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CN100521018C - Chip charger and charging method - Google Patents

Chip charger and charging method Download PDF

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Publication number
CN100521018C
CN100521018C CNB2004100952843A CN200410095284A CN100521018C CN 100521018 C CN100521018 C CN 100521018C CN B2004100952843 A CNB2004100952843 A CN B2004100952843A CN 200410095284 A CN200410095284 A CN 200410095284A CN 100521018 C CN100521018 C CN 100521018C
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China
Prior art keywords
wafer
nibs
those
nib
limit
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Expired - Fee Related
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CNB2004100952843A
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Chinese (zh)
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CN1779875A (en
Inventor
吴旻修
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Darfon Electronics Corp
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Darfon Electronics Corp
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Priority to CNB2004100952843A priority Critical patent/CN100521018C/en
Publication of CN1779875A publication Critical patent/CN1779875A/en
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Publication of CN100521018C publication Critical patent/CN100521018C/en
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Abstract

A chip loader feeder for the rectangular chip is composed of a lower die with multiple hopper-type rectangular the first holes arranged at intervals and with a top opening and a bottom opening, whose widths are respectively greater than the length and width of chip, and an upper die with multiple the second holes correspondent to the first holes.

Description

Wafer feeding device and wafer pan feeding method
Technical field
The present invention relates to a kind of process equipment, particularly a kind of wafer feeding device and wafer pan feeding method.
Background technology
For example need plate external electrode usually on the multilayer ceramic capacitor at a wafer.And traditionally, above-mentioned external electrode is formed at the long limit of above-mentioned wafer usually, and finishes by the assisting of wafer feeding device 20 of Fig. 1.
Please refer to Fig. 1, is a profile, shows an existing wafer feeding device 20.Traditionally, when desiring to plate external electrode on the long limit of wafer 10, earlier wafer 10 is placed on the wafer feeding device 20, wafer feeding device 20 has a plurality of spaced nibs 22, and its width is slightly larger than the length on the long limit of wafer 10.With horizontal direction vibrations wafer feeding device 20, make wafer 10 enter nib 22 afterwards to grow the downward mode in limit.Remove the unnecessary wafer 10 that does not enter nib 22 then, can use a fixture (not illustrating) fixing wafer 10 in the nib 22 above or below wafer feeding device 20, and the technology of plating external electrode.
Yet, desire when the minor face of wafer 10 plates external electrode, even because dwindle the width of nib 22, must improve the height of C.G. of wafer 10 earlier, just can make wafer 10 enter nib 22 in the downward mode of minor face.Therefore, by said method, make wafer 10 enter nib 22 in the downward mode of minor face with regard to being difficult to.
Summary of the invention
In view of this, the technical problem to be solved in the present invention provides wafer feeding device and wafer pan feeding method, can be that minor face is downward with the wafer correcting successfully.
For reaching above-mentioned purpose of the present invention, the invention provides a kind of wafer feeding device, be applicable to long length of side L, the long W of minor face and L the wafer of W, comprise: a bed die, first nib with a plurality of spaced funnel types, above-mentioned each first nib has width R respectively 11A upper shed and width R 12A under shed, and R 11L〉R 12W; And one mold on above-mentioned bed die, have a plurality of second nibs corresponding to above-mentioned first nib, above-mentioned each second nib has width R respectively 2One second opening, and R 2L.
The present invention provides a kind of wafer feeding device again, is applicable to long length of side L, the long W of minor face and L〉wafer of W, comprise: a bed die, have first nib of a plurality of spaced funnel types, above-mentioned each first nib has width R respectively 11A upper shed and width R 12A under shed, and R 11L〉R 12W; One mold has a plurality of second nibs corresponding to above-mentioned first nib on above-mentioned bed die, above-mentioned each second nib has width R respectively 2One second opening, and R 2L; And one bottom die under above-mentioned bed die, have a plurality of the 3rd nibs corresponding to above-mentioned first nib, above-mentioned each the 3rd nib has width R respectively 3One the 3rd opening, and L R 3W.
The present invention provides a kind of method of wafer pan feeding again, be applicable to long length of side L, the long W of minor face and L〉wafer of W, comprise: a wafer feeding device is provided, has: a bed die, first nib with a plurality of spaced funnel types, above-mentioned each first nib has width R respectively 11A upper shed and width R 12A under shed, and R 11L〉R 12W; Reach a mold on above-mentioned bed die, have a plurality of second nibs corresponding to above-mentioned first nib, above-mentioned each second nib has width R respectively 2One second opening, and R 2L; Wherein above-mentioned first nib does not overlap mutually with above-mentioned second nib; A plurality of long length of side L, the long W of minor face and L are provided〉wafer of W on above-mentioned mold, and shake above-mentioned wafer feeding device, make in above-mentioned each second nib and hold an above-mentioned wafer to grow the downward mode in limit respectively; Remove above-mentioned wafer unnecessary on the above-mentioned mold; And make above-mentioned mold and above-mentioned bed die produce relative motion, above-mentioned first nib and above-mentioned second nib are overlapped, and make the above-mentioned wafer in above-mentioned second nib downward-sloping respectively, and enter corresponding above-mentioned first nib in the downward mode of minor face by gravity.
The present invention provides a kind of wafer feeding device again, is applicable to long length of side L, the long W of minor face and L〉wafer of W, comprise: a tabular mould, have a nib through wherein, above-mentioned nib has width R uA upper shed, with width R bA under shed, satisfy R bL〉R uW, and above-mentioned nib more comprises: the first side wall has first limit and second limit, above-mentioned first limit is downward-sloping from this upper shed, accompany a set angle with horizontal plane, above-mentioned second limit extends upward from above-mentioned under shed, intersects with above-mentioned first limit and forms a salient angle; And second sidewall relative with above-mentioned the first side wall, have the 3rd limit, the 4th limit, with the 5th limit, above-mentioned the 3rd limit is downward-sloping from above-mentioned upper shed, be in substantially parallel relationship to above-mentioned first limit, above-mentioned the 5th limit extends upward from above-mentioned under shed, and above-mentioned the 4th limit connects above-mentioned the 3rd limit and above-mentioned the 5th limit, and becomes a block with above-mentioned pentagon, the air line distance of above-mentioned block and above-mentioned salient angle is X, satisfies X 2≧ L 2+ W 2
Description of drawings
Fig. 1 is a profile, shows an existing wafer feeding device 20;
Fig. 2 is a profile, shows the wafer feeding device of first embodiment of the invention and the first step of wafer pan feeding method;
Fig. 3 is a profile, shows the step of the wafer pan feeding method of first embodiment of the invention;
Fig. 4 is a profile, shows the step of the wafer pan feeding method of first embodiment of the invention;
Fig. 5 is a profile, shows the step of the wafer pan feeding method of first embodiment of the invention;
Fig. 6 is a profile, shows the wafer feeding device and the wafer pan feeding step of second embodiment of the invention;
Fig. 7 is a profile, shows the wafer pan feeding step of second embodiment of the invention;
Fig. 8 is a profile, shows the wafer pan feeding step of second embodiment of the invention;
Fig. 9 is a vertical view, shows the wafer feeding device of second embodiment of the invention.
Description of reference numerals
10～wafer, 20～wafer feeding device
22～nib, 30～wafer
111～the upper shed of 110～bed die
112～under shed, 113～the first nibs
120～mold, 122～the second nibs
130～bottom die 132～the 3rd nib
300～tabular mould 301～upper shed
302～under shed 301a～lead angle
310～nib 310a～salient angle
310b～link stopper 22～nib
30～wafer, 311～the first limits
312～the second limits 313～the 3rd limit
314～the 4th limits 315～the 5th limit
Embodiment
For above and other objects of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Please refer to Fig. 2, is a profile, shows the wafer feeding device of first embodiment of the invention and the first step of wafer pan feeding method.
Wafer feeding device of the present invention is applicable to long length of side L, the long W of minor face and L〉wafer 10 of W, comprise a bed die 110 and a mold 120.
Bed die 110 has first nib 113 of a plurality of spaced funnel types, and each first nib 113 has width R respectively 11A upper shed 111 and width R 12A under shed 112, and R 11L〉R 12W.
120 of molds place on the bed die 110, have a plurality of second nibs 122 corresponding to each first nib 113, and respectively this second nib 122 has width R respectively 2Opening, and R 2L.In Fig. 1, first nib 113 does not overlap mutually with second fenestra 122; And in the subsequent step of wafer pan feeding method of the present invention, first nib 113 and second nib 122 are overlapped.
Wafer feeding device of the present invention optionally more comprises a bottom die 130, places bed die 110 times.Bottom die 130 has a plurality of the 3rd nibs 132 corresponding to first nib 113, and each the 3rd nib 132 has width R respectively 3Opening, and L R 3W.At this moment, the 3rd nib 132 is preferably with corresponding first nib 113 and overlaps.
As shown in Figure 2, in the wafer pan feeding method of first embodiment of the invention, at first wafer 10 is placed on the mold 120 of wafer feeding device of the present invention, shake wafer feeding device of the present invention then, be preferably vibrations in horizontal direction, make wafer 10 enter second nib 122 to grow the downward mode in limit.
Please refer to Fig. 3 then, remove wafer unnecessary on the mold 120 10, that is be the wafer 10 that does not enter second nib 122, for example can make the wafer feeding device of the present invention set angle that tilts, and remove the wafer that does not enter second nib 122 10 shown in Figure 2 by gravity.
Next, please refer to Fig. 4, make mold 120 and bed die 110 produce relative motion, A direction or its rightabout in the figure for example, first nib 113 and second nib 122 are overlapped, and make the wafer 10 in second nib 122 downward-sloping respectively, and enter the first corresponding nib 113 in the downward mode of minor face by gravity.
Next, please refer to Fig. 5, enter in the process of first nib 113 by second nib 122, can shake wafer feeding device of the present invention at wafer 10, the for example direction of the two arrow B in figure vibrations are so that wafer 10 enters the process of first nib 113 is more smooth and easy.In addition, when wafer feeding device of the present invention optionally disposed bottom die 130, its 3rd nib 132 coincided with the first corresponding nib 113 at this moment, and made the wafer 10 that enters first nib 113 in the downward mode of minor face be contained in the 3rd nib 132.At this moment, bottom die 130 can be unloaded from wafer feeding device of the present invention, the bottom die 130 that takes up wafer 10 is removed and carried out the step that follow-up step for example forms external electrode, and make wafer feeding device of the present invention be carried out the operation of next echelon immediately.
As mentioned above, by wafer feeding device of the present invention and wafer pan feeding method, can be that minor face is downward successfully with wafer 10 correctings, reach the purpose of the invention described above.
In first embodiment, when making wafer 10 enter second nib 122 to grow the downward mode in limit, if the direction that enters, when angle is not controlled, wafer 10 might not enter second nib 122 fully, and reduces the filling rate of second nib 122.Therefore, for the filling rate and then the lifting production capacity of better lifting wafer feeding device of the present invention, the wafer feeding device of following second embodiment of the invention is improved at mold 120.
Please refer to Fig. 6, is a profile, shows the wafer feeding device of second embodiment of the invention and the first step of wafer pan feeding method.
The wafer feeding device of second embodiment of the invention is applicable to long length of side L, the long W of minor face and L〉wafer 30 of W, it comprises a tabular mould 300, has a nib 310 through wherein, and nib 310 has width R uA upper shed 301, with width R bA under shed 302, satisfy R bL〉R uW, and nib 310 more comprises the first side wall and second sidewall.
Above-mentioned the first side wall has first limit 311 and 312, the first limits 311, second limit are downward-sloping from upper shed 301, accompanies a set angle with horizontal plane, is preferably to be less than or equal to 45; And second limit 312 extends upward under shed 302, intersects with first limit 311 and forms a salient angle 310a.
The second above-mentioned sidewall is then relative with above-mentioned the first side wall, have the 3rd limit 313, the 4th limit 314, with the 5th limit 315, the 3rd limit 313 is downward-sloping from upper shed 301, be in substantially parallel relationship to first limit 311, the 5th limit 315 extends upward under shed 302, and 314 on the 4th limit connects the 3rd limit 313 and the 5th limit 315, and forms a block 310b with the 5th limit 315, the air line distance of block 310b and salient angle 310a is X, and satisfies X 2〉=L 2+ W 2
The vertical view of the wafer feeding device of second embodiment of the invention is illustrated in Fig. 9.The upper shed 301 of nib 310 has the downward lead angle 301a in inclined-plane, can help wafer shown in Figure 6 30 to enter nib 310 by all directions.
Refer again to Fig. 6, wafer 30 enters after the nib 310, because the width of upper shed 301 is between the length on the long and short limit of wafer 30, so wafer 30 enters nib 310 with minor face, and its long edge first limit 311 and slides.
Next please refer to Fig. 7, the part of wafer 30 can touch link stopper 310b.And please refer to Fig. 8, and wafer 30 is because of being subjected to stopping of blocks of files 310b, and the part that it contacts with link stopper 310b just becomes a fulcrum; And because the air line distance of block 310b and salient angle 310a is X, and satisfy X 2〉=L 2+ W 2That is the air line distance of block 310b and salient angle 310a is more than or equal to the catercorner length of wafer 30, act on wafer 30 gravity this moment and can guarantee that by above-mentioned fulcrum makes wafer 30 rotations wafer 30 falls in the nib 310 to grow the downward mode in limit, promote the filling rate of wafer 30.
Though the present invention discloses as above with preferred embodiment; right its is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is with being as the criterion that claims were defined.

Claims (12)

1. a wafer feeding device is applicable to long length of side L, the long W of minor face and L〉wafer of W, comprise:
One bed die has first nib of a plurality of spaced funnel types, and respectively this first nib has width R respectively 11A upper shed and width R 12A under shed, and R 11L〉R 12W; And
One mold has a plurality of second nibs corresponding to those first nibs on this bed die, respectively this second nib has width R respectively 2One second opening, and R 2L.
2. wafer feeding device as claimed in claim 1, wherein those first nibs do not overlap mutually with those second nibs.
3. wafer feeding device as claimed in claim 1, wherein those first nibs and those second nibs overlap.
4. a wafer feeding device is applicable to long length of side L, the long W of minor face and L〉wafer of W, comprise:
One bed die has first nib of a plurality of spaced funnel types, and respectively this first nib has width R respectively 11A upper shed and width R 12A under shed, and R 11L〉R 12W;
One mold has a plurality of second nibs corresponding to those first nibs on this bed die, respectively this second nib has width R respectively 2One second opening, and R 2L; And
One bottom die has a plurality of the 3rd nibs corresponding to those first nibs under this bed die, respectively the 3rd nib has width R respectively 3One the 3rd opening, and L R 3W.
5. wafer feeding device as claimed in claim 4, wherein those first nibs do not overlap mutually with those second nibs.
6. wafer feeding device as claimed in claim 4, wherein those first nibs and those second nibs overlap.
7. wafer feeding device as claimed in claim 4, wherein those the 3rd nibs coincide with those first nibs.
8. the method for a wafer pan feeding is applicable to long length of side L, the long W of minor face and L〉wafer of W, comprise:
One wafer feeding device is provided, has:
One bed die has first nib of a plurality of spaced funnel types, and respectively this first nib has width R respectively 11A upper shed and width R 12A under shed, and R 11L〉R 12W; And
One mold has a plurality of second nibs corresponding to those first nibs on this bed die, respectively this second nib has width R respectively 2One second opening, and R 2L;
Wherein those first nibs do not overlap mutually with those second nibs;
A plurality of long length of side L, the long W of minor face and L are provided〉wafer of W on this mold, and shake this wafer feeding device, make respectively and hold an above-mentioned wafer to grow the downward mode in limit respectively in this second nib;
Remove above-mentioned wafer unnecessary on this mold; And
Make this mold and this bed die produce relative motion, those first nibs and those second nibs are overlapped, and make those wafers in those second nibs downward-sloping respectively, and enter those corresponding first nibs in the downward mode of minor face by gravity.
9. the method for wafer pan feeding as claimed in claim 8 more comprises with this wafer feeding device set angle that tilts, to remove above-mentioned wafer unnecessary on this mold.
10. the method for wafer pan feeding as claimed in claim 8, wherein this wafer feeding device more comprises a bottom die under this bed die, has a plurality of the 3rd nibs corresponding to those first nibs, and respectively the 3rd nib has width R respectively 3One the 3rd opening, satisfy L〉R 3W, and those the 3rd nibs coincide with those first nibs, make those wafers that enter those first nibs in the downward mode of minor face be contained in those the 3rd nibs.
11. a wafer feeding device is applicable to long length of side L, the long W of minor face and L〉wafer of W, comprise:
One tabular mould has a nib through wherein, and this nib has width R uA upper shed, with width R bA under shed, satisfy R bL〉R uW, and this nib more comprises:
The first side wall has first limit and second limit, and this first limit is downward-sloping from this upper shed, accompanies a set angle with horizontal plane, and this second limit extends upward from this under shed, intersects with this first limit and forms a salient angle; And
Second sidewall is relative with this first side wall, have the 3rd limit, the 4th limit, with the 5th limit, the 3rd limit is downward-sloping from this upper shed, be parallel to this first limit, the 5th limit extends upward from this under shed, and the 4th limit connects the 3rd limit and the 5th limit, and becomes a block with this pentagon, the air line distance of this block and this salient angle is X, satisfies X 2〉=L 2+ W 2
12. wafer feeding device as claimed in claim 11, wherein this set angle is less than or equal to 45.
CNB2004100952843A 2004-11-22 2004-11-22 Chip charger and charging method Expired - Fee Related CN100521018C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2004100952843A CN100521018C (en) 2004-11-22 2004-11-22 Chip charger and charging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2004100952843A CN100521018C (en) 2004-11-22 2004-11-22 Chip charger and charging method

Publications (2)

Publication Number Publication Date
CN1779875A CN1779875A (en) 2006-05-31
CN100521018C true CN100521018C (en) 2009-07-29

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Application Number Title Priority Date Filing Date
CNB2004100952843A Expired - Fee Related CN100521018C (en) 2004-11-22 2004-11-22 Chip charger and charging method

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5622585A (en) * 1991-03-20 1997-04-22 Murata Manufacturing Co., Ltd. Method of handling electronic component chips
CN2515774Y (en) * 2001-11-15 2002-10-09 实密科技股份有限公司 Arrangement machine for passive element before sintering

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5622585A (en) * 1991-03-20 1997-04-22 Murata Manufacturing Co., Ltd. Method of handling electronic component chips
CN2515774Y (en) * 2001-11-15 2002-10-09 实密科技股份有限公司 Arrangement machine for passive element before sintering

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Granted publication date: 20090729

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