CN100486343C - Improved backboard possessing C typed layout structure - Google Patents
Improved backboard possessing C typed layout structure Download PDFInfo
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- CN100486343C CN100486343C CNB031582044A CN03158204A CN100486343C CN 100486343 C CN100486343 C CN 100486343C CN B031582044 A CNB031582044 A CN B031582044A CN 03158204 A CN03158204 A CN 03158204A CN 100486343 C CN100486343 C CN 100486343C
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- backboard
- zone
- integrated circuit
- layout structure
- circuit board
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Abstract
The invented backboard is specially suitable to high speed and large capacity communication device, where there are large numbers of cards and plates needed to plug in backboard in laminated construction. According to different type of signal, the backboard is divided into different regions: working plane, plane of power supply and protective ground plane. Sockets for cards in two layers in backboard are symmetrically arranged in different directions. Symmetrical arrangement solves warping distortion of PCB plate. Advantages are: effective signal transmission, reducing interference, reaching electromagnetic compatibility and good antistatic performance.
Description
Technical field
The present invention relates to a kind of backboard of the improved C of having shape layout structure, relate in particular to a kind of being applicable to and have a large amount of integrated circuit boards, the backboard when needing stepped construction in the high-capacity and high-speed communication equipment.
Background technology
In the switching equipment of rack, polylith ply-yarn drill and switch control card interconnect by backboard.When exchange capacity was far longer than the capacity of veneer port, that backboard can be done was very big, the two-layer integrated circuit board of pegging graft, and as shown in Figure 1: 16 (or more) pieces integrated circuit board patches on backboard by upper and lower double-layer structure.
In communication equipment at a high speed, the signal rate on the backboard is very high, adopts the mode of strip line to connect up, and at this moment coupling and uniform continuity with the characteristic impedance that guarantees transmission line need complete plane, place of working, need to adopt the mode of multilayer wiring.
In the structure of backboard, the connection of holding wire between integrated circuit board not only will be provided, simultaneously also to provide power supply for each integrated circuit board such as-48V.For enough electric currents are provided, and keep the complete of place of working, in back plate design, can be each integrated circuit board socket independently power supply, power supply ground and protection are provided usually.Also, it independently covers the copper layer in the laminated construction for providing.In the practical application, always there be the situation of planes such as power supply, power supply ground or protection ground with parallel overlapping between the plane, place of working in this structure, as shown in Figure 2.
For the rack construction of double-deck integrated circuit board, common way is that integrated circuit board is placed by same direction, as shown in Figure 3.Working signal socket 14, place of working socket 15, forceful electric power supply socket 16 and protection ground socket 17 are arranged from top to bottom, at this moment, because the function and the size of 14,15,16 and 17 sockets are all inequality, thereby cause PCB layout density and mode inhomogeneous on pcb board; Because the pcb board area is too big, inhomogeneous, the asymmetric placement of device can make pcb board produce unusual warping phenomenon again; Done simple power supply zoning in addition; make and still can occur the phenomenon of overlapping mutually between work stratum, working signal layer, bus plane and the protection stratum; distributed capacitance between them will be bigger like this, and the signal of telecommunication between each layer disturbs just relatively more serious.Under this layout structure, if the same power supply area in service area, protection area are separated, will therefrom cut off the place of working, influenced the complete signal transmission in place of working.
In the prior art that solves this class power issue, in Chinese patent " anti-jamming printed circuit board package and combination thereof patch structure ", its patent No. is 00130746.0, publication number is CN 1349374A, the open date is on May 15th, 2002, and it has been discussed forceful electric power, light current and has divided different sockets to arrange, and prevents the mixing of forceful electric power and weak electric signal, emphasize that the socket on its integrated circuit board separates, but do not solve for the caused phase mutual interference of the interlayer distributed capacitance on the backboard.In mini-plant, the backboard area is less, and partial design is only considered the zoning of forceful electric power and light current, but does not consider because the backboard device increases, when especially carrying out hierarchical design, and the specific layout partitioned organization that needs and how to solve the anti-warpage issues of large tracts of land backboard.
Summary of the invention
The invention provides a kind of backboard of the improved C of having shape distributed architecture, realize the uniformity and the symmetry of pcb board on the large tracts of land backboard, prevent the pcb board warpage; Realize effectively cutting apart between power supply, protection ground and the working signal ground; The signal that solves each other disturbs; The integrality that keeps the place of working; Improve the delivery quality of HW High Way.
Assurance back board structure stability of the present invention is eliminated between the signal with different type plane and is disturbed, and the backboard with C shape layout structure is achieved in that
A kind of improved backboard with C shape layout structure,
Described backboard is cut apart setting by dissimilar signaling zones, on the locus of backboard working face, power plane, protection ground level is set to different zones respectively;
Be arranged on the position symmetry and with different direction arrangements respectively of place of working socket, power supply and power supply ground socket, the signal plug of the upper and lower two-layer integrated circuit board in the backboard working face.
Described backboard is divided into working face zone, power plane zone, protection ground level zone from inside to outside;
Described protection ground level constitutes the layout structure of C shape in the perimeter of backboard, and respectively covering the copper layer in this zone all is protection ground;
Described power plane constitutes the layout structure of C shape at the zone line of backboard, and in this zone alternately arrange on the PCB stack direction in power supply and power supply stratum, realizes the wiring decoupling;
Described working face constitutes square layout structure at the interior zone of backboard, and the stratum of working in this zone links to each other with each veneer with signals layer.
The interval in each zone of described backboard is at least the distance of 5mm.
The position of upper and lower two-layer integrated circuit board socket is opposite each other in the described backboard working face.
The upper and lower symmetry of the silk-screen of described integrated circuit board.
The integrated circuit board of described integrated circuit board silk-screen sign and port-mark all have positive and negative two kinds of patterns, are used for integrated circuit board and peg graft at slot up and down.
Adopt layout structure of the present invention, compared with prior art, owing to taked the arrangement of upper and lower two-layer integrated circuit board different directions and the structure that signaling zone is cut apart, make even, the symmetrical arrangement of device on the large-area backboard pcb board, solved the warpage issues of pcb board, all can bring benefit heat radiation of system etc.; Guaranteed that the complete of service area do not cut apart, guaranteed effective transmission of signal; Reduce the interference between each signal area, reached the requirement of electronic equipment Electro Magnetic Compatibility, especially in the anti-electrostatic discharging experiment, obtained good performance.
Description of drawings
Fig. 1 is the double-deck distribution schematic diagrams of many integrated circuit boards.
Fig. 2 is a plane overlapping schematic diagram.
Fig. 3 is common backboard schematic layout pattern.
Fig. 4 is the structural representation of C shape power supply zoning backboard.
Fig. 5 is an integrated circuit board panel designs schematic diagram.
Embodiment
Describe in further detail below in conjunction with the enforcement of accompanying drawing technical scheme of the present invention.
The present invention is on a backboard, and it is overlapping that working face, power plane and protection ground level are not occurred on the locus, separates different regional layouts, and accomplishes that the integrated circuit board device layout keeps symmetry on the position, as shown in Figure 4.The installation site of upper and lower two-layer integrated circuit board is opposite in the backboard, and at this moment, 10 protection areas are in the outmost turns zone of backboard, and respectively covering the copper layer in this zone all is protection ground; Is 9 power supply areas at backboard by the layout structure of a C shape of the zone of lining point formation, and in this zone, alternately arrange on the PCB stack direction in power supply and power supply stratum, reaches the effect of good wiring decoupling; In other zone then is 8 working regions, and the work stratum and the signals layer that link to each other with each veneer are distributed in this position.Each is interregional every the distance of 5mm at least, and the protection ground socket on the integrated circuit board, supply socket are at an end of integrated circuit board.Reach the effect of device layout position symmetry on the backboard like this, prevented the warpage issues of large-area backboard pcb board; Cut apart service area, power supply area and protection area, and guaranteed the service area integrality, eliminated the distributed capacitance between each different operating district, reduced the phase mutual interference between the signal with different type, guaranteed effective transmission of high speed signal.
For upper and lower integrated circuit board can indiscriminately be patched, the silk-screen of integrated circuit board panel also will be done particular processing in the present invention.The silk-screen of integrated circuit board adopts laterally zygomorphic design, can both the clear silk-screen of seeing easily on the integrated circuit board panel or see in the other direction no matter positive direction is seen.
Figure 4 shows that the structural representation of C shape power supply zoning backboard.For dissimilar signals, select independently socket for use, the 11st, 18 rows are protection ground socket, and the 12nd, 17 rows are power supply and power supply ground socket, and the 13rd, 16 rows are the place of working socket, and the 14th, 15 rows are signal plug.8 working regions, 9 power supply areas, 10 protection areas do not overlap on the PCB stack direction mutually, leave the interval of minimum 5mm in the middle of each zone.The working region comprises plane, place of working and other signal line layers; Power supply area comprises power supply and power supply ground, and power supply and power supply ground are alternately distributed in respectively covering the copper layer, reaching good decoupling effect, and strengthens current capacity; Zone, protection ground has only protection ground, is distributed in and respectively covers the copper layer, considers the rack construction design, usually protection ground can be centered around backboard around, and link to each other with the frame multiple spot.The width in power supply area and protection area will calculate according to the requirement of the rated operational current of equipment.
In the structure of integrated circuit board, protection ground socket is placed on a certain end of integrated circuit board, be power supply and power supply ground socket then, middle place of working and signal wire socket are on the position of service area.The locus will be with conforming on the backboard.
In the structure of this C shape power supply zoning, the grafting direction of upper strata integrated circuit board and the grafting direction of lower floor's integrated circuit board are opposite shown in the arrow on the integrated circuit board in the accompanying drawing 4.Because the integrated circuit board and the mounting groove position of equipment are not one to one, allow the mixed insertion of the integrated circuit board except the control power board, therefore in the panel designs of integrated circuit board, be designed to the upper and lower form of using with.As shown in Figure 5,21,24 integrated circuit boards of panel silk-screen sign and 22,23 port-marks all have positive and negative two kinds of patterns, so just can make integrated circuit board arbitrarily peg graft in upper and lower slot.
PCB uniformity and device symmetry problem when the backboard of such layout structure has solved large-area backboard power supply zoning design, the mutual interference problem of signal with different type of this large-scale backboard and the integrality that has guaranteed working face have been reduced, the skimble-scamble problem of panel silk-screen when having solved the integrated circuit board mixed insertion.
Claims (6)
1. improved backboard with C shape layout structure is characterized in that:
Described backboard is cut apart setting by dissimilar signaling zones, on the locus of backboard working face, power plane, protection ground level is set to different zones respectively;
Be arranged on the position symmetry and with different direction arrangements respectively of place of working socket, power supply and power supply ground socket, the signal plug of the upper and lower two-layer integrated circuit board in the backboard working face.
2. have the backboard of C shape layout structure according to claim 1, it is characterized in that:
Described backboard is divided into working face zone, power plane zone, protection ground level zone from inside to outside;
Described protection ground level constitutes the layout structure of C shape in the perimeter of backboard, and respectively covering the copper layer in this zone all is protection ground;
Described power plane constitutes the layout structure of C shape at the zone line of backboard, and in this zone alternately arrange on the PCB stack direction in power supply and power supply stratum, realizes the wiring decoupling;
Described working face constitutes square layout structure at the interior zone of backboard, and the stratum of working in this zone links to each other with each veneer with signals layer.
3. have the backboard of C shape layout structure according to claim 1, it is characterized in that:
The interval in each zone of described backboard is at least the distance of 5mm.
4. have the backboard of C shape layout structure according to claim 1, it is characterized in that:
The position of upper and lower two-layer integrated circuit board socket is opposite each other in the described backboard working face.
5. have the backboard of C shape layout structure according to claim 1, it is characterized in that:
The upper and lower symmetry of the silk-screen of described integrated circuit board.
6. as having the backboard of C shape layout structure as described in the claim 5, it is characterized in that:
The integrated circuit board of described integrated circuit board silk-screen sign and port-mark all have positive and negative two kinds of patterns, are used for integrated circuit board and peg graft at slot up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031582044A CN100486343C (en) | 2003-04-23 | 2003-09-08 | Improved backboard possessing C typed layout structure |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN03113308.8 | 2003-04-23 | ||
| CN03113308 | 2003-04-23 | ||
| CNB031582044A CN100486343C (en) | 2003-04-23 | 2003-09-08 | Improved backboard possessing C typed layout structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1540995A CN1540995A (en) | 2004-10-27 |
| CN100486343C true CN100486343C (en) | 2009-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031582044A Expired - Fee Related CN100486343C (en) | 2003-04-23 | 2003-09-08 | Improved backboard possessing C typed layout structure |
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| CN (1) | CN100486343C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106647968B (en) * | 2016-12-09 | 2024-01-19 | 邦彦技术股份有限公司 | Backboard and computer system with same |
| CN109038282B (en) * | 2018-08-21 | 2021-01-29 | 北方工业大学 | Make things convenient for on-spot electrical control cabinet structure of maintaining |
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2003
- 2003-09-08 CN CNB031582044A patent/CN100486343C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN1540995A (en) | 2004-10-27 |
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Granted publication date: 20090506 Termination date: 20170908 |