label recited above that communication performance may reduce greatly under the situation of bonding jumper etc.The RFID label that is called as metal label is considered to prevent the device of this situation.Metal label is the RFID label that comprises substrate, and substrate is centered on by the metal pattern that serves as antenna.Even bonding jumper is near metal label, metal label also can keep its communication performance, except the part of being blocked by bonding jumper.
Now, will the classical production process of metal label be described.
Fig. 2 (A) and Fig. 2 (B) are the skeleton views that is used for the part of metal label manufacturing.
Here the IC chip 11 (Fig. 2 (A)) and the substrate 20 (Fig. 2 (B)) of metal label have been prepared to be used for.
Shown in Fig. 2 (A), IC chip 11 has the projection 11a that is made of gold etc. that is formed on its link.In Fig. 2 (A), the view of the IC chip 11 of shown IC chip 11 from Fig. 1 turns, and is visible so that form the surface of projection 11a in the above.IC chip 11 has by carrying out radio communication via antenna (after a while describe) and external unit and the ability (see figure 1) of their exchange messages.
Fig. 3 (A) illustrates the manufacture method example of metal label to the technological process of Fig. 3 (C).
Liquid or sheet underfilling (underfill) the 24th, resinoid, it is supplied to the zone 23 that IC chip 11 will be installed (Fig. 3 (A)) of substrate 20 in the above.IC chip 11 is placed on the zone 23, is heated between warm table 31 and the heating head 32 and presses together with substrate 20 by being clamped in then.Therefore, IC chip 11 and antenna metal pattern 22 are electrically connected by projection 11a, and because underfilling 24 sclerosis, so IC chip 11 is fixed to (Fig. 3 (B)) on the substrate 20.
By these processes, produce the RFID label of the structure shown in (C) that has Fig. 3.
In the RFID label, IC chip 11 carries out radio communication via coil antenna and external unit, and coil antenna forms circle, around the front and rear surfaces of dielectric-slab 21.
Such RFID label is called as metal label.For example, even with the rear side of bonding jumper near substrate 20, the front side that IC chip 11 is installed also keeps enough communication performances.
Yet, because the IC chip 11 that is installed on the substrate 20 is outstanding from the surface of substrate 20, so use RFID label to be difficult to the attenuation that flattens with reference to Fig. 2 (A)-2 (B) and the described manufacture method manufacturing of Fig. 3 (A)-3 (C).In order to address this problem, what can expect at least is the thickness that reduces substrate 20.Yet, in order to obtain hope performance from antenna metal pattern 22 as coil antenna, must be at antenna metal pattern 22 between the front surface of substrate and those parts on the rear surface, certain distance is set.Therefore, from guaranteeing the viewpoint of antenna performance, the thickness that reduces substrate 20 is conditional.
Summary of the invention
The present invention considers above situation and the manufacture method of the RFID label made and Bao Erping is provided and with the RFID label of this manufacture method manufacturing, and described thin and flat RFID label provides the performance of metal label.
A RFID label manufacture method according to the present invention has:
Preparation process, prepare band and prepared substrate, described band comprises and is formed on suprabasil connection with metal pattern be installed in described suprabasil circuit chip, described connection is connected to the antenna metal pattern that serves as described antenna after assembling with the described circuit chip that metal pattern is used for carrying out radio communication via antenna after assembling, described substrate comprises formation described antenna metal pattern thereon and is formed on the first surface of described substrate, it is one of front and rear surfaces of described substrate, on be used to hold the recess of described circuit chip, described antenna metal pattern is formed on the described substrate, so that described antenna metal pattern forms the circle that does not comprise described recess as follows: described antenna metal pattern extends to second surface the described front and rear surfaces from described first surface, return the described first surface in the described front and rear surfaces again, and two ends of described antenna metal pattern are positioned at the both sides of described recess; And
Connection Step, by described band is installed in described substrate as on upper/lower positions and the direction and with as described in on as described in be connected be connected to metal pattern as described on the substrate as described in the antenna metal pattern, wherein said position and direction are such: its make described with on described circuit chip be accommodated in the described recess that is formed on the described substrate.
Utilization is according to a RFID label manufacture method of the present invention, and described band is to connect like this, and promptly described band is by being installed on the substrate as upper/lower positions and direction, and wherein said position and direction make the IC chip be accommodated in the recess that is formed on the substrate.Because the IC chip is accommodated in the recess, therefore can make the RFID label approach and put down.
In a RFID label manufacture method according to the present invention, described preparation process can have:
The band portion preparation process, this step is prepared described circuit chip and strap, and described strap has and is formed on described suprabasil a plurality of described connection metal patterns;
On in circuit chip installation steps, this step described a plurality of connections usefulness metal patterns on described strap each circuit chip is installed; And
Band forms step, and this step is cut into slices described strap, so that a plurality of described circuit chip is installed in a plurality of independent bands, wherein each band has a circuit chip and is connected with one and uses metal pattern.
In described RFID label manufacture method, described circuit chip installation steps can apply the part that circuit chip will be installed of resinoid to strap, after circuit chip being installed on this part, this part is heated and pressurization, thereby the connection that circuit chip is connected on the strap is fixed on the strap with metal pattern and with circuit chip.
Band portion preparation process, circuit chip installation steps and band form feasible can the preparation efficiently of step and are with.
In described RFID label manufacture method, described preparation process can comprise:
Pattern forms step, this step is being formed with on the plate of described recess, be formed on the pattern part of the pattern part of the described antenna metal pattern on the described first surface and the described antenna metal pattern on described second surface, so that two pattern parts are all corresponding to described recess; And
The plating step, this step is plated the edge of described substrate, and wherein the pattern part that the described pattern part on the described first surface and the described pattern part on the described second surface are coupled together is along described edge placement.
Perhaps, in described RFID label manufacture method, described preparation process can comprise:
Pattern forms step, this step is being formed with on the plate of a plurality of described recesses, be formed on second pattern part of first pattern part of the described antenna metal pattern on the described first surface and the described antenna metal pattern on described second surface, so that two pattern parts are all corresponding to each recess;
Penetration step, this step forms the through hole that penetrates described plate on corresponding to the position at the edge of described substrate, and wherein the pattern part that described first pattern part and described second pattern part are coupled together is along described edge placement;
The plating step, this step is plated the inwall of described through hole, thereby forms the described pattern part that described first pattern part and described second pattern part are coupled together; And
Substrate forms step, and the described plate that this step will form described antenna metal pattern is divided into a plurality of independent substrates.
Adopt pattern formation step, penetration step, plating step and substrate formation step to make and to make substrate effectively.
And, in a RFID label manufacture method according to the present invention, described Connection Step can apply two ends of conductive paste to the antenna metal pattern that is positioned at the recess both sides, on a certain position by band being installed in substrate and the direction and heating tape, thereby and will with on connection be connected to two ends of the antenna metal pattern on the substrate with metal pattern, wherein on described position and direction, with on circuit chip be accommodated in the recess.
A RFID label according to the present invention has:
Band, this band comprises and is formed in the substrate and is used for and will be installed in the connection metal pattern that described suprabasil circuit chip is connected to the antenna metal pattern, wherein said circuit chip carries out radio communication via antenna after assembling, described antenna metal pattern serves as antenna after assembling; And
Substrate, first surface at described substrate, it is one of front and rear surfaces of described substrate, on be formed with the recess that is used to hold described circuit chip, and described antenna metal pattern forms the circle that does not comprise described recess in the following way: described antenna metal pattern extends to second surface the described front and rear surfaces from described first surface, return described first surface again, and two ends of described antenna metal pattern are positioned at the both sides of described recess
Wherein said with on described connection be connected to described antenna metal pattern on the described substrate with metal pattern, wherein said band is by on the substrate as described in being installed in as upper/lower positions and direction: as described in position and direction make as described in on as described in circuit chip be accommodated in be formed at as described on the substrate as described in the recess.
A RFID label according to the present invention has the IC chip and is accommodated in structure in the groove on the substrate, makes that the RFID label is thin and puts down.
The 2nd RFID label manufacture method according to the present invention has:
Preparation process, this step is prepared labei sheet and prepared substrate, described labei sheet comprises and is formed in the substrate and serves as the metal pattern of antenna and be installed in the described substrate and carry out via described antenna the circuit chip of radio communication after assembling, described substrate comprises the first surface that is formed on described substrate, it is one of front and rear surfaces of described substrate, on the recess that is used to hold described circuit chip, described substrate is enclosed around one on described front and rear surfaces by described labei sheet, described substrate has such outside surface, has bonding agent on the described outside surface, around being joined together with labei sheet and conductive material, described conductive material connects described around two ends with the described metal pattern on the labei sheet this bonding agent with described;
Pressing steps, this step is pushed the described first surface of described substrate in the face of the position that the described circuit chip on the described labei sheet is accommodated in the described recess, thereby described labei sheet is attached on the described first surface;
Bending step, this step is with the part of stretching out described substrate of the described labei sheet curved edge along described substrate; And
BENDING PROCESS again, this process with described labei sheet along described curved edge, so that described labei sheet folds on the second surface in the described front and rear surfaces of described substrate, described labei sheet is attached on the described second surface, and connects described two ends of described metal pattern by described conductive material.
For first manufacture method and second manufacture method,, therefore can make the RFID label thin and put down because chip is accommodated in the recess on the substrate.
Utilize first manufacture method, owing to there are two metal patterns, promptly connect with metal pattern and antenna metal pattern, when when these two metal patterns being connected to each other described with reference to Figure 11 after a while, though mistake under individual cases, just occurs, but still mistake may occur.Yet, utilizing second manufacture method, the whole metal pattern that serves as antenna partly is integrally formed with labei sheet, has prevented from manufacture process to introduce the mistake on the antenna length, thereby makes and can keep high communication performance.
By the way, the conductive material on the substrate can not cause the mistake on the antenna length.
And, utilizing first manufacture method, electroconductive binder must apply in the process that band is fixed on the substrate, and the electroconductive binder of paste uses after being adjusted to the low viscosity level applying for convenience.Therefore, when band is pushed in the face of substrate, may form swash part 134a and extruding part 134b shown in Figure 12 (Figure 12 will describe after a while), but this appears under the individual cases.
On the other hand, second manufacture method according to the present invention allows in advance bonding agent to be applied to the whole surface of substrate, makes to use the bonding agent with high viscosity and lazy flow, and has eliminated subsequently with reference to the described problem of Figure 12.
In this manner, the 2nd RFID label manufacture method according to the present invention provides a kind of RFID label manufacture method very reliably that can make thin and flat RFID label.
In the 2nd RFID label manufacture method according to the present invention, pressing steps and bending step can be provided simultaneously, perhaps provide in succession with any order.
In the 2nd RFID label manufacture method according to the present invention, preferably, bending step is by making the labei sheet bending in the punch die that labei sheet is packed into.
And in the 2nd RFID label manufacture method according to the present invention, preferably, bending step makes the labei sheet bending and faces second surface extruding labei sheet with roller.
The 2nd RFID label according to the present invention has:
Substrate, wherein at the first surface of described substrate, i.e. one of front and rear surfaces of described substrate, on be formed with recess; And
Labei sheet, it comprises and is formed on suprabasil metal pattern and is installed in described suprabasil circuit chip, described metal pattern serves as antenna, described circuit chip carries out radio communication via described antenna, wherein said circuit chip is accommodated in the described recess, described labei sheet is engaged to described substrate in the following way: described labei sheet is around described front and rear surfaces one circle of described substrate, and two ends of described metal pattern are connected to described labei sheet.
As mentioned above, the invention provides a kind of thin and flat RFID label.
In addition, the 2nd RFID label manufacture method according to the present invention provides than more reliable the 2nd RFID label of a RFID label.
Description of drawings
The planimetric map of Fig. 1 shows the example of RFID label;
Fig. 2 (A) and Fig. 2 (B) are the skeleton views that is used for the part of metal label manufacturing;
Fig. 3 (A) illustrates the manufacture method example of metal label to the technological process of Fig. 3 (C);
The skeleton view of Fig. 4 (A) and Fig. 4 (B) shows the part that is used in the RFID label manufacture method;
The technological process of Fig. 5 illustrates the manufacture method of band (strap);
Fig. 6 (A) shows first process in the manufacture method of substrate to Fig. 6 (C);
Fig. 7 (A) and Fig. 7 (B) show second process and the 3rd process in the manufacture method of substrate respectively;
Fig. 8 shows the 4th process in the manufacture method of substrate;
Fig. 9 (A) illustrates to the technological process of Fig. 9 (C) and uses the band shown in Fig. 4 (A) and Fig. 4 (B) and the RFID label manufacture method of substrate;
Figure 10 is with the sectional view of Fig. 9 (A) to the RFID label of the manufacturing of the RFID label manufacture method shown in Fig. 9 (C);
Figure 11 shows one of problem that runs under individual cases to the RFID label of the RFID label manufacture method manufacturing shown in Fig. 9 (C) with Fig. 4 (A);
Figure 12 shows another problem that runs under individual cases to the RFID label of the RFID label manufacture method manufacturing shown in Fig. 9 (C) with Fig. 4 (A);
Figure 13 shows according to the embodiment of the 2nd RFID label manufacture method of the present invention with the RFID label of this manufacture method manufacturing.
Embodiment
Various details embodiment.
The skeleton view of Fig. 4 (A) and Fig. 4 (B) shows the part that is used for a RFID label manufacture method.
Shown in the first manufacture method set-up dirgram 4 (A) with 120 and Fig. 4 (B) shown in substrate 130.
Be with 120 to comprise and connecting with metal pattern 122 and IC chip 11 shown in Fig. 4 (A), connect with metal pattern 122 and be formed in the substrate 121 of being made by PET film etc., IC chip 11 is installed in the substrate 121 and uses metal pattern 122 electrical connections with being connected.Under the situation with the IC chip shown in Fig. 2 (A), IC chip 11 has formation golden projection thereon, and has the ability (see figure 1) of carrying out radio communication via antenna of describing after a while and external unit.
Next, will describe shown in Fig. 4 (A) with 120 manufacture method.
The technological process of Fig. 5 illustrates the manufacture method of band.
At first, prepare long strap 120A.
Shown in Fig. 5 (A-1) part, strap 120A comprises a plurality of connection usefulness metal patterns 122 that are formed in the long substrate 121 of being made by PET film etc.(A-2) part of Fig. 5 is the sectional view that metal pattern is used in a connection on the strap 120A.
Connect with metal pattern 122 and form, the IC chip is installed between two by two.
Next, liquid or sheet underfilling 123 (resinoid) are supplied to the connection that is formed on the strap 120A with the IC chip installation site of metal pattern 122 (see (B-1) of Fig. 5 and (B-2) part).In this case, shown in (B-2) part of Fig. 5, by nozzle 33 instillation liquid underfillings 123.
Next, IC chip 11 is placed on the underfilling 123 (see (C-1) of Fig. 5 and (C-2) part), then by being clamped in be heated between warm table 31 and the heating head 32 and pressurize (see (D-1) of Fig. 5 and (D-2) part).Therefore, IC chip 11 passes through projection 11a and is connected with metal pattern 122 electrical connections, is fixed on the strap 120A because of underfilling 123 sclerosis then.
In addition, strap 120A is by die-cut or cut into the independent IC chip 11 that comprises and be with 120 and become (seeing Fig. 4 (A)) by stripping and slicing with being connected with metal pattern 122.
The manufacture method of the substrate 130 shown in Fig. 4 (B) next, will be described.
The manufacture method of substrate 130 is to make the method for a plurality of substrates 130 efficiently and be made up of two or more processes.The example of making three substrates 130 will be described below.
Fig. 6 (A) shows first process in the manufacture method of substrate 130 to Fig. 6 (C).
In this process, form the pattern part of the antenna metal pattern 132 of substrate 130, pattern part will be fixed on the front and rear surfaces of dielectric-slab 131, except the pattern part along two edge placement of dielectric-slab 131.
At first, shown in Fig. 6 (A), the metal forming that the front and rear surfaces of dielectric-slab 131 is used to form metal pattern covers.Therefore plate 130A with three recesses 133 on the one surface of being formed on is prepared.In the following description, the surface that forms three recesses 133 will be called as " end face ", and another surface opposite with end face will be called as " bottom surface ".
Subsequently, shown in the sectional view and vertical view of Fig. 6 (B), those parts of serving as pattern part 132a of antenna metal pattern 132 shown in Fig. 4 (B) are formed on the end face of plate 130A, and its amount covers three substrates 130, wherein have recess 133 to get involved therebetween along pattern part 132a.Shown in Fig. 6 (B), each all integrally forms continuous lines across the pattern part 132a of adjacent substrate 130.By the way, form pattern part 132a by this way: remove by etching on the surface of plate 130A except corresponding to the metal forming that covers on the part the part of pattern part 132a.
Next, shown in the sectional view and vertical view of Fig. 6 (C), the antenna metal pattern 132 shown in Fig. 4 (B) serve as the bottom surface that the pattern part 132b that is used for three substrates 130 is formed on plate 130A, the bottom surface is relative with the end face that is formed with recess 133.Pattern part 132b integrally forms the continuous lines that covers three substrates 130.Pattern part 132b also forms by etching.
This first process is efficiently, because be etched in the pattern part 132a that the end face last time is formed for three substrates 130 by first, is etched in the pattern part 132b that the bottom surface last time is formed for three substrates 130 by second.
After the formation of pattern part was finished, the manufacture method of substrate 130 proceeded to next process.
Fig. 7 (A) and Fig. 7 (B) show second process and the 3rd process in the manufacture method of substrate 130 respectively.
In second process, shown in the sectional view and vertical view of Fig. 7 (A), the through hole 130A_1 that penetrates plate 130A is formed on each the corresponding position in two edges with dielectric-slab 131, and antenna metal pattern 132 is arranged in the substrate 130 shown in Fig. 4 (B) along these two edges.Be that in three substrates 130 each all forms hole 130A_1.
In the 3rd process, shown in the sectional view and vertical view of Fig. 7 (B), use the metal same to be plated to the inwall of each through hole 130A_1 subsequently with forming each pattern part.In this manner, in the 3rd process, form pattern part 132c, pattern part 132c is along each edge placement, and pattern part 132a on the end face and the pattern part 132b on the bottom surface are coupled together, to finish antenna metal pattern 132.
In these the second and the 3rd processes, the inwall of a through hole 130A_1 of plating forms two pattern part 132c of each adjacent antenna metal pattern 132 simultaneously, and this is efficiently.
After the antenna metal pattern 132 that is used for three substrate 130 each substrates is so formed, at each substrate 130 of finishing in the next process shown in Fig. 4 (B).
Fig. 8 shows the 4th process in the manufacture method of substrate 130.
In the 4th process, shown in the sectional view and vertical view of Fig. 8, the plate 130A that forms three antenna metal patterns 132 is cut into three along the cutting planes line, is trimmed then, and described cutting planes line passes the through hole 130A_1 that plated.Therefore, three substrates 130 shown in Fig. 4 (B) are done.
By the way, described manufacture method to Fig. 8 as example with reference to Fig. 6 (A), wherein, pattern part 132a on the formation end face and the pattern part 132b on the bottom surface form and plated-through-hole 130A_1 then.Yet, the invention is not restricted to this example.The manufacture method of substrate can be such method: at first form and plated-through-hole 130A_1, form pattern part 132a on the end face and the pattern part 132b on the bottom surface then.
Next, with provide respectively use so prepare with 120 (shown in Fig. 4 (A)) and so description of the RFID label manufacture method of the substrate 130 (shown in Fig. 4 (B)) of preparation.
Fig. 9 (A) to the technological process of Fig. 9 (C) illustrate use shown in Fig. 4 (A) and Fig. 4 (B) with 120 and the RFID label manufacture method of substrate 130.
At first, thermosetting electroconductive binder 134 is supplied to the two ends (Fig. 9 (A)) of the antenna metal pattern 132 on the both sides of the recess 133 on the substrate 130 by nozzle 34.Can print the conductive paste that is used to connect, and need not be by nozzle 34 supplies.
Next, be with 120 to be reversed and to be installed on the substrate 130, the antenna metal pattern 132 on the substrate 130 and align with the IC chip 11 on 120 (Fig. 9 (B)).Because electroconductive binder is hardened by heating, so be electrically connected to each other with the antenna metal pattern 132 on metal pattern 122 and the substrate 130 with the connection on 120, IC chip 11 is accommodated in the recess 133 on the substrate 130, and is with 120 to be fixed to (Fig. 9 (C)) on the substrate 130.
In the process of Fig. 9 (C), except heating, substrate 130 and be with 120 can be extruded by clamping.
In the RFID label of so making, form coil antenna with the connection on 120 with the antenna metal pattern on metal pattern 122 and the substrate 130 132, coil antenna forms circle, and around the front and rear surfaces of dielectric-slab 131, IC chip 11 carries out radio communication via coil antenna and external unit.
Figure 10 is the sectional view with the RFID label of described RFID label manufacture method manufacturing.
Figure 11 shows one of problem that runs under individual cases to the RFID label of the RFID label manufacture method manufacturing shown in Fig. 9 (C) with Fig. 4 (A).
When being with 120 to be installed on the substrate 130 or be with 120 be installed on the substrate 130 after, in the hardening process of electroconductive binder 134 (seeing Fig. 9 (A)), as shown in figure 11, be with 120 may tilt at substrate 130.If installed with the state that tilts with 120, then by departing from its normal length with the connection on 120 with the 132 formed coil antennas of the antenna metal pattern on metal pattern 122 and the substrate 130, this may influence communication function.
Figure 12 shows another problem that runs under individual cases to the RFID label of the RFID label manufacture method manufacturing shown in Fig. 9 (C) with Fig. 4 (A).
Figure 12 is a substrate 130 and with the enlarged drawing of the bound fraction between 120.
Utilize the manufacture method shown in Fig. 9 (A)-9 (C), in the time will being with 120 installations and being fixed on the substrate 130, use the electroconductive binder 134 (seeing Fig. 9 (A)) of paste, but in the process shown in Fig. 9 (A), be difficult to accurately to control the applied amount of the electroconductive binder 134 of paste.As shown in figure 12, a little excessive apply just may cause electroconductive binder be with form on 120 swash part 134a or recess 133 in formation extruding part 134b.When using on the RFID label when printing by paper is attached to after the process of Fig. 9 (A)-9 (C), the part of swashing 134a may cause the printing defective.And the extruding part 134b in the recess 133 may cause and the short circuit of IC chip 11, causes misoperation.
Running into any RFID label with reference to Figure 11 and the described problem of Figure 12 can be deleted in checking process, but preferably increases the reliability of making.
Next, the description of the RFID label manufacture method that can not only make thin and flat RFID label and can increase reliability will be provided.And, will provide the description of the RFID label made from this manufacture method.
Figure 13 shows according to the embodiment of RFID label manufacture method of the present invention with the RFID label of this manufacture method manufacturing.
At first, prepared substrate 310 and labei sheet 320 ((A) of Figure 13 and (B) part).
Substrate 310 is made up of plastic plate 311, wherein forms porose 314 (seeing (C) part of Figure 13) to hold IC chip 11.In addition, bonding agent 312 is applied to around the substrate 310, and the conductive material 313 such as conducting strip or electroconductive binder is applied to the seam of antenna.
Labei sheet 320 is made up of metal pattern 322 and IC chip 11, serves as antenna after the metal pattern 322 that forms in the substrate 321 of being made by PET film etc. is being made, and IC chip 11 is installed in the substrate 321 by hot binding or Reflow Soldering.
By the way, metal pattern 322 has the design of the metal pattern 132 (seeing Fig. 4 (B)) that is different from according to the foregoing description.This be because best pattern be according to IC chip 11 combine and use etc. is selected.
Next, the first surface that forms recess 314 in the above of substrate 310 is accommodated in the position in the recess 314 on the substrate 310 and is extruded against the IC chip 11 on the labei sheet 320, so labei sheet 320 is utilized and is applied to the bonding agent 312 on the substrate 310 and is attached to ((C) part of Figure 13) on the first surface.
The labei sheet that first surface connected 320 of substrate 310 is encased in the punch die (die) 350, in punch die 350, form recess 351 with suitable dimension, therefore, the part of stretching out substrate 310 of labei sheet 320 is along the edge of substrate 310 and bending ((D) part of Figure 13).
Without (C) of Figure 13 and (D) process in the part, before substrate 310 being installed and be attached to substrate 310, labei sheet 320 can be shown in (D) part of Figure 13, is enclosed in separately in the punch die 350 and crooked.Perhaps, the labei sheet 320 that is arranged on the punch die 350 can be pushed into the recess 351 of punch die 350 simultaneously substrate 310 be installed on the labei sheet 320 and make labei sheet 320 bendings by substrate 310.
After being processed to the state shown in (D) part of Figure 13, roller 360 makes the curved edge of labei sheet 320 along substrate 310, so that labei sheet 320 folds on the second surface downwards, second surface is opposite with substrate 310 first surfaces that form recess 314 in the above, labei sheet 320 is attached to second surface, and the two ends of the metal pattern 322 on the labei sheet 320 are connected ((E) part of Figure 13) by conductive material 313.
By these processes, produce the RFID label of structure shown in (F) part with Figure 13.
Manufacture method shown in Figure 13 not only produces and RFID label with the same Boping of previous the embodiment that describes, has also eliminated the problem with reference to Figure 11 and the described increase antenna length of Figure 12, and has further improved reliability.
And although previous described manufacture method is need be with strap 120A die-cut or cut into process with 120, manufacture method shown in Figure 13 does not need such process.And manufacture method shown in Figure 13 need not form the process of metal pattern on substrate, and this process applies bonding agent or conductive material than on substrate process is complicated and expensive more.In this manner, the manufacture method among Figure 13 is than previous described manufacture method needs process and cost less still less.
Claims (12)
1. RFID tag manufacture method comprises:
Preparation process, prepare band and prepared substrate, described band comprises and is formed on suprabasil connection with metal pattern be installed in described suprabasil circuit chip, described connection is connected to the antenna metal pattern that serves as described antenna after assembling with the described circuit chip that metal pattern is used for carrying out radio communication via antenna after assembling, described substrate comprises formation described antenna metal pattern thereon and is formed on the recess that is used to hold described circuit chip on the first surface of described substrate, described first surface is one of front and rear surfaces of described substrate, described antenna metal pattern is formed on the described substrate, so that described antenna metal pattern forms the circle that does not comprise described recess as follows: described antenna metal pattern extends to second surface the described front and rear surfaces from described first surface, return the described first surface in the described front and rear surfaces again, and two ends of described antenna metal pattern are positioned at the both sides of described recess; And
Connection Step, by described band is installed in described substrate as on upper/lower positions and the direction and with as described in on as described in be connected be connected to metal pattern as described on the substrate as described in the antenna metal pattern, wherein said position and direction are such: its make described with on described circuit chip be accommodated in the described recess that is formed on the described substrate.
2. RFID tag manufacture method as claimed in claim 1, wherein said preparation process comprises:
The band portion preparation process, this step is prepared described circuit chip and strap, and described strap has and is formed on described suprabasil a plurality of described connection metal patterns;
On in circuit chip installation steps, this step described a plurality of connections usefulness metal patterns on described strap each circuit chip is installed; And
Band forms step, and this step is cut into slices described strap, so that a plurality of described circuit chip is installed in a plurality of independent bands, wherein each band has a circuit chip and is connected with one and uses metal pattern.
3. RFID tag manufacture method as claimed in claim 2, wherein said circuit chip installation steps apply the part that described circuit chip will be installed of resinoid to described strap, after being installed in described circuit chip on the described part, described part is heated and pressurization, thereby the described connection that described circuit chip is connected on the described strap is fixed on the described strap with metal pattern and with described circuit chip.
4. RFID tag manufacture method as claimed in claim 1, wherein said preparation process comprises:
Pattern forms step, this step is being formed with on the plate of described recess, be formed on the pattern part of the pattern part of the described antenna metal pattern on the described first surface and the described antenna metal pattern on described second surface, so that the recess location of two pattern parts is corresponding to the recess of described plate; And
The plated film step, the following part of the described substrate of this step plated film, the i.e. part of passing through that is equivalent to the edge that described pattern part on the described first surface and the described pattern part on the described second surface are coupled together.
5. RFID tag manufacture method as claimed in claim 1, wherein said preparation process comprises:
Pattern forms step, this step is being formed with on the plate of a plurality of described recesses, be formed on second pattern part of first pattern part of the described antenna metal pattern on the described first surface and the described antenna metal pattern on described second surface, so that the recess location of each pattern part is corresponding to the recess of described plate;
Penetration step, this step form the through hole that penetrates described plate on the position of following described substrate, i.e. the pattern part that is equivalent to the edge that described first pattern part and described second pattern part are coupled together;
The plated film step, the inwall of the described through hole of this step plated film, thus form the described pattern part that described first pattern part and described second pattern part are coupled together; And
Substrate forms step, and the described plate that this step will form described antenna metal pattern is divided into a plurality of independent substrates.
6. RFID tag manufacture method as claimed in claim 1, wherein said Connection Step applies two ends of conductive paste to the described antenna metal pattern of the both sides that are positioned at described recess, by described band is installed on the described substrate, so that described with on described circuit chip be accommodated on the position and direction in the described recess, heat described band simultaneously, thus with described with on described connection be connected to two ends of the described antenna metal pattern on the described substrate with metal pattern.
7. RFID tag comprises:
Band, this band comprises and is formed in the substrate and is used for and will be installed in the connection metal pattern that described suprabasil circuit chip is connected to the antenna metal pattern, wherein said circuit chip carries out radio communication via antenna after assembling, described antenna metal pattern serves as antenna after assembling; And
Substrate, on the first surface of described substrate, be formed with the recess that is used to hold described circuit chip, described first surface is one of front and rear surfaces of described substrate, and described antenna metal pattern forms the circle that does not comprise described recess in the following way: described antenna metal pattern extends to second surface the described front and rear surfaces from described first surface, return described first surface again, and two ends of described antenna metal pattern are positioned at the both sides of described recess
Wherein said with on described connection be connected to described antenna metal pattern on the described substrate with metal pattern, wherein said band is by on the substrate as described in being installed in as upper/lower positions and direction: as described in position and direction make as described in on as described in circuit chip be accommodated in be formed at as described on the substrate as described in the recess.
8. RFID tag manufacture method comprises:
Preparation process, this step is prepared labei sheet and prepared substrate, described labei sheet comprises and is formed in the substrate and serves as the metal pattern of antenna and be installed in the described substrate and carry out via described antenna the circuit chip of radio communication after assembling, described substrate comprises that being used on the first surface that is formed on described substrate hold the recess of described circuit chip, described first surface is one of front and rear surfaces of described substrate, described substrate is enclosed around one on described front and rear surfaces by described labei sheet, described substrate has such outside surface, have bonding agent and conductive material on the described outside surface, this adhesive bond is described around using labei sheet, and described conductive material connects described around two ends with the described metal pattern on the labei sheet;
Pressing steps, this step are contained in the position in the described recess with the described circuit chip on the described labei sheet and push the described first surface of described substrate, thereby described labei sheet is attached on the described first surface;
Bending step, this step is with the part of stretching out described substrate of the described labei sheet curved edge along described substrate; And
BENDING PROCESS again, this process with described labei sheet along described curved edge, so that described labei sheet folds on the second surface in the described front and rear surfaces of described substrate, described labei sheet is attached on the described second surface, and connects described two ends of described metal pattern by described conductive material.
9. RFID tag manufacture method as claimed in claim 8, wherein said pressing steps are before described bending step, carry out afterwards or simultaneously.
10. RFID tag manufacture method as claimed in claim 8, wherein said bending step is by making described labei sheet bending in the punch die that described labei sheet is packed into.
11. RFID tag manufacture method as claimed in claim 8, wherein said bending step makes described labei sheet bending with roller and faces described second surface and push described labei sheet.
12. a RFID tag comprises:
Substrate wherein is formed with recess on the first surface of described substrate, described first surface is one of front and rear surfaces of described substrate; And
Labei sheet, it comprises and is formed on suprabasil metal pattern and is installed in described suprabasil circuit chip, described metal pattern serves as antenna, described circuit chip carries out radio communication via described antenna, wherein said circuit chip is accommodated in the described recess, described labei sheet is engaged to described substrate in the following way: described labei sheet is around described front and rear surfaces one circle of described substrate, and two ends of described metal pattern are connected to described labei sheet.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006034026 | 2006-02-10 | ||
| JP2006034026 | 2006-02-10 | ||
| JP2006074260 | 2006-03-17 | ||
| JP2006227359 | 2006-08-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101017534A CN101017534A (en) | 2007-08-15 |
| CN100538731C true CN100538731C (en) | 2009-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100801156A Expired - Fee Related CN100538731C (en) | 2006-02-10 | 2007-02-12 | RFID label manufacture method and RFID label |
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| Country | Link |
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| CN (1) | CN100538731C (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5141187B2 (en) * | 2007-10-26 | 2013-02-13 | 富士通株式会社 | RFID tag manufacturing method |
| US7847697B2 (en) * | 2008-02-14 | 2010-12-07 | 3M Innovative Properties Company | Radio frequency identification (RFID) tag including a three-dimensional loop antenna |
| JP5199010B2 (en) * | 2008-10-01 | 2013-05-15 | 富士通株式会社 | RFID tag manufacturing method and RFID tag |
| FR2940486B1 (en) * | 2008-12-22 | 2011-02-11 | Commissariat Energie Atomique | METHOD FOR MANUFACTURING AN ASSEMBLY OF CHIPS WITH RADIOFREQUENCY TRANSMITTING-RECEPTION MEANS CONNECTED MECHANICALLY BY MEANS OF A RIBBON AND ASSEMBLY |
| US8936197B2 (en) * | 2009-11-17 | 2015-01-20 | Avery Dennison Corporation | Integral tracking tag for consumer goods |
| CN102087694B (en) * | 2009-12-07 | 2013-11-13 | 富士通株式会社 | System and method for identifying radio frequency identification tag position and system and method for identifying radio frequency identification tag azimuth |
| CN103367889B (en) * | 2012-04-10 | 2018-02-02 | 上海曜传信息科技有限公司 | A kind of production technology of label antenna |
| US8950683B2 (en) | 2011-11-25 | 2015-02-10 | Zhijia Liu | Production process of tag antenna |
| US10157297B2 (en) * | 2016-07-22 | 2018-12-18 | Kyocera Corporation | RFID tag board, RFID tag, and RFID system |
| CN108735890A (en) * | 2018-05-25 | 2018-11-02 | 张琴 | Quasi- air-tightness surface acoustic wave device encapsulating structure and production method |
| TWI784042B (en) * | 2018-08-21 | 2022-11-21 | 辰晧電子股份有限公司 | Radio frequency identification electronic device and method thereof, and the article that can sense radio frequency electronic signals |
| CN110571161A (en) * | 2019-09-12 | 2019-12-13 | 北京智芯微电子科技有限公司 | Embedded RFID label packaging method |
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2007
- 2007-02-12 CN CNB2007100801156A patent/CN100538731C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN101017534A (en) | 2007-08-15 |
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